A push-blade control method and system for a push-pull force testing machine
By calculating the push-pull force testing machine's push-blade control method, obtaining component parameters and adhesive layer information, calculating the critical push-blade pressure, and adjusting the push-blade extension length, the problem of inaccurate push-blade pressure control was solved, achieving precise control and effective data acquisition.
Patent Information
- Application Number
- CN202510291864.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-12
- Publication Date
- 2025-10-28
- Estimated Expiration
- 2045-03-12
AI Technical Summary
Existing push-pull force testing machines cannot accurately and effectively control the pusher pressure, which can easily damage the test product and result in the inability to obtain valid experimental data.
By acquiring information such as the parameters of the component under test, the pusher extension length, and the adhesive layer thickness, the maximum thrust and pull forces are calculated, their magnitude relationship is determined, the critical pusher pressure is calculated, and control commands are output based on the relationship between the critical pusher pressure and the maximum pressure to adjust the pusher extension length to avoid damaging the component or failing to damage the adhesive layer.
It achieves precise control of the push blade in the push-pull force testing machine, ensuring that the adhesive layer is subjected to force within a safe range, avoiding damage to components or failing to damage the adhesive layer, and obtaining accurate and effective test data.
Smart Images

Figure CN120063890B_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of control technology for testing equipment, and in particular to a push-blade control method and system for a push-pull force testing machine. Background Technology
[0002] Currently, electronic components are frequently subjected to mechanical stresses from external forces such as vibration, impact, and bending during soldering, transportation, and use, which can ultimately lead to solder joint or device failure. Push-pull force testing machines can be used to simulate mechanical failure models of solder joints. By applying a constant-speed push-pull force, they simulate the mechanical stresses that electronic components may encounter in actual use, thereby evaluating the strength of solder joints and the fixing strength of devices through dynamic mechanical testing methods. This reveals their reliability and durability, providing crucial quality control data for the design and manufacturing of electronic components.
[0003] In one existing technology, the test product is fixed to a fixture, and a computer-driven linear push-pull motor drives a slide rail to slide horizontally, causing a pusher to slide. Simultaneously, a lead screw motor controls the movement of the lead screw and horizontal slider, moving the pusher closer to or away from the test product. A lifting motor adjusts the pusher height. The pusher's movement to the test point on the test product is controlled by horizontal sliding, height adjustment, and distance adjustment. The linear push-pull motor then applies a pushing or pulling force to the test product, and a push-pull force sensor acquires test data to complete the testing process. However, for some test products with relatively small pushing or pulling forces, excessive pusher pressure can damage the test product. When the test product is damaged, valid experimental data cannot be obtained.
[0004] In summary, existing technologies cannot accurately and effectively control the pusher pressure, which can easily lead to damage to the test product and prevent the acquisition of effective experimental data. Summary of the Invention
[0005] This invention provides a pusher control method and system for a push-pull force testing machine to solve the problem that the pusher pressure cannot be accurately and effectively controlled, which can easily lead to damage to the test product and failure to obtain effective experimental data.
[0006] In a first aspect, to solve the above-mentioned technical problems, the present invention provides a push-blade control method for a push-pull force testing machine, comprising:
[0007] The parameters of the component under test, the extension length of the pusher and the thickness of the adhesive layer, as well as the initial test push force of the pusher, the force-bearing area of the pusher and the moving distance of the slider are obtained; wherein, the parameters of the component under test include the component size parameters and the component weight;
[0008] The maximum thrust and maximum tension are calculated based on the extension length, the adhesive layer thickness, and the component weight.
[0009] Determine the relationship between the maximum tensile force and the maximum thrust, and obtain the maximum pressure of the initial test thrust based on the relationship;
[0010] The critical pusher pressure is calculated based on the initial test thrust, the maximum pressure, the force-bearing area, and the moving distance; wherein, the critical pusher pressure is the critical pusher pressure required for the adhesive layer to break when the pusher acts on the component, calculated when the maximum pressure is used as the initial test thrust.
[0011] When the critical pusher pressure is greater than the maximum pressure, a control command to increase the extension length is output.
[0012] When the critical pusher pressure is less than the maximum pressure, a control command to reduce the extension length is output.
[0013] In one optional implementation, the step of calculating the maximum thrust and maximum tension based on the extension length, the adhesive layer thickness, and the component weight includes:
[0014] Obtain the pre-configured first and second correction coefficients;
[0015] The maximum thrust and the maximum tensile force are calculated using the following formula for calculating the bond area:
[0016]
[0017] Among them, F p It is the maximum thrust, F t It is the maximum tensile force, k1 is the first correction factor, F t is the maximum tensile force, k2 is the second correction factor, d is the adhesive layer thickness, m is the component weight, and a is the extension length.
[0018] In one optional implementation, determining the relationship between the maximum tensile force and the maximum thrust, and obtaining the maximum pressure of the initial test thrust based on the relationship, includes:
[0019] Compare the magnitudes of the maximum tensile force and the maximum thrust;
[0020] If the maximum tensile force is greater than the maximum thrust, the maximum thrust will be used as the maximum pressure of the initial test thrust;
[0021] If the maximum tensile force is less than the maximum thrust, the maximum tensile force shall be used as the maximum pressure of the initial test thrust.
[0022] In one optional implementation, the step of calculating the critical pusher pressure based on the initial test thrust, the maximum pressure, the force-bearing area, and the moving distance to obtain the critical pusher pressure includes:
[0023] Using the maximum pressure as the initial test thrust, the critical pusher pressure is calculated based on the initial test thrust, the force-bearing area, and the moving distance to obtain the critical pusher pressure.
[0024] The critical pusher pressure is obtained using the following calculation formula:
[0025]
[0026] S=a×d
[0027] Where, p max It is the critical pusher pressure, F max S is the maximum pressure, a is the force-bearing area, d is the extension length, s is the adhesive layer thickness, k3 is the moving distance, and k3 is the third correction coefficient; the force-bearing area is the area of actual contact and force between the pusher and the component under test.
[0028] In one optional implementation, the configuration process of the first correction coefficient and the second correction coefficient includes:
[0029] The test parameters for initializing the push-pull force tester are set according to the component size parameters, the extension length, and the adhesive layer thickness, including the length correction factor and the width correction factor;
[0030] Multiple push-pull force tests were conducted on the component under test, and the test parameters of the push-pull force testing machine were continuously adjusted to cause the adhesive layer to break. Through multiple sets of tests under different conditions, several sets of test data on the critical pusher pressure and moving distance were obtained.
[0031] The test data of the aforementioned sets were fitted using the least squares method, and the fitted data were matched with the calculation formulas for critical pusher pressure and adhesive area to obtain the first correction coefficient and the second correction coefficient.
[0032] In one optional implementation, the step of outputting a control command to increase the extension length when the critical pusher pressure is greater than the maximum pressure includes:
[0033] Analysis based on the calculation formula of the critical pusher pressure shows that the critical pusher pressure is negatively correlated with the force-bearing area, that is, the critical pusher pressure is negatively correlated with the extension length.
[0034] When the critical pusher pressure is greater than the maximum pressure, the maximum pressure is taken as the current pusher pressure;
[0035] Substituting the current pusher pressure into the calculation formula for the critical pusher pressure, the target extension length is obtained;
[0036] The output controls the pusher to adjust to the target extension length, thereby increasing the extension length.
[0037] In one optional implementation, the continuous adjustment of the test parameter settings of the push-pull force testing machine includes:
[0038] The extension length of the pusher blade was adjusted for each set of test parameters using a push-pull force testing machine.
[0039] The following relationship is achieved between the protrusion length and the size of the component under test through calculation:
[0040]
[0041] Where m is the weight of the component, a is the extension length, b is the length correction factor, and c is the width correction factor.
[0042] Secondly, the present invention provides a push-blade control system for a push-pull force testing machine, comprising:
[0043] The data acquisition module acquires the parameters of the component under test, the extension length of the pusher and the thickness of the adhesive layer, as well as the initial test push force of the pusher, the force-bearing area of the pusher and the moving distance of the slider; wherein, the parameters of the component under test include the component size parameters and the component weight;
[0044] The maximum thrust and maximum pressure calculation module calculates the maximum thrust and maximum tension based on the extension length, the adhesive layer thickness, and the component weight.
[0045] The maximum pressure determination module determines the relationship between the maximum tensile force and the maximum thrust, and obtains the maximum pressure of the initial test thrust based on the relationship.
[0046] The critical pusher pressure calculation module calculates the critical pusher pressure based on the initial test thrust, the maximum pressure, the force-bearing area, and the moving distance; wherein, the critical pusher pressure is the critical pusher pressure required for the adhesive layer to break when the pusher acts on the component, calculated using the maximum pressure as the initial test thrust.
[0047] The pressure monitoring and control module is used to determine whether the critical pusher pressure is greater than the maximum pressure, and output a control command to increase the extension length; and whether the critical pusher pressure is less than the maximum pressure, and output a control command to decrease the extension length.
[0048] Thirdly, the present invention also provides an electronic device, including a processor, a memory, and a computer program stored in the memory and configured to be executed by the processor, wherein the processor executes the computer program to implement the push-blade control method of the push-pull force testing machine described in any one of the above.
[0049] Fourthly, the present invention also provides a computer-readable storage medium comprising a stored computer program, wherein, when the computer program is executed, it controls the device containing the computer-readable storage medium to perform the push-blade control method of the push-pull force testing machine described in any one of the above-mentioned embodiments.
[0050] Compared with the prior art, the present invention has the following beneficial effects:
[0051] This invention provides a push-blade control method for a push-pull force testing machine. The method includes acquiring parameters of the component under test, the extension length and adhesive layer thickness of the push-blade, the force-bearing area of the push-blade, and the movement distance of the slider. The parameters of the component under test include component size parameters and component weight. The maximum push force and maximum pull force are calculated based on the extension length, adhesive layer thickness, and component weight. The maximum push force and maximum pull force are compared to obtain the maximum pressure. The critical push-blade pressure is calculated based on the maximum pressure, force-bearing area, and movement distance to obtain the critical push-blade pressure required for adhesive layer failure. Based on the relationship between the critical push-blade pressure and the maximum pressure, a push-blade control command is determined and output.
[0052] The method combines the formulas for calculating the bond area and the critical pusher pressure to calculate the critical pusher pressure required for bond failure. This critical pressure is then compared to the maximum pressure. Based on the comparison, the product under test or the push-pull force testing machine is adjusted so that the critical pusher pressure is within a safe and effective testing range when the bond is subjected to force. This avoids excessive critical pusher pressure damaging components, or insufficient critical pusher pressure preventing bond failure and thus ensuring performance testing. The method enables precise control of the pusher in the push-pull force testing machine, yielding accurate and effective test data. Attached Figure Description
[0053] Figure 1 This is a flowchart illustrating a push-blade control method for a push-pull force testing machine according to the first embodiment of the present invention;
[0054] Figure 2 This is a schematic diagram of the push-blade control system of a push-pull force testing machine provided in the second embodiment of the present invention. Detailed Implementation
[0055] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.
[0056] Reference Figure 1 The first embodiment of the present invention provides a push-blade control method for a push-pull force testing machine, comprising the following steps:
[0057] S11, acquire the parameters of the component under test, the extension length of the pusher and the thickness of the adhesive layer, as well as the initial test push force of the pusher, the force-bearing area of the pusher and the moving distance of the slider; wherein, the parameters of the component under test include the component size parameters and the component weight.
[0058] S12, the maximum thrust and maximum tension are calculated based on the extension length, the adhesive layer thickness and the component weight;
[0059] S13, determine the relationship between the maximum tensile force and the maximum thrust, and obtain the maximum pressure of the initial test thrust based on the relationship;
[0060] S14, calculate the critical pusher pressure based on the initial test thrust, the maximum pressure, the force-bearing area, and the moving distance; wherein, the critical pusher pressure is the critical pusher pressure required for the adhesive layer to break when the pusher acts on the component, calculated when the maximum pressure is used as the initial test thrust.
[0061] S15, when the critical pusher pressure is greater than the maximum pressure, a control command to increase the extension length is output;
[0062] S16, when the critical pusher pressure is less than the maximum pressure, a control command to reduce the extension length is output.
[0063] In step S11, it is necessary to obtain the parameters of the component under test, the extension length of the pusher and the thickness of the adhesive layer, as well as the initial test push force of the pusher, the force-bearing area of the pusher and the moving distance of the slider; wherein, the parameters of the component under test include the component size parameters and the component weight;
[0064] It should be noted that the parameters of the component under test include its size and weight, which are precisely measured using an electronic balance and vernier calipers or a micrometer. All experimental adjustments and calculations are based on the measured parameters of the component under test. The push-pull force testing machine drives the slide rail horizontally via a linear push-pull motor, causing the pusher blade and the test product to slide. The extension length is the distance the pusher blade extends from its initial position during the test, and this length affects the accuracy of the test. The extension length is determined by the control software or mechanical components of the push-pull force testing machine based on the component size parameters and after multiple experimental adjustments. It is used in the formulas for calculating the bonding area and the pusher blade pressure, helping to calculate the first and second correction coefficients, which directly and indirectly affect the validity of the test results. The adhesive layer serves to secure components to the substrate and assess the bonding strength between the chip and the substrate or attached material, as well as the integrity of the material processing steps. This is done by applying a specific force and observing the chip's detachment from the substrate. The adhesive layer thickness is also a crucial indicator, affecting the force applied by the pusher and the bonding strength of the components. It is measured using an ultrasonic thickness gauge or X-ray thickness gauge and used to construct the formulas for calculating the adhesive area and the critical pusher pressure. The first correction coefficient is used to calculate the maximum tensile force. It is obtained by fitting experimental data and is used to adjust the theoretical model to match actual test conditions. The first correction coefficient reflects the relationship between the maximum tensile force applied by the pusher and the component size, mass, and adhesive layer thickness under given test conditions. It considers the physical characteristics of the components and the influence of the test environment, making the test results more accurate and reliable. The second correction coefficient follows the same principle.
[0065] The initial test thrust is a force applied to the pusher blade by the push-pull force testing machine, which is input and controlled through the machine's software interface. The initial test thrust needs to be calculated and statistically determined in advance based on the parameters of the component under test. The contact area is the area where the pusher blade contacts the component under test. This area affects the pressure distribution during testing, thus influencing the test results. The contact area is calculated based on the extension length and the adhesive layer thickness. The slider's movement distance is the total distance the slider carrying the component under test moves during the test. This distance reflects the degree to which the component is pushed away from the substrate.
[0066] In step S12, the maximum thrust and maximum tension need to be calculated based on the extension length, the adhesive layer thickness, and the component weight, including:
[0067] Obtain the pre-configured first and second correction coefficients;
[0068] The maximum thrust and the maximum tensile force are calculated using the following formula for calculating the bond area:
[0069]
[0070] Among them, F p It is the maximum thrust, F t It is the maximum tensile force, k1 is the first correction factor, F t is the maximum tensile force, k2 is the second correction factor, d is the adhesive layer thickness, m is the component weight, and a is the extension length.
[0071] The calculation process of the first correction coefficient and the second correction coefficient includes: initializing the test parameter settings of the push-pull force testing machine according to the component size parameters, the extension length, and the adhesive layer thickness; performing multiple push-pull force tests on the component under test, continuously adjusting the test parameter settings of the push-pull force testing machine to cause the adhesive layer to break, and obtaining several sets of test data on the critical pusher pressure and the moving distance through multiple sets of tests under different conditions; fitting the several sets of test data using the least squares method, and matching the fitted data with the calculation formula of the critical pusher pressure and the adhesive area calculation formula to calculate the first correction coefficient and the second correction coefficient.
[0072] It is worth noting that test sample preparation is required before the push-pull force test: Adhesive tape is fixed to the product to be tested (a1), and the product to be tested (a2) is adhered to the tape, with the tape attached to one end of the product a2. The length of the tape is not less than the diameter of the product a2. The length (b) of the product a1 and the diameter (c) of the product a2 are used as the test parameters. This simulates the actual bonding situation of products in use, helping to ensure the real-world relevance of the test results. The continuous adjustment of the test parameters of the push-pull force testing machine includes: adjusting the extension length of the pusher blade for each set of test parameters using the push-pull force testing machine; and calculating to ensure that the extension length and the size of the component under test satisfy the following relationship:
[0073]
[0074] Where 'a' represents the extension length of the pusher, 'b' represents the length 'b' of the product under test a1, and 'c' represents the diameter 'c' of the product under test a2; if the extension length of the pusher and the size of the component under test do not satisfy the relationship, the extension length of the pusher needs to be reset to meet the relationship. The length 'b' of the product under test a1 is used as the length correction coefficient, and the diameter 'c' of the product under test a2 is used as the width correction coefficient. Continuously adjusting the test parameter settings of the push-pull force testing machine can obtain the damage condition of the adhesive layer under different conditions. Recording several sets of test data on the critical pusher pressure and moving distance helps in the subsequent calculation of the first and second correction coefficients.
[0075] Based on the adhesive layer failure test standard, set the upper limit standard for critical pusher pressure, upper limit standard for slider movement speed, and upper limit standard for slider movement distance; adjust the critical pusher pressure to the upper limit standard for critical pusher pressure, adjust the slider movement speed to the upper limit standard for slider movement speed, and adjust the slider movement distance to the upper limit standard for slider movement distance, and obtain ten sets of test data corresponding to the critical pusher pressure required for adhesive layer failure for each set of test parameters.
[0076] Based on ten sets of test data for each set of test parameters, ten sets of adhesive area calculation formulas F were obtained. p F t The coefficients k1 and k2 are used to determine the accuracy of the data. If the ten sets of coefficients k1 and k2 are similar, the accuracy requirement is met, and the data is fitted using the least squares method. If the ten sets of coefficients k1 and k2 are not similar, the accuracy requirement is not met, and the average value of the ten sets of coefficients k1 and k2 is calculated. After fitting, the fitted data is matched with the calculation formulas for the critical pusher pressure and the bonding area. If the fitted data matches the ten sets of bonding area calculation formulas F... p F t If the mean values of coefficients k1 and k2 are close, then the first correction coefficient and the second correction coefficient are calculated. These coefficients are used to adjust the theoretical model to better match the actual test results, thereby improving the accuracy of the model.
[0077] Furthermore, the acquisition of the maximum thrust and the maximum pull is based on the performance of the push-pull force testing machine and the preset values of the human system; according to the adhesive area calculation formula, the maximum thrust or the maximum pull can be calculated based on the extension length, the adhesive layer thickness and the weight of the component, or the first correction coefficient k1 or the second correction coefficient k2 can be obtained by inverse operation based on the maximum thrust or the maximum pull.
[0078] In step S13, the relationship between the maximum tensile force and the maximum thrust is determined, and the maximum pressure of the initial test thrust is obtained based on the relationship, including:
[0079] Compare the magnitudes of the maximum tensile force and the maximum thrust;
[0080] If the maximum tensile force is greater than the maximum thrust, the maximum thrust will be used as the maximum pressure of the initial test thrust;
[0081] If the maximum tensile force is less than the maximum thrust, the maximum tensile force shall be used as the maximum pressure of the initial test thrust.
[0082] It's worth noting that determining the magnitude of the force is crucial to deciding whether to use the adhesive area-based tensile or thrust model in subsequent tests. Choosing a smaller force ensures the test won't place excessive stress on the components, thus avoiding unnecessary damage. In actual testing, using a larger force could lead to component damage or excessive breakage of the adhesive layer, affecting the reliability of the test results. The maximum pressure of the initial test thrust refers to the maximum value of the selected force used as the initial test thrust.
[0083] Furthermore, the maximum thrust or maximum pressure is the maximum thrust that the push-pull force testing machine can apply without damaging the component under test or the adhesive layer; this value is determined during test design based on the expected adhesive strength and material properties of the component.
[0084] In step S14, the critical pusher pressure needs to be calculated based on the initial test thrust, the maximum pressure, the force-bearing area, and the moving distance to obtain the critical pusher pressure; wherein, the critical pusher pressure is the critical pusher pressure required for the adhesive layer to break when the pusher acts on the component, calculated using the maximum pressure as the initial test thrust, including:
[0085] Using the maximum pressure as the initial test thrust, the critical pusher pressure is calculated based on the initial test thrust, the force-bearing area, and the moving distance to obtain the critical pusher pressure.
[0086] The critical pusher pressure is obtained using the following calculation formula:
[0087]
[0088] S=a×d
[0089] Where, p max It is the critical pusher pressure, F max S is the maximum pressure, a is the force-bearing area, d is the extension length, s is the adhesive layer thickness, k3 is the moving distance, and k3 is the third correction coefficient; the force-bearing area is the area of actual contact and force between the pusher and the component under test.
[0090] It is worth noting that the critical pusher pressure is the pressure applied by the pusher to the adhesive layer during the test. The critical pusher pressure required for the adhesive layer to break is the minimum critical pusher pressure required to cause the adhesive layer to break. The critical pusher pressure is the pressure applied by the pusher to the adhesive layer during the test. Based on the formulas for calculating the adhesive area and the critical pusher pressure, the critical pusher pressure and the sliding distance can be calculated. By analyzing the calculation formula for the critical pusher pressure, the push-pull force testing machine can accurately determine the force-bearing area between the product under test and the pusher based on the maximum tensile or pushing force and the adhesive layer thickness. Simultaneously, when the adhesive layer is under force, the horizontal deviation between the product under test and the pusher is analyzed to ensure that the force applied by the pusher will not damage the product under test.
[0091] The specific steps for obtaining the horizontal deviation include: when the pusher pushes the product under test, if the adhesive layer is damaged, the pusher directly pushes the product under test, causing displacement; a displacement curve A is plotted using laser point data collection, and the displacement curve of the product under test is differentiated to obtain the deflection angle θ; the horizontal distance D between the laser point and the pusher is obtained from the laser point data collection, which refers to the vertical distance between the projection of the laser point on the horizontal plane and the pusher; a horizontal deviation parameter Y = tan(θ) is constructed based on the parameters obtained in the above steps; the calculated horizontal deviation parameter Y is compared with the curve A obtained by fitting the laser point data collection to determine whether there is a horizontal deviation between the product under test and the pusher. If the pusher deviates in the horizontal direction, i.e., the pusher is not completely perpendicular to the test product, this may lead to uneven force application, thereby increasing the risk of damage to the test product.
[0092] In another implementation, the force-bearing area can be calculated using the following formula:
[0093] S = p × d
[0094] Where S is the force-bearing area, p is the critical pusher pressure, and d is the adhesive layer thickness; according to the formula, the critical pusher pressure model, and the adhesive area calculation formula, the third correction coefficient k3 in the critical pusher pressure calculation model can be calculated.
[0095] Furthermore, the calculation formula for the critical pusher pressure is constructed as follows: According to the theory of elastic deformation, when the adhesive area is subjected to force, the area of force on the adhesive layer is the contact area between the component and the adhesive. Under the same deformation condition, the larger the area of force on the component, the smaller the deformation of the component. That is, the force-bearing area of the pusher S = a × d. Therefore, by using the force F applied by the component, the elastic deformation ΔS, the elastic force-bearing area S, and the force f applied by the adhesive area, a calculation model for the critical pusher pressure can be constructed. The adhesion degree s1 between the pusher and the tape is affected by the elastic force and the area of the adhesive layer. When controlling the critical pusher pressure, since the force-bearing area S of the pusher is determined by the push-pull force testing machine, when the adhesive area is subjected to force, the adhesion failure point between the pusher and the tape can be accurately controlled by the adhesive area calculation formula.
[0096] In step S15, when the critical pusher pressure is greater than the maximum pressure, a control command to increase the extension length is output, including:
[0097] Analysis based on the calculation formula of the critical pusher pressure shows that the critical pusher pressure is negatively correlated with the force-bearing area, that is, the critical pusher pressure is negatively correlated with the extension length.
[0098] When the critical pusher pressure is greater than the maximum pressure, the maximum pressure is taken as the current pusher pressure;
[0099] Substituting the current pusher pressure into the calculation formula for the critical pusher pressure, the target extension length is obtained;
[0100] The output controls the pusher to adjust to the target extension length, thereby increasing the extension length.
[0101] It is worth noting that the maximum thrust or maximum pressure refers to the maximum thrust that the push-pull force testing machine can apply without damaging the component or adhesive layer under test; this value is determined during test design based on the expected adhesive strength and material properties of the component. The critical pusher pressure is the pressure applied to the adhesive layer by the pusher during the test. The critical pusher pressure required for adhesive layer failure is the minimum critical pusher pressure required to cause adhesive layer failure; if this pressure value is greater than the maximum thrust of the testing machine, it means that the testing machine cannot apply sufficient force to break the adhesive layer without damaging the component or adhesive layer. Based on the combined analysis of the adhesive area calculation formula and the critical pusher pressure calculation formula, a positive correlation is found between the critical pusher pressure and the extension length.
[0102] When the critical pusher pressure exceeds the maximum pressure, it indicates that the pusher cannot move, and the strength of the adhesive layer exceeds the design capacity of the testing machine. In this case, further increasing the pushing force may damage the component, rather than destroying the adhesive layer. Therefore, to ensure effective testing without damaging the component, the critical pusher pressure needs to be reduced. Based on the positive correlation between the critical pusher pressure and the extension length, a control command is output to increase the extension length. This command instructs the push-pull force testing machine to increase the extension length, thereby reducing the contact depth between the pusher and the component, reducing the force-bearing area of the pusher, and thus reducing the pressure applied to the component.
[0103] In step S16, when the critical pusher pressure is less than the maximum pressure, a control command to reduce the extension length is output, including:
[0104] When the critical pusher pressure is less than the maximum pressure, the maximum pressure is taken as the current pusher pressure;
[0105] Substituting the current pusher pressure into the calculation formula for the critical pusher pressure, the target extension length is obtained;
[0106] The output controls the pusher to adjust to the target extension length, thereby reducing the extension length.
[0107] It is worth noting that the critical pusher pressure also needs to be substituted into the critical pusher pressure calculation model to calculate the moving distance of the slider of the push-pull force testing machine.
[0108] Based on the combined analysis of the formulas for calculating the bonding area and the critical pusher pressure, it is found that the critical pusher pressure is positively correlated with the extension length. The control output command increases the extension length; the push-pull force testing machine is instructed to increase the extension length, which reduces the contact depth between the pusher and the component, thereby reducing the force-bearing area of the pusher and thus reducing the pressure applied to the component.
[0109] To facilitate understanding of the present invention, some preferred embodiments of the present invention will be described in further detail below.
[0110] The following describes the working process of the present invention using a common scenario as an example. The steps are as follows:
[0111] Step 1. Obtain the parameters of the component under test, the extension length of the pusher, the thickness of the adhesive layer, the initial test push force of the pusher, the force-bearing area of the pusher, and the moving distance of the slider; wherein, the parameters of the component under test include the component size parameters and the component weight; set the size of the component under test and the extension length of the pusher, specifically, in this embodiment the component is 12*12cm and the extension length of the pusher is 18cm.
[0112] Step 2. Obtain the maximum tensile force, maximum thrust, and adhesive layer thickness;
[0113] In this embodiment, the maximum tensile force is 20 kg, the maximum thrust is 80 kg, and the adhesive layer thickness is 5 cm.
[0114] Step 3. Calculate the maximum thrust and maximum tension based on the extension length, the adhesive layer thickness, and the component weight;
[0115] When the tensile force is at its maximum, the formula for calculating the bond area is as follows:
[0116]
[0117] Among them, F t For maximum tensile force, k1 is the first correction factor, with a value of 0.0103, m is the weight of the component, a is the extension length, and d is the adhesive layer thickness.
[0118] When the thrust is at its maximum, the formula for calculating the bonding area is as follows:
[0119]
[0120] Among them, F p For maximum thrust, k2 is the second correction factor, with a value of 0.006, m is the component weight, a is the extension length, and d is the adhesive layer thickness.
[0121] Analysis of experimental data reveals that the area of force distribution on the pusher at maximum thrust is S = p × d. Substituting this into the formula for calculating the critical pusher pressure, F = k³·p·S·s, we get:
[0122] S=d*(k2 / d) / (k3*p), so k3=k2 / d;
[0123] In this embodiment, k2 / d is 0.0065 / 5 = 0.013, and the value of k3 is 0.013.
[0124] In this embodiment, the mass m of the component under test is 60 kg. Therefore, the correction coefficient can be obtained by substituting the extension length a of the pusher into the value, which is 1.13.
[0125] In this embodiment, the correction factor is 1.13, so the calculated adhesive area formula is 0.16*5*5*(1-(60 / 18)^2)=1.29㎏;
[0126] Step 4. Calculate the critical pusher pressure required for adhesive layer failure based on the maximum thrust and adhesive force calculation model, and compare it with the maximum thrust.
[0127] Step 5. If the critical pusher pressure required for the adhesive layer to break is greater than the maximum pusher force, the pusher will be unable to move, and the component under test will be damaged.
[0128] In this embodiment, the critical pusher pressure required for the adhesive layer to break is 60 / 1.3 = 45.4 kg, which is greater than the maximum push force of 80 kg, so the component under test is damaged.
[0129] Based on the actual requirement that the pusher cannot move in step 5, a method for calculating the extension length of the pusher is proposed through experimental data analysis.
[0130] Step 6. Set the size of the component to be tested and the extension length of the pusher; specifically, in this embodiment, the component is 12*12cm and the extension length of the pusher is 20cm.
[0131] Step 7. Obtain the maximum thrust and adhesive layer thickness. The maximum thrust is 80 kg and the adhesive layer thickness is 5 cm.
[0132] Step 8. Transfer the model Substitute into the calculation formula for critical pusher pressure;
[0133] F=k3·p·S·s, the critical pusher pressure is calculated by solving for p, and then S is calculated by combining the model S=d*p;
[0134] In this embodiment, the values of k2 and k3 are the same as in step 3. The critical pusher pressure p ≤ 1.05N and the pusher force area S = 5 * p ≤ 5.25 are obtained.
[0135] In summary, this invention discloses a push-blade control method for a push-pull force testing machine, comprising: acquiring parameters of the component under test, the extension length of the push-blade and the thickness of the adhesive layer, as well as the force-bearing area of the push-blade and the moving distance of the slider; wherein, the parameters of the component under test include component size parameters and component weight; calculating the maximum push force and maximum pull force based on the extension length, adhesive layer thickness and component weight; comparing the magnitudes of the maximum push force and maximum pull force to obtain the maximum pressure; calculating the critical push-blade pressure based on the maximum pressure, force-bearing area and moving distance to obtain the critical push-blade pressure required for adhesive layer failure; and determining and outputting a push-blade control command based on the relationship between the critical push-blade pressure and the maximum pressure.
[0136] The method combines the formulas for calculating the bond area and the critical pusher pressure to calculate the critical pusher pressure required for bond failure. This critical pressure is then compared to the maximum pressure. Based on the comparison, the product under test or the push-pull force testing machine is adjusted so that the critical pusher pressure is within a safe and effective testing range when the bond is subjected to force. This avoids excessive critical pusher pressure damaging components, or insufficient critical pusher pressure preventing bond failure and thus ensuring performance testing. The method enables precise control of the pusher in the push-pull force testing machine, yielding accurate and effective test data.
[0137] This invention combines the formulas for calculating adhesive area and critical pusher pressure to calculate the critical pusher pressure required for adhesive layer failure. This critical pressure is then compared with the maximum pusher force. Based on the comparison results, the product under test or the push-pull force testing machine is adjusted so that the critical pusher pressure is within a safe and effective testing range when the adhesive layer is subjected to force. This avoids excessive critical pusher pressure damaging components, or insufficient critical pusher pressure preventing adhesive layer failure and thus hindering performance testing. The method enables precise control of the pusher in the push-pull force testing machine, obtaining accurate and effective test data.
[0138] Reference Figure 2 The second embodiment of the present invention provides a push-blade control system for a push-pull force testing machine, comprising:
[0139] The data acquisition module acquires the parameters of the component under test, the extension length of the pusher and the thickness of the adhesive layer, as well as the initial test push force of the pusher, the force-bearing area of the pusher and the moving distance of the slider; wherein, the parameters of the component under test include the component size parameters and the component weight;
[0140] The maximum thrust and maximum pressure calculation module calculates the maximum thrust and maximum tension based on the extension length, the adhesive layer thickness, and the component weight.
[0141] The maximum pressure determination module determines the relationship between the maximum tensile force and the maximum thrust, and obtains the maximum pressure of the initial test thrust based on the relationship.
[0142] The critical pusher pressure calculation module calculates the critical pusher pressure based on the initial test thrust, the maximum pressure, the force-bearing area, and the moving distance; wherein, the critical pusher pressure is the critical pusher pressure required for the adhesive layer to break when the pusher acts on the component, calculated using the maximum pressure as the initial test thrust.
[0143] The pressure monitoring and control module is used to determine whether the critical pusher pressure is greater than the maximum pressure, and output a control command to increase the extension length; and whether the critical pusher pressure is less than the maximum pressure, and output a control command to decrease the extension length.
[0144] It should be noted that the push-blade control system of the push-pull force testing machine provided in the embodiments of the present invention is used to execute all the process steps of the push-blade control method of the push-pull force testing machine in the above embodiments. The working principles and beneficial effects of the two are one-to-one, so they will not be described again.
[0145] This invention also provides an electronic device. The electronic device includes a processor, a memory, and a computer program stored in the memory and executable on the processor, such as a critical pusher pressure calculation program. When the processor executes the computer program, it implements the steps in the pusher control method embodiments of the various push-pull force testing machines described above, for example... Figure 1 The step S11 shown. Alternatively, when the processor executes the computer program, it implements the functions of each module / unit in the above-described device embodiments, such as the critical pusher pressure calculation module.
[0146] For example, the computer program may be divided into one or more modules / units, which are stored in the memory and executed by the processor to complete the present invention. The one or more modules / units may be a series of computer program instruction segments capable of performing a specific function, which describe the execution process of the computer program in the electronic device.
[0147] The electronic device may be a desktop computer, laptop, handheld computer, or smart tablet, etc. The electronic device may include, but is not limited to, a processor and memory. Those skilled in the art will understand that the above components are merely examples of electronic devices and do not constitute a limitation on the electronic device. It may include more or fewer components than described above, or combine certain components, or different components. For example, the electronic device may also include input / output devices, network access devices, buses, etc.
[0148] The processor can be a Central Processing Unit (CPU), or other general-purpose processors, digital signal processors (DSPs), application-specific integrated circuits (ASICs), field-programmable gate arrays (FPGAs), or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc. A general-purpose processor can be a microprocessor or any conventional processor. The processor is the control center of the electronic device, connecting all parts of the electronic device via various interfaces and lines.
[0149] The memory can be used to store the computer programs and / or modules. The processor implements various functions of the electronic device by running or executing the computer programs and / or modules stored in the memory and by calling data stored in the memory. The memory may mainly include a program storage area and a data storage area. The program storage area may store the operating system, at least one application program required for a function (such as sound playback function, image playback function, etc.), etc.; the data storage area may store data created according to the use of the mobile phone (such as audio data, phonebook, etc.). In addition, the memory may include high-speed random access memory, and may also include non-volatile memory, such as hard disk, RAM, plug-in hard disk, smart media card (SMC), secure digital (SD) card, flash card, at least one disk storage device, flash memory device, or other volatile solid-state storage device.
[0150] Wherein, if the modules / units integrated in the electronic device are implemented as software functional units and sold or used as independent products, they can be stored in a computer-readable storage medium. Based on this understanding, all or part of the processes in the methods of the above embodiments of the present invention can also be implemented by a computer program instructing related hardware. The computer program can be stored in a computer-readable storage medium, and when executed by a processor, it can implement the steps of the various method embodiments described above. The computer program includes computer program code, which can be in the form of source code, object code, executable files, or certain intermediate forms. The computer-readable medium can include: any entity or device capable of carrying the computer program code, recording media, USB flash drives, portable hard drives, magnetic disks, optical disks, computer memory, read-only memory (ROM), random access memory (RAM), electrical carrier signals, telecommunication signals, and software distribution media, etc. It should be noted that the content included in the computer-readable medium can be appropriately added or removed according to the requirements of legislation and patent practice in the jurisdiction. For example, in some jurisdictions, according to legislation and patent practice, computer-readable media do not include electrical carrier signals and telecommunication signals.
[0151] It should be noted that the device embodiments described above are merely illustrative. The units described as separate components may or may not be physically separate, and the components shown as units may or may not be physical units; that is, they may be located in one place or distributed across multiple network units. Some or all of the modules can be selected to achieve the purpose of this embodiment according to actual needs. Furthermore, in the accompanying drawings of the device embodiments provided by this invention, the connection relationships between modules indicate that they have communication connections, which can be specifically implemented as one or more communication buses or signal lines. Those skilled in the art can understand and implement this without any creative effort.
[0152] The specific embodiments described above further illustrate the purpose, technical solution, and beneficial effects of the present invention. It should be understood that the above descriptions are merely specific embodiments of the present invention and are not intended to limit the scope of protection of the present invention. In particular, it should be noted that any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the scope of protection of the present invention for those skilled in the art.
Claims
1. A push-blade control method for a push-pull force testing machine, characterized in that, Performed by the control system, including: The parameters of the component under test, the extension length of the pusher and the thickness of the adhesive layer, as well as the initial test push force of the pusher, the force-bearing area of the pusher and the moving distance of the slider are obtained; wherein, the parameters of the component under test include the component size parameters and the component weight; The maximum thrust and maximum tension are calculated based on the extension length, the adhesive layer thickness, and the component weight. Determine the relationship between the maximum tensile force and the maximum thrust, and obtain the maximum pressure of the initial test thrust based on the relationship; The critical pusher pressure is calculated based on the initial test thrust, the maximum pressure, the force-bearing area, and the moving distance; wherein, the critical pusher pressure is the critical pusher pressure required for the adhesive layer to break when the pusher acts on the component, calculated when the maximum pressure is used as the initial test thrust. When the critical pusher pressure is greater than the maximum pressure, a control command to increase the extension length is output. When the critical pusher pressure is less than the maximum pressure, a control command to reduce the extension length is output. The step of calculating the maximum thrust and maximum tension based on the extension length, the adhesive layer thickness, and the component weight includes: Obtain the pre-configured first and second correction coefficients; The maximum thrust and the maximum tensile force are calculated using the following formula for calculating the bond area: in, It is the maximum thrust. That is the maximum tensile force. It is the first correction factor. It is the second correction factor. It refers to the thickness of the adhesive layer. It is the weight of the components. It is the extension length; The configuration process for the first and second correction coefficients includes: The test parameters for initializing the push-pull force tester are set according to the component size parameters, the extension length, and the adhesive layer thickness, including the length correction factor and the width correction factor; Multiple push-pull force tests were conducted on the component under test, and the test parameters of the push-pull force testing machine were continuously adjusted to cause the adhesive layer to break. Through multiple sets of tests under different conditions, several sets of test data on the critical pusher pressure and moving distance were obtained. The test data of the aforementioned sets were fitted using the least squares method, and the fitted data were matched with the calculation formulas for critical pusher pressure and adhesive area to obtain the first correction coefficient and the second correction coefficient.
2. The push-blade control method of the push-pull force testing machine according to claim 1, characterized in that, The step of determining the relationship between the maximum tensile force and the maximum thrust, and obtaining the maximum pressure of the initial test thrust based on the relationship, includes: Compare the magnitudes of the maximum tensile force and the maximum thrust; If the maximum tensile force is greater than the maximum thrust, the maximum thrust will be used as the maximum pressure of the initial test thrust; If the maximum tensile force is less than the maximum thrust, the maximum tensile force shall be used as the maximum pressure of the initial test thrust.
3. The push-blade control method of the push-pull force testing machine according to claim 2, characterized in that, The calculation of the critical pusher pressure based on the initial test thrust, the maximum pressure, the force-bearing area, and the moving distance, to obtain the critical pusher pressure, includes: Using the maximum pressure as the initial test thrust, the critical pusher pressure is calculated based on the initial test thrust, the force-bearing area, and the moving distance to obtain the critical pusher pressure. The critical pusher pressure is obtained using the following calculation formula: in, It is the critical pusher pressure, That is the maximum pressure mentioned. It is the area of force application. It is the extension length. It refers to the thickness of the adhesive layer. It is the distance traveled. It is the third correction factor; the force-bearing area is the area of actual contact and force between the pusher and the component under test.
4. The push-blade control method of the push-pull force testing machine according to claim 3, characterized in that, When the critical pusher pressure is greater than the maximum pressure, a control command to increase the extension length is output, including: Analysis based on the calculation formula of the critical pusher pressure shows that the critical pusher pressure is negatively correlated with the force-bearing area, that is, the critical pusher pressure is negatively correlated with the extension length. When the critical pusher pressure is greater than the maximum pressure, the maximum pressure is taken as the current pusher pressure; Substituting the current pusher pressure into the calculation formula for the critical pusher pressure, the target extension length is obtained; The output controls the pusher to adjust to the target extension length, thereby increasing the extension length.
5. The push-blade control method of the push-pull force testing machine according to claim 1, characterized in that, The continuous adjustment of the test parameter settings of the push-pull force testing machine includes: The extension length of the pusher blade was adjusted for each set of test parameters using a push-pull force testing machine. The following relationship is achieved between the protrusion length and the size of the component under test through calculation: in, For the weight of the components, denoted as 'extended length', 'b' as the length correction factor, and 'c' as the width correction factor.
6. A push-blade control system for a push-pull force testing machine, used to implement the push-blade control method of the push-pull force testing machine as described in any one of claims 1 to 5, characterized in that, include: The data acquisition module acquires the parameters of the component under test, the extension length of the pusher and the thickness of the adhesive layer, as well as the initial test push force of the pusher, the force-bearing area of the pusher and the moving distance of the slider; wherein, the parameters of the component under test include the component size parameters and the component weight; The maximum thrust and maximum pressure calculation module calculates the maximum thrust and maximum tension based on the extension length, the adhesive layer thickness, and the component weight. The maximum pressure determination module determines the relationship between the maximum tensile force and the maximum thrust, and obtains the maximum pressure of the initial test thrust based on the relationship. The critical pusher pressure calculation module calculates the critical pusher pressure based on the initial test thrust, the maximum pressure, the force-bearing area, and the moving distance; wherein, the critical pusher pressure is the critical pusher pressure required for the adhesive layer to break when the pusher acts on the component, calculated using the maximum pressure as the initial test thrust. The pressure monitoring and control module is used to determine whether the critical pusher pressure is greater than the maximum pressure, and output a control command to increase the extension length; and whether the critical pusher pressure is less than the maximum pressure, and output a control command to decrease the extension length.
7. An electronic device, characterized in that, The device includes a processor, a memory, and a computer program stored in the memory and configured to be executed by the processor, wherein the processor, when executing the computer program, implements the push-blade control method of the push-pull force testing machine as described in any one of claims 1 to 5.
8. A computer-readable storage medium, characterized in that, The computer-readable storage medium includes a stored computer program, wherein, when the computer program is executed, it controls the device containing the computer-readable storage medium to perform the push-blade control method of the push-pull force testing machine as described in any one of claims 1 to 5.
Citation Information
Patent Citations
Method and tool for testing shearing and bonding strength of colloid
CN114459998A
Wafer push-pull force testing machine convenient for controlling clamping force
CN117664699A