Charging pile circuit board mounting method, device and equipment, medium and program product

Abstract

The invention discloses a charging pile circuit board mounting method, device and equipment, a medium and a program product, and relates to the technical field of circuit board mounting. The method comprises the steps that after a charging pile circuit board is fixed through a needle distribution mechanism of a chip mounter, two material taking mechanisms of the chip mounter are arranged on the two sides of the height central axis of the charging pile circuit board respectively, material taking positions of the two material taking mechanisms are obtained, all electrical elements of the charging pile circuit board are determined, and the charging pile circuit board is obtained; dividing each electrical element according to a preset element division rule to obtain a plurality of element sets, and determining a target set according to the element number corresponding to each element set; and obtaining a first coordinate position of a target element in the target set on the charging pile circuit board, obtaining a first distance and a second distance according to the first coordinate position and the two material taking positions, determining a target material taking mechanism according to a comparison result of the first distance and the second distance, and carrying out surface mounting on the target element according to the target material taking mechanism. Therefore, the chip mounting efficiency of the chip mounter is improved.

Description

Technical Field

[0001] The present application relates to the technical field of circuit board mounting, and in particular to a charging pile circuit board mounting method, device, equipment, medium and program product. Background Art

[0002] With the vigorous development of the electronics manufacturing industry, the efficiency of chip mounters, as key equipment on the production line, plays a decisive role in the output and manufacturing cost of products. However, in practical applications, existing chip mounters generally face a challenge in program optimization: the patch travel is long. This problem stems from the complexity of circuit board design and the variability of component layout, which causes the patch head to need to execute a long moving path during the entire process of taking out electronic components from the feeder and accurately mounting them on the charging pile PCB board. The traditional circuit board patch method mainly focuses on improving the mounting accuracy and stability, while the optimization of the patch travel is relatively neglected, which not only increases the energy consumption and wear of the equipment, but also significantly extends the production cycle, thereby restricting the maximization of the efficiency of the patch machine.

[0003] Therefore, how to improve the efficiency of mounting charging pile circuit boards by mounting machines is a technical problem that needs to be solved urgently. Summary of the invention

[0004] The main purpose of this application is to provide a charging pile circuit board mounting method, device, equipment, medium and program product, aiming to improve the mounting efficiency of the circuit board by the mounting machine.

[0005] To achieve the above-mentioned purpose, the present application provides a charging pile circuit board mounting method, the charging pile circuit board mounting method is applied to a placement machine, and the charging pile circuit board mounting method comprises:

[0006] After the charging pile circuit board is fixed by the needle arrangement mechanism of the placement machine, the first material picking mechanism and the second material picking mechanism of the placement machine are arranged on both sides of the height center axis of the charging pile circuit board, and the first material picking position of the first material picking mechanism and the second material picking position of the second material picking mechanism are obtained;

[0007] Determine all electrical components of the charging pile circuit board, divide each of the electrical components according to a preset component division rule to obtain multiple component sets, and determine a target set according to the number of components corresponding to each of the component sets;

[0008] Obtaining a first coordinate position of a target element in the target set on the charging pile circuit board, and determining a first distance from the first coordinate position to the first material picking position, and a second distance from the first coordinate position to the second material picking position, wherein the target element is any one of the electrical elements in the target set;

[0009] Determine the target component picking mechanism according to the comparison result of the first distance and the second distance, and mount the target component according to the target component picking mechanism.

[0010] In one embodiment, the step of determining the target set according to the number of components corresponding to each component set includes:

[0011] Determine the number of components corresponding to each component set, and sort each component set in descending order according to the number of components to obtain a set sorting sequence;

[0012] Take the component set with the largest number of components in the set sorting sequence as the target set.

[0013] In one embodiment, the step of obtaining the first coordinate position of the target component on the charging pile circuit board includes:

[0014] Taking the height central axis of the charging pile circuit board as the vertical axis coordinate axis, taking the width central axis of the charging pile circuit board as the horizontal axis coordinate axis, and taking the node where the vertical axis coordinate axis and the horizontal axis coordinate axis intersect perpendicularly as the coordinate origin, construct the plane coordinate system of the charging pile circuit board;

[0015] Determine the perpendicular straight-line distance from the target component to the horizontal axis coordinate axis according to the plane coordinate system, and determine the perpendicular straight-line distance from the target component to the vertical axis coordinate axis according to the plane coordinate system;

[0016] Construct the first coordinate position of the target component according to the perpendicular straight-line distance and the perpendicular straight-line distance.

[0017] In one embodiment, the step of determining the target component picking mechanism according to the comparison result of the first distance and the second distance includes:

[0018] Compare the first distance with the second distance to obtain a comparison result;

[0019] If the comparison result is that the first distance is greater than the second distance, determine the target component picking mechanism as the second component picking mechanism;

[0020] If the comparison result is that the first distance is less than the second distance, determine the target component picking mechanism as the first component picking mechanism.

[0021] In one embodiment, the step of mounting the target component according to the target component picking mechanism includes:

[0022] Determine the component suction nozzle paired with the target component, and assemble the component suction nozzle on the target component picking mechanism to obtain the assembled target component picking mechanism;

[0023] After placing the component bin containing multiple target components below the assembled target component picking mechanism, the target components are picked from the component bin by the assembled target component picking mechanism, and the target components are moved to the mounting positions on the charging pile circuit board for mounting.

[0024] In one embodiment, after the step of mounting the target components according to the target component picking mechanism, the charging pile circuit board mounting method further includes:

[0025] Taking any one of the electrical components in the target set other than the target component as the next target component, and returning to execute the step of obtaining the first coordinate position of the target component in the target set on the charging pile circuit board;

[0026] Until each electrical component in the target set is mounted by the target component picking mechanism, taking the next component set of the target set as the next target set, and returning to execute the step of obtaining the first coordinate position of the target component in the target set on the charging pile circuit board.

[0027] In one embodiment, the charging pile circuit board mounting device includes:

[0028] An acquisition module, configured to fix the charging pile circuit board through the needle placement mechanism of the mounter, and respectively arrange the first component picking mechanism and the second component picking mechanism of the mounter on both sides of the height central axis of the charging pile circuit board, and acquire the first component picking position of the first component picking mechanism and the second component picking position of the second component picking mechanism;

[0029] A division module, configured to determine the electrical components of the charging pile circuit board, divide each of the electrical components according to a preset component division rule to obtain a plurality of component sets, and determine a target set according to the number of components corresponding to each component set;

[0030] A distance determination module, configured to acquire the first coordinate position of the target component in the target set on the charging pile circuit board, and determine a first distance from the first coordinate position to the first component picking position and a second distance from the first coordinate position to the second component picking position, where the target component is any one of the electrical components in the target set;

[0031] A mounting module, configured to determine a target component picking mechanism according to a comparison result between the first distance and the second distance, and mount the target component according to the target component picking mechanism.

[0032] In addition, to achieve the above object, the present application further provides a charging pile circuit board mounting device, and the charging pile circuit board mounting device of the present application includes:

[0033] An acquisition module, configured to fix a charging pile circuit board through the needle placement mechanism of the mounter, then arrange the first component picking mechanism and the second component picking mechanism of the mounter on both sides of the height central axis of the charging pile circuit board, and acquire the first component picking position of the first component picking mechanism and the second component picking position of the second component picking mechanism;

[0034] A partitioning module, configured to determine the electrical components of the charging pile circuit board, partition each of the electrical components according to a preset component partitioning rule to obtain a plurality of component sets, and determine a target set according to the number of components corresponding to each of the component sets;

[0035] A distance determination module, configured to acquire the first coordinate position of a target component in the target set on the charging pile circuit board, and determine a first distance from the first coordinate position to the first component picking position and a second distance from the first coordinate position to the second component picking position, where the target component is any one of the electrical components in the target set;

[0036] A mounting module, configured to determine a target component picking mechanism according to a comparison result between the first distance and the second distance, and mount the target component according to the target component picking mechanism.

[0037] Each functional module of the charging pile circuit board mounting device of the present application implements the steps of the charging pile circuit board mounting method of the present application as described above when running.

[0038] In addition, to achieve the above object, the present application further provides a charging pile circuit board mounting device, where the charging pile circuit board mounting device includes a memory, a processor, and a charging pile circuit board mounting program stored on the memory and executable on the processor, and the charging pile circuit board mounting program implements the steps of the above charging pile circuit board mounting method when executed by the processor.

[0039] In addition, to achieve the above object, the present application further provides a medium, where the medium is a computer-readable storage medium, and a charging pile circuit board mounting program is stored on the computer-readable storage medium, and the charging pile circuit board mounting program implements the steps of the above charging pile circuit board mounting method when executed by a processor.

[0040] In addition, to achieve the above object, the present application further provides a computer program product, where the computer program product includes a computer program, and the computer program implements the steps of the above charging pile circuit board mounting method when executed by a processor.

[0041] The present application provides a method for mounting a charging pile circuit board, which optimizes the existing chip mounting method. Specifically, in the present application, the charging pile circuit board is fixed by the needle layout mechanism of the mounter to ensure stability during the mounting process; next, the first component picking mechanism and the second component picking mechanism of the mounter are respectively arranged on both sides of the height central axis of the charging pile circuit board, which can not only significantly reduce the moving distance of the two component picking mechanisms during the mounting process, but also realize the parallel operation of the double stations; then, determine the first component picking position of the first component picking mechanism and the second component picking position of the second component picking mechanism, and after clarifying all the electrical components of the charging pile circuit board, divide each electrical component according to the preset component division rules, and then determine the target set according to the number of components corresponding to each component set obtained by the division, that is, the obtained target set ensures the efficient and orderly management of component materials during the mounting process; next, after determining the first coordinate position of the target component in the target set on the charging pile circuit board, the first distance from the first coordinate position to the first component picking position and the second distance from the first coordinate position to the second component picking position can be accurately obtained; then, according to the comparison result of the first distance and the second distance, the target component picking mechanism with the highest mounting efficiency can be accurately obtained, and then mount the target component according to the target component picking mechanism, effectively shortening the mounting stroke and mounting time of the mounter, and significantly improving the chip mounting efficiency of the mounter for mounting the charging pile circuit board. Brief Description of the Drawings

[0042] Figure 1 is a schematic flowchart of the first embodiment of the method for mounting a charging pile circuit board according to the present application;

[0043] Figure 2 is a schematic flowchart of the second embodiment of the method for mounting a charging pile circuit board according to the present application;

[0044] Figure 3 is a schematic flowchart of the mounter involved in the embodiment solution of the present application;

[0045] Figure 4 is a schematic structural diagram of the charging pile circuit board mounting device involved in the embodiment solution of the present application;

[0046] Figure 5 is a schematic structural diagram of the charging pile circuit board mounting equipment involved in the embodiment solution of the present application.

[0047] The realization, functional features and advantages of the purpose of the present application will be further described with reference to the embodiments and the accompanying drawings. Detailed Embodiments

[0048] The embodiment of the present application provides a method for mounting a charging pile circuit board, referring to Figure 1 as shown. Figure 1It is a schematic flow chart of the first embodiment of the method for mounting a charging pile circuit board in this application.

[0049] Here, exemplary embodiments will be described in detail, and examples thereof are shown in the drawings. When the following description refers to the drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this application.

[0050] With the rapid development of modern electronic manufacturing, the mounter, as a key device on the production line, its performance and efficiency directly determine the production capacity and product quality of the entire production line. However, at present, there are problems in the program optimization during the production process of the mounter, such as the pick-up stroke and the placement stroke being relatively far apart, and the placement efficiency not being maximized; in terms of nozzle switching, there is a problem that the nozzle type cannot be reasonably selected, and the high frequency of nozzle switching affects the placement efficiency; when optimizing the station, the material types cannot be intelligently distinguished, and there will be a situation of loading the wrong material when loading materials; when switching products, the top pins cannot be automatically arranged, which affects the line change time.

[0051] To solve the technical defect that the mounter has poor placement efficiency for mounting circuit boards, this application provides a method, device, equipment, medium and program product for mounting a charging pile circuit board.

[0052] The method for mounting a charging pile circuit board in this application is applied to a mounter or a charging pile circuit board mounting device for mounting a circuit board. The execution subject of this application will not be elaborated in the following embodiments.

[0053] The method for mounting a charging pile circuit board in this application includes the following implementation steps S10 to step S40:

[0054] Step S10: After fixing the charging pile circuit board through the needle layout mechanism of the mounter, respectively arrange the first pick-up mechanism and the second pick-up mechanism of the mounter on both sides of the height central axis of the charging pile circuit board, and obtain the first pick-up position of the first pick-up mechanism and the second pick-up position of the second pick-up mechanism.

[0055] In this embodiment, the charging pile circuit board is firmly fixed by the component placement mechanism of the mounter, so as to ensure the stability during the placement process. Then, the first component picking mechanism and the second component picking mechanism of the mounter are symmetrically arranged on both sides of the height central axis of the charging pile circuit board in a mirror image manner, so that the first component picking mechanism and the second component picking mechanism can work simultaneously to achieve parallel processing, thereby shortening the overall placement cycle of the mounter for placing the circuit board. In addition, the two component picking mechanisms symmetrically arranged on both sides of the height central axis in this application effectively reduce the moving distance during the placement process, further improving the component placement efficiency of the mounter for placing the circuit board. In addition, the mounter set in this application can obtain the first component picking position of the first component picking mechanism and the second component picking position of the second component picking mechanism in real time, thus providing accurate position information for the subsequent placement process.

[0056] Step S20: Determine all the electrical components of the charging pile circuit board, divide each of the electrical components according to a preset component division rule to obtain a plurality of component sets, and determine a target set based on the number of components corresponding to each component set.

[0057] In this embodiment, after determining all the electrical components of the charging pile circuit board, using a preset component division rule to orderly divide these electrical components can greatly improve the organization and efficiency of the placement process. Exemplarily, after determining all the electrical components of the charging pile circuit board, determine the component model of each electrical component, and then divide the electrical components with the same component model into one category according to the preset component division rule, so as to accurately obtain a plurality of component sets. Then, based on the number of components corresponding to each component set, the target set can be accurately obtained, ensuring that the subsequent placement process can proceed efficiently and orderly.

[0058] It should be noted that the preset component division rule can be understood as a rule for dividing electrical components with the same component model into one category.

[0059] Step S30: Obtain the first coordinate position of the target component in the target set on the charging pile circuit board, and determine the first distance from the first coordinate position to the first component picking position and the second distance from the first coordinate position to the second component picking position, where the target component is any one of the electrical components in the target set;

[0060] In this embodiment, after determining the first coordinate position of the target component in the target set on the charging pile circuit board, the first distance from the first coordinate position to the first component picking position and the second distance from the first coordinate position to the second component picking position can be accurately obtained.

[0061] It should be noted that the target component is any one of the electrical components in the target set.

[0062] Step S40: Determine the target component picking mechanism based on the comparison result of the first distance and the second distance, and mount the target component according to the target component picking mechanism.

[0063] In this embodiment, the first distance and the second distance are compared to obtain a comparison result. If the comparison result is that the first distance is greater than the second distance, the target component picking mechanism is determined to be the first component picking mechanism. If the comparison result is that the first distance is less than the second distance, the target component picking mechanism is determined to be the second component picking mechanism. That is, in this application, by accurately comparing the first distance and the second distance, the target component picking mechanism can be determined quickly and accurately. When the comparison result is that the first distance is greater than the second distance, the mounter can intelligently identify that the first component picking mechanism is a more suitable choice, which helps to improve the efficiency and accuracy of material picking and placing. On the contrary, if the comparison result is that the first distance is less than the second distance, the mounter can automatically select the second component picking mechanism. This flexible determination mechanism ensures that the picking process can be optimized according to the actual distance conditions, thus effectively avoiding unnecessary resource waste and operation time, and significantly improving the component mounting efficiency of the mounter for the charging pile circuit board.

[0064] In summary, this application provides a method for mounting a charging pile circuit board, which optimizes the existing component mounting method. Specifically, in this application, the charging pile circuit board is fixed by the needle layout mechanism of the mounter to ensure the stability during the mounting process. Next, the first component picking mechanism and the second component picking mechanism of the mounter are respectively arranged on both sides of the height central axis of the charging pile circuit board, which can not only significantly reduce the moving distance of the two component picking mechanisms during the mounting process, but also realize the parallel operation of the two stations. Then, determine the first component picking position of the first component picking mechanism and the second component picking position of the second component picking mechanism. After clarifying all the electrical components of the charging pile circuit board, divide each electrical component according to the preset component division rules, and then determine the target set according to the number of components corresponding to each obtained component set. That is, through the obtained target set, the efficient and orderly management of component materials during the mounting process is ensured. Next, after determining the first coordinate position of the target component in the target set on the charging pile circuit board, the first distance from the first coordinate position to the first component picking position and the second distance from the first coordinate position to the second component picking position can be accurately obtained. Then, based on the comparison result of the first distance and the second distance, the target component picking mechanism with the highest mounting efficiency can be accurately obtained, and then the target component is mounted according to the target component picking mechanism, effectively shortening the mounting stroke and mounting time of the mounter, and significantly improving the component mounting efficiency of the mounter for the charging pile circuit board.

[0065] Further, based on the first embodiment of the method for mounting a charging pile circuit board of this application, a second embodiment of the method for mounting a charging pile circuit board of this application is proposed. Refer to Figure 2 ,Figure 2 It is a schematic flow chart of the second embodiment of the method for mounting a charging pile circuit board in this application.

[0066] Further, in some feasible embodiments, the above step S20: determining the target set according to the number of components corresponding to each component set may further include the following implementation steps S201 to S202:

[0067] Step S201: Determine the number of components corresponding to each component set, and sort each component set in descending order according to the number of components to obtain a set sorting sequence;

[0068] Step S202: Use the component set with the largest number of components in the set sorting sequence as the target set.

[0069] In this embodiment, the number of electrical components in each component set is determined, and sorting is performed from more to less according to this number of components to form a set sorting sequence, providing a clear basis for subsequent priority processing. Next, the component set with the largest number of components in the set sorting sequence is used as the target set, so that the target set can be preferentially mounted subsequently, thereby significantly improving the chip mounting efficiency of the chip mounter for mounting the circuit board.

[0070] Further, in some other feasible embodiments, the above step S30: obtaining the first coordinate position of the target component on the charging pile circuit board may further include the following implementation steps S301 to S303:

[0071] Step S301: Take the height central axis of the charging pile circuit board as the vertical axis coordinate axis, take the width central axis of the charging pile circuit board as the horizontal axis coordinate axis, and take the node where the vertical axis coordinate axis intersects the horizontal axis coordinate axis perpendicularly as the coordinate origin to construct a plane coordinate system of the charging pile circuit board.

[0072] In this embodiment, taking the height central axis of the charging pile circuit board as the vertical axis coordinate axis, taking the width central axis of the charging pile circuit board as the horizontal axis coordinate axis, and there is a coordinate origin at the node where the vertical axis coordinate axis intersects the horizontal axis coordinate axis perpendicularly, so that an accurate plane coordinate system can be constructed to provide accurate coordinate parameters for subsequent coordinate positioning.

[0073] Step S302: Determine the perpendicular straight-line distance from the target component to the horizontal axis coordinate axis according to the plane coordinate system, and determine the perpendicular straight-line distance from the target component to the vertical axis coordinate axis according to the plane coordinate system.

[0074] In this embodiment, the perpendicular straight-line distance from the target component to the horizontal axis coordinate axis and the perpendicular straight-line distance from the target component to the vertical axis coordinate axis are determined according to the plane coordinate system. The perpendicular straight-line distance and the perpendicular straight-line distance can directly reflect the relative position of the target component on the charging pile circuit board and are key data for constructing an accurate coordinate position.

[0075] Step S303: Construct the first coordinate position of the target component according to the perpendicular straight-line distance and the perpendicular straight-line distance.

[0076] In this embodiment, by performing construction processing on the perpendicular straight-line distance and the perpendicular straight-line distance according to the coordinate construction rules of the plane coordinate system, the first coordinate position of the target component can be accurately constructed.

[0077] Further, in some feasible embodiments, the above step S40: Determine the target picking mechanism according to the comparison result of the first distance and the second distance may further include the following implementation steps S401 to S403:

[0078] Step S401: Compare the first distance with the second distance to obtain a comparison result.

[0079] In this embodiment, the present application compares the first distance from the target component to the first picking mechanism with the second distance from the target component to the second picking mechanism to obtain a clear comparison result, thereby providing data support for the subsequent selection of the picking mechanism.

[0080] Step S402: If the comparison result is that the first distance is greater than the second distance, determine that the target picking mechanism is the second picking mechanism.

[0081] In this embodiment, if the comparison result is that the first distance is greater than the second distance, then determine that the second picking mechanism is the target picking mechanism because a shorter moving distance means higher efficiency and lower energy consumption.

[0082] Step S403: If the comparison result is that the first distance is less than the second distance, determine that the target picking mechanism is the second picking mechanism.

[0083] In this embodiment, to improve the chip mounting efficiency of the chip mounter for mounting the circuit board and reduce the chip mounting energy consumption of the chip mounter, if the comparison result is that the first distance is less than the second distance, then determine that the first picking mechanism is the target picking mechanism.

[0084] In summary, through the comparison result of the first distance and the second distance, the present application can intelligently select the pick-up mechanism with a shorter distance as the target pick-up mechanism, thereby significantly reducing the moving distance during the mounting process, improving the production efficiency, and reducing the production cost. This intelligent selection method not only improves the accuracy of mounting the charging pile circuit board, but also ensures the stability and reliability of the mounting process.

[0085] Further, in some feasible embodiments, the above step S40: mounting the target component according to the target pick-up mechanism may further include the following implementation steps A10 to step A20:

[0086] Step A10: Determine the component nozzle paired with the target component, and assemble the component nozzle on the target pick-up mechanism to obtain the assembled target pick-up mechanism.

[0087] In this embodiment, first, the component nozzle paired with the target component is determined to ensure that the paired component nozzle can accurately and firmly grasp the target component, preventing it from falling off or shifting in position during the movement and mounting processes. Then, the component nozzle is assembled on the target pick-up mechanism to form the assembled target pick-up mechanism, thus preparing for subsequent grasping and mounting operations.

[0088] Step A20: After placing the component bin containing a plurality of the target components below the assembled target pick-up mechanism, the assembled target pick-up mechanism grabs the target component from the component bin and moves the target component to the mounting position of the charging pile circuit board for mounting.

[0089] In this embodiment, first, the component bin containing a plurality of target components is placed below the assembled target pick-up mechanism, further shortening the pick-up stroke from the assembled target pick-up mechanism to the component bin. Then, according to the position distance from the target pick-up position (i.e., the first pick-up position or the second pick-up position) corresponding to the assembled target pick-up mechanism to the bin position of the component bin, the pick-up trajectory of the assembled target pick-up mechanism can be accurately obtained. Then, the target component can be accurately grabbed from the component bin according to this pick-up trajectory. Finally, the assembled target pick-up mechanism moves the grabbed target component to the mounting position of the charging pile circuit board and performs precise mounting.

[0090] It should be noted that this mounting position refers to the coordinate position of the target component on the charging pile circuit board.

[0091] In summary, the charging pile circuit board mounting method provided in the present application can ensure the precise grasping and efficient mounting of the target component, improving the automation level and production efficiency of the entire mounting process. At the same time, this optimization method also reduces the error rate of manual operation, improving the product quality and stability.

[0092] Further, in some feasible embodiments, after the above step S40: mounting the target component according to the target component picking mechanism, the charging pile circuit board mounting method may further include the following implementation steps B10 to step B20:

[0093] Step B10: Use any one of the electrical components in the target set other than the target component as the next target component, and return to execute the step of obtaining the first coordinate position of the target component in the target set on the charging pile circuit board.

[0094] In this embodiment, for the sake of the chip mounting efficiency and continuity of the circuit board by the mounter, the present application sets two loop steps B10 and B20 to ensure that all electrical components can be correctly mounted on the charging pile circuit board. Specifically, in step B10, when the target component picking mechanism completes the mounting of the current target component, the mounter will use any one of the electrical components in the target set other than the already mounted target component as the next target component. Then, the step of obtaining the first coordinate position of this target component on the charging pile circuit board is executed again to ensure that the next component can also be accurately positioned and mounted. In addition, this loop process will continue until all the electrical components in the target set are mounted.

[0095] Step B20: Until each electrical component in the target set is mounted by the target component picking mechanism, use the next component set of the target set as the next target set, and return to execute the step of obtaining the first coordinate position of the target component in the target set on the charging pile circuit board.

[0096] In this embodiment, when all the electrical components in the target set are mounted, step B20 will be triggered. In step B20, the system will use the next component set to be processed as the new target set and execute the step of obtaining the first coordinate position of the target component in the target set on the charging pile circuit board again. This process will continue until all the component sets are processed, that is, the mounting work of the entire circuit board is completed.

[0097] In addition, referring to Figure 3 , Figure 3It is a schematic diagram of the process of a chip mounter involved in the embodiment solution of the present application. The method for mounting a charging pile circuit board set in the present application realizes the intelligent optimization of the chip mounting stroke and the pick-up position to achieve the effect of block chip mounting, reducing the impact on efficiency due to the stroke of the pick-up mechanism; realizes the reasonable selection of an adapter nozzle for components according to their sizes, reducing the nozzle switching frequency; realizes the intelligent allocation and optimization of the component stations of the chip mounter, cross-arranging component types such as resistors, capacitors, and diodes, and achieving the function of preventing the machine from starting production when the wrong components are loaded, avoiding loading the wrong components; realizes that when the chip mounter switches products, the software obtains the position of the top pins on the circuit board layout, and the working head automatically sucks the required top pins for the layout, replacing manual top pin layout by personnel and improving the line change efficiency.

[0098] In addition, the present application also provides a device for mounting a charging pile circuit board. Please refer to Figure 4 , Figure 4 It is a schematic diagram of the structure of the device for mounting a charging pile circuit board involved in the embodiment solution of the present application.

[0099] The device for mounting a charging pile circuit board of the present application includes:

[0100] An acquisition module H01, configured to fix the charging pile circuit board through the pin layout mechanism of the chip mounter, then arrange the first pick-up mechanism and the second pick-up mechanism of the chip mounter on both sides of the height central axis of the charging pile circuit board respectively, and acquire the first pick-up position of the first pick-up mechanism and the second pick-up position of the second pick-up mechanism;

[0101] A partitioning module H02, configured to determine the electrical components of the charging pile circuit board, partition each of the electrical components according to a preset component partitioning rule to obtain a plurality of component sets, and determine a target set according to the number of components corresponding to each of the component sets;

[0102] A distance determination module H03, configured to acquire the first coordinate position of a target component in the target set on the charging pile circuit board, and determine a first distance from the first coordinate position to the first pick-up position and a second distance from the first coordinate position to the second pick-up position, where the target component is any one of the electrical components in the target set;

[0103] A mounting module H04, configured to determine a target pick-up mechanism according to a comparison result between the first distance and the second distance, and mount the target component according to the target pick-up mechanism.

[0104] Optionally, the partitioning module H02 may further include:

[0105] A sorting unit, configured to determine the number of components corresponding to each of the component sets, and sort each of the component sets in descending order according to the number of components to obtain a set sorting sequence;

[0106] A set determination unit for taking the set of components with the largest number of components in the set sorting sequence as the target set.

[0107] Optionally, the distance determination module H03 may further include:

[0108] A first construction unit for taking the height central axis of the charging pile circuit board as the longitudinal axis coordinate axis, the width central axis of the charging pile circuit board as the transverse axis coordinate axis, and the node where the longitudinal axis coordinate axis and the transverse axis coordinate axis intersect perpendicularly as the coordinate origin to construct a plane coordinate system of the charging pile circuit board;

[0109] A distance determination unit for determining the perpendicular straight-line distance from the target component to the transverse axis coordinate axis according to the plane coordinate system, and determining the perpendicular straight-line distance from the target component to the longitudinal axis coordinate axis according to the plane coordinate system;

[0110] A second construction unit for constructing the first coordinate position of the target component according to the perpendicular straight-line distance and the perpendicular straight-line distance.

[0111] Optionally, the mounting module H04 may further include:

[0112] A comparison unit for comparing the first distance with the second distance to obtain a comparison result;

[0113] A first comparison output unit for determining that the target pick-up mechanism is the second pick-up mechanism if the comparison result is that the first distance is greater than the second distance;

[0114] A second comparison output unit for determining that the target pick-up mechanism is the first pick-up mechanism if the comparison result is that the first distance is less than the second distance.

[0115] Optionally, the mounting module H04 may further include:

[0116] An assembly unit for determining the component nozzle paired with the target component, assembling the component nozzle on the target pick-up mechanism to obtain the assembled target pick-up mechanism;

[0117] A mounting unit for, after placing the component bin containing a plurality of the target components below the assembled target pick-up mechanism, grasping the target component from the component bin through the assembled target pick-up mechanism and moving the target component to the mounting position of the charging pile circuit board for mounting.

[0118] Optionally, the mounting module H04 may further include:

[0119] The first loop unit is configured to use any one of the electrical components in the target set except the target component as the next target component, and return to execute the step of obtaining the first coordinate position of the target component in the target set on the charging pile circuit board;

[0120] The second loop unit is configured to, until each electrical component in the target set is mounted by the target pick-and-place mechanism, use the next component set of the target set as the next target set, and return to execute the step of obtaining the first coordinate position of the target component in the target set on the charging pile circuit board.

[0121] Each functional module of the charging pile circuit board mounting device of the present application implements the steps of the charging pile circuit board mounting method of the present application as described above during operation.

[0122] In addition, the present application also provides a charging pile circuit board mounting device. Please refer to Figure 5 , Figure 5 which is a schematic structural diagram of the charging pile circuit board mounting device involved in the solution of the embodiment of the present application. The charging pile circuit board mounting device in the embodiment of the present application may specifically be a device for locally running the charging pile circuit board mounting method.

[0123] As Figure 5 shown, the charging pile circuit board mounting device in the embodiment of the present application may include: a processor 1001, such as a CPU, a communication bus 1002, a user interface 1003, a network interface 1004, and a memory 1005. Among them, the communication bus 1002 is used to implement connection communication between these components. The user interface 1003 may include a display screen (Display), an input unit such as a keyboard (Keyboard), and optionally the user interface 1003 may further include a standard wired interface and a wireless interface. The network interface 1004 may optionally include a standard wired interface and a wireless interface (such as a Wi-Fi interface).

[0124] The memory 1005 is disposed on the main body of the charging pile circuit board mounting device. A program is stored on the memory 1005, and when the program is executed by the processor 1001, corresponding operations are implemented. The memory 1005 is also used to store parameters for use by the charging pile circuit board mounting device. The memory 1005 may be a high-speed RAM memory or a stable memory (non-volatile memory), such as a disk memory. Optionally, the memory 1005 may also be a storage device independent of the aforementioned processor 1001.

[0125] Those skilled in the art can understand, Figure 5The structure of the charging pile circuit board mounting device shown does not limit the charging pile circuit board mounting device, and may include more or fewer components than shown, or combine certain components, or have different component arrangements.

[0126] As Figure 5 shown, in the memory 1005 as a storage medium, there may be included an operating system, a network communication module, a user interface module, and a charging pile circuit board mounting program for the charging pile circuit board mounting device.

[0127] In Figure 5 the charging pile circuit board mounting device shown, the processor 1001 may be used to call the charging pile circuit board mounting program stored in the memory 1005 and execute the steps of any of the above charging pile circuit board mounting methods.

[0128] In addition, the present application provides a storage medium, which is a computer-readable storage medium. A charging pile circuit board mounting program is stored on the computer-readable storage medium, and when the charging pile circuit board mounting program is executed by a processor, the steps of the above charging pile circuit board mounting method are implemented.

[0129] It should be noted that in this article, the term "including", "comprising", or any other variant thereof is intended to cover non-exclusive inclusion, such that a process, method, article, or system including a series of elements not only includes those elements but also includes other elements not explicitly listed, or further includes elements inherent to such process, method, article, or system. Without more limitations, an element defined by the statement "including a..." does not exclude the existence of additional identical elements in the process, method, article, or system including that element.

[0130] The serial numbers of the above embodiments of the present application are only for description and do not represent the superiority or inferiority of the embodiments.

[0131] Through the description of the above embodiments, those skilled in the art can clearly understand that the above embodiment methods can be implemented by means of software plus a necessary general hardware platform. Of course, they can also be implemented by hardware, but in many cases the former is a better implementation method. Based on such an understanding, the technical solution of the present application, in essence, or the part that contributes to the prior art, can be embodied in the form of a software product. The computer software product is stored in a computer-readable storage medium as described above (such as ROM / RAM, magnetic disk, optical disc), and includes several instructions for causing a charging pile circuit board mounting device (which may be a mobile phone, a computer, a server, or a network device, etc.) to execute the methods described in various embodiments of the present application.

[0132] The above are only the preferred embodiments of the present application, and do not limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made by using the content of the specification and drawings of the present application, or directly or indirectly applied in other related technical fields, shall be similarly included in the patent protection scope of the present application.

Claims

1. A charging pile circuit board mounting method, characterized in that: The charging pile circuit board mounting method is applied to a chip mounter, and the charging pile circuit board mounting method comprises: After the charging pile circuit board is fixed by the needle arrangement mechanism of the placement machine, the first material picking mechanism and the second material picking mechanism of the placement machine are arranged on both sides of the height center axis of the charging pile circuit board, and the first material picking position of the first material picking mechanism and the second material picking position of the second material picking mechanism are obtained; Determine all electrical components of the charging pile circuit board, divide each of the electrical components according to a preset component division rule to obtain multiple component sets, and determine a target set according to the number of components corresponding to each of the component sets; Obtaining a first coordinate position of a target element in the target set on the charging pile circuit board, and determining a first distance from the first coordinate position to the first material picking position, and a second distance from the first coordinate position to the second material picking position, wherein the target element is any one of the electrical elements in the target set; A target material picking mechanism is determined according to a comparison result between the first distance and the second distance, and the target component is mounted according to the target material picking mechanism.

2. The charging pile circuit board mounting method according to claim 1, characterized in that: The step of determining the target set according to the number of components corresponding to each of the component sets comprises: Determine the number of components corresponding to each component set, and sort each component set in order from large to small in terms of the number of components to obtain a set sorting sequence; The component set with the largest number of components in the set sorting sequence is taken as the target set.

3. The charging pile circuit board mounting method according to claim 1, characterized in that: The step of obtaining the first coordinate position of the target element on the charging pile circuit board includes: The height center axis of the charging pile circuit board is used as the longitudinal coordinate axis, the width center axis of the charging pile circuit board is used as the transverse coordinate axis, and the node where the longitudinal coordinate axis and the transverse coordinate axis intersect vertically is used as the coordinate origin to construct the plane coordinate system of the charging pile circuit board; Determine the vertical straight-line distance from the target element to the horizontal coordinate axis according to the plane coordinate system, and determine the vertical straight-line distance from the target element to the vertical coordinate axis according to the plane coordinate system; The first coordinate position of the target element is constructed according to the vertical straight line distance and the vertical straight line spacing.

4. The charging pile circuit board mounting method according to claim 1, characterized in that: The step of determining the target material taking mechanism according to the comparison result of the first distance and the second distance comprises: Comparing the first distance with the second distance to obtain a comparison result; If the comparison result is that the first distance is greater than the second distance, determining that the target material taking mechanism is the second material taking mechanism; If the comparison result is that the first distance is smaller than the second distance, the target material picking mechanism is determined to be the first material picking mechanism.

5. The charging pile circuit board mounting method according to claim 1, characterized in that: The step of mounting the target component according to the target material picking mechanism includes: Determine a component suction nozzle that is paired with the target component, and assemble the component suction nozzle on the target material picking mechanism to obtain an assembled target material picking mechanism; After placing a component material box containing a plurality of the target components under the assembled target material picking mechanism, the target components are grabbed from the component material box by the assembled target material picking mechanism, and the target components are moved to the mounting position of the charging pile circuit board for mounting.

6. The charging pile circuit board mounting method according to claim 1, characterized in that: After the step of mounting the target component according to the target material picking mechanism, the charging pile circuit board mounting method further includes: Taking any one of the electrical components in the target set except the target component as the next target component, and returning to execute the step of obtaining the first coordinate position of the target component in the target set on the charging pile circuit board; After the target picking mechanism mounts each of the electrical components in the target set, the next component set of the target set is taken as the next target set, and the step of obtaining the first coordinate position of the target component in the target set on the charging pile circuit board is returned to be executed.

7. A charging pile circuit board mounting device, characterized in that: The charging pile circuit board mounting device comprises: An acquisition module is used to arrange the first material picking mechanism and the second material picking mechanism of the chip mounter on both sides of the height center axis of the charging pile circuit board after the charging pile circuit board is fixed by the needle arrangement mechanism of the chip mounter, and to obtain the first material picking position of the first material picking mechanism and the second material picking position of the second material picking mechanism; A division module, used to determine the electrical components of the charging pile circuit board, divide each of the electrical components according to a preset component division rule to obtain a plurality of component sets, and determine a target set according to the number of components corresponding to each of the component sets; A distance determination module, used for obtaining a first coordinate position of a target element in the target set on the charging pile circuit board, and determining a first distance from the first coordinate position to the first material picking position, and a second distance from the first coordinate position to the second material picking position, wherein the target element is any one of the electrical elements in the target set; The mounting module is used to determine a target material picking mechanism according to a comparison result between the first distance and the second distance, and to mount the target component according to the target material picking mechanism.

8. A charging pile circuit board mounting device, characterized in that: The charging pile circuit board mounting device includes a memory, a processor, and a charging pile circuit board mounting program stored in the memory and executable on the processor. When the processor executes the charging pile circuit board mounting program, the steps of the charging pile circuit board mounting method as described in any one of claims 1 to 6 are implemented.

9. A medium, the medium being a computer-readable storage medium, characterized in that: The computer-readable storage medium stores a charging pile circuit board mounting program, and when the charging pile circuit board mounting program is executed by the processor, the steps of the charging pile circuit board mounting method as described in any one of claims 1 to 6 are implemented.

10. A computer program product, characterized in that The computer program product includes a computer program, and when the computer program is executed by a processor, the steps of the charging pile circuit board mounting method as described in any one of claims 1 to 6 are implemented.

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