Multi-sample-holder compatible sample transfer manipulator in ultrahigh vacuum and sample transfer method of multi-sample-holder compatible sample transfer manipulator

Abstract

The invention discloses a sample transfer manipulator compatible with multiple sample racks in ultrahigh vacuum and a sample transfer method thereof, and relates to the technical field of sample transfer manipulators, the sample transfer manipulator comprises a sample transfer fork, the top end of the sample transfer fork is provided with a 2-inch wafer gripper, the bottom end of the sample transfer fork is provided with a 4-inch wafer gripper, and one side of the sample transfer fork is provided with a sample grabbing mechanism; the sample grabbing mechanism comprises a sleeve, and a first clamping groove and a second clamping groove are formed in the sleeve. According to an ultrahigh vacuum system of an Omicro MBE and STM system, a Unisoku MBE and STM system, a 2-inch wafer MBE and a 4-inch wafer MBE, the sample transferring mechanical arm and the sample storing mechanism which can be compatible with four kinds of sample frames are manufactured, and the four kinds of sample frames can be grabbed and stored in the same vacuum cavity. Therefore, only one ultra-high vacuum suitcase needs to be manufactured by using the ultra-high vacuum glove box, and the problem that samples are directly transferred into the glove box protected by argon from the four different ultra-high vacuum systems without passing through the atmosphere can be solved.

Description

Technical Field

[0001] The present invention relates to the technical field of sample transfer manipulators, and in particular to a multi-sample holder compatible sample transfer manipulator in ultra-high vacuum and a sample transfer method thereof. Background Art

[0002] Quantum computers require superconducting Josephson junctions and quantum dots as qubits. To fabricate superconducting Josephson junction devices from two-dimensional thin films, after taking them out of the ultra-high vacuum chamber, they need to be taken to a glove box protected by argon for operations such as electrode evaporation. During the process of taking the sample from ultra-high vacuum to the atmosphere, the sample will be contaminated by oxygen oxidation, moisture deliquescence, dust, etc. in the air, thus greatly affecting the preparation research of two-dimensional thin films. The ultra-high vacuum environment provided by the stainless steel chamber for molecular beam epitaxy can reach a vacuum degree of 1e-10 Torr. As the ceiling of the environment for material growth and device preparation, it can achieve atomic-scale flatness on the surface of the device. If the sample can be directly transferred from the ultra-high vacuum chamber to the glove box through an ultra-high vacuum suitcase, this method will be solved.

[0003] For the ultra-high vacuum systems of Omicron MBE and STM systems, Unisoku MBE and STM systems, 2-inch wafer MBE, and 4-inch wafer MBE, it is necessary to manufacture ultra-high vacuum suitcases with four different sample transfer mechanisms, and single-time transfer a single sample holder from different systems to the transition chamber of the suitcase and then to the glove box protected by argon. For the ultra-high vacuum systems of Omicron MBE and STM systems, Unisoku MBE and STM systems, 2-inch wafer MBE, and 4-inch wafer MBE, it is necessary to manufacture ultra-high vacuum suitcases with four different sample transfer mechanisms, and single-time transfer a single sample holder from different systems to the transition chamber of the suitcase and then to the glove box protected by argon. This operation method is relatively inefficient and cumbersome. Summary of the Invention

[0004] In order to solve the problems mentioned in the above background art, the present invention provides a multi-sample holder compatible sample transfer manipulator in ultra-high vacuum and a sample transfer method thereof.

[0005] In order to achieve the above object, the present invention adopts the following technical solutions: A multi-sample holder compatible sample transfer manipulator in ultra-high vacuum, including a sample transfer fork, a 2-inch wafer gripper is provided at the top end of the sample transfer fork, a 4-inch wafer gripper is provided at the bottom end of the sample transfer fork, and a sample grasping mechanism is provided on one side of the sample transfer fork; The sample grasping mechanism includes a sleeve, a first card slot and a second card slot are respectively opened on the sleeve, and a displacement stator and a return spring are movably installed in the sleeve; A rotating stator is installed inside the displacement stator. A third clamping groove is formed in the displacement stator, and a first limiting post is fixed on the rotating stator. The first limiting post extends to the outside of the displacement stator through the third clamping groove, and the first limiting post extends to the outside of the sleeve through the first clamping groove. A second limiting post is fixed on the displacement stator, and the second limiting post extends to the outside of the sleeve through the first clamping groove.

[0006] Preferably, a rectangular opening is formed at one end of the displacement stator close to the opening of the sleeve. A rotating through hole is provided at the middle position of the rectangular opening. A clamping groove is formed at one end of the rotating stator close to the rectangular opening. The width of the clamping groove matches the width of the rectangular opening.

[0007] Preferably, the first clamping groove includes a displacement guiding groove for guiding the first limiting post and the second limiting post to displace along the axial direction of the sleeve and a rotating guiding groove for guiding the first limiting post to rotate independently.

[0008] Preferably, the 2-inch wafer gripper includes a plurality of first limiting bolts, and the 4-inch wafer gripper includes a plurality of second limiting bolts.

[0009] Preferably, the bracket body of the sample transfer fork is made of 304L stainless steel. A quick-release joint connected to the sample transfer rod is provided on one side of the sample transfer fork away from the sample gripping mechanism.

[0010] A sample transfer method for a multi-sample rack compatible sample transfer manipulator in ultra-high vacuum includes the following steps: S1: Transfer the Omicron sample rack First, insert the transfer positioning component of the Omicron sample rack into the clamping groove of the rotating stator through the rectangular opening. The transfer positioning component of the Omicron sample rack includes a connecting part and a positioning part. The thickness of the connecting part is the same as that of the positioning part, and the width of the connecting part is smaller than the width of the positioning part. The width of the connecting part matches the diameter of the rotating through hole. Then rotate the gripping mechanism by ninety degrees so that the first limiting post rotates to the position of the rotating guiding groove of the first clamping groove. A limiting groove is provided at the end of the rotating guiding groove position. The elastic force of the return spring will push the first limiting post to be stuck in the limiting groove. Since the positioning part is rotationally misaligned with the rectangular opening and the width of the positioning part is greater than the width of the notch of the rectangular opening, the Omicron sample rack can be locked, realizing the gripping of the Omicron sample rack. Reverse the above operations to realize the operation of returning the Omicron sample rack to the sample storage position; S2: Transfer the Unisoku sample rack First, insert the positioning posts of the Unisoku sample holder into the sleeve. The third limiting post on the positioning post moves into the second card slot, and the displacement stator is pushed to compress the return spring and move. Both the first limiting post and the second limiting post move along the displacement guiding groove of the first card slot. Rotate the grasping mechanism counterclockwise by 90 degrees, and the return spring pushes the third limiting post to be stuck in the second card slot, realizing the grasping and fixing of the Unisoku sample holder. Reverse the above operations to realize the operation of returning the Unisoku sample holder to the sample storage position. S3: Grasping of 2-inch wafer sample Rotate the sample transfer rod to make the side of the 2-inch wafer gripper face upward, and remove the 2-inch wafer sample from the sample storage table through the 2-inch wafer gripper to realize sample transfer. S4: Grasping of 4-inch wafer sample Rotate the sample transfer rod to make the side of the 4-inch wafer gripper face upward, and the 4-inch wafer gripper removes the 4-inch wafer sample from the sample storage table to realize sample transfer.

[0011] Compared with the prior art, the beneficial effects of the present invention are as follows: 1. Strong compatibility: For the ultra-high vacuum systems of Omicron MBE and STM systems, Unisoku MBE and STM systems, 2-inch wafer MBE, and 4-inch wafer MBE, the manufactured sample transfer manipulator and sample storage mechanism can be compatible with 4 types of sample holders, can grasp 4 different sample holders and store them in the same vacuum chamber, solving the problem of sample transfer in different systems.

[0012] 2. Simplify the operation process: In the past, for the above different ultra-high vacuum systems, it was necessary to manufacture four different ultra-high vacuum portable boxes with sample transfer mechanisms, and the operation was inefficient and cumbersome. The present invention only needs to manufacture one ultra-high vacuum portable box to realize the direct transfer of samples from the above four different ultra-high vacuum systems into the argon-protected glove box without passing through the atmosphere, simplifying the operation process and improving work efficiency.

[0013] 3. Reasonable structure design: The top of the sample transfer fork is provided with a 2-inch wafer gripper, the bottom is provided with a 4-inch wafer gripper, and a sample grasping mechanism is provided on one side. The components such as the sleeve, displacement stator, and rotation stator of the sample grasping mechanism cooperate, and the grasping and fixing of different sample holders are realized through structures such as card slots and limiting posts. The design is reasonable and the operation is reliable. The present invention manufactures a sample transfer manipulator and a sample storage mechanism that can be compatible with four types of sample holders for the ultra-high vacuum systems of Omicron MBE and STM systems, Unisoku MBE and STM systems, 2-inch wafer MBE, and 4-inch wafer MBE. The manipulator can grasp four types of sample holders and store them in the same vacuum chamber. Therefore, only by manufacturing an ultra-high vacuum suitcase with it can the problem of directly transferring samples from the above four different ultra-high vacuum systems into an argon-protected glove box without passing through the atmosphere be solved. Description of the Drawings

[0014] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0015] Figure 1 Front view of the sample transfer fork of the present invention; Figure 2 First perspective three-dimensional view of the sample transfer fork of the present invention; Figure 3 Second perspective three-dimensional view of the sample transfer fork of the present invention; Figure 4 First perspective three-dimensional view of the sample grasping mechanism of the present invention; Figure 5 Front view of the sample grasping mechanism of the present invention; Figure 6 Right view of the sample grasping mechanism of the present invention; Figure 7 Second perspective three-dimensional view of the sample grasping mechanism of the present invention; Figure 8 Exploded view of the sample grasping mechanism of the present invention; Figure 9 Front perspective cross-sectional view of the sample grasping mechanism of the present invention; Figure 10 Schematic diagram of the Unisoku sample holder structure of the present invention; Figure 11 Schematic diagram of the Omicron sample holder structure of the present invention; Figure 12 Schematic diagram of the matching of the sample transfer fork of the present invention with each sample holder; Figure 13 Schematic diagram of the 2-inch wafer gripper of the present invention grasping a 2-inch wafer sample; Figure 14 Schematic diagram of the 4-inch wafer gripper of the present invention grasping a 4-inch wafer sample; Figure 15 Schematic diagram of the state of the Omicron sample rack grasped by the sample grabbing mechanism of the present invention; Figure 16 Schematic diagram of the state of the Unisoku sample rack grasped by the sample grabbing mechanism of the present invention; In the figure: 1. Sample transfer fork; 101. 2-inch wafer gripper; 1011. First limit bolt; 102. 4-inch wafer gripper; 1021. Second limit bolt; 2. Sample grabbing mechanism; 201. Sleeve; 2011. First card slot; 2012. Second card slot; 203. Displacement stator; 2031. Second limit post; 2032. Third card slot; 2033. Rectangular opening; 2034. Rotation through hole; 204. Rotation stator; 2041. First limit post; 2042. Clamping groove; 3. Unisoku sample rack; 4. Omicron sample rack; 5. 4-inch wafer sample; 6. 2-inch wafer sample. Detailed implementation mode

[0016] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are some, but not all, of the embodiments of the present invention. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0017] Embodiment 1 Refer to Figure 1-16 , a multi-sample-rack compatible sample transfer manipulator in ultra-high vacuum, including a sample transfer fork 1, a 2-inch wafer gripper 101 is provided at the top of the sample transfer fork 1, a 4-inch wafer gripper 102 is provided at the bottom of the sample transfer fork 1, and a sample grabbing mechanism 2 is provided on one side of the sample transfer fork 1; The sample grabbing mechanism 2 includes a sleeve 201, a first card slot 2011 and a second card slot 2012 are respectively opened on the sleeve 201, and a displacement stator 203 and a return spring 202 are movably installed in the sleeve 201; A rotation stator 204 is installed inside the displacement stator 203, a third card slot 2032 is opened on the displacement stator 203, a first limit post 2041 is fixed on the rotation stator 204, the first limit post 2041 extends to the outside of the displacement stator 203 through the third card slot 2032, and the first limit post 2041 extends to the outside of the sleeve 201 through the first card slot 2011. A second limit post 2031 is fixed on the displacement stator 203, and the second limit post 2031 extends to the outside of the sleeve 201 through the first card slot 2011.

[0018] Among them, a rectangular opening 2033 is provided at one end of the displacement stator 203 close to the opening of the sleeve 201. A rotation through-hole 2034 is provided at the middle position of the rectangular opening 2033. A clamping groove 2042 is provided at one end of the rotation stator 204 close to the rectangular opening 2033. The width of the clamping groove 2042 matches the width of the rectangular opening 2033.

[0019] Among them, the first clamping groove 2011 includes a displacement guiding groove for guiding the first limiting post 2041 and the second limiting post 2031 to displace along the axial direction of the sleeve 201 and a rotation guiding groove for guiding the first limiting post 2041 to rotate independently.

[0020] Among them, the 2-inch wafer gripper 101 includes a plurality of first limiting bolts 1011, and the 4-inch wafer gripper 102 includes a plurality of second limiting bolts 1021.

[0021] Among them, the bracket body of the sample transfer fork 1 is made of 304L stainless steel. A quick-release joint connected to the sample transfer rod is provided on one side of the sample transfer fork 1 away from the sample grasping mechanism 2.

[0022] Embodiment 2 Refer to Figure 1-16 , a sample transfer method of a multi-sample rack compatible sample transfer manipulator in ultra-high vacuum, including the following steps: S1: Transfer the Omicron sample rack 4 First, insert the transfer positioning component of the Omicron sample rack 4 into the clamping groove 2042 of the rotation stator 204 through the rectangular opening 2033. The transfer positioning component of the Omicron sample rack 4 includes a connecting part 401 and a positioning part 402. The thickness of the connecting part 401 is the same as that of the positioning part 402, and the width of the connecting part 401 is smaller than the width of the positioning part 402. The width of the connecting part 401 matches the diameter of the rotation through-hole 2034. Then rotate the grasping mechanism 2 by ninety degrees so that the first limiting post 2041 rotates to the position of the rotation guiding groove of the first clamping groove 2011. A limiting groove is provided at the end of the rotation guiding groove position. The elastic force of the return spring 202 will push the first limiting post 2041 to be stuck in the limiting groove. Since the positioning part 402 is rotationally misaligned with the rectangular opening 2033 and the width of the positioning part 402 is greater than the slot width of the rectangular opening 2033, the Omicron sample rack 4 can be locked, realizing the grasping of the Omicron sample rack 4. Reverse the above operations to realize the operation of returning the Omicron sample rack 4 to the sample storage position; S2: Transfer the Unisoku sample rack 3 First, insert the positioning post 301 of the Unisoku sample holder 3 into the sleeve 201. The third limiting post 302 on the positioning post 301 moves into the second card slot 2012, and the displacement stator 203 is pushed to compress the return spring 202 and move. Both the first limiting post 2041 and the second limiting post 2031 move along the displacement guiding groove of the first card slot 2011. Rotate the grasping mechanism 2 counterclockwise by ninety degrees, and the return spring 202 pushes the third limiting post 302 to be stuck in the second card slot 2012, achieving the grasping and fixing of the Unisoku sample holder 3. Reverse the above operations to achieve the operation of sending the Unisoku sample holder 3 back to the sample storage position; S3: Grasping of 2-inch wafer sample 6 Rotate the sample transfer rod so that one side of the 2-inch wafer gripper 101 faces upward, and remove the 2-inch wafer sample 6 from the sample storage table through the 2-inch wafer gripper 101 to achieve sample transfer; S4: Grasping of 4-inch wafer sample 5 Rotate the sample transfer rod so that one side of the 4-inch wafer gripper 102 faces upward, and the 4-inch wafer gripper 102 removes the 4-inch wafer sample 5 from the sample storage table to achieve sample transfer.

[0023] Among them, MBE is molecular beam epitaxy (an epitaxial film formation method), and STM is a scanning tunneling microscope.

[0024] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation to the present invention.

[0025] In the present invention, unless otherwise clearly specified and limited, the terms "set", "install", "connect", "couple", "fix", etc. should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or integrated; it can be a mechanical connection, a direct connection, or an indirect connection through an intermediate medium, and it can be the communication inside two elements or the interaction relationship between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0026] The control method of the present invention is automatically controlled by a controller. The control circuit of the controller can be realized by simple programming by those skilled in the art. The provision of power supply also belongs to the common general knowledge in the art. Moreover, the present invention is mainly used to protect mechanical devices. Therefore, the control method and circuit connection of the present invention will not be explained in detail herein.

[0027] The above is only the preferred specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present invention, according to the technical solution and inventive concept of the present invention, makes equivalent substitutions or changes, and all should be covered within the protection scope of the present invention.

Claims

1. An ultra-high vacuum multi-sample rack compatible sample transfer robot, comprising a sample transfer fork (1), characterized in that: A 2-inch wafer gripper (101) is provided at the top end of the sample transfer fork (1), a 4-inch wafer gripper (102) is provided at the bottom end of the sample transfer fork (1), and a sample grabbing mechanism (2) is provided on one side of the sample transfer fork (1); The sample grabbing mechanism (2) comprises a sleeve (201), the sleeve (201) being provided with a first clamping groove (2011) and a second clamping groove (2012), respectively, and a displacement stator (203) and a return spring (202) being movably installed in the sleeve (201); A rotating stator (204) is installed inside the displacement stator (203); a third slot (2032) is provided on the displacement stator (203); a first limiting column (2041) is fixed on the rotating stator (204); the first limiting column (2041) extends to the outside of the displacement stator (203) through the third slot (2032); and the first limiting column (2041) extends to the outside of the sleeve (201) through the first slot (2011); a second limiting column (2031) is fixed on the displacement stator (203); and the second limiting column (2031) extends to the outside of the sleeve (201) through the first slot (2011).

2. The ultra-high vacuum multi-sample rack compatible sample transfer robot according to claim 1, characterized in that: A rectangular opening (2033) is provided at one end of the displacement stator (203) close to the opening of the sleeve (201), a rotation through hole (2034) is provided in the middle of the rectangular opening (2033), and a clamping groove (2042) is provided at one end of the rotation stator (204) close to the rectangular opening (2033), the width of the clamping groove (2042) matching the width of the rectangular opening (2033).

3. The ultra-high vacuum multi-sample rack compatible sample transfer robot according to claim 2, characterized in that: The first clamping groove (2011) comprises a displacement guide groove for guiding the first limiting column (2041) and the second limiting column (2031) to axially displace along the sleeve (201) and a rotation guide groove for guiding the first limiting column (2041) to rotate independently.

4. The ultra-high vacuum multi-sample rack compatible sample transfer robot according to claim 3, characterized in that: The 2-inch wafer gripper (101) comprises a plurality of first limiting bolts (1011), and the 4-inch wafer gripper (102) comprises a plurality of second limiting bolts (1021).

5. The ultra-high vacuum multi-sample rack compatible sample transfer robot according to claim 1, characterized in that: The support body of the sample transfer fork (1) is made of 304L stainless steel, and a quick-release joint connected to the sample transfer rod is provided on the side of the sample transfer fork (1) away from the sample grabbing mechanism (2).

6. A method for transferring samples by a multi-sample rack compatible sample transfer robot in ultra-high vacuum, implemented by a multi-sample rack compatible sample transfer robot in ultra-high vacuum as claimed in any one of claims 1 to 5, characterized in that: The following steps are involved: S1: Transfer Omicron Sample Holder (4) First, the transfer positioning component of the Omicron sample holder (4) is inserted into the clamping groove (2042) of the rotating stator (204) through the rectangular opening (2033). The transfer positioning component of the Omicron sample holder (4) comprises a connecting portion (401) and a positioning portion (402). The thickness of the connecting portion (401) and the positioning portion (402) are the same, and the width of the connecting portion (401) is smaller than the width of the positioning portion (402). The width of the connecting portion (401) matches the diameter of the rotating through hole (2034). Then, the grasping mechanism (2) is rotated ninety degrees so that the first limiting column (2041) ) is rotated to the rotation guide slot position of the first clamping slot (2011), a limit slot is provided at the end of the rotation guide slot position, and the elastic force of the reset spring (202) pushes the first limit post (2041) to be stuck in the limit slot. Since the positioning portion (402) and the rectangular opening (2033) are rotationally misaligned, the width of the positioning portion (402) is greater than the slot width of the rectangular opening (2033), so that the Omicron sample rack (4) can be locked, thereby realizing the grabbing of the Omicron sample rack (4). The above operation is reversed to realize the operation of returning the Omicron sample rack (4) to the sample storage position; S2: Transfer the Unisoku sample holder (3) First, the positioning column (301) of the Unisoku sample rack (3) is inserted into the sleeve (201), and the third limiting column (302) on the positioning column (301) is moved into the second slot (2012), pushing the displacement stator (203) to compress the reset spring (202) to move, and the first limiting column (2041) and the second limiting column (2031) are both moved along the displacement guide groove of the first slot (2011), and the grasping mechanism (2) is rotated counterclockwise by 90 degrees, and the reset spring (202) pushes the third limiting column (302) to be clamped in the second slot (2012), thereby realizing the grasping and fixing of the Unisoku sample rack (3), and the above operation is reversed to realize the operation of returning the Unisoku sample rack (3) to the sample storage position; S3: 2-inch wafer sample (6) grabbing Rotate the sample transfer rod so that one side of the 2-inch wafer gripper (101) faces upward, and remove the 2-inch wafer sample (6) from the sample storage table through the 2-inch wafer gripper (101) to achieve sample transfer; S4: 4-inch wafer sample (5) grabbing The sample transfer rod is rotated so that one side of the 4-inch wafer gripper (102) faces upward, and the 4-inch wafer gripper (102) takes the 4-inch wafer sample (5) off the sample storage table to achieve sample transfer.

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