A heterogeneous integrated fiber-coupled module based on phase change cooling

Abstract

The present invention relates to a heterogeneous integrated optical fiber coupling module based on phase change cooling. The module solves the technical problems of uneven chip temperature rise, high temperature rise, poor heat dissipation effect, and low internal space utilization when the optical fiber coupling module adopts a phase change cooling mode and uses an existing optical fiber coupling module housing. The present invention adopts mounting steps to arrange semiconductor laser chips. A hollow portion is provided inside the mounting steps. An extension portion is provided on the inner wall of the phase change cooling module. The extension portion extends into the hollow portion. The bottom ends of all hollow portions are equidistant from the semiconductor laser chip, so that the heat conduction distance from each semiconductor laser chip to the phase change cooling module is equal, and the chip temperature is consistent and the heat dissipation effect is good. The optical fiber coupling module fully utilizes the offset space of the mounting steps to install the chip, and mounting steps are provided on both the top plate and the bottom plate, effectively combining two optical fiber modules into one, thereby improving space and material utilization.

Description

Technical Field

[0001] The present invention relates to an optical fiber coupling module, and in particular to a heterogeneous integrated optical fiber coupling module based on phase change cooling. Background Art

[0002] Fiber-coupled modules are used in the optical field to convert electrical energy into light energy. The main electro-optical conversion component is a semiconductor laser chip. During the conversion process, there is inevitably a conversion efficiency issue. That is, energy that is not converted into light energy is converted into heat and accumulated in the semiconductor laser chip, causing the chip temperature to rise. This temperature rise effect will degrade the optical performance of the chip, resulting in a reduction in its lifespan and efficiency.

[0003] In order to reduce the temperature rise effect caused by this heat accumulation, traditional fiber coupling modules generally use water cooling to dissipate heat. In order to improve the cooling capacity, two water cooling methods are generally used. One is to use an independent water cooling plate 01 placed on the outer shell of the fiber coupling module for heat dissipation. Its structure is as follows: Figure 1 As shown; the second is to process the water cooling channel 02 on the bottom plate of the optical fiber coupling module, and its structure is as follows Figure 2 As shown in the figure, when the chip generates heat, the heat is transferred to the fiber coupling module housing through the steps inside the fiber coupling module. The heat is then removed by the external independent water cooling plate 01 or water cooling channel 02, reducing the chip temperature. To improve heat dissipation, semiconductor laser chips are generally arranged on one side and distributed only on the bottom plate of the fiber coupling module. If the above heat dissipation structure is adopted, the optical geometric configuration of the semiconductor laser chips is determined to be distributed only on the bottom of the module.

[0004] The above-mentioned water-cooling heat dissipation method requires not only an independent water-cooling plate 01 or water-cooling channel 02 and a refrigerant, but also a chiller whose volume and weight are tens or even hundreds of times that of the fiber-optic coupling module to achieve the cooling function. This cooling cycle leads to redundant thermal management volume and weight of the fiber-optic coupling module, which is not conducive to use in highly mobile equipment.

[0005] Based on traditional cooling methods, a new phase change cooling mode has begun to be applied to fiber-coupled modules. This phase change can be solid-liquid or liquid-vapor. The thermal management component structure of this phase change cooling mode is simple, requiring only the phase change material to wrap the fiber-coupled module. However, the fiber-coupled modules used in the existing phase change cooling mode continue to use the fiber-coupled module housing of the traditional water cooling mode, resulting in the following problems:

[0006] 1) The semiconductor laser chip inside the fiber coupling module is placed on a step. The difference in distance between each semiconductor laser chip and the housing leads to different conduction thermal resistance, resulting in uneven and high temperature rise of the chip.

[0007] 2) The shell design of existing fiber coupling modules is unreasonable, resulting in poor heat dissipation effect;

[0008] 3) The semiconductor laser chips are only distributed on one side of the fiber coupling module base plate, resulting in low internal space utilization. Summary of the Invention

[0009] The purpose of the present invention is to solve the technical problems of uneven chip temperature rise, high temperature rise, poor heat dissipation effect and low internal space utilization when the fiber coupling module adopts the phase change cooling mode due to the use of the existing fiber coupling module housing, and to provide a heterogeneous integrated fiber coupling module based on phase change cooling.

[0010] To achieve the above object, the technical solution adopted by the present invention is:

[0011] A heterogeneous integrated fiber coupling module based on phase change cooling includes a phase change cooling module and a fiber coupling module body located within the phase change cooling module. A phase change cooling material is provided between the phase change cooling module and the fiber coupling module body. The module is special in that:

[0012] The fiber coupling module body includes a mounting housing and a plurality of semiconductor laser chips;

[0013] The mounting shell includes a frame, a top plate and a bottom plate, wherein the top plate and the bottom plate are respectively arranged at the top and bottom of the frame; a plurality of mounting steps are respectively arranged on the top plate and the bottom plate, wherein the plurality of mounting steps are arranged along the length direction of the mounting shell, and the outer end surfaces of the plurality of mounting steps arranged on the top plate are located in the same horizontal plane; the outer end surfaces of the plurality of mounting steps arranged on the bottom plate are located in the same horizontal plane, and the heights of the plurality of mounting steps decrease sequentially from one end to the other end of the mounting shell; and the heights of the plurality of mounting steps arranged on the top plate and the bottom plate decrease in opposite directions;

[0014] The inner end surface of the mounting step is located in the mounting housing, and the plurality of semiconductor laser chips are mounted on the inner end surfaces of the plurality of mounting steps;

[0015] The interior of the mounting step is provided with a hollow portion along the height direction, the open end of the hollow portion is located on the outer end surface of the mounting step, the height of the hollow portion is less than the height of the corresponding mounting step, and the inner end surfaces of all the hollow portions are at the same distance from the semiconductor laser chip;

[0016] The phase-change cooling material extends from the open end of the hollow portion to the interior of the hollow portion.

[0017] Furthermore, the plurality of mounting steps provided on the top plate are integrally provided with the top plate, and the plurality of mounting steps provided on the bottom plate are integrally provided with the bottom plate;

[0018] The multiple mounting steps provided on the top plate are divided into two groups, and the two groups of mounting steps are correspondingly provided at two sides close to the top plate. A phase change cold storage tank is provided between the two groups of mounting steps, and the notch of the phase change cold storage tank faces the outside of the mounting shell;

[0019] The multiple mounting steps provided on the bottom plate are divided into two groups. The two groups of mounting steps are correspondingly provided at two sides close to the bottom plate. A phase change cold storage tank is provided between the two groups of mounting steps. The notch of the phase change cold storage tank faces the outside of the mounting shell.

[0020] The phase-change cooling material extends into the phase-change cold storage tank;

[0021] A plurality of heat sinks are arranged in the phase change cold storage tank, and the plurality of heat sinks are arranged at equal intervals along the length direction of the mounting shell, and the two ends of the heat sink are respectively connected to the inner side walls of the two corresponding sets of mounting steps, the inner end surface of the heat sink is connected to the bottom of the phase change cold storage tank, the outer end surface and the outer end surface of the mounting step are located in the same plane, and the heat sink and the mounting step are integrally arranged.

[0022] Furthermore, the two groups of mounting steps arranged on the top plate and the two groups of mounting steps arranged on the bottom plate are centrally symmetrical with respect to the three-dimensional geometric center of the mounting shell as a symmetry point.

[0023] Furthermore, the hollow portion is a rectangular groove, a circular groove or an irregular groove.

[0024] Furthermore, the hollow portion is a rectangular groove;

[0025] A plurality of heat dissipating fins are arranged at intervals in the hollow portion along the length direction of the mounting shell, the inner end surfaces of the heat dissipating fins are flush with the inner end surface of the hollow portion, the two ends of the heat dissipating fins are respectively flush with the two inner side walls opposite to the hollow portion, and the outer end surfaces of the heat dissipating fins are located in the same plane as the outer end surface of the mounting step.

[0026] Furthermore, the mounting shell, heat dissipation fins, heat dissipation plate and mounting steps are all made of high thermal conductivity materials.

[0027] Furthermore, the high thermal conductivity material is copper, aluminum, copper alloy or aluminum alloy.

[0028] Furthermore, the phase change cooling material is a solid-liquid phase change material or a liquid-gas phase change material.

[0029] The beneficial effects of the present invention are:

[0030] (1) The present invention provides a heterogeneous integrated fiber coupling module based on phase change cooling, which uses mounting steps to set semiconductor laser chips, and a hollow portion is provided inside the mounting steps, and the phase change cooling material extends into the hollow portion to form a continuum. The inner end faces of all the hollow portions are at the same distance from the semiconductor laser chip, so that the heat conduction distance from each semiconductor laser chip to the phase change cooling material is equal, the thermal resistance is the same, the chip temperature is consistent, and the heat dissipation effect is good; the fiber coupling module makes full use of the offset space of the mounting steps to install the chip, and mounting steps are provided on both the top plate and the bottom plate, effectively combining the two fiber modules into one, thereby improving the space and material utilization.

[0031] (2) The present invention provides a heterogeneous integrated optical fiber coupling module based on phase change cooling, in which heat dissipation fins are provided in the hollow portion and a heat dissipation plate is provided in the phase change cold storage tank, thereby increasing the heat exchange area and improving the heat dissipation effect.

[0032] (3) The hollow portion design of the heterogeneous integrated fiber coupling module based on phase change cooling provided by the present invention reduces the weight of the installation shell.

[0033] (4) The present invention provides a heterogeneous integrated optical fiber coupling module based on phase change cooling, in which a plurality of heat dissipation fins are arranged in the hollow portion. The two ends of the heat dissipation fins are respectively flush with the two inner side walls opposite to the hollow portion, forming a simply supported beam structure, thereby enhancing the mechanical structural strength of the mounting shell.

[0034] (5) The heterogeneous integrated fiber coupling module based on phase change cooling provided by the present invention has installation steps arranged on the bottom plate and the top plate in a centrally symmetrical distribution, which has high space and material utilization, making the entire module more compact and lightweight. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] Figure 1 This is a schematic diagram of the structure of an independent water cooling plate in an existing optical fiber coupling module;

[0036] Figure 2 This is a schematic diagram of the base structure of an existing optical fiber coupling module provided with a water cooling channel;

[0037] Figure 3 Schematic diagram of the structure of an embodiment of a heterogeneous integrated optical fiber coupling module based on phase change cooling of the present invention;

[0038] Figure 4 The three-dimensional structure of the optical fiber coupling module body in the embodiment of the present invention is shown in FIG. Figure 1 ;

[0039] Figure 5 The three-dimensional structure of the optical fiber coupling module body in the embodiment of the present invention is shown in FIG. Figure 2 ;

[0040] Figure 6 1 is an exploded schematic diagram of the optical fiber coupling module body according to an embodiment of the present invention;

[0041] Figure 7 is a schematic structural diagram of an installation step installed on a base plate in an embodiment of the present invention;

[0042] Figure 8 yes Figure 7 sectional view of

[0043] Figure 9 yes Figure 8 A partial enlarged schematic diagram.

[0044] The following are the descriptions of the reference numerals:

[0045] 01-independent water cooling plate, 02-water cooling channel;

[0046] 1-fiber coupling module body, 11-frame, 12-top plate, 13-bottom plate, 14-semiconductor laser chip, 15-mounting step, 151-hollow portion, 152-heat dissipation fins; 16-heat dissipation plate; 2-phase change cooling module. DETAILED DESCRIPTION

[0047] In order to make the purpose, advantages and features of the present invention more clear, the heterogeneous integrated fiber coupling module based on phase change cooling proposed by the present invention is further described in detail below with reference to the accompanying drawings and specific embodiments.

[0048] according to Figure 3-Figure 9 As shown in the figure, the present invention is a heterogeneous integrated optical fiber coupling module based on phase change cooling, comprising a phase change cooling module 2 and an optical fiber coupling module body 1 located in the phase change cooling module 2. A phase change cooling material is provided between the phase change cooling module 2 and the optical fiber coupling module body 1, and the phase change cooling material completely covers the optical fiber coupling module body 1. The structure is as shown in the figure. Figure 3 Compared to conventional liquid cooling, this embodiment employs encapsulated phase change cooling, which is immersion-type and phase change cooling. The phase change cooling material can be a solid-liquid phase change material or a liquid-vapor phase change material. Commonly used solid-liquid phase change materials include paraffin wax, and liquid-vapor phase change materials include low-boiling-point phase change liquids such as polyether. The heat of the semiconductor laser chip 14 is absorbed through the phase change of the material.

[0049] The structure of the fiber coupling module body 1 is as follows Figure 4-Figure 6 As shown, it includes a mounting housing and a plurality of semiconductor laser chips 14. The mounting housing is a hollow rectangular housing, including a frame 11 and a top plate 12 and a bottom plate 13 respectively arranged on the top and bottom of the frame 11.

[0050] Multiple mounting steps 15 are provided on each of the top plate 12 and the bottom plate 13. These steps 15 are arranged along the length of the mounting housing. The inner end surfaces of the mounting steps 15 are located within the mounting housing, and the semiconductor laser chips 14 are mounted on the inner end surfaces of the mounting steps 15. The outer end surfaces of the mounting steps 15 on the top plate 12 and the outer end surfaces of the mounting steps 15 on the bottom plate 13 are located in the same horizontal plane. Furthermore, the height of the mounting steps 15 decreases from one end of the mounting housing to the other, with the mounting steps 15 on the top plate 12 and bottom plate 13 decreasing in opposite directions.

[0051] In this embodiment, the multiple mounting steps 15 provided on the top plate 12 are divided into two groups, and the two groups of mounting steps 15 are correspondingly provided at both sides close to the top plate 12, and a phase change cold storage tank is provided between the two groups of mounting steps 15, and the notch of the phase change cold storage tank faces the outside of the mounting shell, and the multiple mounting steps 15 provided on the top plate 12 are integrally provided with the top plate 12; and the multiple mounting steps 15 provided on the bottom plate 13 are also divided into two groups, and the two groups of mounting steps 15 are correspondingly provided at both sides close to the bottom plate 13, and a phase change cold storage tank is provided between the two groups of mounting steps 15, and the notch of the phase change cold storage tank faces the outside of the mounting shell, and the multiple mounting steps 15 provided on the bottom plate 13 are integrally provided with the bottom plate 13, and the mounting steps 15 located on the bottom plate 13 are as shown Figure 7 shown.

[0052] like Figure 4 As shown, a phase change cold storage tank is provided between the two sets of mounting steps 15, and the phase change cooling material extends into the phase change cold storage tank. A plurality of heat sinks 16 are provided in the phase change cold storage tank. The plurality of heat sinks 16 are arranged at equal intervals along the length direction of the mounting shell, and the ends of the heat sinks 16 are respectively connected to the inner side walls of the two sets of mounting steps 15 provided correspondingly. The heat sinks 16 and the mounting steps 15 are integrally provided, thereby transferring the heat transferred from the semiconductor laser chip 14 to the mounting steps 15 to the heat sinks 16. The inner end surface of the heat sink 16 is connected to the bottom of the phase change cold storage tank. In this way, the mounting steps 15 can transfer heat to the mounting shell, and then conduct it to the heat sink 16. The outer end surface of the heat sink 16 and the outer end surface of the mounting step 15 are located in the same plane. In this way, the heat sink 16 is completely within the phase change cold storage tank, without any redundant protruding parts, and has better integrity. The heat sink 16 will not be broken due to collisions with the protruding parts.

[0053] In order to ensure a reasonable overall layout, the two sets of mounting steps 15 set on the top plate 12 and the two sets of mounting steps 15 set on the bottom plate 13 are centrally symmetrical with the three-dimensional geometric center of the mounting shell as the symmetry point. This two-sided symmetrical chip layout effectively combines the two optical fiber modules into one, thereby improving the overall space and material utilization.

[0054] In order to make the thermal resistance of each semiconductor laser chip 14 equal during heat dissipation, Figure 9 As shown, a hollow portion 151 is defined within the mounting step 15 along its height. The open end of the hollow portion 151 is located on the outer end surface of the mounting step 15. The height of the hollow portion 151 is less than the height of the corresponding mounting step 15, and the inner end surfaces of all hollow portions 151 are equidistant from the semiconductor laser chip 14. The shape of the hollow portion 151 is not unique; it can be a rectangular groove, a circular groove, or an irregular groove. However, for ease of processing and manufacturing, in this embodiment, the hollow portion 151 is a rectangular groove. The phase change cooling material extends through the open end of the hollow portion 151 into the hollow portion 151. This ensures that the heat conduction distance from all semiconductor laser chips 14 to the phase change cooling material is equal, and thus their thermal resistance is also equal. The hollow portion 151, through its hollow design, reduces the weight of the mounting housing.

[0055] In order to further improve the heat dissipation effect, a plurality of heat dissipating fins 152 are arranged at intervals in the hollow portion 151 along the length direction of the mounting shell. The inner end surface of the heat dissipating fin 152 is flush with the inner end surface of the hollow portion 151, and the two ends of the heat dissipating fin 152 are respectively flush with the two inner side walls opposite to the hollow portion 151, and the outer end surface of the heat dissipating fin 152 is located in the same plane as the outer end surface of the mounting step 15. With this design, the heat dissipating fin 152 has no unnecessary protrusions, and the whole module has better integrity. In addition, the two ends of the heat dissipating fin 152 are respectively flush with the two inner side walls opposite to the hollow portion 151, thus forming a simply supported beam structure, which further enhances the mechanical structural strength of the mounting shell.

[0056] The mounting shell, heat dissipation fins 152, heat dissipation plate 16 and mounting step 15 are all made of high thermal conductivity materials, which can transfer excess heat to the phase change cooling module 2 more quickly. High thermal conductivity materials are generally made of copper, aluminum, copper alloy or aluminum alloy.

[0057] In order to verify the overall heat dissipation effect, the following tests were designed:

[0058] A single-tube semiconductor laser chip 14 with an optical power of 30W was used as the test object. The entire fiber-coupled module body 1 used 90 semiconductor laser chips 14. Each semiconductor laser chip 14 had an electro-optical conversion efficiency of 60%. A single semiconductor laser chip 14 generated 20W of heat. Without the hollow structure design, the temperature rise was 45°C. With the hollow structure to enhance heat dissipation, the heat dissipation fins 152 were 1mm thick and arranged at 1mm intervals. The temperature rise of a single semiconductor laser chip 14 was 32°C, a temperature reduction of 29%.

[0059] The embodiments described above are merely descriptions of specific implementation methods of the present invention and are not intended to limit the scope of the present invention. Without departing from the design spirit of the present invention, various modifications and improvements made to the technical solutions of the present invention by ordinary technicians in this field should fall within the scope of protection determined by the claims of the present invention.

Claims

1. A heterogeneous integrated optical fiber coupling module based on phase change cooling, comprising a phase change cooling module (2) and an optical fiber coupling module body (1) located within the phase change cooling module (2), wherein a phase change cooling material is provided between the phase change cooling module (2) and the optical fiber coupling module body (1), and characterized in that: The optical fiber coupling module body (1) comprises a mounting housing and a plurality of semiconductor laser chips (14); The mounting shell comprises a frame (11), a top plate (12) and a bottom plate (13), wherein the top plate (12) and the bottom plate (13) are respectively arranged at the top and bottom of the frame (11); a plurality of mounting steps (15) are respectively arranged on the top plate (12) and the bottom plate (13), wherein the plurality of mounting steps (15) are arranged along the length direction of the mounting shell, and the outer end surfaces of the plurality of mounting steps (15) arranged on the top plate (12) are located in the same horizontal plane; the outer end surfaces of the plurality of mounting steps (15) arranged on the bottom plate (13) are located in the same horizontal plane, and the heights of the plurality of mounting steps (15) decrease in sequence from one end to the other end of the mounting shell; and the heights of the plurality of mounting steps (15) respectively arranged on the top plate (12) and the bottom plate (13) decrease in opposite directions; The inner end surface of the mounting step (15) is located in the mounting housing, and the plurality of semiconductor laser chips (14) are mounted on the inner end surfaces of the plurality of mounting steps (15); The interior of the mounting step (15) is provided with a hollow portion (151) along the height direction, the open end of the hollow portion (151) is located on the outer end surface of the mounting step (15), the height of the hollow portion (151) is less than the height of the corresponding mounting step (15), and the inner end surfaces of all the hollow portions (151) are at the same distance from the semiconductor laser chip (14); The phase-change cooling material extends from the open end of the hollow portion (151) to the interior of the hollow portion (151).

2. The heterogeneous integrated fiber coupling module based on phase change cooling according to claim 1, characterized in that: A plurality of mounting steps (15) provided on the top plate (12) are integrally provided with the top plate (12), and a plurality of mounting steps (15) provided on the bottom plate (13) are integrally provided with the bottom plate (13); A plurality of mounting steps (15) arranged on the top plate (12) are divided into two groups, the two groups of mounting steps (15) being correspondingly arranged at positions on both sides close to the top plate (12), a phase change cold storage tank being arranged between the two groups of mounting steps (15), and a notch of the phase change cold storage tank facing the outside of the mounting shell; The plurality of mounting steps (15) provided on the bottom plate (13) are divided into two groups, the two groups of mounting steps (15) being correspondingly provided at positions on both sides close to the bottom plate (13), a phase change cold storage tank being provided between the two groups of mounting steps (15), and the notch of the phase change cold storage tank being directed toward the outside of the mounting shell; The phase-change cooling material extends into the phase-change cold storage tank; A plurality of heat dissipation plates (16) are arranged in the phase-change cold storage tank, and the plurality of heat dissipation plates (16) are arranged at equal intervals along the length direction of the mounting shell, and the two ends of the heat dissipation plates (16) are respectively connected to the inner side walls of two sets of corresponding mounting steps (15), the inner end surface of the heat dissipation plate (16) is connected to the bottom of the phase-change cold storage tank, and the outer end surface and the outer end surface of the mounting step (15) are located in the same plane, and the heat dissipation plate (16) and the mounting step (15) are arranged integrally.

3. The heterogeneous integrated fiber coupling module based on phase change cooling according to claim 2, characterized in that: The two groups of mounting steps (15) arranged on the top plate (12) and the two groups of mounting steps (15) arranged on the bottom plate (13) are centrally symmetrical with respect to the three-dimensional geometric center of the mounting shell as a symmetry point.

4. The heterogeneous integrated fiber coupling module based on phase change cooling according to claim 3, characterized in that: The hollow portion (151) is a rectangular groove, a circular groove or an irregular groove.

5. The heterogeneous integrated fiber coupling module based on phase change cooling according to claim 3, characterized in that: The hollow portion (151) is a rectangular groove; A plurality of heat dissipation fins (152) are arranged at intervals in the hollow portion (151) along the length direction of the mounting shell, the inner end surface of the heat dissipation fin (152) is flush with the inner end surface of the hollow portion (151), the two ends of the heat dissipation fin (152) are respectively flush with the two inner side walls opposite to the hollow portion (151), and the outer end surface of the heat dissipation fin (152) is located in the same plane as the outer end surface of the mounting step (15).

6. The heterogeneous integrated fiber coupling module based on phase change cooling according to claim 5, characterized in that: The mounting housing, the heat dissipation fins (152), the heat dissipation plate (16), and the mounting step (15) are all made of high thermal conductivity materials.

7. The heterogeneous integrated fiber coupling module based on phase change cooling according to claim 6, characterized in that: The high thermal conductivity material is copper, aluminum, copper alloy or aluminum alloy.

8. The heterogeneous integrated fiber coupling module based on phase change cooling according to claim 1, characterized in that: The phase change cooling material is a solid-liquid phase change material or a liquid-gas phase change material.

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