Filtering combined module

Abstract

The invention relates to a filtering combination module which comprises a shielding cover, a common mode inductor group, overline capacitors and four grounding capacitors, an inductor base is arranged in the shielding cover, the common mode inductor group is arranged on the upper surface of the inductor base, the overline capacitors are arranged on the lower surface of the inductor base, and the grounding capacitors are arranged on the upper surface of the inductor base. The four grounding capacitors are arranged on the two sides of the overline capacitor in pairs, a lead of the common mode inductor set is connected with leads of the grounding capacitors and the overline capacitor, and an insulating plate is arranged at the bottom of the shielding cover. The grounding capacitors are arranged on the two sides of the overline capacitor, the common-mode inductor group is arranged on the upper sides of the overline capacitor and the grounding capacitors, through integrated packaging in the vertical direction, the size occupied by overall board arrangement can be reduced, the installation technology requirement is reduced, therefore, the welding procedure is reduced, the technology cost is reduced, and the structure is especially suitable for high-density and small-sized electronic equipment. And the structure is optimized, various safety problems are avoided, and the filtering function is met.

Description

Technical Field

[0001] The present invention relates to the technical field of filters, and particularly to a filter combination module. Background Art

[0002] A filter is an electronic device or circuit used to selectively pass or block signals of specific frequencies, thereby filtering out noise or interference. It can isolate certain frequency components in the input signal and retain the required frequency components, and is widely used in fields such as audio processing, wireless communication, and signal processing to improve the signal quality and system performance.

[0003] Currently, filters are used independently in PCB plug-ins, but they occupy a relatively large area on the PCB, resulting in more soldering processes and increased process costs. Summary of the Invention

[0004] The purpose of the present invention is to provide a filter combination module that reduces the volume occupied by the overall circuit board layout and reduces the installation process requirements.

[0005] To achieve the above purpose, the technical solution of the present invention is as follows.

[0006] A filter combination module includes a shielding cover, a common-mode inductor group, a jumper capacitor, and a grounding capacitor. An inductor base is provided inside the shielding cover. The common-mode inductor group is arranged on the upper surface of the inductor base. The jumper capacitor is arranged on the lower surface of the inductor base. The number of grounding capacitors is four, and the four grounding capacitors are divided into two groups and respectively arranged on both sides of the jumper capacitor. Moreover, the leads of the common-mode inductor group are connected to the leads of the grounding capacitor and the jumper capacitor. An insulating board is provided at the bottom of the shielding cover.

[0007] Thus, the grounding capacitors are arranged on both sides of the jumper capacitor, and the common-mode inductor group is arranged above the jumper capacitor and the grounding capacitors. Through the vertical integrated packaging, it can reduce the volume occupied by the overall circuit board layout, reduce the installation process requirements, thus reducing the soldering process and lowering the process cost, and is particularly suitable for high-density and miniaturized electronic devices.

[0008] Furthermore, notch openings are provided on both sides of the bottom of the insulating board, and support feet are provided on both sides of the lower surface of the shielding cover. The support feet pass through the notch openings and extend to the lower side of the insulating board.

[0009] The outer surface of the support feet is tinned and soldered to the PCB board by plugging. On the one hand, it plays a role of mechanical fixation, and on the other hand, it plays a role of grounding to prevent the shielding cover from being charged and causing safety problems.

[0010] Furthermore, three side blocks are provided on both sides of the lower surface of the inductor base, and limiting grooves are opened on the outer surface of the side blocks.

[0011] The inductor base and the side blocks are of an integral structure, made of an insulating material, which is epoxy resin. It can increase the distance between the cross-line capacitor and the ground capacitor and the common-mode inductor group as well as the inductor core, reduce the influence of inductor heating on the cross-line capacitor and the ground capacitor, and the space between the two side blocks is used to limit the cross-line capacitor. The three limiting grooves on the same side are used to limit the ground capacitor, improving its stability.

[0012] Further, a placement groove is provided on the upper surface of the inductor base, and through grooves are provided at the four corners of the inductor base. The four leads of the common-mode inductor group respectively pass through the four through grooves and extend to the outside of the insulating board.

[0013] Through the setting of the placement groove, the inductor core of the common-mode inductor group can be limited, improving the stability of its structure. And through the setting of the through grooves, the leads of the common-mode inductor group can be limited, preventing displacement or loosening during operation, reducing the change in the lead position caused by vibration or impact, so as to maintain the stability and consistency of the whole component.

[0014] Further, an insulating pad is provided on the top of the common-mode inductor group.

[0015] The insulating pad is used to isolate the inductor magnetism from the shielding cover, playing an insulating role. The material of the insulating pad is polyester, which not only has good structural strength, avoiding insulation failure caused by damage during long-term use, but also has the characteristic of high temperature resistance and a long service life.

[0016] Further, the shielding cover is made of a metal material. The upper part of the shielding cover shrinks inward, and the inwardly shrinking part corresponds to the common-mode inductor group.

[0017] The metal material can shield the electromagnetic radiation brought by the inductor. And the material of the shielding cover is aluminum alloy, which has a low thermal resistance, fast heat conduction, is more conducive to the dissipation of internal heat, and is light in weight. The inwardly shrinking part can not only reduce the volume and weight, but also, due to the large heat generation of the common-mode inductor group, increase the heat dissipation effect on the common-mode inductor group.

[0018] Further, both sides of the bottom of the shielding cover extend into the notch and are on the same horizontal plane as the lower surface of the insulating board.

[0019] Since the bottom of the shielding cover is on the same horizontal plane as the lower surface of the insulating board, it is convenient to paste the board horizontally (PCB).

[0020] Further, potting compound is provided inside the shielding cover.

[0021] The material of the potting compound is silica gel, and the thermal conductivity coefficient ≥ 1.5W / mK, which is convenient for better dissipation of internal heat. Brief Description of the Drawings

[0022] Figure 1One of the three-dimensional structure diagrams of the present invention;

[0023] Figure 2 Another three-dimensional structure diagram of the present invention;

[0024] Figure 3 One of the internal structure diagrams of the present invention;

[0025] Figure 4 Another internal structure diagram of the present invention;

[0026] Figure 5 The structural diagram of the common mode inductor group of the present invention;

[0027] Figure 6 The structural diagram of the across-line capacitor and the ground capacitor of the present invention;

[0028] Figure 7 One of the structural diagrams of the inductor base of the present invention;

[0029] Figure 8 Another structural diagram of the inductor base of the present invention;

[0030] Figure 9 The structural diagram of the insulating board of the present invention;

[0031] Figure 10 The circuit diagram of the present invention;

[0032] Figure 11 The circuit structure diagram of the present invention.

[0033] In the figure: 100, shielding cover; 101, insulating board; 102, inductor base; 103, common mode inductor group; 104, across-line capacitor; 105, ground capacitor; 106, potting compound; 200, notch; 201, leg; 300, side block; 301, limiting groove; 400, placement groove; 401, through groove; 500, insulating pad. Detailed implementation manners

[0034] The present invention will be described in detail below with reference to the accompanying drawings.

[0035] As Figures 1-10As shown in the figure, a filtering combination module includes a shielding cover 100, a common-mode inductor group 103, a jumper capacitor 104, and a grounding capacitor 105. An inductor base 102 is arranged inside the shielding cover 100. The common-mode inductor group 103 is arranged on the upper surface of the inductor base 102. The jumper capacitor 104 is arranged on the lower surface of the inductor base 102. The number of grounding capacitors 105 is four. The four grounding capacitors 105 are divided into two groups and are respectively arranged on both sides of the jumper capacitor 104. And the leads of the common-mode inductor group 103 are connected to the leads of the grounding capacitor 105 and the jumper capacitor 104. An insulating plate 101 is arranged at the bottom of the shielding cover 100.

[0036] The grounding capacitor 105 is arranged on both sides of the jumper capacitor 104, and the common-mode inductor group 103 is arranged above the jumper capacitor 104 and the grounding capacitor 105. Through vertical integrated packaging, the volume occupied by the overall circuit board can be reduced, the installation process requirements can be reduced, so the welding process can be reduced, and the process cost can be reduced. It is especially suitable for high-density and miniaturized electronic devices, and the structure is optimized to avoid various safety problems and meet the filtering function.

[0037] In the common-mode inductor group 103, the magnetic core is made of high-permeability manganese-zinc material with a permeability of 10kμ. The high permeability is to increase the inductance, and the manganese-zinc is to make the inductance stable. The coil is made of enameled copper wire with a wire diameter of 1.5*2.0mm, aiming to reduce the heat generated during current conduction.

[0038] The jumper capacitor 104 and the grounding capacitor 105 are made of thin-film capacitors, and the thin-film material is polypropylene, with more stable performance.

[0039] The insulating plate 101 is made of insulating material, specifically PPS material, which is heat-resistant and anti-deformation. Its main function is to increase the creepage distance between the leads and the shielding cover 100 to meet the safety regulations requirements.

[0040] As Figure 11 shown in the figure, it is a circuit connection schematic diagram of the common-mode inductor group 103, the jumper capacitor 104, and the grounding capacitor 105. It is a single-phase circuit, with input on the left and output on the right. The two input phase lines are respectively grounded, then connected to the common-mode inductor, and then connected to the jumper filter capacitor. Finally, the two output phase lines are respectively grounded.

[0041] Specifically, notches 200 are arranged on both sides of the bottom of the insulating plate 101, and feet 201 are arranged on both sides of the lower surface of the shielding cover 100. The feet 201 pass through the notches 200 and extend to the lower side of the insulating plate 101. The outer surface of the feet 201 is tinned and is used for plug-in welding with the PCB board. On the one hand, it plays a role of mechanical fixation, and on the other hand, it plays a role of grounding to prevent the shielding cover 100 from being charged and causing safety problems.

[0042] Specifically, three side blocks 300 are provided on both sides of the lower surface of the inductor base 102. A limiting groove 301 is formed on the outer surface of the side block 300. The inductor base 102 and the side block 300 are of an integral structure and are made of an insulating material, which is epoxy resin. This can increase the distance between the jumper capacitor 104 and the ground capacitor 105 and the common-mode inductor group 103 as well as the inductor core, reduce the influence of inductor heating on the jumper capacitor 104 and the ground capacitor 105, and the space between the two side blocks 300 is used to limit the jumper capacitor 104, and the three limiting grooves 301 on the same side are used to limit the ground capacitor 105 to improve its stability.

[0043] Specifically, a placement groove 400 is provided on the upper surface of the inductor base 102, and through grooves 401 are provided at the four corners of the inductor base 102. The four leads of the common-mode inductor group 103 respectively pass through the four through grooves 401 and extend to the outside of the insulating board 101. Through the setting of the placement groove 400, the inductor core of the common-mode inductor group 103 can be limited to improve the stability of its structure, and through the setting of the through grooves 401, the leads of the common-mode inductor group 103 can be limited to prevent displacement or loosening during operation, reduce the change in the lead position caused by vibration or impact, and thus maintain the stability and consistency of the entire component.

[0044] Specifically, an insulating pad 500 is provided on the top of the common-mode inductor group 103. The insulating pad 500 is used to isolate the inductor magnetism from the shielding cover 100 and plays an insulating role. The material of the insulating pad 500 is polyester, which not only has good structural strength to avoid insulation failure caused by breakage after long-term use, but also has the characteristic of high temperature resistance and a long service life.

[0045] Specifically, the shielding cover 100 is made of a metal material. The upper part of the shielding cover 100 shrinks inward, and the inwardly shrinking part corresponds to the common-mode inductor group 103. The metal material can shield the electromagnetic radiation brought by the inductor, and the material of the shielding cover 100 is aluminum alloy, which has a low thermal resistance, fast heat conduction, is more conducive to the dissipation of internal heat, and is light in weight; the inwardly shrinking part can not only reduce the volume and weight, but also increase the heat dissipation effect on the common-mode inductor group 103 due to the large heat generation of the common-mode inductor group 103.

[0046] Specifically, both sides of the bottom of the shielding cover 100 extend into the notch 200 and are on the same horizontal plane as the lower surface of the insulating board 101. Since the bottom of the shielding cover 100 is on the same horizontal plane as the lower surface of the insulating board 101, it is convenient to attach the board to the horizontal PCB.

[0047] Specifically, potting compound 106 is provided inside the shielding cover 100. The material of the potting compound 106 is silica gel, and the thermal conductivity coefficient ≥ 1.5W / mK, which is convenient for better dissipation of internal heat.

[0048] The above is a detailed description of the present invention in combination with specific embodiments. It cannot be determined that the specific implementation of the present invention is only limited to these descriptions. For those of ordinary skill in the technical field to which the present invention pertains, without departing from the concept of the present invention, making several equivalent substitutions or obvious modifications, and having the same performance or use, all should be regarded as belonging to the patent protection scope determined by the claims submitted for the present invention.

Claims

1. A filter assembly module, comprising a shielding cover (100), a common mode inductor group (103), a cross-line capacitor (104) and a grounding capacitor (105), characterized in that: An inductor base (102) is arranged inside the shielding cover (100), the common-mode inductor group (103) is arranged on the upper surface of the inductor base (102), the cross-line capacitor (104) is arranged on the lower surface of the inductor base (102), the number of the grounding capacitors (105) is four, and the four grounding capacitors (105) are arranged in groups of two on both sides of the cross-line capacitor (104), and the leads of the common-mode inductor group (103) are connected to the leads of the grounding capacitor (105) and the cross-line capacitor (104), and an insulating plate (101) is arranged at the bottom of the shielding cover (100).

2. A filter combination module according to claim 1, characterized in that: Notches (200) are provided on both sides of the bottom of the insulating plate (101), and legs (201) are provided on both sides of the lower surface of the shielding cover (100), and the legs (201) pass through the notches (200) and extend to the lower side of the insulating plate (101).

3. A filter combination module according to claim 1, characterized in that: Three side blocks (300) are provided on both sides of the lower surface of the inductor base (102), and limiting grooves (301) are provided on the outer surfaces of the side blocks (300).

4. A filter combination module according to claim 1, characterized in that: The upper surface of the inductor base (102) is provided with a placement groove (400), and four corners of the inductor base (102) are provided with through grooves (401), and four leads of the common mode inductor group (103) respectively pass through the four through grooves (401) and extend to the outside of the insulating plate (101).

5. The filter combination module according to claim 1, characterized in that: An insulating pad (500) is provided on the top of the common mode inductor group (103).

6. A filter combination module according to claim 1, characterized in that: The shielding cover (100) is made of metal, and the upper portion of the shielding cover (100) shrinks inwards, and the inwardly shrunk portion corresponds to the common mode inductor group (103).

7. A filter combination module according to claim 2, characterized in that: Both sides of the bottom of the shielding cover (100) extend into the notch (200) and are on the same level as the lower surface of the insulating plate (101).

8. The filter combination module according to claim 1, characterized in that: A potting material (106) is arranged inside the shielding cover (100).

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