Wafer processing film pasting device

Abstract

A wafer processing film pasting equipment for semiconductor wafer film pasting processing, comprising a rack, a support seat mounted on the rack, and a positioning device mounted on the rack and extending into the outer periphery above the support seat, the rack comprising a first face cover, the first face cover being further provided with a plurality of auxiliary positioning columns, the auxiliary positioning columns being tangent to the outer peripheral surface of the wafer after the wafer completes position correction on the support seat; the positioning device comprising a guide plate, a driving assembly matched with the guide plate, a sleeve group mounted on the upper end surface of the guide plate, a positioning rod group mounted on the sleeve group, a first limiting block, a second limiting block, a first magnetic attraction assembly, and a second magnetic attraction assembly, the driving assembly driving the guide plate to adjust the position, so that the guide plate moves to a first position or a second position, when the guide plate moves to the first position, the positioning rod group limits the wafer, the wafer can be position corrected and fixed, the film pasting quality is ensured, and the processing quality of the product in the subsequent process is effectively improved.

Description

TECHNICAL FIELD

[0001] The present application relates to a semiconductor processing equipment, in particular to a wafer processing film pasting equipment. BACKGROUND

[0002] Wafer refers to a silicon wafer used for manufacturing semiconductor integrated circuits, which is circular in shape, so it is called wafer. The raw material of wafer is high-purity polycrystalline silicon, which is formed into a silicon wafer after processes such as dissolving, doping into silicon crystal seeds, pulling out single crystal silicon rods, grinding, polishing and slicing.

[0003] After the wafer completes the mother block processing, it still needs to be further cut to form micro-shaped grains, and before cutting, the wafer also needs to be pasted with film. By pasting film on the wafer, on the one hand, the wafer surface can be protected to prevent the cutting edge from directly contacting the wafer surface during cutting, thereby reducing surface scratches and other damage; secondly, it effectively reduces the generation of debris and avoids debris splashing, improving safety; in addition, the wafer film can also fix the grains to prevent uneven stress on the grains during cutting, resulting in poor cutting quality, while ensuring that the grains will not fall off or collide with each other during transportation.

[0004] The existing wafer film pasting process is usually completed on the equipment, wherein the patent CN202211362951.4 discloses a manual wafer film pasting machine, which has the ability to adsorb wafers when pasting film through the vacuum air inlet and vacuum groove.

[0005] The above-mentioned wafer automatic film pasting all-in-one machine has complex overall structure, increases equipment cost, and needs to rely on air source when fixing the wafer, which limits the use scene of the equipment, and has high requirements for the sealing performance of the air path, which needs to be maintained frequently. Once the air path sealing is not good, it is easy to cause the wafer fixing failure. SUMMARY

[0006] Therefore, it is necessary to provide a wafer processing film pasting equipment aiming at the deficiencies in the prior art.

[0007] The application discloses a wafer processing film pasting equipment which is used for wafer film pasting processing and comprises a rack, a supporting seat installed on the rack, and a positioning device installed on the rack and extending into the outer periphery of the supporting seat above. The rack comprises a first surface cover which is additionally provided with a plurality of auxiliary positioning columns. The auxiliary positioning columns are arranged in an arc shape in the horizontal direction and are tangent to the outer periphery surface of the wafer after the wafer completes position correction on the supporting seat. The positioning device comprises a guide plate, a driving assembly matched with the guide plate, a sleeve group installed on the upper end surface of the guide plate, a positioning rod group installed on the sleeve group, first and second limiting blocks arranged on the two sides of the guide plate, first and second magnetic attraction assemblies, wherein the positioning rod group comprises first, second and third positioning rods. The driving assembly drives the guide plate to be positioned so that the guide plate moves to a first position where the first limiting block is attached or a second position where the second limiting block is attached. When the guide plate moves to the first position, the first magnetic attraction assembly locks the guide plate, and the first, second and third positioning rods limit the wafer. When the guide plate moves to the second position, the second magnetic attraction assembly locks the guide plate, and the first, second and third positioning rods release the wafer.

[0008] In one of the embodiments, after the wafer is placed on the supporting seat and completes position correction, the projection of the wafer in the vertical direction coincides with the supporting seat. At this time, the positions of the front side, the rear side, the right side and the left side of the wafer periphery are respectively a first fixed position, a second fixed position, a third fixed position and a fourth fixed position. The first, second and third positioning rods are respectively moved to the first, second and third fixed positions to limit the wafer.

[0009] In one of the embodiments, the number of the auxiliary positioning columns is two. The two auxiliary positioning columns are symmetrically arranged along the connecting line between the third fixed position and the fourth fixed position.

[0010] In one of the embodiments, the first surface cover is additionally provided with two first functional grooves, two second functional grooves, a first functional hole, a second functional hole and a third functional hole. The first functional hole is located below the first fixed position, the second functional hole is located below the second fixed position, and the third functional hole is located below the third fixed position. The first, second and third positioning rods respectively pass through the first, second and third functional holes.

[0011] In one of the embodiments, the first face cover is concave in the middle to form a mounting groove for mounting the support seat, the first function groove and the second function groove are respectively arranged on the left and right sides of the mounting groove, the first function groove and the second function groove extend downward from the upper end of the first face cover, and the first function groove and the second function groove are connected with the mounting groove in the horizontal direction, the first function hole and the second function hole are arranged on the front and back sides of the function groove, and the third function hole is arranged between the two second function grooves, the first function hole, the second function hole and the third function hole are all long holes extending in the horizontal direction, and the auxiliary positioning column is vertically connected to the bottom of the second function groove.

[0012] In one of the embodiments, the driving assembly comprises a first driving rod and a driving block mounted on the first driving rod, the bottom of the guide plate is further provided with two driving strips arranged side by side, and the two driving strips are arranged in the direction of the driving assembly in the guide plate, the driving block is arranged between the two driving strips, wherein the interval between the two driving strips is L, the distance between the axis of the first driving rod and the end of the driving block is R, R < L < 2R, and in the rotating process of the driving strip, the driving block pushes one driving strip to move, and the other driving strip enters the rotating path of the driving block.

[0013] In one of the embodiments, when the driving block pushes the guide plate to move to the maximum position on both sides, the guide plate moves to the first position abutting against the first limiting block or the second position abutting against the second limiting block.

[0014] In one of the embodiments, the driving assembly further comprises a gear box, a second driving rod mounted on the input end of the gear box, and a hand wheel connected to the end of the second driving rod, the first driving rod is mounted on the output end of the gear box, the driving block is connected to the end of the first driving rod, the second driving rod is mounted on the gear box in the horizontal direction, the first driving rod is mounted on the gear box in the vertical direction, the gear box connects the first driving rod and the second driving rod, and the first driving rod and the second driving rod are linked.

[0015] In one of the embodiments, the positioning device further comprises a guide assembly, the guide plate is mounted on the guide assembly, and the guide assembly guides the guide plate.

[0016] In one of the embodiments, the first magnetic attraction assembly is composed of two groups of magnetic attraction members, the two groups of magnetic attraction members of the first magnetic attraction assembly are respectively mounted on the side close to each other of the first limiting block and the guide plate, the different groups of magnetic attraction members on the first magnetic attraction assembly are one-to-one corresponding and aligned with each other; the second magnetic attraction assembly is also composed of two groups of magnetic attraction members, the two groups of magnetic attraction members of the second magnetic attraction assembly are respectively mounted on the side close to each other of the second limiting block and the guide plate, and the different groups of magnetic attraction members on the second magnetic attraction assembly are one-to-one corresponding and aligned with each other.

[0017] The beneficial effects of the wafer processing and film laminating equipment of the present invention are: by setting a positioning device and arranging an auxiliary positioning column on the first surface cover, the positioning device includes a guide plate, a drive component, a sleeve group, a positioning rod group, a first limit block, a second limit block, a first magnetic component and a second magnetic component. When the wafer is corrected and positioned, the auxiliary positioning column limits and preliminarily corrects the wafer at one side position, and the drive component drives the guide plate to adjust the position so that the guide plate moves from the other side to the first position. During the movement of the guide plate, the positioning rod group performs a secondary correction on the wafer. When the guide plate moves to the first position, the first magnetic component locks the guide plate, and the positioning rod group limits the wafer. The present invention does not require an air source to correct and fix the wafer, eliminates the dependence of the equipment on the air source during use, effectively simplifies the internal structure, reduces the equipment cost, and increases the service life of the equipment. At the same time, it ensures the quality of the film laminating and effectively improves the processing quality of the product in subsequent processes. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a structural schematic diagram of the wafer processing film laminating equipment of the present invention;

[0019] Figure 2 for Figure 1 An exploded view of the wafer processing and laminating equipment shown;

[0020] Figure 3 is a top view of the wafer;

[0021] Figure 4 for Figure 1 The top view of the wafer processing film laminating equipment after removing the upper cover and the first cutting device;

[0022] Figure 5 for Figure 4 A top view of the positioning device and the first cover when they are installed in coordination;

[0023] Figure 6 and Figure 7 Schematic diagram of the structure of the positioning device of the wafer processing film laminating equipment of the present invention at different angles, wherein the guide plate is in the first position;

[0024] Figure 8 It is a structural schematic diagram of the positioning device of the wafer processing film mounting equipment of the present invention, wherein the guide plate is in the second position;

[0025] Figure 9 A cross-sectional view of the second cutting device of the wafer processing and film laminating equipment of the present invention;

[0026] Figure 10 This is a cross-sectional view of the first cutting device of the wafer processing and film laminating equipment of the present invention;

[0027] Figure 11Figure 1 is a structural schematic view of the upper cover and the first cutting device of the wafer processing film pasting equipment of the present application. DETAILED DESCRIPTION

[0028] In order to make the above objectives, characteristics and advantages of the present application more apparent, the specific embodiments of the present application will be described in detail below with reference to the accompanying drawings. In the following description, a large number of specific details are set forth in order to provide a thorough understanding of the present application. However, the present application can be implemented in many different ways other than the ways described herein, and those skilled in the art can make similar improvements without departing from the spirit of the present application, and therefore the present application is not limited to the specific embodiments disclosed below.

[0029] In the description of the present application, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the purpose of facilitating the description of the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation of the present application.

[0030] In addition, the terms "first" and "second" are only for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features referred to. Therefore, the features defined with "first" and "second" can explicitly or implicitly include at least one of the features. In the description of the present application, the meaning of "a plurality of" is at least two, such as two, three, etc., unless otherwise explicitly specified and limited.

[0031] In the present application, unless otherwise explicitly specified and limited, the terms "mounting", "connection", "connection", "fixing" and the like should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or it can be integrated; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the internal communication of two elements or the interaction relationship between two elements, unless otherwise explicitly limited. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0032] In the present application, unless otherwise explicitly specified and limited, a first feature is "on" or "under" a second feature can be that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, the first feature is "over", "above" and "on top of" the second feature can be that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in horizontal height than the second feature. The first feature is "under", "below" and "underneath" the second feature can be that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in horizontal height than the second feature.

[0033] It should be noted that when an element is referred to as being "fixed to" or "set to" another element, it can be directly on the other element or there can be an intermediate element. When an element is considered to be "connected" to another element, it can be directly connected to the other element or there can be an intermediate element. The terms "vertical", "horizontal", "up", "down", "left", "right" and similar expressions used herein are for illustrative purposes only and are not intended to be the only implementation.

[0034] Please refer to Figures 1 to 11 The present application provides a wafer processing film pasting equipment for processing film pasting of a semiconductor wafer 100. When processing film pasting, a wafer film is pasted on the wafer 100 and a wafer film pasting ring 200 at the same time. The wafer processing film pasting equipment comprises a rack 10, a movable cover 20 movably installed on the rack 10, a first cutting device 30 installed on the cover 20, a guide mold frame 40 installed on the rack 10 at a rear position, a support seat 50 installed on the rack 10 at a middle position, a first guide device 61 arranged on the rack 10 at both sides, a mold pressing device 70 installed on the first guide device 61 and arranged above the support seat 50, a second guide device 62 installed on the mold pressing device 70, a second cutting device 80 installed on the second guide device 62, and a positioning device 90 installed on the rack 10 and extending to the outer periphery above the support seat 50. The positioning device 90 is used for position correction and positioning of the wafer to be pasted. The guide mold frame 40 is used for installing a cylindrical wafer film. After the front end of the wafer film is pulled to the upper side of the wafer 100, the wafer film is pasted on the wafer 100 and the wafer film pasting ring 200 by the mold pressing device 70. After the cover 20 is closed, the wafer film covering part of the wafer film pasting ring 200 and the wafer 100 is cut separately by the first cutting device 30, so that the wafer film of the part is separated from the main wafer film. Then, the wafer film behind the wafer film pasting ring 200 is cut off by the second cutting device 80.

[0035] As Figures 2 to 5As shown, the rack 10 comprises two oppositely arranged support plates 11, a first cover 13 arranged at a front side position between the two support plates 11, and a second cover 14 arranged at a rear side position between the two support plates 11. The first cover 13 and the second cover 14 have a height difference. An operation space 12 is formed above the first cover 13. The die stamping device 70, the first cutting device 30, and the second cutting device 80 complete corresponding operations in the operation space 12. When the film is attached, the front end of the wafer film is pulled into the operation space 12.

[0036] The first cover 13 is concave in the middle to form a mounting groove 131. The support seat 50 is mounted on the mounting groove 131. The support seat 50 is arranged in a circular pie shape. After the wafer 100 is placed on the support seat 50 and the position is corrected, the projection of the wafer 100 in the vertical direction coincides with the support seat 50. At this time, the positions of the outermost front side, the outermost rear side, the outermost right side, and the outermost left side of the wafer 100 are the first fixed position 101, the second fixed position 102, the third fixed position 103, and the fourth fixed position 104, respectively.

[0037] The first cover 13 is concave in the middle to form a mounting groove 131. The support seat 50 is mounted on the mounting groove 131. The support seat 50 is arranged in a circular pie shape. After the wafer 100 is placed on the support seat 50 and the position is corrected, the projection of the wafer 100 in the vertical direction coincides with the support seat 50. At this time, the positions of the outermost front side, the outermost rear side, the outermost right side, and the outermost left side of the wafer 100 are the first fixed position 101, the second fixed position 102, the third fixed position 103, and the fourth fixed position 104, respectively.

[0038] In this embodiment, there are two auxiliary positioning posts 137, which are symmetrically arranged along the line connecting the third fixing position 103 and the fourth fixing position 104. The top surface height of the auxiliary positioning posts 137 is flush with the top surface height of the patch ring 200 mounted on the support base 50. In addition, the wafer processing film bonding equipment also includes a plurality of limit heads 15, which are mounted on the support base 50 and are used to limit the position of the patch ring 200, making it easier for the user to place the patch ring 200 in the correct position.

[0039] like Figure 2 、 Figures 5 to 8 As shown, the positioning device 90 includes a guide assembly 91, a guide plate 92 installed on the guide assembly 91, a driving assembly 93 cooperating with the guide plate 92, a sleeve group 94 installed on the upper end surface of the guide plate 92, a positioning rod group 95 installed on the sleeve group 94, a first limit block 96 and a second limit block 97 provided on the left and right sides of the guide plate 92, a first magnetic assembly 98 and a second magnetic assembly 99, the sleeve group 94 is composed of a plurality of sleeves 941, the positioning rod group 95 includes a first positioning rod 951, a second positioning rod 952 and a third positioning rod 953, and the driving assembly 93 drives the guide plate 92 to adjust its position so that the guide plate 92 The guide plate 92 moves to the first position where it is in contact with the first limit block 96 or the second position where it is in contact with the second limit block 97. When the guide plate 92 moves to the first position, the first magnetic assembly 98 locks the guide plate 92, and the first positioning rod 951, the second positioning rod 952 and the third positioning rod 953 move to the first fixed position 101, the second fixed position 102 and the third fixed position 103 respectively to limit the wafer 100. When the guide plate 92 moves to the second position, the second magnetic assembly 99 locks the guide plate 92, and the first positioning rod 951, the second positioning rod 952 and the third positioning rod 953 release the wafer 100.

[0040] Specifically, the guide assembly 91 includes two guide rails 911 arranged opposite to each other, and two sliders 912 respectively slidably arranged on the two guide rails 911. The guide plate 92 is installed on the two sliders 912. The first limit block 96 and the second limit block 97 are both installed on the two guide rails 911. The guide plate 92 is arranged between the first limit block 96 and the second limit block 97. The slider 912 and the guide plate 92 installed on the slider 912 can be adjusted along the guide rail 911. During the adjustment process, the guide plate 92 approaches the first limit block 96 or the second limit block 97, and at the same time drives the first positioning rod 951, the second positioning rod 952 and the third positioning rod 953 to adjust synchronously. The first positioning rod 951, the second positioning rod 952 and the third positioning rod 953 are all installed on different sleeves 941 in the vertical direction, and the distribution positions of the first positioning rod 951, the second positioning rod 952 and the third positioning rod 953 correspond to the first functional hole 134, the second functional hole 135 and the third functional hole 136.

[0041] The first magnetic assembly 98 is composed of two groups of magnetic pieces (e.g. magnets, magnetite, etc.), and the two groups of magnetic pieces of the first magnetic assembly 98 are respectively installed on the side of the first limiting block 96 and the guide plate 92 close to each other, and the different groups of magnetic pieces on the first magnetic assembly 98 correspond to each other and are aligned with each other. The second magnetic assembly 99 is also composed of two groups of magnetic pieces (e.g. magnets, magnetite, etc.), and the two groups of magnetic pieces of the second magnetic assembly 99 are respectively installed on the side of the second limiting block 97 and the guide plate 92 close to each other, and the different groups of magnetic pieces on the second magnetic assembly 99 correspond to each other and are aligned with each other.

[0042] The driving assembly 93 includes a gear box 931, a first driving rod 932 installed at the output end of the gear box 931, a second driving rod 933 installed at the input end of the gear box 931, a driving block 934 connected to the end of the first driving rod 932, a hand wheel 935 connected to the end of the second driving rod 933, and a positioning sleeve 936 sleeved on the outside of the second driving rod 933. The second driving rod 933 is installed on the gear box 931 in the horizontal direction, the first driving rod 932 is installed on the gear box 931 in the vertical direction, the gear box 931 connects the first driving rod 932 and the second driving rod 933, and the first driving rod 932 and the second driving rod 933 are linked. During the rotation of the second driving rod 933 driven by hand, the gear box 931 drives the first driving rod 932 and the driving block 934 installed on the first driving rod 932 to rotate.

[0043] In addition, one end of the driving block 934 is installed on the first driving rod 932, and the bottom of the guide plate 92 is further provided with two driving bars 921, which are distributed side by side, and the two driving bars 921 are arranged in the direction of the guide assembly 91 along the guide plate 92.

[0044] When assembled, the two guide rails 911 of the guide assembly 91 are mounted on the frame 10, the extension direction of the guide rails 911 and the adjustment direction of the guide plate 92 on the guide assembly 91 are consistent with the shapes of the first functional hole 134, the second functional hole 135 and the third functional hole 136, and the first positioning rod 951, the second positioning rod 952 and the third positioning rod 953 respectively pass through the first functional hole 134, the second functional hole 135 and the third functional hole 136. The positioning sleeve 936 is mounted on the frame 10, the second driving rod 933 passes through the positioning sleeve 936 from the inside of the frame 10 and extends to the outside of the frame 10 to be mounted in cooperation with the hand wheel 935, the driving block 934 is arranged between the two driving bars 921, the spacing between the two driving bars 921 is L, the spacing between the axis of the first driving rod 932 and the end of the driving block 934 is R, R < L < 2R, and during the 360° rotation of the driving bar 921, the two driving bars 921 alternately enter the rotation path of the driving block 934, the driving block 934 pushes one driving bar 921 to move, and the other driving bar 921 enters the rotation path of the driving block 934, and the driving bar 921 is pushed by the two driving bars 921 alternately entering the rotation path to reciprocally adjust the position of the guide plate 92. In this embodiment, when the driving block 934 pushes the guide plate 92 to move to the maximum position on both sides, the guide plate 92 moves to the first position abutting against the first limiting block 96 or the second position abutting against the second limiting block 97.

[0045] When the wafer 100 is adjusted and positioned, the wafer 100 is initially placed on the support seat 50, the auxiliary positioning column 137 is tangent to the outer circumferential surface of the wafer 100, the arc-shaped auxiliary positioning column 137 can preliminarily adjust the wafer 100, so that the wafer 100 is completely or basically placed in the correct position, the hand wheel 935 is rotated, the driving block 934 on the driving assembly 93 pushes the guide plate 92 to move to the first position, the upper ends of the first positioning rod 951, the second positioning rod 952 and the third positioning rod 953 respectively move to the first fixed position 101, the second fixed position 102 and the third fixed position 103 to limit the wafer 100, the first fixed position 101, the second fixed position 102 and the third fixed position 103 further adjust the wafer 100 in different directions during the movement, the first magnetic attraction assembly 98 locks the guide plate 92 to prevent the first positioning rod 951, the second positioning rod 952 and the third positioning rod 953 from moving, after the wafer 100 is adjusted and positioned, the patch ring 200 is mounted, at this time, the wafer 100 can be subjected to the film pasting treatment. Conversely, when the wafer 100 needs to be taken out after the film pasting is completed, the hand wheel 935 is rotated, the driving block 934 on the driving assembly 93 pushes the guide plate 92 to move to the second position, the first positioning rod 951, the second positioning rod 952 and the third positioning rod 953 are separated from the wafer 100, and the second magnetic attraction assembly 99 locks the guide plate 92.

[0046] As Figure 2、 Figure 4 As shown, there are two groups of first guide devices 61, and the two groups of first guide devices 61 are respectively installed on the two support plates 11. The die device 70 includes two mounting seats 71 and a pressure roller 72 installed on the two mounting seats 71. The two mounting seats 71 of the die device 70 are installed on the two first guide devices 61.

[0047] The second guide device 62 is installed on two mounting seats 71, wherein the first guide device 61 and the second guide device 62 both adopt a structure similar to that of a guide rail and a slider. The main difference is that the first guide device 61 guides the die device 70 in the front-to-back direction, and the second guide device 62 guides the second cutting device 80 in the left-to-right direction.

[0048] like Figure 9 As shown, the second cutting device 80 includes a second knife seat 81, a second pressing head 82 movably mounted vertically on the second knife seat 81 and arranged in a T-shape, a second cutter 83 mounted on the second pressing head 82, and a second spring 84 elastically supporting the second knife seat 81 and the second pressing head 82. When the second pressing head 82 is pressed downward, the second cutter 83 extends further from the second knife seat 81 to cut the wafer film, and the second spring 84 contracts. When the second pressing head 82 is released, the second spring 84 elastically returns to its original position, and the second cutter 83 is stored in the second knife seat 81, preventing interference when the die pressing device 70 attaches the wafer film to the wafer 100.

[0049] like Figure 2 、 Figure 10 、 Figure 11 As shown, the upper cover 20 includes a main body 21, a limiting member 23 installed at the bottom of the main body 21, and a guide plate 82 installed on the limiting member 23. The main body 21 is provided with a guide hole 211. There are multiple limiting members 23. The limiting members 23 are arranged around the outer periphery of the guide hole 211. The limiting member 23 is provided with an arc-shaped groove 231. The edge of the guide plate 82 is stuck in the arc-shaped groove 231. The guide plate 82 is coaxial with the guide hole 211, and the guide plate 82 can rotate around its axis.

[0050] The first cutting device 30 includes a housing 35, a first blade holder 31 secured to the housing 35, a first pressing head 32 vertically movably mounted on the first blade holder 31 and arranged in a T-shape, a first cutter 33 mounted on the first pressing head 32, and a first spring 34 elastically supporting the first blade holder 31 and the first pressing head 32. During cutting, the upper cover 20 is closed and the first pressing head 32 is pressed downward, causing the first spring 34 to contract and further adjust the first cutter 33 downward. This downward pressure on the first pressing head 32 causes the first cutting device 30 to rotate in a circumferential direction to cut the wafer film, while the guide plate 82 rotates synchronously. When the first pressing head 32 is released, the first spring 34 elastically returns to its original position, causing the first cutter 33 to move upward.

[0051] The wafer processing film pasting equipment has the advantages that: the positioning device 90 is arranged, the auxiliary positioning column 137 is arranged on the first cover 13, the positioning device 90 comprises a guide plate 92, a driving assembly 93, a sleeve group 94, a positioning rod group 95, a first limiting block 96, a second limiting block 97, a first magnetic attraction assembly 98 and a second magnetic attraction assembly 99, when the position of the wafer is corrected and positioned, the auxiliary positioning column 137 limits and preliminarily corrects the position of the wafer 100 on one side, the driving assembly 93 drives the guide plate 92 to adjust the position, so that the guide plate 92 moves to the first position from the other side, the positioning rod group 95 corrects the wafer 100 again during the movement of the guide plate 92, the first magnetic attraction assembly 98 locks the guide plate 92 when the guide plate 92 moves to the first position, and the positioning rod group 95 limits the wafer 100, the wafer can be corrected and fixed without using the air source, the dependence on the air source during the use of the equipment is eliminated, the internal structure is effectively simplified, the equipment cost is reduced, the service life of the equipment is prolonged, the film pasting quality is ensured, and the processing quality of the product in the subsequent process is effectively improved.

[0052] The technical features of the above-described embodiments can be combined in any manner, and to make the description concise, all possible combinations of the technical features in the above-described embodiments are not described, however, as long as the combinations of the technical features do not exist contradictions, they should be considered as the scope of the present application.

[0053] The above-described embodiments only express several implementation manners of the present application, the description is relatively specific and detailed, but it should not be understood as the limitation of the patent scope of the present application. It should be pointed out that, for ordinary skilled in the art, without departing from the concept of the present application, a number of modifications and improvements can be made, which all belong to the protection scope of the present application. Therefore, the patent protection scope of the present application should be subject to the appended claims.

Claims

1. A wafer processing film laminating device, used for laminating semiconductor wafers, characterized in that: The utility model provides a kind of wafer positioner, including rack, support seat installed on rack, positioning device installed on rack and extend into the periphery above support seat, the rack includes first face cover, the first face cover is additionally provided with several auxiliary positioning columns, auxiliary positioning column is tangential with the outer peripheral surface of wafer after position deviation is completed on support seat between arc distribution in horizontal plane direction;The positioning device includes guide plate, drive assembly matched with guide plate, sleeve group installed on the end surface of guide plate, positioning rod group installed on sleeve group, first limit block and second limit block being located at the both sides of guide plate, first magnetic attraction assembly and second magnetic attraction assembly, positioning rod group includes first positioning rod, second positioning rod and third positioning rod, the drive assembly drives guide plate to adjust position, so that guide plate moves to the first position that is attached with first limit block or the second position that is attached with second limit block, when guide plate moves to the first position, first magnetic attraction assembly locks guide plate, and first positioning rod, second positioning rod and third positioning rod limit wafer, when guide plate moves to the second position, second magnetic attraction assembly locks guide plate, and first positioning rod, second positioning rod and third positioning rod release wafer; The drive assembly includes first drive rod and drive block installed on first drive rod, the bottom of guide plate is additionally provided with two drive strips, two drive strips are distributed side by side, and two drive strips are arranged along the guide plate in the adjusting position direction of guide assembly, and the drive block is arranged between two drive strips, wherein the interval between two drive strips is L, the distance between the axis of first drive rod and the end of drive block is R, wherein R < L < 2R, in the rotating process of drive strip, drive block pushes one drive strip to shift, and the other drive strip enters the rotating path of drive block.

2. The wafer processing film attaching apparatus according to claim 1, wherein After wafer is placed on support seat and completes position deviation, the projection of wafer in vertical direction coincides with support seat, at this time, the positions of the most front side, the last side, the most right side and the most left side of wafer periphery are first fixed position, second fixed position, third fixed position and fourth fixed position respectively, and the first positioning rod, the second positioning rod and the third positioning rod are moved to the first fixed position, the second fixed position and the third fixed position respectively to limit wafer.

3. The wafer processing film attaching apparatus according to claim 2, wherein The number of auxiliary positioning columns is two, and two auxiliary positioning columns are symmetrically arranged along the line between third fixed position and fourth fixed position.

4. The wafer processing film attaching apparatus according to claim 2, wherein The first face cover is additionally provided with two first functional grooves, two second functional grooves, a first functional hole, a second functional hole and a third functional hole, the first functional hole is located below the first fixed position, the second functional hole is located below the second fixed position, the third functional hole is located below the third fixed position, and the first positioning rod, the second positioning rod and the third positioning rod pass through the first functional hole, the second functional hole and the third functional hole respectively.

5. The wafer processing film attaching apparatus according to claim 4, wherein The first face cover is concave in the middle to form a mounting groove for mounting the support seat, the first function groove and the second function groove are respectively arranged on the left and right sides of the mounting groove, the first function groove and the second function groove extend downward from the upper end of the first face cover, and the first function groove and the second function groove are connected with the mounting groove in the horizontal direction, the first function hole and the second function hole are arranged on the front and back sides of the function grooves, the third function hole is arranged between the two second function grooves, the first function hole, the second function hole and the third function hole are all long holes extending in the horizontal direction, and the auxiliary positioning column is connected with the bottom of the second function groove in the vertical direction.

6. The wafer processing film attaching apparatus according to claim 1, wherein When the driving block pushes the guide plate to move to the maximum position on both sides, the guide plate moves to the first position abutting against the first limiting block or the second position abutting against the second limiting block.

7. The wafer processing film attaching apparatus according to claim 1, wherein The driving assembly further comprises a gear box, a second driving rod installed on the input end of the gear box, a hand wheel connected with the end of the second driving rod, the first driving rod is installed on the output end of the gear box, the driving block is connected with the end of the first driving rod, the second driving rod is installed on the gear box in the horizontal direction, the first driving rod is installed on the gear box in the vertical direction, the gear box connects the first driving rod and the second driving rod, and linkage of the first driving rod and the second driving rod is realized.

8. The wafer processing and film laminating equipment according to claim 1, characterized in that: The positioning device further comprises a guide assembly, the guide plate is installed on the guide assembly, and the guide assembly guides the guide plate.

9. The wafer processing film attaching apparatus according to claim 1, wherein The first magnetic attraction assembly is composed of two groups of magnetic attraction members, the two groups of magnetic attraction members of the first magnetic attraction assembly are respectively installed on the side close to each other of the first limiting block and the guide plate, the different groups of magnetic attraction members on the first magnetic attraction assembly are one-to-one corresponding and aligned with each other, the second magnetic attraction assembly is also composed of two groups of magnetic attraction members, the two groups of magnetic attraction members of the second magnetic attraction assembly are respectively installed on the side close to each other of the second limiting block and the guide plate, and the different groups of magnetic attraction members on the second magnetic attraction assembly are one-to-one corresponding and aligned with each other.

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