A liquid cooling plate assembly with both active and passive heat dissipation for high heat flux chips

Abstract

The application discloses a liquid cooling plate assembly with active and passive heat dissipation for high heat flux density chips. The application firstly connects the high heat flux density chip with the boss through spring screws, and fills the boss with heat-conducting silicone grease between the boss and the high heat flux density chip; the boss is embedded with a flexible heat pipe, the flexible heat pipe is interconnected with the embedded liquid cooling plate; the boss is connected with the liquid cooling plate through a heat-conducting pad; heat is conducted from the high heat flux density chip to the boss through the heat-conducting silicone grease, the boss is conducted to the liquid cooling plate through the flexible heat pipe, the liquid cooling plate is conducted to the heat exchanger or the heat sink through the internal low-temperature working medium and the VC uniform temperature plate, and the flexible low-thermal-resistance high-heat-conducting mechanical connection of the high heat flux density chip and the liquid cooling plate is realized. Therefore, the application can solve the impact and vibration damage of the boss on the high heat flux density chip in the mechanical environment, especially the mechanical environment faced by the star-borne computing device in the rocket ignition carrying process.

Description

Technical Field

[0001] This invention relates to the field of high heat flux density chip technology, and in particular to a liquid cooling plate assembly for high heat flux density chips that combines active and passive heat dissipation. Background Technology

[0002] In the field of high heat flux density chip technology, if the large amount of heat generated by high heat flux density chips during operation cannot be dissipated in time, it will cause problems such as chip performance degradation, shortened lifespan, or even failure.

[0003] Existing cold plate heat dissipation methods cannot solve the near-zero gap rigid connection between bosses and high heat flux density chips under mechanical conditions. A thermal pad thicker than 0.5mm must be used to fill the gap for mechanical vibration and impact resistance, achieving heat conduction while preventing damage to the high heat flux density chip from vibration and impact. However, the thermal resistance of a thermal pad thicker than 0.5mm is much greater than the thermal resistance of a rigid connection filled with near-zero gap thermal grease. This results in ineffective heat dissipation, leading to the technical problem of chip overheating. Summary of the Invention

[0004] To address the shortcomings of existing technologies, this invention provides a liquid cooling plate assembly that combines active and passive heat dissipation for high heat flux density chips. This liquid cooling plate assembly enables a flexible, low thermal resistance, and high thermal conductivity mechanical connection between the high heat flux density chip and the liquid cooling plate, and solves the problems of impact and vibration damage to the high heat flux density chip and chip overheating caused by the boss under mechanical conditions.

[0005] This invention is achieved through the following technical solution:

[0006] A liquid cooling plate assembly for high heat flux density chips, combining active and passive heat dissipation, includes: a liquid cooling plate, a boss, a thermal pad, thermal grease, a PCB with a high heat flux density chip, a flexible heat pipe, and spring screws; the high heat flux density chip and the boss are connected by spring screws, and thermal grease is filled between the boss and the high heat flux density chip; the flexible heat pipe is embedded in the boss, and the flexible heat pipe is internally interconnected with the liquid cooling plate; the boss and the liquid cooling plate are thermally connected through the thermal pad.

[0007] Specifically, the liquid cooling plate includes a liquid cooling plate working fluid inlet, a liquid cooling plate working fluid outlet, a liquid cooling channel, a vapor chamber (VC), an integrated boss of the liquid cooling plate, PCB mounting stud holes, a liquid cooling plate heat sink mounting surface, a liquid cooling plate heat sink mounting hole, a liquid cooling plate stacking through-hole, and a liquid cooling plate flexible heat pipe fitting area. When heat is conducted from the high heat flux density chip to the boss, the boss conducts the heat to the liquid cooling plate through the flexible heat pipe and thermal pad. The liquid cooling plate first achieves uniform temperature diffusion of the high heat flux density chip through the VC vapor chamber, and then achieves heat export through the low temperature liquid cooling working fluid in the liquid cooling channel. At the same time, heat export can also be achieved by installing a heat-conducting surface.

[0008] Specifically, the liquid cooling plate is provided with stacking pin holes at the four corners to enable multi-module stacking of the liquid cooling plate.

[0009] Furthermore, the protrusion has a flexible heat pipe fitting area inside for embedding a flexible heat pipe.

[0010] Furthermore, the flexible heat pipe includes a flexible heat pipe boss fitting section, a flexible heat pipe liquid cooling plate boss connecting section, and a flexible heat pipe liquid cooling plate fitting section; the flexible heat pipe liquid cooling plate boss connecting section is used to achieve a highly efficient heat-conducting flexible connection between the boss and the liquid cooling plate.

[0011] Specifically, the spring screw is used for the rigid connection between the boss and the high heat flux density chip; that is, it is used to achieve rigid contact and clamping between the high heat flux density chip and the boss.

[0012] Specifically, the thermal pad needs to be a flexible thermal pad that is compressible and has adhesive properties.

[0013] Specifically, the pump is used to provide a power source for the flow of cryogenic liquid cooling working fluid to the entire liquid cooling plate. The cryogenic liquid cooling working fluid enters the liquid cooling plate from the working fluid inlet through the liquid cooling pipe, flows out from the working fluid outlet through the liquid cooling channel, and flows to the heat exchanger through the liquid cooling channel to achieve heat exchange, thus realizing both active liquid cooling heat dissipation and passive VC heat dissipation functions.

[0014] Furthermore, a threshold signal can be set by monitoring the temperature of the high heat flux density chip. If the threshold is exceeded, a start / stop signal is fed back to the switch to start the pump. This enables automatic start / stop of active liquid cooling. When the temperature does not exceed the threshold, passive cooling is achieved by the liquid cooling plate vapor chamber VC. When the temperature exceeds the threshold, the pump is automatically started to achieve simultaneous active and passive cooling.

[0015] Specifically, the pump does not start when the temperature equals the threshold, and passive heat dissipation is achieved by the liquid cooling plate.

[0016] The beneficial effects of this invention are as follows: Existing cold plate heat dissipation cannot solve the near-zero gap rigid connection between the boss and the high heat flux density chip under mechanical conditions. It is necessary to fill the gap with a thermal pad with a thickness of 0.3-0.5mm or more to achieve heat conduction while avoiding mechanical damage to the high heat flux density chip structure. However, the thermal resistance of a thermal pad with a thickness of 0.3-0.5mm or more is much greater than the thermal resistance of a rigid connection filled with near-zero gap thermal grease, resulting in inefficient heat dissipation. This invention, through a flexible heat pipe and a separate boss design, can achieve a flexible mechanical connection between the liquid cooling plate and the high heat flux density chip, solving the problem of mechanical damage to the high heat flux density chip by the boss under mechanical conditions, and achieving efficient heat conduction. It has excellent application prospects in spaceborne high heat flux density equipment. Attached Figure Description

[0017] Figure 1 This is an integrated assembly diagram of a liquid cooling plate assembly with active and passive heat dissipation functions for a high heat flux density chip and a PCB with a high heat flux density chip, according to the present invention.

[0018] Figure 2 This is an exploded view of a liquid cooling plate assembly with both active and passive heat dissipation functions for a high heat flux density chip, and a PCB with a high heat flux density chip, according to the present invention.

[0019] Figure 3 This is a design feature diagram of the liquid cooling plate of the present invention;

[0020] Figure 4 This is a diagram of the active heat dissipation start-stop control scheme based on high heat flux density chip temperature monitoring according to the present invention;

[0021] Figure 5 This is a feature diagram of the boss in this invention;

[0022] Figure 6 This is a feature diagram of the flexible heat pipe of the present invention.

[0023] Figure reference numerals: 1-1 Liquid cooling plate, 1-2 Thermal pad, 1-3 Boss, 1-4 Thermal grease, 1-5 PCB with high heat flux density chip, 1-5-1 High heat flux density chip, 1-6 Spring screw, 1-7 Flexible heat pipe, 1-1-1 Liquid cooling plate working fluid inlet, 1-1-2 Liquid cooling plate working fluid outlet, 1-1-3 Liquid cooling channel, 1-1-4 Vaporizer (VC), 1-1-5 Integrated boss of liquid cooling plate, 1-1-6 PCB mounting stud hole, 1-1-7 Liquid cooling plate heat sink mounting surface, 1-1-8 Liquid cooling plate heat sink mounting hole, 1-1-9 Liquid cooling plate stacking pin Hole, 1-1-10 Liquid cooling plate flexible heat pipe interlocking area, 3-1 Switch, 3-2 Liquid cooling pipe, 3-3 Start / stop signal feedback, 1-1-1 Liquid cooling plate working fluid inlet, 1-1-2 Liquid cooling plate working fluid outlet, 3-4 Heat exchanger, 3-5 Mounting surface heat sink, 3-6 Pump, 3-7 Temperature monitoring, 1-3-1 Boss connecting PCB threaded hole, 1-3-2 High heat flux density chip heat conduction surface, 1-3-3 Boss flexible heat pipe interlocking area, 1-7-1 Flexible heat pipe boss interlocking section, 1-7-2 Flexible heat pipe liquid cooling plate boss connection section, 1-7-3 Flexible heat pipe liquid cooling plate interlocking section. Detailed Implementation

[0024] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this application.

[0025] Reference Appendix Figure 2A liquid cooling plate assembly that combines active and passive heat dissipation functions for a high heat flux density chip is provided. The liquid cooling plate assembly 1 specifically includes: a liquid cooling plate 1-1, a thermal pad 1-2, a boss 1-3, thermal grease 1-4, a PCB with a high heat flux density chip 1-5, a high heat flux density chip 1-5-1, a spring screw 1-6, and a flexible heat pipe 1-7.

[0026] The liquid cooling plate assembly with active and passive heat dissipation functions for the high heat flux density chip is shown in the attached figure. Figure 1 and Figure 6 As shown, the high heat flux density chip 1-5-1 is connected to the boss connection PCB threaded hole 1-3-1 on the boss 1-3 via spring screw 1-6, and thermally conductive silicone grease 1-4 is filled between the high heat flux density chip 1-5-1 and the boss 1-3. The boss flexible heat pipe fitting area 1-3-3 inside the boss 1-3 is fitted with the flexible heat pipe 1-7. The liquid cooling plate flexible heat pipe fitting area 1-1-10 inside the liquid cooling plate 1-1 is fitted with the flexible heat pipe liquid cooling plate fitting section 1-7-3. The boss 1-3 and the liquid cooling plate 1-1 achieve a highly efficient thermally conductive flexible connection through the flexible heat pipe liquid cooling plate boss connection section 1-7-2. The PCB1-5 with the high heat flux density chip is connected to the liquid cooling plate 1-1 through the PCB mounting stud hole 1-1-6. The gap between the boss 1-3 and the liquid cooling plate 1-1 is filled with a thermal pad 1-2. The thermal pad 1-2 must be a flexible thermal pad with a certain amount of compression and adhesion.

[0027] Appendix Figure 3 The design feature diagram of the liquid cooling plate shown includes a liquid cooling plate working fluid inlet 1-1-1, a liquid cooling plate working fluid outlet 1-1-2, a liquid cooling channel 1-1-3, a vapor chamber VC1-1-4, an integrated liquid cooling plate boss 1-1-5, PCB mounting stud holes 1-1-6, a liquid cooling plate heat sink mounting surface 1-1-7, a liquid cooling plate heat sink mounting hole 1-1-8, a liquid cooling plate stacking through-hole 1-1-9, and a liquid cooling plate flexible heat pipe mating area 1-1-10. When heat is conducted from the high heat flux density chip 1-5-1 to the boss 1-3, the boss 1-3 conducts the heat to the liquid cooling plate 1-1 through the flexible heat pipe 1-7 and the thermal pad 1-2. The liquid cooling plate 1-1 first achieves efficient planar temperature uniformity through the vapor chamber VC1-1-4, while simultaneously transferring heat through the liquid cooling plate heat sink mounting surface 1-1-7 to the mounting surface heat sink 3-5, achieving passive heat dissipation. At the same time, the coolant enters the liquid cooling channel 1-1-3 from the liquid cooling plate working fluid inlet 1-1-1 and flows out from the liquid cooling plate working fluid outlet 1-1-2, carrying away heat through the low-temperature liquid cooling working fluid to achieve synchronous active heat dissipation.

[0028] like Figure 4The diagram illustrates an active cooling start-stop control scheme based on high heat flux density chip temperature monitoring. Pump 3-6 provides the power source for the flow of cryogenic liquid cooling medium to the entire liquid cooling plate 1-1. The cryogenic liquid cooling medium enters the liquid cooling plate 1-1 through the liquid cooling pipe 3-2 from the liquid cooling inlet 1-1-1, flows out through the liquid cooling channel 1-1-3 from the liquid cooling outlet 1-1-2, and then flows through the liquid cooling channel 1-1-3 to the heat exchanger 3-4 for heat exchange, thus achieving active liquid cooling. A threshold signal can be set using the high heat flux density chip 1-5-1 and temperature monitoring 3-7. If the threshold is exceeded, a start-stop signal is fed back to switch 3-1 via start-stop signal 3-3, activating pump 3-6. This scheme enables automatic start-stop of active liquid cooling. When the temperature does not exceed the threshold, passive cooling is mainly achieved by the liquid cooling plate 1-1 and the heat spreader VC1-1-4. When the temperature exceeds the threshold, pump 3-6 is automatically started to achieve simultaneous active and passive heat dissipation. When the temperature equals the threshold, pump 3-6 is not started, and passive heat dissipation is achieved by liquid cooling plate 1-1.

[0029] Other embodiments of this application will readily occur to those skilled in the art upon consideration of the specification and practice of the disclosure herein. This application is intended to cover any variations, uses, or adaptations of this application that follow the general principles of this application and include common knowledge or customary techniques in the art not disclosed herein.

[0030] It should be understood that this application is not limited to the precise structure described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope.

Claims

1. A liquid-cooled plate assembly for high heat flux density chips, characterized in that, include: The system comprises a liquid cooling plate, a boss, a thermal pad, thermal grease, a PCB with a high heat flux density chip, a flexible heat pipe, and spring screws. The high heat flux density chip is connected to the boss via spring screws, and thermal grease is filled between the boss and the high heat flux density chip. A flexible heat pipe is embedded within the boss, and the flexible heat pipe is internally interconnected with the liquid cooling plate. The boss and the liquid cooling plate are thermally connected via a thermal pad. The liquid cooling plate includes a liquid cooling working fluid inlet, a liquid cooling working fluid outlet, a liquid cooling channel, a vapor chamber (VC), and the liquid cooling plate itself. The components include a raised boss, PCB mounting stud holes, liquid cooling plate heat sink mounting surface, liquid cooling plate heat sink mounting holes, liquid cooling plate stacking through-holes, and a liquid cooling plate flexible heat pipe fitting area. When heat is conducted from the high heat flux density chip to the raised boss, the raised boss conducts the heat to the liquid cooling plate through flexible heat pipes and thermal pads. The liquid cooling plate first achieves uniform temperature diffusion of the high heat flux density chip through the VC temperature distribution cavity, and then achieves heat export through the low-temperature liquid cooling medium in the liquid cooling channel. At the same time, heat export can also be achieved by installing a heat-conducting surface.

2. The liquid cooling plate assembly for high heat flux density chips with both active and passive heat dissipation as described in claim 1, characterized in that, The liquid cooling plate has stacking pin holes at its four corners to enable multi-module stacking of the liquid cooling plate.

3. The liquid cooling plate assembly for high heat flux density chips with both active and passive heat dissipation as described in claim 1, characterized in that, The protrusion has a flexible heat pipe fitting area inside, which is used to embed a flexible heat pipe.

4. The liquid cooling plate assembly for high heat flux density chips with both active and passive heat dissipation as described in claim 1, characterized in that, The flexible heat pipe includes a flexible heat pipe boss fitting section, a flexible heat pipe liquid cooling plate boss connection section, and a flexible heat pipe liquid cooling plate fitting section; the flexible heat pipe liquid cooling plate boss connection section is used to achieve a highly efficient heat-conducting flexible connection between the boss and the liquid cooling plate.

5. A liquid cooling plate assembly for high heat flux density chips with both active and passive heat dissipation as described in claim 1, characterized in that, The spring screw is used for the rigid connection between the boss and the high heat flux density chip; that is, it is used to achieve rigid contact and clamping between the high heat flux density chip and the boss.

6. The liquid cooling plate assembly for high heat flux density chips with both active and passive heat dissipation according to claim 1, characterized in that, The thermal pad must be a flexible thermal pad that is compressible and has adhesive properties.

7. A liquid cooling plate assembly for high heat flux density chips with both active and passive heat dissipation as described in claim 1, characterized in that, It can set a threshold signal through high heat flux density chip temperature monitoring. If the threshold is exceeded, the start / stop signal is fed back to the switch to start the pump. This enables automatic start and stop of active liquid cooling. When the temperature does not exceed the threshold, passive heat dissipation is achieved by the liquid cooling plate and the vapor chamber VC. When the temperature exceeds the threshold, the pump is automatically started to achieve simultaneous active and passive heat dissipation.

8. A liquid cooling plate assembly for high heat flux density chips, combining active and passive heat dissipation, as described in claim 7, characterized in that... The pump is used to provide a power source for the flow of cryogenic liquid cooling working fluid to the entire liquid cooling plate. The cryogenic liquid cooling working fluid enters the liquid cooling plate from the working fluid inlet through the liquid cooling pipe, flows out from the working fluid outlet through the liquid cooling channel, and flows to the heat exchanger through the liquid cooling channel to achieve heat exchange, thus realizing both active liquid cooling heat dissipation and passive VC heat dissipation functions.

9. A liquid cooling plate assembly for high heat flux density chips with both active and passive heat dissipation as described in claim 8, characterized in that, When the temperature equals the threshold, the pump does not start, and passive heat dissipation is achieved by the liquid cooling plate.

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