Focal plane efficient temperature control structure with super-large temperature gradient
By designing a focal surface high-efficiency temperature control structure with ultra-large temperature gradients including flexible connection of printed boards, independent spaces and thermal isolation units, the problem of taking into account the low temperature of the detector and the appropriate temperature of the control module is solved, and high-quality focal surface imaging effect and low thermal energy consumption are achieved.
Patent Information
- Application Number
- CN202510260196.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-06
- Publication Date
- 2025-05-30
AI Technical Summary
The prior art is difficult to effectively reduce the temperature and noise level of the detector, while improving the thermal conductivity of high-power devices, resulting in waste of satellite power consumption and poor imaging effects.
A focal surface high-efficiency temperature control structure with ultra-large temperature gradient is designed. Through flexible connected printed boards, independent control modules and detector spaces, thermal isolation units and thermal conductivity heat pipes, the detector low temperature and the appropriate temperature of the control module are achieved, while reducing thermal energy consumption.
It realizes high-quality focal imaging effect, reduces the focal heat dissipation energy consumption demand, improves signal transmission efficiency, and effectively reduces the heat conduction efficiency of the connection between the detector and the control module.
Smart Images
Figure CN120076267A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the field of space optical remote sensing technology, and particularly to a high-efficiency temperature control structure for a focal plane with an ultra-large temperature gradient. Background Art
[0002] The detector is the core component of an optical remote sensing camera. With the development of the space optical remote sensing field towards higher resolution and larger field of view, the sensitivity requirements of the detector are getting higher and higher, the scale requirements of the detector are getting larger and larger, and the impacts of the corresponding increases in noise and power consumption are becoming more and more prominent. Therefore, in order to improve the imaging effect of the detector, it is necessary to significantly reduce the temperature of the detector, reduce the noise level, and at the same time, it is necessary to improve the heat conduction efficiency of high-power devices and reduce the impact of the heat generation of high-power devices on the temperature fluctuation of the detector.
[0003] The focal plane is the carrier of the detector. In addition to the detector, it also includes a control module, a printed circuit board, a focal plane support, and a heat conduction structure, etc. In order to ensure the imaging effect of the detector, it is necessary to significantly reduce the temperature of the detector (below 0 °C). In order to ensure the reliability of the long-term on-orbit operation of the control module, it is necessary to maintain an appropriate working temperature for the electronic devices (generally 20 °C - 30 °C). There is a large temperature gradient between the two. Existing technical means generally use the means of increasing a large amount of heat conduction power consumption to meet the temperature gradient requirements. This method causes a great waste of satellite power consumption, and the achieved effect is not satisfactory.
[0004] Based on the above technical problems, those skilled in the art urgently need to develop a high-efficiency temperature control structure for a focal plane with an ultra-large temperature gradient that can take into account the low-temperature requirements of the detector and the working temperature requirements of the control module, while significantly reducing the heat conduction energy consumption of the focal plane and achieving a high-quality imaging effect of the focal plane. Summary of the Invention
[0005] The purpose of the present invention is to provide a high-efficiency temperature control structure for a focal plane with an ultra-large temperature gradient that can take into account the low-temperature requirements of the detector and the working temperature requirements of the control module, while significantly reducing the heat conduction energy consumption of the focal plane and achieving a high-quality imaging effect of the focal plane.
[0006] To achieve the above purpose, the present invention provides the following technical solutions: A high-efficiency temperature control structure for a focal plane with an ultra-large temperature gradient of the present invention, the temperature control structure includes: Focal plane electronics, which includes a first printed circuit board and a second printed circuit board; wherein, The first printed circuit board and the second printed circuit board are flexibly connected, and a control module is fixedly installed on the first printed circuit board, and a detector is mainly fixedly installed on the second printed circuit board; The temperature control structure further includes: The focal plane support and heat conduction structure cooperate with the first printed circuit board to form an independent space for the control module and cooperate with the second printed circuit board to form an independent space for the detector; and A thermal isolation unit provided between the independent space of the control module and the independent space of the detector.
[0007] Furthermore, the independent space of the control module and the independent space of the detector are connected by a rigid-flexible tape, and a rigid-flexible tape protection cover plate is installed outside the rigid-flexible tape.
[0008] Furthermore, a concentrated area for high-power devices is arranged on the first printed circuit board, and the high-power devices in the control module are installed in the concentrated area for high-power devices and are concentrated and arranged in a long and narrow shape along the long side of the first printed circuit board.
[0009] Furthermore, the focal plane support and heat conduction structure includes a bottom frame of the independent space of the control module installed outside the first printed circuit board; and A cover plate of the independent space of the control module covering the bottom frame of the independent space of the control module. A boss is provided on the cover plate of the independent space of the control module, and the boss contacts the high-power devices in the control module to form the independent space of the control module; An upper frame of the independent space of the detector installed outside the second printed circuit board. The bottom frame of the independent space of the control module and the upper frame of the independent space of the detector are connected by the thermal isolation unit, and a heat insulation multi-layer material is laid between the independent space of the control module and the independent space of the detector.
[0010] Preferably, a heat conduction path for high-power devices is formed at one end of the cover plate of the independent space of the control module, and a heat conduction heat pipe is installed in the heat conduction path for high-power devices.
[0011] Furthermore, the temperature control structure further includes a focal plane substrate; and A heat conduction copper block assembled on the detector. The combination of the detector and the heat conduction copper block is installed on the focal plane substrate.
[0012] Preferably, a heat conduction path for the detector is formed on the heat conduction copper block, and a heat conduction heat pipe is installed in the heat conduction path for the detector.
[0013] In the above technical solution, an ultra-large temperature gradient focal plane high-efficiency temperature control structure provided by the present invention has the following beneficial effects: The ultra-large temperature gradient focal plane high-efficiency temperature control structure of the present invention has good temperature control effect, wide temperature control range, and reduces the heat dissipation energy consumption requirement of the focal plane. The rigid-flexible tape flexible connection method is adopted between the two printed circuit boards. On the one hand, it can improve the signal integrity and signal transmission efficiency, and on the other hand, it can reduce the heat conduction efficiency of the connection between the detector and the control module; The thermal isolation unit of the present invention is a transition unit for connecting the control module support structure and the detector support structure, and is also a rigid-flexible tape protection structure for the printed circuit board. It uses a structural material with low thermal conductivity, which can significantly reduce the thermal conduction efficiency between two independent spaces. Brief Description of the Drawings
[0014] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings required in the embodiments. Obviously, the drawings described below are only some embodiments recorded in the present invention. For those of ordinary skill in the art, other drawings can also be obtained based on these drawings.
[0015] Figure 1 It is a cross-sectional view of a high-efficiency temperature control structure for a focal plane with an ultra-large temperature gradient provided by an embodiment of the present invention; Figure 2 It is a schematic diagram of the focal plane electronics structure in a high-efficiency temperature control structure for a focal plane with an ultra-large temperature gradient provided by an embodiment of the present invention; Figure 3 It is a schematic diagram of the overall structure of a high-efficiency temperature control structure for a focal plane with an ultra-large temperature gradient provided by an embodiment of the present invention.
[0016] Description of the Reference Numerals in the Drawings: Focal plane electronics; 2. Focal plane support and heat conduction structure; 3. Thermal isolation unit; 4. Rigid-flexible tape; 5. Rigid-flexible tape protection cover plate; 6. Focal plane substrate; 7. Heat-conducting copper block; 101. First printed circuit board; 102. Second printed circuit board; 103. Detector; 1011. Concentrated area of high-power devices; 201. Bottom frame of the control module independent space; 202. Cover plate of the control module independent space; 203. Upper frame of the detector independent space; 2021. Heat conduction path of high-power devices; 701. Heat conduction path of the detector. Detailed Embodiments
[0017] In order to enable those skilled in the art to better understand the technical solutions of the present invention, the following will further introduce the present invention in detail in conjunction with the drawings.
[0018] See Figures 1 to 3 as shown; A high-efficiency temperature control structure for a focal plane with an ultra-large temperature gradient of the present invention, the temperature control structure includes: Focal plane electronics 1, which includes a first printed circuit board 101 and a second printed circuit board 102; wherein, The first printed circuit board 101 and the second printed circuit board 102 are flexibly connected. A control module is fixedly welded on the first printed circuit board 101, and a detector 103 is fixedly welded on the second printed circuit board 102. Through the printed circuit board line design and layout, a predetermined function is achieved; This temperature control structure further includes: A focal plane support and heat conduction structure 2, which cooperates with the first printed circuit board 101 to form an independent space for the control module and cooperates with the second printed circuit board 102 to form an independent space for the detector; and A thermal isolation unit 3 provided between the independent space of the control module and the independent space of the detector.
[0019] As a further introduction of this embodiment, the independent space of the control module and the independent space of the detector are connected by a rigid-flexible tape 4, and a rigid-flexible tape protection cover plate 5 is installed outside the rigid-flexible tape 4. The thermal isolation unit 3 is a transition unit for the connection between the independent space of the control module and the independent space of the detector, and is also a rigid-flexible tape protection structure for the printed circuit board. Using a structural material with a low heat conduction rate can greatly reduce the heat conduction efficiency between the two independent spaces.
[0020] As a further introduction of this embodiment, a high-power device concentration area 1011 is arranged on the first printed circuit board 101. The high-power devices in the control module are installed in the high-power device concentration area 1011 and are concentrated and arranged in a long and narrow manner along the long side of the first printed circuit board 101. When designing the printed circuit board, the high-power devices of the control module are arranged in a concentrated area far from the detector 103, so as to reduce the influence of the heat generated by the high-power devices during operation on the temperature of the detector 103, and can realize the centralized and nearby heat dissipation of the high-power devices. The first printed circuit board 101 and the second printed circuit board 102 are flexibly connected by a rigid-flexible tape 4. On the one hand, it can improve the signal integrity and signal transmission efficiency, and on the other hand, it can reduce the heat conduction efficiency of the connection between the detector 103 and the control module.
[0021] As a further introduction of this embodiment, the focal plane support and heat conduction structure 2 includes a bottom frame 201 of the independent space of the control module installed outside the first printed circuit board 101; and A cover plate 202 of the independent space of the control module covering the bottom frame 201 of the independent space of the control module. A boss is provided on the cover plate 202 of the independent space of the control module, and the boss contacts the high-power devices in the control module to form the independent space of the control module; the high-power devices of the control module directly conduct heat to the auxiliary cooling structure outside the camera through the structural boss and heat conduction heat pipe above it, realizing the nearby and rapid heat dissipation of the high-power devices; The upper frame 203 of the detector independent space installed outside the second printed circuit board 102, the bottom frame 201 of the control module independent space is connected to the upper frame 203 of the detector independent space through the thermal isolation unit 3, and a heat insulation multi-layer material is laid between the control module independent space and the detector independent space.
[0022] As a preferred technical solution of this embodiment, one end of the cover plate 202 of the control module independent space forms a heat conduction path 2021 for high-power devices, and a heat conduction heat pipe is installed in the heat conduction path 2021 for high-power devices.
[0023] As a further introduction of this embodiment, the temperature control structure further includes a focal plane substrate 6; and A heat conduction copper block 7 assembled on the detector 103, and the combination of the detector 103 and the heat conduction copper block 7 is installed on the focal plane substrate 6.
[0024] As a preferred technical solution of this embodiment, a detector heat conduction path 701 is formed on the heat conduction copper block 7, and a heat conduction heat pipe is installed in the detector heat conduction path 701. The heat of the detector 103 is directly conducted to the auxiliary cooling structure outside the camera through the heat conduction copper block 7 and the heat conduction heat pipe, realizing direct and efficient heat dissipation of the detector.
[0025] A focal plane high-efficiency temperature control structure with an ultra-large temperature gradient provided by this embodiment has the following specific assembly process: Step 1: When designing the focal plane electronics 1, the first printed circuit board 101 and the second printed circuit board 102 adopt a rigid-flexible tape connection method, and the high-power devices in the control module are arranged on the first printed circuit board 101 far away from the detector 103 and concentrated in a long and narrow layout along the long side of the first printed circuit board 101; Step 2: After all the structural parts of the focal plane support and heat conduction structure 2 are adapted, ensure that the installation relationship is accurate; Step 3: Connect the bottom frame 201 of the control module independent space to the upper frame 203 of the detector independent space through the thermal isolation unit 3, and lay a heat insulation multi-layer material between the two independent spaces; Step 4: The components of the focal plane electronics 1 are welded according to the designed positions on the printed circuit board and installed into the focal plane support and heat conduction structure 2; Step 5: Measure the height of the high-power device, and modify the height of the corresponding boss of the cover plate 202 of the control module independent space according to the size to make the two in full contact. After modification, a control module independent space is formed by combination; Step 6: Combine the detector 103 with the heat conduction copper block 7, install it on the focal plane substrate 6, complete the welding of the second printed circuit board 102 and the detector 103, and install the combination into the focal plane support and heat conduction structure 2 to form a detector independent space; Step Seven: Install a heat pipe at the position of the high-power device heat conduction path 2021 on the cover plate 203 of the control module independent space, ensuring that the heat pipe is in full contact with the structural member, thus completing the installation of the high-power device heat conduction path; Step Eight: Install a heat pipe on the heat-conducting copper block 7 in the detector independent space, ensuring that the heat pipe is in full contact with the structural member, thus completing the installation of the detector heat conduction path; Step Nine: Install the side rigid-flexible tape protection cover plate 5 to complete the assembly of the entire focal plane.
[0026] Only some exemplary embodiments of the present invention are described by way of illustration above. Undoubtedly, for those of ordinary skill in the art, the described embodiments can be modified in various different ways without departing from the spirit and scope of the present invention. Therefore, the above drawings and descriptions are illustrative in nature and should not be construed as limiting the scope of protection of the claims of the present invention.
Claims
1. A focal plane efficient temperature control structure with ultra-large temperature gradient, characterized in that: The temperature control structure includes: Focal plane electronics (1), comprising a first printed circuit board (101) and a second printed circuit board (102); wherein: The first printed board (101) and the second printed board (102) are flexibly connected, a control module is fixedly mounted on the first printed board (101), and a detector (103) is fixedly mounted on the second printed board (102); The temperature control structure also includes: A focal plane support and heat conduction structure (2), which cooperates with the first printed board (101) to form an independent space for the control module, and cooperates with the second printed board (102) to form an independent space for the detector; and A thermal isolation unit (3) is provided between the independent space of the control module and the independent space of the detector.
2. The focal plane efficient temperature control structure with ultra-large temperature gradient according to claim 1, characterized in that: The independent space of the control module is connected to the independent space of the detector via a rigid-flexible belt (4), and a rigid-flexible belt protection cover plate (5) is installed on the outside of the rigid-flexible belt (4).
3. The focal plane efficient temperature control structure with ultra-large temperature gradient according to claim 1, characterized in that: A high-power device concentration area (1011) is arranged on the first printed circuit board (101), and the high-power devices in the control module are mounted in the high-power device concentration area (1011) and arranged in a concentrated and narrow manner along the long side of the first printed circuit board (101).
4. The focal plane efficient temperature control structure with ultra-large temperature gradient according to claim 1, characterized in that: The focal plane support and heat conduction structure (2) comprises a control module independent space bottom frame (201) installed outside the first printed board (101); and A control module independent space cover plate (202) is arranged on the bottom frame (201) of the control module independent space, the control module independent space cover plate (202) being provided with a boss, the boss being in contact with a high-power device in the control module to form the control module independent space; An upper frame (203) of the detector independent space is installed on the outside of the second printed circuit board (102), the bottom frame (201) of the control module independent space is connected to the upper frame (203) of the detector independent space via the thermal isolation unit (3), and a multi-layer thermal insulation material is laid between the control module independent space and the detector independent space.
5. The focal plane efficient temperature control structure with ultra-large temperature gradient according to claim 4, characterized in that: A high-power device heat conduction path (2021) is formed at one end of the control module independent space cover (202), and a heat conduction heat pipe is installed in the high-power device heat conduction path (2021).
6. The focal plane efficient temperature control structure with ultra-large temperature gradient according to claim 1, characterized in that: The temperature control structure also includes a focal plane substrate (6); and A heat-conducting copper block (7) is assembled on the detector (103), and a combination of the detector (103) and the heat-conducting copper block (7) is mounted on the focal plane substrate (6).
7. The focal plane efficient temperature control structure with ultra-large temperature gradient according to claim 6, characterized in that: A detector heat conduction path (701) is formed on the heat conduction copper block (7), and a heat conduction heat pipe is installed in the detector heat conduction path (701).