Microphone module and electronic equipment

Abstract

The invention relates to the technical field of terminals, in particular to a microphone module and electronic equipment. The microphone module comprises a circuit board, wherein the circuit board comprises a first pickup hole, a second pickup hole and a bridging channel; wherein the first pickup hole and the second pickup hole are arranged at an interval, and the bridging channel is communicated with the first pickup hole and the second pickup hole; the first pickup hole is used for communicating with a pickup channel of the electronic equipment; the microphone is arranged on the circuit board and is communicated with the second pickup hole; the microphone and the pickup channel are located on the same side of the circuit board. According to the microphone module and the electronic equipment provided by the invention, the overall thickness of the microphone module can be reduced, and the light and thin design of the electronic equipment can be conveniently realized.

Description

[0001] This application is a divisional application. The application number of the original application is 202311190506.9, the original application date is September 14, 2023, and the entire content of the original application is incorporated herein by reference. Technical Field

[0002] This application relates to the field of terminal technologies, and particularly to a microphone module and an electronic device. Background Art

[0003] In order to enable voice control and voice call functions, an electronic device often needs to be provided with a microphone module. The microphone module is generally disposed inside the electronic device and communicates with the outside of the electronic device through a sound pickup channel on the housing of the electronic device.

[0004] With the development of the thin and light design of electronic devices, the internal space of the housing of the electronic device is getting smaller and smaller. However, the original setting method of the microphone module requires a large amount of internal space of the housing, resulting in a contradiction between the setting of the microphone module and the thin and light design of the electronic device, and it is difficult to meet the design requirements. Summary of the Invention

[0005] To solve the above problems, this application provides a microphone module and an electronic device, which can reduce the overall thickness of the microphone module and facilitate the realization of the thin and light design of the electronic device.

[0006] To achieve the above object, in a first aspect, this application provides a microphone module, including:

[0007] A circuit board, the circuit board includes a first sound pickup hole, a second sound pickup hole, and a bridging channel; wherein, the first sound pickup hole and the second sound pickup hole are spaced apart, and the bridging channel communicates with the first sound pickup hole and the second sound pickup hole; the first sound pickup hole is used to communicate with the sound pickup channel of the electronic device;

[0008] A microphone, the microphone is disposed on the circuit board and communicates with the second sound pickup hole;

[0009] The microphone and the sound pickup channel are located on the same side of the circuit board.

[0010] The microphone module provided by the embodiment of this application sets the microphone and the sound pickup channel on the same side of the circuit board and uses the bridging channel to realize the connection between the first sound pickup hole and the second sound pickup hole. This can not only realize the connection between the microphone and the sound pickup channel, but more importantly, change the original stacked setting of the sound pickup channel, the circuit board and the microphone to reduce the thickness dimension of the microphone module, so as to facilitate the realization of the thin and light design of the electronic device.

[0011] In an alternative embodiment, it further includes: a sealing cover located on the side of the circuit board facing away from the microphone and buckled to the circuit board; along the arrangement direction of the first sound pickup hole and the second sound pickup hole, both ends of the sealing cover cover the first sound pickup hole and the second sound pickup hole; there is a cavity between the sealing cover and the circuit board, and the cavity communicates with the first sound pickup hole and the second sound pickup hole to form a bridging channel. In this embodiment, a cavity can be provided between the circuit board and the sealing cover, and the sealing cover can be used to seal the cavity to form a bridging channel, thereby facilitating the setting of the bridging channel.

[0012] In an alternative embodiment, the sealing cover has a first groove opened towards the circuit board, the first sound pickup hole and the second sound pickup hole communicate with the first groove, and the first groove forms the cavity. In this embodiment, by providing the first groove on the sealing cover and using the first groove to form the cavity, the structure of the circuit board is not affected. In this way, the sealing cover can not only achieve the sealing function but also provide the cavity structure.

[0013] In an alternative embodiment, a second groove is provided on the side of the circuit board facing the sealing cover; the second groove communicates with the first sound pickup hole and the second sound pickup hole; the sealing cover is located in the second groove. In this embodiment, the second groove is provided on the circuit board and the sealing cover is arranged in the second groove, which can further reduce the space occupied by the sealing cover in the thickness direction, so as to reduce the size of the microphone module in the thickness direction, thereby facilitating the realization of the thin and light design of the electronic device.

[0014] In an alternative embodiment, a third groove is provided on the side of the circuit board facing the sealing cover; the third groove communicates with the first sound pickup hole and the second sound pickup hole; the sealing cover covers the opening of the third groove; the third groove forms the cavity. In this embodiment, by providing the third groove on the circuit board to form the cavity structure, the structural design of the sealing cover can be simplified, and the space occupied by the sealing cover in the thickness direction can be further reduced, so as to reduce the size of the microphone module in the thickness direction, thereby facilitating the realization of the thin and light design of the electronic device.

[0015] In an alternative embodiment, the sealing cover has a first groove opened towards the circuit board; a third groove is provided on the side of the circuit board facing the sealing cover, the third groove communicates with the first sound pickup hole and the second sound pickup hole, and the third groove communicates with the first groove; the sealing cover covers the opening of the third groove; the first groove and the third groove jointly form the cavity. In this embodiment, by using both the first groove and the third groove to form the cavity, the overall thickness of the cavity can be distributed to two components, thereby facilitating the realization of the thin and light design of the electronic device.

[0016] In an alternative embodiment, a second groove is provided on the side of the circuit board facing the sealing cover; the second groove communicates with a third groove, and the third groove is located on the groove bottom surface of the second groove; the sealing cover is located within the second groove. In this embodiment, by providing the second groove on the circuit board and disposing the sealing cover within the second groove, the space occupied by the sealing cover in the thickness direction can be further reduced, so as to reduce the size of the microphone module in the thickness direction, thereby facilitating the realization of a thin and light design for the electronic device.

[0017] In an alternative embodiment, the sealing cover includes a cover body and a flange structure, and the first groove is provided on the cover body; the flange structure is connected to the edge of the cover body, and the flange structure is sealingly connected to the circuit board. In this embodiment, by providing the flange structure, the contact area between the sealing cover and the electronic device can be increased, thereby increasing the connection area between the sealing cover and the electronic device, and further improving the connection strength between the sealing cover and the electronic device.

[0018] In an alternative embodiment, the material of the sealing cover is a metal material. In this embodiment, compared with other materials, the metal material has better structural strength and is convenient for processing.

[0019] In an alternative embodiment, the microphone module further includes: a sealing component disposed between the first sound pickup hole and the sound pickup channel, the sealing component being provided with a first through hole that communicates the first sound pickup hole and the sound pickup channel; a dustproof net disposed between the sealing component and the first sound pickup hole, or disposed between the sealing component and the sound pickup channel. In this embodiment, the sealing component is provided to achieve a sealed connection between the sound pickup channel and the first sound pickup hole. At the same time, providing a dustproof net at the first sound pickup hole can prevent impurities in the sound pickup channel from entering the first sound pickup hole, blocking the first sound pickup hole, the bridging channel, and the second sound pickup hole, so as to protect the microphone module.

[0020] In an alternative embodiment, the aperture of the first sound pickup hole is larger than the aperture of the second sound pickup hole. In this embodiment, since a dustproof net is provided corresponding to the first sound pickup hole, the dustproof net will reduce the original sound pickup area of the first sound pickup hole. Therefore, the aperture of the first sound pickup hole can be increased to increase the sound pickup area of the first sound pickup hole and reduce the influence of the dustproof net on sound propagation.

[0021] To achieve the above object, in a second aspect, the present application provides an electronic device, including a housing and the microphone module as described in the first aspect above, the housing being provided with a sound pickup channel; the first sound pickup hole communicates with the sound pickup channel; the microphone and the sound pickup channel are located on the same side of the circuit board. In this embodiment, the electronic device having the above microphone module is more likely to achieve a thin and light design to meet market demands. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] To more clearly illustrate the technical solution of the present application, the accompanying drawings required in the embodiments will be briefly introduced below. Obviously, for those of ordinary skill in the art, without creative efforts, other accompanying drawings can also be obtained based on these drawings.

[0023] Figure 1 Schematic structural diagram of a mobile phone 01 provided in this embodiment;

[0024] Figure 2 For Figure 1 Partial cross-sectional view along the A-A direction in;

[0025] Figure 3 For Figure 2 Simplified structural diagram of the microphone assembly in;

[0026] Figure 4 Schematic structural diagram of a microphone module and a sound pickup channel provided in this embodiment;

[0027] Figure 5 First schematic cross-sectional structural diagram of a microphone module and a sound pickup channel provided in this embodiment;

[0028] Figure 6 Second schematic cross-sectional structural diagram of a microphone module and a sound pickup channel provided in this embodiment;

[0029] Figure 7 Third schematic cross-sectional structural diagram of a microphone module and a sound pickup channel provided in this embodiment;

[0030] Figure 8 Fourth schematic cross-sectional structural diagram of a microphone module and a sound pickup channel provided in this embodiment;

[0031] Figure 9 Fifth schematic cross-sectional structural diagram of a microphone module and a sound pickup channel provided in this embodiment;

[0032] Figure 10 Sixth schematic cross-sectional structural diagram of a microphone module and a sound pickup channel provided in this embodiment;

[0033] Figure 11 Seventh schematic cross-sectional structural diagram of a microphone module and a sound pickup channel provided in this embodiment;

[0034] Figure 12 Partial cross-sectional view of an electronic device provided in this embodiment.

[0035] Illustration marks:

[0036] 01. Mobile phone; 011. Display screen; 012. Rear case; 013. Microphone assembly; 014. Microphone device; 015. Main board; 016. Sealing structure; 017. Sound transmission channel; 018. Sound transmission hole; 1. Circuit board; 11. First sound pickup hole; 12. Second sound pickup hole; 13. Bridging channel; 14. Second groove; 15. Third groove; 2. Microphone; 3. Sealing component; 31. First through hole; 4. Dust-proof net; 5. Sealing cover; 51. First end; 52. Second end; 53. First groove; 54. Cover body; 55. Flange structure; 6. Pipe fitting; 100. Microphone module; 200. Electronic device; 201. Housing; 202. Sound pickup channel. Detailed implementation manners

[0037] Next, the technical solutions in the embodiments of the present application will be clearly described in conjunction with the accompanying drawings in the embodiments of the present application.

[0038] In an electronic device, a microphone (MIC) is an important recording device. The microphone is mainly used to capture sound information such as ambient sound or the user's voice, and convert the sound information into an electrical signal.

[0039] It should be noted that the above-mentioned electronic devices may include, but are not limited to, mobile phones, tablet computers, smart wearable devices, personal digital assistants (PDAs), augmented reality (AR) / virtual reality (VR) devices, vehicle-mounted devices, and other electronic devices. The electronic device may also be an electronic product such as an electric vehicle, a household appliance, a headset, a drone, etc. The specific form of the electronic device in the embodiments of the present application is not particularly limited.

[0040] The following takes a mobile phone as an example of the electronic device for illustration.

[0041] Figure 1 A schematic structural diagram of a mobile phone 01 provided in this embodiment.

[0042] As Figure 1 shown, the mobile phone 01 may include a display screen 011 and a rear case 012, and the display screen 011 is buckled on the rear case 012. A microphone assembly 013 is also provided between the display screen 011 and the rear case 012. The microphone assembly 013 in the mobile phone 01 is usually used for calls, voice recognition, video or audio recording, etc.

[0043] One or more microphone components 013 can be set inside the mobile phone 01. For example, two microphone components 013 can be set inside the mobile phone 01. One sound outlet is located at the bottom of the mobile phone 01 and serves as the main microphone component; the other sound outlet is located at the top of the mobile phone 01 and serves as the secondary microphone component. The secondary microphone component plays a role in supplementing the function of the main microphone component in the mobile phone 01 and can be used for specific operations such as noise cancellation, ambient sound capture, and sound directionality to provide a better call and recording experience.

[0044] It can be understood that in other mobile phones 01, the microphone component can also be one, three, etc. The specific setting method can vary according to the functions and designs of the mobile phone 01 and is not limited in this embodiment.

[0045] It is worth noting that components such as a camera module, a battery, a main board, and a speaker component are also provided between the display screen 011 and the rear case 012, which are not listed one by one here.

[0046] To facilitate the description of the positions of the various components in the mobile phone 01, a three-dimensional coordinate system is exemplarily established based on the mobile phone 01 in this embodiment of the application. Among them, the x-axis direction is the width direction of the mobile phone 01, the y-axis direction is the length direction of the mobile phone 01, and the z-axis direction is the thickness direction of the mobile phone 01.

[0047] Figure 2 For Figure 1 the partial sectional view along the A-A direction in

[0048] Figure 3 For Figure 2 the simplified structural schematic diagram of the microphone component in

[0049] As Figure 2 and Figure 3 shown, in order to implement the functions of the microphone, each microphone component 013 can include a microphone device 014, a main board 015, a sealing structure 016, and a sound transmission channel 017. Among them, the main board 015 can be the whole machine circuit board of the mobile phone 01, or it can also be a microphone function board connected to the whole machine circuit board.

[0050] Considering the utilization rate of the internal space of the mobile phone 01 and the compactness of the device layout, the microphone device 014 can be set on the main board 015 and electrically connected to the main board 015. While realizing the transmission of the sound signal collected by the microphone device 014 to the main board 015, it can also realize the fixed connection of the microphone device 014 to avoid the influence of external vibration on the microphone device 014.

[0051] To facilitate the connection between the microphone device 014 and the sound transmission channel 017, a sound transmission hole 018 is provided on the main board 015 corresponding to the microphone device 014, and the sound signal in the sound transmission channel 017 is transmitted to the microphone device 014 through the sound transmission hole 018.

[0052] A sealing structure 016 is provided between the sound transmission channel 017 and the sound transmission hole 018 to achieve a sealed connection between the sound transmission channel 017 and the sound transmission hole 018, avoiding leakage or mixing of sound signals, thereby reducing the possibility of silent or noisy sounds.

[0053] Since the microphone device 014 is provided between the display screen 011 and the rear case 012, to facilitate the connection between the microphone device 014 and the environment where the mobile phone 01 is located to receive sound signals, the sound transmission channel 017 can be provided on the rear case 012. One end of the sound transmission channel 017 communicates with the environment where the mobile phone 01 is located, and the other end is used to communicate with the microphone device 014.

[0054] As Figure 2 shown, Figure 2 the dotted arrow in

[0055] represents the transmission direction of the sound signal. The working process of the microphone assembly 013 is introduced below.

[0056] When the microphone assembly 013 is working, the sound signal outside the mobile phone 01 enters through one end of the sound transmission channel 017 and is transmitted to the sound transmission hole 018 on the main board 015. When the sound signal is transmitted from the sound transmission channel 017 to the sound transmission hole 018, it will pass through the sealing structure 016. The setting of the sealing structure 016 can prevent the sound signal from leaking between the sound transmission channel 017 and the sound transmission hole 018, or from introducing noise signals between the sound transmission channel 017 and the sound transmission hole 018 to achieve sealing. The sound transmission hole 018 can transmit the sound signal to the microphone device 014 to achieve the acquisition of the sound signal.

[0057] As Figure 3 shown, to achieve the functional design of the microphone assembly 013, the stacking of each structure in the microphone assembly 013 adopts a sandwich structure. That is, along the z-axis direction, the microphone device 014, the main board 015, the sealing structure 016, and the sound transmission channel 017 are stacked layer by layer. In this way, while meeting the functional requirements of the microphone assembly 013, a compact design of the microphone assembly 013 can also be achieved, thereby reducing the occupation of the internal space of the mobile phone 01.

[0058] As Figure 1As shown, with the development of the thin and light design of mobile phone 01, the thickness of mobile phone 01 gradually decreases. However, as can be seen from Figure 2 and Figure 3 , the microphone assembly 013 is stacked along the z-axis, and its overall thickness is H1. The size of H1 is equal to the sum of the dimensions of the microphone device 014, the main board 015, the sealing structure 016, and the sound transmission channel 017 in the z-axis direction. The dimensions of the microphone device 014, the sealing structure 016, and the sound transmission channel 017 in the z-axis direction are already relatively small and it is difficult to further reduce them. At this time, the z-axis space of mobile phone 01 occupied by H1 will hinder the thin and light design of mobile phone 01 and affect the design and manufacturing of mobile phone 01.

[0059] In one implementation, in order to reduce H1, the rigid main board 015 in the microphone assembly 013 can be replaced with a flexible printed circuit (FPC). At this time, the FPC is a partial printed circuit structure. The thickness of the FPC is less than the thickness of the rigid main board 015, which can reduce the overall thickness of the microphone assembly 013.

[0060] However, in the above implementation, the FPC is a flexible structure and cannot support the microphone device 014. An additional structure is required to support and fix the microphone device 014.

[0061] More importantly, when the microphone device 014 is connected to the FPC, an additional connector is required to electrically connect the FPC to the main board of the entire mobile phone 01 to achieve signal transmission. This requires re-designing and arranging the main board of the entire mobile phone 01 and the connector, etc., increasing the design difficulty of the entire mobile phone 01 and making it difficult to implement.

[0062] To solve the above problems, this embodiment provides a microphone module and an electronic device. The microphone module can reduce the space occupied in the z-axis direction and facilitate the thin and light design of the electronic device.

[0063] Figure 4 It is a schematic structural diagram of a microphone module and a sound pickup channel provided in this embodiment.

[0064] Figure 5 It is a schematic cross-sectional structural diagram of the first microphone module and sound pickup channel provided in this embodiment.

[0065] Please refer to Figure 4 and Figure 5 . In some embodiments, the microphone module 100 may include a printed circuit board (PCB) 1 and a microphone 2.

[0066] The circuit board 1 may include a first sound pickup hole 11, a second sound pickup hole 12, and a bridging channel 13. The first sound pickup hole 11 and the second sound pickup hole 12 are spaced apart. The first sound pickup hole 11 is used to connect to the sound pickup channel 202 of the electronic device. Meanwhile, the bridging channel 13 communicates with the first sound pickup hole 11 and the second sound pickup hole 12 to connect the second sound pickup hole 12 to the first sound pickup hole 11 and the sound pickup channel 202 by using the bridging channel 13.

[0067] The microphone 2 is disposed on the circuit board 1 and communicates with the second sound pickup hole 12 to communicate with the sound pickup channel 202 through the bridging channel 13 and the first sound pickup hole 11, so as to collect the sound signal in the sound pickup channel 202. Meanwhile, the microphone 2 is electrically connected to the circuit board 1 to facilitate signal transmission between the circuit board 1 and the microphone 2, and the circuit board 1 can also be used to support and fix the microphone 2.

[0068] The microphone 2 and the sound pickup channel 202 are located on the same side of the circuit board 1.

[0069] The microphone module 100 provided by the embodiment of the present application can reduce the overall thickness of the microphone module 100 while realizing the normal sound pickup function. Since the microphone 2 and the sound pickup channel 202 have a great influence on the size of the microphone module 100, after the microphone 2 and the sound pickup channel 202 are arranged on the same side of the circuit board 1, the thicknesses of the microphone 2 and the sound pickup channel 202 will not be superimposed, which is convenient for reducing the overall thickness of the microphone module 100. In this way, the z - direction space of the electronic device occupied by the microphone module 100 can be reduced, which is convenient for realizing the thin and light design of the electronic device. Meanwhile, the microphone module 100 provided by this embodiment has little influence on other components in the electronic device while realizing the thin and light design, is easy to implement, and can reduce the design and manufacturing difficulty of the electronic device.

[0070] It should be noted that in the electronic device, the sound pickup channel 202 is usually arranged on the housing of the electronic device to communicate the inside and outside of the electronic device. The housing can be a middle frame or a rear cover, and the arrangement of the sound pickup channel 202 is not limited in this embodiment.

[0071] Please refer to Figure 4 and Figure 5 , in some embodiments, the microphone module 100 may further include a sealing component 3 and a dustproof net 4.

[0072] The sealing component 3 is arranged between the first sound pickup hole 11 and the sound pickup channel 202 to seal the connection position between the first sound pickup hole 11 and the sound pickup channel 202. A first through - hole 31 is arranged on the sealing component 3 to communicate with the first sound pickup hole 11 and the sound pickup channel 202 by using the first through - hole 31, so as to realize the normal transmission of sound signals while realizing the sealing.

[0073] Optionally, the material of the sealing component 3 can be a material with deformation ability. During assembly, the sealing component 3 can be first fixed to the side of the sound pickup channel 202 facing the first sound pickup hole 11, and then the circuit board 1 can be press-fitted and connected to the sealing component 3, and the first sound pickup hole 11 corresponds to the first through hole 31. In this way, through the extrusion between the circuit board 1 and the sound pickup channel 202, the sealing component 3 can be deformed to improve the sealing effect.

[0074] It can be understood that during assembly, the sealing component 3 can also be first connected to the circuit board 1 and then connected to the sound pickup channel 202. In this embodiment, the assembly sequence of the sealing component 3 is not limited.

[0075] Exemplarily, the sealing component 3 can be a foam sealing ring. Or, the sealing component 3 can also be an elastic rubber sleeve. Or, the sealing component 3 can be a combination of a foam sealing ring and an elastic rubber sleeve. By utilizing the elastic deformation ability of the foam sealing ring and / or the elastic rubber sleeve, the sealing of the connection position between the sound pickup channel 202 and the first sound pickup hole 11 is achieved. In this embodiment, the specific composition of the sealing component 3 is not limited.

[0076] The dustproof net 4 is disposed between the sealing component 3 and the first sound pickup hole 11, or between the sealing component 3 and the sound pickup channel 202. Since one end of the sound pickup channel 202 communicates with the environment where the electronic device is located, there will inevitably be some impurities such as dust and gravel in this environment. These impurities may enter the sound pickup channel 202, and even enter the first sound pickup hole 11, the second sound pickup hole 12, and the microphone 2, thereby blocking the transmission path of the sound signal and affecting the normal function of the microphone module 100. The setting of the dustproof net 4 can prevent impurities from entering the microphone module 100 from the sound pickup channel 202, thereby protecting the microphone module 100.

[0077] Optionally, the aperture D1 of the first sound pickup hole 11 is larger than the aperture D2 of the second sound pickup hole 12. Due to the setting of the dustproof net 4, to a certain extent, it will affect the flow of the sound signal. By increasing the aperture D1 of the first sound pickup hole 11, the sound pickup area of the first sound pickup hole 11 can be increased, thereby reducing the influence of the dustproof net 4 and facilitating the realization of the function of the microphone 2.

[0078] When the microphone module 100 is disposed in the electronic device, the overall thickness of the microphone module 100 and the dimension of the sound pickup channel 202 in the z-axis direction jointly affect the size of the electronic device.

[0079] Such as Figure 3As shown, in the traditional structure, the overall thickness of the microphone component 013 inside the electronic device is marked as H1. H1 includes the sum of the dimensions of the microphone device 014, the main board 015, the sealing structure 016, and the sound transmission channel 017 along the z-axis direction.

[0080] As Figure 4 shown, the overall thickness of the microphone module 100 provided in this embodiment inside the electronic device is marked as H2. H2 includes the sum of the dimensions of the sound pickup channel 202, the sealing component 3, the dustproof net 4, the circuit board 1, and the bridging channel 13 along the z-axis direction. Figure 4 The sum of the dimensions of the sealing component 3 and the dustproof net 4 along the z-axis direction in Figure 3 can be equivalent to the dimension of the sealing structure 016 along the z-axis direction in

[0081] Please refer to Figure 5 , in one implementation, the microphone module 100 may further include a sealing cover 5.

[0082] For ease of description, the arrangement direction of the first sound pickup hole 11 and the second sound pickup hole 12 is defined as the first direction, and the first direction is perpendicular to the axial direction of the first sound pickup hole 11. In Figure 5 , the axial direction of the first sound pickup hole 11 is the z-axis direction, and the first direction is the y-axis direction.

[0083] The sealing cover 5 is located on the side of the circuit board 1 opposite to the microphone 2. That is to say, along the z-axis direction, the sealing cover 5 and the microphone 2 are respectively located on both sides of the circuit board 1. The sealing cover 5 is buckled on the circuit board 1, and both ends of the sealing cover 5 cover the first sound pickup hole 11 and the second sound pickup hole 12 to achieve the closure of the first sound pickup hole 11 and the second sound pickup hole 12.

[0084] Exemplarily, the two ends of the sealing cover 5 in the first direction are respectively a first end 51 and a second end 52. Along the direction of the y-axis, the first end 51 is located on the side of the first sound pickup hole 11 away from the second sound pickup hole 12 to cover the first sound pickup hole 11. Along the direction of the y-axis, the second end 52 is located on the side of the second sound pickup hole 12 away from the first sound pickup hole 11 to cover the second sound pickup hole 12, so as to achieve the enclosure of the first sound pickup hole 11 and the second sound pickup hole 12.

[0085] Further, there is a cavity between the sealing cover 5 and the circuit board 1, and this cavity communicates with the first sound pickup hole 11 and the second sound pickup hole 12 to form a bridging channel 13, facilitating the transmission of sound signals.

[0086] As Figure 5 shown, in one implementation, the sealing cover 5 has a first groove 53 opened towards the circuit board 1, so that the sealing cover 5 and the circuit board 1 can be used to seal the first groove 53, thus facilitating the formation of a closed space. At the same time, the first groove 53 communicates with the first sound pickup hole 11 and the second sound pickup hole 12 to form a cavity by using the first groove 53.

[0087] The opening of the first groove 53 towards the circuit board 1 can cover the first sound pickup hole 11 and the second sound pickup hole 12 to achieve the communication between the first groove 53 and the first sound pickup hole 11 and the second sound pickup hole 12. The first sound pickup hole 11 and the second sound pickup hole 12 can penetrate through both sides of the circuit board 1 along the z-axis direction.

[0088] In other words, the cavity can be arranged on the sealing cover 5. In this way, not only the influence on the structure of the circuit board 1 is reduced, but also the communication between the first sound pickup hole 11 and the second sound pickup hole 12 can be achieved, which is convenient to implement.

[0089] Optionally, the above-mentioned first groove 53 can be formed by material removal or by stamping, which is not limited in this embodiment.

[0090] Exemplarily, the sealing cover 5 can include a cover body 54 and a flange structure 55, and the first groove 53 is arranged on the cover body 54. The flange structure 55 is connected to the edge of the cover body 54, and the flange structure 55 is sealingly connected to the circuit board 1. The first end 51 and the second end 52 are respectively located at both ends of the flange structure 55 in the first direction. The cover body 54 can be used to form the side wall of the first groove 53, and the design of the flange structure 55 can increase the connection area between the sealing cover 5 and the circuit board 1. In this way, the connection strength and sealing performance between the sealing cover 5 and the circuit board 1 can be improved.

[0091] Optionally, the cover body 54 and the flange structure 55 can be integrally formed. The cover body 54 and the sealing cover 5 can be formed by stamping. Or, the flange structure 55 can be formed by folding the edge of the cover body 54, which is not limited in this embodiment.

[0092] Alternatively, the cover body 54 and the flange structure 55 can also be integrally formed, and the cover body 54 and the flange structure 55 can be connected to form the sealing cover 5.

[0093] Optionally, the flange structure 55 can be connected to the circuit board 1 by welding, which can ensure the connection strength.

[0094] Alternatively, the flange structure 55 can also be connected to the circuit board 1 by gluing, which can facilitate the connection operation and reduce the impact on the circuit board 1.

[0095] In some embodiments, the sealing cover 5 can be made of a metal material. That is, both the cover body 54 and the flange structure 55 are made of a metal material, and the metal material facilitates the forming and processing of the sealing cover 5. More importantly, while ensuring the structural strength, the metal material can be made thinner than other materials, so that the size of the sealing cover 5 in the z-axis direction can be reduced. In this way, the overall thickness of the microphone module 100 can be further reduced.

[0096] Figure 6 This is a schematic cross-sectional structure diagram of the second microphone module 100 and the sound pickup channel 202 provided in this embodiment.

[0097] Please refer to Figure 6 , optionally, a second groove 14 is provided on one side of the circuit board 1 facing the sealing cover 5. The second groove 14 communicates with the first sound pickup hole 11 and the second sound pickup hole 12. That is to say, the first sound pickup hole 11 and the second sound pickup hole 12 penetrate through one side of the circuit board 1 facing the microphone 2 and the bottom surface of the second groove 14. The sealing cover 5 is located in the second groove 14, and one side surface of the sealing cover 5 facing the circuit board 1 is connected to the bottom surface of the second groove 14. By providing the second groove 14 on the circuit board 1, the sealing cover 5 can be embedded in the circuit board 1 to reduce the impact of the sealing cover 5 on the overall thickness, so that the overall thickness can be further reduced.

[0098] For the convenience of comparison, the total dimension of the circuit board 1, the sealing component 3, the dustproof net 4, and the sound pickup channel 202 in the z-axis direction is marked as H 21 . The dimension of the sealing cover 5 with the first groove 53 along the z-axis is marked as H 221 . Then, Figure 5 the overall thickness H2 of the microphone module 100 and the sound pickup channel 202 in the z-axis direction in 21 is H 221 .

[0099] Please refer to Figure 5 and Figure 6 , and mark the depth of the second groove 14 in Figure 6 as H 23Then, when the second groove 14 is provided on the circuit board 1, H2 = H 21 +H 221 -H 23 , it can be seen that the provision of the second groove 14 can further reduce the overall thickness of the microphone module 100 and the sound pickup channel 202.

[0100] Exemplarily, the dimension of the second groove 14 in the first direction may be exactly equal to the dimension from the first end 51 to the second end 52 of the sealing cover 5. In this way, while accommodating the sealing cover 5, the influence on the circuit board 1 can be reduced.

[0101] Optionally, in the z-axis direction, the depth of the second groove 14 may be equal to the thickness of the flange structure 55, so that the flange structure 55 can be just embedded in the second groove 14. Alternatively, in the z-axis direction, the depth of the second groove 14 may be greater than or less than the thickness of the flange structure 55, and its specific depth can be adjusted according to the thickness of the circuit board 1 itself, which is not limited in this embodiment.

[0102] Figure 7 This is a schematic cross-sectional structure diagram of the third microphone module 100 and the sound pickup channel 202 provided in this embodiment.

[0103] As Figure 7 shown, in another implementation, the sealing cover 5 has a first groove 53 opened towards the circuit board 1, and a third groove 15 is provided on the side of the circuit board 1 facing the sealing cover 5. In this way, the sealing cover 5 and the circuit board 1 can be used to seal the first groove 53 and the third groove 15, so as to facilitate the formation of a closed space. The third groove 15 communicates with the first sound pickup hole 11 and the second sound pickup hole 12. At this time, the first sound pickup hole 11 and the second sound pickup hole 12 penetrate through the side of the circuit board 1 facing the microphone 2 and the bottom surface of the third groove 15. The first groove 53 communicates with the third groove 15, and the sealing cover 5 covers the opening of the third groove 15. At this time, the first groove 53 and the third groove 15 jointly form a cavity to form the bridging channel 13.

[0104] When the volume of the cavity is certain, using the first groove 53 and the third groove 15 to jointly form the cavity can make the third groove 15 share a part of the cavity volume. In this way, compared with the case of only using the first groove 53 to form the cavity, the existence of the third groove 15 can reduce the volume of the first groove 53, thereby reducing the dimension of the sealing cover 5 in the z-axis direction, and further reducing the overall thickness of the microphone module 100 and the sound pickup channel 202.

[0105] Optionally, the opening of the first groove 53 facing the circuit board 1 can be exactly aligned with the opening of the third groove 15 facing the sealing cover 5. In this way, a stepped structure can be avoided between the first groove 53 and the third groove 15, which affects the transmission of sound signals.

[0106] Please combine Figure 5 and Figure 7 , and mark the dimension of the sealing cover 5 with the first groove 53 along the z-axis in Figure 7 as H. 221’ Then, Figure 7 the total thickness H2 of the microphone module 100 and the sound pickup channel 202 in 21 along the z-axis direction is H2 = H 221’ .

[0107] Figure 5 The cavity volume in Figure 7 is equal to the volume of the first groove 53, and the cavity volume in Figure 7 is equal to the sum of the volume of the first groove 53 and the volume of the third groove 15. When Figure 5 the cavity volume in Figure 7 is equal to Figure 5 the cavity volume in Figure 7 the H in 221’ is less than Figure 5 the H in 221 . It can be seen that compared with the scheme in Figure 5 , Figure 7 the overall thickness H2 of the microphone module 100 and the sound pickup channel 202 in

[0108] is further reduced.

[0109] It is worth noting that on the basis of the scheme in Figure 5 , if it is necessary to increase the volume of the cavity, it can also be achieved by setting the third groove 15 to avoid increasing the dimension of the sealing cover 5 along the z-axis.

[0110] Figure 8 FIG. 55 is a schematic cross-sectional structure diagram of the fourth microphone module 100 and the sound pickup channel 202 provided in this embodiment.

[0111] As shown in Figure 8As shown, optionally, a second groove 14 is provided on one side of the circuit board 1 facing the sealing cover 5. The second groove 14 communicates with the third groove 15, that is, the second groove 14 communicates with the first sound pickup hole 11 and the second sound pickup hole 12. And the third groove 15 is located at the bottom surface of the second groove 14, and the opening of the third groove 15 facing the sealing cover 5 is smaller than the opening of the second groove 14 facing the sealing cover 5. At this time, the first sound pickup hole 11 and the second sound pickup hole 12 penetrate through one side of the circuit board 1 facing the microphone 2 and the bottom surface of the third groove 15. The sealing cover 5 is located in the second groove 14, and one side surface of the sealing cover 5 facing the circuit board 1 is connected to the bottom surface of the second groove 14. By providing the second groove 14 on the circuit board 1, the sealing cover 5 can be embedded in the circuit board 1 to reduce the influence of the sealing cover 5 on the overall thickness, so that the overall thickness can be further reduced.

[0112] Please combine Figure 7 and Figure 8 , and mark the depth of the second groove 14 in Figure 8 as H 23 . Then, when the second groove 14 is provided on the circuit board 1, H2 = H 21 + H 221’ - H 23 . It can be seen that the provision of the second groove 14 can further reduce the overall thickness of the microphone module 100 and the sound pickup channel 202.

[0113] As Figure 8 shown, optionally, the dimension of the third groove 15 in the first direction can just cover the first sound pickup hole 11 and the second sound pickup hole 12 at the same time. In this way, the influence on the structure of the circuit board 1 can be reduced, and the strength of the circuit board 1 can be ensured.

[0114] Figure 9 FIG. is a schematic cross-sectional structure diagram of the fifth microphone module 100 and the sound pickup channel 202 provided in this embodiment.

[0115] As Figure 9 shown, in another implementation, a third groove 15 is provided on one side of the circuit board 1 facing the sealing cover 5. The third groove 15 communicates with the first sound pickup hole 11 and the second sound pickup hole 12. At this time, the first sound pickup hole 11 and the second sound pickup hole 12 penetrate through one side of the circuit board 1 facing the microphone 2 and the bottom surface of the third groove 15. The sealing cover 5 covers the opening of the third groove 15. At this time, the third groove 15 forms a cavity to form a bridging channel 13.

[0116] Optionally, the dimension of the third groove 15 in the first direction can just cover the first sound pickup hole 11 and the second sound pickup hole 12 at the same time. In this way, the influence on the structure of the circuit board 1 can be reduced, and the strength of the circuit board 1 can be ensured.

[0117] Optionally, when the first groove 53 is not provided on the sealing cover 5, the sealing cover 5 can be a cover plate structure. That is to say, the sealing cover 5 can be a flat plate structure and cover the opening of the third groove 15, thereby closing the third groove 15 to form a cavity.

[0118] Please refer to Figure 5 and Figure 9 , and mark the dimension of the sealing cover 5 without the first groove 53 along the z-axis in Figure 9 as H 222 . Since the sealing cover 5 without the first groove 53 only needs to cover the third groove 15 and does not need to reserve a thickness space for setting the first groove 53. Then, H 222 should be less than H 221 . And Figure 9 where H2 = H 21 + H 222 , it can be seen that setting the third groove 15 on the circuit board 1 can further reduce the overall thickness.

[0119] Figure 10 FIG. 6 is a schematic cross-sectional structure diagram of the sixth microphone module 100 and the sound pickup channel 202 provided in this embodiment.

[0120] As Figure 10 shown, optionally, a second groove 14 is provided on the side of the circuit board 1 facing the sealing cover 5. The second groove 14 communicates with the third groove 15, that is, the second groove 14 communicates with the first sound pickup hole 11 and the second sound pickup hole 12. And the third groove 15 is located at the bottom surface of the second groove 14, and the opening of the third groove 15 facing the sealing cover 5 is smaller than the opening of the second groove 14 facing the sealing cover 5. At this time, the first sound pickup hole 11 and the second sound pickup hole 12 penetrate through the side of the circuit board 1 facing the microphone 2 and the bottom surface of the third groove 15. The sealing cover 5 is located in the second groove 14, and the side surface of the sealing cover 5 facing the circuit board 1 is connected to the bottom surface of the second groove 14. By providing the second groove 14 on the circuit board 1, the sealing cover 5 can be embedded in the circuit board 1 to reduce the influence of the sealing cover 5 on the overall thickness, thereby further reducing the overall thickness.

[0121] Please refer to Figure 9 and Figure 10 , and mark the dimension of the sealing cover 5 without the first groove 53 along the z-axis in Figure 10 as H 222 , and mark the depth of the second groove 14 in Figure 10 as H 23 . Since the sealing cover 5 without the first groove 53 only needs to cover the third groove 15 and does not need to reserve a thickness space for setting the first groove 53. Then, H 222 should be less than H 221 . And Figure 9where H2 = H 21 +H 222 -H 23 It can be seen that by embedding the sealing cover 5 on the circuit board 1, the overall thickness can be further reduced.

[0122] Optionally, the depth of the second groove 14 can be equal to the dimension of the sealing cover 5 in the z-axis direction. This can make the sealing cover 5 flush with the circuit board 1, and while reducing the overall thickness, it can also avoid affecting other structures.

[0123] From the above Figures 5 to 10 it can be known that the cavity can be provided on the circuit board 1, or on the sealing cover 5, or can be provided on both the sealing cover 5 and the circuit board 1 at the same time.

[0124] When the cavity is provided on the sealing cover 5, while realizing the communication between the first sound pickup hole 11 and the second sound pickup hole 12, the influence on the structure of the circuit board 1 can be reduced.

[0125] When the cavity is provided on the circuit board 1, the sealing cover 5 can be a plate structure. In this way, while realizing the communication between the first sound pickup hole 11 and the second sound pickup hole 12, the structure of the sealing cover 5 can be further simplified, thereby further reducing the overall thickness of the microphone module 100 and the sound pickup channel 202. At the same time, the cavity is located on the circuit board 1, which can avoid the cavity occupying additional z-direction space and is convenient for further reducing the overall thickness.

[0126] When the cavity is provided on both the sealing cover 5 and the circuit board 1 at the same time, the sealing cover 5 and the circuit board 1 can share the dimension of the cavity in the z-axis direction. In this way, the influence on the structure of the circuit board 1 can be reduced, and the dimension of the sealing cover 5 in the z-axis direction can be reduced to a certain extent, so as to facilitate the realization of a thin and light design.

[0127] Figure 11 This is a schematic cross-sectional structure diagram of the seventh microphone module 100 and the sound pickup channel 202 provided in this embodiment.

[0128] As Figure 11 shown, in another implementation, the microphone module 100 may further include a pipe member 6. The pipe member 6 is located on the side of the circuit board 1 opposite to the microphone 2, that is, along the z-axis direction, the pipe member 6 and the microphone 2 are respectively located on both sides of the circuit board 1. Both ends of the pipe member 6 are connected to the circuit board 1, and one end of the pipe member 6 communicates with the first sound pickup hole 11, and the other end of the pipe member 6 communicates with the second sound pickup hole 12. In this way, the inner cavity of the pipe member 6 can be used to form a bridging channel 13 to facilitate the transmission of sound signals.

[0129] It can be understood that when the bridging channel 13 is formed by the pipe member 6, the pipe member 6 can be a flexible pipe or a rigid pipe. Its material can be plastic or metal. In this embodiment, the pipe member 6 is not limited.

[0130] It is worth noting that the bridging channel 13 is a channel capable of connecting the first sound pickup hole 11 and the second sound pickup hole 12, so as to transmit the sound signal in the sound pickup channel 202 to the microphone 2 on the same side of the circuit board 1. The bridging channel 13 can be formed by the above cavity structure, or can be formed by the pipe member 6, or can also be formed by a hole structure provided in the circuit board 1 body and communicating with the first sound pickup hole 11 and the second sound pickup hole 12. In this embodiment, the specific formation method of the bridging channel 13 is not limited.

[0131] Figure 12 This is a partial cross-sectional view of an electronic device provided in this embodiment.

[0132] As Figure 12 shown, this embodiment also provides an electronic device 200. The electronic device 200 includes a housing 201 and the above microphone module 100. A sound pickup channel 202 is provided on the housing 201. The first sound pickup hole 11 communicates with the sound pickup channel 202, and the microphone 2 and the sound pickup channel 202 are located on the same side of the circuit board 1. The bridging channel 13 is located on the side of the circuit board 1 facing away from the microphone 2. In this way, the occupation of the z-direction space of the microphone module 100 in the electronic device 200 can be reduced, facilitating the realization of the thin and light design of the electronic device 200.

[0133] As Figure 12 shown by the dotted arrow in, when the microphone module 100 works, the sound signal enters through the sound pickup channel 202 on the housing 201, enters the bridging channel 13 through the first sound pickup hole 11, and then enters the second sound pickup hole 12 to reach the microphone 2, thereby realizing the reception of the sound signal.

[0134] It can be understood that the microphone module 100 can be arranged at the top, bottom or back of the electronic device 200. In this embodiment, the setting position of the microphone module 100 in the electronic device 200 is not limited.

[0135] Optionally, a receiving groove for receiving the microphone 2 can also be correspondingly provided on the housing 201 to limit and protect the microphone 2, avoiding connection failure, misalignment, etc. of the microphone 2 due to external vibration, affecting the function of the microphone 2.

[0136] It is worth noting that the housing 201 of the electronic device 200 may be a middle frame, or may be a whole including the middle frame and the back cover. In addition, the display screen of the electronic device 200 may be arranged on the side of the circuit board 1 facing the microphone 2, or may be arranged on the side of the circuit board 1 facing away from the microphone 2. The layout may be made according to actual conditions, and this embodiment does not limit this.

[0137] It should be noted that those skilled in the art will easily think of other embodiments of the present application after considering the specification and practicing the application disclosed herein. The present application is intended to cover any modification, use or adaptation of the present application, which follows the general principles of the present application and includes common knowledge or customary technical means in the art that are not disclosed in the present application. The specification and examples are only regarded as exemplary, and the true scope of the present application is indicated by the claims.

[0138] It should be understood that the present application is not limited to the precise structures that have been described above and shown in the drawings, and that various modifications and changes may be made without departing from the scope thereof. The scope of the present application is limited only by the appended claims.

Claims

1. A microphone module, characterized in that, it includes: a circuit board (1), a first sound pickup hole (11) provided on the circuit board (1) and used to communicate with a sound pickup channel (202) of an electronic device; a second sound pickup hole (12) provided on the circuit board (1) and spaced apart from the first sound pickup hole (11); a bridging channel (13) provided on the circuit board (1) and communicating the first sound pickup hole (11) and the second sound pickup hole (12); a microphone (2) provided on the circuit board (1) and communicating with the second sound pickup hole (12); the microphone (2) and the sound pickup channel (202) are located on the same side of the circuit board (1).

2. The microphone module according to claim 1, characterized in that, a sound signal enters through the sound pickup channel (202), enters the bridging channel (13) through the first sound pickup hole (11), then enters the second sound pickup hole (12) and reaches the microphone (2).

3. The microphone module according to claim 2, characterized in that, the microphone module further includes: a sealing component (3), the sealing component (3) is provided between the first sound pickup hole (11) and the sound pickup channel (202), and the sealing component (3) is provided with a first through hole (31), and the first through hole (31) communicates the first sound pickup hole (11) and the sound pickup channel (202).

4. The microphone module according to any one of claims 1-3, characterized in that, it further includes: a sealing cover (5), the sealing cover (5) is located on the side of the circuit board (1) facing away from the microphone (2) and is buckled on the circuit board (1); along the arrangement direction of the first sound pickup hole (11) and the second sound pickup hole (12), both ends of the sealing cover (5) cover the first sound pickup hole (11) and the second sound pickup hole (12); a cavity is formed between the sealing cover (5) and the circuit board (1), and the cavity communicates with the first sound pickup hole (11) and the second sound pickup hole (12) to form the bridging channel (13).

5. The microphone module according to claim 4, characterized in that, the sealing cover (5) has a first groove (53) opened towards the circuit board (1), the first sound pickup hole (11) and the second sound pickup hole (12) communicate with the first groove (53), and the first groove (53) forms the cavity.

6. The microphone module according to claim 5, characterized in that, a second groove (14) is provided on the side of the circuit board (1) facing the sealing cover (5); the second groove (14) communicates with the first sound pickup hole (11) and the second sound pickup hole (12); the sealing cover (5) is located in the second groove (14).

7. The microphone module according to any one of claims 4-6, characterized in that, a third groove (15) is provided on the side of the circuit board (1) facing the sealing cover (5); The third groove (15) communicates with the first sound pickup hole (11) and the second sound pickup hole (12); The sealing cover (5) covers the opening of the third groove (15); The third groove (15) forms the cavity.

8. The microphone module according to any one of claims 4-6, characterized in that The sealing cover (5) has a first groove (53) opened towards the circuit board (1); On one side of the circuit board (1) facing the sealing cover (5), there is a third groove (15), the third groove (15) communicates with the first sound pickup hole (11) and the second sound pickup hole (12), and the third groove (15) communicates with the first groove (53); The sealing cover (5) covers the opening of the third groove (15); The first groove (53) and the third groove (15) together form the cavity.

9. The microphone module according to claim 7 or 8, characterized in that On one side of the circuit board (1) facing the sealing cover (5), there is a second groove (14); The second groove (14) communicates with the third groove (15), and the third groove (15) is located at the groove bottom surface of the second groove (14); The sealing cover (5) is located in the second groove (14).

10. The microphone module according to claim 5, characterized in that The sealing cover (5) includes a cover body (54) and a flange structure (55), The first groove (53) is provided on the cover body (54); The flange structure (55) is connected to the edge of the cover body (54), and the flange structure (55) is hermetically connected to the circuit board (1).

11. The microphone module according to any one of claims 4-6, characterized in that The material of the sealing cover (5) is a metal material.

12. The microphone module according to any one of claims 1-11, characterized in that A dustproof net (4) is provided between the sealing assembly (3) and the first sound pickup hole (11), or between the sealing assembly (3) and the sound pickup channel (202).

13. The microphone module according to claim 12, characterized in that The aperture of the first sound pickup hole (11) is larger than the aperture of the second sound pickup hole (12).

14. An electronic device, characterized in that It includes a housing (201) and the microphone module according to any one of claims 1-13; The housing (201) is provided with the sound pickup channel (202); The first sound pickup hole (11) communicates with the sound pickup channel (202); The microphone (2) and the sound pickup channel (202) are located on the same side of the circuit board (1).

Images