Connector gold wire bonding method and device

Abstract

The present invention relates to a connector wire bonding method and device, belonging to the field of wire bonding. The method comprises: cleaning the bonding area and soldering the microstrip connector to the cavity housing; wrapping and fixing the tail pin of the microstrip connector and wire bonding the tail pin of the microstrip connector to the PCB board; releasing the wrapping and fixing of the tail pin of the microstrip connector, cleaning the bonding area, and completing the wire bonding. The present invention effectively solves the vibration and deformation problems of the tail pin of a high aspect ratio microstrip connector caused by insufficient suspended support during the bonding process through an active constraint mechanism, significantly improving the strength and success rate of wire bonding.

Description

Technical Field

[0001] The present invention belongs to the field of gold wire bonding, and in particular relates to a connector gold wire bonding method and device. Background Art

[0002] In the manufacturing of RF microstrip connectors, gold wire bonding is a core process for achieving reliable high-frequency signal transmission. When the tail microstrip of a microstrip connector enters the device cavity, the tail pin of the microstrip connector is often exposed alone in the cavity due to a lack of effective support. As the ratio of the length to diameter of the microstrip connector's tail pin (microstrip aspect ratio) increases, the tail pin of the microstrip connector is prone to uncontrolled deformation and high-frequency vibration under the action of pressure and ultrasonic energy during the bonding process, resulting in the inability to form stable contact at the bonding interface, becoming a key factor restricting the bonding yield. This problem is particularly prominent in application scenarios where the microstrip aspect ratio is significantly increased. For example, in microwave frequency bands above the K and Ka bands, miniaturized connectors are often used for integration into communication modules with multiple ports. However, the diameter of the tail pin of connectors commonly used for gold wire bonding is mostly less than 0.5mm, and some are even less than 0.3mm. If gold wire bonding is performed directly, there will be problems such as difficulty in bonding and insufficient bonding strength due to the inability to effectively suppress the microstrip vibration during the bonding process.

[0003] Existing technologies mainly improve bonding effects by optimizing bonding interface pretreatment and adjusting equipment parameters. Typical solutions include ultrasonic or chemical cleaning of the bonding end faces to remove contaminants, improve the surface flatness of the coating, and compensate for insufficient support defects by increasing the number of bonding times, power, or pressure parameters during the bonding process. Although such methods can improve the interface bonding state in the short term, they essentially do not change the suspended state of the tail pin of the microstrip connector in the equipment cavity, and the inherent lack of mechanical support still exists. When the aspect ratio of the microstrip reaches a certain threshold, relying solely on process parameter adjustments can no longer effectively suppress the vibration of the microstrip during the bonding process. For example, when the aspect ratio of the microstrip is above 1.5, the risk of bonding failure increases significantly due to bonding difficulties and insufficient bonding strength.

[0004] The limitations of the above-mentioned technical solutions are mainly reflected in the lack of an active control mechanism for the dynamic stability of the microstrip connector's tail pins. Especially when the microstrip aspect ratio increases significantly, the bending and vibration of the microstrip connector's tail pins under the impact load of the bond are difficult to eliminate. This causes the bond force transmission path to deviate from the intended contact area, ultimately leading to insufficient bond strength or even bond failure. Therefore, the development of a connector gold wire bonding method and device is urgently needed. Summary of the Invention

[0005] In order to solve the above problems existing in the prior art, the present invention provides a connector gold wire bonding method and device. The technical problem to be solved by the present invention is achieved through the following technical solutions:

[0006] The present invention provides a connector gold wire bonding method, comprising:

[0007] Clean the area to be bonded and solder the microstrip connector to the cavity housing;

[0008] Wrapping and fixing the tail pin of the microstrip connector, and performing gold wire bonding on the tail pin of the microstrip connector and the PCB board;

[0009] The tail pins of the microstrip connector are unwrap-fixed, the bonding area is cleaned, and the gold wire bonding is completed.

[0010] In one embodiment of the present invention, cleaning the area to be bonded and welding the microstrip connector to the cavity housing includes:

[0011] Cleaning the cavity housing and the tail pins of the microstrip connector respectively with a degreasing cleaning agent, and baking them at a temperature of 240° C. for at least 5 minutes after cleaning;

[0012] After baking, the microstrip connector is soldered to the cavity housing by reflow soldering, and the temperature range of the reflow soldering is 240-260°C.

[0013] In one embodiment of the present invention, wrapping and fixing the tail pin of the microstrip connector includes:

[0014] preparing a bonding tool according to the bonding area between the cavity housing and the microstrip connector;

[0015] Press-fitting the bonding fixture into the cavity shell so that the upper end surface of the bonding fixture mating with the cavity shell is not higher than the upper surface of the cavity shell;

[0016] The tail pin of the microstrip connector is wrapped and fixed by the bonding tool.

[0017] In one embodiment of the present invention, the bonding tooling includes a fixed section and an extension section that are interconnected. The fixed section is press-fitted with the cavity shell and wraps around and fixes the tail pin of the microstrip connector; the extension section extends out of the cavity shell.

[0018] In one embodiment of the present invention, performing gold wire bonding on the tail pin of the microstrip connector and the PCB board includes:

[0019] Setting bonding parameters, performing gold wire bonding on the tail pin of the microstrip connector and the PCB board according to the preset bonding parameters, wherein the bonding parameters are: bonding pressure range of 13~30g, bonding power range of 140~170mW, bonding time range of 50~80ms, and ultrasonic energy parameter of 130LSB.

[0020] In one embodiment of the present invention, releasing the wrapping and fixing of the tail pin of the microstrip connector and cleaning the bonding area includes:

[0021] The bonding tool is taken out through the extension section, and the bonding area is cleaned with anhydrous ethanol to ensure that there is no residue in the bonding area and the cavity shell.

[0022] The present invention also provides a connector gold wire bonding device, which is used in the above-mentioned connector gold wire bonding method. The device includes: a cavity housing, a microstrip connector, and a bonding tool, wherein a plurality of the microstrip connectors are fixedly connected to the cavity housing; the cavity housing is provided with a plurality of bonding holes, and the tail pins of the plurality of microstrip connectors extend out from the plurality of bonding holes in a one-to-one correspondence; and the plurality of bonding tools are detachably connected to the tail pins of the plurality of microstrip connectors in a one-to-one correspondence;

[0023] Each of the bonding fixtures comprises a fixed section and an extension section that are connected to each other. The fixed section is arranged in the bonding hole and is transitionally fitted or tightly fitted with the tail pin of the microstrip connector.

[0024] In one embodiment of the present invention, the ratio between the length and the diameter of the tail pin of the microstrip connector is greater than or equal to 2.

[0025] In one embodiment of the present invention, the fixing section and the extending section are both made of flexible non-metallic materials. An open positioning hole is provided on one side of the fixing section, and the opening angle of the positioning hole ranges from 10 to 12 degrees.

[0026] In one embodiment of the present invention, a plurality of the bonding fixtures are arranged side by side as a whole, and are used for batch wrapping and fixing of tail pins of multiple rows of the microstrip connectors.

[0027] Compared with the prior art, the present invention has the following beneficial effects:

[0028] The connector gold wire bonding method of the present invention performs segmented cleaning and high-temperature baking on the bonding area before bonding to eliminate the influence of contaminants on the interface bonding; by providing a wrapped fixed support for the tail pin of the microstrip connector, a constraint is provided during the bonding process, which suppresses the vibration of the tail pin of the microstrip connector during the bonding process, ensures that the bonding pressure is stably applied to the bonding area, and significantly improves the strength and success rate of the gold wire bonding, and effectively solves the vibration and deformation problems of the tail pin of the high aspect ratio microstrip connector during the bonding process caused by insufficient suspension support. This method avoids bonding failure or bonding offset by dynamically balancing the mechanical stability of the tail pin of the microstrip connector, and significantly improves the reliability of signal transmission. Compared with the traditional passive solution that relies on optimizing bonding parameters, its active constraint mechanism can adapt to application scenarios with significantly increased microstrip aspect ratios, and can be extended to a variety of microstrip connector types. It has strong versatility and is easy to operate, which greatly reduces the process complexity and improves the bonding yield.

[0029] The connector gold wire bonding method of the present invention only wraps and fixes the tail pin of the microstrip connector during the gold wire bonding process, and takes it out immediately after the process is completed. It does not exist on the product as part of the product bonding and will not affect the performance and environmental resistance of the product. At the same time, there is no residue on the tail pin of the microstrip connector, and there is no residual hidden danger.

[0030] The connector wire bonding device provided by this invention actively controls the suspended deformation of the microstrip connector's tail pins through a physical constraint mechanism. By integrating a detachable bonding fixture with the cavity housing, the device achieves structural dynamic support for the tail pins of high-aspect-ratio microstrip connectors. The bonding fixture wraps around the microstrip connector's tail pins with a transitional or tight fit, creating a stable mechanical transmission path during the bonding process, counteracting vibration and bending deformation caused by ultrasonic impact loads.

[0031] The above description is only an overview of the technical solution of the present invention. In order to more clearly understand the technical means of the present invention, it can be implemented in accordance with the contents of the specification. In order to make the above and other purposes, features and advantages of the present invention more obvious and easy to understand, the following preferred embodiments are specifically cited and described in detail with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1 This is a flow chart of a connector gold wire bonding method provided by an embodiment of the present invention;

[0033] Figure 2 The embodiment of the present invention provides Figure 1 Flowchart of step 1 in [1];

[0034] Figure 3 The embodiment of the present invention provides Figure 1 Flowchart for step 2 in [1];

[0035] Figure 4 This is a schematic structural diagram of a connector gold wire bonding device provided by an embodiment of the present invention;

[0036] Figure 5 This is a schematic diagram of the partial structure of a connector gold wire bonding device provided by an embodiment of the present invention;

[0037] Figure 6 is a schematic diagram of a partial structure of a cavity shell provided by an embodiment of the present invention;

[0038] Figure 7 Schematic diagram of the structure of the bonding tool provided by an embodiment of the present invention;

[0039] Figure 8 Schematic diagram of the partial structure of the bonding tool provided by an embodiment of the present invention;

[0040] Figure 9 1 is a schematic structural diagram of another connector gold wire bonding device provided by an embodiment of the present invention;

[0041] Figure 10 The embodiment of the present invention provides Figure 9 Schematic diagram of the structure at I in the figure. DETAILED DESCRIPTION

[0042] In order to further illustrate the technical means and effects adopted by the present invention to achieve the predetermined purpose of the invention, the following is a detailed description of a connector gold wire bonding method and device proposed in accordance with the present invention in conjunction with the accompanying drawings and specific embodiments.

[0043] The aforementioned and other technical contents, features, and effects of the present invention are clearly presented in the following detailed description of the specific embodiments in conjunction with the accompanying drawings. Through the description of the specific embodiments, a deeper and more specific understanding of the technical means and effects adopted by the present invention to achieve the intended purpose can be obtained. However, the accompanying drawings are provided for reference and illustration purposes only and are not intended to limit the technical solutions of the present invention.

[0044] Example 1

[0045] This embodiment provides a connector gold wire bonding method that can be used for millimeter wave connectors with a frequency of up to 50 GHz, and uses a 25 μm diameter gold wire to bond on the end face of a microstrip connector with a length of 1.3 mm and a diameter of 0.3 mm on the tail pin of the microstrip connector.

[0046] like Figure 1 As shown, Figure 1 This is a flow chart of a connector gold wire bonding method provided by an embodiment of the present invention.

[0047] In this embodiment, the connector wire bonding method includes:

[0048] Step 1: Clean the area to be bonded and solder the microstrip connector to the cavity shell.

[0049] like Figure 2 As shown, Figure 2 The embodiment of the present invention provides Figure 1 Flowchart for step 1 in .

[0050] In an optional embodiment, step 1 includes:

[0051] Step 1.1: Clean the cavity housing and the tail pins of the microstrip connector with a degreasing detergent and bake them at 240°C for at least 5 minutes after cleaning.

[0052] Exemplarily, the areas to be bonded are the cavity housing and the tail pins of the microstrip connector.

[0053] For example, the degreasing cleaning agent may be HT-1 type degreasing cleaning agent.

[0054] Step 1.2: After baking, solder the microstrip connector to the cavity housing using reflow soldering at a temperature range of 240-260°C.

[0055] Step 2: Wrap and fix the tail pin of the microstrip connector and perform gold wire bonding on the tail pin of the microstrip connector and the PCB (Printed Circuit Board).

[0056] like Figure 3 As shown, Figure 3 The embodiment of the present invention provides Figure 1 Flowchart for step 2 in .

[0057] In an optional embodiment, step 2 includes:

[0058] Step 2.1: Prepare bonding tooling based on the bonding area between the cavity housing and the microstrip connector.

[0059] For example, a matching bonding tool can be designed based on the bonding dimensions of different microstrip connector tail pins to ensure that the microstrip connector tail pins are fixed while avoiding affecting the bonding process. By actively fixing the microstrip connector tail pins, the connector bonding environment is improved, effectively increasing the bonding success rate of the microstrip connector.

[0060] Exemplarily, the bonding tooling is made of flexible non-metallic materials, such as non-metallic organic fluorine materials, so as to avoid damaging the surface plating of the tail pins of the microstrip connector.

[0061] Step 2.2: Press-fit the bonding tool into the cavity shell so that the upper end surface of the bonding tool mating with the cavity shell is not higher than the upper surface of the cavity shell.

[0062] Exemplarily, after the microstrip connector is welded, the bonding tool at least partially wraps and fixes the tail pin of the microstrip connector, and the portion of the bonding tool wrapping the tail pin of the microstrip connector does not exceed the upper surface of the cavity shell.

[0063] It is worth noting that the tail pin of the microstrip connector is wrapped and fixed by the bonding tool to form an annular support, which resists the lateral bending and high-frequency vibration caused by ultrasonic energy during the bonding process, ensures that the bonding pressure is evenly transmitted to the contact position, and avoids mechanical instability caused by the excessive aspect ratio of the microstrip. The bonding tool is designed to limit the upper surface of the cavity shell, which avoids assembly interference between the bonding tool and the cavity shell, ensures that the ultrasonic energy is focused on the predetermined bonding area during the bonding process, and prevents energy scattering or bonding offset caused by the protrusion of the bonding tool. This structural feature fundamentally eliminates the problem of the tail pin of the microstrip connector being suspended, improves the contact stability of the bonding interface, and solves the core problem of insufficient bonding strength of the tail pin of the microstrip connector with a high aspect ratio (greater than or equal to 2).

[0064] Step 2.3: Wrap and secure the tail pins of the microstrip connector with the bonding tool.

[0065] Step 2.4: Set the bonding parameters and perform gold wire bonding on the tail pin of the microstrip connector and the PCB board according to the preset bonding parameters. The bonding parameters are: bonding pressure range of 13-30g, bonding power range of 140-170mW, bonding time range of 50-80ms, and ultrasonic energy parameter of 130LSB.

[0066] In an optional embodiment, the bonding tool includes an interconnected fixed section and an extension section. The fixed section is press-fitted with the cavity housing and wraps around the tail pin of the fixed microstrip connector; the extension section extends outside the cavity housing. During assembly, the extension section serves as an axial alignment reference, guiding the bonding tool to be pressed into the cavity housing along a predetermined path, ensuring quick and precise alignment of the fixed section and the tail pin of the microstrip connector, thereby reducing assembly adjustment time. At the same time, the extension section can also serve as an external operating handle. During disassembly, there is no need to use tools to contact the fixed section or the tail pin of the microstrip connector, avoiding secondary damage to the bonding area due to direct force.

[0067] Step 3: Unwrap the tail pins of the microstrip connector, clean the bonding area, and complete the gold wire bonding.

[0068] In an optional embodiment, step 3 includes: removing the bonding tool through the extension section, cleaning the bonding area with anhydrous ethanol, and ensuring that there is no residue in the bonding area and the cavity shell.

[0069] It is worth noting that the bonding tool is only used to assist the gold wire bonding process, that is, the bonding tool is only used to wrap and fix the tail pins of the microstrip connector during the gold wire bonding process, and is removed immediately after the process is completed. Since the bonding tool does not remain on the product as part of the product bonding, it will not affect the performance and environmental resistance of the product. At the same time, there is no residue on the tail pins of the microstrip connector, and there is no residual hidden danger. In particular, compared with the existing solution of using glue to assist the tail pins of the microstrip connector, the advantage of no residual hidden danger is particularly prominent. In addition, by providing an extension section, the mechanical stability of the tail pin of the microstrip connector can be guaranteed through the fixed section, and the bonding tool can be quickly replaced and reused through the extension section, which completely solves the problem of low maintenance efficiency caused by the difficulty of disassembly in the traditional solution.

[0070] For example, a millimeter wave connector is used as the microstrip connector, and its application frequency is 50 GHz. A gold wire with a diameter of 25 μm is used for bonding on a circular surface with a diameter of 0.3 mm. After bonding, two groups of 10 microstrip connectors, each with a pull-off test, are respectively performed. The pull-off force results are shown in Tables 1 and 2.

[0071] Table 1 Pull-off force of Au wire with diameter of 25 μm before using bonding tool (unit: g)

[0072]

[0073] Table 2 Pull-off force of Au wire with a diameter of 25 μm after using the tooling (unit: g)

[0074]

[0075] Before using the bonding fixture, the qualified rate of pull-off force based on GJB548B was 70%, and based on GB / T4937, the qualified rate was 40%. After using the bonding fixture, the qualified rate of pull-off force based on GJB548B was 95%, and based on GB / T4937, the qualified rate was 90%.

[0076] It can be seen that the connector wire bonding method of the present invention effectively suppresses the vibration deformation of the microstrip connector's tail pin during the bonding process through the active support structure. The pull-off force qualification rate under the GJB548B and GB / T4937 standards has been greatly improved (95% and 90%), which is significantly improved compared to the pre-use tooling (70% and 40%). This technology breaks through the bottleneck of the traditional process of lacking support when the aspect ratio of the microstrip connector's tail pin increases. By real-time constraining the freedom of the microstrip connector's tail pin, it eliminates the problems of stress concentration and unstable contact at the bonding interface, allowing the microstrip connector to maintain high mechanical strength and electrical contact reliability at the bonding point under complex working conditions.

[0077] The connector gold wire bonding method of the present invention performs segmented cleaning and high-temperature baking on the bonding area before bonding to eliminate the influence of contaminants on the interface bonding; by providing a wrapped fixed support for the tail pin of the microstrip connector, a constraint is provided during the bonding process, which suppresses the vibration of the tail pin of the microstrip connector during the bonding process, ensures that the bonding pressure is stably applied to the bonding area, and significantly improves the strength and success rate of the gold wire bonding, and effectively solves the vibration and deformation problems of the tail pin of the high aspect ratio microstrip connector during the bonding process caused by insufficient suspension support. This method avoids bonding failure or bonding offset by dynamically balancing the mechanical stability of the tail pin of the microstrip connector, and significantly improves the reliability of signal transmission. Compared with the traditional passive solution that relies on optimizing bonding parameters, its active constraint mechanism can adapt to application scenarios with significantly increased microstrip aspect ratios, and can be extended to a variety of microstrip connector types. It has strong versatility and is easy to operate, which greatly reduces the process complexity and improves the bonding yield.

[0078] Example 2

[0079] This embodiment provides a connector gold wire bonding device, which is used in the connector gold wire bonding method of embodiment 1. Figures 4 to 6 As shown, Figure 4 This is a schematic structural diagram of a connector gold wire bonding device provided by an embodiment of the present invention; Figure 5 This is a schematic diagram of the partial structure of a connector gold wire bonding device provided by an embodiment of the present invention; Figure 6 It is a schematic diagram of the partial structure of the cavity shell provided by an embodiment of the present invention.

[0080] In this embodiment, the connector gold wire bonding device includes: a cavity housing 100, a microstrip connector 200 and a bonding tool 300, wherein a plurality of microstrip connectors 200 are fixedly connected to the cavity housing 100; the cavity housing 100 is provided with a plurality of bonding holes, and the tail pins of the plurality of microstrip connectors 200 extend from the plurality of bonding holes in a one-to-one correspondence; and a plurality of bonding toolings 300 are detachably connected to the tail pins of the plurality of microstrip connectors 200 in a one-to-one correspondence;

[0081] like Figure 7 and Figure 8 As shown, Figure 7 Schematic diagram of the structure of the bonding tool provided by an embodiment of the present invention; Figure 8 It is a schematic diagram of the partial structure of the bonding tool provided in an embodiment of the present invention.

[0082] In this embodiment, each bonding fixture 300 includes a fixed section 310 and an extended section 320 that are connected. The fixed section 310 is disposed in the bonding hole and is transitionally fitted or tightly fitted with the tail pin of the microstrip connector 200 .

[0083] For example, the cavity housing 100 may be made of aluminum alloy with a silver-plated surface for easy welding.

[0084] Illustratively, the bonding holes provided on the cavity housing 100 are clearance-fitted with the outer surface of the fixing section 310 of the bonding tool 300 , adapting to the high-density integration requirements of the small microstrip connector 200 and facilitating the installation and removal of the bonding tool 300 .

[0085] In an optional embodiment, the ratio between the length and the diameter of the tail pin of the microstrip connector 200 is greater than or equal to 2.

[0086] In an optional embodiment, the fixing section 310 and the extension section 320 are both made of flexible non-metallic materials. An open positioning hole is provided on one side of the fixing section 310. The opening angle of the positioning hole is The range is 10~12°.

[0087] For example, the tail pin diameter of the microstrip connector 200 may be set to 0.3 mm, and the length may be set to 1.3 mm, with the ratio between the length and the diameter being greater than 4.

[0088] Exemplarily, the surface roughness of the tail pin of the microstrip connector 200 is not less than 0.8, and the surface of the tail pin of the microstrip connector 200 is plated with soft gold (purity of 99.99%), and the thickness of the gold layer is greater than or equal to 2 μm.

[0089] Exemplarily, both the fixed section 310 and the extension section 320 are made of flexible non-metallic materials, such as non-metallic organic fluorine materials. Specifically, polytetrafluoroethylene (PTFE) can be used. PTFE has low material cost, is easy to process, and will not damage the surface coating of the tail pins of the microstrip connector 200. The non-metallic properties of the bonding tool 300 can protect the integrity of the surface coating of the tail pins of the microstrip connector 200 and maintain the conductive properties of the bonding surface. At the same time, the detachable design can also prevent the impact of tooling residue on the environmental resistance of the product.

[0090] For example, the fixing section 310 is inserted into the key hole of the cavity housing 100. For example, the length of the fixing section 310 is The outer portion of the fixed section 310 can be set to be circular, and its diameter size can be set to 1mm. It can be set to 0.7mm. The interior of the fixed section 310 can be set to a circle with a diameter of Can be set to 0.3mm.

[0091] Specifically, after the bonding tool 300 is fixed in place, the upper end surface of the fixing section 310 does not exceed the upper surface of the bonding hole provided on the cavity shell 100 to avoid affecting the bonding process.

[0092] Furthermore, in order to facilitate the clamping of the bonding tool 300, an open positioning hole is provided on one side of the fixed section 310, so that a certain deformation can be generated when the fixed section 310 clamps the tail pin of the microstrip connector 200, and it is convenient to load and remove. In this way, the bonding tool 300 and the tail pin of the microstrip connector 200 can form a tight fit or a transition fit, thereby achieving effective fixation.

[0093] The principle is that the bonding tool 300 is arranged between the cavity housing 100 and the tail pin of the microstrip connector 200, and the tail pin of the microstrip connector 200 originally exposed in the cavity housing 100 is wrapped by the fixed section 310, which can provide protection and support for the tail pin of the microstrip connector 200. During the gold wire bonding process, the tail pin of the microstrip connector 200 is protected from vibration under the external force of the bonding machine, and the bonding machine blade can apply stable pressure on the end face of the tail pin of the microstrip connector 200, thereby achieving a good bonding effect.

[0094] It can be understood that the bonding tool 300 of the present invention needs to be customized according to the actual size of the microstrip connector 200 and is suitable for multiple series and types of microstrip connectors 200. For example, it is not limited to RF coaxial connectors, but can also be extended to macro connectors, glass bead connectors and pin connectors, etc., and is not limited to semi-automatic or manual bonding machine equipment.

[0095] In addition, the bonding tool 300 may be provided as a single one, or as a plurality of bonding tools 300 arranged in parallel.

[0096] like Figure 9 and Figure 10 As shown, Figure 9 1 is a schematic structural diagram of another connector gold wire bonding device provided by an embodiment of the present invention; Figure 10 The embodiment of the present invention provides Figure 9 Schematic diagram of the structure at I in the figure.

[0097] In an optional embodiment, a plurality of bonding fixtures 300 are arranged side by side as a whole, and are used for batch wrapping and fixing of tail pins of multiple rows of microstrip connectors 200 .

[0098] Specifically, according to the structure of the cavity shell 100 and the bonding requirements of the microstrip connector 200, multiple bonding tooling 300 can be arranged in parallel to form a combined arrangement clamping tooling or a multi-clamping tooling. When in use, the bonding tooling 300 arranged in parallel as a whole is used in conjunction with the cavity shell 100 and the tail pins of multiple microstrip connectors 200 to support the synchronous fixation of the tail pins of multiple rows of microstrip connectors 200, which significantly improves the process efficiency in high-density bonding scenarios.

[0099] The connector wire bonding device provided by this invention actively controls the suspended deformation of the microstrip connector's tail pins through a physical constraint mechanism. By integrating a detachable bonding fixture with the cavity housing, the device achieves structural dynamic support for the tail pins of high-aspect-ratio microstrip connectors. The bonding fixture wraps around the microstrip connector's tail pins with a transitional or tight fit, creating a stable mechanical transmission path during the bonding process, counteracting vibration and bending deformation caused by ultrasonic impact loads.

[0100] It should be noted that, in this document, relational terms such as first and second are used solely to distinguish one entity or operation from another, and do not necessarily require or imply any actual relationship or order between these entities or operations. Furthermore, the terms "comprise," "include," or any other variations thereof are intended to encompass non-exclusive inclusion, such that an article or device comprising a list of elements includes not only those elements but also other elements not explicitly listed. Without further limitation, an element defined by the phrase "comprising a..." does not preclude the presence of additional identical elements in the article or device comprising the element. Terms such as "connected" or "connected" are not limited to physical or mechanical connections but may include electrical connections, whether direct or indirect. References to orientations or positional relationships, such as "upper," "lower," "left," and "right," are based on the orientations or positional relationships shown in the accompanying drawings and are intended solely to facilitate description and simplify the description of the present invention. They do not indicate or imply that the device or element referred to must have, be constructed, or operate in a specific orientation, and are therefore not to be construed as limiting the present invention.

[0101] The above is a further detailed description of the present invention in conjunction with specific preferred embodiments, and the specific implementation of the present invention should not be considered to be limited to these descriptions. For those skilled in the art of the present invention, without departing from the concept of the present invention, several simple deductions or substitutions can be made, which should be considered to fall within the scope of protection of the present invention.

Claims

1. A connector gold wire bonding method, characterized in that: include: Clean the area to be bonded and solder the microstrip connector to the cavity housing; Wrap and fix the tail pin of the microstrip connector, and perform gold wire bonding on the tail pin of the microstrip connector and the PCB board, wherein wrap and fix the tail pin of the microstrip connector, including: preparing a bonding tool according to the bonding area between the cavity shell and the microstrip connector; press-fitting the bonding tool into the cavity shell so that the upper end surface of the bonding tool and the cavity shell is not higher than the upper surface of the cavity shell; wrap and fix the tail pin of the microstrip connector by the bonding tool; the bonding tool includes a fixed section and an extension section that are interconnected, the fixed section is press-fitted with the cavity shell, and wraps and fixes the tail pin of the microstrip connector; the extension section extends out of the cavity shell; The tail pins of the microstrip connector are unwrap-fixed, the bonding area is cleaned, and the gold wire bonding is completed.

2. The connector gold wire bonding method according to claim 1, characterized in that: Cleaning the area to be bonded and welding the microstrip connector to the cavity housing includes: Cleaning the cavity housing and the tail pins of the microstrip connector respectively with a degreasing cleaning agent, and baking them at a temperature of 240° C. for at least 5 minutes after cleaning; After baking, the microstrip connector is soldered to the cavity housing by reflow soldering, and the temperature range of the reflow soldering is 240-260°C.

3. The connector gold wire bonding method according to claim 1, wherein: Performing gold wire bonding on the tail pin of the microstrip connector and the PCB board includes: Setting bonding parameters, performing gold wire bonding on the tail pin of the microstrip connector and the PCB board according to the preset bonding parameters, wherein the bonding parameters are: bonding pressure range of 13~30g, bonding power range of 140~170mW, bonding time range of 50~80ms, and ultrasonic energy parameter of 130LSB.

4. The connector gold wire bonding method according to claim 1, wherein: Unwrapping and fixing the tail pins of the microstrip connector and cleaning the bonding area include: The bonding tool is taken out through the extension section, and the bonding area is cleaned with anhydrous ethanol to ensure that there is no residue in the bonding area and the cavity shell.

5. A connector gold wire bonding device, characterized in that: The connector gold wire bonding method according to any one of claims 1 to 4, the device comprises: a cavity housing, a microstrip connector and a bonding tool, wherein: The plurality of microstrip connectors are fixedly connected to the cavity housing; the cavity housing is provided with a plurality of bonding holes, the tail pins of the plurality of microstrip connectors extend out from the plurality of bonding holes in a one-to-one correspondence, and the plurality of bonding fixtures are detachably connected to the tail pins of the plurality of microstrip connectors in a one-to-one correspondence; Each of the bonding fixtures comprises a fixed section and an extension section that are connected to each other. The fixed section is arranged in the bonding hole and is transitionally fitted or tightly fitted with the tail pin of the microstrip connector.

6. The connector gold wire bonding device according to claim 5, characterized in that: The ratio between the length and diameter of the tail pin of the microstrip connector is greater than or equal to 2.

7. The connector gold wire bonding device according to claim 5, characterized in that: The fixing section and the extending section are both made of flexible non-metallic materials. An open positioning hole is provided on one side of the fixing section, and the opening angle range of the positioning hole is 10-12°.

8. The connector gold wire bonding device according to claim 5, characterized in that: A plurality of the bonding fixtures are arranged in parallel as a whole, and are used for batch wrapping and fixing of tail pins of multiple rows of the microstrip connectors.

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