PCSEL array lead bonding integration method and system

Abstract

The invention relates to the technical field of lead bonding, in particular to a PCSEL array lead bonding integration method and system, and the method comprises the steps: positioning a PCSEL array, bonding one end of a photon lead bonding array with a surface-emitting light outlet of the PCSEL array, and carrying out the bonding of the photon lead bonding array and the surface-emitting light outlet of the PCSEL array in the process of carrying out the lead bonding of a PCSEL array sample, obtaining parameter values of the next batch of PCSEL array samples according to the change characteristics of the bonding parameters in the lead bonding process and the difference between the positioning information and the original positioning information; and after the waveguide array is positioned, bonding the other end of the photon lead bonding array with the waveguide array. According to the invention, the bonding parameter value is adjusted, and the quality of lead bonding integration is improved.

Description

Technical Field

[0001] The present application relates to the technical field of wire bonding, and particularly to a method and system for integrating wire bonding of a PCSEL array. Background Art

[0002] With the rapid development of globalization and technology, the amount of data to be processed is increasing sharply, and the corresponding data processing models and algorithms are also increasing continuously. As a result, the requirements for computing power and power consumption are constantly rising. Optical computing technology has natural parallel processing capabilities and mature wavelength division multiplexing technology, which can greatly improve the data processing capacity, capacity, and bandwidth; the power consumption of optical computing is expected to be as low as 10-18 J / bit, and at the same power consumption, photonic devices are hundreds of times faster than electronic devices. Photonic integration technology integrates optical devices on a single chip and is the core of the future photonic era.

[0003] At present, materials such as silicon, lithium niobate, and silicon nitride are commonly used materials for mainstream optical chip integration platforms. However, these materials are all indirect bandgap materials and have great difficulties in meeting the on-chip high-power optical requirements. In view of this, introducing III-V materials into the photonic integration platform has become a research hotspot in the current scientific research field. Photonic Crystal Surface-emitting Lasers (PCSELs) are regarded as key light source devices in the field of photonic integration due to their many advantages such as small size, high output power, good temperature stability, and broad spectral range.

[0004] During the integration process of PCSELs, in order to achieve on-chip integration, it is necessary to input them into the grating coupler at a specific angle, which inevitably involves the wire bonding process. In the automated wire bonding process, the docking and bonding processes are extremely vulnerable to various factors, and the position deviation and the variation difference of the bonding parameters have particularly significant effects. In the existing process treatments for the wire bonding integration of PCSELs, due to the differences in bonding materials and process conditions, obvious deviations will occur in the wire bonding positions. This not only makes it difficult to guarantee the quality of the wire bonding integration for the PCSEL array, but also greatly increases the difficulty of the integration process, hindering the wide application of PCSELs in the field of photonic integration. Summary of the Invention

[0005] In view of the above, it is necessary to provide a method and system for integrating wire bonding of a PCSEL array to solve the above problems.

[0006] The first aspect of the present application provides a method for integrating wire bonding of a PCSEL array. The integrated structure of the wire bonding of the PCSEL array includes: a substrate layer, an insulating layer, a waveguide array, a metal layer, a PCSEL array, and a photonic wire bonding array; there is a groove on one side of the substrate layer; the insulating layer is disposed on the substrate layer; the waveguide array is disposed on the insulating layer, connected to the groove and located on one side of the groove; the metal layer is disposed on the substrate layer lining the groove of the substrate layer; the PCSEL array is located on the metal layer; Locate the PCSEL array, and based on the position difference between the positioning information and the preset position information, obtain the position deviation values of all bonding positions; bond one end of the photonic wire bonding array to the light-emitting port on the surface of the PCSEL array. During the process of wire bonding of the PCSEL array sample, measure the bonding parameter data; based on the weights corresponding to each bonding parameter data of all PCSEL array samples in the same batch, obtain the state sample set; Based on the distance between any two PCSEL array samples in the state sample set, combined with the difference between the position deviation values, obtain the distance determination result between the two PCSEL array samples; cluster the state sample set, compare the change of each bonding parameter in each cluster with the preset parameter value, and the proportion of each cluster in the bonding process, obtain the parameter adjustment value of the next batch of PCSEL array samples, and obtain the parameter values of the next batch of PCSEL array samples; After positioning the waveguide array, bond the other end of the photonic wire bonding array to the waveguide array.

[0007] Wherein, the photonic wire bonding array is divided into a coupling part and a transmission part.

[0008] Wherein, the positioning of the PCSEL array is specifically: Collect images of the light-emitting port on the surface of the PCSEL array; based on the shape information of the light-emitting port on the surface of the PCSEL array, use template matching to obtain the position information of the light-emitting port of the PCSEL array in the image, map it to a two-dimensional coordinate system, and combine triangulation and camera parameters to position the PCSEL array.

[0009] Wherein, bond the coupling part of the photonic wire bonding array to the light-emitting port on the surface of the PCSEL array.

[0010] Wherein, the process of obtaining the state sample set is: Based on the numerical size of each bonding parameter of each PCSEL array sample among all PCSEL array samples, assign weights to each bonding parameter, map the weighted values to a multi-dimensional space as the mapping result of each PCSEL array sample, and use the set composed of the mapping results of all batches of PCSEL array samples as the state sample set.

[0011] Among them, the step of obtaining the distance determination result between any two PCSEL array samples is as follows: Take the sequence composed of the position deviation values of all bonding positions of the PCSEL array as the deviation sequence; Obtain the distance metric between any two PCSEL array samples in the state sample set; calculate the difference between the deviation sequences of the wire bonding integration processes of the any two PCSEL array samples; take the result of positively fusing the distance metric and the difference as the distance determination result between the any two PCSEL array samples.

[0012] Among them, the specific formula for obtaining the parameter adjustment value of the next batch of PCSEL array samples is: ; where represents the adjustment amount of the t-th bonding parameter, represents the difference between the preset parameter value of the t-th bonding parameter and the mean value of the t-th bonding parameter of all PCSEL array samples in the i-th clustering cluster; represents the number of PCSEL array samples in the i-th clustering cluster; represents the number of all PCSEL array samples, and n represents the number of clustering clusters.

[0013] Among them, the parameter value of the next batch of PCSEL array samples is specifically the sum value of the parameter value before the adjustment of each bonding parameter and the adjustment amount.

[0014] Among them, bond the transmission part of the photon wire bonding array with the waveguide array.

[0015] In a second aspect, an embodiment of the present application further provides a PCSEL array wire bonding integration system for implementing the above-mentioned PCSEL array wire bonding integration method. The system includes a hardware part and a software part. Among them, the hardware part includes: A vision recognition system for positioning the PCSEL array and the waveguide array and obtaining the position deviation values of all bonding positions; A bonding device for bonding one end of the photon wire bonding array to the surface emitting light port of the PCSEL array and bonding the other end of the photon wire bonding array to the waveguide array; A control system for obtaining the state sample set based on the weights corresponding to the data of each bonding parameter of all PCSEL array samples in the same batch; Based on the distance between any two PCSEL array samples in the state sample set, and combining the differences between the position deviation values, obtain the distance determination result between the any two PCSEL array samples; cluster the state sample set, compare the changes of each bonding parameter in each cluster with respect to the preset parameter values, and the proportion of each cluster in the bonding process, obtain the parameter adjustment values of the next batch of PCSEL array samples, and obtain the parameter values of the next batch of PCSEL array samples; A detection device for quality detection of the bonding position; The software part includes: An image recognition and processing software for automatic recognition, positioning and calibration of PCSEL arrays, waveguide arrays and photon lead bonding arrays; A data management and analysis software for storing, managing and analyzing the data in the bonding process; A bonding control software for setting parameter values and controlling the start and stop of the bonding device.

[0016] This application has at least the following beneficial effects: When facing the PCSEL array lead bonding integration process, considering that the existing lead bonding integration process has a large integration difficulty, and the position deviation in the lead bonding process of the same batch has a great influence on the stability and quality of the bonding process, resulting in poor lead bonding integration quality of the PCSEL array by the existing methods; therefore, this application specifically sets adjustment nodes for the preset bonding parameters for the bonding quality differences caused by the same batch of bonding position deviations under the preset bonding parameters, and based on the bonding data of the PCSEL array samples before the adjustment nodes, makes an effective division. The division process fully considers the bonding position differences and the response differences of the real-time collected bonding parameters in the bonding process, and then comprehensively considers the comprehensive differences of the bonding parameters caused by the position deviation, and makes a phased adjustment of the bonding parameters, reducing the influence of the bonding position differences of the samples under the preset bonding parameters in the same batch on the bonding quality; at the same time, through the lead bonding integration method of this application, the on-chip integration of the PCSEL array can be realized, with low process difficulty, strong practicability, and can be applied to large-scale production. Description of the Drawings

[0017] Figure 1 It is a step flow chart of a PCSEL array lead bonding integration method provided by an embodiment of this application; Figure 2 It is a paraxial schematic diagram of a PCSEL array lead bonding integration structure provided by an embodiment of this application; Figure 3 It is a top view of a PCSEL array lead bonding integration structure provided by an embodiment of this application; Figure 4 Schematic diagram of the paraxial region of a laser in a PCSEL array provided by an embodiment of the present application; Figure 5 Cross-sectional view of a laser in a PCSEL array provided by an embodiment of the present application; Figure 6 Top view of the cross-section of a grating layer provided by an embodiment of the present application. Detailed implementation manners

[0018] In the description of the embodiments of the present application, words such as "exemplary", "or", "for example" are used to indicate examples, illustrations or explanations. Any embodiment or design solution described as "exemplary" or "for example" in the embodiments of the present application should not be construed as being more preferred or having more advantages than other embodiments or design solutions. Rather, the use of words such as "exemplary", "or", "for example" is intended to present related concepts in a specific manner.

[0019] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the technical field to which this application belongs. The terms used in the description of this application are only for the purpose of describing specific embodiments and are not intended to limit this application.

[0020] In addition, it should be noted that the terms "first", "second" in this application and the accompanying drawings are used to distinguish similar objects and are not used to describe a specific order or sequence. For the methods disclosed in the embodiments of the present application or the methods shown in the flowcharts, including one or more steps for implementing the methods, without departing from the scope of protection of this application, the execution order of multiple steps can be interchanged with each other, and some steps can also be deleted.

[0021] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the technical field to which this application belongs.

[0022] The following specifically describes the specific solution of a PCSEL array wire bonding integration method and system provided by this application with reference to the drawings.

[0023] Please refer to Figure 1 , which shows a flowchart of the steps of a PCSEL array wire bonding integration method provided by an embodiment of the present application. The method includes the following steps: S1. Preliminary preparation S101. Structural composition: As Figure 2As shown in the figure, the PCSEL array wire bonding integrated structure in this application includes: a substrate layer 1, an insulating layer 2, a waveguide array 3, a metal layer 4, a PCSEL array 5, and a photonic wire bonding array 6. One side of the substrate layer 1 has a groove. The insulating layer 2 is disposed on the substrate layer 1 and has the same area as the substrate layer 1. The waveguide array 3 is disposed on the insulating layer 2, is connected to the groove, and is located on one side of the groove. The metal layer 4 is disposed on the substrate layer 1 in the groove of the substrate layer 1, and its area is slightly smaller than that of the groove, and is used to power the PCSEL array 5 and serve as the metal bonding medium of the PCSEL array 5. The PCSEL array 5 is located on the metal layer 4 and serves as an on-chip light source. One end of the photonic wire bonding array 6 is connected to the PCSEL array 5, and the other end is connected to the waveguide array 3, and is used to transmit and couple the light of the PCSEL array into the waveguide array, and finally realize the introduction of the on-chip light source.

[0024] As Figure 3 shown, the photonic wire bonding array 6 respectively guides the lasers in the PCSEL array 5 into the waveguide array 3, and the number of the photonic wire bonding array 6 is the same as that of the PCSEL array 5 and the waveguide array 3.

[0025] As Figure 4 shown, the PCSEL array 5 is composed of multiple lasers. The laser includes a PCSEL layer 51; an adhesion layer 52, which is located on the PCSEL layer 51 and serves as a medium to connect the PCSEL layer 51 and the grating layer 53; a grating layer 53, which is located on the adhesion layer 52 and is used to focus the light spot; a buffer layer 54, which is located on the grating layer and is used to transition the light spot and is connected to the photonic wire bonding array 6.

[0026] As Figure 5 shown, the photonic wire bonding array 6 can be divided into a coupling part 61 and a transmission part 62. The coupling part 61 is frustum-shaped and is used to couple and transmit the light spot to the transmission part 62 to improve the optical coupling efficiency; the transmission part 62 guides the light from the coupling part to the waveguide array 3.

[0027] As Figure 6 shown, the grating layer 53 can be divided into a first material 531 and a second material 532. The center of the grating layer is a cylinder composed of the first material 531, and the outermost side is filled with the first material 531. The center is composed of a ring formed by alternating the first material 531 and the second material 532. The radial width of the first material 531 decreases from the center to the outside, and the radial width of the second material 532 increases from the center to the outside.

[0028] S102, Material Preparation: Prepare the materials required for the substrate layer, insulation layer, waveguide array, metal layer, PCSEL array, and photon wire bonding array. Specifically, in this application, the substrate layer material is selected as silicon, the insulation layer material is silicon oxide, and the waveguide array material can be selected from silicon, lithium niobate, and silicon nitride; the metal layer material is gold; the optional materials for the PCSEL layer include but are not limited to the GaAs material system and the InP material system; the adhesion layer uses BCB material; the first material of the grating layer is silicon with a high refractive index, and the second material is silicon oxide or silicon oxynitride with a low refractive index, which can be disposed on the adhesion layer through microtransfer printing technology or bonding technology; the photon wire bonding array material is photoresist; the buffer layer material is silicon oxide or silicon oxynitride.

[0029] S103, Device Pretreatment: Perform photolithography on the substrate layer to define the grooves and ensure the flatness of the groove bottom; the insulation layer completely covers the surface of the substrate layer, and the grooves are hollowed out; the waveguide array is formed by photolithography definition and etching; the metal layer is grown on the substrate layer in the grooves by magnetron sputtering, and the area is slightly smaller than the grooves. The PCSEL array is a conventional PCSEL structure. The PCSEL array is a laser matrix formed by multiple PCSEL lasers, and its light output direction is vertically upward; in the grating layer, after defining the shape of the first material by DUV or EUV lithography, the second material can be filled into the slits of the first material through PECVD technology and chemical mechanical polishing technology. The minimum radial width of the second material does not exceed 14 nm. The grating layer, as a refractive index gradient lens, can reduce the spot size and thus couple into the photon wire bonding array; the photon wire bonding array is prepared by photon wire bonding technology.

[0030] S104, Equipment Debugging: Debug the wire bonding automatic control equipment, including presetting appropriate bonding parameters, where the bonding parameters include but are not limited to bonding pressure, bonding time, bonding temperature, and ultrasonic power; specifically, in this application, the preset bonding pressure is set to 5 - 20 cN, the preset bonding time is 10 - 50 ms, the preset bonding temperature is 150 - 300 °C, and the ultrasonic power is 20 - 80 mW. In this embodiment, the preset bonding pressure for the first batch is 15 cN, the preset bonding time is 30 ms, the preset bonding temperature is 250 °C, and the preset ultrasonic power is 50 mW.

[0031] S2, Bonding Process S201, Positioning and Calibration: Use the visual recognition system in the automatic control technology to accurately position the PCSEL array and the waveguide array.

[0032] (1)Image acquisition: The high-resolution industrial camera in the vision recognition system works in coordination with the light source. The light source is turned on in advance to provide a clear environment for imaging, reducing the interference of shadows and reflections, and ensuring that the details and features of the light-emitting ports and waveguide arrays emitted from the PCSEL array surface can be clearly presented in the images captured by the camera. According to factors such as the size, shape, material of the PCSEL array and waveguide array, and their contrast with the background, the parameters of the industrial camera, such as the aperture size, focal length, and exposure time, are finely adjusted to make the key features such as the contours and marking points of the PCSEL array and waveguide array clearly imaged. After the preparation work is completed, the industrial camera captures images of the light-emitting ports and waveguide arrays emitted from the PCSEL array surface according to the set parameters.

[0033] (2)Obtaining position information based on the captured images: The images captured by the industrial camera are quickly transmitted to the image processor through the HDMI data transmission interface. After receiving the images, the image processor first uses a filtering algorithm. In this embodiment, the median filtering algorithm is used to remove the noise in the images and improve the image quality; then the histogram equalization algorithm is used to highlight the key features such as the edges and contours of the PCSEL array and waveguide array, facilitating subsequent feature extraction and analysis. In this application, an identification algorithm based on template matching is adopted. According to the standard shape and size of the light-emitting ports emitted from the known PCSEL array surface, corresponding templates are made, and their positions are determined in the images through template matching. For the PCSEL array, the shape, size, color, and texture features of its light-emitting ports are identified; for the waveguide array, its specific marking points (bonding positions) and boundary contour features are extracted. It should be noted that the median filtering algorithm, the histogram equalization algorithm, and the identification algorithm based on template matching are all well-known existing technologies, and this application will not elaborate on them.

[0034] According to the above-mentioned extracted features, combined with the pre-set coordinate system and geometric model, the actual positions of the PCSEL array and waveguide array in the images are calculated. Taking the center of the image as the coordinate origin, according to the intercepts of the connection line between the light-emitting port and the coordinate origin on the two coordinate axes, and the intercepts of the connection line between the marking point and the coordinate origin on the two coordinate axes, respectively, their two-dimensional coordinate positions in the image are marked. Then, using the triangulation method and combining the parameters of the camera, the two-dimensional coordinates are converted into three-dimensional coordinates in the actual space, so as to obtain the accurate position information of the PCSEL array and waveguide array in the actual working space.

[0035] Compare the obtained positioning information of the PCSEL array and the waveguide array with the preset position information, calculate the translation deviation (such as the displacement in the X, Y, and Z directions) and the rotation deviation (such as the rotation angles around the X, Y, and Z axes), which provides a basis for automatically adjusting the position of the bonding device. The position deviation value corresponding to each position includes the translation deviation and the rotation deviation. According to the calculated position deviation value, automatically adjust the position of the bonding device to ensure that both ends of the photon lead bonding array can accurately dock with the light-emitting ports emitted from the surface of the PCSEL array and the waveguide array, ensuring high-precision bonding.

[0036] S202, bonding of the photon lead bonding array: Control the bonding device to accurately bond one end (the frustum-shaped coupling part) of the photon lead bonding array to the light-emitting port emitted from the surface of the PCSEL array. The bonding process strictly follows the preset bonding parameters to ensure firm bonding without damaging the device. Subsequently, bond the transmission part of the photon lead bonding array to the waveguide array along the designed path to achieve one-to-one correspondence connection. During the bonding process, in this application, the bonding quality is monitored and adjusted in real time with the PCSEL array as an example.

[0037] (1) Real-time monitoring during the bonding process: Real-time monitor the bonding pressure through a pressure sensor to ensure its stability, and the pressure data is fed back to the control system in real time. Use a temperature sensor to collect the temperature information of the bonding area in real time and transmit it to the control system to ensure that the bonding temperature is within a suitable range. Use a power sensor to collect the ultrasonic power information of the bonding area in real time and transmit it to the control system to ensure that the ultrasonic power is within a suitable range.

[0038] (2) Control and adjustment of bonding parameters: The control system takes an industrial computer as the core and combines a programmable logic controller to automate the entire bonding process. According to the data fed back by the pressure sensor, power sensor, and temperature sensor, when the bonding pressure, ultrasonic power, or temperature deviates from the preset range, the control system automatically adjusts the bonding device to restore the bonding pressure and temperature to the preset values, ensuring the stable progress of the bonding process. Considering that in the actual lead bonding process, the situations vary when different PCSEL arrays are integrated by lead bonding, and the connection position deviation will affect the bonding effect, so the bonding parameter data characteristics of each batch of PCSEL array samples are used to adjust the parameters of the next batch of PCSEL array samples.

[0039] First, determine the node positions for adjusting the preset bonding parameters of a preset number of PCSEL array samples. For example, if the preset number is 10,000, then for every 500 samples produced as a batch, an optimization adjustment of the preset bonding parameters is performed. During the wire bonding integration process of each PCSEL array sample, after completing the wire bonding pairing and bonding operations, save the bonding parameter data during the bonding process and the position deviation values during the positioning and calibration process. The sequence composed of all position deviation values is used as the deviation sequence of each PCSEL array sample to compare the translational deviation and rotational deviation differences at different positions during the bonding process of different samples. Organize the collected bonding parameter data of each type in ascending order of time to form a bonding parameter sequence, and use the objective weighting method to obtain the weight value of each bonding parameter. The magnitude of the weight value reflects the response degree of the corresponding bonding parameter during the wire bonding process to deviate from the normal and stable bonding process due to the bonding position deviation. The weight values of each bonding parameter obtained during the wire bonding integration process of the preset number of PCSEL array samples form a state response array, which reflects the parameter response characteristics of the wire bonding process of each PCSEL array sample caused by the position deviation.

[0040] To accurately analyze the variation characteristics of the wire bonding state during the integration process of PCSEL array samples in the same batch under different bonding parameters, map the PCSEL array samples in the same batch into a three-dimensional space for clustering division. Use the data in the state response array corresponding to each PCSEL array sample as the X-axis, Y-axis, and Z-axis coordinates respectively, and use the mapping result as the state sample set. Determine the distance judgment result between samples through the position deviation during the actual bonding process: obtain the distance metric between any two PCSEL array samples in the state sample set; calculate the difference between the deviation sequences of the wire bonding integration processes of the any two PCSEL array samples; use the result of the positive fusion of the distance metric and the difference as the distance judgment result between the any two PCSEL array samples.

[0041] In this embodiment, the Euclidean distance is used as the distance metric between samples, which reflects the difference in the state responses of different PCSEL array samples; the Manhattan distance is used to calculate the difference between sequences; and the positive fusion result of multiple variables is calculated by the multiplication method.

[0042] It should be understood that the larger the calculated distance determination result is, it indicates that during the wire bonding process of two PCSEL array samples, due to the connection position deviation, the response deviation of different bonding parameters will increase, which will make the difference in wire bonding effect more significant, and the reference value of the bonding parameter adjustment for the same batch will also decrease accordingly. Therefore, the density peak clustering algorithm can be used to cluster and divide the state sample set, calculate the mean value of each bonding parameter of all PCSEL array samples within each cluster during the wire bonding process, and then obtain the difference between the preset bonding parameter value and this mean value. It should be noted that the density peak clustering algorithm is a well-known existing technology, and this application will not elaborate on it.

[0043] Based on the overall change difference of each bonding parameter in each cluster compared with the preset parameter value, and the proportion of this cluster during the bonding process, preset the parameter values for the next batch. This is because the more PCSEL array samples with the same bonding parameter change, it means that more samples are affected by the connection position deviation, which also means that the bonding parameter change of the same batch is more affected by the position deviation, and the difference in bonding effect is more obvious. Therefore, when presetting the bonding parameters, the greater the influence degree of the same batch by the bonding position deviation of the PCSEL array, the higher the possibility of bonding deviation; accordingly, obtain the adjustment amount of each bonding parameter, and its formula form is: ; where represents the adjustment amount of the t-th bonding parameter, represents the difference between the preset bonding parameter value of the t-th bonding parameter and the mean value of the t-th bonding parameter of all PCSEL array samples in the i-th cluster; represents the number of PCSEL array samples in the i-th cluster; represents the number of all PCSEL array samples, and n represents the number of clusters.

[0044] Based on the adjustment amount of each bonding parameter, according to the formula ; adjust the preset bonding parameters for the wire bonding integration of the PCSEL array in the same batch, where represents the value of the t-th bonding parameter after adjustment, represents the value of the t-th bonding parameter before adjustment; represents the adjustment amount of the t-th bonding parameter; if the adjustment amount of the bonding parameter during the bonding process exceeds the reasonable range, stop the bonding process, prompt the operator to check and handle, or directly perform re-bonding.

[0045] S203, Quality Inspection and Adjustment: After bonding is completed, automatic detection technology is used to inspect the quality of the bonding points. Specifically, an ultrasonic scanning microscope is used to detect whether there are defects such as voids and cracks inside the bonding points; a tensile testing device is used to detect whether the bonding strength meets the standards.

[0046] S3, Post-processing S301, Encapsulation Protection: The wire bonding integrated structure of the PCSEL array after bonding is encapsulated with epoxy resin to effectively protect the bonding area and the entire integrated structure, preventing adverse effects on its performance from external environmental factors.

[0047] S302, Performance Testing: Comprehensive performance testing is carried out on the integrated device, including testing parameters such as optical transmission efficiency, coupling efficiency, and power loss. The test results are compared with the expected indicators to evaluate the effectiveness of the integration scheme. If the performance does not meet the expectations, the reasons are analyzed in depth and the integration method is optimized and improved.

[0048] Based on the same inventive concept as the above method, the embodiment of the present application also provides a wire bonding integration system for a PCSEL array, including: 1. Hardware part (1) Vision Recognition System: Composed of a high-resolution image acquisition device (such as an industrial camera), an image processor, and a light source. The image acquisition device is responsible for obtaining the position and shape information of the PCSEL array, waveguide array, and photon wire bonding array; the image processor processes and analyzes the acquired images to calculate the deviation between the actual position and the ideal position of each device; the light source is used to provide a clear imaging environment to ensure the accuracy of image acquisition.

[0049] (2) Bonding Device: A high-precision wire bonder with an automatic control function, which can precisely control parameters such as the movement trajectory, bonding pressure, bonding time, and bonding temperature of the bonding device. The bonding device needs to adapt to the bonding requirements of the photon wire bonding array and can flexibly replace different types of bonding tools.

[0050] (3) Detection Devices: An ultrasonic scanning microscope, a tensile testing device, an optical power meter, etc. The ultrasonic scanning microscope is used to detect internal defects of the bonding points; the tensile testing device detects the bonding strength; the optical power meter is used to test the optical transmission performance of the integrated device.

[0051] (4) Control system: With an industrial computer as the core, combined with a programmable logic controller (PLC), it realizes the automatic control of the entire bonding process. It receives data from the vision recognition system and detection equipment, controls the actions of the bonding equipment according to preset programs and algorithms, adjusts the bonding parameters, and realizes the system's fault diagnosis and alarm functions; specifically, the bonding parameter control during the wire bonding process is carried out through real-time feedback control by the programmable logic controller; and the adjustment of the preset bonding parameters during the production process of the same batch is calculated and adjusted according to the set adjustment nodes.

[0052] 2. Software part (1) Image recognition and processing software: Responsible for processing the images collected by the vision recognition system, and realizing the automatic recognition, positioning and calibration of the PCSEL array, waveguide array and photon wire bonding array. It adopts advanced image recognition algorithms to improve the recognition accuracy and speed, and ensure the accuracy of the bonding position.

[0053] (2) Data management and analysis software: Stores, manages and analyzes the data during the bonding process (including bonding parameters, detection data and performance test data). Through data analysis, it summarizes the bonding data characteristics of the PCSEL array samples in the same batch, and adjusts the preset bonding parameters at different adjustment nodes for the bonding difference characteristics caused by the position deviation of the PCSEL array samples in the same batch. At the same time, it generates production reports to facilitate the traceability and management of the production process.

[0054] (3) Bonding control software: Users can set bonding parameters, select bonding modes (manual or automatic), control the start and stop of the bonding equipment, etc. through this software. The software interface is simple and intuitive, which is convenient for operators to set parameters and monitor the process.

[0055] In summary, when facing the wire bonding integration process of the PCSEL array, considering that the existing wire bonding integration process has great integration difficulty, and the position deviation during the wire bonding integration process of the same batch has a great impact on the stability and quality of the bonding process, resulting in poor wire bonding integration quality of the PCSEL array by the existing methods; therefore, specifically aiming at the bonding quality difference caused by the bonding position deviation of the same batch under the preset bonding parameters in this application, adjustment nodes of the preset bonding parameters are set, and the bonding data of the PCSEL array samples before the adjustment nodes are effectively divided. The division process fully considers the bonding position difference and the response difference of the real-time collected bonding parameters during the bonding process, and then comprehensively considers the comprehensive difference of the bonding parameters caused by the position deviation, and adjusts the bonding parameters in stages to reduce the influence of the bonding position difference of the samples of the same batch under the preset bonding parameters on the bonding quality; at the same time, through the wire bonding integration method of this application, the on-chip integration of the PCSEL array can be realized, the process difficulty is low, the practicability is strong, and large-scale production applications can be carried out.

[0056] The flowcharts and block diagrams in the accompanying drawings illustrate the possible architectures, functions, and operations of systems, methods, and computer program products according to embodiments of the present application. In this regard, each block in the flowchart or block diagram may represent a module, a program segment, or a part of code, and the module, program segment, or part of code contains one or more executable instructions for implementing the specified logical function. In some alternative implementations, the functions marked in the block may occur in a different order than marked in the accompanying drawings. For example, two consecutive blocks may actually be executed substantially in parallel, and they may sometimes be executed in the reverse order, which may depend on the functions involved. In the descriptions corresponding to the flowcharts and block diagrams in the accompanying drawings, the operations or steps corresponding to different blocks may also occur in a different order than disclosed in the descriptions. Sometimes, there is no specific order between different operations or steps. For example, two consecutive operations or steps may actually be executed substantially in parallel, and they may sometimes be executed in the reverse order, which may depend on the functions involved. Each block in the block diagram and / or flowchart, and the combination of blocks in the block diagram and / or flowchart, can be implemented by a dedicated hardware-based system for performing the specified functions or actions, or can be implemented by a combination of dedicated hardware and computer instructions.

[0057] For those skilled in the art, it is obvious that the present application is not limited to the details of the above exemplary embodiments, and the present application can be implemented in other specific forms without departing from the basic characteristics of the present application. Therefore, from any point of view, the above embodiments of the present application should be regarded as exemplary and non-limiting; modifying the technical solutions recorded in the foregoing embodiments, or equivalently replacing some of the technical features, does not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present application, and should all be included within the protection scope of the present application.

Claims

1. A PCSEL array wire bonding integration method, characterized in that: The PCSEL array wire bonding integrated structure includes: a substrate layer, an insulating layer, a waveguide array, a metal layer, a PCSEL array, and a photon wire bonding array; a groove is provided on one side of the substrate layer; the insulating layer is arranged on the substrate layer; the waveguide array is arranged on the insulating layer, connected to the groove, and located on one side of the groove; the metal layer is arranged on the substrate layer in the groove of the substrate layer; the PCSEL array is located on the metal layer; Position the PCSEL array, and obtain the position deviation values ​​of all bonding positions based on the position difference between the positioning information and the preset position information; bond one end of the photon wire bonding array to the surface emission light outlet of the PCSEL array, and measure the bonding parameter data during the wire bonding process of the PCSEL array sample; obtain a state sample set based on the weight corresponding to each bonding parameter data of all PCSEL array samples in the same batch; Based on the distance between any two PCSEL array samples in the state sample set and the difference between the position deviation values, a distance determination result between the any two PCSEL array samples is obtained; the state sample set is clustered, and the changes between each bonding parameter in each cluster cluster and the preset parameter value are compared, as well as the proportion of each cluster cluster in the bonding process, and the parameter adjustment values ​​of the next batch of PCSEL array samples are obtained to obtain the parameter values ​​of the next batch of PCSEL array samples; After positioning the waveguide array, the other end of the photonic wire bonding array is bonded to the waveguide array.

2. A PCSEL array wire bonding integration method as claimed in claim 1, characterized in that: The photon wire bonding array is divided into a coupling part and a transmission part.

3. A PCSEL array wire bonding integration method as claimed in claim 1, characterized in that: The positioning of the PCSEL array is specifically as follows: The image of the light outlet of the PCSEL array surface is collected. Based on the shape information of the light outlet of the PCSEL array surface, the position information of the light outlet of the PCSEL array in the image is obtained by template matching, mapped to a two-dimensional coordinate system, and the PCSEL array is positioned by combining triangulation and camera parameters.

4. A PCSEL array wire bonding integration method as claimed in claim 2, characterized in that: The coupling part of the photon wire bonding array is bonded to the surface emission light outlet of the PCSEL array.

5. A PCSEL array wire bonding integration method as claimed in claim 1, characterized in that: The process of obtaining the state sample set is: Based on the numerical value of each bonding parameter of each PCSEL array sample among all PCSEL array samples, each bonding parameter is weighted, and the weighted value is mapped into a multidimensional space as the mapping result of each PCSEL array sample. The set consisting of the mapping results of all PCSEL array samples in the same batch is taken as a state sample set.

6. A PCSEL array wire bonding integration method as claimed in claim 1, characterized in that: The step of obtaining the distance determination result between any two PCSEL array samples is: A sequence consisting of position deviation values ​​of all bonding positions of the PCSEL array is used as a deviation sequence; Obtain a distance metric between any two PCSEL array samples in a state sample set; calculate the difference between the deviation sequences of the wire bonding integration process of the any two PCSEL array samples; and forwardly fuse the distance metric with the difference as a distance determination result between the any two PCSEL array samples.

7. A PCSEL array wire bonding integration method as claimed in claim 1, characterized in that: The specific formula for obtaining the parameter adjustment values ​​of the next batch of PCSEL array samples is: ;in, represents the adjustment amount of the t-th bonding parameter, represents the difference between the preset parameter value of the t-th bonding parameter and the mean value of the t-th bonding parameter of all PCSEL array samples in the i-th cluster; represents the number of PCSEL array samples in the i-th cluster; represents the number of all PCSEL array samples, and n represents the number of clusters.

8. A PCSEL array wire bonding integration method as claimed in claim 7, characterized in that: The parameter values ​​of the next batch of PCSEL array samples are specifically the sum of the parameter value of each bonding parameter before adjustment and the adjustment amount.

9. A PCSEL array wire bonding integration method as claimed in claim 1, characterized in that: Bond the transmission portion of the photonic wire bonding array to the waveguide array.

10. A PCSEL array wire bonding integration system, which implements a PCSEL array wire bonding integration method as claimed in claim 1, characterized in that: The system includes a hardware part and a software part, wherein the hardware part includes: A visual recognition system is used to locate the PCSEL array and waveguide array and obtain the position deviation values ​​of all bonding positions; A bonding device, used to bond one end of the photon wire bonding array to the surface emission light outlet of the PCSEL array, and to bond the other end of the photon wire bonding array to the waveguide array; A control system, for obtaining a set of state samples based on a weight corresponding to each bonding parameter data of all PCSEL array samples of the same batch; Based on the distance between any two PCSEL array samples in the state sample set and the difference between the position deviation values, a distance determination result between the any two PCSEL array samples is obtained; the state sample set is clustered, and the changes between each bonding parameter in each cluster cluster and the preset parameter value are compared, as well as the proportion of each cluster cluster in the bonding process, and the parameter adjustment values ​​of the next batch of PCSEL array samples are obtained to obtain the parameter values ​​of the next batch of PCSEL array samples; Inspection equipment for quality inspection of bonding locations; The software part includes: Image recognition and processing software for automatic recognition, positioning and alignment of PCSEL arrays, waveguide arrays and photonic wire-bond arrays; Data management and analysis software for storing, managing and analyzing data from the bonding process; Bonding control software is used to set parameter values ​​and control the start and stop of bonding equipment.

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