Multi-chip MOS integrated packaging structure

Abstract

The invention discloses a multi-chip MOS (Metal Oxide Semiconductor) integrated packaging structure, which belongs to the technical field of chip packaging and comprises a box body, a packaging cavity is formed in the left side of the box body, a loader is movably connected to the inner side of the packaging cavity, a PCB (Printed Circuit Board) is mounted in an assembling groove of the loader, a plurality of groups of chips are mounted on the PCB, an access component is mounted on the loader, and the access component is connected with the packaging cavity. According to the multi-chip MOS integrated packaging structure, the first heat dissipation fins and the second heat dissipation fins are arranged and can be tightly attached to the PCB through work of the fixing assembly, and therefore heat dissipated when the PCB and the chips work can be absorbed; the first heat dissipation fins and the second heat dissipation fins absorb heat, meanwhile, when the draught fan works, the absorbed heat can be discharged out of the box body through communication between the first ventilation grooves and the second ventilation grooves, the first heat dissipation fins and the second heat dissipation fins can conveniently form a complete heat dissipation channel for the upper portion and the lower portion of the PCB, the heat dissipation effect of the PCB and the chip is improved, and the heat dissipation cost is reduced.

Description

Technical Field

[0001] The present invention relates to the technical field of chip packaging, and particularly to a multi-chip MOS integrated packaging structure. Background Art

[0002] A chip packaging structure is a casing for installing semiconductor integrated circuit chips, which plays the roles of placing, fixing, sealing, protecting the chips and enhancing the electrothermal performance. Moreover, it is also a bridge connecting the internal world of the chip and the external circuit - the contacts on the chip are connected to the pins of the packaging casing by wires, and these pins are further connected to other devices through the wires on the printed circuit board.

[0003] The existing patent CN117457601A discloses a multi-chip MOS integrated packaging structure and its packaging method, which relates to the technical field of chip packaging. It includes a casing and a PCB board. A placement board is arranged inside the casing, and the PCB board is placed on the surface of the placement board. Several MOS chips are installed on the surface of the PCB board. It also includes a cooling unit installed at the bottom of the casing. The present invention optimizes the cooling unit in the existing integrated packaging structure. While meeting the requirement of cooling the bottom of the casing, in cooperation with the cooling unit on the closing plate, it can inhale the low-temperature gas at the bottom and discharge the low-temperature gas from top to bottom, so that the low-temperature gas directly impacts the PCB board and the MOS chips, resulting in a larger and more uniform cooling range. At the same time, the flow guiding component in the cooling unit is used to narrow the air outlet of the air flow, so that the air flow can be specifically blown from top to bottom towards the MOS chip area, avoiding some areas not being cooled. While achieving targeted cooling, it can also increase the blowing speed of the low-temperature air flow and improve the cooling effect. In this patent, low-temperature gas is generated by the cooling unit, and then the low-temperature gas is blown to the upper part of the PCB board and the MOS chips by a fan for cooling. However, the production cost of this packaging structure is relatively high, and the later maintenance is relatively complex. Moreover, when the PCB board and the MOS chips are working, heat will not only appear on the upper part, but also on the back of the PCB board, which is not convenient for heat dissipation on the back of the PCB board. Summary of the Invention

[0004] The purpose of the present invention is to provide a multi-chip MOS integrated packaging structure to solve the problem of the limited applicable range of the current multi-chip MOS integrated packaging structure proposed in the above background art.

[0005] To achieve the above invention purpose, the present invention adopts the following technical solutions: A multi-chip MOS integrated packaging structure provided by the present invention includes a box body. A packaging cavity is opened on the left side of the box body. A carrier is movably connected inside the packaging cavity. A PCB board is installed inside the assembly groove of the carrier. A number of groups of chips are installed on the PCB board. An access component is installed on the carrier. The access component can access the PCB board and the chips. A fixing component is installed on the box body. The fixing component can fix the PCB board and the chips inside the packaging cavity. A heat dissipation component is installed on the fixing component. The heat dissipation component can dissipate heat from the PCB board and the chips in the working state. The access component further includes a tooth groove one opened on the back of the carrier, and a gear one rotatably connected in the assembly groove of the box body. The gear one can drive the carrier to move in the packaging cavity through the meshing cooperation with the tooth groove one when rotating, so as to achieve the function of accessing the PCB board and the chips. The fixing component further includes a storage groove one opened at the top and bottom of the packaging cavity, a closing frame movably installed in the storage groove one at the top of the packaging cavity, and a push plate movably installed in the storage groove one at the bottom of the packaging cavity. When the carrier enters the inside of the packaging cavity, the closing frame and the push plate move towards each other through the cooperation of relevant parts to squeeze and fix the PCB board and the chips. The heat dissipation component further includes a ventilation hood movably installed inside the box body, and a fan fixedly installed inside the ventilation hood cavity. A heat dissipation fin one is fixedly installed on the closing frame, and a heat dissipation fin two is fixedly installed on the push plate. The heat dissipation fin one and the heat dissipation fin two can absorb the heat dissipated by the PCB board and the chips during operation, and the fan can discharge the heat absorbed by the heat dissipation fin one and the heat dissipation fin two out of the box body.

[0006] Preferably, track grooves are opened on the front side and the rear side inside the packaging cavity. Slide rails are movably connected inside the track grooves. The two slide rails are respectively fixed on the front side and the rear side of the carrier. Two moving grooves one are opened at the bottom of the carrier close to the slide rails. Two extrusion columns are movably connected inside the two moving grooves one. The end parts of the two extrusion columns are respectively fixedly connected to the front side and the rear side inside the packaging cavity.

[0007] Preferably, two activity grooves are opened at the top of the carrier close to the slide rails. Two extrusion grooves one are penetrated and opened at the ends of the two activity grooves close to the moving grooves one. A pull rod is movably connected inside the activity grooves. One end of the pull rod is fixedly connected with a triangular top block. An extrusion plate is fixedly connected to the end of the pull rod close to the extrusion groove one. A slide rod is movably connected to the surface of the extrusion plate through an assembly hole.

[0008] Preferably, both ends of the sliding rod are fixedly connected inside the first extrusion groove. A first spring is sleeved on the outer surface of the sliding rod. Two ends of the first spring are respectively fixedly connected to the surface of the extrusion plate and the inner wall of the first extrusion groove. The surface of the first gear penetrates through the assembly groove to rotatably connect to the end of the first rotating shaft. The outer surface of the first rotating shaft penetrates through and is rotatably installed in the assembly groove on the surface of the box body. The top of the first rotating shaft is fixedly installed with a folding handle.

[0009] Preferably, a sliding groove is formed on the right side inside the encapsulation cavity. A slider is movably connected inside the sliding groove. An extrusion groove two is formed through the surface of the slider. Two sides of the front and back of the extrusion groove two are both movably connected with clamping blocks. A second spring is fixedly connected between the two clamping blocks. A slot matching the slider is formed on the right side of the carrier. A clamping groove matching the clamping block is formed inside the slot.

[0010] Preferably, a through groove is formed through the top of the slider. A tooth groove two is formed inside the through groove. The inside of the box body is rotatably connected with a second rotating shaft through an assembly groove. The outer surface of the second rotating shaft passes through the sliding groove and the through groove. Two ends of the second rotating shaft are respectively rotatably connected to the first storage groove at the top of the encapsulation cavity and the first storage groove at the bottom of the encapsulation cavity. A second gear matching the tooth groove two is fixedly connected to the outer peripheral surface of the second rotating shaft close to the through groove.

[0011] Preferably, an internally threaded sleeve is rotatably connected inside the first storage groove through a bearing. A threaded rod is rotatably connected inside the internally threaded sleeve. Threaded rods are fixedly connected to the top of the sealing frame and the bottom of the push plate. Pulley wheels are fixedly connected to the outer peripheral surfaces of the internally threaded sleeve and the second rotating shaft. A belt is connected between the pulley wheels.

[0012] Preferably, three groups of second storage grooves are formed through the right side inside the encapsulation cavity. Ventilation covers are movably connected inside the three groups of second storage grooves. The three groups of second storage grooves are connected through two moving grooves two. The surfaces of the three ventilation covers close to the moving grooves two are connected through two connecting rods. A rotating groove is formed inside the second storage groove close to the second rotating shaft. A third gear is fixedly connected to the outer peripheral surface of the second rotating shaft close to the rotating groove. A fourth gear matching the third gear is rotatably connected inside the rotating groove.

[0013] Preferably, a tooth groove three matching the fourth gear is formed on the side surface of the ventilation cover. A number of first heat dissipation fins are fixedly connected inside the sealing frame. A first ventilation groove is formed inside the sealing frame close to the first heat dissipation fins. Air inlet holes are formed through the bottom of the first ventilation groove. Three docking grooves are formed on the side surface of the sealing frame close to the ventilation cover.

[0014] Preferably, a through hole is formed through the surface of the carrier close to the first moving groove, a second ventilation groove is formed on the right side of the push plate, a second heat dissipation fin is fixedly installed through the assembly hole inside the second ventilation groove, an air outlet hole is formed through the top of the second ventilation groove close to the through hole, an air inlet is formed through the inner side of the encapsulation cavity close to the second ventilation groove, and a filter screen is fixedly installed inside the air inlet.

[0015] Compared with the prior art, the above one or more technical solutions have the following beneficial effects: 1. The first heat dissipation fin and the second heat dissipation fin are arranged to be able to be attached to the PCB board through the operation of the fixing component, so as to absorb the heat dissipated when the PCB board and the chip work. While the first heat dissipation fin and the second heat dissipation fin absorb the heat, the fan can discharge the absorbed heat out of the box body through the communication between the first ventilation groove and the second ventilation groove during operation, which is convenient for the first heat dissipation fin and the second heat dissipation fin to form a complete heat dissipation channel for the upper and lower parts of the PCB board, improve the heat dissipation effect of the PCB board and the chip, and reduce the heat dissipation cost; 2. The carrier is arranged to be able to slide in the encapsulation cavity by rotating the folding handle. When the carrier drives the PCB board and the chip to slide out of the inside of the encapsulation cavity, the extrusion column will push the extrusion plate, the pull rod and the triangular top block. When the triangular top block is pushed, it can push the PCB board and the chip out of the inside of the assembly groove of the carrier through its inclined surface, which is convenient for the PCB board and the chip to be quickly taken out; 3. When the carrier enters the inside of the encapsulation cavity, it will push the slider. When the slider is pushed, it can drive the first heat dissipation fin and the second heat dissipation fin to move towards each other through the cooperation of parts. When the first heat dissipation fin and the second heat dissipation fin move towards each other, they can position the PCB board. At the same time, when the slider moves, it drives the ventilation cover and the first heat dissipation fin to be docked through the cooperation of parts, so that the assembly groove of the carrier forms a heat dissipation channel, which is convenient for the PCB board and the chip to be clamped and fixed up and down during heat dissipation. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The specification drawings forming a part of the present invention are used to provide a further understanding of the present invention. The schematic embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation to the present invention.

[0017] Figure 1 is a schematic three-dimensional structure diagram of the present invention; Figure 2 is a schematic three-dimensional encapsulation sectional structure diagram of the present invention; Figure 3 is a schematic three-dimensional unfolded sectional view structure diagram of the present invention from a first perspective; Figure 4 is a schematic three-dimensional unfolded sectional view structure diagram of the present invention from a second perspective; Figure 5 is a schematic front sectional structure diagram of the present invention; Figure 6 is the schematic structural diagram of the first explosion perspective of the present invention; Figure 7 is the schematic structural diagram of the second explosion perspective of the present invention; Figure 8 is the schematic three-dimensional enlarged structural diagram of the local fixed component of the present invention; Figure 9 is the present invention Figure 4 schematic enlarged structural diagram of part A; Figure 10 is the present invention Figure 3 schematic enlarged structural diagram of part B; In the figure: 100, box body; 200, encapsulation cavity; 300, carrier; 400, PCB board; 500, chip; 600, access component; 601, track groove; 602, slide rail; 603, first moving groove; 604, extrusion column; 605, movable groove; 606, first extrusion groove; 607, pull rod; 608, triangular top block; 609, extrusion plate; 6010, slide rod; 6011, first spring; 6012, first tooth groove; 6013, first gear; 6014, first rotating shaft; 6015, folding handle; 700, fixed component; 701, chute; 702, slider; 703, second extrusion groove; 704, clamping block; 705, second spring; 706, slot; 707, clamping groove; 708, first storage groove; 709, through groove; 7010, second tooth groove; 7011, second rotating shaft; 7012, second gear; 7013, internal thread sleeve; 7014, pulley; 7015, belt; 7016, threaded rod; 7017, closed frame; 7018, push plate; 800, heat dissipation component; 801, second storage groove; 802, second moving groove; 803, ventilation cover; 804, connecting rod; 805, fan; 806, sealing plate; 807, rotating groove; 808, third gear; 809, fourth gear; 8010, third tooth groove; 8011, first ventilation groove; 8012, first heat dissipation fin; 8013, docking groove; 8014, air inlet hole; 8015, through hole; 8016, second ventilation groove; 8017, second heat dissipation fin; 8018, air outlet hole; 8019, air inlet; 8020, filter screen. Detailed implementation manners

[0018] In order to enable those skilled in the art to better understand the solution of the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present application.

[0019] It should be noted that the terms "first", "second", etc. in the description, claims and above-mentioned drawings of this application are used to distinguish similar objects, and do not necessarily describe a specific order or sequence. It should be understood that the data used in this way can be interchanged under appropriate circumstances, so as to implement the embodiments of this application described here. In addition, the terms "comprising" and "having" and any variations thereof are intended to cover non-exclusive inclusion. For example, a process, method, system, product or device comprising a series of steps or units does not necessarily have to be limited to those steps or units clearly listed, but may include other steps or units not clearly listed or inherent to these processes, methods, products or devices.

[0020] In this application, the orientation or positional relationship indicated by the terms "upper", "lower", "left", "right", "front", "rear", "top", "bottom", "inner", "outer", "middle", "vertical", "horizontal", "lateral", "longitudinal", etc. is based on the orientation or positional relationship shown in the drawings. These terms are mainly used to better describe this application and its embodiments, and are not used to limit that the indicated device, element or component must have a specific orientation, or be constructed and operated in a specific orientation.

[0021] Moreover, in addition to being able to represent an orientation or positional relationship, some of the above terms may also be used to represent other meanings. For example, the term "upper" may also be used to represent a certain attachment relationship or connection relationship in some cases. For those of ordinary skill in the art, the specific meanings of these terms in this application can be understood according to specific circumstances.

[0022] In addition, the terms "install", "set", "provided with", "connect", "connected", "socketed" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral structure; it can be a mechanical connection or an electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, or there can also be internal communication between two devices, elements or components. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0023] Please refer to Figures 1 - 3, the present invention provides an embodiment: a multi-chip MOS integrated packaging structure, including a box body 100. An encapsulation cavity 200 is provided on the left side of the box body 100. A carrier 300 is movably connected inside the encapsulation cavity 200. A PCB board 400 is installed inside the assembly slot of the carrier 300. A number of groups of chips 500 are installed on the PCB board 400. An access component 600 is installed on the carrier 300. The access component 600 can access the PCB board 400 and the chips 500. A fixing component 700 is installed on the box body 100. The fixing component 700 can fix the PCB board 400 and the chips 500 inside the encapsulation cavity 200. A heat dissipation component 800 is installed on the fixing component 700. The heat dissipation component 800 can dissipate heat from the PCB board 400 and the chips 500 in the working state.

[0024] It should be understood that the PCB board 400 and the chips 500 are installed in the assembly slot of the carrier 300. After the PCB board 400 and the chips 500 are placed, the carrier 300 is conveyed into the encapsulation cavity 200 by operating the access component 600. When the carrier 300 enters the inside of the encapsulation cavity 200, the fixing component 700 will be activated by extrusion. When the fixing component 700 works, it can drive the heat dissipation component 800 to clamp the PCB board 400 and the chips 500 to form a heat dissipation channel. After the PCB board 400 is clamped, the carrier 300 can be connected to related devices through an interface to make the chips 500 work. When the chips 500 are working, the heat dissipation component 800 can work simultaneously to dissipate heat from the chips 500.

[0025] Such as Figures 1 - 6 and Figure 9As shown, the access component 600 further includes a first tooth groove 6012 formed on the back of the carrier 300, and a first gear 6013 rotatably connected in the assembly groove of the box body 100. The first gear 6013 can drive the carrier 300 to move in the encapsulation cavity 200 through rotational engagement with the first tooth groove 6012, thereby achieving the function of accessing the PCB board 400 and the chip 500. Track grooves 601 are formed on both the front side and the rear side inside the encapsulation cavity 200. Slide rails 602 are movably connected inside the track grooves 601. The two slide rails 602 are respectively fixed to the front side and the rear side of the carrier 300. Two first moving grooves 603 are formed at the bottom of the carrier 300 close to the slide rails 602. Extrusion columns 604 are movably connected inside the two first moving grooves 603. The ends of the two extrusion columns 604 are respectively fixedly connected to the front side and the rear side inside the encapsulation cavity 200. Two movable grooves 605 are formed at the top of the carrier 300 close to the slide rails 602. Two first extrusion grooves 606 are formed through the ends of the two movable grooves 605 close to the first moving grooves 603. A pull rod 607 is movably connected inside the movable groove 605. One end of the pull rod 607 is fixedly connected to a triangular top block 608. An extrusion plate 609 is fixedly connected to the end of the pull rod 607 close to the first extrusion groove 606. A slide rod 6010 is movably connected to the surface of the extrusion plate 609 through an assembly hole. Both ends of the slide rod 6010 are fixedly connected inside the first extrusion groove 606. A first spring 6011 is sleeved on the outer surface of the slide rod 6010. Both ends of the first spring 6011 are respectively fixedly connected to the surface of the extrusion plate 609 and the inner wall of the first extrusion groove 606. The end of a first rotating shaft 6014 is rotatably connected to the surface of the first gear 6013 through an assembly groove. The outer surface of the first rotating shaft 6014 is rotatably installed in the assembly groove on the surface of the box body 100. A folding handle 6015 is fixedly installed at the top of the first rotating shaft 6014.

[0026] It can be imagined that the PCB board 400 and the chip 500 are installed inside the assembly groove of the carrier 300. After the PCB board 400 and the chip 500 are assembled, the folding handle 6015 can be rotated. When the folding handle 6015 rotates, it can drive the first rotating shaft 6014 to rotate inside the box body 100. When the first rotating shaft 6014 rotates, it can drive the first gear 6013 to rotate. When the first gear 6013 rotates, it can drive the carrier 300 to move through the cooperation with the first tooth groove 6012. When the carrier 300 moves, it can drive the slide rails 602 to slide inside the track grooves 601. When the carrier 300 moves, it can slide the PCB board 400 and the chip 500 into the encapsulation cavity 200 for encapsulation; When the PCB board 400 and the chip 500 need to be disassembled, the folding handle 6015 can be rotated in the reverse direction to slide the carrier 300 to the right. When the carrier 300 slides, it can drive the first moving groove 603 and the extrusion column 604 to slide. When the first moving groove 603 slides, it can drive the extrusion plate 609 to move. When the extrusion plate 609 moves to the side of the extrusion column 604, the extrusion column 604 will extrude the extrusion plate 609. When the extrusion plate 609 is pushed, it can slide in the first extrusion groove 606. The sliding of the extrusion plate 609 can extrude the first spring 6011. While the extrusion plate 609 slides, it can slide on the surface of the sliding rod 6010 through its own assembly hole. When the extrusion plate 609 slides, it will drive the pull rod 607 and the triangular top block 608 to slide inside the first extrusion groove 606. When the triangular top block 608 slides, it can push up one side of the PCB board 400 through its inclined surface, so that the PCB board 400 and the chip 500 can be quickly taken when not in use.

[0027] Such as Figures 2 - 10As shown, the fixing component 700 further includes a first storage groove 708 opened at the top and bottom of the encapsulation cavity 200, a closing frame 7017 movably installed in the first storage groove 708 at the top of the encapsulation cavity 200, and a push plate 7018 movably installed in the first storage groove 708 at the bottom of the encapsulation cavity 200. When the carrier 300 enters the interior of the encapsulation cavity 200, through the cooperation of relevant parts, the closing frame 7017 and the push plate 7018 move towards each other to squeeze and fix the PCB board 400 and the chip 500. A sliding groove 701 is opened on the right side inside the encapsulation cavity 200, and a slider 702 is movably connected inside the sliding groove 701. An extrusion groove two 703 is penetrated through the surface of the slider 702. Clamping blocks 704 are movably connected to both the front and rear sides of the extrusion groove two 703. A second spring 705 is fixedly connected between the two clamping blocks 704. A slot 706 matching the slider 702 is opened on the right side of the carrier 300, and a clamping groove 707 matching the clamping block 704 is opened inside the slot 706. A through groove 709 is penetrated through the top of the slider 702, and a second tooth groove 7010 is opened inside the through groove 709. A second rotating shaft 7011 is rotatably connected to the inside of the box body 100 through an assembly groove. The outer surface of the second rotating shaft 7011 passes through the sliding groove 701 and the through groove 709. The two ends of the second rotating shaft 7011 are respectively rotatably connected in the first storage groove 708 at the top of the encapsulation cavity 200 and the first storage groove 708 at the bottom of the encapsulation cavity 200. A second gear 7012 matching the second tooth groove 7010 is fixedly connected to the outer peripheral surface of the second rotating shaft 7011 close to the through groove 709. An internally threaded sleeve 7013 is rotatably connected to the inside of the first storage groove 708 through a bearing. A threaded rod 7016 is rotatably connected to the inside of the internally threaded sleeve 7013. The top of the closing frame 7017 and the bottom of the push plate 7018 are both fixedly connected with the threaded rod 7016. Pulley wheels 7014 are fixedly connected to the outer peripheral surfaces of the internally threaded sleeve 7013 and the second rotating shaft 7011, and a belt 7015 is connected between the pulley wheels 7014.

[0028] It can be conceived that when the carrier 300 slides inside the encapsulation cavity 200, it will drive the slot 706 to move. When the slot 706 moves to the end of the slider 702, docking can be carried out. When the slot 706 docks with the slider 702, it can push the slider 702 to slide inside the chute 701 through the inclined surface of the clamping block 704. When the slider 702 slides, it can drive the second tooth groove 7010 to move. When the second tooth groove 7010 moves, it drives the second gear 7012 to engage and rotate. When the second gear 7012 engages and rotates, it can drive the second rotating shaft 7011 to rotate inside the box body 100. When the second rotating shaft 7011 rotates, it can drive the belt pulleys 7014 at both ends to rotate. When the belt pulleys 7014 rotate, they can drive the belt 7015 to rotate. When the belt 7015 rotates, it can drive another group of belt pulleys 7014 to rotate. When the belt pulleys 7014 rotate, they can drive the internal thread sleeve 7013 to rotate inside the encapsulation cavity 200. The internal thread sleeve 7013 can drive the internal threaded rod 7016 to slide in a threaded manner. When the threaded rod 7016 slides in a threaded manner, it can push the closing frame 7017 and the push plate 7018 to move towards each other. When the closing frame 7017 and the push plate 7018 move towards each other, they can drive the first heat dissipation fin 8012 and the second heat dissipation fin 8017 to move towards each other. When the first heat dissipation fin 8012 and the second heat dissipation fin 8017 move to the top and bottom of the PCB board 400, they can clamp and fix it. When the first heat dissipation fin 8012 and the second heat dissipation fin 8017 clamp the PCB board 400, the closing frame 7017 and the push plate 7018 can drive the air inlet hole 8014, the air outlet hole 8018 and the through hole 8015 to be vertically docked, so as to form a ventilation channel between the closing frame 7017, the push plate 7018 and the carrier 300. When the right end of the slider 702 slides into the chute 701, the slot 706 will continuously push and squeeze the inclined surface of the clamping block 704. When the clamping block 704 is squeezed, it can slide inside the second extrusion groove 703. When the clamping block 704 slides, it can squeeze the second spring 705. When the clamping block 704 is completely squeezed into the second extrusion groove 703, the slot 706 will drive the clamping groove 707 to move to the side of the clamping block 704. At this time, the clamping block 704 can be reset by the self-elastic force of the second spring 705. When the clamping block 704 is reset, it can be snap-connected with the clamping groove 707. When the PCB board 400 and the chip 500 need to be taken out, when the carrier 300 moves, it can pull the slider 702 to move through the clamping groove 707.

[0029] As Figure 1 and Figures 5 - 9As shown, the heat dissipation component 800 further includes a ventilation hood 803 movably installed inside the box body 100, and a fan 805 fixedly installed inside the cavity of the ventilation hood 803. A first heat dissipation fin 8012 is fixedly installed on the closed frame 7017, and a second heat dissipation fin 8017 is fixedly installed on the push plate 7018. The first heat dissipation fin 8012 and the second heat dissipation fin 8017 can absorb the heat dissipated when the PCB board 400 and the chip 500 are working. The fan 805 can then discharge the heat absorbed by the first heat dissipation fin 8012 and the second heat dissipation fin 8017 out of the box body 100. On the right side inside the encapsulation cavity 200, three sets of second storage grooves 801 are penetrated and opened. Inside each of the three sets of second storage grooves 801, a ventilation hood 803 is movably connected. The three sets of second storage grooves 801 are connected by two sets of second moving grooves 802. The surfaces of the three sets of ventilation hoods 803 close to the second moving grooves 802 are connected by two sets of connecting rods 804. Inside the second storage groove 801, close to the second rotating shaft 7011, a rotating groove 807 is opened. On the outer peripheral surface of the second rotating shaft 7011 close to the rotating groove 807, a third gear 808 is fixedly connected. Inside the rotating groove 807, a fourth gear 809 that matches the third gear 808 is rotatably connected. On the side surface of the ventilation hood 803, a third tooth groove 8010 that matches the fourth gear 809 is opened. Inside the closed frame 7017, several sets of first heat dissipation fins 8012 are fixedly connected. Inside the closed frame 7017, close to the first heat dissipation fin 8012, a first ventilation groove 8011 is opened. At the bottom of the first ventilation groove 8011, an air inlet hole 8014 is penetrated and opened. On the side surface of the closed frame 7017, close to the ventilation hood 803, three sets of docking grooves 8013 are opened. On the surface of the carrier 300, close to the first moving groove 603, a through hole 8015 is penetrated and opened. On the right side of the push plate 7018, a second ventilation groove 8016 is opened. Inside the second ventilation groove 8016, a second heat dissipation fin 8017 is fixedly installed through an assembly hole. At the top of the second ventilation groove 8016, close to the through hole 8015, an air outlet hole 8018 is penetrated and opened. On the inner side of the encapsulation cavity 200, close to the second ventilation groove 8016, an air inlet 8019 is penetrated and opened. Inside the air inlet 8019, a filter screen 8020 is fixedly installed.

[0030] It should be noted that when the slider 702 moves, it can drive the rotation of the second rotating shaft 7011 through the cooperation of the second gear 7012 and the second tooth groove 7010. When the second rotating shaft 7011 rotates, it can drive the rotation of the third gear 808 inside the rotating groove 807. When the third gear 808 rotates, it can drive the fourth gear 809 to engage and rotate. When the fourth gear 809 engages and rotates, it can drive the ventilation hood 803 to move through the third tooth groove 8010. When the ventilation hood 803 moves, it can slide inside the second moving groove 802. When the ventilation hood 803 slides into the docking groove 8013, it can be docked with the first heat dissipation fin 8012. After the ventilation hood 803 is docked with the first heat dissipation fin 8012, the fan 805 can work. When the fan 805 works, it will generate suction force. The suction force of the fan 805 will draw the external air into the inside of the air inlet 8019. When the air enters the inside of the air inlet 8019, the filter screen 8020 will filter the dust inside the air. The filtered air can be transported to the inside of the second ventilation groove 8016 through the air inlet 8019. When the air enters the inside of the second ventilation groove 8016, it can drive the heat absorbed by the second heat dissipation fin 8017 from the PCB board 400. The heat of the air is then transported to the inside of the first ventilation groove 8011 through the air outlet hole 8018, the through hole 8015 and the air inlet hole 8014. After the air enters the inside of the first ventilation groove 8011, it enters between the first heat dissipation fins 8012, and the heat absorbed by the first heat dissipation fin 8012 is drawn into the inside of the ventilation hood 803. After the air enters the inside of the ventilation hood 803, it is discharged from the inside of the box body 100 by the fan 805. When the fan 805 discharges heat, it can open the sealing plate 806 through the wind force. When the fan 805 is not working, the sealing plate 806 can be reset and closed through the assembled elastic member.

[0031] The above is only a preferred specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present invention, according to the technical solution and inventive concept of the present invention, makes equivalent substitutions or changes, and should be covered by the protection scope of the present invention.

Claims

1. A multi-chip MOS integrated packaging structure, comprising: a box body (100), a packaging cavity (200) is opened on the left side of the box body (100), a carrier (300) is movably connected inside the packaging cavity (200), a PCB board (400) is installed inside the assembly groove of the carrier (300), a plurality of groups of chips (500) are installed on the PCB board (400), an access component (600) is installed on the carrier (300), and the access component (600) is installed on the carrier (300). ) can access the PCB board (400) and the chip (500), a fixing component (700) is installed on the box body (100), and the fixing component (700) can fix the PCB board (400) and the chip (500) inside the packaging cavity (200), and a heat dissipation component (800) is installed on the fixing component (700), and the heat dissipation component (800) can dissipate heat for the PCB board (400) and the chip (500) in a working state, characterized in that: The access component (600) further comprises a tooth groove (6012) provided on the back of the carrier (300), and a gear (6013) rotatably connected to the assembly groove of the box body (100); the gear (6013) can rotate and mesh with the tooth groove (6012) to drive the carrier (300) to move in the packaging cavity (200), thereby achieving the function of accessing the PCB board (400) and the chip (500); The fixing assembly (700) further comprises a collection groove (708) provided at the top and the bottom of the packaging cavity (200), a closed frame (7017) movably mounted in the collection groove (708) at the top of the packaging cavity (200), and a push plate (7018) movably mounted in the collection groove (708) at the bottom of the packaging cavity (200); when the carrier (300) enters the packaging cavity (200), the closed frame (7017) and the push plate (7018) move towards each other through the cooperation of relevant parts to squeeze and fix the PCB board (400) and the chip (500); The heat dissipation component (800) further includes a ventilation hood (803) movably mounted inside the box body (100), and a fan (805) fixedly mounted in the inner cavity of the ventilation hood (803); a heat dissipation fin 1 (8012) is fixedly mounted on the closed frame (7017); and a heat dissipation fin 2 (8018) is fixedly mounted on the push plate (7018); the heat dissipation fin 1 (8012) and the heat dissipation fin 2 (8018) can absorb the heat emitted by the PCB board (400) and the chip (500) when they are working, and the fan (805) can discharge the heat absorbed by the heat dissipation fin 1 (8012) and the heat dissipation fin 2 (8018) out of the box body (100).

2. The multi-chip MOS integrated packaging structure according to claim 1, characterized in that: The front and rear sides of the packaging cavity (200) are provided with track grooves (601), and the track grooves (601) are movably connected with slide rails (602). Two groups of slide rails (602) are respectively fixed on the front and rear sides of the carrier (300). The carrier (300) is provided with two groups of movable grooves 1 (603) at the bottom near the slide rails (602). The two groups of movable grooves 1 (603) are movably connected with extrusion columns (604), and the ends of the two groups of extrusion columns (604) are respectively fixedly connected to the front and rear sides of the packaging cavity (200).

3. The multi-chip MOS integrated packaging structure according to claim 2, characterized in that: The carrier (300) is provided with two groups of movable grooves (605) near the top of the slide rail (602), and two groups of extrusion grooves (606) are penetrated through the ends of the two groups of movable grooves (605) near the movable groove (603). The interior of the movable groove (605) is movably connected with a pull rod (607), one end of the pull rod (607) is fixedly connected with a triangular top block (608), and the end of the pull rod (607) near the extrusion groove (606) is fixedly connected with an extrusion plate (609), and the surface of the extrusion plate (609) is movably connected with a slide rod (6010) via an assembly hole.

4. The multi-chip MOS integrated packaging structure according to claim 3, characterized in that: The two ends of the slide bar (6010) are fixedly connected to the inside of the extrusion groove (606); the outer surface of the slide bar (6010) is sleeved with a spring (6011); the two ends of the spring (6011) are respectively fixedly connected to the surface of the extrusion plate (609) and the inner wall of the extrusion groove (606); the surface of the gear (6013) is rotatably connected to the end of the rotating shaft (6014) through the assembly groove; the outer surface of the rotating shaft (6014) is rotatably installed in the assembly groove on the surface of the box body (100); and the top of the rotating shaft (6014) is fixedly installed with a folding handle (6015).

5. The multi-chip MOS integrated packaging structure according to claim 1, characterized in that: A slide groove (701) is provided on the right side of the packaging cavity (200), a slider (702) is movably connected to the slide groove (701), a second extrusion groove (703) is provided on the surface of the slider (702), a clamping block (704) is movably connected to the front and rear sides of the second extrusion groove (703), a second spring (705) is fixedly connected between the two groups of the clamping blocks (704), a slot (706) matching the slider (702) is provided on the right side of the carrier (300), and a clamping groove (707) matching the clamping block (704) is provided on the inner side of the slot (706).

6. The multi-chip MOS integrated packaging structure according to claim 5, characterized in that: A through groove (709) is formed through the top of the slider (702), and a tooth groove (7010) is formed on the inner side of the through groove (709). A second rotating shaft (7011) is rotatably connected to the interior of the box body (100) via an assembly groove. The outer surface of the second rotating shaft (7011) passes through the slide groove (701) and the through groove (709). The two ends of the second rotating shaft (7011) are rotatably connected to a collection groove (708) at the top of the packaging cavity (200) and a collection groove (708) at the bottom of the packaging cavity (200), respectively. A gear (7012) matching the tooth groove (7010) is fixedly connected to the outer peripheral surface of the second rotating shaft (7011) close to the through groove (709).

7. The multi-chip MOS integrated packaging structure according to claim 6, characterized in that: The interior of the collection groove 1 (708) is rotatably connected to an internal threaded sleeve (7013) via a bearing, and the interior of the internal threaded sleeve (7013) is rotatably connected to a threaded rod (7016). The top of the closing frame (7017) and the bottom of the push plate (7018) are both fixedly connected to the threaded rod (7016), and the outer circumference of the internal threaded sleeve (7013) and the second rotating shaft (7011) are both fixedly connected to pulleys (7014), and a belt (7015) is connected between the pulleys (7014).

8. The multi-chip MOS integrated packaging structure according to claim 1, characterized in that: The right side of the packaging cavity (200) is provided with three groups of collection slots 2 (801), each of which is movably connected with a ventilation hood (803). The three groups of collection slots 2 (801) are connected via two groups of movable slots 2 (802), and the surfaces of the three groups of ventilation hoods (803) close to the movable slots 2 (802) are connected via two groups of connecting rods (804). A rotating slot (807) is provided on the inner side of the collection slots 2 (801) close to the rotating shaft 2 (7011), and a gear 3 (808) is fixedly connected to the outer peripheral surface of the rotating shaft 2 (7011) close to the rotating slot (807), and a gear 4 (809) matching the gear 3 (808) is rotatably connected to the inside of the rotating slot (807).

9. The multi-chip MOS integrated packaging structure according to claim 8, characterized in that: The side of the ventilation hood (803) is provided with a tooth groove three (8010) matching with the gear four (809); the interior of the closed frame (7017) is fixedly connected with a plurality of groups of heat dissipation fins one (8012); the interior of the closed frame (7017) close to the heat dissipation fins one (8012) is provided with a ventilation groove one (8011); the bottom of the ventilation groove one (8011) is penetrated by an air inlet hole (8014); and the side of the closed frame (7017) close to the ventilation hood (803) is provided with three groups of docking grooves (8013).

10. The multi-chip MOS integrated packaging structure according to claim 9, characterized in that: A through hole (8015) is formed through the surface of the carrier (300) near the movable groove 1 (603), a ventilation groove 2 (8016) is formed on the right side of the push plate (7018), a heat sink 2 (8017) is fixedly installed through the assembly hole inside the ventilation groove 2 (8016), an air outlet hole (8018) is formed through the top of the ventilation groove 2 (8016) near the through hole (8015), an air inlet (8019) is formed through the inner side of the packaging cavity (200) near the ventilation groove 2 (8016), and a filter screen (8020) is fixedly installed inside the air inlet (8019).

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