An apparatus for attaching a protective tape to a semiconductor wafer

Abstract

The application belongs to the technical field of wafer processing, in particular to a device for attaching protective tape on a semiconductor wafer, which comprises a placing device, the upper surface of the placing device is provided with a chip plate, the upper part of the chip plate is provided with a cutting device; the outer surface of the accommodating base is symmetrically provided with tape roll rods on the left and right sides, the outer surface of the tape roll rod is rotatably connected with a protective tape, the left tape roll rod is used for placing a tape roll, and the right tape roll rod is used for accommodating the waste tape after cutting. The device can perform tape attaching work on the chips placed on the upper surface of the adaptive carrier plate through the middle protective tape, and the tape attached on the upper surface of the chip can be accurately cut off through the cutting component, thereby avoiding the problem that the cut tape is difficult to be accurately clamped and attached on the outer surface of the chip due to the small area, and the problem that the attached tape is broken due to the clamping force applied by the mechanical clamping jaw can also be avoided.

Description

TECHNICAL FIELD

[0001] The present application belongs to the technical field of wafer processing, in particular to a device for attaching protective tape to a semiconductor wafer. BACKGROUND

[0002] The process of manufacturing semiconductor chips generally includes forming a circuit having a concave-convex portion on the front surface of a semiconductor wafer, and then, in order to meet the recent demand for reducing the size of semiconductor chips, polishing the rear surface located on the opposite side of the front surface on which the circuit is formed, to thereby reduce the thickness of the wafer. When the thickness of the wafer is reduced, the circuit formation portion is protected by applying a protective tape to the front surface of the wafer.

[0003] Since the volume of semiconductor chips is generally small, an adaptive cutting work needs to be performed before the protective tape is attached to the outer surface of the chip, and then the cut tape is precisely attached to the outer surface of the chip, but at this time the area of the tape is small, which is not only difficult to clamp, but also prone to breakage due to the clamping force applied by the related mechanical clamps, so special tape-attaching equipment is needed. SUMMARY

[0004] In view of the deficiencies of the prior art, the technical scheme adopted by the present application to solve the technical problems is: a device for attaching protective tape to a semiconductor wafer, comprising a placing device, the upper surface of the placing device is provided with a chip plate, the upper part of the chip plate is provided with a cutting device;

[0005] The placing device comprises a containing disc, the outer surfaces of the left and right sides of the containing disc are symmetrically provided with tape roll rods, the outer surfaces of the tape roll rods are rotationally connected with protective tapes, the left tape roll rod is used for placing a tape roll, and the right tape roll rod is used for accommodating waste tape after cutting, the left and right sides of the top inner wall of the containing disc are symmetrically provided with supporting devices, and the bottom inner wall of the containing disc is provided with a communicating disc, the upper surface of the communicating disc is symmetrically provided with pressure sensing rods.

[0006] The cutting device comprises a pressing top shell, the upper surface of the pressing top shell is symmetrically provided with a control pressure rod, the top of the control pressure rod is slidably connected with the ceiling through a guide rail, the control pressure rod can drive the pressing top shell to vertically slide, and can also control the top end of the pressing top shell to horizontally slide along the guide rail laid on the surface of the ceiling, so as to adjust the lower knife point, the top of the inner wall of the pressing top shell is uniformly provided with a cutting part, the top of the outer surface of the cutting part is provided with a traction device, the left and right sides of the inner wall of the pressing top shell are symmetrically provided with a pressure generator, the bottom of the inner cavity of the pressure generator is uniformly provided with a compression connecting rod, and the bottom end of the compression connecting rod is fixedly connected with a pressing arc plate, the pressure generator presses the pressing arc plates on the two sides by means of the compression connecting rod, so that the middle adhesive tape can be pressed flat on the upper surface of the chip board, and the two sides of the adhesive tape will not be raised due to the traction of the adhesive tape roll rod.

[0007] Further, the cutting part comprises a sliding controller, the bottom end of the output shaft of the sliding controller is fixedly connected with a segmented traction arm, the sliding controller can twist the segmented traction arms on the two sides in the horizontal plane, the end, away from the sliding controller, of the segmented traction arm is fixedly connected with a torsion motor, the segmented traction arm can pull the torsion motors on the two sides in an extending and retracting mode, the bottom end of the output shaft of the torsion motor is fixedly connected with a suspension bracket, the bottom end of the suspension bracket is symmetrically provided with a torsion motor, the outer surface of the output shaft of the torsion motor is fixedly connected with a cutting disc, and the torsion motor can change the lower knife point of the cutting disc by rotating the suspension bracket. The upper surface of the sliding controller is slidably connected with the inner wall of the pressing top shell through a rolling ball, the shaft center of the outer surface of the torsion motor is fixedly connected with the bottom end of the suspension bracket, the outer surface of the pressure generator is fixedly connected with the inner wall of the pressing top shell, and the lower surface of the pressing arc plate is pressed against the upper surface of the protective adhesive tape.

[0008] Further, the chip board comprises an adaptive carrier plate, the inner cavity of the adaptive carrier plate is uniformly provided with a through accommodating groove, and the bottom of the inner cavity of the adaptive carrier plate is symmetrically provided with a symmetric socket. The upper surface of the adaptive carrier plate is uniformly provided with a film chip through the through accommodating groove. The top end of the pressure sensing plug rod extends to the outside of the accommodating base through the socket, the bottom of the adaptive carrier plate is inserted into the top end of the pressure sensing plug rod through the symmetric socket, the lower surface of the protective adhesive tape is attached to the upper surface of the adaptive carrier plate, the pressure sensing plug rod supports the adaptive carrier plate and suspends the adaptive carrier plate on the upper part of the accommodating base, and when the pressure sensing plug rod is pressed, the communicating base at the bottom controls the cutting device to cut.

[0009] Further, the traction device comprises a searchlight box, the upper surface of the searchlight box is uniformly provided with a searchlight lens, the front and rear sides of the inner cavity of the searchlight box are symmetrically provided with vertical adjusting rods, the top end of the vertical adjusting rod is fixedly connected with a propeller, the shaft center of the inner cavity of the propeller is fixedly connected with a horizontal push rod, the searchlight box can scan the through accommodating groove on the top of the inner wall through the searchlight lens directly above, since one through accommodating groove can place one chip, the searchlight box can accurately move the cutting component to the position of the chip through the scanning picture, so that only one cutting component needs to be arranged in each column to realize flexible cutting work. The lower surface of the searchlight box is fixedly connected with the upper surface of the accommodating base plate, the outer surface of the propeller is fixedly connected with the inner wall of the downward pressing top shell, and the end, away from the propeller, of the horizontal push rod is fixedly connected with the shaft center of the outer surface of the sliding controller.

[0010] Further, the support device comprises a pressure control bottom plate, the upper surface of the pressure control bottom plate is uniformly provided with segmented hollow tubes through exhaust ports, the top end of the segmented hollow tube is fixedly connected with a long strip push plate, the upper surface of the long strip push plate is uniformly provided with mesh covers, and the shaft center of the mesh cover is rollingly connected with an external ball through a clamping groove. The number of the support device is two, the upper part of the outer surface of the pressure control bottom plate is fixedly connected with the top of the inner cavity of the accommodating base plate through a slot, the outer surface of the external ball is extruded with the lower surface of the protective adhesive tape, and the top end of the segmented hollow tube is communicated with the inner cavity of the long strip push plate through a butt joint. The pressure control bottom plate can blow the adhesive tape away from the outer surface of the external ball by means of the holes of the mesh cover through the upward blowing way.

[0011] The beneficial effects of the present application are as follows:

[0012] 1. The device can perform adhesive work on the chip placed on the upper surface of the adaptive carrier plate through the middle protective adhesive tape, and the adhesive tape adhered to the upper surface of the chip can be accurately cut off by the cutting component, thereby avoiding the problem that the cut adhesive tape is difficult to be accurately clamped on the outer surface of the chip due to its small area, and avoiding the problem that the clamping force of the mechanical clamping jaw causes the adhesive tape to break.

[0013] 2. The device can perform adhesive work on the outer surface of the chip placed on the adaptive carrier plate in batches, and the residual adhesive tape after cutting can be recycled by the right adhesive tape winding rod and supplemented by the left adhesive tape winding rod, so as to achieve the effect of circulating feeding, so that the next chip adhesive work can be normally carried out, thereby saving the time consumed for feeding the adhesive tape, and the adhesive surface is always not in contact with the outside during feeding, thereby ensuring the purity of the adhesive surface and avoiding the problem that the adhesive surface is polluted by contacting the hands of the operator during manual feeding.

[0014] 3. The device can cut the protective tape through the cutting component. Since the traction device below can determine the position of the chip through the through-hole accommodating slot of the adaptive carrier plate, the cutting component can be automatically moved, and the lower cutting point of the cutting component can be accurately determined, so that the cutting disc always adheres to the side edge position of the chip during the cutting process, thereby avoiding the problems of excessive cutting surface of the tape and damage to the chip by the cutting disc.

[0015] 4. Since the support device is arranged below the tape, when the waste tape after cutting is recycled, the support device can be used to push the tape from bottom to top, so that the tape is peeled off from the upper surface of the adaptive carrier plate, and then the tape is separated from the external ball through the jetting of the mesh cover. Since the support device is symmetrically arranged and works synchronously, the tape will not be wrinkled or skewed due to manual operation, and the middle part of the processed tape can still maintain the arched state, so that the chip plate can be removed, thereby avoiding the problem that the lower surface of the tape is in contact with the chip plate and adheres to the chip plate. BRIEF DESCRIPTION OF DRAWINGS

[0016] Figure 1 is the front view of the present application;

[0017] Figure 2 is the sectional view of the present application;

[0018] Figure 3 is the sectional view of the placing device of the present application;

[0019] Figure 4 is the sectional view of the cutting device of the present application;

[0020] Figure 5 is the structural schematic view of the cutting component of the present application;

[0021] Figure 6 is the structural schematic view of the chip plate of the present application;

[0022] Figure 7 is the structural schematic view of the traction device of the present application;

[0023] Figure 8 is the sectional view of the support device of the present application.

[0024] In the figure: 1, placing device; 2, supporting device; 3, chip plate; 4, cutting device; 5, control pressure rod; 11, containing bottom disc; 12, adhesive tape roll rod; 13, protective adhesive tape; 14, communication bottom disc; 15, pressure sensing plug rod; 41, lower pressing top shell; 42, pressure generator; 43, compression connecting rod; 44, lower pressing arc plate; 6, cutting component; 61, sliding controller; 62, segmented traction arm; 63, torsion motor; 64, suspension frame; 65, torsion motor; 66, cutting cutter; 31, adaptive carrier plate; 32, through containing slot; 33, symmetrical socket; 7, traction device; 71, searchlight box; 72, searchlight lens; 73, vertical adjustment rod; 74, propeller; 75, horizontal push rod; 21, pressure control bottom plate; 22, segmented hollow pipe; 23, long strip push plate; 24, mesh cover; 25, external ball. DETAILED DESCRIPTION

[0025] The application will be further described below in conjunction with the drawings and specific embodiments. The embodiments of the application are given for illustrative and descriptive purposes only and are not intended to be exhaustive or to limit the application to the forms disclosed. Many modifications and variations will be apparent to those of ordinary skill in the art. Embodiments were chosen and described in order to best explain the principles of the application and its practical application, and to enable others skilled in the art to understand the application for various embodiments with various modifications as are suited to the particular use contemplated.

[0026] Embodiment 1, please refer to Figures 1-5 The application provides a technical solution: a device for attaching protective adhesive tape 13 to a semiconductor wafer, comprising a placing device 1, the upper surface of the placing device 1 is provided with a chip plate 3, and the upper part of the chip plate 3 is provided with a cutting device 4;

[0027] The placing device 1 comprises a containing bottom disc 11, the outer surfaces of the left and right sides of the containing bottom disc 11 are symmetrically provided with adhesive tape roll rods 12, the outer surfaces of the adhesive tape roll rods 12 are rotationally connected with protective adhesive tapes 13, the left adhesive tape roll rod 12 is used for placing an adhesive tape cylinder, and the right adhesive tape roll rod 12 is used for accommodating waste adhesive tape after cutting, the left and right sides of the top of the inner wall of the containing bottom disc 11 are symmetrically provided with supporting devices 2, and the bottom of the inner wall of the containing bottom disc 11 is provided with a communication bottom disc 14, and the upper surface of the communication bottom disc 14 is symmetrically provided with pressure sensing plug rods 15;

[0028] The cutting device 4 includes a pressure top shell 41. Control pressure rods 5 are symmetrically arranged on the upper surface of the pressure top shell 41. The top of the control pressure rods 5 is slidably connected to the ceiling via a guide rail. Cutting components 6 are evenly arranged on the top of the inner wall of the pressure top shell 41. A traction device 7 is arranged on the top of the outer surface of the cutting components 6. Pressure boosters 42 are symmetrically arranged on the left and right sides of the inner wall of the pressure top shell 41. Compression connecting rods 43 are evenly arranged at the bottom of the inner cavity of the pressure booster 42. A pressure arc plate 44 is fixedly connected to the bottom end of the compression connecting rod 43. The pressure booster 42 pushes the compression connecting rod 43 to press down the pressure arc plates 44 on both sides, thereby pressing the tape in the middle flat onto the upper surface of the chip board 3, and the two sides of the tape will not lift up due to the traction of the tape roll rod 12.

[0029] The cutting component 6 includes a sliding controller 61. A segmented traction arm 62 is fixedly connected to the bottom end of the output shaft of the sliding controller 61. The sliding controller 61 can twist the segmented traction arms 62 on both sides in a horizontal plane. A torsion motor 63 is fixedly connected to the end of the segmented traction arm 62 away from the sliding controller 61. The segmented traction arm 62 can pull the torsion motors 63 on both sides by telescopic movement. A suspension frame 64 is fixedly connected to the bottom end of the output shaft of the torsion motor 63. A torque motor 65 is symmetrically arranged at the bottom end of the suspension frame 64. A cutting disc 66 is fixedly connected to the outer surface of the output shaft of the torque motor 65. The torsion motor 63 can change the cutting point of the cutting disc 66 by rotating the suspension frame 64. The upper surface of the sliding controller 61 is slidably connected to the inner wall of the lower pressure shell 41 via a ball bearing. The shaft of the outer surface of the torque motor 65 is fixedly connected to the bottom end of the suspension bracket 64. The outer surface of the pressure device 42 is fixedly connected to the inner wall of the lower pressure shell 41. The lower surface of the lower pressure arc plate 44 is pressed against the upper surface of the protective tape 13.

[0030] Before using this device to apply adhesive to the chip, peel off the protective tape 13 from the left tape reel 12, allowing the tape 13 to pass through the middle of the device. Then, attach the right end of the tape to the right tape reel 12, allowing the right tape reel 12 to retract the tape. To ensure sufficient space for removing the chip board 3, the protective tape 13 will typically arch to a certain height when not applying adhesive. Figure 3 As shown.

[0031] First, remove the internal chip board 3, fill the slot above the chip board 3 with chips in sequence, then insert the four corners of the bottom of the adapter carrier board 31 into the top of the pressure-sensitive plug 15, and suspend the chip board 3 directly above the receiving chassis 11 to complete the preparation work.

[0032] After the chip board 3 is fixed, the control lever 5 above presses down the cutting device 4. The pressure devices 42 on both sides press down on both sides of the middle tape by pushing down the pressure arc plate 44. At this time, the adhesive side of the lower surface of the tape will directly cover the top of the chip board 3. Since the chip on the adapter carrier 31 will protrude, the protective tape 13 will first flatly adhere to the upper surface of the chip. Then, as the pressure arc plate 44 continues to press, both sides of the protective tape 13 will adhere to the upper surface of the adapter carrier 31, and then the cutting work will be ready.

[0033] After the tape is cut, it is divided into two parts: a large piece of tape to be applied to the upper surface of the adapter board 31, and several small pieces of tape to be applied to the upper surface of the chip. The two parts of tape are completely separated. At this time, the large piece of tape applied to the upper surface of the adapter board 31 can be pushed upward from bottom to top by the support device 2 at the bottom to separate the tape from the adapter board 31. Then, the tape reel 12 on the right side retracts the cut large piece of tape, removes the chip board 3, pours out the internal chip, and obtains the chip after adhesive application.

[0034] Example 2, please refer to Figures 1-8 This invention provides a technical solution: Based on embodiment 1, the chip board 3 includes an adapter carrier 31. The inner cavity of the adapter carrier 31 is uniformly provided with through-hole receiving grooves 32. Symmetrical insertion ports 33 are symmetrically provided at the bottom of the inner cavity of the adapter carrier 31. A coated chip is uniformly disposed on the upper surface of the adapter carrier 31 through the through-hole receiving grooves 32. The top end of the pressure-sensitive insertion rod 15 extends to the outside of the receiving base 11 through the through-hole. The bottom of the adapter carrier 31 is inserted into the top end of the pressure-sensitive insertion rod 15 through the symmetrical insertion ports 33. The lower surface of the protective tape 13 is in contact with the upper surface of the adapter carrier 31. The pressure-sensitive insertion rod 15 lifts the adapter carrier 31, suspending it above the receiving base 11. When the pressure-sensitive insertion rod 15 is pressed, the bottom connecting base 14 controls the cutting device 4 to perform cutting operations.

[0035] The traction device 7 includes a searchlight box 71. Searchlight lenses 72 are evenly distributed on the upper surface of the searchlight box 71. Vertical adjustment rods 73 are symmetrically arranged on the front and rear sides of the inner cavity of the searchlight box 71. A pusher 74 is fixedly connected to the top of the vertical adjustment rod 73. A horizontal push rod 75 is fixedly connected to the axis of the inner cavity of the pusher 74. The searchlight box 71 can scan the through-hole receiving slot 32 on the top of the inner wall through the searchlight lenses 72. Since one through-hole receiving slot 32 can hold one chip, the searchlight box 71 can accurately move the cutting component 6 to the position of the chip through the scanning image. Therefore, only one cutting component 6 is needed for each column to achieve flexible cutting. The lower surface of the searchlight box 71 is fixedly connected to the upper surface of the receiving chassis 11. The outer surface of the pusher 74 is fixedly connected to the inner wall of the lower pressure shell 41. The end of the horizontal push rod 75 away from the pusher 74 is fixedly connected to the axis of the outer surface of the sliding controller 61.

[0036] The support device 2 includes a pressure-controlled base plate 21. Segmented hollow tubes 22 are evenly arranged on the upper surface of the pressure-controlled base plate 21 through exhaust ports. A long push plate 23 is fixedly connected to the top of each segmented hollow tube 22. Mesh covers 24 are evenly arranged on the upper surface of the long push plate 23. External ball bearings 25 are rotatably connected to the axis of the mesh cover 24 via slots. There are two support devices 2. The upper part of the outer surface of the pressure-controlled base plate 21 is fixedly connected to the top of the inner cavity of the receiving chassis 11 via slots. The outer surface of the external ball bearings 25 is pressed against the lower surface of the protective tape 13. The top of the segmented hollow tubes 22 communicates with the inner cavity of the long push plate 23 via an interface. The pressure-controlled base plate 21 can blow air upwards, using the holes in the mesh cover 24, to blow away the tape adhering to the outer surface of the external ball bearings 25.

[0037] The cutting component 6 inside the pressure top shell 41 can cut the upper surface of the protective tape 13, cutting the tape that adheres to the upper surface of the chip from the protective tape 13. That is, the torque motor 65 drives the cutting disc 66 to rotate at high speed, cutting the protective tape 13 along the edge of the upper chip. Since it is a mass production operation and each chip has the same shape, after the cutting disc 66 of each cutting component 6 is aligned with the upper surface of the protective tape 13, the pressure rod 5 can be used to move the pressure top shell 41 to simultaneously control all the cutting components 6 to perform the cutting operation. The segmented traction arm 62 and the sliding controller 61 can further fine-tune the deflection of the cutting disc 66 to ensure that the cut tape adheres to the contour of the outer surface of the chip.

[0038] After placing the chip board 3 on top of the pressure-sensitive plug 15, the bottom probe box 71 can scan each column of through-receiving grooves 32 through the probe lens 72. The actual cutting point of the cutting disc 66 is determined by the reserved cutting opening of the through-receiving groove 32, so that the cutting disc 66 is aligned with the opening of the through-receiving groove 32, ensuring that the cutting disc 66 can cut through the protective tape 13 and that all four sides of the chip can be effectively cut. Then, the corresponding cutting component 6 is precisely controlled to move longitudinally to cut the protective tape 13 at the adjacent chip positions.

[0039] The segmented hollow tube 22 can actively retract to push the long push plate 23 upward, thereby making the top external ball bearing 25 contact the adhesive surface of the lower surface of the protective tape 13, peeling off the protective tape 13 attached to the upper surface of the adapter plate 31. The pressure control plate 21 blows air from bottom to top through the segmented hollow tube 22 to separate the tape attached to the outer surface of the external ball bearing 25, and then the tape is wound up to ensure that the tape does not wrinkle or skew, and the middle of the treated tape can still maintain an arched shape.

[0040] Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of them. All other embodiments obtained by those skilled in the art and related fields based on the embodiments of the present invention without inventive effort should fall within the scope of protection of the present invention. Structures, devices, and operating methods not specifically described and explained in the present invention, unless otherwise specified or limited, shall be implemented according to conventional means in the art.

Claims

1. An apparatus for attaching protective tape to a semiconductor wafer, comprising a placement device (1), wherein a chip plate (3) is disposed on the upper surface of the placement device (1), and a cutting device (4) is disposed on the upper part of the chip plate (3), characterized in that: The placement device (1) includes a receiving chassis (11), tape reel rods (12) are symmetrically arranged on the left and right sides of the outer surface of the receiving chassis (11), a protective tape (13) is rotatably connected to the outer surface of the tape reel rods (12), support devices (2) are symmetrically arranged on the left and right sides of the top of the inner wall of the receiving chassis (11), a connecting chassis (14) is arranged at the bottom of the inner wall of the receiving chassis (11), and pressure-sensing inserts (15) are symmetrically arranged on the upper surface of the connecting chassis (14). The cutting device (4) includes a pressure top shell (41), on the upper surface of the pressure top shell (41) are symmetrically arranged control pressure rods (5), the top of the control pressure rods (5) is slidably connected to the ceiling through a guide rail, the top of the inner wall of the pressure top shell (41) is uniformly arranged with cutting components (6), the top of the outer surface of the cutting components (6) is arranged with a traction device (7), the left and right sides of the inner wall of the pressure top shell (41) are symmetrically arranged with pressure boosters (42), the bottom of the inner cavity of the pressure booster (42) is uniformly arranged with compression connecting rods (43), and the bottom end of the compression connecting rods (43) is fixedly connected with a pressure arc plate (44).

2. The apparatus for attaching protective tape to a semiconductor wafer according to claim 1, characterized in that: The cutting component (6) includes a sliding controller (61), a segmented traction arm (62) is fixedly connected to the bottom end of the output shaft of the sliding controller (61), a torsion motor (63) is fixedly connected to the end of the segmented traction arm (62) away from the sliding controller (61), a suspension frame (64) is fixedly connected to the bottom end of the output shaft of the torsion motor (63), a torque motor (65) is symmetrically arranged at the bottom end of the suspension frame (64), and a cutting disc (66) is fixedly connected to the outer surface of the output shaft of the torque motor (65).

3. The apparatus for attaching protective tape to a semiconductor wafer according to claim 2, characterized in that: The upper surface of the sliding controller (61) is slidably connected to the inner wall of the lower pressure shell (41) via a ball bearing. The shaft of the outer surface of the torque motor (65) is fixedly connected to the bottom end of the suspension frame (64). The outer surface of the pressure device (42) is fixedly connected to the inner wall of the lower pressure shell (41). The lower surface of the lower pressure arc plate (44) is pressed against the upper surface of the protective tape (13).

4. The apparatus for attaching protective tape to a semiconductor wafer according to claim 1, characterized in that: The chip board (3) includes an adapter board (31). The inner cavity of the adapter board (31) is uniformly provided with through receiving grooves (32). The bottom of the inner cavity of the adapter board (31) is symmetrically provided with symmetrical insertion ports (33). The upper surface of the adapter board (31) is uniformly provided with coated chips through the through receiving grooves (32).

5. The apparatus for attaching protective tape to a semiconductor wafer according to claim 4, characterized in that: The top end of the pressure-sensing plug (15) extends to the outside of the receiving chassis (11) through the through-hole, and the bottom of the adapter plate (31) is inserted into the top end of the pressure-sensing plug (15) through the symmetrical plug (33). The lower surface of the protective tape (13) is in contact with the upper surface of the adapter plate (31).

6. The apparatus for attaching protective tape to a semiconductor wafer according to claim 2, characterized in that: The traction device (7) includes a searchlight box (71), on which searchlight lenses (72) are evenly arranged on the upper surface. Vertical adjustment rods (73) are symmetrically arranged on the front and rear sides of the inner cavity of the searchlight box (71). A pusher (74) is fixedly connected to the top of the vertical adjustment rod (73). A horizontal push rod (75) is fixedly connected to the axis of the inner cavity of the pusher (74).

7. The apparatus for attaching protective tape to a semiconductor wafer according to claim 6, characterized in that: The lower surface of the searchlight box (71) is fixedly connected to the upper surface of the receiving chassis (11), the outer surface of the pusher (74) is fixedly connected to the inner wall of the pressure top shell (41), and the end of the horizontal push rod (75) away from the pusher (74) is fixedly connected to the axis of the outer surface of the sliding controller (61).

8. The apparatus for attaching protective tape to a semiconductor wafer according to claim 2, characterized in that: The support device (2) includes a pressure control base plate (21). The upper surface of the pressure control base plate (21) is uniformly provided with segmented hollow tubes (22) through exhaust ports. The top end of the segmented hollow tubes (22) is fixedly connected with a long push plate (23). The upper surface of the long push plate (23) is uniformly provided with a mesh cover (24). The axial center of the mesh cover (24) is connected to an external ball bearing (25) through a slot.

9. The apparatus for attaching protective tape to a semiconductor wafer according to claim 8, characterized in that: The number of the support devices (2) is two. The upper part of the outer surface of the pressure control base plate (21) is fixedly connected to the top of the inner cavity of the receiving chassis (11) through a slot. The outer surface of the external ball bearing (25) and the lower surface of the protective tape (13) are pressed against each other. The top of the segmented hollow tube (22) is connected to the inner cavity of the long strip push plate (23) through a mating interface.

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