PCBA and semiconductor cleaning machine spray pipe mechanism and cleaning machine

Abstract

The invention provides a PCBA and semiconductor cleaning machine spray pipe mechanism and a cleaning machine, the PCBA and semiconductor cleaning machine spray pipe mechanism comprises a cleaning machine body, a spray pipe assembly and a conventional spray head are installed in the cleaning machine body, the spray pipe assembly and the conventional spray head are arranged in the cleaning machine body in parallel, and the spray pipe assembly comprises a spray pipe upper support; a JCI upper spraying pipe fixing plate is fixedly connected to one side face of the spraying pipe upper support through threads, a welding fixing plate is further installed on the cleaning machine body, and a JCI upper busbar is connected to the inner side of the welding fixing plate. The JCI holes are formed in the JCI upper spraying pipe, the hole diameter and the hole distance of the JCI holes are determined, the spraying effect of jet flow impact can be generated, the impact force of water flow is high, pollutants on the surfaces of PCBA and semiconductors can be strongly penetrated, especially for surface-mounted elements, large water drops can be cleaned in a manner of being attached to pins, and the cleaning effect is good. The problem that impact force and seepage force are insufficient during cleaning of a traditional spray pipe is solved, and the cleaning quality is remarkably improved.

Description

Technical Field

[0001] The present invention relates to the technical field of cleaning machines, and particularly to a nozzle mechanism for a PCBA and semiconductor cleaning machine and a cleaning machine. Background Art

[0002] In the process of PCBA and semiconductor manufacturing, cleaning is an extremely crucial process. The miniaturization and precision of PCBA and semiconductor components are continuously improving, and their surfaces are extremely prone to attaching various pollutants, such as particulate impurities, metal ions, organic residues, etc. If these pollutants are not thoroughly removed, they will seriously affect the performance, reliability, and yield of PCBA and semiconductor components.

[0003] Currently, there are many deficiencies in the cleaning effect of traditional nozzle mechanisms for PCBA and semiconductor cleaning machines. Common ordinary spray pipe assemblies mostly use ordinary nozzles for spraying, and the cleaning liquid sprayed forms small water droplets on the surface of the object to be cleaned. When facing the cleaning of surface-mounted components, the impact force and penetration force of these small water droplets are limited, and it is difficult to penetrate into the fine parts such as the pins of the components, and the pollutants in these parts cannot be effectively removed. Moreover, the water droplets sprayed on the surface-mounted components are prone to rebound, resulting in uneven distribution of the cleaning liquid and further reducing the cleaning effect.

[0004] To solve these problems, it is extremely necessary to develop a new type of nozzle mechanism for PCBA and semiconductor cleaning machines, which needs to have stronger cleaning capabilities to meet the increasingly complex cleaning requirements of PCBA and semiconductors. Summary of the Invention

[0005] The technical problem to be solved by the present invention is to overcome the defects existing in the prior art. The present invention provides a nozzle mechanism for a PCBA and semiconductor cleaning machine and a cleaning machine.

[0006] In order to solve the above technical problems, the technical solution adopted by the present invention is a PCBA and semiconductor cleaning machine nozzle mechanism and a cleaning machine, including a cleaning machine body, a nozzle assembly and a conventional nozzle are installed inside the cleaning machine body, the nozzle assembly and the conventional nozzle are arranged in parallel inside the cleaning machine body, the nozzle assembly includes a nozzle upper bracket, a JCI upper spray pipe fixing plate is fixedly connected to one side of the nozzle upper bracket by a thread, a welding fixing plate is also installed on the cleaning machine body, the inner side of the welding fixing plate is connected to the JCI upper bus, the front end of the JCI upper bus is provided with a spray rod fixing seat, the JCI upper bus The JCI upper spray pipe is embedded in the flow bar, and the JCI upper spray pipe is installed between the JCI upper spray pipe fixing plate and the JCI upper busbar. The surface of the JCI upper spray pipe embedded in the spray bar fixing seat is provided with a sealing ring installation groove, and two O-rings are installed in the sealing ring installation groove. The front end of the JCI upper spray pipe is connected with a fixing bolt, and the rear end of the JCI upper spray pipe is connected with an angle adjustment plate. The fixing bolt passes through the inside of the spray bar fixing seat and rotates 90° to be embedded in the inside of the JCI upper busbar. The outer side of the welding fixing plate is connected with an internal thread straight-through, and the outer surface of the internal thread straight-through is sleeved with a Teflon gasket;

[0007] The cleaning machine body is also provided with a JCI lower fixed plate support frame and a JCI lower bus. The top of the JCI lower fixed plate support frame is fixedly connected to the JCI lower spray pipe fixing plate by threads. The JCI lower spray pipe is installed between the JCI lower spray pipe fixing plate and the JCI lower bus. The JCI lower spray pipe is arranged directly below the JCI upper spray pipe. The bottom end of the JCI upper spray pipe is provided with a JCI hole, and the JCI hole is used to guide the JCI water flow.

[0008] Furthermore, the JCI upper bus and the welding fixing plate are fixedly connected together, the JCI upper bus and the flow holes opened inside the welding fixing plate are welded together, the JCI upper bus and the inside of the welding fixing plate are connected, the JCI upper bus is fixed in the inner cavity of the cleaning machine, and the Teflon gasket passes through the internal thread and is aligned with the welding fixing plate and the hole in the inner cavity of the cleaning machine and then is threadedly connected.

[0009] Furthermore, the JCI lower bus has the same structure as the JCI upper bus, another set of spray bar fixing seats is arranged on the inner side of the JCI lower bus, and another set of welding fixing plates, Teflon gaskets and internal thread straight-throughs are arranged on the outer side of the JCI lower bus.

[0010] Further, one end of the upper spray pipe of the JCI, which is far away from the upper manifold of the JCI, is connected with an angle adjusting plate. The angle adjusting plate is fixedly connected to the outside of the fixing plate of the upper spray pipe of the JCI. The upper spray pipe of the JCI penetrates through the fixing plate of the upper spray pipe of the JCI and the inside of the angle adjusting plate and extends to the outside.

[0011] Further, the upper spray pipe of the JCI is rotatably connected with the fixing plate of the upper spray pipe of the JCI. The upper spray pipe of the JCI rotates to adjust the inclination angle of the JCI hole.

[0012] Further, angle scale lines are provided on the angle adjusting plate. The angle adjusting plate is used to mark the rotation angle of the upper spray pipe of the JCI.

[0013] Further, the O-ring and the seal ring installation groove are embedded into the inside of the upper manifold of the JCI. The outer wall of the O-ring is closely attached to the inner wall of the upper manifold of the JCI. The O-ring is used for the sealed connection between the upper spray pipe of the JCI and the upper manifold of the JCI.

[0014] Further, the fixing bolt is horizontally arranged on the upper spray pipe of the JCI. The upper spray pipe of the JCI is used to lock the connection between the upper spray pipe of the JCI and the upper manifold of the JCI.

[0015] Further, the JCI holes opened on the upper spray pipe of the JCI and the JCI holes opened on the lower spray pipe of the JCI correspond to each other. The JCI holes opened on the upper spray pipe of the JCI are vertically downward, and the JCI holes opened on the lower spray pipe of the JCI are vertically upward.

[0016] Further, the JCI holes opened on the upper spray pipe of the JCI and the lower spray pipe of the JCI are both vertically corresponding to the surfaces of the PCBA and the semiconductor object.

[0017] Compared with the prior art, the beneficial effects of the present invention include: the JCI holes provided on the upper spray pipe of the JCI, the establishment of the aperture and the hole pitch thereof can generate a spray effect of jet impact. This water flow has strong impact force and can strongly penetrate the pollutants on the surfaces of the PCBA and the semiconductor. Especially for surface-mounted components, large water droplets can stick to the pins for cleaning, solving the problem of insufficient impact force and penetration force during the cleaning of traditional spray pipes, and significantly improving the cleaning quality; secondly, the spray pipe can be flexibly adjusted in angle and can be adjusted according to the actual cleaning requirements in a specific manner. Facing PCBA and semiconductor components with different structures and pollution conditions, the spray direction can be accurately adjusted to ensure that the cleaning liquid fully covers, meeting the requirements of diversified cleaning processes and improving the cleaning efficiency and pertinence. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The disclosure of the present invention will be described with reference to the accompanying drawings. It should be understood that the drawings are for illustrative purposes only and are not intended to limit the scope of protection of the present invention. In the drawings, the same reference numerals are used to refer to the same components. Among them:

[0019] Figure 1 Schematically shows a schematic structural diagram of a PCBA, a nozzle mechanism of a semiconductor cleaning machine, and a cleaning machine body according to an embodiment of the present invention;

[0020] Figure 2 Schematically shows a schematic flow layout structural diagram of a PCBA, a nozzle mechanism of a semiconductor cleaning machine, a nozzle assembly of a cleaning machine, and a conventional nozzle according to an embodiment of the present invention;

[0021] Figure 3 Schematically shows a schematic structural diagram of a PCBA, a nozzle mechanism of a semiconductor cleaning machine, and a nozzle assembly of a cleaning machine according to an embodiment of the present invention;

[0022] Figure 4 Schematically shows a schematic structural diagram of a PCBA, a nozzle mechanism of a semiconductor cleaning machine, a nozzle rod fixing seat of a cleaning machine, and a welding fixing plate according to an embodiment of the present invention;

[0023] Figure 5 Schematically shows a schematic structural diagram of a PCBA, a nozzle mechanism of a semiconductor cleaning machine, a Teflon gasket of a cleaning machine, and an internal thread straight-through according to an embodiment of the present invention;

[0024] Figure 6 Schematically shows a schematic structural diagram of a PCBA, a nozzle mechanism of a semiconductor cleaning machine, an angle adjustment plate of a cleaning machine, and a JCI hole according to an embodiment of the present invention;

[0025] Figure 7 Schematically shows a PCBA, a nozzle mechanism of a semiconductor cleaning machine, and a cleaning machine according to an embodiment of the present invention Figure 6 An enlarged structural diagram at position A in the middle;

[0026] Figure 8 Schematically shows a schematic structural diagram of the jet water impact state of the upper spray pipe of the JCI of a PCBA, a nozzle mechanism of a semiconductor cleaning machine, and a cleaning machine according to an embodiment of the present invention;

[0027] Figure 9 Schematically shows a schematic structural diagram of the jet water impact state of the upper spray pipe of the JCI of a PCBA, a nozzle mechanism of a semiconductor cleaning machine, and a cleaning machine according to an embodiment of the present invention;

[0028] Figure 10Schematically shows a schematic diagram of a PCBA, a nozzle mechanism of a semiconductor cleaning machine, and a spray pipe and an angle adjustment plate on the JCI of the cleaning machine according to an embodiment of the present invention;

[0029] Figure 11 Schematically shows a schematic diagram of a PCBA, a nozzle mechanism of a semiconductor cleaning machine, and a hole and a fixing bolt on the JCI of the cleaning machine according to an embodiment of the present invention;

[0030] Figure 12 Schematically shows a schematic diagram of a PCBA, a nozzle mechanism of a semiconductor cleaning machine, and a central rod and a filter net of the cleaning machine according to an embodiment of the present invention;

[0031] Figure 13 Schematically shows a schematic diagram of a PCBA, a nozzle mechanism of a semiconductor cleaning machine, and a movable slot and a gasket of the cleaning machine according to an embodiment of the present invention;

[0032] Figure 14 Schematically shows a schematic diagram of a PCBA, a nozzle mechanism of a semiconductor cleaning machine, and a central rod and an embedded sleeve of the cleaning machine according to an embodiment of the present invention;

[0033] Figure 15 Schematically shows a schematic diagram of a PCBA, a nozzle mechanism of a semiconductor cleaning machine, and an embedded sleeve and an air pipe of the cleaning machine in a disassembled state according to an embodiment of the present invention;

[0034] Figure 16 Schematically shows a schematic diagram of a PCBA, a nozzle mechanism of a semiconductor cleaning machine, and a seal sleeve of the cleaning machine in a flipped state according to an embodiment of the present invention;

[0035] Figure 17 Schematically shows a schematic diagram of a PCBA, a nozzle mechanism of a semiconductor cleaning machine, and an embedded sleeve and a partition block of the cleaning machine according to an embodiment of the present invention.

[0036] In the figure: 1. Cleaning machine body; 2. Spray pipe assembly; 201. Upper support of spray pipe; 202. Fixed plate for JCI upper spray pipe; 203. JCI upper spray pipe; 204. JCI upper manifold; 205. JCI lower manifold; 206. JCI lower spray pipe; 207. Support frame for JCI lower fixed plate; 208. Fixed plate for JCI lower spray pipe; 209. JCI water flow; 211. Fixed seat for spray rod; 212. Welding fixed plate; 213. Teflon gasket; 214. Internal thread straight-through; 215. Angle adjustment plate; 216. JCI hole; 217. Fixed bolt; 218. O-ring; 219. O-ring installation groove; 3. Flow conversion assembly; 301. Sealing sleeve; 302. Central rod; 303. Filter screen; 304. Embedded sleeve; 305. Flow guide block; 306. Filter ring; 307. Operating lever; 308. Activity groove; 309. Sealing gasket; 310. Air pipe; 311. Partition block; 312. Protrusion; 4. Conventional nozzle. Detailed implementation mode

[0037] It is easy to understand that according to the technical solution of the present invention, without changing the essential spirit of the present invention, those of ordinary skill in the art can propose various structural ways and implementation ways that can be mutually replaced. Therefore, the following detailed implementation modes and the accompanying drawings are only exemplary descriptions of the technical solution of the present invention, and should not be regarded as all of the present invention or as a limitation or restriction on the technical solution of the present invention.

[0038] According to an embodiment of the present invention in combination with Figure 1-8Shown. A PCBA, a nozzle mechanism of a semiconductor cleaning machine, and a cleaning machine. Inside the cleaning machine body 1, a nozzle assembly 2 and a conventional nozzle 4 are installed. The nozzle assembly 2 and the conventional nozzle 4 are arranged in parallel inside the cleaning machine body 1. The nozzle assembly 2 includes a nozzle upper bracket 201. On one side surface of the nozzle upper bracket 201, a JCI upper spray pipe fixing plate 202 is fixedly connected by threads. A welding fixing plate 212 is also installed on the cleaning machine body 1. Inside the welding fixing plate 212, a JCI upper manifold 204 is connected. The JCI upper manifold 204 and the welding fixing plate 212 are fixedly connected together. The flow holes opened inside the JCI upper manifold 204 and the welding fixing plate 212 are directly opposite for welding, and the inside of the JCI upper manifold 204 and the welding fixing plate 212 are connected and communicated. The JCI upper manifold 204 is fixed inside the cleaning machine cavity. The Teflon gasket 213 passes through the internal thread straight-through 214 and is threadedly connected after being aligned with the holes of the welding fixing plate 212 and the cleaning machine cavity. The JCI lower manifold 205 has the same structure as the JCI upper manifold 204. On the inner side of the JCI lower manifold 205, there is another set of spray bar fixing seats 211. On the outer side of the JCI lower manifold 205, there is another set of welding fixing plates 212, Teflon gaskets 213, and internal thread straight-throughs 214. At the front end of the JCI upper manifold 204, there are spray bar fixing seats 211. Inside the JCI upper manifold 204, a JCI upper spray pipe 203 is embedded. The JCI upper spray pipe 203 is installed between the JCI upper spray pipe fixing plate 202 and the JCI upper manifold 204. The fixing bolt 217 is horizontally arranged on the JCI upper spray pipe 203 and is used to lock the connection between the JCI upper spray pipe 203 and the JCI upper manifold 204. On the part of the JCI upper spray pipe 203 embedded in the spray bar fixing seat 211, a sealing ring installation groove 219 is opened on the surface, and two O-ring seals 218 are installed inside the sealing ring installation groove 219. At the front end of the JCI upper spray pipe 203, a fixing bolt 217 is connected. At the rear end of the JCI upper spray pipe 203, an angle adjustment plate 215 is connected. At the end of the JCI upper spray pipe 203 far from the JCI upper manifold 204, an angle adjustment plate 215 is connected. The angle adjustment plate 215 is fixedly connected to the outside of the JCI upper spray pipe fixing plate 202. The JCI upper spray pipe 203 passes through the inside of the JCI upper spray pipe fixing plate 202 and the angle adjustment plate 215 and extends to the outside. The fixing bolt 217 passes through the inside of the spray bar fixing seat 211 and rotates 90° and is embedded into the inside of the JCI upper manifold 204. On the outside of the welding fixing plate 212, an internal thread straight-through 214 is connected. The outer surface of the internal thread straight-through 214 is sleeved with a Teflon gasket 213;

[0039] The cleaning machine body 1 is also provided with a JCI lower fixing plate support frame 207 and a JCI lower bus bar 205. The top end of the JCI lower fixing plate support frame 207 is fixedly connected by a thread to a JCI lower spray pipe fixing plate 208. An O-ring 218 and an O-ring mounting groove 219 are embedded inside the JCI upper bus bar 204. The outer wall of the O-ring 218 is closely attached to the inner wall of the JCI upper bus bar 204. The O-ring 218 is used for the sealed connection between the JCI upper spray pipe 203 and the JCI upper bus bar 204. A JCI lower spray pipe 206 is installed between the JCI lower spray pipe fixing plate 208 and the JCI lower bus bar 205. The JCI lower spray pipe 206 is arranged directly below the JCI upper spray pipe 203. A JCI hole 216 is opened at the bottom end of the JCI upper spray pipe 203. The JCI upper spray pipe 203 is rotatably connected to the JCI upper spray pipe fixing plate 202. The JCI upper spray pipe 203 rotates to adjust the inclination angle of the JCI hole 216. An angle scale line is provided on the angle adjustment plate 215. The angle adjustment plate 215 is used to mark the rotation angle of the JCI upper spray pipe 203. The JCI hole 216 is used to discharge the JCI water flow 209. The JCI holes 216 opened on the JCI upper spray pipe 203 and the JCI holes 216 opened on the JCI lower spray pipe 206 correspond to each other. The JCI holes 216 opened on the JCI upper spray pipe 203 are vertically downward, and the JCI holes 216 opened on the JCI lower spray pipe 206 are vertically upward. The JCI holes 216 opened on the JCI upper spray pipe 203 and the JCI lower spray pipe 206 are all vertically corresponding to the surfaces of the PCBA and the semiconductor object.

[0040] Specifically, after the cleaning machine is started, the cleaning liquid flows out from the liquid storage device inside the cleaning machine and enters the pipeline system connected to the cleaning machine body 1. Since the JCI upper bus bar 204 and the welding fixing plate 212 are internally connected and the flow holes are directly opposite to the welding, the cleaning liquid smoothly flows into the welding fixing plate 212 and the JCI upper bus bar 204. Under the action of pressure, the cleaning liquid flows stably in the welding fixing plate 212 and the JCI upper bus bar 204, providing a sufficient liquid source for the subsequent spraying operation. Subsequently, the cleaning liquid is transported to the inside of the JCI upper spray pipe 203 and the JCI lower spray pipe 206 through the JCI upper bus bar 204. At this time, the cleaning liquid will be sprayed out through the JCI holes 216, thereby realizing the cleaning of the PCBA and the semiconductor. Through the spraying of the JCI lower spray pipe 206, the sprayed cleaning liquid vertically impacts the surfaces of the PCBA and the semiconductor. Subsequently, the cleaning liquid is in a divergent state. In this way, the penetration strength of the cleaning liquid can be improved.

[0041] In addition, the spray pipe 203 on the JCI is rotatably connected to the fixing plate 202 of the spray pipe on the JCI, and the operator can rotate the spray pipe 203 on the JCI according to the cleaning requirements of the PCBA and the semiconductor. The angle adjustment plate 215 is fixed to the outside of the fixing plate 202 of the spray pipe on the JCI, and the spray pipe 203 on the JCI penetrates through the angle adjustment plate 215. The angle scale line set on the angle adjustment plate 215 can assist the operator to accurately adjust the rotation angle of the spray pipe 203 on the JCI. When the spray pipe 203 on the JCI is rotated, the inclination angle of the JCI hole 216 opened at the bottom end of the spray pipe 203 on the JCI changes accordingly, so as to adjust the spraying angle of the cleaning liquid to adapt to the surface structure and pollution conditions of different PCBA and semiconductors. After the angle of the spray pipe 203 on the JCI is adjusted, the cleaning liquid is ejected vertically downward from the JCI hole 216 of the spray pipe 203 on the JCI, directly impacting the surfaces of the PCBA and the semiconductor, and removing the pollutants on the surfaces of the PCBA and the semiconductor by using its impact force. At the same time, the JCI lower spray pipe 206 located directly below the spray pipe 203 on the JCI has the JCI hole 216 opened vertically upward, and sprays the cleaning liquid upward to clean and rinse the PCBA and the semiconductor. This two-way spraying design enables all parts of the surfaces of the PCBA and the semiconductor to come into full contact with the cleaning liquid, improving the comprehensiveness and cleanliness of the cleaning. Since the JCI lower manifold 205 and the JCI upper manifold 204 have the same structure and are both equipped with corresponding spray bar fixing seats 211, welding fixing plates 212, Teflon gaskets 213 and internal thread straight-throughs 214 and other components, when cleaning PCBA and semiconductors with larger sizes or special shapes, multiple sets of spray pipe mechanisms can be enabled simultaneously. Multiple sets of spray pipes spray and clean the PCBA and the semiconductor from different angles, greatly improving the cleaning efficiency and ensuring that all parts of the PCBA and the semiconductor can be effectively cleaned.

[0042] According to another embodiment of the present invention in combination with Figure 9-17Shown. A PCBA, a nozzle mechanism of a semiconductor cleaning machine, and a cleaning machine. A flow-changing component 3 is installed inside the upper JCI spray pipe 203, and the flow-changing component 3 is used to change the form of the cleaning liquid sprayed out. The flow-changing component 3 includes a sealing sleeve 301. The sealing sleeve 301 is embedded inside the upper JCI spray pipe 203. The sealing sleeve 301 is fixedly connected inside the upper JCI spray pipe 203, and one side of the sealing sleeve 301 is attached to the inner surface of the angle adjustment plate 215. A sealing gasket 309 is embedded inside the sealing sleeve 301, and an operating rotating rod 307 is embedded inside the sealing gasket 309. An activity groove 308 is formed on the surface of the sealing sleeve 301, and the operating rotating rod 307 slides up and down inside the activity groove 308. One end of the sealing gasket 309 is fixedly connected to a central rod 302. The end of the central rod 302 is connected to a special guiding block 305. A filtering ring 306 is connected to the top surface of the guiding block 305. A filtering net 303 is connected to the surface of the central rod 302. Through the setting of the filtering net 303, particulate matter in the cleaning liquid can be filtered and separated, and during the flow of the water flow, the filtering net 303 can also separate and cut floccules in the cleaning liquid.

[0043] An embedded sleeve 304 is embedded inside the central rod 302. The operating rotating rod 307 is connected to the embedded sleeve 304. A partition block 311 is embedded inside the embedded sleeve 304. Protrusions 312 are connected to both sides of the partition block 311. An air pipe 310 is embedded inside the operating rotating rod 307, and the air pipe 310 extends into the embedded sleeve 304.

[0044] In order to improve the quality of cleaning, by changing the form of the flowing water, different effects are brought to the cleaning of the PCBA and semiconductor surfaces by the sprayed water flow. After the cleaning liquid is transported to the inside of the spray pipe 203 on the JCI, due to the settings of the central rod 302 and the filter screen 303, the inside of the spray pipe 203 on the JCI is divided into two spaces. Thus, the cleaning liquid transported to the inside of the spray pipe 203 on the JCI is guided to the upper half of the spray pipe 203 on the JCI through the inclined setting of the flow guiding block 305. The inclined setting of the flow guiding block 305 can reduce the impact of the water flow and has the function of guiding the water flow. When the cleaning liquid enters the upper half of the spray pipe 203 on the JCI, the cleaning liquid will pass through the filter screen 303 and reach the lower half of the spray pipe 203 on the JCI. Subsequently, the lower half of the spray pipe 203 on the JCI is filled, and the cleaning liquid overflows. The overflowed cleaning liquid flows into the inside of the JCI hole 216 through the embedded sleeve 304, and at this time, the cleaning liquid is sprayed out. After the cleaning liquid enters the inside of the embedded sleeve 304, since the flow velocity of the cleaning liquid inside is relatively large, part of the air will be extracted into the inside of the embedded sleeve 304 through the air pipe 310. After the addition of air, the cleaning liquid is filled with air. When the air-filled cleaning liquid is sprayed out, the rupture of the bubbles will generate tiny impact forces, and these impact forces can assist the cleaning liquid to more effectively strip the pollutants on the PCBA and semiconductor surfaces. For some impurities that are more firmly attached, the additional force generated by the rupture of the bubbles can help the cleaning liquid penetrate into the tiny gaps between the impurities and the PCBA and semiconductor surfaces, making the impurities easier to be removed. In addition, the presence of air may provide a more active reaction environment for certain chemical components in the cleaning liquid. When the cleaning liquid contains substances that require oxygen to participate in the reaction, the mixing of air can increase the concentration of oxygen and accelerate the progress of the chemical reaction. This helps to decompose or dissolve specific pollutants on the PCBA and semiconductor surfaces, improving the cleaning efficiency and effect. After the cleaning is completed, the cleaning liquid containing air leaves less residue on the PCBA and semiconductor surfaces. Due to the presence of air, the cleaning liquid is more likely to slide off or be dried on the PCBA and semiconductor surfaces under the action of gravity or external force, reducing the potential impact of the cleaning liquid residue on the subsequent processing or performance of the PCBA and semiconductor, and reducing the risks of short circuit and corrosion caused by the cleaning liquid residue.

[0045] In addition, since a partition block 311 is further provided inside the embedded sleeve 304 and the partition block 311 is slidably connected to the embedded sleeve 304, when water flows through the embedded sleeve 304, the partition block 311 will be washed and embedded into the interior of the JCI hole 216. At this time, after the water flow passes through the interior of the embedded sleeve 304, it will be divided into two streams. The original single stream of water will be divided into two streams after passing through the partition block 311, and the two divided streams of water can impact different positions of the PCBA and semiconductor components. With the arrangement of the bump 312, after the water flow enters the interior of the embedded sleeve 304, the size of the internal channel is changed through the arc design of the bump 312. In this way, when the water flow passes through the embedded sleeve 304, it is gradually compressed first and then gradually released, which can increase the flow velocity of the water flow and improve the penetration of the cleaning liquid.

[0046] PCBA and semiconductor components usually have complex structures with many tiny gaps, pins, and grooves. After a single stream of water is divided into two streams, they can respectively impact different positions of the PCBA and semiconductor components, effectively expanding the cleaning coverage. When cleaning a chip with dense pins, a single stream of water may be difficult to reach the gaps of all pins simultaneously, while the two divided streams of water can enter these gaps from different angles to ensure that each pin can be fully cleaned and reduce cleaning dead spots. Most importantly: Turbulence will occur in the space between the two streams of water. Due to the differences in the velocity, direction, and pressure of the two streams of water, in the area where they approach each other, the water flows will interfere with each other, forming irregular turbulence. Turbulence can increase the contact area and contact time between the cleaning liquid and the surfaces of the PCBA and semiconductor, enabling the cleaning agent in the cleaning liquid to react more fully with the pollutants, further improving the cleaning effect. The pressure difference between the water flows will cause the cleaning liquid to form a tiny circulating flow on the surfaces of the PCBA and semiconductor. When the two streams of water meet at a specific position, a superimposed impact force will be generated, further enhancing the penetration ability of the cleaning liquid, making the cleaning more thorough, helping to quickly carry away the pollutants washed off, preventing the pollutants from reattaching to the surfaces of the PCBA and semiconductor, maintaining the cleanliness of the cleaning area, and improving the quality and efficiency of the cleaning.

[0047] To provide different cleaning effects, by flipping the operation lever 307, when the operation lever 307 is flipped, it drives the embedded sleeve 304 to rotate. Since the embedded sleeve 304 is embedded inside the central rod 302, when the embedded sleeve 304 rotates, it drives the central rod 302, the filter net 303, and the gasket 309 to rotate accordingly. When the embedded sleeve 304 rotates, it will be separated from the JCI hole 216, and at this time, the cleaning liquid can be directly sprayed out from the inside of the JCI hole 216. Since the flow of the cleaning liquid does not pass through the embedded sleeve 304, the sealing sleeve 301 installed inside the embedded sleeve 304 cannot attract the outside air into the inside. At this time, there are not many bubbles in the cleaning liquid, and the force of the cleaning liquid sprayed onto the PCBA and semiconductor components is greater, and the splashing effect of the cleaning liquid is more obvious.

[0048] In addition, by adjusting the position of the embedded sleeve 304, when adjusting the position, the operation lever 307 can be lifted, so that the operation lever 307 drives the gasket 309 to slide inside the sealing sleeve 301. Thus, the movement of the operation lever 307 drives the movement of the embedded sleeve 304. When the embedded sleeve 304 slides upward, there is a gap between the embedded sleeve 304 and the upper spray pipe 203 of the JCI. The existence of the gap allows the cleaning liquid to flow to the lower spray pipe 206 of the JCI. By raising or lowering the embedded sleeve 304, the size of the gap is changed, thereby changing the amount of the cleaning liquid sprayed.

[0049] The technical scope of the present invention is not limited to the content described above. Those skilled in the art can make various deformations and modifications to the above embodiments without departing from the technical idea of the present invention, and these deformations and modifications should all fall within the protection scope of the present invention.

Claims

1. A nozzle mechanism and a cleaning machine for PCBA and semiconductor, characterized in that: The cleaning machine comprises a cleaning machine body, wherein a spray pipe assembly and a conventional spray head are installed inside the cleaning machine body, wherein the spray pipe assembly and the conventional spray head are arranged in parallel inside the cleaning machine body, wherein the spray pipe assembly comprises an upper spray pipe bracket, wherein a JCI upper spray pipe fixing plate is fixedly connected to one side surface of the upper spray pipe bracket by a thread, wherein a welding fixing plate is also installed on the cleaning machine body, wherein an upper busbar of JCI is connected to the inner side of the welding fixing plate, wherein a spray rod fixing seat is provided at the front end of the upper busbar of JCI, wherein an upper spray pipe of JCI is embedded inside the upper busbar of JCI, wherein the upper busbar of JCI The upper spray pipe is installed between the JCI upper spray pipe fixing plate and the JCI upper busbar. The surface of the JCI upper spray pipe embedded in the spray rod fixing seat is provided with a sealing ring installation groove. Two O-rings are installed inside the sealing ring installation groove. The front end of the JCI upper spray pipe is connected with a fixing bolt. The rear end of the JCI upper spray pipe is connected with an angle adjustment plate. The fixing bolt passes through the inside of the spray rod fixing seat and rotates 90° to be embedded in the inside of the JCI upper busbar. The outer side of the welding fixing plate is connected with an internal thread straight-through. The outer surface of the internal thread straight-through is sleeved with a Teflon gasket. The cleaning machine body is also provided with a JCI lower fixed plate support frame and a JCI lower bus. The top of the JCI lower fixed plate support frame is fixedly connected to the JCI lower spray pipe fixing plate by threads. The JCI lower spray pipe is installed between the JCI lower spray pipe fixing plate and the JCI lower bus. The JCI lower spray pipe is arranged directly below the JCI upper spray pipe. The bottom end of the JCI upper spray pipe is provided with a JCI hole, and the JCI hole is used to guide the JCI water flow.

2. The PCBA and semiconductor cleaning machine nozzle mechanism and cleaning machine as claimed in claim 1, characterized in that: The JCI upper bus and the welding fixing plate are fixedly connected together, the JCI upper bus and the flow holes opened inside the welding fixing plate are welded together, the JCI upper bus and the inside of the welding fixing plate are connected, the JCI upper bus is fixed in the inner cavity of the cleaning machine, and the Teflon gasket passes through the internal thread and is aligned with the welding fixing plate and the inner cavity hole of the cleaning machine and then threadedly connected.

3. The PCBA and semiconductor cleaning machine nozzle mechanism and cleaning machine as claimed in claim 1, characterized in that: The JCI lower busbar has the same structure as the JCI upper busbar. Another set of spray bar fixing seats is arranged on the inner side of the JCI lower busbar, and another set of welding fixing plates, Teflon gaskets and internal thread straight-throughs are arranged on the outer side of the JCI lower busbar.

4. The PCBA and semiconductor cleaning machine nozzle mechanism and cleaning machine as claimed in claim 1, characterized in that: An end of the JCI upper spray pipe away from the JCI upper bus is connected to an angle adjustment plate, and the angle adjustment plate is fixedly connected to the outer side of the JCI upper spray pipe fixing plate. The JCI upper spray pipe passes through the JCI upper spray pipe fixing plate and the interior of the angle adjustment plate and extends to the outside.

5. The PCBA and semiconductor cleaning machine nozzle mechanism and cleaning machine as claimed in claim 4, characterized in that: The JCI upper spray pipe is rotatably connected to the JCI upper spray pipe fixing plate, and the JCI upper spray pipe is rotated to adjust the inclination angle of the JCI hole.

6. The PCBA and semiconductor cleaning machine nozzle mechanism and cleaning machine as claimed in claim 1, characterized in that: Angle scale lines are arranged on the angle adjustment plate, and the angle adjustment plate is used to mark the rotation angle of the JCI upper spray pipe.

7. The PCBA and semiconductor cleaning machine nozzle mechanism and cleaning machine as claimed in claim 1, characterized in that: The O-ring and the sealing ring installation groove are embedded in the interior of the JCI upper busbar, the outer wall of the O-ring is tightly fitted to the inner wall of the JCI upper busbar, and the O-ring is used for sealing connection between the JCI upper spray pipe and the JCI upper busbar.

8. The PCBA and semiconductor cleaning machine nozzle mechanism and cleaning machine as claimed in claim 1, characterized in that: The fixing bolt is horizontally arranged on the JCI upper spray pipe, and the JCI upper spray pipe is used to lock the connection between the JCI upper spray pipe and the JCI upper busbar.

9. The PCBA and semiconductor cleaning machine nozzle mechanism and cleaning machine as claimed in claim 1, characterized in that: The JCI holes opened on the JCI upper spray pipe and the JCI holes opened on the JCI lower spray pipe correspond to each other, the JCI holes opened on the JCI upper spray pipe are vertically downward, and the JCI holes opened on the JCI lower spray pipe are vertically upward.

10. The PCBA and semiconductor cleaning machine nozzle mechanism and cleaning machine as claimed in claim 9, characterized in that: The JCI holes formed on the JCI upper spray pipe and the JCI lower spray pipe are vertically corresponding to the surfaces of the PCBA and the semiconductor object.

Images