Line deposition method and deposition device

Abstract

The invention provides a circuit deposition method and device, and relates to the field of electronic circuit manufacturing, and the method comprises the following steps: preparing a deposition solution; deploying a dripping path of the deposition solution on a sample to be processed according to a preset circuit pattern; and dropwise adding the deposition solution on the sample along a dropwise adding path, and irradiating a dropwise adding region by using laser, so that an oxidation-reduction reaction occurs on the sample, thereby forming a line. The method is based on a laser-induced liquid phase deposition technology, a deposition solution containing metal ions is dropwise added to a sample to be processed according to a preset circuit pattern, laser is further used for irradiating a dropwise adding area, and a needed pattern circuit is formed along with movement of a laser irradiation position. The deposition device applying the method is simple in operation step and does not need post-treatment, and a simplified and environment-friendly solution is provided for the circuit manufacturing industry.

Description

Technical Field

[0001] The present invention relates to the technical field of electronic circuits, and in particular, to a circuit deposition method and a deposition apparatus. Background Art

[0002] With the rapid development of manufacturing technology and science and technology, the market demand for printed circuit boards has gradually expanded with industrial upgrading, giving rise to the manufacturing demand for fabricating metal circuits on insulating materials such as glass and ceramics, and corresponding processing technologies have also emerged. However, the current processes for preparing microcircuits on substrates and other materials have disadvantages such as high production costs, cumbersome manufacturing processes, poor preparation accuracy, and the need to additionally add electrode materials.

[0003] Laser-induced liquid-phase deposition is a technique that uses laser energy to promote the deposition of substances in a liquid-phase environment. By focusing the laser energy onto the liquid-phase system, the substances in the liquid phase absorb the energy. In some chemical solutions, the laser energy can trigger chemical reactions or change the physical state of substances. In this process, the photon energy of the laser may excite the molecules or ions in the liquid phase, enabling them to obtain sufficient energy to participate in the deposition process. For example, when the laser irradiates the surface where the substrate contacts the deposition solution, a thermal effect is generated to locally heat the deposition solution, activating the redox reaction and inducing copper deposition. This technology has simple processing technology, low manufacturing cost, high precision, and good deposition quality. Compared with the traditional electroless copper plating technology, it not only requires a mask and pretreatment, but also takes a longer time.

[0004] The Chinese invention patent with the publication number CN110565130A provides a "laser-enhanced three-dimensional micro-area electrodeposition method", which enhances the electrodeposition effect through laser and improves the deposition efficiency, but its steps are cumbersome and the probability of errors is relatively large.

[0005] The Chinese invention patent with the publication number CN106133891B provides a "pulse-mode direct-write laser metallization" method, which uses a pulsed energy beam to adhere and sinter the target material onto the substrate to achieve metallization, but the unadhered material needs to be removed by post-treatment, which will reduce the material utilization rate. Summary of the Invention

[0006] Aiming at the defects in the prior art, one of the purposes of the present invention is to provide a circuit deposition method. Based on the scientific principle of laser-induced liquid-phase deposition, it changes the existing chemical manufacturing additive method. By dropping a deposition solution on a sample and irradiating with a laser, the redox reaction in the deposition solution is catalyzed to achieve circuit deposition.

[0007] To achieve the above purpose, the present invention adopts the following technical solutions:

[0008] The present invention provides a circuit deposition method, including the following steps:

[0009] Prepare a deposition solution;

[0010] According to a preset circuit pattern, deploy the dropping path of the deposition solution on the sample to be processed;

[0011] Drop the deposition solution along the dropping path on the sample, and use laser to irradiate the dropping area, so that a redox reaction occurs on the sample, thereby forming a circuit.

[0012] The deposition solution in the method steps contains metal ions. The principle is to use the redox reaction in the deposition solution to cause the metal ions in the solution to gain or lose charges, so as to deposit on the surface of the sample. Among them, a laser beam is used to provide energy to stimulate the progress of the redox reaction. With the movement of the laser irradiation position, deposition continuously occurs on the sample to realize circuit manufacturing. The deposition solution is added to the sample in a dropping manner. By presetting the relevant instrument program to deploy the dropping path, material consumption can be reduced, production costs can be lowered, and at the same time, no extra material is generated, and post-treatment operations can be avoided to reduce the overall time, thereby improving production efficiency.

[0013] In a further technical solution, dropping the deposition solution along the dropping path on the sample, and using laser to irradiate the dropping area, so that a redox reaction occurs on the sample, thereby forming a circuit includes: dropping the deposition solution on the sample to form a continuous solution layer on the sample.

[0014] The dropping of the deposition solution on the sample is affected by various factors, resulting in different distributions of the solution layer on the sample. For example, improper coordination of the solution dropping rate and the moving rate will cause the solution layer to be discontinuous, affecting circuit deposition. That is, when the solution dropping rate is much smaller than the moving rate, the solution dropping rate of the deposition solution cannot keep up with the moving speed of the dropping container, and the dropped droplets are separated from each other on the sample, thereby forming a discontinuous solution layer, resulting in the inability to completely connect the subsequently deposited metal circuits.

[0015] In a further technical solution, by controlling the position of the laser focus, the laser is focused on the contact surface between the surface of the sample and the deposition solution.

[0016] In the present invention, the laser irradiates the droplet addition area to provide the energy required for the redox reaction by irradiating the contact surface between the sample surface and the deposition solution, so that the temperature in the corresponding area reaches the temperature required for catalytic redox. If the laser focus falls on the solution layer on the sample, it is in a defocused state on the sample surface, resulting in a reduction in the energy of the irradiation area, slower heating, and partial loss of laser energy due to the reflection and refraction of the deposition solution itself on light. Subsequently, the energy of the laser passing through the solution layer and irradiating the sample surface will be further weakened, thereby reducing the laser irradiation effect. In contrast, adjusting the laser focus to the contact surface between the sample surface and the deposition solution can increase the irradiation energy of the laser on the sample, make up for the deficiency of the laser energy weakened by the solution layer, enable the temperature of the corresponding area on the sample to rise faster, and improve the deposition rate.

[0017] In a further technical solution, the light source of the laser includes at least one of nanosecond laser, picosecond laser, and femtosecond laser.

[0018] The light source of the laser can be set to be a single laser or one of the multi-laser combinations. By this method, the laser energy intensity can be adjusted to match the production requirements of different products.

[0019] In a further technical solution, before deploying the droplet addition path of the deposition solution on the sample to be processed according to the preset circuit pattern, it further includes: cleaning and drying the sample, and performing surface treatment, where the surface treatment includes at least one of surface finishing, roughening, micro / nano structure preparation, and surface chemical treatment.

[0020] The pretreatment of the sample is beneficial to increasing the adhesion after metal ion deposition, thereby ensuring the product quality.

[0021] The second object of the present invention is to provide a deposition device, which uses a droplet ejection component and a laser component to cooperate to quickly deposit a precise circuit pattern on a sample to be processed with less consumables, and the obtained product has high precision, can reduce material waste, and at the same time avoid the problem of difficult post-treatment.

[0022] To achieve the above object, the present invention adopts the following technical solutions:

[0023] The present invention also provides a deposition device, including a deposition component, where the deposition component includes a connecting piece, a plurality of droplet ejection components and a laser component installed on the connecting piece, and the plurality of droplet ejection components are arranged on the periphery of the laser component.

[0024] The deposition component is a device for depositing metal ions to manufacture circuits. A plurality of droplet ejection components are externally connected to a container filled with a deposition solution, and can eject a small amount of the deposition solution onto the sample to be deposited and processed, avoiding the waste of unnecessary materials. Moreover, the ejection points of the plurality of droplet ejection components are all located below the laser component, so that the irradiation point of the laser component can be covered by the deposition solution. Secondly, the laser component can emit a high-energy beam to stimulate the redox reaction in the deposition solution, so that the metal ions in the deposition solution are deposited on the sample to be processed to form a circuit pattern.

[0025] In a further technical solution, the droplet ejection component includes a droplet nozzle, a liquid storage device connected to the droplet nozzle, and a liquid guiding port located on the liquid storage device. One end of the liquid storage device is fixed to the connecting piece; a liquid storage cavity and a liquid guiding tube are formed in the liquid storage device. The liquid guiding tube is communicated with the liquid storage cavity and the droplet nozzle, and the liquid storage cavity is communicated with the liquid guiding port.

[0026] The liquid storage cavity in the liquid storage device is used to store the deposition solution to be ejected. The droplet ejection component can obtain the deposition solution from an external container through the liquid guiding port on the liquid storage device, and use the liquid guiding tube in the droplet nozzle to make the deposition solution spray out in a uniform thin strip under the action of gravity to control the amount of the deposition solution used.

[0027] In a further technical solution, a liquid control port is provided at one end of the liquid guiding tube, and the liquid control port is connected to the liquid storage cavity.

[0028] The liquid control port is a conical port. When the deposition solution enters the liquid guiding tube due to gravity, a uniformly distributed pressure will be generated on the wall of the liquid control port and act on the deposition solution, so that a stable and consistent liquid column is formed in the liquid guiding tube, thereby ensuring that the ejected deposition solution can be continuous and stable, and further making the deposition solution on the sample to be processed continuous.

[0029] In a further technical solution, a through hole is provided on the liquid storage device. The droplet ejection component further includes a flow rate control member. One end of the flow rate control member is fixedly connected to the connecting piece, and the opposite end is rotatably connected to the through hole; the flow rate control member passes through the through hole and abuts against the liquid control port.

[0030] Internal threads are provided in the through hole of the liquid storage device, and external threads are provided on the flow rate control member. The liquid storage device is threadedly connected to the flow rate control member, so as to fixedly connect the liquid storage device together with the droplet nozzle to the connecting piece. By controlling the connection depth of the above two, the tightness of the flow rate control member abutting against the liquid control port is controlled, and then the amount of the deposition solution entering the liquid guiding tube is controlled to adjust the liquid outlet rate.

[0031] The specific implementation process of the device is as follows: The staff places the sample to be processed horizontally on the workbench, connects the liquid reservoir to the deposition solution from the outside, then designs the overall movement path of the deposition component according to the required graphic circuit, then sets the program through the control system to determine the dropping path, and then aligns the laser component and the droplet ejection component with the starting point of the dropping path and starts working. During the working process, the droplet ejection component evenly ejects the deposition solution on the dropping path, and at the same time, the laser component irradiates the sample to be processed, so that a metal circuit is deposited on the sample to be processed, or only the droplet ejection component is turned on to discharge liquid at startup. After the entire graphic circuit on the sample to be processed is covered by the deposition solution, the laser component is started, and the laser component is focused and deposited along the dropping path, and finally a complete circuit pattern is obtained.

[0032] The beneficial effects of the present invention at least include:

[0033] A circuit deposition method provided by the present invention is based on laser-induced liquid-phase deposition technology. By preparing a deposition solution containing metal ions, the deposition solution is dropped on the sample to be processed according to a preset circuit pattern. Further, the dropping area is irradiated with a laser to raise the temperature of the dropping area to stimulate the redox reaction in the deposition solution, so that metal ions are deposited into a coating layer, and then the required graphic circuit is formed as the laser irradiation position moves. This method has simple steps, does not require post-treatment, and has high material utilization rate, providing a simplified and environmentally friendly solution for the circuit manufacturing industry.

[0034] The present invention also provides a deposition device, which is provided with a droplet ejection component for providing a deposition solution and a laser component for providing a laser beam according to the above method. The deposition solution is ejected by a plurality of droplet ejection components on a predetermined graphic circuit, so that the droplets form thin strips on the sample to be processed. At the same time, the laser component is aligned with the surface where the deposition solution contacts the sample to be processed for laser irradiation, so that the metal ions in the deposition solution are deposited to form a circuit. This device can quickly deposit a precise circuit pattern on the sample to be processed with less consumables, and the obtained product has high precision and low production cost. Description of the Drawings

[0035] Figure 1 is a flowchart of the circuit deposition method provided by the present application;

[0036] Figure 2 is a three-dimensional schematic diagram of the deposition device provided by Embodiment 3 of the present application;

[0037] Figure 3 is a front view of the deposition device provided by Embodiment 3 of the present application;

[0038] Figure 4 is a structural schematic diagram of the connecting piece provided by Embodiment 3 of the present application;

[0039] Figure 5 It is a cross-sectional view of the deposition component provided in the third embodiment of the present application along the height direction.

[0040] Reference numerals:

[0041] 1. Deposition component; 11. Connecting piece; 111. Rotating shaft; 112. Outer shell; 12. Droplet injection component; 121. Droplet nozzle; 122. Liquid storage; 123. Liquid storage cavity; 13. Laser component; 131. Laser head;

[0042] 2. Workbench; 3. Liquid guiding port;

[0043] 4. Liquid guiding pipe; 41. Liquid control port; 5. Flow rate control component;

[0044] 6. Hydraulic valve; 7. Machine base; 71. Y-axis guide rail;

[0045] 8. Frame; 81. X-axis guide rail; 82. Moving seat; 821. Z-axis guide rail. Specific embodiments

[0046] The preferred embodiments of the present invention will be described in more detail below with reference to the accompanying drawings. Although the preferred embodiments of the present invention are shown in the drawings, it should be understood that the present invention can be implemented in various forms and should not be limited by the embodiments set forth herein. On the contrary, these embodiments are provided to make the present invention more thorough and complete, and to fully convey the scope of the present invention to those skilled in the art.

[0047] In the description of the present invention, the orientation or positional relationship indicated by terms such as "upper", "lower", "left" and "right" is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention rather than requiring the present invention to be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation of the present invention.

[0048] The terms used in the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The singular forms of "a", "the" and "the" used in the present invention and the appended claims are also intended to include the plural forms unless the context clearly indicates otherwise. It should also be understood that the term "and / or" as used herein refers to and includes any and all possible combinations of one or more of the associated listed items.

[0049] Laser-induced liquid-phase deposition is a technology that uses laser energy to promote material deposition in a liquid-phase environment. By focusing the laser energy onto the liquid-phase system, the substances in the liquid phase absorb the energy. In some chemical solutions, the laser energy can trigger chemical reactions or change the physical state of substances. During this process, the photon energy of the laser may excite the molecules or ions in the liquid phase, enabling them to gain sufficient energy to participate in the deposition process. For example, when the laser irradiates the surface where the substrate contacts the deposition solution, a thermal effect is generated to locally heat the deposition solution, activating the redox reaction and inducing copper deposition. This technology has simple processing technology, low manufacturing cost, high precision, and good deposition quality. Compared with traditional electroless copper plating technology, it not only requires masks and pretreatment but also takes longer time. In addition, the method of fixing circuits by laser sintering solid materials has low material utilization rate, while the production precision of three-dimensional technology for printing patterns is not high, the process is complex, and there are certain difficulties in post-treatment.

[0050] See Figure 1 As shown, in view of the disadvantages existing in the prior art, the present invention provides a circuit deposition method, including the following steps:

[0051] S1. Prepare the deposition solution;

[0052] S2. According to the preset circuit pattern, deploy the dropping path of the deposition solution on the sample to be processed;

[0053] S3. Drop the deposition solution along the dropping path on the sample and irradiate the dropping area with a laser, so that a redox reaction occurs on the sample, thereby forming a circuit.

[0054] Specifically, the above deposition solution contains a copper ion complex solution, a copper ion salt solution, an alkaline solution, and a reducing agent. The surface of the above sample to be processed is a flat substrate of various circuit board materials, a three-dimensional structure, etc., which can be processed surfaces, including but not limited to circuit board materials such as ceramics, glass fiber, epoxy resin, and polyimide. The principle of this method is to use the redox reaction in the deposition solution to cause the metal ions in the solution to gain or lose charges, thereby depositing on the surface of the sample. Among them, a laser beam is used to provide energy to stimulate the progress of the redox reaction. As the laser irradiation position moves, deposition continuously occurs on the sample to achieve circuit manufacturing. In some embodiments, a dropping device is used to add the deposition solution to the sample in a dropping manner. Subsequently, setting the program to deploy the dropping path can reduce material consumption, lower production costs, and at the same time will not generate excess materials, avoiding post-treatment operations to reduce the overall time, thereby improving production efficiency.

[0055] Further, step S3 includes dropping the deposition solution on the sample to form a continuous solution layer on the sample.

[0056] Specifically, the solution layer is a thin liquid surface, and the laser can pass through the solution layer and irradiate the surface of the sample to be processed. The deposition solution dropped on the sample is affected by multiple factors, resulting in different distribution situations of the solution layer on the sample. For example, improper coordination of the solution dropping rate and the moving rate will cause the solution layer to be discontinuous, affecting the circuit deposition, or the solution layer is too large in a local area of the sample, resulting in low material utilization rate. When the solution dropping rate is much smaller than the moving rate, the deposition solution dropping rate cannot keep up with the moving speed of the dropping container, and the dropped liquid droplets are separated from each other on the sample, thus forming a discontinuous solution layer; when the solution dropping rate is much larger than the moving rate, the dropping container drops more liquid droplets in a local area of the sample, and the dropped liquid droplets gather in a local area of the sample, resulting in the coverage area of the deposition solution being larger than the preset circuit pattern, thus causing material waste.

[0057] Further, by controlling the position of the laser focus, the laser is focused on the contact surface between the sample surface and the deposition solution.

[0058] In the present invention, the laser irradiates the dropping area to provide the energy required for the redox reaction by irradiating the contact surface between the sample surface and the deposition solution, so that the temperature in the corresponding area reaches the temperature required for the catalytic redox reaction. If the laser focus falls on the solution layer on the sample, it is in a defocused state on the sample surface, resulting in a reduction in the laser energy in the irradiation area, slower heating, and due to the reflection and refraction of light by the deposition solution itself, part of the laser energy will be lost, and then the energy of the laser passing through the solution layer and irradiating on the sample surface will be further weakened, thereby reducing the laser irradiation effect. In contrast, adjusting the laser focus to the contact surface between the sample surface and the deposition solution can increase the irradiation energy of the laser on the sample, make up for the deficiency of the laser energy weakened by the solution layer, and make the temperature of the corresponding area on the sample rise faster to increase the deposition rate.

[0059] Further, the light source of the laser includes at least one of nanosecond laser, picosecond laser, and femtosecond laser.

[0060] Specifically, the light source of the laser can be set as a single laser or a combination of multiple lasers. By this method, the laser energy intensity can be adjusted to match the production requirements of different products.

[0061] Further, before step S2, it also includes: cleaning and drying the sample, and performing surface treatment, and the surface treatment includes at least one of surface finishing, roughening, micro / nano structure preparation, and surface chemical treatment.

[0062] It can be understood that the pretreatment of the sample is beneficial to increasing the adhesion after the metal ions are deposited, thereby ensuring the product quality.

[0063] Example 1

[0064] The present invention provides an implementation process: using a zirconia ceramic plate with a thickness of 1 mm and a deposition solution with a copper sulfate concentration of 20 - 30 g / L, and the thermal conductivity of this ceramic plate is 2.2 - 3 W·(mK) -1 , with dimensions of 40×40×1 mm, and using a laser machine tool with an ultraviolet nanosecond laser wavelength of 355λ / nm, a pulse width of 10 - 100 ns, and a frequency of 200 - 500 kHz for laser induction.

[0065] 1. Prepare a copper sulfate solution with a concentration of 20 - 30 g / L;

[0066] 2. Place the zirconia ceramic plate in ethanol for ultrasonic cleaning for 15 min. After cleaning, conduct drying treatment in a drying oven for 15 min to ensure that the surface is free of contaminants, roughen the surface of the zirconia ceramic plate to be processed, and finally place the zirconia ceramic plate flat on the surface of the workbench;

[0067] 3. Set the laser scanning path, and accurately position the laser and the metal droplet ejector to the required positions according to the preset circuit pattern;

[0068] 4. Inject the chemical deposition solution into the metal droplet reservoir, and set the liquid droplet ejection program of the droplet ejector to set the droplet diameter to 10 - 50 μm and the flow rate to 0.5 - 3 m / s;

[0069] 5. Use the metal droplet ejector to drop deposition solution droplets on the surface of the zirconia ceramic plate according to the preset path;

[0070] 6. Control the laser to move following the position of the deposition solution droplets, focus the laser on the contact interface between the surface of the zirconia ceramic plate and the droplets, and by controlling the position of the laser focus, cause the metal ions to undergo redox reactions and deposit on the surface of the zirconia ceramic plate. Among them, the laser scanning speed is 0.1 - 1 mm / s, the power is 0.5 W - 10 W, and depositing along the set scanning path can achieve uniform and dense copper circuits.

[0071] Example 2

[0072] The present invention provides another implementation process: using a zirconia ceramic rod with a diameter of 8 mm and a length of 5 cm and a deposition solution with a copper sulfate concentration of 20 - 30 g / L, and the thermal conductivity of this ceramic rod is 2.2 - 3 W·(mK) -1 , and using a laser machine tool with an ultraviolet nanosecond laser repetition frequency of 300 kHz, a pulse width of 10 - 100 ns, and a spot diameter of 20 - 50 μm for laser induction.

[0073] 1. Prepare a copper sulfate solution with a concentration of 20 - 30 g / L;

[0074] 2. Place the zirconia ceramic rod in ethanol and ultrasonically clean it for 15 minutes. After cleaning, perform a drying treatment in an oven for 15 minutes to ensure that the surface is free of contaminants. Roughen the side of the zirconia ceramic rod to be processed, and finally place the zirconia ceramic rod flat on the surface of the workbench.

[0075] 3. Set the laser scanning path, and accurately position the laser and the metal droplet injector to the required positions according to the preset circuit pattern.

[0076] 4. Inject the chemical deposition solution into the metal droplet reservoir, and set the droplet ejection program of the droplet injector to set the droplet size to 5 - 100 μm and the flow rate to 0.5 - 4 m / s.

[0077] 5. Simultaneously turn on the laser system and the hydraulic valve, drop the deposition solution droplets on the surface of the zirconia ceramic rod, and at the same time focus the laser on the contact interface between the upper surface of the zirconia ceramic rod and the droplets, so that the metal ions undergo an oxidation-reduction reaction and are deposited on the surface of the zirconia ceramic rod. Among them, the laser scanning speed is 0.1 - 1 mm / s, the power is 0.2 W - 5 W, and depositing along the set scanning path can achieve a uniform copper circuit.

[0078] Example 3

[0079] See Figures 2 to 5 As shown, this embodiment provides a deposition device, including a deposition component 1. The deposition component 1 includes a connecting piece 11, a plurality of droplet ejection components 12 installed on the connecting piece 11, and a laser component 13. The plurality of droplet ejection components 12 are arranged on the periphery of the laser component 13.

[0080] Specifically, the deposition component 1 is a device for depositing metal ions to manufacture a circuit. The droplet ejection component can be set as a combination of one or more than two with the same ejection points. The droplet ejection component 12 can be a liquid syringe externally connected to a container filled with deposition liquid, which can eject a small amount of deposition liquid on the sample to be processed, avoiding the waste of unnecessary materials. And the ejection points of the plurality of droplet ejection components 12 are all located below the laser component 13, so that the irradiation points of the laser component 13 can be covered by the deposition liquid. The laser component 13 is one of a single laser or a multi-laser combination, and the light source includes one or more combinations of nanosecond laser, picosecond laser, and femtosecond laser. High-energy light beams can be emitted by the laser component 13 to activate the oxidation-reduction reaction in the deposition liquid, so that the metal ions in the deposition liquid are deposited into a circuit pattern on the sample to be processed. When using this device, the sample to be processed is horizontally placed on the workbench 2, and the side where the droplet ejection component 12 is located relative to the laser component 13 is the moving direction of the deposition component 1. In this way, it can be ensured that the laser irradiation area is covered by the deposition liquid, avoiding circuit disconnection.

[0081] Further, the droplet ejection assembly 12 includes a droplet ejector head 121, a liquid reservoir 122 connected to the droplet ejector head 121, and a liquid guiding port 3 located on the liquid reservoir 122. One end of the liquid reservoir 122 is fixed to the connecting member 11; a liquid storage cavity 123 and a liquid guiding pipe 4 are formed in the liquid reservoir 122. The liquid guiding pipe 4 is communicated with the liquid storage cavity 123 and the droplet ejector head 121, and the liquid storage cavity 123 is communicated with the liquid guiding port 3.

[0082] Specifically, the bottom of the liquid reservoir 122 is connected to the droplet ejector head 121. The droplet ejector head 121 has a liquid dripping port. The top of the liquid reservoir 122 is vertically connected to the connecting member 11. The liquid storage cavity 123 is used for storing the deposition liquid to be ejected. The droplet ejection assembly 12 can obtain the deposition liquid from an external container through the liquid guiding port 3 on the liquid reservoir 122, and uses the liquid guiding pipe 4 in the droplet ejector head 121 to eject the deposition liquid in a uniform thin strip under the action of gravity, so as to control the amount of the deposition liquid used and reduce the additional cost caused by the low utilization rate of materials.

[0083] Further, a liquid control port 41 is provided at one end of the liquid guiding pipe 4, and the liquid control port 41 is connected to the liquid storage cavity 123.

[0084] Specifically, the liquid control port 41 is a conical port. When the deposition liquid enters the liquid guiding pipe 4 due to gravity, a uniformly distributed pressure is generated on the wall of the liquid control port 41 and acts on the deposition liquid, so that the intermolecular force in the deposition liquid reaches an equilibrium state. Furthermore, a stable and uniform liquid column is formed in the liquid guiding pipe 4 for the deposition liquid, thereby ensuring that the ejected deposition liquid can be continuous, and further ensuring that the deposition liquid on the sample to be processed is continuous and reaches a uniform distribution state.

[0085] Further, a through port is formed on the liquid reservoir 122. The droplet ejection assembly 12 further includes a flow rate control member 5. One end of the flow rate control member 5 is fixedly connected to the connecting member 11, and the opposite end is rotatably connected to the through port; the flow rate control member 5 passes through the through port and abuts against the liquid control port 41.

[0086] Specifically, the flow rate control member 5 can be a long screw. The liquid reservoir 122 is provided with internal threads in the through port, and the liquid reservoir 122 is threadedly connected to the flow rate control member 5, thereby connecting the liquid reservoir 122 together with the droplet ejector head 121 to the connecting member 11. By controlling the connection depth between the two, the tightness of the flow rate control member 5 abutting against the liquid control port 41 can be controlled, and the gap size can be controlled between the flow rate control member 5 and the liquid control port 41, so as to control the amount of the deposition liquid entering the liquid guiding pipe 4 and adjust the liquid discharge rate.

[0087] Further, a hydraulic valve 6 is provided in the droplet ejector head 121, and the hydraulic valve 6 is communicated with the liquid guiding pipe 4 and the droplet ejector head 121.

[0088] Specifically, the hydraulic valve 6 is located between the liquid guide pipe 4 of the liquid storage device 122 and the droplet nozzle 121, which can increase the liquid outlet pressure and thus be used to control the liquid outlet rate. The droplet ejection assembly 12 can first adjust the deposition liquid ejection speed through the abutting gap between the liquid control port 41 and the flow rate control member 5, and then further precisely control the liquid outlet rate through the hydraulic valve 6 to achieve high-precision adjustment.

[0089] Further, two droplet ejectors 12 are provided on the connecting member 11, and the two droplet ejection assemblies 12 are symmetrically arranged with respect to the laser assembly 13.

[0090] Specifically, the axes of the two droplet ejection assemblies 12 form an angle at the intersection, and the irradiation line of the laser assembly 13 passes through the vertex of the angle. Using this symmetrical layout can ensure that the droplets are ejected from both sides of the laser assembly 13 and are evenly distributed on the middle deposition area irradiated by the laser assembly 13, avoiding the deposition liquid concentrating on one side and ensuring the uniformity of the coating.

[0091] Further, the laser assembly 13 has a laser head 131, and the droplet nozzle 121 and the laser head 131 are arranged on the same horizontal plane.

[0092] Specifically, because the laser beam has divergence, to ensure the energy required for inducing the deposition solution, the laser assembly 13 is usually arranged close to the upper part of the sample to be processed and adjusted to an appropriate distance, so as not to lose too much energy due to too large an irradiation distance. At this time, setting the droplet nozzle 121 and the laser head 131 at the same horizontal level can ensure that the droplet nozzle 121 is also close to the sample to be processed, so that the deposited liquid is accurately ejected onto the predetermined graphic line after being ejected, thereby improving the deposition quality and further increasing the yield.

[0093] Further, the connecting member 11 includes a rotating shaft 111 and a housing 112. One end of the rotating shaft 111 is rotatably connected to the housing 112, and the opposite end is fixed with the laser assembly 13 and the droplet ejection assembly 12.

[0094] Specifically, the housing 112 is set in a cylindrical shape and sleeved on one end of the rotating shaft 111. The rotating shaft 111 is rotatably connected to the housing 112 to adjust the position of the droplet ejection assembly 12. In this way, the ejection position of the deposited liquid can be changed through the rotating shaft 111, and the moving direction of the deposition assembly 1 can be changed to achieve multi-angle deposition lines.

[0095] Further, it further includes a moving assembly. The moving assembly includes a machine base 7 and a frame 8. The frame 8 is fixed on the machine base 7; a Y-axis guide rail 71 and a workbench 2 are provided on the top of the machine base 7. The workbench 2 is slidably connected to the Y-axis guide rail 71. An X-axis guide rail 81 is provided on the frame 8. A moving seat 82 is slidably connected to the X-axis guide rail 81. A Z-axis guide rail 821 is provided on the moving seat 82, and the Z-axis guide rail 821 is slidably connected to the housing 112.

[0096] Specifically, motors for controlling the three-axis movement of the deposition assembly 1 are respectively provided on the machine base 7 and the machine frame 8, and the motors are electrically connected to the control system. This design enables the workbench 2 to have one degree of freedom, and the sample to be processed can move along the Y-axis on the workbench. The moving seat 82 has two degrees of freedom, enabling the deposition assembly to move within the XZ plane. One side of the outer shell 112 is mounted on the Z-axis guide rail 821, enabling the device to further adjust the liquid outlet position and flexibly correspond to complex graphic designs for corresponding production activities. Combining with the high-precision characteristics of the device, the deposition manufacturing of high-resolution graphics can be achieved.

[0097] The above are only the preferred embodiments of the present invention and are not intended to limit the present invention. For those skilled in the art, the present invention can have various changes and modifications. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included within the protection scope of the present invention.

Claims

1. A line deposition method, characterized in that: include: preparing a deposition solution; Deploying a drop path of the deposition solution on the sample to be processed according to a preset circuit pattern; The deposition solution is dripped on the sample to be processed along the dripping path, and the dripping area is irradiated with a laser to cause a redox reaction on the sample, thereby forming a circuit.

2. The line deposition method according to claim 1, characterized in that: Dropping the deposition solution on the sample along a dropping path and irradiating the dropping area with laser to cause a redox reaction on the sample to form a circuit includes: dropping the deposition solution on the sample to form a continuous solution layer on the sample.

3. The line deposition method according to claim 1, characterized in that: The laser is focused on the contact surface between the sample surface and the deposition solution by controlling the position of the laser focus.

4. The line deposition method according to claim 1, characterized in that: The laser light source includes at least one of nanosecond laser, picosecond laser and femtosecond laser.

5. The line deposition method according to claim 1, characterized in that: Before deploying the droplet path of the deposition solution on the sample to be processed according to the preset circuit pattern, the method also includes: cleaning and drying the sample, and performing surface treatment, wherein the surface treatment includes at least one of surface finishing, roughening, micro / nanostructure preparation, and surface chemical treatment.

6. A deposition device, characterized in that: The invention comprises a deposition assembly (1), wherein the deposition assembly (1) comprises a connecting member (11), a plurality of droplet spraying assemblies (12) mounted on the connecting member (11), and a laser assembly (13), wherein the plurality of droplet spraying assemblies (12) are arranged on the periphery of the laser assembly (13).

7. The deposition device according to claim 6, characterized in that: The liquid droplet spraying assembly (12) comprises a liquid droplet spraying head (121), a liquid reservoir (122) connected to the liquid droplet spraying head (121), and a liquid guide port (3) located on the liquid reservoir (122); one end of the liquid reservoir (122) is fixed to the connecting member (11); a liquid storage cavity (123) and a liquid guide tube (4) are provided in the liquid reservoir (122); the liquid guide tube (4) is in communication with the liquid storage cavity (123) and the liquid droplet spraying head (121); and the liquid storage cavity (123) is in communication with the liquid guide port (3).

8. The deposition device according to claim 7, characterized in that: One end of the liquid guiding tube (4) is provided with a liquid control port (41), and the liquid control port (41) is connected to the liquid storage cavity (123).

9. The deposition device according to claim 8, characterized in that: The liquid reservoir (122) is provided with a through-hole, and the droplet spraying assembly (12) further comprises a flow rate control member (5), one end of the flow rate control member (5) is fixedly connected to the connecting member (11), and the other end opposite thereto is rotatably connected to the through-hole; the flow rate control member (5) passes through the through-hole and abuts against the liquid control port (41).

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