A method and system for intelligent wiring optimization of HDI circuit boards

Abstract

This invention discloses an intelligent wiring optimization method and system for HDI circuit boards, relating to the field of electronic circuit optimization technology. By setting up an electromagnetic compatibility monitoring module and a thermal management evaluation module, this invention monitors and evaluates the electromagnetic interference index (Em) and heat accumulation index (Thc) of the HDI circuit board in real time, triggering optimization warning signals and generating thermal management optimization suggestions to accurately solve electromagnetic interference and insufficient heat dissipation problems. It improves electromagnetic shielding and heat distribution balance by calculating and evaluating the comprehensive optimization index (COP). Finally, it calculates and evaluates the optimization performance evaluation coefficient (OPE), dynamically adjusts wiring parameters and optimizes paths in real time using a dynamic adjustment module, and iteratively optimizes using a real-time feedback mechanism to ultimately output a wiring scheme that meets the requirements. This solves the problems of low automation and poor optimization effect in existing systems, meeting the high-performance requirements of wearable devices for HDI circuit boards.

Description

Technical Field

[0001] This invention relates to the field of electronic circuit optimization technology, specifically to an intelligent wiring optimization method and system for HDI circuit boards. Background Technology

[0002] HDI (High-Distribution) circuit boards are an advanced printed circuit board technology that developed to meet the demand for thinner and smaller electronic products. Its origins can be traced back to the 1990s, initially used in consumer electronics such as mobile phones and tablets. Through designs with tiny apertures, fine lines, and high layer counts, it improved circuit density and performance. With continuous technological advancements, HDI circuit boards have gradually been applied to high-end fields such as automotive electronics, medical devices, and wearable devices, significantly increasing their wiring complexity. To address issues such as signal integrity, electromagnetic compatibility, and thermal management in multi-layer wiring, wiring optimization systems have emerged. These systems combine computer-aided design with intelligent algorithms to maximize resource utilization and improve performance through precise path planning and wiring parameter optimization. The development of wiring optimization technology has driven the widespread application of HDI circuit boards in high-performance and high-reliability electronic devices.

[0003] However, wiring optimization systems for HDI circuit boards used in wearable devices often have the following technical drawbacks:

[0004] Insufficient electromagnetic compatibility: Wearable devices typically need to operate in a variety of wireless communication environments, and existing wiring optimization systems have limited optimization capabilities in terms of electromagnetic shielding and noise suppression design, which may lead to electromagnetic interference problems;

[0005] Inadequate thermal management capabilities: The high integration of wearable devices leads to higher power density, while existing optimized systems have not fully considered the optimization design of heat dissipation paths during wiring, which may lead to overheating problems when the device is used for a long time.

[0006] Lack of intelligent support: Existing cabling optimization systems have a low degree of automation under complex constraints and fail to effectively utilize machine learning or intelligent algorithms for cabling path planning and dynamic adjustment, resulting in poor overall optimization performance. Summary of the Invention

[0007] To address the shortcomings of existing technologies, this invention provides an intelligent wiring optimization method and system for HDI circuit boards, which solves the technical deficiencies mentioned in the background art.

[0008] To achieve the above objectives, the present invention is implemented through the following technical solution: an intelligent wiring optimization system for HDI circuit boards, comprising an electromagnetic compatibility monitoring module, a thermal management evaluation module, an intelligent wiring planning module, a comprehensive optimization analysis module, and a dynamic adjustment module;

[0009] The electromagnetic compatibility monitoring module is used to monitor electromagnetic interference data generated during the operation of HDI circuit boards in real time, calculate the electromagnetic interference index Em, compare and analyze the electromagnetic interference index Em with the preset electromagnetic interference threshold EMth, and finally trigger an electromagnetic compatibility optimization early warning signal.

[0010] The thermal management evaluation module is used to collect temperature distribution data of high-power areas on the circuit board and calculate the heat accumulation index (Thc). By comparing and evaluating the heat accumulation index (Thc), it determines whether the thermal management capability in the circuit board wiring design meets the requirements and generates thermal management optimization suggestions.

[0011] The intelligent cabling planning module uses machine learning algorithms to take electromagnetic interference-related data and temperature distribution-related data as feature inputs, generates multi-objective cabling schemes through dynamic path planning methods, and finally calculates the comprehensive optimization index (COP) of the multi-objective cabling schemes.

[0012] The comprehensive optimization analysis module is based on the electromagnetic interference index Em, the thermal accumulation index Thc, and the comprehensive optimization index COP. It combines the physical constraints and performance requirements of the circuit board design to calculate and evaluate the optimization performance evaluation coefficient OPE, and finally outputs the comprehensive optimization results, including the optimization qualified results and the optimization unqualified results.

[0013] The dynamic adjustment module dynamically adjusts the wiring parameters and route based on the optimization results of unqualified results, and at the same time establishes and updates the wiring planning results through a real-time feedback mechanism.

[0014] Preferably, the electromagnetic compatibility monitoring module includes an electromagnetic interference calculation unit and an electromagnetic interference assessment unit;

[0015] The electromagnetic interference calculation unit is used to collect electromagnetic interference related data generated during the operation of the HDI circuit board in real time. By collecting radiated interference signals and conducted interference signals during the operation of the circuit board and converting them into digital form, then performing spectrum analysis and time domain decomposition, then extracting key feature parameters and performing dimensionless processing, including signal band strength Sfi, instantaneous peak amplitude Spk, pulse repetition frequency Prf and total interference power Tip, and finally calculating the electromagnetic interference index Em based on the following formula.

[0016]

[0017] Preferably, the electromagnetic interference assessment unit is used to preset the electromagnetic interference threshold EMth, compare and evaluate it with the electromagnetic interference index Em, and trigger the generation of an electromagnetic compatibility optimization early warning signal, as detailed below:

[0018] When the electromagnetic interference index Em ≤ electromagnetic interference threshold EMth: it means that the electromagnetic interference of the HDI circuit board is within a safe range and no additional optimization measures are required.

[0019] When the electromagnetic interference index Em > electromagnetic interference threshold EMth: it indicates that the electromagnetic interference of the HDI circuit board exceeds the safe range, affecting the normal operation of the equipment or causing communication signal interference. At this time, an electromagnetic compatibility optimization warning signal is generated.

[0020] Preferably, the thermal management assessment module includes a heat accumulation calculation unit and a heat accumulation assessment unit;

[0021] The heat accumulation calculation unit is used to collect temperature distribution data in high-power areas of the HDI circuit board in real time. Multiple temperature sensors are arranged in the high-power areas of the HDI circuit board to collect the temperature of each key area in real time. Then, the sensor array records the spatial distribution information of the temperature, and next, it records the temperature change trend over time during the circuit board's operation. Finally, after smoothing, denoising, and dimensionless processing of the collected temperature distribution data, the heat accumulation index (Thc) is calculated using the following formula:

[0022]

[0023] In the formula, Tmax represents the highest temperature of the hotspot in the temperature distribution data, Tavg represents the average temperature in the temperature distribution data, Tgra represents the temperature gradient in the temperature distribution data, Tva represents the thermal fluctuation amplitude in the temperature distribution data, and ln represents the natural logarithm, which is a logarithmic function with the mathematical constant e as the base.

[0024] Preferably, the heat accumulation evaluation unit is used to preset the heat dissipation equalization threshold THCth and compare it with the heat accumulation index THC. The specific evaluation content is as follows:

[0025] When the heat accumulation index THC ≤ the heat dissipation equilibrium threshold THCth, it indicates that the thermal management capability of the circuit board meets the design requirements and no additional adjustment is needed.

[0026] When the heat accumulation index THC > the heat dissipation equilibrium threshold THCth, it indicates that the thermal management capability of the circuit board does not meet the design requirements, resulting in local overheating of the equipment. At this time, thermal management optimization suggestions are generated, including wiring path adjustment, heat dissipation material replacement and structural heat dissipation adjustment.

[0027] Preferably, the intelligent wiring planning module integrates electromagnetic interference (EMI) related data and temperature distribution related data. Then, it normalizes the EMI index Em and the heat accumulation index Thc and uses them as the main feature inputs. Next, based on the main feature inputs, it uses machine learning algorithms, including reinforcement learning algorithms, to generate a multi-objective wiring optimization model. Then, through dynamic path planning methods, combined with the physical constraints of the circuit board design, it optimizes and adjusts key wiring paths in real time to generate a wiring scheme that meets the multi-objective optimization requirements. Finally, it obtains and fits the EMI suppression score EDs, heat distribution balance score TBs, wiring length optimization score PLs, and resource utilization score RUs from the multi-objective wiring optimization model to calculate the comprehensive optimization index COP of the generated wiring scheme. The specific formula is as follows:

[0028]

[0029] Preferably, the comprehensive optimization analysis module includes a comprehensive optimization calculation unit and a comprehensive optimization evaluation unit;

[0030] The comprehensive optimization calculation unit is used to calculate the optimization performance evaluation coefficient OPE. By combining the physical constraints and performance requirements of the circuit board design, including wiring density Dw and via quantity Vh, and relating them to electromagnetic interference index Em, heat accumulation index Thc, and comprehensive optimization index COP, the optimization performance evaluation coefficient OPE is calculated using the following formula:

[0031]

[0032] Preferably, the comprehensive optimization evaluation unit is used to preset the optimization performance evaluation threshold OPEth, compare and evaluate the optimization performance evaluation coefficient OPE, analyze the optimization level of the cabling scheme, and finally output the comprehensive optimization result; the specific evaluation content is as follows:

[0033] When the optimization performance evaluation coefficient OPE ≥ the optimization performance evaluation threshold OPEth, the cabling scheme is determined to meet the optimization requirements, and the optimization result is output as qualified.

[0034] When the optimization performance evaluation coefficient OPE is less than the optimization performance evaluation threshold OPEth, the cabling scheme is determined to be non-compliant with optimization requirements. In this case, targeted improvement suggestions are generated, and a non-compliant result is output.

[0035] Preferably, the dynamic adjustment module extracts relevant lower-level parameters, including the electromagnetic interference index Em, heat accumulation index Thc, wiring density Dw, and via quantity Vh, based on the unqualified optimization results, and analyzes the specific reasons for the insufficient optimization. Secondly, it dynamically adjusts the wiring parameters, including replanning the wiring path, optimizing the wiring density distribution, and adjusting the via layout in high-power areas. Simultaneously, it establishes a real-time feedback mechanism using reinforcement learning algorithms, recalculating the optimization performance evaluation coefficient OPE after each adjustment and iteratively optimizing the adjustment scheme. Finally, it feeds the updated wiring planning results back to the comprehensive optimization analysis module for re-evaluation. If the evaluation result is a qualified optimization result, the final wiring scheme is output, completing the dynamic adjustment process.

[0036] An intelligent routing optimization method for HDI circuit boards includes the following steps:

[0037] Step 1: Monitor the electromagnetic interference data generated during the operation of the HDI circuit board in real time and calculate the electromagnetic interference index Em; compare and analyze the electromagnetic interference index Em with the preset electromagnetic interference threshold EMth, and finally trigger the electromagnetic compatibility optimization early warning signal.

[0038] Step 2: Collect temperature distribution data of high-power areas on the circuit board and calculate the heat accumulation index (Thc); by comparing and evaluating the heat accumulation index (Thc), determine whether the thermal management capability in the circuit board wiring design meets the requirements and generate thermal management optimization suggestions.

[0039] Step 3: Using machine learning algorithms, electromagnetic interference-related data and temperature distribution-related data are used as feature inputs. Through dynamic path planning, a multi-objective cabling scheme is generated, and finally, the comprehensive optimization index (COP) of the multi-objective cabling scheme is calculated.

[0040] Step 4: Based on the electromagnetic interference index Em, the thermal accumulation index Thc, and the comprehensive optimization index COP, combined with the physical constraints and performance requirements of the circuit board design, calculate and evaluate the optimization performance evaluation coefficient OPE, and finally output the comprehensive optimization results, including the optimization qualified results and the optimization unqualified results.

[0041] Step 5: Based on the optimization of unqualified results, dynamically adjust the cabling parameters and route, and at the same time establish and implement a real-time feedback mechanism to update the cabling planning results.

[0042] This invention provides an intelligent routing optimization method and system for HDI circuit boards. It has the following beneficial effects:

[0043] (1) The intelligent wiring optimization method and system for HDI circuit boards, by setting up an electromagnetic compatibility monitoring module and a thermal management evaluation module, respectively monitors the electromagnetic interference related data and the temperature distribution related data of the high power consumption area generated during the operation of the HDI circuit board in real time, and calculates the electromagnetic interference index Em and the heat accumulation index THC; by comparing and evaluating with the preset electromagnetic interference threshold EMth and heat dissipation equalization threshold THCth, it can accurately identify the electromagnetic interference problem and heat dissipation problem that the circuit board may cause in various wireless communication environments; when Em exceeds EMth or THC exceeds THCth, respectively triggers the electromagnetic compatibility optimization warning signal and generates thermal management optimization suggestions, thereby providing a quantitative basis for electromagnetic interference suppression and thermal management performance optimization.

[0044] (2) The intelligent wiring optimization method and system for HDI circuit boards utilizes machine learning algorithms, including reinforcement learning algorithms, through an intelligent wiring planning module. The electromagnetic interference index Em and the heat accumulation index Thc are normalized and used as the main feature inputs. Combined with the physical constraint parameters of the circuit board design (wiring density Dw and via number Vh) and performance requirements (such as electromagnetic compatibility and thermal management efficiency), a multi-objective wiring optimization model is generated. The key wiring paths are optimized in real time through dynamic path planning methods to generate a wiring scheme that meets the multi-objective optimization requirements. The comprehensive optimization index COP is calculated by combining the electromagnetic interference suppression score EDs, the heat distribution balance score TBs, the wiring length optimization score PLs, and the resource utilization score RUs to ensure that the wiring scheme achieves the best effect in terms of electromagnetic shielding and heat distribution balance.

[0045] (3) The intelligent wiring optimization method and system for HDI circuit boards calculates the optimization performance evaluation coefficient OPE through the comprehensive optimization analysis module. Based on the comprehensive optimization index COP, electromagnetic interference index Em, heat accumulation index Thc, and circuit board physical constraint parameters wiring density Dw and via number Vh, the overall optimization effect of the wiring scheme is quantified. When the optimization performance evaluation coefficient OPE is less than the optimization performance evaluation threshold OPEth, the dynamic adjustment module combines reinforcement learning algorithm to adjust the wiring parameters in real time, including replanning the wiring path, optimizing the wiring density distribution, and adjusting the via layout in high power consumption areas. The wiring planning results are updated through a real-time feedback mechanism. Finally, a wiring scheme with an optimization performance evaluation coefficient OPE that meets the requirements is generated. This comprehensively solves the problem of poor optimization effect of existing wiring optimization systems under low automation and complex constraint conditions, and ensures the high-performance application requirements of HDI circuit boards in wearable devices. Attached Figure Description

[0046] Figure 1 This is a schematic diagram of the framework structure of an intelligent wiring optimization system for HDI circuit boards according to the present invention.

[0047] Figure 2 This is a flowchart illustrating the steps of an intelligent wiring optimization method for HDI circuit boards according to the present invention. Detailed Implementation

[0048] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0049] Example 1

[0050] Please see Figure 1 This invention provides an intelligent wiring optimization system for HDI circuit boards, including an electromagnetic compatibility monitoring module, a thermal management evaluation module, an intelligent wiring planning module, a comprehensive optimization analysis module, and a dynamic adjustment module;

[0051] The electromagnetic compatibility monitoring module is used to monitor electromagnetic interference data generated during the operation of HDI circuit boards in real time, calculate the electromagnetic interference index Em, compare and analyze the electromagnetic interference index Em with the preset electromagnetic interference threshold EMth, and finally trigger an electromagnetic compatibility optimization early warning signal.

[0052] The thermal management evaluation module is used to collect temperature distribution data of high-power areas on the circuit board and calculate the heat accumulation index (Thc). By comparing and evaluating the heat accumulation index (Thc), it determines whether the thermal management capability in the circuit board wiring design meets the requirements and generates thermal management optimization suggestions.

[0053] The intelligent cabling planning module uses machine learning algorithms to take electromagnetic interference-related data and temperature distribution-related data as feature inputs, generates multi-objective cabling schemes through dynamic path planning methods, and finally calculates the comprehensive optimization index (COP) of the multi-objective cabling schemes.

[0054] The comprehensive optimization analysis module is based on the electromagnetic interference index Em, the thermal accumulation index Thc, and the comprehensive optimization index COP. It combines the physical constraints and performance requirements of the circuit board design to calculate and evaluate the optimization performance evaluation coefficient OPE, and finally outputs the comprehensive optimization results, including the optimization qualified results and the optimization unqualified results.

[0055] The dynamic adjustment module dynamically adjusts the wiring parameters and route based on the optimization results of unqualified results, and at the same time establishes and updates the wiring planning results through a real-time feedback mechanism.

[0056] In this embodiment, the electromagnetic compatibility (EMC) monitoring module can monitor EMC-related data generated during the operation of the HDI circuit board in real time. By calculating the EMC index Em and comparing it with the preset EMC threshold EMth, it can accurately identify and trigger EMC optimization warning signals, thereby effectively solving EMC problems. The thermal management evaluation module collects temperature distribution data of high-power areas and calculates the heat accumulation index THC. Combined with the heat dissipation equalization threshold THCth, it can determine whether the thermal management capability of the circuit board wiring design meets the requirements and generate targeted thermal management optimization suggestions to effectively solve the problems of insufficient heat dissipation and local overheating. The intelligent wiring planning module uses machine learning algorithms to normalize the EMC index Em and the heat accumulation index THC as feature inputs, combined with the wiring density Dw and the number of vias. The Vh module generates a routing scheme that meets multi-objective optimization requirements through dynamic path planning and calculates the comprehensive optimization index COP to ensure the overall performance of the routing scheme in terms of electromagnetic shielding, thermal management, and resource utilization. The comprehensive optimization analysis module calculates the optimization performance evaluation coefficient OPE through the electromagnetic interference index Em, heat accumulation index Thc, comprehensive optimization index COP, routing density Dw, and via number Vh, and outputs the comprehensive optimization result by comparing it with the optimization performance evaluation threshold OPEth, effectively quantifying the optimization level of the routing scheme. The dynamic adjustment module dynamically adjusts the routing parameters, routing density Dw, and via number Vh based on the unqualified optimization results, combined with reinforcement learning algorithms, and updates the routing planning results through a real-time feedback mechanism to ensure that the routing scheme meets the high-performance requirements of wearable devices for HDI circuit boards after iterative optimization.

[0057] Example 2

[0058] The electromagnetic compatibility monitoring module includes an electromagnetic interference calculation unit and an electromagnetic interference assessment unit;

[0059] The electromagnetic interference calculation unit is used to collect electromagnetic interference related data generated during the operation of the HDI circuit board in real time. By collecting radiated interference signals and conducted interference signals during the operation of the circuit board and converting them into digital form, then performing spectrum analysis and time domain decomposition, then extracting key feature parameters and performing dimensionless processing, including signal band strength Sfi, instantaneous peak amplitude Spk, pulse repetition frequency Prf and total interference power Tip, and finally calculating the electromagnetic interference index Em based on the following formula.

[0060]

[0061] The electromagnetic interference assessment unit is used to preset the electromagnetic interference threshold EMth, compare and evaluate it with the electromagnetic interference index Em, and trigger the generation of an electromagnetic compatibility optimization early warning signal. The specific content is as follows:

[0062] When the electromagnetic interference index Em ≤ electromagnetic interference threshold EMth: it means that the electromagnetic interference of the HDI circuit board is within a safe range and no additional optimization measures are required.

[0063] When the electromagnetic interference index Em > electromagnetic interference threshold EMth: it indicates that the electromagnetic interference of the HDI circuit board exceeds the safe range, affecting the normal operation of the equipment or causing communication signal interference. At this time, an electromagnetic compatibility optimization warning signal is generated.

[0064] The thermal management assessment module includes a thermal accumulation calculation unit and a thermal accumulation assessment unit;

[0065] The heat accumulation calculation unit is used to collect temperature distribution data in high-power areas of the HDI circuit board in real time. Multiple temperature sensors are arranged in the high-power areas of the HDI circuit board to collect the temperature of each key area in real time. Then, the sensor array records the spatial distribution information of the temperature, and next, it records the temperature change trend over time during the circuit board's operation. Finally, after smoothing, denoising, and dimensionless processing of the collected temperature distribution data, the heat accumulation index (Thc) is calculated using the following formula:

[0066]

[0067] In the formula, Tmax represents the highest temperature of the hotspot in the temperature distribution data, Tavg represents the average temperature in the temperature distribution data, Tgra represents the temperature gradient in the temperature distribution data, Tva represents the thermal fluctuation amplitude in the temperature distribution data, and ln represents the natural logarithm, which is a logarithmic function with the mathematical constant e as the base.

[0068] The heat accumulation evaluation unit is used to preset the heat dissipation equalization threshold THCth and compare it with the heat accumulation index THC. The specific evaluation content is as follows:

[0069] When the heat accumulation index THC ≤ the heat dissipation equilibrium threshold THCth, it indicates that the thermal management capability of the circuit board meets the design requirements and no additional adjustment is needed.

[0070] When the heat accumulation index THC > the heat dissipation equilibrium threshold THCth, it indicates that the thermal management capability of the circuit board does not meet the design requirements, resulting in local overheating of the equipment. At this time, thermal management optimization suggestions are generated, including wiring path adjustment, heat dissipation material replacement and structural heat dissipation adjustment.

[0071] The intelligent wiring planning module integrates electromagnetic interference (EMI) and temperature distribution data. It then normalizes the EMI index (Em) and heat accumulation index (Thc) and uses them as primary feature inputs. Next, based on these primary feature inputs, it uses machine learning algorithms, including reinforcement learning, to generate a multi-objective wiring optimization model. Then, through dynamic path planning and considering the physical constraints of the circuit board design, it optimizes and adjusts key wiring paths in real time to generate a wiring scheme that meets the multi-objective optimization requirements. Finally, it obtains and fits the EMI suppression score (EDs), heat distribution balance score (TBs), wiring length optimization score (PLs), and resource utilization score (RUs) from the multi-objective wiring optimization model to calculate the comprehensive optimization index (COP) of the generated wiring scheme. The specific formula is as follows:

[0072]

[0073] The comprehensive optimization analysis module includes a comprehensive optimization calculation unit and a comprehensive optimization evaluation unit;

[0074] The comprehensive optimization calculation unit is used to calculate the optimization performance evaluation coefficient OPE. By combining the physical constraints and performance requirements of the circuit board design, including wiring density Dw and via quantity Vh, and relating them to electromagnetic interference index Em, heat accumulation index Thc, and comprehensive optimization index COP, the optimization performance evaluation coefficient OPE is calculated using the following formula:

[0075]

[0076] In this embodiment, the wiring optimization capability of the HDI circuit board is comprehensively improved through the collaborative work of the electromagnetic compatibility monitoring module, thermal management evaluation module, intelligent wiring planning module, and comprehensive optimization analysis module. Specifically, the electromagnetic interference calculation unit of the electromagnetic compatibility monitoring module collects radiated and conducted interference signals in real time, and calculates the electromagnetic interference index Em by extracting key characteristic parameters including signal band strength Sfi, instantaneous peak amplitude Spk, pulse repetition frequency Prf, and total interference power Tip, thus accurately quantifying the electromagnetic interference level of the circuit board. The electromagnetic interference evaluation unit compares the electromagnetic interference index Em with a preset electromagnetic interference threshold EMth, triggering an electromagnetic compatibility optimization early warning signal to effectively suppress electromagnetic interference. The thermal management evaluation module collects temperature distribution data related to high-power areas in real time through the heat accumulation calculation unit, including the highest hotspot temperature Tmax, average temperature Tavg, temperature gradient Tgra, and thermal fluctuation amplitude Tva, and quantifies the heat accumulation effect of the circuit board based on the calculated heat accumulation index Thc. The heat accumulation evaluation unit... By comparing the heat accumulation index THC with the preset heat dissipation balance threshold THCth, optimization suggestions are generated to solve the problem of insufficient heat dissipation. The intelligent routing planning module combines the normalized electromagnetic interference index Em and the heat accumulation index THC with the physical constraint parameters routing density Dw and via number Vh, and uses reinforcement learning algorithm to generate a multi-objective routing optimization model. The routing path is optimized through dynamic path planning method, and the comprehensive optimization index COP is calculated by calculating electromagnetic interference suppression score EDs, heat distribution balance score TBs, routing length optimization score PLs, and resource utilization score RUs to ensure the balance between performance and resource utilization of the routing scheme. The comprehensive optimization analysis module calculates the optimization performance evaluation coefficient OPE and evaluates the overall optimization level of the routing scheme by comparing it with the optimization performance evaluation threshold OPEth. Finally, the dynamic adjustment module adjusts the routing parameters and path planning in real time, and iteratively optimizes through feedback mechanism to ensure that the routing scheme meets the high performance requirements of HDI circuit boards in terms of electromagnetic compatibility, thermal management capability, and resource utilization efficiency.

[0077] Example 3

[0078] The comprehensive optimization evaluation unit is used to preset the optimization performance evaluation threshold OPEth, compare and evaluate the optimization performance evaluation coefficient OPE, analyze the optimization level of the cabling scheme, and finally output the comprehensive optimization result; the specific evaluation content is as follows:

[0079] When the optimization performance evaluation coefficient OPE ≥ the optimization performance evaluation threshold OPEth, the cabling scheme is determined to meet the optimization requirements, and the optimization result is output as qualified.

[0080] When the optimization performance evaluation coefficient OPE is less than the optimization performance evaluation threshold OPEth, the cabling scheme is determined to be non-compliant with optimization requirements. In this case, targeted improvement suggestions are generated, and a non-compliant result is output.

[0081] The dynamic adjustment module extracts relevant lower-level parameters, including the electromagnetic interference index Em, heat accumulation index Thc, wiring density Dw, and via quantity Vh, based on the unqualified optimization results, and analyzes the specific reasons for the insufficient optimization. Secondly, it dynamically adjusts the wiring parameters, including replanning the wiring path, optimizing the wiring density distribution, and adjusting the via layout in high-power areas. Simultaneously, it establishes a real-time feedback mechanism using reinforcement learning algorithms, recalculating the optimization performance evaluation coefficient OPE after each adjustment and iteratively optimizing the adjustment scheme. Finally, the updated wiring planning results are fed back to the comprehensive optimization analysis module for re-evaluation. If the evaluation result is a qualified optimization result, the final wiring scheme is output, completing the dynamic adjustment process.

[0082] In this embodiment, the intelligent and dynamic adjustment capabilities of the HDI circuit board routing optimization scheme are effectively improved through the collaborative work of the comprehensive optimization evaluation unit and the dynamic adjustment module. The comprehensive optimization evaluation unit presets an optimization performance evaluation threshold OPEth, compares and evaluates the optimization performance evaluation coefficient OPE, and comprehensively analyzes the optimization level of the routing scheme. When the optimization performance evaluation coefficient OPE is less than the performance evaluation threshold OPEth, targeted improvement suggestions are generated to output unqualified results, providing a reference for subsequent dynamic adjustments. The dynamic adjustment module extracts lower-level parameters, including the electromagnetic interference index Em, the heat accumulation index Thc, the routing density Dw, and the number of vias Vh, based on the unqualified optimization results, and analyzes the specific reasons for insufficient optimization. Among them, the electromagnetic interference index Em is used to quantify the electromagnetic interference level of the routing scheme, and the heat accumulation index Thc is used to characterize heat accumulation. The cluster effect, wiring density Dw, and via quantity Vh are used to evaluate the density distribution and resource utilization of wiring, respectively. The module dynamically adjusts wiring parameters, replans wiring paths, optimizes wiring density distribution, and adjusts via layout in high-power areas. Combined with reinforcement learning algorithms, a real-time feedback mechanism is established. After each adjustment, the optimization performance evaluation coefficient OPE is recalculated and the adjustment scheme is iteratively optimized. Finally, the updated wiring planning results are fed back to the comprehensive optimization analysis module for re-evaluation. If the adjusted optimization performance evaluation coefficient OPE reaches the performance evaluation threshold OPEth, the final optimized and qualified wiring scheme is output, completing the dynamic adjustment process. Through the above process, Example 3 can achieve efficient optimization of HDI circuit boards under complex constraints, improve the electromagnetic compatibility, thermal management capability, and resource utilization efficiency of the wiring scheme, and ensure that high-performance requirements are met.

[0083] Example 4

[0084] Please see Figure 2An intelligent routing optimization method for HDI circuit boards includes the following steps:

[0085] Step 1: Monitor the electromagnetic interference data generated during the operation of the HDI circuit board in real time and calculate the electromagnetic interference index Em; compare and analyze the electromagnetic interference index Em with the preset electromagnetic interference threshold EMth, and finally trigger the electromagnetic compatibility optimization early warning signal.

[0086] Step 2: Collect temperature distribution data of high-power areas on the circuit board and calculate the heat accumulation index (Thc); by comparing and evaluating the heat accumulation index (Thc), determine whether the thermal management capability in the circuit board wiring design meets the requirements and generate thermal management optimization suggestions.

[0087] Step 3: Using machine learning algorithms, electromagnetic interference-related data and temperature distribution-related data are used as feature inputs. Through dynamic path planning, a multi-objective cabling scheme is generated, and finally, the comprehensive optimization index (COP) of the multi-objective cabling scheme is calculated.

[0088] Step 4: Based on the electromagnetic interference index Em, the thermal accumulation index Thc, and the comprehensive optimization index COP, combined with the physical constraints and performance requirements of the circuit board design, calculate and evaluate the optimization performance evaluation coefficient OPE, and finally output the comprehensive optimization results, including the optimization qualified results and the optimization unqualified results.

[0089] Step 5: Based on the optimization of unqualified results, dynamically adjust the cabling parameters and route, and at the same time establish and implement a real-time feedback mechanism to update the cabling planning results.

[0090] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. An intelligent wiring optimization system for HDI circuit boards, characterized in that: It includes an electromagnetic compatibility monitoring module, a thermal management assessment module, an intelligent cabling planning module, a comprehensive optimization analysis module, and a dynamic adjustment module; The electromagnetic compatibility monitoring module is used to monitor electromagnetic interference data generated during the operation of HDI circuit boards in real time, calculate the electromagnetic interference index Em, compare and analyze the electromagnetic interference index Em with the preset electromagnetic interference threshold EMth, and finally trigger an electromagnetic compatibility optimization early warning signal. The thermal management evaluation module is used to collect temperature distribution data of high-power areas on the circuit board and calculate the heat accumulation index (Thc). By comparing and evaluating the heat accumulation index (Thc), it determines whether the thermal management capability in the circuit board wiring design meets the requirements and generates thermal management optimization suggestions. The intelligent cabling planning module uses machine learning algorithms to take electromagnetic interference-related data and temperature distribution-related data as feature inputs, generates multi-objective cabling schemes through dynamic path planning methods, and finally calculates the comprehensive optimization index (COP) of the multi-objective cabling schemes. The comprehensive optimization analysis module is based on the electromagnetic interference index Em, the thermal accumulation index Thc, and the comprehensive optimization index COP. It combines the physical constraints and performance requirements of the circuit board design to calculate and evaluate the optimization performance evaluation coefficient OPE, and finally outputs the comprehensive optimization results, including the optimization qualified results and the optimization unqualified results. The dynamic adjustment module extracts relevant lower-level parameters, including the electromagnetic interference index Em, heat accumulation index Thc, wiring density Dw, and via quantity Vh, based on the unqualified optimization results, and analyzes the specific reasons for the insufficient optimization. Secondly, it dynamically adjusts the wiring parameters, including replanning the wiring path, optimizing the wiring density distribution, and adjusting the via layout in high-power areas. Simultaneously, it establishes a real-time feedback mechanism using reinforcement learning algorithms, recalculating the optimization performance evaluation coefficient OPE after each adjustment and iteratively optimizing the adjustment scheme. Finally, the updated wiring planning results are fed back to the comprehensive optimization analysis module for re-evaluation. If the evaluation result is a qualified optimization result, the final wiring scheme is output, completing the dynamic adjustment process.

2. The intelligent wiring optimization system for HDI circuit boards according to claim 1, characterized in that: The electromagnetic compatibility monitoring module includes an electromagnetic interference calculation unit and an electromagnetic interference assessment unit. The electromagnetic interference calculation unit is used to collect electromagnetic interference related data generated during the operation of the HDI circuit board in real time. By collecting radiated interference signals and conducted interference signals during the operation of the circuit board and converting them into digital form, then performing spectrum analysis and time domain decomposition, then extracting key feature parameters and performing dimensionless processing, including signal band strength Sfi, instantaneous peak amplitude Spk, pulse repetition frequency Prf and total interference power Tip, and finally calculating the electromagnetic interference index Em based on the following formula. 。 3. The intelligent wiring optimization system for HDI circuit boards according to claim 2, characterized in that: The electromagnetic interference assessment unit is used to preset the electromagnetic interference threshold EMth, compare and evaluate it with the electromagnetic interference index Em, and trigger the generation of an electromagnetic compatibility optimization early warning signal. The specific content is as follows: When the electromagnetic interference index Em ≤ electromagnetic interference threshold EMth: it means that the electromagnetic interference of the HDI circuit board is within a safe range and no additional optimization measures are required. When the electromagnetic interference index Em > electromagnetic interference threshold EMth: it indicates that the electromagnetic interference of the HDI circuit board exceeds the safe range, affecting the normal operation of the equipment or causing communication signal interference. At this time, an electromagnetic compatibility optimization warning signal is generated.

4. The intelligent wiring optimization system for HDI circuit boards according to claim 1, characterized in that: The thermal management assessment module includes a thermal accumulation calculation unit and a thermal accumulation assessment unit; The heat accumulation calculation unit is used to collect temperature distribution data in high-power areas of the HDI circuit board in real time. Multiple temperature sensors are arranged in the high-power areas of the HDI circuit board to collect the temperature of each key area in real time. Then, the sensor array records the spatial distribution information of the temperature, and next, it records the temperature change trend over time during the circuit board's operation. Finally, after smoothing, denoising, and dimensionless processing of the collected temperature distribution data, the heat accumulation index (Thc) is calculated using the following formula: In the formula, Tmax represents the highest temperature of the hotspot in the temperature distribution data, Tavg represents the average temperature in the temperature distribution data, Tgra represents the temperature gradient in the temperature distribution data, Tva represents the thermal fluctuation amplitude in the temperature distribution data, and ln represents the natural logarithm, which is a logarithmic function with the mathematical constant e as the base.

5. The intelligent wiring optimization system for HDI circuit boards according to claim 4, characterized in that: The heat accumulation evaluation unit is used to preset the heat dissipation equalization threshold THCth and compare it with the heat accumulation index THC. The specific evaluation content is as follows: When the heat accumulation index THC ≤ the heat dissipation equilibrium threshold THCth, it indicates that the thermal management capability of the circuit board meets the design requirements and no additional adjustment is needed. When the heat accumulation index THC > the heat dissipation equilibrium threshold THCth, it indicates that the thermal management capability of the circuit board does not meet the design requirements, resulting in local overheating of the equipment. At this time, thermal management optimization suggestions are generated, including wiring path adjustment, heat dissipation material replacement and structural heat dissipation adjustment.

6. The intelligent wiring optimization system for HDI circuit boards according to claim 1, characterized in that: The intelligent wiring planning module is used to integrate electromagnetic interference-related data and temperature distribution-related data. Then, the electromagnetic interference index Em and the heat accumulation index Thc are normalized and used as the main feature inputs. Secondly, based on the main feature inputs, machine learning algorithms, including reinforcement learning algorithms, are used to generate a multi-objective routing optimization model. Then, through dynamic path planning methods, combined with the physical constraints of the circuit board design, the key routing paths are optimized and adjusted in real time to generate a routing scheme that meets the multi-objective optimization requirements. Finally, the electromagnetic interference suppression score (EDs), thermal distribution balance score (TBs), routing length optimization score (PLs), and resource utilization score (RUs) are obtained from the multi-objective routing optimization model and fitted to calculate the comprehensive optimization index (COP) of the generated routing scheme. The specific formula is as follows: 。 7. The intelligent wiring optimization system for HDI circuit boards according to claim 1, characterized in that: The comprehensive optimization analysis module includes a comprehensive optimization calculation unit and a comprehensive optimization evaluation unit; The comprehensive optimization calculation unit is used to calculate the optimization performance evaluation coefficient OPE. By combining the physical constraints and performance requirements of the circuit board design, including wiring density Dw and via quantity Vh, and relating them to electromagnetic interference index Em, heat accumulation index Thc, and comprehensive optimization index COP, the optimization performance evaluation coefficient OPE is calculated using the following formula: 。 8. The intelligent wiring optimization system for HDI circuit boards according to claim 7, characterized in that: The comprehensive optimization evaluation unit is used to preset the optimization performance evaluation threshold OPEth, compare and evaluate the optimization performance evaluation coefficient OPE, analyze the optimization level of the cabling scheme, and finally output the comprehensive optimization result; the specific evaluation content is as follows: When the optimization performance evaluation coefficient OPE ≥ the optimization performance evaluation threshold OPEth, the cabling scheme is determined to meet the optimization requirements, and the optimization result is output as qualified. When the optimization performance evaluation coefficient OPE is less than the optimization performance evaluation threshold OPEth, the cabling scheme is determined to be non-compliant with optimization requirements. In this case, targeted improvement suggestions are generated, and a non-compliant result is output.

9. An intelligent routing optimization method for HDI circuit boards, and an intelligent routing optimization system for HDI circuit boards according to any one of claims 1-8, characterized in that: Includes the following steps: Step 1: Monitor the electromagnetic interference data generated during the operation of the HDI circuit board in real time and calculate the electromagnetic interference index Em; The electromagnetic interference index Em is compared and analyzed with the preset electromagnetic interference threshold EMth, and finally an electromagnetic compatibility optimization warning signal is triggered. Step 2: Collect temperature distribution data of high-power areas on the circuit board and calculate the heat accumulation index (Thc); by comparing and evaluating the heat accumulation index (Thc), determine whether the thermal management capability in the circuit board wiring design meets the requirements and generate thermal management optimization suggestions. Step 3: Using machine learning algorithms, electromagnetic interference-related data and temperature distribution-related data are used as feature inputs. Through dynamic path planning, a multi-objective cabling scheme is generated, and finally, the comprehensive optimization index (COP) of the multi-objective cabling scheme is calculated. Step 4: Based on the electromagnetic interference index Em, the thermal accumulation index Thc, and the comprehensive optimization index COP, combined with the physical constraints and performance requirements of the circuit board design, calculate and evaluate the optimization performance evaluation coefficient OPE, and finally output the comprehensive optimization results, including the optimization qualified results and the optimization unqualified results. Step 5: Based on the unsatisfactory optimization results, extract relevant lower-level parameters including electromagnetic interference index Em, heat accumulation index Thc, wiring density Dw, and via quantity Vh to analyze the specific reasons for insufficient optimization. Next, dynamically adjust wiring parameters, including replanning wiring paths, optimizing wiring density distribution, and adjusting via layout in high-power areas. Simultaneously, establish a real-time feedback mechanism using reinforcement learning algorithms to recalculate the optimization performance evaluation coefficient OPE after each adjustment and iteratively optimize the adjustment scheme. Finally, feed the updated wiring planning results back to the comprehensive optimization analysis module for re-evaluation. If the evaluation result is satisfactory, output the final wiring scheme, completing the dynamic adjustment process.

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