Phase-change heat-conducting gasket as well as preparation method and application thereof

Abstract

The invention relates to a phase-change heat-conducting gasket as well as a preparation method and application thereof. The phase-change heat-conducting gasket is prepared from the following raw materials: a base material, a heat-conducting material and a reinforcing material, the base material comprises a phase change alloy; the phase change alloy comprises, by mass, 14%-18% of tin, 29%-35% of bismuth, 46%-55% of indium, 0.1%-2% of zinc, 0.1%-1% of magnesium and 0.1%-1% of copper. The phase-change heat-conducting gasket provided by the invention takes the phase-change alloy as a matrix, has good processability at normal temperature, is convenient to cut, has relatively high heat conductivity coefficient and structural stability at working temperature, and can reduce thermal impedance, so that the phase-change heat-conducting gasket is effectively applied to heat dissipation of electronic components.

Description

Technical Field

[0001] The present invention relates to the technical field of thermal conductive gaskets, and particularly relates to a phase change thermal conductive gasket, a preparation method thereof and a use thereof. Background Art

[0002] In the heat dissipation of electronic components, the performance of thermal conductive gaskets is crucial. Traditional thermal conductive gaskets mostly use silicone as the matrix. Due to its softness and elasticity, silicone can effectively fill the tiny gaps between contact surfaces under pressure, thereby reducing the thermal resistance and improving the heat dissipation effect.

[0003] However, there are some problems with traditional silicone carrier materials in cutting and processing. Especially when it is necessary to prepare thin sheets with a thickness less than 1.0 mm, due to the soft nature of silicone, it is extremely difficult to precisely control the cutting thickness. Thinner silicone sheets are more easily affected by the vibration of the cutting tool during the cutting process, resulting in uneven thickness after cutting, which cannot meet the manufacturing requirements of precision heat dissipation components.

[0004] In order to improve the cutting accuracy, existing processes attempt to use silicone with a hardness greater than Shore OO 75 and add thermal conductive particles such as metal oxides to increase the thermal conductivity. Although this method can increase the hardness, even after adding thermal conductive particles, its thermal conductivity usually can only reach 1 - 8 W / (m·K), which is difficult to meet the requirements of high-performance heat dissipation materials. And under this hardness condition, it is still easily affected by vibration, resulting in a decrease in cutting accuracy.

[0005] In addition, using organic polymer phase change materials such as paraffin or petroleum resin as the carrier to replace traditional silicone materials can reduce the material cost, but the thermal conductivity usually does not exceed 0.5 W / (m·K), far from meeting the requirements of efficient heat dissipation. Even when using thermosetting resins or resins with a softening point higher than 110°C as the carrier material, although thin sheets with uniform thickness can be prepared in cutting and processing, they do not undergo phase change within the common working temperature range (such as 80 - 100°C), so they cannot effectively fill the gaps between contact surfaces like silicone and reduce the thermal resistance.

[0006] Therefore, providing a gasket material that can meet the cutting needs and the heat dissipation needs of electronic components and has a high thermal conductivity is a technical problem that needs to be solved in the current field. Summary of the Invention

[0007] In view of the above problems, the object of the present invention is to provide a phase change thermal conductive gasket and its preparation method and use. Compared with the prior art, the phase change thermal conductive gasket provided by the present invention uses a phase change alloy as the matrix, has good processing performance at room temperature, is convenient for cutting, and has a high thermal conductivity and structural stability at the working temperature, can reduce the thermal impedance, and thus can be effectively applied to the heat dissipation of electronic components.

[0008] To achieve the object of the present invention, the following technical solutions are adopted:

[0009] In the first aspect, the present invention provides a phase change thermal conductive gasket, and the preparation raw materials of the phase change thermal conductive gasket include a matrix material, a thermal conductive material, and a reinforcing material;

[0010] The matrix material includes a phase change alloy;

[0011] In the phase change alloy, by mass percentage, it includes 14-18% of tin, 29-35% of bismuth, 46-55% of indium, 0.1-2% of zinc, 0.1-1% of magnesium, and 0.1-1% of copper.

[0012] The phase change thermal conductive gasket provided by the present invention uses a phase change alloy as the matrix. At room temperature, the matrix is solid and has a high hardness. When cutting, its softening point or melting point is not reached, so it is convenient for cutting; when the temperature rises to the phase change temperature, the matrix softens or melts, can better fill the tiny gaps between the heat source and the electronic components, discharge air, thus significantly reducing the contact thermal resistance, has a high thermal conductivity, and can effectively improve the heat dissipation efficiency.

[0013] It should be noted that through the synergistic effect of the matrix material, the thermal conductive material, and the reinforcing material in the preparation raw materials provided by the present invention, the thermal conductivity and structural stability of the thermal conductive gasket can be ensured. When the matrix material softens or melts at the working temperature, the reinforcing material keeps the overall thickness of the gasket certain, thus ensuring the thermal conductivity of the carbon fiber in the Z-axis direction. Further, the phase change alloy provided by the present invention is combined with tin, bismuth, indium, zinc, magnesium, and copper. The addition of zinc, magnesium, and copper can further adjust the melting point and thermal conductivity of the phase change alloy, that is, appropriately reduce the melting point and increase the thermal conductivity, so as to be able to control the phase change temperature to match the working temperature of the phase change thermal conductive gasket. Compared with the traditional silica gel gasket, the phase change temperature of the thermal conductive gasket provided by the present invention is relatively low, can quickly react and soften when the working temperature rises, fill the interface gap, reduce the thermal resistance, and thus significantly improve the thermal conductivity.

[0014] In the present invention, in the phase change alloy by mass percentage, it includes 14-18% of tin, for example, it can be 14%, 15%, 16%, 17% or 18%, but not limited to the listed values, and other unlisted values within the numerical range are equally applicable; 29-35% of bismuth, for example, it can be 29%, 30%, 31%, 32%, 33%, 34% or 35%, but not limited to the listed values, and other unlisted values within the numerical range are equally applicable; 46-55% of indium, for example, it can be 46%, 47%, 48%, 49%, 50%, 51%, 52%, 53%, 54% or 55%, but not limited to the listed values, and other unlisted values within the numerical range are equally applicable; 0.1-2% of zinc, for example, it can be 0.1%, 0.2%, 0.5%, 0.8%, 1%, 1.2%, 1.5%, 1.8% or 2%, but not limited to the listed values, and other unlisted values within the numerical range are equally applicable; 0.1-1% of magnesium, for example, it can be 0.1%, 0.2%, 0.5%, 0.8% or 1%, but not limited to the listed values, and other unlisted values within the numerical range are equally applicable; 0.1-1% of copper, for example, it can be 0.1%, 0.2%, 0.5%, 0.8% or 1%, but not limited to the listed values, and other unlisted values within the numerical range are equally applicable.

[0015] Preferably, the mass ratio of tin, bismuth and indium in the phase change alloy is (14-18):(30-35):(50-55), for example, it can be 14:30:50, 15:32:52, 16:34:53, 17:34:54 or 18:35:55, but not limited to the listed values, and other unlisted values within the numerical range are equally applicable.

[0016] In the present invention, by preferably controlling the mass ratio of tin, bismuth and indium in the phase change alloy, the melting point of the phase change alloy can be further adjusted, so that it can quickly react and soften when the working temperature rises, and the thermal conductivity is increased and the thermal resistance is reduced.

[0017] Preferably, the phase change temperature of the phase change alloy is 58-65°C, for example, it can be 58°C, 59°C, 60°C, 61°C, 62°C, 63°C, 64°C or 65°C, but not limited to the listed values, and other unlisted values within the numerical range are equally applicable.

[0018] Preferably, the heat-conducting material includes carbon fiber.

[0019] Preferably, the thermal conductivity of the carbon fiber is 600-900 W / (m·K), for example, it can be 600 W / (m·K), 650 W / (m·K), 700 W / (m·K), 750 W / (m·K), 800 W / (m·K), 850 W / (m·K) or 900 W / (m·K), but is not limited to the listed values, and other unlisted values within the numerical range are equally applicable.

[0020] Preferably, the reinforcing material includes any one or a combination of at least two of stainless steel powder, nickel metal powder, copper metal powder, silver metal powder, silicon dioxide, aluminum oxide, zinc oxide, magnesium oxide or aluminum nitride.

[0021] In the present invention, the stainless steel powder can be the commonly used stainless steel powder in the art, for example, it can be SUS304.

[0022] Preferably, the particle size of the reinforcing material is 0.05-3.0 mm, for example, it can be 0.05 mm, 0.1 mm, 0.5 mm, 1 mm, 1.5 mm, 2 mm, 2.5 mm or 3 mm, but is not limited to the listed values, and other unlisted values within the numerical range are equally applicable.

[0023] In the present invention, by preferably controlling the particle size of the reinforcing material within a specific range, on the one hand, it avoids that the particle size is too small to play a good structural support role. Since the carbon fiber can achieve the best thermal conductivity effect only when it is arranged in the Z-axis direction, too small a particle size may cause the carbon fiber to be crushed and lose the thermal conductivity ability in the Z-axis direction, thereby increasing the thermal resistance; on the other hand, it avoids that the particle size is too large resulting in too large a thermal resistance and poor mechanical properties.

[0024] Preferably, the preparation raw materials of the phase change thermal conductive gasket, calculated by weight, include:

[0025] Matrix material 15-90 parts;

[0026] Thermal conductive material 1-10 parts;

[0027] Reinforcing material 0.5-4 parts.

[0028] In the present invention, by preferably controlling the weight parts of each component of the matrix material, the thermal conductive material and the reinforcing material, the synergistic effect can be further fully exerted, so as to achieve good thermal conductivity effect and structural stability. Among them, preferably controlling the weight parts of the reinforcing material can avoid too little addition amount, which cannot effectively control the thickness of the phase change thermal conductive gasket during operation, resulting in the carbon fiber being crushed and poor thermal conductivity effect; at the same time, it avoids too much addition amount, which cannot be liquefied and interferes with the directional arrangement of the carbon fiber, also resulting in poor thermal conductivity effect.

[0029] Second aspect, the present invention provides a method for preparing a phase change thermal conductive gasket as described in the first aspect of the present invention, characterized in that the preparation method includes the following steps:

[0030] (1) Mix the matrix material, thermal conductive material and reinforcing material, and then extrude them directionally to obtain a strip-shaped extruded material;

[0031] (2) Subject the strip-shaped extruded material obtained in step (1) to vacuum pumping, hardening and cutting in sequence to obtain a phase change thermal conductive gasket.

[0032] In the preparation method provided by the present invention, by adopting the directional extrusion process, it is possible to avoid the random distribution of carbon fibers caused by the traditional mixing and pressing process, and thus the thermal conductivity in the Z-axis direction is limited. The present invention can make the carbon fibers align along the extrusion direction in the mixture state to form an oriented structure, significantly improving the thermal conductivity of the carbon fibers in the Z-axis direction, increasing the thermal conductivity efficiency of the gasket, and ensuring the mechanical properties.

[0033] Preferably, the temperature of the mixing in step (1) is 80 - 110 °C, for example, it can be 80 °C, 82 °C, 84 °C, 86 °C, 88 °C, 90 °C, 92 °C, 94 °C, 96 °C, 98 °C, 100 °C, 102 °C, 105 °C, 108 °C or 110 °C, but is not limited to the listed values, and other unlisted values within the numerical range are equally applicable.

[0034] In the present invention, by preferably controlling the mixing temperature within a specific range, the matrix material can be melted, so that the matrix material, thermal conductive material and reinforcing material are fully and uniformly mixed.

[0035] Preferably, the temperature of the directional extrusion is 110 - 120 °C, for example, it can be 110 °C, 112 °C, 114 °C, 116 °C, 118 °C or 120 °C, but is not limited to the listed values, and other unlisted values within the numerical range are equally applicable.

[0036] Preferably, the temperature of the hardening in step (2) is < 60 °C, for example, it can be 59 °C, 58 °C, 57 °C, 56 °C or 55 °C, but is not limited to the listed values, and other unlisted values within the numerical range are equally applicable.

[0037] Preferably, the thickness of the phase change thermal conductive gasket is 0.1 - 0.5 mm, for example, it can be 0.1 mm, 0.2 mm, 0.3 mm, 0.4 mm or 0.5 mm, but is not limited to the listed values, and other unlisted values within the numerical range are equally applicable.

[0038] As a preferred technical solution of the second aspect of the present invention, the preparation method includes the following steps:

[0039] (1) Mix the matrix material, heat-conducting material, and reinforcing material at a temperature of 80 - 110 °C, and then perform directional extrusion at a temperature of 110 - 120 °C to obtain a strip-shaped extruded material;

[0040] (2) Evacuate the strip-shaped extruded material obtained in step (1), then harden it at a temperature < 60 °C, and then cut it to a thickness of 0.1 - 0.5 mm to obtain a phase-change heat-conducting gasket.

[0041] Thirdly, the present invention provides a use of the phase-change heat-conducting gasket as described in the first aspect of the present invention, and the phase-change heat-conducting gasket is used for heat dissipation of electronic components.

[0042] The phase-change heat-conducting gasket provided by the present invention can soften and fill the interface voids when the working temperature rises, reduce the thermal resistance, and thus significantly improve the heat dissipation effect.

[0043] Compared with the prior art, the present invention has the following beneficial effects:

[0044] (1) The phase-change heat-conducting gasket provided by the present invention uses a phase-change alloy as the matrix, which is convenient to cut at room temperature. When the temperature rises to the phase-change temperature, the matrix softens or melts, which can better fill the tiny voids between the heat source and the electronic components, discharge air, and thus significantly reduce the contact thermal resistance. Under better conditions, the phase-change heat-conducting gasket provided by the present invention can make the phase-change temperature reach within the range of 58 - 65 °C, the thermal conductivity reach above 60 W / (m·K), and the thermal impedance reach below 0.007 K·in 2 / W.

[0045] (2) Through the synergistic effect of the matrix material, heat-conducting material, and reinforcing material, the phase-change heat-conducting gasket provided by the present invention can ensure the thermal conductivity and structural stability of the heat-conducting gasket. When the matrix material softens or melts at the working temperature, the reinforcing material keeps the overall thickness of the gasket certain, so as to ensure the heat-conducting ability of the carbon fiber in the Z-axis direction.

[0046] (3) Through the combined use of tin, bismuth, indium, zinc, magnesium, and copper in the phase-change alloy, the phase-change heat-conducting gasket provided by the present invention can quickly react and soften when the working temperature rises, fill the interface voids, reduce the thermal resistance, and thus significantly improve the thermal conductivity.

[0047] (4) In the preparation method of the phase-change heat-conducting gasket provided by the present invention, by adopting the directional extrusion process, the heat-conducting performance of the carbon fiber in the Z-axis direction can be significantly improved, the heat-conducting efficiency of the gasket can be increased, and the mechanical properties can be ensured. Detailed Embodiments

[0048] The technical solution of the present invention will be further described below through specific embodiments. Those skilled in the art should understand that the embodiments are only for helping to understand the present invention and should not be regarded as specific limitations on the present invention.

[0049] Example 1

[0050] This example provides a phase change heat conductive gasket. The preparation raw materials of the phase change heat conductive gasket include, by weight:

[0051] Matrix material (phase change alloy) 55 parts;

[0052] Thermal conductive material (carbon fiber, thermal conductivity 800 W / (m·K)) 5 parts;

[0053] Reinforcing material 2 parts;

[0054] In the phase change alloy, by mass percentage, it includes 14% of tin, 30% of bismuth, 55% of indium, 0.7% of zinc, 0.2% of magnesium and 0.1% of copper, and the mass ratio of tin, bismuth and indium is 14:30:55;

[0055] The reinforcing material is stainless steel powder (model SUS304) with a particle size of 1.5 mm.

[0056] This example also provides a preparation method of the above phase change heat conductive gasket. The preparation method includes the following steps:

[0057] (1) Mix the matrix material, thermal conductive material and reinforcing material at a temperature of 100°C, and then perform directional extrusion at a temperature of 115°C to obtain a strip-shaped extruded material;

[0058] (2) Vacuumize the strip-shaped extruded material obtained in step (1), then harden it at a temperature of 55°C, and then cut it to a thickness of 0.2 mm to obtain a phase change heat conductive gasket.

[0059] Example 2

[0060] This example provides a phase change heat conductive gasket. The preparation raw materials of the phase change heat conductive gasket include, by weight:

[0061] Matrix material (phase change alloy) 15 parts;

[0062] Thermal conductive material (carbon fiber, thermal conductivity 800 W / (m·K)) 10 parts;

[0063] Reinforcing material 4 parts;

[0064] In the phase change alloy, by mass percentage, it includes 16% of tin, 32% of bismuth, 50% of indium, 1.5% of zinc, 0.3% of magnesium and 0.2% of copper, and the mass ratio of tin, bismuth and indium is 16:32:50;

[0065] The reinforcing material is metallic copper powder with a particle size of 0.05 mm.

[0066] This embodiment also provides a preparation method for the above-mentioned phase change heat-conducting gasket. The preparation method includes the following steps:

[0067] (1) Mix the matrix material, heat-conducting material and reinforcing material under the condition of a temperature of 110°C, and then perform directional extrusion under the condition of a temperature of 110°C to obtain a strip-shaped extruded material;

[0068] (2) Vacuumize the strip-shaped extruded material obtained in step (1), then harden it at a temperature of 55°C, and then cut it to a thickness of 0.2 mm to obtain the phase change heat-conducting gasket.

[0069] Example 3

[0070] This embodiment provides a phase change heat-conducting gasket. The preparation raw materials of the phase change heat-conducting gasket include, by weight:

[0071] 90 parts of matrix material (phase change alloy);

[0072] 1 part of heat-conducting material (carbon fiber, heat conductivity coefficient 800 W / (m·K));

[0073] 0.5 part of reinforcing material;

[0074] In the phase change alloy, by mass percentage, it includes 17.5% of tin, 32% of bismuth, 50% of indium, 0.3% of zinc, 0.1% of magnesium and 0.1% of copper. The mass ratio of tin, bismuth and indium is 17.5:32:50;

[0075] The reinforcing material is alumina with a particle size of 0.05 mm.

[0076] This embodiment also provides a preparation method for the above-mentioned phase change heat-conducting gasket. The preparation method includes the following steps:

[0077] (1) Mix the matrix material, heat-conducting material and reinforcing material under the condition of a temperature of 110°C, and then perform directional extrusion under the condition of a temperature of 110°C to obtain a strip-shaped extruded material;

[0078] (2) Vacuumize the strip-shaped extruded material obtained in step (1), then harden it at a temperature of 55°C, and then cut it to a thickness of 0.2 mm to obtain the phase change heat-conducting gasket.

[0079] Example 4

[0080] This embodiment provides a phase change thermal conductive gasket. The only difference compared with that of Embodiment 1 is that the total mass percentage content of tin, bismuth, and indium in the phase change alloy remains unchanged, and its mass ratio is adjusted to 20:10:55.

[0081] Embodiment 5

[0082] This embodiment provides a phase change thermal conductive gasket. The only difference compared with that of Embodiment 1 is that the total mass percentage content of tin, bismuth, and indium in the phase change alloy remains unchanged, and its mass ratio is adjusted to 10:40:55.

[0083] Embodiment 6

[0084] This embodiment provides a phase change thermal conductive gasket. The only difference compared with that of Embodiment 1 is that the particle size of the reinforcing material in the phase change alloy is 0.01 mm.

[0085] Embodiment 7

[0086] This embodiment provides a phase change thermal conductive gasket. The only difference compared with that of Embodiment 1 is that the particle size of the reinforcing material in the phase change alloy is 5 mm.

[0087] Embodiment 8

[0088] This embodiment provides a phase change thermal conductive gasket. The only difference compared with that of Embodiment 1 is that, calculated by weight, the preparation raw materials of the phase change thermal conductive gasket include 0.2 parts of reinforcing material.

[0089] Embodiment 9

[0090] This embodiment provides a phase change thermal conductive gasket. The only difference compared with that of Embodiment 1 is that, calculated by weight, the preparation raw materials of the phase change thermal conductive gasket include 6 parts of reinforcing material.

[0091] Comparative Example 1

[0092] This comparative example provides a thermal conductive gasket. The only difference compared with that of Embodiment 1 is that the reinforcing material is not added to the preparation raw materials of the phase change thermal conductive gasket.

[0093] This comparative example also provides a preparation method of the above thermal conductive gasket. The only difference compared with that of Embodiment 1 is that no reinforcing material is added in the mixing in step (1), and the rest is the same as that of Embodiment 1.

[0094] Comparative Examples 2 - 4

[0095] Comparative Examples 2 - 4 respectively provide a thermal conductive gasket. The only difference compared with that of Embodiment 1 is that zinc, magnesium, and copper are not added to the phase change alloy in sequence, the number of parts of the phase change alloy is ensured to be unchanged, and the addition amounts of other elements are adjusted proportionally.

[0096] Comparative Examples 2-4 respectively provide a preparation method of the above thermal conductive gasket. The only difference compared with Example 1 is that the phase change alloys provided by Comparative Examples 2-4 are respectively used in the mixing in step (1), and the rest is the same as in Example 1.

[0097] Comparative Example 5

[0098] This comparative example provides a thermal conductive gasket. The only difference compared with Example 1 is that zinc, magnesium and copper are not added to the phase change alloy, ensuring that the amount of the phase change alloy remains unchanged, and the addition amounts of tin, bismuth and indium are adjusted proportionally.

[0099] This comparative example also provides a preparation method of the above thermal conductive gasket. The only difference compared with Example 1 is that the phase change alloy provided by this comparative example is used in the mixing in step (1), and the rest is the same as in Example 1.

[0100] The phase change temperatures of the phase change thermal conductive gaskets obtained in the above examples and comparative examples were measured using a DSC device produced by TA Company. Using the ASTM D5470 method, a thermal conductivity measuring instrument manufactured by Ruiling was used to measure the thermal conductivity and thermal impedance. The results are shown in Table 1.

[0101] Table 1

[0102]

[0103] It can be seen from the data in Table 1 as follows:

[0104] (1) Under relatively optimal conditions, the phase change thermal conductive gasket provided by the present invention can make the phase change temperature reach within the range of 58-65 °C, the thermal conductivity reach above 60 W / (m·K), and the thermal impedance reach below 0.007 K·in 2 / W.

[0105] (2) By comprehensively comparing the data of Example 1 and Examples 4-5, it can be seen that by preferably controlling the mass ratio of tin, bismuth and indium in the phase change alloy, the present invention can further lower the phase change temperature, increase the thermal conductivity and reduce the thermal impedance.

[0106] (3) By comprehensively comparing the data of Example 1, Examples 6-9 and Comparative Example 1, it can be seen that by adding a reinforcing material and preferably controlling the particle size and weight fraction of the reinforcing material, the present invention can ensure the structural stability of the thermal conductive gasket, while ensuring the thermal conductivity effect of the carbon fiber, further increasing the thermal conductivity and reducing the thermal impedance.

[0107] (4) By comprehensively comparing the data of Example 1 and Comparative Examples 2-5, it can be seen that by controlling the phase change alloy to add zinc, magnesium and copper on the basis of using tin, bismuth and indium, the present invention can effectively increase the thermal conductivity, reduce the thermal impedance, and adjust the phase change temperature for rapid reaction and softening.

[0108] In summary, the phase change thermal conductive gasket provided by the present invention uses a phase change alloy as the matrix, has good processing performance at room temperature, is convenient for cutting, and has a high thermal conductivity and structural stability at the working temperature, can reduce the thermal impedance, and thus can be effectively applied to the heat dissipation of electronic components.

[0109] The applicant declares that the above description is only the specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Those skilled in the art should understand that any changes or substitutions that can be easily thought of by any person skilled in the art within the technical scope disclosed by the present invention fall within the protection scope and the disclosure scope of the present invention.

Claims

1. A phase change thermally conductive gasket, characterized in that: The raw materials for preparing the phase change thermal conductive pad include base material, thermal conductive material and reinforcing material; The matrix material includes a phase change alloy; The phase change alloy comprises, by weight percentage, 14-18% tin, 29-35% bismuth, 46-55% indium, 0.1-2% zinc, 0.1-1% magnesium and 0.1-1% copper.

2. The phase change thermally conductive pad according to claim 1, characterized in that: The mass ratio of tin, bismuth and indium in the phase change alloy is (14-18):(30-35):(50-55).

3. The phase change thermally conductive pad according to claim 1 or 2, characterized in that: The phase change temperature of the phase change alloy is 58-65°C.

4. The phase change thermally conductive pad according to any one of claims 1 to 3, characterized in that: The thermally conductive material comprises carbon fiber; Preferably, the thermal conductivity of the carbon fiber is 600-900 W / (m·K).

5. The phase change thermally conductive pad according to any one of claims 1 to 4, characterized in that: The reinforcing material comprises any one or a combination of at least two of stainless steel powder, metal nickel powder, metal copper powder, metal silver powder, silicon dioxide, aluminum oxide, zinc oxide, magnesium oxide or aluminum nitride; Preferably, the particle size of the reinforcing material is 0.05-3.0 mm.

6. The phase change thermally conductive pad according to any one of claims 1 to 5, characterized in that: The raw materials for preparing the phase change thermal conductive pad include, by weight: 15-90 parts of base material; 1-10 parts of thermal conductive material; Reinforcement material 0.5-4 parts.

7. A method for preparing the phase change thermally conductive gasket according to any one of claims 1 to 6, characterized in that: The preparation method comprises the following steps: (1) mixing a matrix material, a thermal conductive material, and a reinforcing material, and then directional extruding the mixture to obtain a strip-shaped extruded material; (2) The strip extruded material obtained in step (1) is vacuumed, hardened and cut in sequence to obtain a phase change thermal conductive gasket.

8. The preparation method according to claim 7, characterized in that: The mixing temperature in step (1) is 80-110° C. Preferably, the temperature of the directional extrusion is 110-120°C; Preferably, the hardening temperature in step (2) is less than 60°C; Preferably, the thickness of the phase change thermal conductive gasket is 0.1-0.5 mm.

9. The preparation method according to claim 7 or 8, characterized in that: The preparation method comprises the following steps: (1) mixing a matrix material, a thermal conductive material and a reinforcing material at a temperature of 80-110° C., and then directional extruding the material at a temperature of 110-120° C. to obtain a strip-shaped extruded material; (2) The strip extruded material obtained in step (1) is evacuated, then hardened at a temperature of less than 60° C., and then cut to a thickness of 0.1-0.5 mm to obtain a phase change thermal conductive gasket.

10. A use of the phase change thermal conductive pad according to any one of claims 1 to 6, characterized in that: The phase-change thermally conductive pad is used for heat dissipation of electronic components.

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