Display screen, electronic equipment and manufacturing method of display screen

Abstract

The invention provides a display screen, electronic equipment and a manufacturing method of the display screen, relates to the technical field of display, and is used for solving the problem that water vapor easily enters a display module through an opening of the display module. The display screen comprises a display module and an isolation layer. The display module is provided with an open hole, and the open hole penetrates through the display module in the thickness direction of the display module. The isolation layer is integrally formed, and at least one part of the isolation layer is located in the hole and covers the inner wall of the hole. The display screen is used for displaying pictures.

Description

Technical Field

[0001] This application relates to the field of display technologies, and particularly to a display screen, an electronic device, and a method for manufacturing a display screen. Background Art

[0002] A display screen is an important component of an electronic device and can be used for displaying images. A display screen generally includes a display module. Among them, an organic light-emitting diode (OLED) display module can emit light by itself and has the advantage of being relatively thin, and is gradually applied to various types of electronic devices.

[0003] Currently, most electronic devices generally include a camera. To facilitate the entry of light into the camera, an opening needs to be formed in the display module to avoid the camera. However, cracks are likely to form at the above-mentioned opening, and water vapor can easily enter the interior of the OLED display module through the cracks of the opening, affecting the internal components of the OLED display module, and finally forming black spots on the display screen. Summary of the Invention

[0004] This application provides a display screen, an electronic device, and a method for manufacturing a display screen, which are used to solve the problem that water vapor easily enters the interior of the display module through the opening of the display module.

[0005] To achieve the above object, this application adopts the following technical solutions:

[0006] In a first aspect, this application provides a display screen, including a display module and an isolation layer. An opening is formed in the display module, and the opening penetrates the display module along the thickness direction of the display module. The isolation layer is integrally formed, and at least a part of it is located in the opening and covers the inner wall of the opening.

[0007] For the display screen provided in this application, since the inner wall of the opening is covered with the isolation layer, the isolation layer can cover and isolate the cracks that may form at the inner wall of the opening. Thus, the water vapor is blocked by the isolation layer and cannot enter the interior of the display module from the cracks, thereby avoiding the oxidation of the light-emitting components inside the display module and forming black spots. At the same time, since the isolation layer is integrally formed and there are no gaps in the isolation layer itself, it is ensured that water vapor will not enter through the isolation layer, and the isolation effect of the isolation layer is better.

[0008] In a possible implementation manner of the first aspect, the isolation layer may include at least one of UV glue, polyurethane glue, silicone glue, carbon silicon thin film material, and carbon fluorine thin film material. Based on the above different materials to manufacture the isolation layer, the isolation layer can have a better isolation effect.

[0009] In a possible implementation of the first aspect, the isolation layer can be entirely located within the opening and cover the inner wall of the opening. In this way, the non-display surface of the display module can remain flat, and at the same time, the material consumption of the isolation layer can be saved.

[0010] In a possible implementation of the first aspect, along the thickness direction of the display module, the display module has a display surface and a non-display surface that are oppositely arranged. A part of the isolation layer can be located within the opening and cover the inner wall of the opening. Another part of the isolation layer can be located on the non-display surface of the display module. The isolation layer can completely cover the inner wall of the opening near the non-display surface side. Thus, the places on the inner wall of the opening where cracks are likely to occur can be covered by the isolation layer, thereby preventing water vapor from entering the interior of the display module through the cracks and ensuring the effect of isolating water vapor.

[0011] In a possible implementation of the first aspect, along the thickness direction of the display module, the thickness of the part of the isolation layer on the non-display surface can be less than or equal to 0.3 mm. At this time, the thickness of the isolation layer is relatively thin, which can keep the overall non-display surface in a relatively flat state.

[0012] In a possible implementation of the first aspect, the single-sided thickness of the part of the isolation layer within the opening can be less than or equal to 0.5 mm. When the single-sided thickness of the part of the isolation layer within the opening is less than or equal to 0.5 mm, it can be ensured that the size of the opening will not increase significantly due to the setting of the isolation layer.

[0013] In a possible implementation of the first aspect, the display module includes a back film, an adhesive layer, a substrate, and a display device layer. The adhesive layer is laminated on one side of the back film. The substrate layer is laminated on the side of the adhesive layer away from the back film. The display device layer is laminated on the side of the substrate away from the adhesive layer.

[0014] In a possible implementation of the first aspect, the material of the adhesive layer can include a curing material. Based on this, the cutting of the opening of the display module can be divided into two steps. First, the back film blank and the adhesive blank are cut, and then the opening is formed by cutting on the other side. In this way, the time of laser irradiation received by the adhesive layer is shorter, and the absorbed energy is also relatively reduced, so that the adhesive layer will not shrink significantly, and cracks are not easily formed on the inner wall of the opening. In this way, water vapor is not easily introduced into the interior of the display module through the opening, and the probability of black spots appearing in the display picture is also reduced.

[0015] In a possible implementation of the first aspect, the material of the adhesive layer can include a photocuring material.

[0016] In a possible implementation of the first aspect, the material of the adhesive layer can include a pressure-sensitive material.

[0017] In a possible implementation of the first aspect, the thickness of the back film can be less than or equal to 88 μm. At this time, the thickness of the back film is relatively thin, and thus the overall thickness of the display module can be relatively thin, realizing the thinning and lightening of the display module.

[0018] In a possible implementation of the first aspect, the material of the back film can be one of PI or PET. Since the PI and PET materials are flexible, the back film can be bent, enabling the display module to be bent and applied to foldable electronic devices.

[0019] In a possible implementation of the first aspect, the display screen can further include a light-transmitting cover plate. Along the thickness direction of the display module, the light-transmitting cover plate is disposed on one side of the display module. Among them, the part of the isolation layer within the opening can be attached to the surface of the light-transmitting cover plate close to the display module. In this way, there is no gap between the light-transmitting cover plate and the isolation layer, and water vapor will not contact the possible cracks on the inner wall of the opening through the gap between the isolation layer and the light-transmitting cover plate, thereby ensuring the isolation effect of the isolation layer.

[0020] In a second aspect, the present application provides a display screen, including a back film, an adhesive layer, a substrate, and a display device. The adhesive layer is stacked on one side of the back film. The substrate layer is stacked on the side of the adhesive layer away from the back film. The display device layer is stacked on the side of the substrate away from the adhesive layer. Among them, the material of the adhesive layer includes a curing material.

[0021] Based on this, the cutting of the opening of the display module can be divided into two steps. First, the back film blank and the adhesive blank are cut, and then the opening is cut on the other side. In this way, the adhesive layer is irradiated by the laser for a shorter time, and the absorbed energy is also relatively reduced, so that the adhesive layer will not shrink significantly, and cracks are not easily formed on the inner wall of the opening. In this way, water vapor is not easily introduced into the interior of the display module through the opening, and the probability of black spots generated in the real picture is also reduced.

[0022] In a possible implementation of the second aspect, the material of the adhesive layer can include a photocuring material.

[0023] In a possible implementation of the second aspect, the material of the adhesive layer can include a pressure-sensitive material.

[0024] In a possible implementation of the second aspect, the thickness of the back film can be less than or equal to 88 μm.

[0025] In a possible implementation of the second aspect, the material of the back film can be one of PI or PET.

[0026] In a third aspect, the present application provides an electronic device, including any one of the display screens in the first aspect or the second aspect above.

[0027] Since the electronic device provided by this application includes the display screen of any one of the above first aspect or second aspect, it can solve the same technical problems as the above display screen and achieve the same technical effects.

[0028] In a fourth aspect, this application provides a method for manufacturing a display screen, including the steps of: manufacturing a display module blank. Making an opening in the display module blank to form a display module. Manufacturing and forming an isolation layer on the inner wall of the opening so that the isolation layer covers the inner wall of the opening.

[0029] In a possible implementation manner of the fourth aspect, manufacturing and forming an isolation layer on the inner wall of the opening so that the isolation layer covers the inner wall of the opening includes the steps of: manufacturing the isolation layer on the inner wall of the opening by means of dispensing.

[0030] In a possible implementation manner of the fourth aspect, the material of the isolation layer includes at least one of UV glue, polyurethane glue, and silicone glue.

[0031] In a possible implementation manner of the fourth aspect, manufacturing and forming an isolation layer on the inner wall of the opening so that the isolation layer covers the inner wall of the opening includes the steps of: manufacturing the isolation layer on the inner wall of the opening by means of vapor deposition.

[0032] In a possible implementation manner of the fourth aspect, the material of the isolation layer includes at least one of carbon silicon thin film material and carbon fluorine thin film material.

[0033] In a possible implementation manner of the fourth aspect, the display module blank includes a back film blank, an adhesive blank, a substrate blank, and a display device blank that are sequentially stacked. Making an opening in the display module blank to form a display module includes the steps of: making a first opening on the side where the back film blank is located. Among them, the first opening penetrates through the back film blank and the semi-cured adhesive blank along the stacking direction of the display module blank. Making a second opening on the side where the display device blank is located. Among them, the second opening penetrates through the substrate blank and the display device blank along the stacking direction of the display module blank and is connected to the first opening to form an opening.

[0034] In a possible implementation manner of the fourth aspect, after making a first opening on the side where the back film blank is located, making an opening in the display module blank to form a display module further includes the steps of: curing the semi-cured adhesive blank so that the adhesive blank is adhered to the back film blank and the substrate blank.

[0035] In a possible implementation manner of the fourth aspect, the material of the adhesive blank includes a photocurable material.

[0036] In a possible implementation manner of the fourth aspect, the material of the adhesive blank includes a pressure-sensitive material.

[0037] Fifth aspect, the present application provides a method for manufacturing a display screen, including the steps of: manufacturing a display module blank. The display module blank includes a back film blank, an adhesive blank, a substrate blank, and a display device blank that are sequentially stacked. A first opening is formed on one side where the back film blank is located. The first opening penetrates through the back film blank and the semi-cured adhesive blank along the stacking direction of the display module blank. A second opening is formed on one side where the display device blank is located. The second opening penetrates through the display device blank and the substrate blank along the stacking direction of the display module blank and communicates with the first opening.

[0038] In a possible implementation manner of the fifth aspect, after forming the first opening on one side where the back film blank is located, the manufacturing method further includes the step of: curing the semi-cured adhesive blank to bond the adhesive blank to the back film blank and the substrate blank.

[0039] In a possible implementation manner of the fifth aspect, the material of the adhesive blank includes a photocurable material.

[0040] In a possible implementation manner of the fifth aspect, the material of the adhesive blank includes a pressure-sensitive material.

[0041] Among them, for the technical effects brought by the design manners of the fourth aspect and the fifth aspect, reference can be made to the technical effects brought by different design manners in the first aspect and the second aspect, which will not be elaborated here. Description of the Drawings

[0042] Figure 1 It is a cross-sectional view of the cutting position of the display module;

[0043] Figure 2 It is a schematic structural diagram of an electronic device provided by an embodiment of the present application;

[0044] Figure 3 It is a schematic structural diagram of a display screen provided by an embodiment of the present application;

[0045] Figure 4 It is a schematic structural diagram of a display module provided by an embodiment of the present application;

[0046] Figure 5 It is a schematic structural diagram of a display device layer provided by an embodiment of the present application;

[0047] Figure 6 It is a partial schematic structural diagram of a display module provided by an embodiment of the present application;

[0048] Figure 7 It is a partial schematic structural diagram of a display screen provided by an embodiment of the present application;

[0049] Figure 8Another partial structural schematic diagram of the display screen provided by the embodiment of the present application;

[0050] Figure 9 It is a structural schematic diagram when the isolation layer is fabricated by chemical vapor deposition;

[0051] Figure 10 Another partial structural schematic diagram of the display screen provided by the embodiment of the present application;

[0052] Figure 11 One of the flow schematic diagrams of the method for manufacturing the display screen provided by the embodiment of the present application;

[0053] Figure 12 Another flow schematic diagram of the method for manufacturing the display screen provided by the embodiment of the present application;

[0054] Figure 13 Another flow schematic diagram of the method for manufacturing the display screen provided by the embodiment of the present application;

[0055] Figure 14 Another flow schematic diagram of the method for manufacturing the display screen provided by the embodiment of the present application;

[0056] Figure 15 It is a structural schematic diagram when the first opening is fabricated;

[0057] Figure 16 Another flow schematic diagram of the method for manufacturing the display screen provided by the embodiment of the present application;

[0058] Figure 17 Another flow schematic diagram of the method for manufacturing the display screen provided by the embodiment of the present application;

[0059] Figure 18 Another flow schematic diagram of the method for manufacturing the display screen provided by the embodiment of the present application;

[0060] Explanation of reference numerals:

[0061] 100 - Electronic device; 10 - Display screen; 20 - Rear case; 30 - Camera; 40 - Transparent cover plate; 401 - Through hole; 41 - Transparent decorative member; 50 - Display module; 501 - Opening; 5011 - First opening; 502 - Display surface; 503 - Non - display surface; 51 - Back film; 511 - Back film blank; 52 - Adhesive layer; 521 - Adhesive blank; 53 - Substrate; 54 - Display device layer; 55 - Encapsulation layer; 551 - Encapsulation layer blank; 56 - Polarizer layer; 561 - Polarizer blank; 57 - Pressure - sensitive adhesive layer; 571 - Pressure - sensitive adhesive blank; 58 - Optically clear adhesive layer; 59 - Thin - film transistor layer; 60 - Isolation layer; 200 - Chemical vapor deposition equipment. Detailed implementation manners

[0062] In the embodiments of the present application, the term "exemplarily" or "for example" is used to give examples, illustrations or explanations. Any embodiment or design solution described as "exemplarily" or "for example" in the embodiments of the present application should not be construed as being more preferred or having more advantages than other embodiments or design solutions. Rather, the use of the words "exemplarily" or "for example" is intended to present the relevant concepts in a specific manner.

[0063] In the description of the embodiments of the present application, the term "and / or" means and encompasses any and all possible combinations of one or more of the associated listed items. The term "and / or" is a relational term describing the relationship between associated objects, indicating that three relationships may exist. For example, A and / or B may represent: A exists alone, A and B exist simultaneously, and B exists alone. Additionally, the character " / " in the present application generally indicates that the associated objects before and after are in an "or" relationship.

[0064] In the description of the embodiments of the present application, unless otherwise clearly specified and limited, the terms "installed", "connected" and "coupled" shall be understood in a broad sense. For example, "connected" may be a detachable connection or a non-detachable connection; it may be a direct connection or an indirect connection through an intermediate medium.

[0065] In the description of the embodiments of the present application, the term "comprising", "including" or any other variant thereof is intended to cover non-exclusive inclusion, such that a process, method, article or device comprising a series of elements not only includes those elements but also includes other elements not expressly listed, or further includes elements inherent to such process, method, article or device. Without further limitation, an element defined by the statement "comprising one..." does not exclude the existence of additional identical elements in the process, method, article or device comprising that element. Without further limitation, an element defined by the statement "comprising one..." does not exclude the existence of additional identical elements in the process, method, article or device comprising that element.

[0066] As used herein, "parallel", "perpendicular", and "equal" include the stated situations as well as situations similar to the stated situations, where the range of the similar situations is within an acceptable deviation range, and the acceptable deviation range is determined by a person of ordinary skill in the art considering the measurement under discussion and the errors associated with the measurement of a specific quantity (i.e., the limitations of the measurement system). For example, "parallel" includes absolute parallelism and approximate parallelism, and the acceptable deviation range for approximate parallelism can be, for example, a deviation within ±10°; "perpendicular" includes absolute perpendicularity and approximate perpendicularity, and the acceptable deviation range for approximate perpendicularity can also be, for example, a deviation within ±10°. "Equal" includes absolute equality and approximate equality, and the acceptable deviation range for approximate equality can be, for example, that the difference between the two equal values is less than or equal to 5% of either one of them.

[0067] With the continuous development of display technology, display modules have also been further developed. Since OLED display modules can emit light by themselves and have the advantage of being relatively thin, they are gradually applied to various electronic devices. At the same time, with the continuous development of OLED display modules, the thickness of OLED display modules is further reduced, and the thickness of each film layer in the OLED display module is gradually reduced.

[0068] In the current market, most electronic devices are equipped with cameras. For example, electronic devices such as mobile phones, tablet computers, or laptop computers all have cameras. In related technologies, by making an opening on the display module and corresponding the light incident end of the camera with the opening, it is convenient for light to enter the camera.

[0069] However, as the thickness of each film layer in the OLED display module gradually decreases, the problem of electroluminescence peeling (EL Peeling) is likely to occur at the opening of the OLED display module, and display failure will occur during environmental testing (RA test) under specific environmental conditions. The main reason is that after the thickness of the OLED display module is reduced, a relatively serious problem of film layer shrinkage will occur during the cutting process. And the shrinkage of the OLED film layer will cause cracks to occur, making it easy for water vapor to enter the inside of the OLED display module through the cracks at the opening, oxidizing the light-emitting devices of the OLED display module, resulting in the inability of the light-emitting devices to display, and then black spots that cannot be displayed appear.

[0070] For example, the adhesive layer on the back film side of the OLED display module will shrink when heated during the cutting process. When the shrinkage size exceeds a certain range (for example, 30 μm), it will pull other film layers, and then rainbow patterns will be generated, as Figure 1 shown Figure 1 is a cross-sectional view of the cutting part of the display module, which makes it easy for water vapor to enter the inside of the OLED display module, and finally forms the above-mentioned black spots.

[0071] Based on this, the present application provides an electronic device, which can be an electronic product with a display function such as a mobile phone, a tablet computer (pad), a computer, a smart wearable product (e.g., a smart watch, a smart bracelet), a virtual reality (VR) terminal device, an augmented reality (AR) terminal device, etc. The embodiments of the present application do not impose special restrictions on the specific form of the above-mentioned electronic device with a display function.

[0072] As an example, the electronic device provided by the embodiments of the present application can be a mobile phone, such as Figure 2 shown Figure 2 FIG. is a schematic structural diagram of an electronic device 100 provided by an embodiment of the present application. The electronic device 100 may include a display screen 10 and a rear case 20. Among them, the display screen 10 can be buckled on one side of the rear case 20 to jointly form the external structure of the electronic device 100 with the rear case 20.

[0073] Continue to refer to Figure 2 , the electronic device 100 may further include a camera 30 to implement the functions of taking pictures and videos. Among them, the camera 30 can be a front camera. In order to place the front camera, the display screen 10 may be provided with an opening ( Figure 2 not shown in the figure), and the front camera can be arranged in the opening of the display screen 10.

[0074] It can be understood that the front camera can be set at any position of the display screen 10 according to actual needs. For example, the display screen 10 can be divided into a display area and a non-display area. Among them, the front camera can be arranged in the display area of the display screen 10 or in the non-display area of the display screen 10.

[0075] Next, the display screen 10 provided by the embodiments of the present application will be further introduced. As Figure 3 shown Figure 3 FIG. is a schematic structural diagram of a display screen 10 provided by an embodiment of the present application. The display screen 10 may include a light-transmitting cover plate 40 and a display module 50. Among them, the material of the light-transmitting cover plate 40 includes but is not limited to glass, plastic or ceramic. The light-transmitting cover plate 40 can be covered on one side of the display module 50 along the thickness direction of the display module 50 (i.e., the X direction shown in Figure 3 ). The light-transmitting cover plate 40 can play a certain protective role for the display module 50 to prevent the display module 50 from being damaged.

[0076] The display module 50 can be an OLED display module, that is, the display module 50 can emit light by itself. The display module 50 can be a rigid OLED display module or a flexible OLED display module. When the display module 50 is a flexible OLED display module, the display module 50 can be bent and can be used in an electronic device 100 capable of folding (such as a foldable mobile phone, a wearable device, or a tablet computer, etc.). In the embodiments of the present application, the display module 50 can be selected as a flexible OLED display module.

[0077] As can be seen from the above, based on the arrangement of the camera 30 inside the electronic device 100, an opening needs to be made on the display screen 10. As Figure 3 shown, an opening 501 can be provided on the display module 50. The opening 501 penetrates through the display module 50 along the thickness direction of the display module 50. Thus, the camera 30 can be disposed within the opening 501 of the display module 50.

[0078] It can be understood that, as Figure 3 shown, a through hole 401 can be provided on the light-transmitting cover plate 40, which is covered on one side of the display module 50. Among them, the through hole 401 is communicated with the opening 501 of the display module. In this way, a part of the camera 30 ( Figure 2 ) can be located within the through hole 401 to ensure that the light incident end of the camera 30 can smoothly receive light.

[0079] In addition, as Figure 3 shown, the display screen 10 can further include a light-transmitting decorative member 41, and the light-transmitting decorative member 41 can be located within the through hole 401. As Figure 3 shown, the light-transmitting decorative member 41 can block the through hole 401 of the light-transmitting cover plate 40 and the opening 501 on the display module 50. Thus, the light-transmitting decorative member 41 can block external dust and moisture from entering the inside of the opening 501, playing a protective role.

[0080] Of course, in some other embodiments, the through hole may not be provided on the light-transmitting cover plate 40, and it is covered on one side of the display module 50. The light-transmitting cover plate 40 can block the opening 501 on the display module 50. Thus, the light-transmitting cover plate 40 can block external dust and moisture from entering the inside of the opening 501, playing a protective role.

[0081] The display module 50 provided by the embodiments of the present application can have different compositions. As Figure 4 shown, Figure 4 is a schematic structural diagram of a display module 50 provided by the embodiments of the present application. The display module 50 can include a back film 51, an adhesive layer 52, a substrate 53, and a display device layer 54.

[0082] The back film 51 can play a supporting role and support other film layers of the display module 50. The adhesive layer 52 is stacked on one side of the back film 51, and the substrate 53 is stacked on the side of the adhesive layer 52 away from the back film 51. The adhesive layer 52 can play an adhesive role and bond the substrate 53 and the back film 51 together.

[0083] The display device layer 54 is stacked on the side of the substrate 53 away from the adhesive layer 52. The display device layer 54 can emit light by itself to realize the display of the picture. Among them, the substrate 53 can be used as the manufacturing substrate of the display device layer 54, and the display device layer 54 is manufactured on the substrate 53.

[0084] Exemplarily, as Figure 5 shown, the display module 50 may further include a thin film transistor (TFT) layer 59. The thin film transistor layer 59 is located between the display device layer 54 and the substrate 53.

[0085] In addition, as Figure 6 shown, Figure 6 is a partial structural schematic diagram of a display module 50 provided by an embodiment of the present application. The display module 50 may further include a packaging layer 55. The packaging layer 55 may be stacked on the side of the display device layer 54 ( Figure 4 ) away from the substrate 53 ( Figure 4 ). The packaging layer 55 can play a packaging role to prevent moisture from entering the inside of the display device layer 54 and causing damage to the display device layer 54. It can be understood that the specific composition of the packaging layer 55 can be selected according to actual situations and will not be further described here.

[0086] In some embodiments, as Figure 6 shown, the display module 50 may further include a polarizer layer 56 and a touch layer (not shown in the figure). Both the polarizer layer 56 and the touch layer can be stacked on the side of the packaging layer 55 away from the substrate 53. Among them, the polarizer layer 56 can further adjust the light, and the touch layer can be used to realize the touch function of the display module 50.

[0087] Among them, as Figure 6 shown, a pressure-sensitive adhesive layer 57 may be provided on the side of the polarizer layer 56 close to the packaging layer 55. The polarizer layer 56 can be bonded to other film layers through the pressure-sensitive adhesive layer 57. Similarly, as Figure 7 shown, Figure 7 is a partial structural schematic diagram of a display screen 10 provided by an embodiment of the present application. The display screen 10 may further include an optical transparent adhesive layer 58. The optical transparent adhesive layer 58 may be located on the side of the light-transmitting cover plate 40 close to the display module 50. The light-transmitting cover plate 40 can be bonded to the display module 50 through the optical transparent adhesive layer 58.

[0088] As described above, as the thickness of the display module 50 gradually decreases, in order to prevent water vapor from entering the interior of the display module 50 through the opening 501 of the display module 50, as Figure 7 shown, in some embodiments, the display screen 10 may further include an isolation layer 60. The isolation layer 60 is integrally formed, and at least a part thereof is inside the opening 501 and covers the inner wall of the opening 501.

[0089] In this way, since the inner wall of the opening 501 is covered with the isolation layer 60, the isolation layer 60 can cover and isolate the cracks that may form at the inner wall of the opening 501. Thus, the water vapor is blocked by the isolation layer 60 and cannot enter the interior of the display module 50 from the cracks, thereby preventing the light-emitting devices inside the display module 50 from being oxidized to form black spots. At the same time, since the isolation layer 60 is integrally formed, there are no gaps in the isolation layer 60 itself, thereby ensuring that water vapor will not enter through the isolation layer 60, and the isolation effect of the isolation layer 60 is better.

[0090] It can be understood that since the inner wall of the opening 501 is covered with the isolation layer 60. The size of the opening 501 on the display module 50 can be larger than the size of the camera 30. In this way, when the inner wall of the opening 501 is covered with the isolation layer 60, it can also enable the camera 30 to smoothly extend into the opening 501 to ensure the smooth assembly of the camera 30.

[0091] In some embodiments, as Figure 7 shown, the part of the isolation layer 60 located inside the opening 501 can be attached to the surface of the light-transmitting cover plate 40 close to the display module 50. In this way, there is no gap between the light-transmitting cover plate 40 and the isolation layer 60, and water vapor will not contact the possible cracks on the inner wall of the opening 501 through the gap between the isolation layer 60 and the light-transmitting cover plate 40, thereby ensuring the isolation effect of the isolation layer 60.

[0092] Of course, in some other embodiments, the part of the isolation layer 60 located inside the opening 501 may not be attached to the surface of the light-transmitting cover plate 40 close to the display module 50. Generally, the opening 501 of the display module 50 is generally formed by laser cutting from the side of the display module 50 away from the light-transmitting cover plate 40. Therefore, the position of the inner wall of the opening 501 far from the light-transmitting cover plate 40 is subjected to a longer laser duration, the adhesive layer 52 close to the back film 51 shrinks the most severely, and the adhesive layer 52 pulls the film layers on both sides the most severely, resulting in the most likely formation of cracks at this position, while the position of the inner wall of the opening 501 close to the light-transmitting cover plate 40 is relatively less likely to form cracks. Therefore, since the position of the inner wall of the opening 501 close to the light-transmitting cover plate 40 is less likely to form cracks, even if water vapor contacts the inner wall of the opening 501 through the isolation layer 60, it is not easy to enter the interior of the display module 50 and affect the display module 50.

[0093] In some embodiments, as Figure 7 shown, along the thickness direction of the display module 50 ( Figure 7 the X direction shown), the display module 50 has a display surface 502 and a non-display surface 503 that are oppositely arranged. A part of the isolation layer 60 can be located within the opening 501 and cover the inner wall of the opening 501, and another part is located on the non-display surface 503 of the display module 50.

[0094] As mentioned above, cracks are likely to form on the inner wall of the opening 501 at a position far from the light-transmitting cover plate 40. Since another part of the isolation layer 60 extends to the outside of the opening 501 and is located on the non-display surface 503 of the display module 50. In this way, as Figure 7 shown, the isolation layer 60 can completely cover the inner wall of the opening 501 at a position close to the non-display surface 503. Thus, the place where cracks are more likely to occur on the inner wall of the opening 501 can be covered by the isolation layer 60, thereby preventing water vapor from entering the inside of the display module 50 through the cracks and ensuring the effect of isolating water vapor.

[0095] Of course, in some other embodiments, as Figure 8 shown, Figure 8 is a partial structural schematic diagram of another display screen 10 provided by the embodiment of the present application. The isolation layer 60 can also be entirely located within the opening 501 and cover the inner wall of the opening 501. At this time, the isolation layer 60 is completely on the inner wall of the opening 501, which can keep the non-display surface of the display module 50 flat and save the material consumption of the isolation layer 60.

[0096] To ensure the effect of the isolation layer 60 in isolating water vapor, as Figure 8 shown, when the isolation layer 60 is completely within the opening 501, one end of the isolation layer 60 close to the non-display surface of the display module 50 can be flush with the plane where the non-display surface 503 is located. In this way, it can be ensured that the isolation layer 60 can cover as much as possible the positions where cracks are likely to occur on the opening 501, thereby ensuring that water vapor does not enter the inside of the display module 50 through the cracks and oxidize the light-emitting devices in the display module 50 to form black spots.

[0097] In some embodiments, please continue to refer to Figure 7 and Figure 8, the single-sided thickness L1 of the part of the isolation layer 60 within the opening 501 can be less than or equal to 0.5 mm. When the single-sided thickness of the isolation layer 60 is relatively thick, in order to enable the light incident end of the camera 30 to smoothly extend into the opening 501, the size of the opening 501 also needs to be increased accordingly, and the size of the display module 50 occupied by the opening 501 is also relatively large, which affects the display effect. Therefore, when the single-sided thickness of the part of the isolation layer 60 within the opening 501 is less than or equal to 0.5 mm, it can be ensured that the size of the opening 501 will not increase significantly due to the setting of the isolation layer 60.

[0098] It can be understood that the specific value of the single-sided thickness of the part of the isolation layer 60 within the opening 501 can be selected according to the actual situation and will not be further limited here. Exemplarily, the single-sided thickness of the part of the isolation layer 60 within the opening 501 can be 0.5 mm, 0.4 mm, 0.3 mm, 0.2 mm, 0.1 mm, etc.

[0099] In addition, it can be understood that after the isolation layer 60 is worn, water vapor is likely to enter the interior of the display module 50 from the cracks formed on the inner wall of the opening 501. Therefore, in order to ensure the isolation effect of the isolation layer 60, the single-sided thickness of the part of the isolation layer 60 within the opening 501 should not be too thin. Exemplarily, the single-sided thickness of the part of the isolation layer 60 within the opening 501 can be greater than or equal to 0.1 mm.

[0100] In addition, the single-sided thickness of each position of the part of the isolation layer 60 within the opening 501 can be substantially the same or can be different. Exemplarily, as Figure 7 shown, the single-sided thickness of the isolation layer 60 at different positions on the inner wall of the opening 501 can be substantially equal. Or, as Figure 8 shown, the single-sided thickness of the isolation layer 60 at different positions on the inner wall of the opening 501 can also be different. Among them, when the single-sided thickness of the isolation layer 60 at different positions on the inner wall of the opening 501 is different, the range of the single-sided thickness of the isolation layer 60 refers to the value range of the thickest single-sided thickness.

[0101] Based on Figure 7 the scheme shown, in some embodiments, along the thickness direction of the display module 50, the thickness L2 of the part of the isolation layer 60 on the non-display surface can be less than or equal to 0.3 mm. At this time, the thickness of the isolation layer 60 is relatively thin, which can make the overall non-display surface maintain a relatively flat state. Similarly, the specific value of the thickness of the part of the isolation layer 60 on the non-display surface can be selected according to the actual situation and will not be further limited here. Exemplarily, the thickness of the part of the isolation layer 60 on the non-display surface can be 0.3 mm, 0.2 mm, 0.1 mm, etc.

[0102] In the display screen 10 provided in the embodiments of the present application, the material of the isolation layer 60 can be selected according to actual situations as long as it can play a role in isolating water vapor. In some embodiments, the isolation layer 60 can include at least one of UV glue, polyurethane glue, silica gel, carbon silicon thin film material, and carbon fluorine thin film material. That is to say, the isolation layer 60 can include UV glue, polyurethane glue, silica gel, carbon silicon thin film material, or carbon fluorine thin film material, and the isolation layer 60 can also include any two, three, four, or all of UV glue, polyurethane glue, silica gel, carbon silicon thin film material, and carbon fluorine thin film material. Based on the above different materials to make the isolation layer 60, the isolation layer 60 can have a good isolation effect.

[0103] If the material of the isolation layer 60 is different, the method of making the isolation layer 60 on the inner wall of the opening 501 will also be different. Exemplarily, when the material of the isolation layer 60 includes at least one of UV glue, polyurethane glue, and silica gel, the above materials can be covered on the inner wall of the opening 501 by a dispensing method to form the isolation layer 60. When making the isolation layer 60 by the dispensing method, the manufacturing method of the isolation layer 60 is relatively simple and the operation is easier.

[0104] Or, when the material of the isolation layer 60 includes at least one of carbon silicon thin film material and carbon fluorine thin film material, the above thin film materials can be deposited on the inner wall of the opening 501 by a vapor deposition method to form the isolation layer 60. As Figure 9 shown, Figure 9 FIG. is a schematic structural diagram when making the isolation layer 60 by the vapor deposition method. When making the isolation layer 60, a plasma enhanced chemical vapor deposition (PECVD) method can be adopted, and by using the vapor deposition device 200, the above thin film materials are ejected and deposited on the inner wall of the opening 501 to form the isolation layer 60.

[0105] In some embodiments, the thickness of the back film 51 can be less than or equal to 88 μm. At this time, the thickness of the back film 51 is relatively thin, which can further make the overall thickness of the display module 50 relatively thin, realizing the thinning of the display module 50. At the same time, it can also be beneficial to improve the flexibility of the display screen 10. Exemplarily, the thickness of the back film 51 can be 88 μm, 70 μm, or 65 μm, etc.

[0106] In some embodiments, the material of the back film 51 may be one of polyimide (PI) or polyethylene terephthalate (PET). Since the PI and PET materials are flexible, the back film 51 can be bent, enabling the display module 50 to be bent and applied to the foldable electronic device 100. Of course, other materials can also be selected for the back film 51, which can be specifically selected according to actual requirements and will not be further limited here.

[0107] In some embodiments, the material of the adhesive layer 52 may include a curing material. At this time, the original state of the adhesive layer 52 can be a semi-cured state, and after the curing operation, it adheres to the back film 51 and the substrate 53. Based on this, when manufacturing the display module 50 from the display module blank, the manufacturing process of the opening 501 of the display module 50 can be divided into two steps. Among them, the display module blank may include a back film blank, an adhesive blank, a substrate blank, and a display device blank stacked in sequence.

[0108] When making the opening of the display module 50, in the first step, a laser can be used to first cut and open a first opening on the side where the back film blank in the display module blank is located, so that the first opening penetrates through the back film blank and the adhesive blank along the stacking direction of the display module blank. Since the adhesive blank is in a semi-cured state before curing, the adhesion between the back film blank and the display device blank is not strong. After laser cutting, it is convenient to first remove the waste materials of the back film blank and the adhesive blank to form the first opening.

[0109] In the second step, a laser is used to cut and open a second opening on the side where the display device blank is located, so that the second opening penetrates through the display device blank and the substrate blank along the stacking direction of the display module 50 and communicates with the first opening. In this way, the opening of the opening 501 can be completed, and the display module 50 can be completed.

[0110] Based on the above material of the adhesive layer 52 and the manufacturing process of the opening 501, the cutting of the opening 501 of the display module 50 can be divided into two steps. First, cut the back film blank and the adhesive blank, and then cut on the other side to form the opening 501. In this way, the adhesive layer 52 is irradiated by the laser for a shorter time and absorbs relatively less energy, so that the adhesive layer 52 will not shrink significantly, the peeling of the film layer is controllable, and cracks are not easily formed on the inner wall of the opening 501. In this way, water vapor is not easily introduced into the interior of the display module 50 through the opening 501, and the probability of black spots generated in the display picture will also be reduced.

[0111] As described above, when the material of the adhesive layer 52 includes a curing material, the opening 501 can be processed in two steps, which can reduce the probability of cracks forming at the opening 501 of the display module 50. Therefore, when the material of the adhesive layer 52 includes a curing material, the display screen 10 provided by the embodiments of the present application may or may not include the isolation layer 60. As Figure 10 shown, Figure 10 FIG. is a partial structural schematic diagram of another display screen 10 provided by the embodiments of the present application. This display screen 10 does not include the isolation layer 60. It can be understood that when the display screen 10 provided by the embodiments of the present application does not include the isolation layer 60, other structures of the display screen 10 may be the same as those of the display screen 10 with the isolation layer 60, and no further introduction will be made here.

[0112] In some embodiments, the material of the adhesive layer 52 may include a photo-curing material. In this way, based on the above manufacturing method, after the first opening is formed and the first opening penetrates through the back film 51 and the adhesive layer 52 along the thickness direction of the display module 50, the adhesive layer 52 can be cured by means of light irradiation, so that the adhesive layer 52 can firmly bond the back film 51 and the substrate 53.

[0113] This process can be completed at the encapsulation and assembly (EAC) stage. When the display screen 10 has a bending area, this process can be carried out synchronously when grooving the bending area is required. Exemplarily, the material of the adhesive layer 52 may include a UV curable adhesive. At this time, the adhesive layer 52 can be cured by a UV curing lamp.

[0114] In some embodiments, the material of the adhesive layer 52 may further include a pressure-sensitive material. At this time, the adhesive layer 52 can be better bonded to the back film 51 and the substrate 53 by pressing, and the bonding effect is better.

[0115] On the other hand, a manufacturing method of a display screen provided by the embodiments of the present application, as Figure 11 shown, Figure 11 is one of the flow schematic diagrams of the manufacturing method of the display screen provided by the embodiments of the present application. This manufacturing method may include steps S100 to S300.

[0116] S100: Manufacture a display module blank.

[0117] S200: Open an opening on the display module blank to form a display module. Exemplarily, the display module blank can be cut by laser cutting to form the above opening.

[0118] S300: Fabricate an isolation layer on the inner wall of the opening such that the isolation layer covers the inner wall of the opening. Thus, the isolation layer can function to isolate water vapor, preventing water vapor from entering the interior of the display module through the inner wall of the opening, causing the light-emitting devices inside the display module to be oxidized, and avoiding black spots on the display screen.

[0119] In some embodiments, as Figure 12 shown, Figure 12 FIG. 2 is a second flowchart of the method for manufacturing a display screen provided by an embodiment of the present application. Fabricating an isolation layer on the inner wall of the opening such that the isolation layer covers the inner wall of the opening includes step S301.

[0120] S301: Fabricate an isolation layer on the inner wall of the opening by dispensing glue. Using the above method to fabricate the isolation layer, the operation is relatively simple and the fabrication is more convenient.

[0121] Based on the above step S301, the material of the isolation layer may include at least one of UV glue, polyurethane glue, and silicone glue.

[0122] In some embodiments, as Figure 13 shown, Figure 13 FIG. 3 is a third flowchart of the method for manufacturing a display screen provided by an embodiment of the present application. Fabricating an isolation layer on the inner wall of the opening such that the isolation layer covers the inner wall of the opening includes step S302.

[0123] S302: Fabricate an isolation layer on the inner wall of the opening by vapor deposition. Using the above method to fabricate the isolation layer can make the thickness of one side of the isolation layer relatively uniform, thereby ensuring that a good water vapor isolation effect can be achieved at each position on the inner wall of the opening.

[0124] Exemplarily, as Figure 9 shown, the plasma enhanced chemical vapor deposition (PECVD) method can be used, and with the vapor deposition device 200, the above thin film material is ejected and deposited on the inner wall of the opening 501 to form the isolation layer 60.

[0125] Based on the above fabrication step S302, the material of the isolation layer may include at least one of carbon silicon thin film materials and carbon fluorine thin film materials.

[0126] In some embodiments, the display module blank can include a back film blank, an adhesive blank, a substrate blank, and a display device blank that are sequentially stacked. Among them, the initial state of the adhesive blank can be a semi-cured state. Based on this, as Figure 14 shown, Figure 14FIG. 4 is a schematic flow chart of a method for manufacturing a display screen provided by an embodiment of the present application. The method of manufacturing a display module by opening holes in a display module blank includes steps S201 and S202.

[0127] S201: Open a first hole on one side where the back film blank is located. Among them, as Figure 15 , Figure 15 FIG. shows a schematic structural diagram when manufacturing the first hole 5011. The first hole 5011 penetrates through the back film blank 511 and the semi-cured adhesive blank 521 along the stacking direction of the display module blank. In addition, as Figure 15 shown, the display module blank may further include a packaging layer blank 551, a pressure-sensitive adhesive blank 571, and a polarizer blank 561.

[0128] Exemplarily, the first hole can be opened by means of laser cutting. At the same time, since the adhesive blank is in a semi-cured state, after laser cutting, the adhesive blank at the cutting position is easily separated from the substrate blank, and the adhesive blank and the back film blank can be removed more conveniently.

[0129] S202: Open a second hole on one side where the display device blank is located. Among them, the second hole penetrates through the substrate blank and the display device blank along the stacking direction of the display module blank and communicates with the first hole to form the above-mentioned hole. Similarly, the first hole can be opened by means of laser cutting.

[0130] Based on the above steps, since the first hole and the second hole are respectively opened from both sides of the display module blank during the process of making the hole. During the process of opening the first hole, the energy of the laser received by the adhesive blank is relatively reduced, so that the adhesive blank will not shrink greatly, and thus it is not easy to form cracks on the inner wall of the hole. In this way, water vapor is not easily introduced into the interior of the display module through the inner wall of the hole, reducing the probability of black spots appearing on the display screen.

[0131] In addition, based on the above steps S201 and S202, in order to enable the first hole and the second hole to communicate with each other to form a hole. When manufacturing the display module blank, positioning points can be set in the display module blank. When performing laser cutting, according to the detected positions of the positioning points, cutting is performed from both sides respectively, so that the first hole and the second hole can communicate at corresponding positions.

[0132] Exemplarily, the thin film transistor blank in the display module blank may include the above-mentioned positioning points. The positioning points can be positioning metals in the thin film transistor blank. When performing cutting, the positioning points are detected according to laser cutting. After detecting the positioning points, the first hole and the second hole are respectively opened from both sides of the display module blank at corresponding positions for communication according to the identification of the positioning points.

[0133] In some embodiments, such as Figure 16 shown, Figure 16 FIG. 5 is a schematic flowchart of a method for manufacturing a display screen provided by an embodiment of the present application. After opening a first opening on the side where the back film blank is located, opening an opening on the display module blank to form a display module further includes step S203.

[0134] S203: Cure the semi-cured bonding blank to bond the bonding blank to the back film blank and the substrate blank. After this step, after the bonding blank is cured, it can be better bonded to the substrate blank and the back film blank, so that the back film blank and the substrate blank can be well bonded together through the bonding blank.

[0135] Among them, as Figure 16 shown, step S203 can be performed between steps S201 and S202. In this way, before opening the second opening, the substrate and the back film are firmly bonded together to ensure that no separation occurs during the process of opening the second opening from the side where the display device blank is located.

[0136] Based on the above manufacturing method, in some embodiments, the material of the bonding blank may include a photo-curable material. In this way, the initial state of the bonding layer can be in a semi-cured state, and then the bonding blank is cured by using light to achieve the bonding effect of the bonding blank. Exemplarily, the material of the bonding blank may include a UV curable adhesive. At this time, the bonding blank can be cured by a UV curing lamp.

[0137] Of course, the material of the bonding blank can also be other materials with an initial state of semi-cured state. For example, the material of the bonding blank may also include a heat-curable material. In this way, the bonding blank can be cured by heating to achieve the bonding effect of the bonding blank.

[0138] In some embodiments, the material of the bonding blank may further include a pressure-sensitive material. Since the bonding blank includes a curable material and the initial state is semi-cured. Based on this, when manufacturing the display module blank, the bonding blank can be pressed on one side of the display module blank, and the pressure-sensitive material in the bonding blank makes the bonding blank play a certain bonding role to avoid falling off during subsequent processing.

[0139] On the other hand, when the display screen provided by the embodiment of the present application does not include an isolation layer, as Figure 17 shown, Figure 17 FIG. 6 is a schematic flowchart of another method for manufacturing a display screen provided by an embodiment of the present application. The embodiment of the present application provides another method for manufacturing a display screen, and this manufacturing method may include steps S400-S600.

[0140] S400: Fabricate a display module blank. Among them, the display module blank may include a back film blank, an adhesive blank, a substrate blank, and a display device blank that are sequentially stacked.

[0141] S500: Open a first opening on one side where the back film blank is located. Among them, referring to Figure 15 , the first opening penetrates through the back film blank and the semi-cured adhesive blank along the thickness direction of the display module blank. Exemplarily, laser cutting can be used for cutting. At the same time, since the adhesive blank is in a semi-cured state, after laser cutting, the adhesive blank at the cutting position is easily separated from the substrate blank, and it is more convenient to remove the adhesive blank and the back film blank.

[0142] S600: Open a second opening on one side where the display device blank is located. Among them, the second opening penetrates through the display device blank and the substrate blank along the thickness direction of the display module blank and communicates with the first opening. Similarly, laser cutting can be used for cutting to form the above-mentioned second opening. Thus, the mutually connected first opening and second opening can form an opening penetrating the display module blank, which can be used to place a camera.

[0143] Based on the above manufacturing steps, in the manufacturing method of the display screen provided by the embodiment of the present application, during the manufacturing process, the adhesive blank between the back film blank and the substrate blank only absorbs the energy of the laser when making the first opening, and the energy absorbed by the adhesive blank is less and serious shrinkage will not occur. Thus, the inner wall of the finally formed opening is not easy to form cracks, and water vapor is not easy to enter the interior of the display module from the inner wall of the opening, thereby reducing the probability of black spots appearing in the display screen.

[0144] In addition, similarly, based on the above steps S500 and S600, in order to enable the first opening and the second opening to communicate with each other to form an opening. When fabricating the display module blank, positioning points can be set in the display module blank. When performing laser cutting, according to the detected positions of the positioning points, cutting is performed from both sides respectively, so that the first opening and the second opening can communicate at the corresponding positions.

[0145] Exemplarily, the thin film transistor blank in the display module blank may include the above-mentioned positioning points. The positioning points can be positioning metals in the thin film transistor blank. When performing cutting, the positioning points are detected according to the laser cutting. After detecting the positioning points, the first opening and the second opening are respectively opened from both sides of the display module blank at the corresponding positions for communication according to the identification of the positioning points.

[0146] Similarly, as Figure 18 shown, Figure 18FIG. 7 is a schematic flowchart of a method for manufacturing a display screen provided by an embodiment of the present application. In some embodiments, after a first opening is formed on one side where the back film blank is located, the manufacturing method may further include step S700.

[0147] S700: Cure the semi-cured bonding blank to bond the bonding blank to the back film blank and the substrate blank. After this step, the bonding blank can be better bonded to the substrate blank and the back film blank after curing, so that the back film blank and the substrate blank can be well bonded together through the bonding blank.

[0148] Among them, as Figure 18 shown, step S700 can be performed between steps S500 and S600. In this way, before the second opening is formed, the substrate and the back film are firmly bonded together to ensure that no separation occurs during the process of forming the second opening from the side where the display device blank is located.

[0149] In some embodiments, the material of the bonding blank may include a photo-curable material. Based on this, light can be used to cure the bonding blank. Exemplarily, the material of the bonding blank may include UV glue, and a UV curing lamp can be used for irradiation during curing.

[0150] In some embodiments, the material of the bonding blank may further include a pressure-sensitive material. As mentioned above, since the bonding blank includes a curing material and is in a semi-cured state. Based on this, when manufacturing the display module blank, pressure can be applied on one side of the display module blank, and the pressure-sensitive material in the bonding blank enables the bonding blank between the back film blank and the substrate blank to play a certain bonding role, preventing it from falling off during subsequent processing.

[0151] In the description of this specification, specific features, structures, materials, or characteristics may be combined in a suitable manner in any one or more embodiments or examples.

[0152] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, and are not intended to limit them; although the present application has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements for some of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. A display screen, characterized in that, it includes: a display module, and an opening is formed in the display module; the opening penetrates through the display module along the thickness direction of the display module; and, an isolation layer, and the isolation layer is integrally formed; at least a part of the isolation layer is located in the opening and covers the inner wall of the opening.

2. The display screen according to claim 1, characterized in that, the isolation layer includes at least one of UV glue, polyurethane glue, silica gel, carbon silicon thin film material and carbon fluorine thin film material.

3. The display screen according to claim 1, characterized in that, the whole isolation layer is located in the opening and covers the inner wall of the opening.

4. The display screen according to claim 1, characterized in that, along the thickness direction of the display module, the display module has a display surface and a non-display surface which are oppositely arranged; a part of the isolation layer is located in the opening and covers the inner wall of the opening; another part of the isolation layer is located on the non-display surface of the display module.

5. The display screen according to claim 4, characterized in that, along the thickness direction of the display module, the thickness of the part of the isolation layer on the non-display surface is less than or equal to 0.3 mm.

6. The display screen according to claim 3 or 4, characterized in that, the unilateral thickness of the part of the isolation layer in the opening is less than or equal to 0.5 mm.

7. The display screen according to any one of claims 1-6, characterized in that, the display module includes: a back film; an adhesive layer, which is laminated on one side of the back film; a substrate, which is laminated on the side of the adhesive layer away from the back film; and, a display device layer, which is laminated on the side of the substrate away from the adhesive layer.

8. The display screen according to claim 7, characterized in that, the material of the adhesive layer includes a curing material.

9. The display screen according to claim 7 or 8, characterized in that, the thickness of the back film is less than or equal to 88 μm.

10. The display screen according to any one of claims 7-9, characterized in that, the material of the back film is one of PI or PET.

11. The display screen according to any one of claims 1-10, characterized in that, the display screen further includes: a light-transmitting cover plate, and along the thickness direction of the display module, the light-transmitting cover plate is covered on one side of the display module; wherein, the part of the isolation layer located in the opening is attached to the surface of the light-transmitting cover plate close to the display module.

12. A display screen, characterized in that, it includes: a back film; an adhesive layer, which is laminated on one side of the back film; a substrate, which is laminated on the side of the adhesive layer away from the back film; and, a display device layer, which is laminated on the side of the substrate away from the adhesive layer; wherein, the material of the adhesive layer includes a curing material.

13. An electronic device, characterized in that, it includes the display screen according to any one of claims 1-12.

14. A manufacturing method of a display screen, characterized in that, the manufacturing method includes: manufacturing a display module blank; An opening is formed in the display module blank to make a display module; An isolation layer is formed on the inner wall of the opening so that the isolation layer covers the inner wall of the opening.

15. The method for manufacturing a display screen according to claim 14, wherein, forming an isolation layer on the inner wall of the opening so that the isolation layer covers the inner wall of the opening includes: forming the isolation layer on the inner wall of the opening by dispensing glue.

16. The method for manufacturing a display screen according to claim 15, wherein, the material of the isolation layer includes at least one of UV glue, polyurethane glue, and silicone glue.

17. The method for manufacturing a display screen according to claim 15, wherein, forming an isolation layer on the inner wall of the opening so that the isolation layer covers the inner wall of the opening includes: forming the isolation layer on the inner wall of the opening by vapor deposition.

18. The method for manufacturing a display screen according to claim 17, wherein, the material of the isolation layer includes at least one of carbon-silicon thin film material and carbon-fluorine thin film material.

19. The method for manufacturing a display screen according to any one of claims 14-18, wherein, the display module blank includes a back film blank, an adhesive blank, a base blank, and a display device blank stacked in sequence; forming an opening in the display module blank to make a display module includes: forming a first opening on the side where the back film blank is located; wherein, the first opening penetrates through the back film blank and the semi-cured adhesive blank along the stacking direction of the display module blank; forming a second opening on the side where the display device blank is located; wherein, the second opening penetrates through the base blank and the display device blank along the stacking direction of the display module blank and communicates with the first opening to form the opening.

20. The method for manufacturing a display screen according to claim 19, wherein, after forming a first opening on the side where the back film blank is located, forming an opening in the display module blank to make a display module further includes: curing the semi-cured adhesive blank so that the adhesive blank is bonded to the back film blank and the base blank.

21. The method for manufacturing a display screen according to claim 19 or 20, wherein, the material of the adhesive blank includes a photo-curing material.

22. The method for manufacturing a display screen according to any one of claims 19-21, wherein, the material of the adhesive blank includes a pressure-sensitive material.

23. A method for manufacturing a display screen, wherein, the manufacturing method includes: manufacturing a display module blank; wherein, the display module blank includes a back film blank, an adhesive blank, a base blank, and a display device blank stacked in sequence; forming a first opening on the side where the back film blank is located; wherein, the first opening penetrates through the back film blank and the semi-cured adhesive blank along the stacking direction of the display module blank; A second opening is formed on one side where the display device blank is located; wherein, the second opening penetrates through the display device blank and the substrate blank along the stacking direction of the display module blank, and is communicated with the first opening.

24. The manufacturing method according to claim 23, characterized in that, after the first opening is formed on one side where the back film blank is located, the manufacturing method further includes: curing the semi-cured adhesive blank to bond the adhesive blank to the back film blank and the substrate blank.

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