Novel micro-channel heat dissipation structure

Abstract

The invention provides a novel micro-channel heat dissipation structure, and relates to the technical field of heat dissipation structures. Comprising a substrate and a micro-channel arranged on the substrate, the micro-channel comprises a first main channel, a second main channel, a micro-channel main body and an auxiliary channel; a water inlet and a water outlet of the micro-channel main body are connected with a second main channel through a first main channel, the first main channel is connected with the water inlet, the second main channel is connected with the water outlet, the auxiliary channel is arranged in the micro-channel main body to form a cross structure, and the micro-channel main body is of a serial structure and is composed of a plurality of circular units; the water inlet is formed in the upper part of the micro-channel main body, the water outlet is formed in the lower part of the micro-channel main body, and the water inlet and the water outlet are bilaterally symmetrically arranged; the first main channel and the second main channel are both used for conducting cooling liquid, and the micro-channel main body is used for forming a multi-shunting structure and a confluence structure according to the auxiliary channels. The problem that in the prior art, the heat dissipation effect of a heat dissipation structure is poor is solved.

Description

Technical Field

[0001] The present invention relates to the technical field of heat dissipation structures, and particularly to a novel microchannel heat dissipation structure. Background Art

[0002] With the continuous development of electronic technology, the integration and processing power of chips have been greatly improved, and the heat generated during operation has increased sharply. For example, ultra-large-scale gate array chips and transceiver chips, etc., have a much higher heat generation power than traditional chips. Traditional heat dissipation technologies such as air cooling are difficult to meet the heat dissipation requirements of high heat flux density chips, and liquid cooling technology has become an inevitable development direction due to its high heat dissipation ability. At the same time, the trend of miniaturization, lightness, and thinness of modern electronic devices has put higher requirements on the volume and weight of the heat dissipation system. The liquid-cooled microchannel radiator has a compact structure and occupies a small space, and can well adapt to this development trend.

[0003] Traditional heat dissipation technologies, such as air cooling, are a common heat dissipation method, but their heat dissipation efficiency is relatively low, and they are greatly affected by the ambient temperature and air circulation conditions. In high-temperature environments or occasions with high heat dissipation requirements, air cooling often cannot effectively dissipate heat in time, resulting in too high a temperature of electronic devices and affecting their performance and reliability. Although traditional liquid cooling methods can take away the heat of the chips, there is still room for improvement in the flow mode of the coolant and the heat exchange efficiency. For example, problems such as uneven flow and incomplete exchange of the coolant in the liquid cavity will affect the heat dissipation effect. Therefore, for high heat flux density chips, a microchannel cooling device with high heat dissipation efficiency is urgently needed. Summary of the Invention

[0004] In order to overcome the deficiencies of the prior art, the purpose of the present invention is to provide a novel microchannel heat dissipation structure.

[0005] To achieve the above purpose, the present invention provides the following solution: A novel microchannel heat dissipation structure, comprising: A substrate and a microchannel provided on the substrate; The microchannel includes: A first main channel, a second main channel, a microchannel body, and a sub-channel; The water inlet and outlet of the microchannel body are connected by the first main channel and the second main channel. The first main channel is connected to the water inlet, the second main channel is connected to the water outlet, the sub-channel is arranged inside the microchannel body to form a cross structure, the microchannel body is a serial structure and is composed of multiple circular units; the water inlet is arranged above the microchannel body, the water outlet is arranged below the microchannel body, and both the water inlet and the water outlet are symmetrically arranged left and right; Both the first main channel and the second main channel are used for guiding the coolant flow, and the microchannel body is used to form a multi-branching structure and a confluence structure according to the secondary channels.

[0006] Preferably, the distance between each circular unit is 0.45 mm.

[0007] Preferably, the cross-sections of the water inlet and the water outlet of the microchannel body are both rectangular, with a width of 0.2 mm and a height of 0.3 mm.

[0008] Preferably, the height of the base is 0.6 mm, the distance between the top of the base and the top of the microchannel body is 0.15 mm, and the distance between the bottom of the base and the bottom of the microchannel body is 0.15 mm.

[0009] Preferably, the material of the base is a silicon-based material or a metal alloy material.

[0010] Preferably, the coolant is one of deionized water, freon, methanol, ethanol, ethylene glycol, or an ethylene glycol aqueous solution.

[0011] The present invention discloses the following technical effects: The present invention provides a novel microchannel heat dissipation structure, including: a base and a microchannel disposed on the base; the microchannel includes: a first main channel, a second main channel, a microchannel body, and a secondary channel; the water inlet and the water outlet of the microchannel body are connected by the first main channel and the second main channel, the first main channel is connected to the water inlet, the second main channel is connected to the water outlet, the secondary channel is disposed inside the microchannel body to form a cross structure, the microchannel body is a serial structure and is composed of multiple circular units; the water inlet is disposed above the microchannel body, the water outlet is disposed below the microchannel body, and both the water inlet and the water outlet are symmetrically arranged left and right; both the first main channel and the second main channel are used for guiding the coolant flow, and the microchannel body is used to form a multi-branching structure and a confluence structure according to the secondary channels. The present invention can improve the comprehensive heat dissipation performance of the microchannel radiator, and this structure adopts a double-in and double-out mode to enhance the heat dissipation effect of the microchannel radiator. Description of the Drawings

[0012] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for use in the embodiments. Obviously, the drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0013] Figure 1A three-dimensional perspective view of a novel microchannel heat dissipation structure provided by an embodiment of the present invention; Figure 2 A schematic diagram of a partial flow channel structure of a microchannel provided by an embodiment of the present invention; Figure 3 A schematic diagram of a microchannel structure provided by an embodiment of the present invention.

[0014] Reference numerals: 1, substrate; 2, first main channel; 3, water inlet; 4, microchannel main body; 5, sub-channel; 6, second main channel; 7, water outlet. Detailed implementation manners

[0015] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0016] To make the above objects, features, and advantages of the present invention more obvious and understandable, the present invention will be further described in detail below with reference to the accompanying drawings and specific implementation manners.

[0017] As Figure 1 shown, the present invention provides a novel microchannel heat dissipation structure, including: A substrate 1 and a microchannel provided on the substrate 1; The microchannel includes: A first main channel 2, a second main channel 6, a microchannel main body 4, and a sub-channel 5; The water inlet 3 and the water outlet 7 of the microchannel main body 4 are connected through the first main channel 2 and the second main channel 6. The first main channel 2 is connected to the water inlet 3, the second main channel 6 is connected to the water outlet 7, the sub-channel 5 is arranged inside the microchannel main body 4 to form a cross structure, the microchannel main body 4 is a serial structure and is composed of multiple circular units; the water inlet 3 is arranged above the microchannel main body 4, the water outlet 7 is arranged below the microchannel main body 4, and both the water inlet 3 and the water outlet 7 are symmetrically arranged left and right; Both the first main channel 2 and the second main channel 6 are used for guiding the coolant, and the microchannel main body 4 is used to form a multi-shunt structure and a confluence structure according to the sub-channel 5.

[0018] Specifically, the microchannel has a "copper coin" - shaped structure. The "copper coin" - shaped structure contains a large number of cross - shaped structures, which makes the fluid flow mode and direction change continuously. It can continuously disturb the boundary layer and prevent it from thickening continuously, thus strengthening heat transfer. At the same time, the numerous flow - splitting and flow - converging structures formed by the main microchannel 4 and the secondary microchannel 5 can play the role of redistributing the coolant flow rate and fluid mixing, further improving the temperature uniformity. In addition, the cross - shaped secondary channels designed inside the mesh holes of the main channel can further increase the convective heat - transfer area and strengthen its heat - dissipation ability.

[0019] The main microchannel 4 has a serial structure and is composed of multiple circular units. Among circular units with the same area, the circle has the shortest perimeter. The "copper coin" - shaped structure uses a shorter flow path with fewer flow - dead zones, which can reduce the flow resistance of the coolant. At the same time, the main channel has good distribution uniformity, can evenly distribute the entire heat - source area, increases the heat - transfer specific surface while avoiding the local heat - island phenomenon, and has good temperature uniformity.

[0020] Furthermore, the spacing between each circular unit is 0.45 mm. The circular unit is composed of an outer circle and a 90 - degree - arc sector. After forming the microchannel plane (multiple circular units), it is stretched to form the main microchannel 4. The local flow - channel structure is composed of Figures 2-3 As shown, numerous annular flow channels (the main microchannel 4 and the secondary microchannel 5) form numerous flow - splitting structures and flow - converging structures at the intersections and separations. At the same time, the inner - circle radius and the sector - angle radius of each ring are the same, making the microchannel form a "copper coin" - shaped structure. The annular flow channels are evenly distributed throughout the area to be cooled, showing axial symmetry and central symmetry. This makes the flow path of the serial structure shorter and has fewer flow - dead zones, which can reduce the flow resistance of the coolant. At the same time, the microchannel has good distribution uniformity.

[0021] Specifically, both the length of the flow channel and the size of the substrate 1 can be flexibly set according to actual needs. In terms of the material of the substrate 1, silicon is one of the excellent choices; and the choice of coolant is diverse, and deionized water is a common option.

[0022] Furthermore, the cross - sections of the water inlet 3 and the water outlet 7 of the main microchannel 4 are both rectangular, with a width of 0.2 mm and a height of 0.3 mm.

[0023] Furthermore, the height of the substrate 1 is 0.6 mm, the distance between the top of the substrate 1 and the top of the main microchannel 4 is 0.15 mm, and the distance between the bottom of the substrate 1 and the bottom of the main microchannel 4 is 0.15 mm.

[0024] Furthermore, the material of the substrate 1 is a silicon - based material or a metal - alloy material.

[0025] Specifically, the substrate 1 is made of a silicon-based material or a metal alloy material with a relatively high thermal conductivity (such as aluminum alloy, gold, etc.), and the thickness is 0.6 mm.

[0026] Furthermore, the coolant is deionized water, freon, methanol, ethanol, ethylene glycol or their aqueous solutions.

[0027] The present invention conducts model simulation with the help of Comsol multi-physics simulation software. During the simulation process, the computational domain is carefully divided into a liquid fluid domain and a substrate 1 solid domain. The thermal boundary condition is set as a generalized inward heat flux of 10 w / m², the heat dissipation rate of the heat source is 150 w, the liquid flow is set as a fully developed flow state, the initial flow rate is set as 20 ml / min, and the ambient temperature is set as 273.15 K.

[0028] Based on the cooling structure of the present invention, the cooling liquid flows into the serial microchannels simultaneously, homogeneously and in the same amount from two liquid inlets, conducts sufficient heat exchange with the microchannel wall surface, and then flows out from the liquid outlet, completing an efficient heat dissipation cycle.

[0029] Even further, the present embodiment also discloses the preparation method of the microchannel as follows: The microchannel can be processed on the substrate of the silicon-based material by photolithography or deep reactive ion etching technology, or processed on the metal substrate by micro milling or micro electrical discharge machining technology; or the aluminum-magnesium alloy and nickel-based alloy materials can be integrally processed and formed by metal 3D printing technology.

[0030] Specifically, to verify the superior performance of the microchannel structure provided by the present invention in heat dissipation, a traditional rectangular straight microchannel structure is used as a benchmark, and thermal simulation and comparative analysis are carried out on the two microchannel structures. According to the equal parameter principle, the following settings are made: the substrate materials and sizes are the same; the channel sizes are the same, and the cross-sections are all rectangles; the coolants are the same; the heat fluxes are the same; the heat source powers and sizes are the same; the flow channel coverage areas are basically the same. Based on this, the detailed thermal simulation calculation model parameters and the settings of each boundary condition parameter are as follows: 1. The size of the microchannel substrate is: 6 mm * 6.5 mm * 0.6 mm 2. Substrate material: silicon 3. Microchannel cross-section size: 0.2 mm * 0.3 mm 4. Heat source size: 6 mm * 6 mm * 0.1 mm 5. Coolant: liquid water 6. Ambient temperature: 273.15 K 7. Heat source power: 150 w 8. Generalized inward heat flux of the radiator: 10 w / m2 Two thermal simulation models of microchannel heat sinks are established. Using the same discretization format and solution model, thermal simulation calculations are carried out on three microchannel heat sink structures under different inlet flow rates, and the simulation results are shown in Table 1. Table 1 is a comparison table of simulation results, as follows: Table 1 Comparison Table of Simulation Results It can be analyzed from the above numerical simulation results that the microchannel structure designed in the present invention can more effectively control the temperature rise of the heating surface and has good temperature consistency, and the solid-liquid heat transfer efficiency has been significantly improved compared with the basic structure. Maximum temperature: The highest temperature of the system. Temperature difference: The difference between the highest temperature of the system and the outlet temperature.

[0031] In this specification, each embodiment is described in a progressive manner. The key point of each embodiment is to illustrate the differences from other embodiments. For the same or similar parts among the embodiments, reference can be made to each other.

[0032] Specific examples are used in this article to elaborate on the principle and implementation manner of the present invention. The description of the above embodiments is only used to help understand the method and its core idea of the present invention; at the same time, for those of ordinary skill in the art, according to the idea of the present invention, there will be changes in the specific implementation manner and application scope. In summary, the content of this specification should not be construed as a limitation to the present invention.

Claims

1. A novel microchannel heat dissipation structure, characterized in that: include: A substrate and a microfluidic channel disposed on the substrate; The microfluidic channel comprises: A first main channel, a second main channel, a microfluidic channel body, and a secondary channel; The water inlet and the water outlet of the microfluidic channel body are connected to the second main channel through the first main channel, the first main channel is connected to the water inlet, the second main channel is connected to the water outlet, the secondary channel is arranged inside the microfluidic channel body to form a cross structure, the microfluidic channel body is a serial structure and is composed of a plurality of circular units; the water inlet is arranged above the microfluidic channel body, the water outlet is arranged below the microfluidic channel body, and the water inlet and the water outlet are arranged symmetrically on the left and right; The first main channel and the second main channel are both used to conduct the cooling liquid, and the microchannel body is used to form a multi-dividing flow structure and a converging flow structure according to the secondary flow channel; The spacing between the circular units is 0.45mm; the cross-sections of the water inlet and outlet of the microfluidic channel body are both rectangular, with a width of 0.2mm and a height of 0.3mm; the height of the base is 0.6mm, the spacing between the top of the base and the top of the microfluidic channel body is 0.15mm, and the spacing between the bottom of the base and the bottom of the microfluidic channel body is 0.15mm.

2. A novel microchannel heat dissipation structure according to claim 1, characterized in that: The substrate is made of a silicon-based material or a metal alloy material.

3. A novel microchannel heat dissipation structure according to claim 1, characterized in that: The coolant is one of deionized water, Freon, methanol, ethanol, ethylene glycol or ethylene glycol aqueous solution.

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