Full-automatic single wafer cleaning machine and wafer cleaning method
By using a twisting mechanism to drive the wafer box swing and the installation frame movement in a fully automatic single wafer cleaning machine to drive the filter plate cleaning, the problem of the wafer box stationary and impurities affecting the cleaning quality in the prior art is solved, and efficient wafer cleaning and filtration effects are achieved.
Patent Information
- Application Number
- CN202510201997.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-02-24
- Publication Date
- 2025-06-03
- Estimated Expiration
- Not applicable · inactive patent
AI Technical Summary
When used in the existing tank cleaning machine, the wafer box is stationary, resulting in low contact efficiency between the wafer and the cleaning tank chemical agent, and the impurities generated during the cleaning process are likely to affect the next cleaning and affect the cleaning quality.
A fully automatic single wafer cleaning machine is designed, using a twisting mechanism to drive the wafer box to swing back and forth, improve the flow efficiency of the liquid inside the cleaning tank, and drive the filter plate to clean through the up and down movement of the installation frame to avoid the impact of impurities on the next cleaning.
It improves the contact efficiency between the wafer and the liquid, ensures the cleaning quality, and avoids the impact of impurities on the next cleaning.
Smart Images

Figure CN120089619A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the technical field of wafer cleaning, and particularly to a fully automatic single-wafer cleaning machine and a wafer cleaning method. Background Art
[0002] A single wafer refers to a silicon wafer used in the production of silicon semiconductor integrated circuits. Due to its circular shape, it is called a wafer. It is the core material for the production of silicon semiconductor integrated circuits and can be used to manufacture various circuit element structures.
[0003] A single wafer is made from a silicon ingot through processes such as cutting, grinding, and polishing. During the manufacturing process of the wafer, it comes into contact with various pollutants such as organic substances, particles, and metal impurities, resulting in the attachment of pollutants to the wafer. Therefore, it is necessary to clean the wafer. Currently, the common cleaning methods are tank cleaning and single-piece cleaning. However, when most current tank cleaning machines are in use, when the wafer cassette enters the inside of the cleaning tank, the wafer cassette remains stationary at this time, so the contact between the wafers inside the wafer cassette and the chemicals inside the cleaning tank is relatively slow, affecting the cleaning efficiency of the wafers. Moreover, when the wafers are being cleaned inside the cleaning tank, some impurities are generated, and these impurities are likely to affect the wafers during the next cleaning, affecting the cleaning quality of the wafers. In view of the above problems, the inventor proposes a fully automatic single-wafer cleaning machine and a wafer cleaning method to solve the above problems. Summary of the Invention
[0004] In order to solve the problems that the wafer cassette remains stationary and the impurities generated during cleaning are likely to affect the next cleaning; the purpose of the present invention is to provide a fully automatic single-wafer cleaning machine and a wafer cleaning method.
[0005] To solve the above technical problems, the present invention adopts the following technical solutions: A fully automatic single-wafer cleaning machine includes a cleaning mechanism. On both sides of the three cleaning mechanisms, there are installation mechanisms for collecting waste water. On the upper surface of the installation mechanism, there is a transportation mechanism for transporting the wafer cassette. Inside the three cleaning mechanisms, there is a twisting mechanism for driving the wafer cassette to twist. Inside the cleaning mechanism, there is a flushing mechanism for cleaning the filter plate.
[0006] Preferably, the cleaning mechanism includes a cleaning tank. Inside the tops of the three cleaning tanks, two rotating plates are rotatably installed. On the outer surface of the rotating shafts on one side of the two rotating plates, a first gear is fixedly installed. On one side of the tops of the three cleaning tanks near the first gear, two first toothed plates are slidably installed, and the first toothed plates are engaged with the first gear. On one side of the tops of the three cleaning tanks near the first gear, a bidirectional screw is rotatably installed, and two first toothed plates are threadedly connected to the bidirectional screw. On the sides of the three cleaning tanks, two fixed blocks are fixedly installed. Inside the two fixed blocks, a transmission rod is rotatably installed, and the transmission rod and the bidirectional screw are driven by a synchronous pulley and a synchronous belt.
[0007] Preferably, the installation mechanism includes an installation frame, and the two installation frames are located on both sides of the cleaning tank. A collection box and a fixed box are fixedly installed inside the installation frame, and the fixed box is located directly above the collection box. A transfer pump is fixedly installed inside the installation frame, and the water inlet pipe and the water outlet pipe of the transfer pump are respectively fixedly connected to the collection box and the fixed box. A water pump is fixedly installed on the upper surface of the fixed box, and a connecting pipe is fixedly installed on the upper surface of the water pump. The end of the connecting pipe away from the water pump is fixedly connected to the flushing mechanism.
[0008] Preferably, the transfer mechanism includes a transfer frame, and the transfer frame is fixedly installed on the installation frame. An installation plate is slidably installed between the two transfer frames. Sliders are fixedly installed on both sides of the installation plate, and the sliders are slidably arranged inside the transfer frame. Second electric cylinders are slidably installed on the upper surfaces of the two transfer frames, and the bottom ends of the output shafts of the second electric cylinders are fixedly connected to the sliders. Installation blocks are slidably installed inside the tops of the two transfer frames, and the sliders are slidably clamped inside the installation blocks. First electric cylinders are fixedly installed on the sides of the two transfer frames, and the ends of the output shafts of the first electric cylinders close to the second electric cylinders are fixedly connected to the installation blocks. A third toothed plate is fixedly installed inside one side of the slider. A toothed rod is rotatably installed inside the top of the transfer frame on the left side, and the toothed rod and the transmission rod are driven by a synchronous wheel and a synchronous belt. A fifth gear is fixedly installed at the end of the toothed rod away from the synchronous wheel, and the fifth gear is movably meshed with the third toothed plate. A second toothed plate is fixedly installed inside the side of the slider away from the installation plate. Three one-way bearings are rotatably installed inside the middle of the transfer frame on the left side. A fourth gear is fixedly installed at the end of the one-way bearing close to the slider, and the fourth gear is movably meshed with the second toothed plate.
[0009] Preferably, a clamping frame is slidably installed on the lower surface of the installation plate, and the mutually approaching sides of the bottom ends of the clamping frame are in movable contact with both sides of the wafer box. A driving plate is rotatably installed inside the middle of the installation plate. Connecting bars are rotatably installed on the lower surfaces of both ends of the driving plate, and the ends of the connecting bars away from the driving plate are rotatably connected to the clamping frame. A second motor is fixedly installed on the upper surface of the installation plate, and the bottom end of the output shaft of the second motor is fixedly connected to the driving plate.
[0010] Preferably, the twisting mechanism includes an installation frame, and the installation frame is located inside the cleaning tank. Fixed plates are fixedly installed on the mutually approaching sides of the top of the installation frame, and swing plates are rotatably installed at the mutually approaching ends of the two fixed plates. Two installation seats are slidably installed on the mutually approaching sides of the top of the installation frame. A pushing bar is rotatably installed inside the installation seat, and the end of the pushing bar away from the installation seat is rotatably arranged on the swing plate. Moving frames are slidably installed inside both sides of the top of the installation frame, and the two ends of the moving frame are respectively fixedly connected to the two installation seats. Connecting rods are rotatably installed inside both sides of the top of the installation frame. Installation bars are fixedly installed at the mutually approaching ends of the two connecting rods. Fixed rods are fixedly installed at the tops of the mutually approaching sides of the two installation bars, and the mutually approaching ends of the two fixed rods are slidably inserted inside the moving frame.
[0011] Preferably, second cross bars are rotatably installed on both inner sides of the three cleaning tanks, and one end of the connecting rod away from the mounting strip is slidably clamped inside the second cross bar. A fourth bevel gear is fixedly installed at one end of the second cross bar away from the connecting rod. Drive rods are rotatably installed on both inner sides of the three cleaning tanks, and the three drive rods on both sides are connected to each other. The two drive rods are driven by a synchronous pulley and a synchronous belt. A first motor is fixedly installed on the side of the cleaning tank on the right, and one end of the output shaft of the first motor close to the cleaning tank is fixedly connected to the drive rod. A third bevel gear is fixedly installed on the outer surface of the drive rod, and the third bevel gear meshes with the fourth bevel gear.
[0012] Preferably, moving strips are slidably installed on both inner sides of the tops of the three cleaning tanks. Moving seats are fixedly installed on the sides of the two moving strips close to each other at the top. A swinging strip is rotatably installed in the moving seat, and one end of the swinging strip away from the moving seat is rotatably connected to the mounting frame. Two mounting rods are rotatably installed on both inner sides of the three cleaning tanks. A rotating strip is fixedly installed at one end of the mounting rod close to the moving strip. A guide rod is fixedly installed on the side of the rotating strip away from the mounting rod, and one end of the guide rod away from the rotating strip is slidably inserted into the moving strip. Rotating rods are rotatably installed on both inner sides of the three cleaning tanks, and the rotating rods and the mounting rods are driven by a synchronous pulley and a synchronous belt. First rotating rods are rotatably installed on both sides of the three cleaning tanks. A second toothless gear is fixedly installed on the outer surface of the first rotating rod. A third gear is fixedly installed on the outer surface of the rotating rod, and the third gear meshes with the second toothless gear movably. A first bevel gear is fixedly installed on the outer surface of the first rotating rod. Two first cross bars are rotatably installed on one side of the three cleaning tanks, and the two first cross bars are driven by a synchronous pulley and a synchronous belt. The one-way bearing and the first cross bar are driven out of phase, and the one-way bearing and the first cross bar are driven by a synchronous pulley and a synchronous belt. A second bevel gear is fixedly installed at one end of the first cross bar close to the first rotating rod, and the second bevel gear meshes with the first bevel gear.
[0013] Preferably, the rinsing mechanism includes a fixed strip, a spray head, and a moving box. The fixed strip is slidably arranged inside the cleaning tank. The spray head is located directly above the moving box, and the end of the connecting pipe away from the water pump is fixedly connected to the spray head. Two pulling strips are rotatably installed on the side of the fixed strip close to the spray head, and the ends of the upper and lower groups of pulling strips away from the fixed strip are respectively rotatably connected to the spray head and the moving box. Two second rotating rods are rotatably installed on both sides inside each of the three cleaning tanks. A driving strip is fixedly installed at the end of the second rotating rod close to the moving box. A guiding rod is fixedly installed on the side of the driving strip away from the second rotating rod, and the end of the guiding rod away from the driving strip is slidably inserted inside the fixed strip. A gear rod is rotatably installed on one side inside each of the three cleaning tanks close to the moving box, and the gear rod and the two second rotating rods are driven by a synchronous wheel and a synchronous belt. A second gear is fixedly installed on the outer surface of the gear rod, and a first toothless gear is fixedly installed on the outer surface of the first rotating rod on the left side, and the first toothless gear and the second gear are movably engaged.
[0014] A wafer cleaning method for a fully automatic single-wafer cleaning machine includes the following steps:
[0015] Step 1: Start the first motor to drive the driving rod to rotate. Drive the mounting strip to rotate through the rotation of the driving rod, drive the moving frame to move through the rotation of the mounting strip, drive the swing plate to swing through the movement of the moving frame, and drive the wafer cassette to swing through the swing of the swing plate to improve the contact efficiency between the wafers inside the wafer cassette and the chemical agent inside the cleaning tank.
[0016] Step 2: When the second electric cylinder is started to drive the mounting plate to move to the bottommost position, start the second motor at this time to drive the clamping frame to move, clamp and limit the wafer cassette, and move the wafer cassette.
[0017] Step 3: Drive the first cross bar to rotate through the simultaneous rotation of the inner and outer rings of the one-way bearing, drive the first rotating rod to rotate one full circle through the rotation of the first cross bar. When the first rotating rod rotates the first quarter circle, drive the rotating rod to rotate half a circle, and drive the mounting frame to move upward through the rotation of the rotating rod.
[0018] Step 4: When the first rotating rod rotates the second quarter circle, the gear rod rotates half a circle. Drive the spray head and the moving box to move through the rotation of the gear rod, so that the spray head and the moving box are in contact with the upper and lower sides of the filter plate at the bottom of the mounting frame to clean the filter plate.
[0019] Compared with the prior art, the beneficial effects of the present invention are as follows:
[0020] 1. In the present invention, by setting a twisting mechanism to drive the wafer cassette to swing reciprocally, the flow efficiency of the chemical liquid inside the cleaning tank is improved through the reciprocal swing of the wafer cassette, thereby improving the contact efficiency between the wafer and the chemical liquid. Moreover, the movement of the mounting frame drives the filter plate at the bottom of the mounting frame to move, and the impurities inside the cleaning tank are filtered by the filter plate to avoid the influence of the impurities generated during cleaning on the next cleaning.
[0021] 2. In the present invention, by setting up the cooperation among the one-way bearing, the first cross bar, the first rotating rod, the gear rod and the second rotating rod, the spray head and the moving box are driven to move left and right reciprocally, so that the spray head contacts the upper surface of the filter plate at the bottom of the installation frame, cleaning the filter plate and avoiding the blockage of the filter holes of the filter plate, which affects the filtering effect.
[0022] 3. In the present invention, by setting up the cooperation among the one-way bearing, the first cross bar, the rotating rod and the installation rod, the installation frame is driven to move up and down reciprocally, thereby driving the filter plate at the bottom of the installation frame to move up and down, filtering the impurities inside the cleaning tank and avoiding affecting the next cleaning. BRIEF DESCRIPTION OF THE DRAWINGS
[0023] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the following-described drawings are only some embodiments of the present invention. For those of ordinary skill in the art, other drawings can also be obtained based on these drawings without creative efforts.
[0024] Figure 1 It is a schematic diagram of the overall structure of the present invention.
[0025] Figure 2 It is a schematic diagram of the overall sectional structure of the present invention.
[0026] Figure 3 It is a schematic diagram of the sectional structure of the cleaning mechanism of the present invention.
[0027] Figure 4 It is a schematic diagram of the sectional structure of the cleaning tank of the present invention.
[0028] Figure 5 It is a schematic diagram of the sectional structure of the moving bar of the present invention.
[0029] Figure 6 It is a schematic diagram of the sectional structure of the rotating plate of the present invention.
[0030] Figure 7 It is a schematic diagram of the sectional structure of the transportation mechanism of the present invention.
[0031] Figure 8 It is a schematic diagram of the sectional structure of the transportation rack of the present invention.
[0032] Figure 9 It is a schematic diagram of the sectional structure of the twisting mechanism of the present invention.
[0033] Figure 10 It is a schematic diagram of the sectional structure of the cleaning mechanism of the present invention.
[0034] Figure 11Schematic cross-sectional structure diagram of the fixing bar of the present invention.
[0035] Figure 12 For the present invention Figure 4 Enlarged schematic diagram of the structure at position A.
[0036] Figure 13 For the present invention Figure 7 Enlarged schematic diagram of the structure at position B.
[0037] Figure 14 For the present invention Figure 8 Enlarged schematic diagram of the structure at position C.
[0038] Figure 15 For the present invention Figure 9 Enlarged schematic diagram of the structure at position D.
[0039] In the figure: 1. Cleaning mechanism; 101. Cleaning tank; 102. Moving seat; 103. Swing bar; 104. Moving bar; 105. First cross bar; 106. First rotating rod; 107. First bevel gear; 108. Rotating rod; 109. Mounting rod; 110. Rotating bar; 111. Guide rod; 112. Rotating plate; 113. First gear; 114. First toothed plate; 115. Bidirectional screw; 116. Fixed block; 117. Transmission rod; 118. Driving rod; 119. First motor; 120. Gear rod; 121. Second rotating rod; 122. Driving bar; 123. Guide rod; 124. Second bevel gear; 125. First toothless gear; 126. Second toothless gear; 127. Second gear; 128. Third gear; 129. Third bevel gear; 130. Second cross bar; 131. Fourth bevel gear; 2. Mounting mechanism; 201. Mounting frame; 202. Collection box; 203. Transfer pump; 204. Water pump; 205. Connecting pipe; 206. Fixed box; 3. Transport mechanism; 301. Transport frame; 302. Mounting block; 303. First electric cylinder; 304. Mounting plate; 305. Slide block; 306. Second electric cylinder; 307. Clamping frame; 308. Driving plate; 309. Connecting bar; 310. Second motor; 311. Second toothed plate; 312. One-way bearing; 313. Fourth gear; 314. Third toothed plate; 315. Tooth bar; 316. Fifth gear; 4. Twisting mechanism; 401. Mounting frame; 402. Fixed plate; 403. Swing plate; 404. Mounting seat; 405. Pushing bar; 406. Connecting rod; 407. Mounting bar; 408. Fixed rod; 409. Moving frame; 5. Flushing mechanism; 501. Fixed bar; 502. Sprayer; 503. Moving box; 504. Pulling bar. Detailed implementation manners
[0040] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.
[0041] Embodiment: As Figures 1-15 shown, the present invention provides a fully automatic single-wafer cleaning machine, which includes a cleaning mechanism 1. Installation mechanisms 2 for collecting waste water are provided on both sides of the three cleaning mechanisms 1 to collect waste water and filter the waste water to realize the recycling of waste water. A transportation mechanism 3 for transporting the wafer cassette is provided on the upper surface of the installation mechanism 2 to clamp and limit the wafer cassette and drive the wafer cassette to move. A twisting mechanism 4 for driving the wafer cassette to twist is provided in the three cleaning mechanisms 1 to drive the wafer cassette to twist and improve the contact efficiency between the wafers and the chemicals inside the wafer cassette. A flushing mechanism 5 for cleaning the filter plate is provided in the cleaning mechanism 1 to flush the filter plate at the bottom of the installation frame 401.
[0042] The cleaning mechanism 1 includes a cleaning tank 101. Two rotating plates 112 are rotatably installed inside the tops of the three cleaning tanks 101. A first gear 113 is fixedly installed on the outer surface of the rotating shafts on one side of the two rotating plates 112. Two first toothed plates 114 are slidably installed inside the tops of the three cleaning tanks 101 near the first gear 113, and the first toothed plates 114 are engaged with the first gear 113. A bidirectional screw 115 is rotatably installed inside the tops of the three cleaning tanks 101 near the first gear 113, and two first toothed plates 114 are threadedly connected to the bidirectional screw 115. Two fixing blocks 116 are fixedly installed on the sides of the three cleaning tanks 101. A transmission rod 117 is rotatably installed inside the two fixing blocks 116, and the transmission rod 117 and the bidirectional screw 115 are driven by a synchronous pulley and a synchronous belt.
[0043] By adopting the above technical solution, the transmission rod 117 can drive the rotating plate 112 to rotate.
[0044] The installation mechanism 2 includes an installation frame 201, and the two installation frames 201 are located on both sides of the cleaning tank 101. A collection box 202 and a fixed box 206 are fixedly installed inside the installation frame 201, and the fixed box 206 is located directly above the collection box 202. A transfer pump 203 is fixedly installed inside the installation frame 201, and the inlet pipe and the outlet pipe of the transfer pump 203 are respectively fixedly connected to the collection box 202 and the fixed box 206. A water pump 204 is fixedly installed on the upper surface of the fixed box 206. A connecting pipe 205 is fixedly installed on the upper surface of the water pump 204, and one end of the connecting pipe 205 away from the water pump 204 is fixedly connected to the flushing mechanism 5.
[0045] By adopting the above technical solution, the water pump 204 can transport the water used for flushing.
[0046] The transport mechanism 3 includes a transport frame 301, and the transport frame 301 is fixedly installed on the mounting frame 201. An installation plate 304 is slidably installed between the two transport frames 301. Sliders 305 are fixedly installed on both sides of the installation plate 304, and the sliders 305 are slidably arranged inside the transport frame 301. Second electric cylinders 306 are slidably installed on the upper surfaces of the two transport frames 301, and the bottom ends of the output shafts of the second electric cylinders 306 are fixedly connected to the sliders 305. Installation blocks 302 are slidably installed inside the tops of the two transport frames 301, and the sliders 305 are slidably clamped inside the installation blocks 302. First electric cylinders 303 are fixedly installed on the sides of the two transport frames 301, and one ends of the output shafts of the first electric cylinders 303 close to the second electric cylinders 306 are fixedly connected to the installation blocks 302. A third toothed plate 314 is fixedly installed inside one side of the slider 305. A toothed rod 315 is rotatably installed inside the top of the left transport frame 301, and the toothed rod 315 and the transmission rod 117 are driven by a synchronous pulley and a synchronous belt. One end of the toothed rod 315 away from the synchronous pulley is fixedly installed with a fifth gear 316, and the fifth gear 316 is movably engaged with the third toothed plate 314. A second toothed plate 311 is fixedly installed inside the side of the slider 305 away from the installation plate 304. Three one-way bearings 312 are rotatably installed inside the middle of the left transport frame 301. Since the one-way bearing 312 has an inner ring and an outer ring, there are two situations: the inner ring rotates and the outer ring does not rotate, and both the inner and outer rings rotate simultaneously. When the second toothed plate 311 moves downward to drive the one-way bearing 312 to rotate, at this time, the inner ring of the one-way bearing 312 rotates and the outer ring does not rotate. When the second toothed plate 311 moves upward to drive the one-way bearing 312 to rotate, at this time, both the inner and outer rings of the one-way bearing 312 rotate. A fourth gear 313 is fixedly installed at one end of the one-way bearing 312 close to the slider 305, and the fourth gear 313 is movably engaged with the second toothed plate 311.
[0047] By adopting the above technical solution, the toothed rod 315 can drive the transmission rod 117 to rotate.
[0048] A clamping frame 307 is slidably installed on the lower surface of the installation plate 304, and the mutually approaching sides of the bottom ends of the clamping frame 307 are in movable contact with both sides of the wafer cassette. A driving plate 308 is rotatably installed inside the middle of the installation plate 304. Connecting bars 309 are rotatably installed on the lower surfaces of both ends of the driving plate 308, and one ends of the connecting bars 309 away from the driving plate 308 are rotatably connected to the clamping frame 307. A second motor 310 is fixedly installed on the upper surface of the installation plate 304, and the bottom end of the output shaft of the second motor 310 is fixedly connected to the driving plate 308.
[0049] By adopting the above technical solution, the second motor 310 can drive the clamping frame 307 to move.
[0050] The twisting mechanism 4 includes a mounting frame 401, and the mounting frame 401 is located inside the cleaning tank 101. On the mutually adjacent sides of the top of the mounting frame 401, fixing plates 402 are fixedly installed. At one end of the two fixing plates 402 close to each other, swing plates 403 are rotatably installed. On the mutually adjacent sides of the top of the mounting frame 401, two mounting seats 404 are slidably installed. Inside the mounting seats 404, push bars 405 are rotatably installed. And one end of the push bar 405 away from the mounting seat 404 is rotatably arranged on the swing plate 403. Inside the two sides of the top of the mounting frame 401, moving frames 409 are slidably installed. And both ends of the moving frame 409 are fixedly connected to the two mounting seats 404 respectively. Inside the two sides of the top of the mounting frame 401, connecting rods 406 are rotatably installed. At one end of the two connecting rods 406 close to each other, mounting bars 407 are fixedly installed. At the top ends of the mutually adjacent sides of the two mounting bars 407, fixing rods 408 are fixedly installed. And one end of the two fixing rods 408 close to each other is slidably inserted into the inside of the moving frame 409
[0051] By adopting the above technical solution, the connecting rod 406 can drive the swing plate 403 to swing.
[0052] On both sides of the three cleaning tanks 101, second cross bars 130 are rotatably installed. And one end of the connecting rod 406 away from the mounting bar 407 is slidably clamped inside the second cross bar 130. At one end of the second cross bar 130 away from the connecting rod 406, a fourth bevel gear 131 is fixedly installed. Inside the three cleaning tanks 101 on both sides, driving rods 118 are rotatably installed. And the three driving rods 118 on both sides are connected to each other. Between the two driving rods 118, transmission is carried out through a synchronous pulley and a synchronous belt. On the side of the cleaning tank 101 on the right, a first motor 119 is fixedly installed. And one end of the output shaft of the first motor 119 close to the cleaning tank 101 is fixedly connected to the driving rod 118. On the outer surface of the driving rod 118, a third bevel gear 129 is fixedly installed. And the third bevel gear 129 meshes with the fourth bevel gear 131.
[0053] By adopting the above technical solution, the driving rod 118 can drive the connecting rod 406 to rotate.
[0054] On both sides inside the tops of the three cleaning tanks 101, moving bars 104 are slidably installed. On the sides of the tops of the two moving bars 104 close to each other, moving seats 102 are fixedly installed. Inside the moving seats 102, swing bars 103 are rotatably installed, and one end of the swing bar 103 far from the moving seat 102 is rotatably connected to the mounting frame 401. Inside both sides of the three cleaning tanks 101, two mounting rods 109 are rotatably installed. One end of the mounting rod 109 close to the moving bar 104 is fixedly installed with a rotating bar 110. On the side of the rotating bar 110 far from the mounting rod 109, a guide rod 111 is fixedly installed, and one end of the guide rod 111 far from the rotating bar 110 is slidably inserted inside the moving bar 104. Inside both sides of the three cleaning tanks 101, rotating rods 108 are rotatably installed, and the rotating rods 108 and the mounting rods 109 are driven by a synchronous pulley and a synchronous belt. On both sides of the three cleaning tanks 101, first rotating rods 106 are rotatably installed. On the outer surface of the first rotating rod 106, a second missing-tooth gear 126 is fixedly installed. On the outer surface of the rotating rod 108, a third gear 128 is fixedly installed, and the third gear 128 and the second missing-tooth gear 126 are movably meshed. On the outer surface of the first rotating rod 106, a first bevel gear 107 is fixedly installed. Inside one side of the three cleaning tanks 101, two first cross bars 105 are rotatably installed, and the two first cross bars 105 are driven by a synchronous pulley and a synchronous belt. The one-way bearing 312 and the first cross bar 105 are driven in a staggered manner, and the one-way bearing 312 and the first cross bar 105 are driven by a synchronous pulley and a synchronous belt. One end of the first cross bar 105 close to the first rotating rod 106 is fixedly installed with a second bevel gear 124, and the second bevel gear 124 and the first bevel gear 107 are meshed with each other.
[0055] By adopting the above technical solution, the one-way bearing 312 can drive the mounting frame 401 to move.
[0056] The rinsing mechanism 5 includes a fixed bar 501, a spray head 502 and a moving box 503. The fixed bar 501 is slidably arranged inside the cleaning tank 101. The spray head 502 is located directly above the moving box 503, and one end of the connecting pipe 205 far away from the water pump 204 is fixedly connected to the spray head 502. Two pulling bars 504 are rotatably installed on the side of the fixed bar 501 close to the spray head 502, and the ends of the upper and lower groups of pulling bars 504 far away from the fixed bar 501 are respectively rotatably connected to the spray head 502 and the moving box 503. Two second rotating rods 121 are rotatably installed on both sides inside each of the three cleaning tanks 101. A driving bar 122 is fixedly installed at one end of the second rotating rod 121 close to the moving box 503. A guiding rod 123 is fixedly installed on the side of the driving bar 122 far away from the second rotating rod 121, and one end of the guiding rod 123 far away from the driving bar 122 is slidably inserted inside the fixed bar 501. A gear rod 120 is rotatably installed on one side inside each of the three cleaning tanks 101 close to the moving box 503, and the gear rod 120 and the two second rotating rods 121 are driven by a synchronous pulley and a synchronous belt. A second gear 127 is fixedly installed on the outer surface of the gear rod 120. A first toothless gear 125 is fixedly installed on the outer surface of the left first rotating rod 106, and the first toothless gear 125 and the second gear 127 are movably engaged.
[0057] By adopting the above technical solution, the rotation of the first rotating rod 106 drives the movement of the spray head 502 and the moving box 503.
[0058] A wafer cleaning method for a fully automatic single-wafer cleaning machine includes the following steps:
[0059] Step 1: Start the first motor 119 to drive the driving rod 118 to rotate. Drive the mounting strip 407 to rotate through the rotation of the driving rod 118. Drive the moving frame 409 to move through the rotation of the mounting strip 407. Drive the swing plate 403 to swing through the movement of the moving frame 409. Drive the wafer cassette to swing through the swing of the swing plate 403 to improve the contact efficiency between the wafers inside the wafer cassette and the chemical agent inside the cleaning tank 101.
[0060] Step 2: When the second electric cylinder 306 is started to drive the mounting plate 304 to move to the bottommost position, start the second motor 310 to drive the clamping frame 307 to move, clamp and limit the wafer cassette, and move the wafer cassette.
[0061] Step 3: Drive the first cross bar 105 to rotate through the simultaneous rotation of the inner and outer rings of the one-way bearing 312. Drive the first rotating rod 106 to rotate one circle through the rotation of the first cross bar 105. When the first rotating rod 106 rotates the first quarter circle, drive the rotating rod 108 to rotate half a circle. Drive the mounting frame 401 to move upward through the rotation of the rotating rod 108.
[0062] Step 4: When the first rotating rod 106 rotates the second quarter turn, the gear rod 120 rotates half a turn. The rotation of the gear rod 120 drives the movement of the nozzle 502 and the moving box 503, so that the nozzle 502 and the moving box 503 are in contact with the upper and lower sides of the filter plate at the bottom of the installation frame 401, and the filter plate is cleaned.
[0063] Working principle: First, turn on the first motor 119 to drive the driving rod 118 to rotate. The rotation of the driving rod 118 drives the third bevel gear 129 to rotate. The rotation of the third bevel gear 129 drives the fourth bevel gear 131 to rotate. The rotation of the fourth bevel gear 131 drives the second cross bar 130 to rotate. The rotation of the second cross bar 130 drives the connecting rod 406 to rotate. The rotation of the connecting rod 406 drives the mounting strip 407 to rotate. The rotation of the mounting strip 407 drives the fixed rod 408 to perform a circular motion. At this time, the circular motion can be decomposed into a horizontal movement and a vertical movement. When the fixed rod 408 moves vertically, the fixed rod 408 is slidably arranged inside the moving frame 409. When the fixed rod 408 moves horizontally, the movement of the fixed rod 408 drives the moving frame 409 to move. The movement of the moving frame 409 drives the mounting seat 404 to move. The movement of the mounting seat 404 drives the push bar 405 to swing. The swing of the push bar 405 drives the swing plate 403 to swing. The swing of the swing plate 403 drives the wafer cassette to swing, improving the contact efficiency between the wafers inside the wafer cassette and the chemical agent inside the cleaning tank 101.
[0064] Secondly, when the cleaning is completed, turn on the second electric cylinder 306 to drive the slider 305 to move. The movement of the slider 305 moves the mounting plate 304 downward. At this time, the movement of the slider 305 drives the third toothed plate 314 and the second toothed plate 311 to move. When the third toothed plate 314 meshes with the fifth gear 316, it drives the fifth gear 316 to rotate. The rotation of the fifth gear 316 drives the toothed rod 315 to rotate. The rotation of the toothed rod 315 drives the transmission rod 117 to rotate. The rotation of the transmission rod 117 drives the bidirectional screw 115 to rotate. The rotation of the bidirectional screw 115 drives the first toothed plate 114 to rotate. The movement of the first toothed plate 114 drives the first gear 113 to rotate. The rotation of the first gear 113 drives the rotating plate 112 to rotate, causing the rotating plate 112 to rotate upward and opening the cleaning tank 101. When the mounting plate 304 moves downward to the bottom, turn on the second motor 310 to drive the driving plate 308 to rotate. The rotation of the driving plate 308 drives the connecting bar 309 to swing. The swing of the connecting bar 309 drives the clamping frame 307 to move, so that the mutually approaching sides of the clamping frames 307 are in contact with both sides of the wafer cassette, clamping and limiting the wafer cassette.
[0065] Then, the second electric cylinder 306 is opened to drive the moving of the mounting plate 304. The movement of the mounting plate 304 drives the movement of the clamping bracket 307, and the movement of the clamping bracket 307 drives the movement of the wafer cassette, so that the wafer cassette is moved out of the inside of the cleaning tank 101. At this time, the movement of the mounting plate 304 drives the movement of the slider 305. When and only when the second toothed plate 311 and the fourth gear 313 are engaged, the fourth gear 313 is driven to rotate. The rotation of the fourth gear 313 drives the rotation of the one-way bearing 312. At this time, the inner and outer rings of the one-way bearing 312 rotate simultaneously. The simultaneous rotation of the inner and outer rings of the one-way bearing 312 drives the rotation of the first cross bar 105. At this time, the one-way bearing 312 located above the second cleaning tank 101 drives the first cross bar 105 located in the first cleaning tank 101 to rotate. The rotation of the first cross bar 105 drives the rotation of the second bevel gear 124. The rotation of the second bevel gear 124 drives the rotation of the first bevel gear 107. The rotation of the first bevel gear 107 drives the first rotating rod 106 to rotate one circle. The rotation of the first rotating rod 106 drives the rotation of the second toothless gear 126 and the first toothless gear 125;
[0066] At this time, when the first rotating rod 106 rotates the first and third quarter circles, the third gear 128 is driven to rotate half a circle by the engagement of the second toothless gear 126 and the third gear 128. The rotation of the third gear 128 drives the rotation of the rotating rod 108. The rotation of the rotating rod 108 drives the rotation of the mounting rod 109. The rotation of the mounting rod 109 drives the rotation of the rotating strip 110. The rotation of the rotating strip 110 drives the guide rod 111 to perform a circular motion. At this time, the circular motion of the guide rod 111 drives the reciprocating movement of the moving strip 104. The movement of the moving strip 104 drives the movement of the moving seat 102, so that the moving seats 102 approach each other, and the movement of the moving seats 102 drives the swinging of the swinging strip 103. The swinging of the swinging strip 103 drives the movement of the mounting frame 401, so that the mounting frame 401 moves up and down;
[0067] When the first rotating rod 106 rotates by the second and fourth quarter turns, at this time, the engagement of the first toothless gear 125 and the second gear 127 drives the second gear 127 to rotate. The rotation of the second gear 127 drives the gear rod 120 to rotate half a turn. The rotation of the gear rod 120 drives the second rotating rod 121 to rotate. The rotation of the second rotating rod 121 drives the driving strip 122 to rotate. The rotation of the driving strip 122 drives the guide rod 123 to perform a circular motion. At this time, the circular motion of the guide rod 123 drives the fixed strip 501 to reciprocate. The movement of the fixed strip 501 drives the pulling strip 504 to swing. The swing of the pulling strip 504 drives the nozzle 502 and the moving box 503 to move, so that the nozzle 502 and the moving box 503 are in contact with the upper and lower sides of the filter plate at the bottom of the installation frame 401. The water sprayed by the nozzle 502 cleans the filter plate. At this time, the cleaned water falls into the moving box 503, and the cleaned waste water enters the drainage grooves on both sides of the cleaning tank 101 through the drain pipes on both sides of the moving box 503, and then enters the collection box 202;
[0068] Finally, when the mounting plate 304 moves to the topmost position, at this time, the slider 305 is clamped inside the mounting block 302. The first electric cylinder 303 is opened to drive the mounting block 302 to move. The movement of the mounting block 302 drives the mounting plate 304 to move. The movement of the mounting plate 304 drives the wafer cassette to move, so that the wafer cassette moves to directly above the next cleaning tank 101.
[0069] Obviously, those skilled in the art can make various changes and modifications to the present invention without departing from the spirit and scope of the present invention. Thus, if these modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalent technologies, the present invention is also intended to include these changes and modifications.
Claims
1. A fully automatic single wafer cleaning machine, comprising a cleaning mechanism (1), characterized in that: Both sides of the three cleaning mechanisms (1) are provided with installation mechanisms (2) for collecting waste water, the upper surface of the installation mechanisms (2) is provided with a transport mechanism (3) for transporting a wafer box, the three cleaning mechanisms (1) are provided with a twisting mechanism (4) for driving the wafer box to twist, and the cleaning mechanism (1) is provided with a mechanism (5) for cleaning and flushing the filter plate.
2. A fully automatic single wafer cleaning machine as claimed in claim 1, characterized in that: The cleaning mechanism (1) comprises a cleaning tank (101), two rotating plates (112) are rotatably mounted in the tops of the three cleaning tanks (101), a No. 1 gear (113) is fixedly mounted on the outer surface of a rotating shaft on one side of the two rotating plates (112), two No. 1 toothed plates (114) are slidably mounted in the tops of the three cleaning tanks (101) on one side close to the No. 1 gear (113), and the No. 1 toothed plates (114) and the No. 1 gear (113) are meshed, a bidirectional screw (115) is rotatably mounted in the tops of the three cleaning tanks (101) on one side close to the No. 1 gear (113), and the bidirectional screw (115) is threadedly connected to the two No. 1 toothed plates (114), two fixed blocks (116) are fixedly mounted on the sides of the three cleaning tanks (101), a transmission rod (117) is rotatably mounted in the two fixed blocks (116), and transmission is performed between the transmission rod (117) and the bidirectional screw (115) via a synchronous wheel and a synchronous belt.
3. A fully automatic single wafer cleaning machine as claimed in claim 1, characterized in that: The mounting mechanism (2) comprises a mounting frame (201), and the two mounting frames (201) are located on both sides of the cleaning tank (101); a collecting box (202) and a fixing box (206) are fixedly mounted in the mounting frame (201), and the fixing box (206) is located directly above the collecting box (202); a transport pump (203) is fixedly mounted in the mounting frame (201), and a water inlet pipe and a water outlet pipe of the transport pump (203) are fixedly connected to the collecting box (202) and the fixing box (206), respectively; a water pump (204) is fixedly mounted on the upper surface of the fixing box (206), a connecting pipe (205) is fixedly mounted on the upper surface of the water pump (204), and an end of the connecting pipe (205) away from the water pump (204) is fixedly connected to the flushing mechanism (5).
4. A fully automatic single wafer cleaning machine as claimed in claim 1, characterized in that: The transport mechanism (3) comprises a transport frame (301), and the transport frame (301) is fixedly mounted on the mounting frame (201), a mounting plate (304) is slidably mounted between the two transport frames (301), sliders (305) are fixedly mounted on both sides of the mounting plate (304), and the sliders (305) are slidably arranged inside the transport frame (301), a No. 2 electric cylinder (306) is slidably mounted on the upper surfaces of the two transport frames (301), and the bottom end of the output shaft of the No. 2 electric cylinder (306) is fixedly connected to the slider (305), a mounting block (302) is slidably mounted on the top of the two transport frames (301), and the slider (305) is slidably clamped inside the mounting block (302), and a No. 1 electric cylinder (303) is fixedly mounted on the side surfaces of the two transport frames (301), and the output shaft of the No. 1 electric cylinder (303) is close to one end of the No. 2 electric cylinder (306). The slider (305) is fixedly connected to the mounting block (302). A third toothed plate (314) is fixedly installed in one side of the slider (305). A toothed rod (315) is rotatably installed in the top of the transport frame (301) on the left side. The toothed rod (315) and the transmission rod (117) are driven by a synchronous wheel and a synchronous belt. A fifth gear (316) is fixedly installed at one end of the toothed rod (315) away from the synchronous wheel. The fifth gear (316) and the third toothed plate (314) are movably engaged. A second toothed plate (311) is fixedly installed in one side of the slider (305) away from the mounting plate (304). Three one-way bearings (312) are rotatably installed in the middle of the transport frame (301) on the left side. A fourth gear (313) is fixedly installed at one end of the one-way bearing (312) close to the slider (305). The fourth gear (313) and the second toothed plate (311) are movably engaged.
5. A fully automatic single wafer cleaning machine as claimed in claim 4, characterized in that: A clamping frame (307) is slidably mounted on the lower surface of the mounting plate (304), and the side surfaces of the bottom end of the clamping frame (307) that are close to each other are in movable contact with the two sides of the wafer box. A driving plate (308) is rotatably mounted in the middle of the mounting plate (304), and connecting strips (309) are rotatably mounted on the lower surfaces of both ends of the driving plate (308), and one end of the connecting strip (309) away from the driving plate (308) is rotatably connected to the clamping frame (307). A second motor (310) is fixedly mounted on the upper surface of the mounting plate (304), and the bottom end of the output shaft of the second motor (310) is fixedly connected to the driving plate (308).
6. The fully automatic single wafer cleaning machine according to claim 1, characterized in that: The twisting mechanism (4) comprises a mounting frame (401), and the mounting frame (401) is located inside the cleaning tank (101), and the top of the mounting frame (401) is fixedly mounted with fixed plates (402) on the sides close to each other, and the ends of the two fixed plates (402) close to each other are rotatably mounted with swing plates (403), and the top of the mounting frame (401) is slidably mounted with two mounting seats (404) on the sides close to each other, and a push bar (405) is rotatably mounted in the mounting seat (404), and the end of the push bar (405) away from the mounting seat (404) is rotatably arranged on the swing plate (403), movable frames (409) are slidably installed in both sides of the top of the installation frame (401), and the two ends of the movable frame (409) are respectively fixedly connected to the two installation seats (404), and connecting rods (406) are rotatably installed in both sides of the top of the installation frame (401), and the ends of the two connecting rods (406) close to each other are fixedly installed with mounting strips (407), and the tops of the sides of the two mounting strips (407) close to each other are fixedly installed with fixed rods (408), and the ends of the two fixed rods (408) close to each other are slidably inserted into the inside of the movable frame (409).
7. The fully automatic single wafer cleaning machine as claimed in claim 2, characterized in that: A second cross bar (130) is rotatably mounted on both sides of the three cleaning tanks (101), and one end of the connecting rod (406) away from the mounting bar (407) is slidably clamped inside the second cross bar (130), and one end of the second cross bar (130) away from the connecting rod (406) is fixedly mounted with a fourth bevel gear (131), and a driving rod (118) is rotatably mounted on both sides of the three cleaning tanks (101), and the three driving rods (118) on both sides are connected to each other, and the two driving rods (118) are driven by a synchronous wheel and a synchronous belt, and a first motor (119) is fixedly mounted on the side of the cleaning tank (101) on the right side, and one end of the output shaft of the first motor (119) close to the cleaning tank (101) is fixedly connected to the driving rod (118), and a third bevel gear (129) is fixedly mounted on the outer surface of the driving rod (118), and the third bevel gear (129) and the fourth bevel gear (131) are meshed.
8. The fully automatic single wafer cleaning machine as claimed in claim 2, characterized in that: The three cleaning tanks (101) are provided with moving bars (104) slidably mounted on both sides of the tops thereof, and moving seats (102) are fixedly mounted on the sides of the two moving bars (104) close to each other at the tops thereof, and a swing bar (103) is rotatably mounted in the moving seat (102), and one end of the swing bar (103) away from the moving seat (102) is rotatably connected to the mounting frame (401), and two mounting rods (109) are rotatably mounted on both sides of the three cleaning tanks (101), and the mounting rods (109) are rotatably mounted on the two sides of the three cleaning tanks (101). 9) A rotating bar (110) is fixedly installed at one end close to the moving bar (104), a guide rod (111) is fixedly installed on the side of the rotating bar (110) away from the mounting rod (109), and one end of the guide rod (111) away from the rotating bar (110) is slidably inserted inside the moving bar (104), rotating rods (108) are rotatably installed in both sides of the three cleaning tanks (101), and the rotating rods (108) and the mounting rods (109) are driven by synchronous wheels and synchronous belts, and the three cleaning tanks (101) are connected to the rotating bar (110) and the mounting rods (109 ... A first rotating rod (106) is rotatably mounted on both sides of each cleaning tank (101), a second toothless gear (126) is fixedly mounted on the outer surface of the first rotating rod (106), a third gear (128) is fixedly mounted on the outer surface of the rotating rod (108), and the third gear (128) and the second toothless gear (126) are movably meshed, a first bevel gear (107) is fixedly mounted on the outer surface of the first rotating rod (106), and two first gears (107) are rotatably mounted on one side of the three cleaning tanks (101). The first cross bar (105) is provided with a second bevel gear (124), and the second bevel gear (124) is meshed with the first bevel gear (107).
9. The fully automatic single wafer cleaning machine as claimed in claim 2, characterized in that: The flushing mechanism (5) comprises a fixed bar (501), a nozzle (502) and a movable box (503), and the fixed bar (501) is slidably arranged inside the cleaning tank (101), the nozzle (502) is located directly above the movable box (503), and one end of the connecting pipe (205) away from the water pump (204) is fixedly connected to the nozzle (502), and two pulling bars (504) are rotatably installed on the side of the fixed bar (501) close to the nozzle (502), and one end of the upper and lower groups of pulling bars (504) away from the fixed bar (501) are respectively rotatably connected to the nozzle (502) and the movable box (503), and two No. 2 rotating rods (121) are rotatably installed on both sides of the three cleaning tanks (101), and the No. 2 rotating rods (121) are close to the movable box (503). ) is fixedly mounted with a driving bar (122) at one end thereof, a guide bar (123) is fixedly mounted on the side of the driving bar (122 away from the second rotating rod (121), and an end of the guide bar (123) away from the driving bar (122) is slidably inserted in the interior of the fixed bar (501), a gear bar (120) is rotatably mounted in one side of the three cleaning tanks (101) close to the moving box (503), and transmission is performed between the gear bar (120) and the two second rotating rods (121) via a synchronous wheel and a synchronous belt, a second gear (127) is fixedly mounted on the outer surface of the gear bar (120), and a first gear with missing teeth (125) is fixedly mounted on the outer surface of the first rotating rod (106) on the left side, and the first gear with missing teeth (125) and the second gear (127) are movably meshed.
10. A wafer cleaning method for a fully automatic single wafer cleaning machine according to any one of claims 1 to 9, characterized in that: The steps include: Step 1: Start the No. 1 motor (119) to drive the driving rod (118) to rotate, and the driving rod (118) drives the mounting bar (407) to rotate, and the mounting bar (407) drives the moving frame (409) to move, and the moving frame (409) drives the swing plate (403) to swing, and the swing plate (403) drives the wafer box to swing, so as to improve the contact efficiency between the wafers in the wafer box and the reagents in the cleaning tank (101); Step 2: Start the No. 2 electric cylinder (306) to drive the mounting plate (304) to move to the bottom, then start the No. 2 motor (310) to drive the clamping frame (307) to move, clamp the wafer box to limit the position, and move the wafer box; Step 3: The inner and outer rings of the one-way bearing (312) rotate simultaneously to drive the first crossbar (105) to rotate, and the rotation of the first crossbar (105) drives the first rotating rod (106) to rotate one circle, and when the first rotating rod (106) rotates the first quarter circle, it drives the rotating rod (108) to rotate half a circle, and the rotation of the rotating rod (108) drives the mounting frame (401) to move upward; Step 4: When the first rotating rod (106) rotates the second quarter turn, the gear rod (120) rotates half a turn, and the rotation of the gear rod (120) drives the nozzle (502) and the moving box (503) to move, so that the nozzle (502) and the moving box (503) contact the upper and lower sides of the filter plate at the bottom of the installation frame (401), and the filter plate is cleaned.