Circuit board assembly and electronic equipment

Abstract

The invention discloses a circuit board assembly and electronic equipment. The circuit board assembly comprises a main circuit board and an adapter plate. The adapter plate is electrically connected with the main circuit board, and the adapter plate comprises a first part located outside a projection area of the main circuit board; the first part of the adapter plate is configured to be electrically connected with at least one first electronic device in the electronic equipment, and the first electronic device is located outside the projection area of the main circuit board. In this way, the adapter plate can extend to the area where the main circuit board cannot be arranged, and the adapter plate can be used for achieving electric connection between at least one first electronic device outside the projection area of the main circuit board and the main circuit board.

Description

Technical Field

[0001] This application relates to the technical field of terminal devices, and particularly to a circuit board assembly and an electronic device. Background Art

[0002] With the development of electronic devices, users have more and more functional requirements for electronic devices, and thus more and more electronic components need to be arranged in the electronic devices. Each electronic component is connected to a circuit board arranged in the electronic device for signal transmission.

[0003] However, since each electronic component is located at different spatial positions in the electronic device and there is a height difference between the electronic components in the thickness direction, it causes a situation where some electronic components obstruct the arrangement of the circuit board, making the circuit board unable to extend to all areas in the electronic device to be electrically connected to the corresponding electronic components. It can be seen that in the limited space of the electronic device, there is an easy situation where some electronic components cannot be electrically connected to the circuit board. Summary of the Invention

[0004] This application provides a circuit board assembly and an electronic device to solve the problem that electronic components cannot be electrically connected to the circuit board.

[0005] In a first aspect, this application provides a circuit board assembly, including: a main circuit board and an adapter board. The adapter board is electrically connected to the main circuit board, and the adapter board includes a first part located outside the projection area of the main circuit board; the first part of the adapter board is configured to be electrically connected to at least one first electronic component in the electronic device, and the first electronic component is located outside the projection area of the main circuit board.

[0006] In the circuit board assembly provided by the embodiments of this application, the adapter board is electrically connected to the main circuit board, and the first part of the adapter board extends towards the area outside the projection area of the main circuit board relative to the main circuit board. In this way, the adapter board can extend to the area where the main circuit board cannot be arranged, and the adapter board can be used to realize the electrical connection between at least one first electronic component outside the projection area of the main circuit board and the main circuit board.

[0007] In one implementation, the adapter board further includes a second part located within the projection area of the main circuit board; the main circuit board includes a first surface; the second part of the adapter board is stacked on the first surface. In this way, the adapter board and the main circuit board are in a stacked structure, which will not occupy too much space and can realize the thinning and lightening of the electronic device.

[0008] In one implementation, the first surface of the main circuit board includes connection pads; the connection pads are used to achieve at least one of electrical connection and fixed connection between the main circuit board and the second part of the adapter board. The connection pads include signal connection pads and / or strength connection pads; the second part of the adapter board is electrically connected and fixedly connected to the main circuit board through the signal connection pads; the second part of the adapter board is fixedly connected to the main circuit board through the strength connection pads. In this way, not only can the electrical connection and fixed connection between the main circuit board and the adapter board be achieved by using the signal connection pads, but also the soldering strength can be further increased by using the strength connection pads, improving the reliability of the stacked soldering of the main circuit board and the adapter board.

[0009] In one implementation, the center of gravity of the adapter board is located in the second part. In this way, the first part of the adapter board can be prevented from being distorted or deformed due to its own weight, so as to reduce the stress generated by the adapter board.

[0010] In one implementation, a reinforcing component is further included; the reinforcing component is located on the surface of the adapter board facing away from the main circuit board. In this way, the strength of the adapter board can be improved by using the reinforcing component, preventing the adapter board from deforming under stress, and thus ensuring the strength of the circuit board assembly.

[0011] In one implementation, the reinforcing component includes a first end and a second end; the first end extends to the second part of the adapter board and covers part or all of the area of the second part; the second end extends to the first part of the adapter board and covers part or all of the area of the first part. In this way, the reinforcing component can cover the areas of the adapter board where large stress is likely to occur, and thus reduce the influence of stress on the signal connection pads and the strength connection pads. The reinforcing component can also avoid the signal connection pads and the strength connection pads from failing due to stress while increasing the strength of the adapter board, improving the reliability of the circuit board assembly.

[0012] In one implementation, the first electronic device includes at least one of an antenna elastic sheet, an ambient light sensor, a flash, an infrared sensor, a time-of-flight sensor, a microphone, a camera module, and a display module. The main circuit board further includes a second surface opposite to the first surface, and a through hole penetrating the first surface and the second surface; the second part of the adapter board covers the through hole, and the through hole is configured to accommodate the connector of the camera module so that the connector is electrically connected to the second part of the adapter board. In this way, the adapter board can facilitate the electrical connection between the electronic devices in different spaces inside the electronic device and the main circuit board.

[0013] In one implementation, a grounding elastic sheet is further included; the grounding elastic sheet is located on the side of the reinforcing component facing away from the adapter board, and the grounding elastic sheet is fixedly arranged; the grounding elastic sheet is configured to elastically connect with one of the middle frame of the electronic device and the first part of the adapter board, so as to form a signal return path to the ground with the middle frame, the antenna elastic sheet, the main circuit board, and the adapter board. In this way, signal transmission can be achieved.

[0014] In one implementation, the grounding spring piece is fixed on the adapter board, and the grounding spring piece is elastically connected to the middle frame; alternatively, the grounding spring piece is fixed on the middle frame, and the grounding spring piece is elastically connected to the first part of the adapter board. In this way, the grounding spring piece can adopt two fixing methods, and thus can adopt two elastic connection methods to form a signal return path to the ground, which is suitable for the usage requirements of different electronic devices.

[0015] In one implementation, the middle frame includes a groove; the grounding spring piece includes a fixed end and an elastic end; the fixed end is located in the groove, the elastic end bends towards the adapter board, and is elastically connected to the first part of the adapter board. In this way, embedding the grounding spring piece into the middle frame can save space and avoid increasing the body thickness of the electronic device.

[0016] In a second aspect, the present application provides an electronic device, including: a middle frame, and a screen and a rear case located on opposite sides of the middle frame; the circuit board assembly provided in the first aspect is located on the middle frame, the main circuit board faces the rear case, and the adapter board faces the screen; the first camera module and the second camera module are spaced apart on the middle frame and are both outside the projection area of the main circuit board; the lens of the first camera module faces the screen, and the lens of the second camera module faces the rear case; the connector of the first camera module passes through a through hole on the main circuit board and is electrically connected to the second part of the adapter board; the first part of the adapter board is located between the first camera module and the second camera module; the antenna spring piece is outside the projection area of the main circuit board, the antenna spring piece is between the first camera module and the second camera module and on the outer side relative to the main circuit board, and the antenna spring piece is electrically connected to the first part of the adapter board.

[0017] The electronic device provided by the embodiments of the present application can rely on the adapter board to meet the connection requirements of different electronic components to the main circuit board in different spaces. At the same time, the adapter board and the main circuit board are connected by soldering, which can save the space of the connection part. And considering various aspects such as soldering strength and production reliability, the reliability ability is further improved.

[0018] In one implementation, it further includes: a flexible circuit board; one end of the flexible circuit board is located between the first camera module and the rear case, the other end of the flexible circuit board extends towards the first part of the adapter board and is electrically connected to the first part of the adapter board; and, the second camera module includes an ambient light sensor and a flash; the ambient light sensor and the flash are located on the side of the flexible circuit board facing the rear case, and the ambient light sensor and the flash are electrically connected to the first part of the adapter board through the flexible circuit board. In this way, not only can the adapter board be used to realize the electrical connection between electronic components with a height difference and the main circuit board; but also the electronic components in the second camera module can be arranged on the back of the first camera module, which can save the space of the electronic device, and thus the electronic device can be made thinner and lighter. Description of the Drawings

[0019] To more clearly illustrate the technical solutions of the present application, the accompanying drawings required for use in the embodiments will be briefly introduced below. Obviously, for those of ordinary skill in the art, other accompanying drawings can be obtained based on these drawings without creative efforts.

[0020] Figure 1 is a schematic structural diagram of the electronic device provided by an embodiment of the present application;

[0021] Figure 2 is Figure 1 a partial schematic diagram of area A in

[0022] Figure 3 is a first schematic structural diagram of the circuit board assembly provided by an embodiment of the present application;

[0023] Figure 4 is a second schematic structural diagram of the circuit board assembly provided by an embodiment of the present application;

[0024] Figure 5 is a schematic structural diagram of the main circuit board 100 provided by an embodiment of the present application;

[0025] Figure 6 is a schematic welding structure diagram of the main circuit board 100 and the adapter board 200 provided by an embodiment of the present application;

[0026] Figure 7 is a first schematic diagram of arranging pads provided by an embodiment of the present application;

[0027] Figure 8 is a second schematic diagram of arranging pads provided by an embodiment of the present application;

[0028] Figure 9 is a first top view of the circuit board assembly provided by an embodiment of the present application;

[0029] Figure 10 is a third schematic structural diagram of the circuit board assembly provided by an embodiment of the present application;

[0030] Figure 11 is a second top view of the circuit board assembly provided by an embodiment of the present application;

[0031] Figure 12 is a schematic internal structure diagram of the electronic device provided by an embodiment of the present application;

[0032] Figure 13 is Figure 12 a schematic structural diagram of the C-C cross-section in

[0033] Figure 14 is Figure 13 a partial schematic diagram of area D in Detailed implementation manners

[0034] The following will clearly describe the technical solutions in the embodiments of the present application with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments of the present application, other embodiments obtained by those of ordinary skill in the art without creative efforts all fall within the protection scope of the present application.

[0035] Hereinafter, terms such as "first" and "second" are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, features defined with "first", "second", etc. may explicitly or implicitly include one or more of such features. In the description of the present application, unless otherwise stated, the meaning of "a plurality" is two or more.

[0036] In addition, in the present application, orientation terms such as "upper" and "lower" are defined relative to the orientation of the components shown in the accompanying drawings. It should be understood that these directional terms are relative concepts, which are used for relative description and clarification, and they may change accordingly with the change of the orientation of the components placed in the accompanying drawings.

[0037] The following will explain the professional terms mentioned in the embodiments of the present application to facilitate the understanding of those skilled in the art.

[0038] An antenna feed point refers to the connection position between a cable and an antenna.

[0039] Elastic connection can be understood as the connection of a device to a circuit board using a spring device.

[0040] A board-to-board (B2B) connector is a type of micro-coupling plug and socket that can directly connect power and signals between printed circuit boards through the pins of the connector. The B2B connector not only has the strongest transmission ability, but also has characteristics such as being thin, light, stable in high-frequency transmission, solderless, and noise reduction.

[0041] The electronic device described in the embodiments of the present application includes but is not limited to mobile phones, foldable mobile phones, laptops, tablets, laptops, personal digital assistants, or wearable devices, etc. The following will take a foldable mobile phone as an example for explanation.

[0042] Figure 1 It is a schematic structural diagram of the electronic device provided by the embodiments of the present application.

[0043] As Figure 1As shown in the figure, the electronic device 100A may include a first body 10, a second body 20, a screen 30, and a rotating shaft assembly 40. The first body 10 and the second body 20 are respectively disposed on both sides of the axis direction of the rotating shaft assembly 40. The first body 10 and the second body 20 are respectively connected to the rotating shaft assembly 40 and can rotate through the rotating shaft assembly 40 to reduce the angle between the first body 10 and the second body 20 until the electronic device 100A presents a folded state, or increase the angle between the first body 10 and the second body 20 until the electronic device 100A presents an unfolded state.

[0044] The screen 30 covers the first body 10, the second body 20, and the rotating shaft assembly 40 and is respectively connected to the first body 10 and the second body 20. Exemplarily, the screen 30 may adopt a bendable flexible screen. When the electronic device 100A is in the unfolded state, the rotating shaft assembly 40 is also in the unfolded state. In the unfolded state, the first body 10 and the second body 20 are parallelly distributed on both sides of the rotating shaft assembly 40, and the screen 30 is laid flat on the rotating shaft assembly 40 in the unfolded state. When the electronic device 100A is in the folded state, the rotating shaft assembly 40 is also in the folded state. In the folded state, the first body 10 and the second body 20 are relatively distributed on both sides of the rotating shaft assembly 40, and the rotating shaft assembly 40 presses the screen 30 into a water droplet shape.

[0045] To facilitate the description of the positions of the various components in the electronic device 100A, the embodiments of the present application exemplarily establish a three-dimensional coordinate system based on the electronic device 100A. Among them, the x-axis direction is the width direction of the electronic device 100A, the y-axis direction is the length direction of the electronic device 100A, and the z-axis direction is the thickness direction of the electronic device 100A.

[0046] A plurality of electronic devices and circuit boards are configured in both the first body 10 and the second body 20, and each electronic device is electrically connected to the corresponding circuit board. The electronic devices include but are not limited to circuit boards, camera modules, antenna elastomers, ambient light sensors, flashlights, time-of-flight sensors, infrared sensors, microphones, speaker modules, batteries, and display screen modules, etc., which are not listed one by one here.

[0047] Inside the electronic device 100A, since there is a situation where some electronic devices hinder the layout space of the circuit board, the circuit board cannot extend to all areas inside the electronic device 100A, so that the electronic devices located outside the projection area of the circuit board cannot be electrically connected to the circuit board. In order to realize the electrical connection between the electronic devices located outside the projection area of the circuit board and the circuit board, although it can be achieved by relying on hard board spring connection or B2B connector transfer. However, due to the limited internal space of the electronic device 100A and the need to meet the requirement of the thin and light of the electronic device 100A, the above-mentioned hard board spring connection or B2B connector will occupy part of the space of the electronic device 100A, resulting in the electronic device 100A being unable to achieve thin and light.

[0048] To meet the requirement of thinning of the electronic device 100A and to achieve the electrical connection between each electronic component in the electronic device 100A and the circuit board, the embodiments of the present application provide a circuit board assembly and an electronic device.

[0049] Figure 2 is Figure 1 A partial schematic view of area A in Figure 2 The perspective shown is the perspective of the rear case, and the rear case is not shown.

[0050] Combined with Figure 1 and Figure 2 As shown, in some embodiments, taking the first body 10 as an example, the first body 10 may include a middle frame 11 and a rear case (not shown in the figure). The screen 30 and the rear case are located on opposite sides of the middle frame 11. A partial area of the screen 30 covers the middle frame 11, and another partial area of the screen 30 covers the middle frame of the second body 20 (not shown in the figure).

[0051] A circuit board assembly and each electronic component in the first body 10 are provided on the middle frame 11. Each electronic component is located at a different position on the middle frame 11 and can be electrically connected to the circuit board assembly.

[0052] In some embodiments, the circuit board assembly may include: a main circuit board 100 and an adapter board 200. Along the thickness (z-axis) direction, the main circuit board 100 and the adapter board 200 are stacked, and the adapter board 200 is electrically connected to the main circuit board 100.

[0053] It should be noted that both the main circuit board 100 and the adapter board 200 adopt rigid printed circuit boards (PCBs). The adapter board 200 can be understood as a secondary circuit board used in cooperation with the main circuit board 100.

[0054] Figure 3 This is the first structural schematic diagram of the circuit board assembly provided by the embodiments of the present application.

[0055] As Figure 3 shown, in some embodiments, the main circuit board 100 includes opposite first surface 101 and second surface 102. Combined with Figure 1 and Figure 2 , the first surface 101 faces the screen 30, and the second surface 102 faces the rear case.

[0056] The adapter board 200 may include a first part 201 and a second part 202. The first part 201 is located outside the projection area of the main circuit board 100, and the second part 202 is located inside the projection area of the main circuit board 100. The extending direction of the first part 201 relative to the main circuit board 100 is parallel to the x-axis direction.

[0057] The second part 202 of the adapter board 200 is stacked on the first surface 101; the first part 201 of the adapter board 200 is configured to be electrically connected to at least one first electronic component in the electronic device 100A, and the first electronic component is located outside the projection area of the main circuit board.

[0058] Exemplarily, the first electronic component may include at least one of an antenna elastic sheet, an ambient light sensor, a flash, an infrared sensor, a time-of-flight sensor, a microphone, a camera module, a display module, etc.

[0059] In the circuit board assembly provided by the embodiment of the present application, the adapter board 200 is electrically connected to the main circuit board 100, and the first part 201 of the adapter board 200 extends relative to the main circuit board 100 to an area outside the projection area of the main circuit board 100. In this way, the adapter board 200 can be used to extend to an area where the main circuit board 100 cannot be arranged, and the first part 201 of the adapter board 200 is electrically connected to at least one first electronic component located outside the projection area of the main circuit board 100, so that at least one first electronic component outside the projection area of the main circuit board 100 can be electrically connected to the main circuit board 100. Moreover, the adapter board 200 and the main circuit board 100 are in a stacked structure, and the adapter board 200 is thinner and does not occupy too much space, so that the electronic device 100A can be made thinner and lighter.

[0060] Figure 4 It is the second structural schematic diagram of the circuit board assembly provided by the embodiment of the present application.

[0061] Combined with Figure 3 and Figure 4 As shown, in some embodiments, the main circuit board 100 may further include a through hole 103 penetrating the first surface 101 and the second surface 102.

[0062] The second part 202 of the adapter board 200 covers the through hole 103; the through hole 103 may be located on one side of the main circuit board 100 adjacent to the first part 201 of the adapter board 200, that is to say, the through hole 103 is located in an area adjacent to the area outside the projection area of the main circuit board 100. In this way, it is convenient for the electronic components located outside the projection area of the main circuit board 100 to pass through the through hole 103 and be electrically connected to the second part 202 of the adapter board 200, and thus be electrically connected to the main circuit board 100.

[0063] Exemplarily, the through hole 103 is configured to accommodate the connector of the camera module so that the connector is electrically connected to the second part 202 of the adapter board 200. The specific content of the electrical connection between the connector and the second part 202 of the adapter board 200 can be referred to the following content and will not be elaborated here.

[0064] Figure 5It is a schematic structural diagram of the main circuit board 100 provided by an embodiment of the present application.

[0065] As Figure 5 shown, in some embodiments, the first surface 101 of the main circuit board 100 may include connection pads for implementing at least one of electrical connection and fixed connection between the main circuit board 100 and the second part 202 of the adapter board 200.

[0066] The connection pads can be configured with different functions according to usage requirements. Exemplarily, if it is necessary to implement signal connection between two circuit boards and the requirement for connection strength is not high, the connection pads can be configured with signal connection function; if it is necessary to ensure the connection strength between two circuit boards while signal transmission is required, the connection pads can be configured with both signal connection function and strength connection function; if only fixed connection between two circuit boards is required, the connection pads can be configured with strength connection function.

[0067] The connection pads may include signal connection pads 301 and / or strength connection pads 302. The signal connection pads 301 are used to implement signal connection function to achieve electrical connection and fixed connection between two circuit boards, and the strength connection pads 302 are used to implement strength connection function to achieve fixed connection between two circuit boards.

[0068] The signal connection pads 301 and / or strength connection pads 302 may be located at the edge of the through hole 103. Exemplarily, the connection pads include signal connection pads 301 which are located at the edge of the through hole 103; the connection pads include signal connection pads 301 and strength connection pads 302, and the signal connection pads 301 and strength connection pads 302 are located at the edge of the through hole 103; the connection pads include strength connection pads 302 which are located at the edge of the through hole 103.

[0069] Figure 6 It is a schematic welding structure diagram of the main circuit board 100 and the adapter board 200 provided by an embodiment of the present application.

[0070] Combined Figure 5 and Figure 6As shown, in some embodiments, the signal connection pad 301 and / or the strength connection pad 302 may be located between the second part 202 of the adapter board 200 and the main circuit board 100. Pins (not shown in the figure) may be provided on the surface of the second part 202 of the adapter board 200 facing the main circuit board 100. The second part 202 of the adapter board 200 is electrically connected to the signal connection pad 301 through the pins to achieve the electrical connection between the second part 202 of the adapter board 200 and the main circuit board 100 for signal transmission. At the same time, the second part 202 of the adapter board 200 and the signal connection pad 301 can also achieve a fixed connection, so that there is a certain connection strength between the adapter board 200 and the main circuit board 100; the second part 202 of the adapter board 200 is fixedly connected to the main circuit board 100 through the strength connection pad 302 to further increase the connection strength between the adapter board 200 and the main circuit board 100.

[0071] In this way, when stacking the main circuit board 100 and the adapter board 200, different requirements can be achieved through different connection pads. It can not only use the signal connection pad 301 to achieve the electrical connection and fixed connection between the main circuit board 100 and the adapter board 200, but also use the strength connection pad 302 to further increase the welding strength and improve the reliability of the stacked welding of the main circuit board 100 and the adapter board 200. At the same time, by using the connection pads to connect the main circuit board 100 and the adapter board 200, the space of the connection part can be saved, and thus the requirement of thinning the electronic device 100A can be achieved.

[0072] Figure 7 It is the first schematic diagram of arranging pads provided by the embodiment of the present application.

[0073] As Figure 7 shown, in some embodiments, the main circuit board 100 may include a first edge 100a, and the first edge 100a of the main circuit board 100 is adjacent to the first part 201 of the adapter board 200 extending to the outside.

[0074] After arranging electronic devices on the first part 201 of the adapter board 200, for example, arranging electronic devices at the B point position of the first part 201. The electronic device exerts a pressure on the adapter board 200 due to its own weight, causing the adapter board 200 to be deformed by the force and generating different degrees of stress in different regions of the adapter board 200. The stress generated in the region of the adapter board 200 adjacent to the force application point B is greater than the stress generated in the region away from the force application point B. That is to say, the stress generated in the region B1 of the adapter board 200 adjacent to the first edge 100a of the main circuit board 100 is greater than the stress generated in the region B2 of the adapter board 200 away from the first edge 100a of the main circuit board 100, and the region B2 is close to the center of the main circuit board 100 along the x-axis direction.

[0075] Excessive stress generated on the adapter board 200 can cause the pads connected to it to fail, affecting the reliability of the circuit board assembly. If the signal connection pad 301 fails, the signal connection pad 301 will lose its signal transmission function and strength connection function; if the strength connection pad 302 fails, the connection strength between the main circuit board 100 and the adapter board 200 will be reduced, or even the connection strength will be lost. Therefore, taking the connection pads including the signal connection pad 301 and the strength connection pad 302 as an example, in order to avoid excessive stress from affecting the reliability of the circuit board assembly, the signal connection pad 301 and the strength connection pad 302 can be arranged on the main circuit board 100 according to the stress magnitude.

[0076] In some embodiments, the signal connection pad 301 is arranged in the area of the main circuit board 100 corresponding to the small stress area B2, and the strength connection pad 302 is arranged in the area of the main circuit board 100 corresponding to the large stress area B1. In this way, arranging the signal connection pad 301 in the small stress area B2 can not only achieve the electrical connection and fixed connection between the main circuit board 100 and the adapter board 200, but also ensure that the signal connection pad 301 is not easily damaged, improving the signal transmission quality and efficiency, and ensuring a certain connection strength between the adapter board 200 and the main circuit board 100. Using the strength connection pad 302 can increase the strength of the area of the main circuit board 100 and the adapter board 200 corresponding to the large stress area B1, further increasing the connection strength between the adapter board 200 and the main circuit board 100, and ensuring the reliability of the circuit board assembly; and the strength connection pad 302 corresponds to the GND grounding network, so even if the strength connection pad 302 fails, it will not affect signal transmission.

[0077] In some embodiments, referring again to Figure 7 , in order to improve the connection strength between the main circuit board 100 and the adapter board 200 and avoid the pads in the large stress area B1 from failing and affecting the connection strength, the strength connection pad 302 can include a first strength connection pad 302-1 and a second strength connection pad 302-2. The signal connection pad 301, the first strength connection pad 302-1, and the second strength connection pad 302-2 are arranged around the edge of the through hole 103.

[0078] The signal connection pad 301 is located in the area of the through hole 103 away from the top of the main circuit board 100, and the signal connection pad 301 is located in the small stress area B2; the first strength connection pad 302-1 and the second strength connection pad 302-2 are located on opposite sides of the through hole 103 along the x-axis direction. The first strength connection pad 302-1 is adjacent to the first part 201 of the adapter board 200, and the first strength connection pad 302-1 is located in the large stress area B1; the second strength connection pad 302-2 is away from the first part 201 of the adapter board 200 along the x-axis direction, and the second strength connection pad 302-2 is located in the small stress area B2.

[0079] In this way, the signal connection pad 301 and the second-strength connection pad 302-2 are arranged in the small stress area B2, and the first-strength connection pad 302-1 is arranged in the large stress area B1. By increasing the layout area of the strength connection pad 302 at the edge of the via hole 103, the fixing strength between the main circuit board 100 and the adapter board 200 can be improved; moreover, even if the first-strength connection pad 302-1 in the large stress area B1 fails due to excessive stress and affects the connection strength, the connection strength between the main circuit board 100 and the adapter board 200 can still be ensured by using the second-strength connection pad 302-2 in the small stress area B2.

[0080] Figure 8 It is the second schematic diagram of arranging pads provided by the embodiment of the present application.

[0081] As Figure 8 shown, in some embodiments, in order to improve the signal transmission quality and efficiency between the main circuit board 100 and the adapter board 200, the signal connection pad 301 may include a first signal connection pad 301-1 and a second signal connection pad 301-2.

[0082] Exemplarily, the first signal connection pad 301-1 is located in the area away from the top of the main circuit board 100 of the via hole 103, and the first signal connection pad 301-1 is located in the small stress area B2; the second signal connection pad 301-2 and the strength connection pad 302 are located on opposite sides of the via hole 103 along the first direction. The strength connection pad 302 is adjacent to the first part 201 of the adapter board 200, and the strength connection pad 302 is located in the large stress area B1; the second signal connection pad 301-2 is away from the first part 201 of the adapter board 200 along the x-axis direction, and the second signal connection pad 301-2 is located in the small stress area B2.

[0083] In this way, the first signal connection pad 301-1 and the second signal connection pad 301-2 are arranged in the small stress area B2, and the strength connection pad 302 is arranged in the large stress area B2. The first signal connection pad 301-1 and the second signal connection pad 301-2 are not easily damaged, and by increasing the layout area of the signal connection pad 301 at the edge of the via hole 103, the signal transmission quality and efficiency between the main circuit board 100 and the adapter board 200 can be improved.

[0084] In some embodiments, the projected area of the second part 202 of the adapter board 200 is larger than the projected area of the first part 201, so that the center of gravity of the adapter board 200 is located in the second part 202. Exemplarily, the ratio of the projected area of the second part 202 to the total projected area of the adapter board 200 can be 60%-70%, and the ratio of the projected area of the first part 201 to the total projected area of the adapter board 200 can be 30%-40%.

[0085] In this way, when no electronic devices are arranged on the first part 201 of the adapter board 200, the first part 201 can be prevented from being distorted or deformed due to its own weight, so as to reduce the stress generated by the adapter board 200, and it can also be avoided that the first part 201 of the deformed adapter board 200 contacts other structural components in the electronic device 100A and causes damage; and, when a plurality of electronic devices are arranged on the first part 201 of the adapter board 200, it can also be avoided that the adapter board 200 is deformed by the self-weight of the plurality of electronic devices and generates greater stress. Therefore, locating the center of gravity of the adapter board 200 at the second part 202 can ensure the performance of the circuit board assembly.

[0086] In some embodiments, in combination with Figure 7 and Figure 8 As shown, the second part 202 of the adapter board 200 further includes a first outward expansion part 2021 and a second outward expansion part 2022. The first outward expansion part 2021 expands outward along the y-axis direction to the top of the main circuit board 100, and the second outward expansion part 2022 expands outward along the x-axis direction away from the first edge 100a.

[0087] Although a relatively large stress is generated in the second part 202 of the adapter board 200 near the stress point B, the first outward expansion part 2021 is far from the stress point B of the adapter board 200, and the stress generated at the first outward expansion part 2021 is relatively smaller than the stress generated in the area of the second part 202 of the adapter board 200 near the stress point B. Therefore, the strength connection pad 302 corresponding to the first outward expansion part 2021 is not easily affected by stress.

[0088] The second outward expansion part 2022 is far from the stress point B of the adapter board 200 and is closer to the center of the main circuit board 100, and the stress generated at the second outward expansion part 2022 is small. Therefore, signal connection pads 301 and / or strength connection pads 302 can be arranged in the area corresponding to the second outward expansion part 2022, which can improve the signal transmission quality and efficiency, and improve the connection strength.

[0089] Figure 9 This is the first top view of the circuit board assembly provided by the embodiment of the present application.

[0090] As Figure 9 shown, in some embodiments, the through hole 103 is adjacent to the first edge 100a of the main circuit board 100, and there is a first width W between the second edge of the through hole 103 and the first edge 100a of the main circuit board 100 1 . The second part 202 of the adapter board 200 covers the through hole 103, and the third edge of the second part 202 is located between the second edge of the through hole 103 and the first edge 100a of the main circuit board 100, so that there is a second width W between the third edge of the second part 202 and the second edge of the through hole 1032 and the second width W 2 is less than or equal to the first width W 1 .

[0091] On one side adjacent to the first edge 100a of the main circuit board 100, there is an overlapping narrow strip area with a width of W (not shown in the figure) between the second part 202 and the main circuit board 100. Combining 2 , the overlapping narrow strip area can be provided with strength connection pads 302. In this way, the stability of the main circuit board 100 and the adapter board 200 can be improved by using the overlapping narrow strip area, and further the mass production and production reliability of the circuit board assembly in the production process can be ensured. Figure 6

[0092] Figure 10 FIG. is the third structural schematic diagram of the circuit board assembly provided by the embodiment of the present application.

[0093] As Figure 10 shown, in some embodiments, the circuit board assembly may further include a reinforcing member 400.

[0094] The reinforcing member 400 is located on the surface of the adapter board 200 facing away from the main circuit board 100, and the reinforcing member 400 is adjacent to the first surface 101 of the main circuit board 100.

[0095] In this way, the strength of the adapter board 200 can be improved by using the reinforcing member 400, and the adapter board 200 can be prevented from deforming under force, and further the strength of the circuit board assembly can be ensured.

[0096] Figure 11 FIG. is the second top view of the circuit board assembly provided by the embodiment of the present application.

[0097] As Figure 11 shown, in some embodiments, the reinforcing member 400 may include a first end 401 and a second end 402.

[0098] The first end 401 extends to the second part 202 of the adapter board 200 and covers part or all of the area of the second part 202; the second end 402 extends to the first part 201 of the adapter board 200 and covers part or all of the area of the first part 201.

[0099] Exemplarily, the first end 401 may include a first protrusion 4011 and a second protrusion 4012. The first protrusion 4011 protrudes towards the position where the signal connection pad 301 is located, and the second protrusion 4012 protrudes towards the position where the strength connection pad 302 is located; at least part of the first protrusion 4011 and at least part of the second protrusion 4012 cover part of the area of the through hole 103.

[0100] ​The first part 201 of the adapter board 200 is weaker in strength relative to the second part 202 connected to the main circuit board 100, and a through hole 103 is provided in the area where the main circuit board 100 is electrically connected to the second part 202 of the adapter board 200, making the strength at the first edge 100a of the main circuit board 100 weaker.

[0101] In this way, the reinforcing member 400 can increase the strength and hardness of the adapter board 200 and the main circuit board 100. The reinforcing member 400 can cover the area of the adapter board 200 where large stress is likely to occur, thereby reducing the influence of stress on the signal connection pads 301 and the strength connection pads 302. The reinforcing member 400 can also avoid the signal connection pads 301 and the strength connection pads 302 from failing due to stress while increasing the strength of the adapter board 200, improving the performance of the circuit board assembly.

[0102] Figure 12 It is a schematic diagram of the internal structure of the electronic device provided by the embodiment of the present application. Among them, Figure 12 is Figure 2 the top view of Figure 12 The flexible circuit board 54 is not shown in

[0103] Combined with Figure 1 、 Figure 2 and Figure 12 As shown, in the electronic device 100A, the circuit board assembly is located on the middle frame 11. Supporting the circuit board assembly by the middle frame 11 can reduce the reliability risk. The main circuit board 100 is away from the middle frame 11 and faces the rear shell; the adapter board 200 is close to the middle frame 11 and faces the screen 30. The circuit board assembly can be the circuit board assembly provided in any of the foregoing embodiments, which will not be elaborated here.

[0104] The electronic device 100A may include a first camera module 51, a second camera module 52, and an antenna elastic sheet 53. The first camera module 51, the second camera module 52, and the antenna elastic sheet 53 are all electronic devices located outside the projection area of the main circuit board 100.

[0105] The electronic device 100A includes a bending part 12 connected to the middle frame 11. The bending part 12 is used to accommodate the second body 20 when the electronic device 100A is in a folded state. The first camera module 51 and the second camera module 52 are spaced apart on the middle frame 11 and are located within the bending part 12. The thickness of the bending part 12 is greater than the thickness of the first body 10. Arranging the first camera module 51 and the second camera module 52 in the bending part 12 can avoid increasing the thickness of the first body 10 and achieve the thin and light of the electronic device 100A.

[0106] The lens of the first camera module 51 (not shown in the figure) faces the screen 30. Exemplarily, the first camera module 51 can be a front camera. The lens of the second camera module 52 faces the rear shell. Exemplarily, the second camera module 52 can be a rear camera.

[0107] The first camera module 51 includes a hard board component, which faces the rear housing, and includes a hard board 511, a flexible board 512 connected to the hard board 511, and a connector 513 connected to the flexible board 512. There is a height difference between the hard board 511 and the main circuit board 100, and the hard board 511 cannot be directly electrically connected to the main circuit board 100; and the hard board 511 and the second surface 102 of the main circuit board 100 are both facing the rear housing, and the second surface 102 of the main circuit board 100 is not arranged with a circuit, so that the hard board 511 cannot be electrically connected to the main circuit board 100.

[0108] In some embodiments, the first surface 101 of the main circuit board 100 is provided with circuits, the first surface 101 of the main circuit board 100 is electrically connected to the adapter board 200, and a through hole 103 is provided at a position of the main circuit board 100 adjacent to the first camera module 51. In this way, the hard board 511 of the first camera module 51 is connected to a connector 513 through a flexible board 512, so that the connector 513 is bent to the second surface 102 of the main circuit board 100 through the flexible board 512, and passes through the through hole 103 on the main circuit board 100, so that the connector 513 is electrically connected to the second portion 202 of the adapter board 200. The first portion 201 of the adapter board 200 is located between the first camera module 51 and the second camera module 52, and extends in a direction away from the main circuit board 100.

[0109] In this way, the electronic device 100A can reasonably utilize its internal space, which will not cause waste of space, and can also enable electronic devices that were originally unable to be electrically connected to the main circuit board 100 to be electrically connected to the main circuit board 100 using the adapter board 200; and, the connector 513 is embedded in the main circuit board 100, which can also prevent the connector 513 from increasing the thickness of the first body 10.

[0110] In some embodiments, the second camera module 52 may include an ambient light sensor 521 and a flash 522. In order to fully utilize the space of the electronic device 100A, the ambient light sensor 521 and the flash 522 are arranged on the projection of the first camera module 51, that is, the ambient light sensor 521 and the flash 522 are arranged on the back side of the first camera module 51 (the side of the hard board 511).

[0111] Since there is a height difference between the back surface of the first camera module 51 and the main circuit board 100, in order to facilitate the connection of the ambient light sensor 521 and the flash 522 to the main circuit board 100, the electronic device 100A further includes a flexible circuit board 54. One end of the flexible circuit board 54 is located between the first camera module 51 and the rear case, and one end of the flexible circuit board 54 is located on the rigid board 511; the other end of the flexible circuit board 54 extends toward the first part 201 of the adapter board 200.

[0112] Elastic pieces 55 are arranged on the first part 201 of the adapter board 200, and the elastic pieces 55 are electrically connected to the first part 201 of the adapter board 200. The other end of the flexible circuit board 54 is electrically connected to the adapter board 200 through the elastic pieces 55. The ambient light sensor 521 and the flash 522 are located on the side of the flexible circuit board 54 facing the rear case, and the ambient light sensor 521 and the flash 522 are electrically connected to the first part 201 of the adapter board 200 through the flexible circuit board 54.

[0113] In this way, by arranging the electronic devices in the second camera module 52 on the back surface of the first camera module 51, the space of the electronic device 100A can be saved, and thus the electronic device 100A can be made thinner and lighter. Moreover, by using the first part 201 of the outwardly extending adapter board 200 to provide a layout space for other first electronic devices and the required elastic pieces, it is convenient to electrically connect the electronic devices such as the ambient light sensor 521 and the flash 522 located outside the projection area of the main circuit board 100 to the main circuit board 100.

[0114] In some embodiments, electronic devices such as a time-of-flight sensor, an infrared sensor, and a microphone can also be arranged on the back surface of the first camera module 51. The time-of-flight sensor, the infrared sensor, and the microphone and other electronic devices can all be electrically connected to the adapter board 200 below them through the flexible circuit board 54. Correspondingly, for complex electronic devices, a B2B connector can also be arranged on the first part 201 of the adapter board 200, so as to facilitate the electrical connection between the flexible circuit board 54 and the adapter board 200, or the electrical connection between the electronic device and the adapter board 200.

[0115] In some embodiments, the antenna elastic piece 53 is located between the first camera module 51 and the second camera module 52 and on the outer side relative to the main circuit board 100. The antenna elastic piece 53 is adjacent to the frame 13 of the middle frame 11 to be electrically connected to the antenna on the frame 13 to form an antenna feed point. The antenna elastic piece 53 is located on the first part 201 of the adapter board 200 and is electrically connected to the first part 201. In this way, the electrical connection between the antenna, the antenna elastic piece 53, the adapter board 200, and the main circuit board 200 can be realized to achieve the transmission of antenna signals.

[0116] In some embodiments, a ground point needs to be set near the antenna feed point so that the middle frame 11, the antenna elastic sheet 53, the main circuit board 100, and the adapter board 200 form a signal ground path to achieve the transmission of antenna signals. Exemplarily, the ground point can be achieved by arranging an under-board elastic sheet on the adapter board 200, or by spot-welding an elastic sheet on the middle frame 11 and elastically connecting it to the adapter board 200.

[0117] Figure 13 Is Figure 12 The structural schematic diagram of the C-C cross-section in.

[0118] As Figure 13 As shown, in some embodiments, the adapter board 200 is adjacent to the middle frame 11, and the reinforcing member 400 is located between the adapter board 200 and the middle frame 11.

[0119] The circuit board assembly may further include a ground elastic sheet 500. The ground elastic sheet 500 is used as a ground point near the antenna feed point.

[0120] The ground elastic sheet 500 is located on the side of the reinforcing member 400 away from the adapter board 200, and the ground elastic sheet 500 is closer to the screen side. The ground elastic sheet 500 is fixedly arranged. Exemplarily, the ground elastic sheet 500 can be fixed on the adapter board 200 or on the middle frame 11.

[0121] The ground elastic sheet 500 is configured to elastically connect with one of the middle frame 11 of the electronic device and the first part 201 of the adapter board 200 to form a signal ground path with the middle frame 11, the antenna elastic sheet 53, the main circuit board 100, and the adapter board 200. Exemplarily, the ground elastic sheet 500 is fixed on the adapter board 200 and elastically connected with the middle frame 11 to facilitate the subsequent formation of a signal ground path; or, the ground elastic sheet 500 is fixed on the middle frame 11 and elastically connected with the first part 201 of the adapter board 200 to facilitate the subsequent formation of a signal ground path.

[0122] In some embodiments, in the scenario where the ground elastic sheet 500 is fixed on the middle frame 11, the middle frame 11 of the electronic device 100A includes a groove 14, and the groove 14 is formed by the surface of the middle frame 11 facing the upper side ( Figure 13 in the shown state) of the rear shell and recessing in the direction of the lower side ( Figure 13 in the shown state) of the screen.

[0123] Figure 14 Is Figure 13 The partial schematic diagram of the D area in.

[0124] As Figure 14 As shown, in some embodiments, the ground elastic sheet 500 may include a fixed end 501 and an elastic end 502.

[0125] The fixed end 501 of the grounding spring piece 500 can be fixed in the groove 14 by spot welding. The connection position between the fixed end 501 and the middle frame 11 is the ground point. The elastic end 502 bends towards the adapter board 200 relative to the fixed end 501, so that the elastic end 502 of the grounding spring piece 500 elastically contacts the first part 201 of the adapter board 200.

[0126] In this way, embedding the grounding spring piece 500 into the middle frame 11 can save space and avoid increasing the body thickness of the electronic device 100A. Moreover, a signal ground path can be formed by using the grounding spring piece 500, the antenna spring piece 53, the main circuit board 100, and the adapter board 200. The signals generated by the radio frequency chip (not shown in the figure) in the electronic device 100A pass through the main circuit board 100, the adapter board 200, the antenna spring piece 53, the middle frame 11, the antenna spring piece 53, the adapter board 200, and the main circuit board 100 in sequence, and then return to the radio frequency chip to form a signal ground path for signal transmission.

[0127] The electronic device provided by the embodiment of the present application can rely on the adapter board 200 to meet the connection requirements of different electronic components in different spaces within the electronic device. The adapter board 200 is connected to the main circuit board 100 by welding, which can save the space of the connection part. Moreover, considering various aspects such as welding strength and production reliability, the reliability can be further improved to ensure the reliability of the whole machine. At the same time, the strength and extension length of the adapter board 200 are ensured by the reinforcing component 400, and the center of gravity distribution of the adapter board 200 is fully considered to ensure production processability and use reliability.

[0128] It should be noted that those skilled in the art will easily think of other implementation schemes of the present application after considering the specification and practicing the application disclosed herein. The present application aims to cover any variations, uses, or adaptive changes of the present application, which follow the general principles of the present application and include the common general knowledge or conventional technical means in the technical field not disclosed in the present application. The specification and the embodiments are only regarded as exemplary, and the true scope of the present application is pointed out by the following claims.

[0129] It should be understood that the present application is not limited to the exact structure already described and shown in the drawings, and various modifications and changes can be made without departing from its scope. The scope of the present application is only limited by the appended claims.

Claims

1. A circuit board assembly, characterized in that, it includes: a main circuit board (100); an adapter board (200), the adapter board (200) is electrically connected to the main circuit board (100), and includes a first portion (201) located outside the projection area of the main circuit board (100); the first portion (201) of the adapter board (200) is configured to be electrically connected to at least one first electronic device in the electronic device, and the first electronic device is located outside the projection area of the main circuit board.

2. The circuit board assembly according to claim 1, characterized in that, the adapter board (200) further includes a second portion (202) located within the projection area of the main circuit board (100); the main circuit board (100) includes a first surface (101); the second portion (202) of the adapter board (200) is stacked on the first surface (101).

3. The circuit board assembly according to claim 2, characterized in that, the first surface (101) of the main circuit board (100) includes connection pads; the connection pads are used to achieve at least one of electrical connection and fixed connection between the main circuit board (100) and the second portion (202) of the adapter board (200).

4. The circuit board assembly according to claim 3, characterized in that, the connection pads include signal connection pads (301) and / or strength connection pads (302); the second portion (202) of the adapter board (200) is electrically connected and fixedly connected to the main circuit board (100) through the signal connection pads (301); the second portion (202) of the adapter board (200) is fixedly connected to the main circuit board (100) through the strength connection pads (302).

5. The circuit board assembly according to claim 2, characterized in that, the center of gravity of the adapter board (200) is located in the second portion (202).

6. The circuit board assembly according to claim 2, characterized in that, it further includes a reinforcement member (400); the reinforcement member (400) is located on the surface of the adapter board (200) facing away from the main circuit board (100).

7. The circuit board assembly according to claim 6, characterized in that, the reinforcement member (400) includes a first end (401) and a second end (402); the first end (401) extends to the second portion (202) of the adapter board (200) and covers part or all of the area of the second portion (202); the second end (402) extends to the first portion (201) of the adapter board (200) and covers part or all of the area of the first portion (201).

8. The circuit board assembly according to claim 3, characterized in that, the first electronic device includes at least one of an antenna elastic sheet (53), an ambient light sensor (521), a flash (522), an infrared sensor, a time-of-flight sensor, a microphone, a camera module, and a display module.

9. The circuit board assembly according to claim 8, It is characterized in that The main circuit board (100) further comprises a second surface (102) opposite to the first surface (101), and a through hole (103) penetrating the first surface (101) and the second surface (102); The second part (202) of the adapter board (200) covers the through hole (103), and the through hole (103) is configured to accommodate the connector of the camera module so that the connector is electrically connected to the second part (202) of the adapter board (200).

10. The circuit board assembly according to claim 8, It is characterized in that Also includes a grounding spring (500); The grounding spring sheet (500) is located on a side of the reinforcing component (400) away from the adapter plate (200), and the grounding spring sheet (500) is fixedly arranged; The grounding spring sheet (500) is configured to be spring-connected with one of the middle frame (11) of the electronic device and the first part (201) of the adapter board (200) to form a signal ground return path with the middle frame (11), the antenna spring sheet (53), the main circuit board (100) and the adapter board (200).

11. The circuit board assembly according to claim 10, It is characterized in that The grounding spring sheet (500) is fixed on the adapter plate (200), and the grounding spring sheet (500) is elastically connected to the middle frame (11); or, The grounding spring sheet (500) is fixed on the middle frame (11), and the grounding spring sheet (500) is spring-connected to the first part (201) of the adapter plate (200).

12. The circuit board assembly according to claim 10, It is characterized in that The middle frame (11) comprises a groove (14); The grounding spring (500) comprises a fixed end (501) and an elastic end (502); The fixed end (501) is located in the groove (14), and the elastic end (502) is bent toward the adapter plate (200) and is elastically connected to the first part (201) of the adapter plate (200).

13. An electronic device, It is characterized in that include: A middle frame (11), and a screen (30) and a rear shell located on opposite sides of the middle frame (11); The circuit board assembly according to any one of claims 1 to 12, wherein the circuit board assembly is located on the middle frame (11), the main circuit board (100) faces the rear housing, and the adapter board (200) faces the screen (30); A first camera module (51) and a second camera module (52), wherein the first camera module (51) and the second camera module (52) are spaced apart on the middle frame (11) and are both located outside the projection area of ​​the main circuit board (100); The lens of the first camera module (51) faces the screen (30), and the lens of the second camera module (52) faces the rear case; the connector of the first camera module (51) passes through the through hole (103) on the main circuit board (100) and is electrically connected to the second part (202) of the adapter board (200); the first part (201) of the adapter board (200) is located between the first camera module (51) and the second camera module (52); The antenna elastic sheet (53) is located outside the projection area of the main circuit board (100). The antenna elastic sheet (53) is located between the first camera module (51) and the second camera module (52) and on the outer side relative to the main circuit board (100). The antenna elastic sheet (53) is electrically connected to the first part (201) of the adapter board (200).

14. The electronic device according to claim 13, wherein, it further includes: a flexible circuit board (54); one end of the flexible circuit board (54) is located between the first camera module (51) and the rear case, and the other end of the flexible circuit board (54) extends towards the first part (201) of the adapter board (200) and is electrically connected to the first part (201) of the adapter board (200); and, the second camera module (52) includes an ambient light sensor (521) and a flash (522); the ambient light sensor (521) and the flash (522) are located on the side of the flexible circuit board (54) facing the rear case, and the ambient light sensor (521) and the flash (522) are electrically connected to the first part (201) of the adapter board (200) through the flexible circuit board (54).

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