Lead frame

Abstract

A lead frame for a semiconductor assembly is disclosed. The lead frame includes a first column array of die pads and a second column array of die pads. The die holders in the first column array are offset from the die holders in the second column array.

Description

Technical Field

[0001] The present invention relates to a lead frame for a semiconductor component and a semiconductor component. Background Art

[0002] Semiconductor components, such as transistors, are manufactured as layered components that include components such as a die pad, a die, clips, and a housing. The housing provides a protection function and (at least partially) surrounds the die and other components that form part of the semiconductor component. The housing may alternatively be referred to as encapsulation material.

[0003] The die pad is initially manufactured as part of a lead frame. The lead frame consists of a plurality of die pads (which may be interchangeably referred to as die pads) typically arranged in a columnar array. The lead frame is typically manufactured by removing material from a flat plate of copper, a copper alloy, or a FeNi alloy, and the material is typically removed by etching or stamping. The number of die pads that can be provided in a single lead frame is at least partially limited by the size of the initial material (e.g., a copper plate) and the width of the material that must be retained between adjacent die pads to provide the lead frame with structure and rigidity, otherwise the lead frame may warp to an unacceptable degree and, in the worst case, break. However, this material between the die pads is ultimately waste material because this material is typically removed when manufacturing individual semiconductor components, although it should be understood that a small amount of material between the die pads may remain when forming individual semiconductor components (i.e., after the cutting stage).

[0004] It is desirable to overcome one or more of the disadvantages associated with existing semiconductor components and lead frames, whether or not mentioned or otherwise referred to in this document. Summary of the Invention

[0005] According to a first aspect of the present invention, there is provided a lead frame for a semiconductor component, the lead frame including a first columnar array of die pads and a second columnar array of die pads;

[0006] wherein the die pads in the first columnar array are offset from the die pads in the second columnar array.

[0007] The lead frame and / or the die pads may alternatively be described as a plate of conductive material. The lead frame and the die pads may be made of a copper alloy or entirely of copper or of any other suitable material.

[0008] The lead frame may be used for leadless packaging such that leads do not extend from the die pads. In other embodiments, leads may extend from the die pads.

[0009] The term columnar array of die pads includes a plurality of die pads arranged in a column. That is, the die pads are arranged in a 1×n array. In this way, the first columnar array and the second columnar array of die pads define a 2×n array. The number of die pads in the first columnar array will typically be equal to the number of die pads in the second columnar array. However, in some embodiments, the number of die pads in the first columnar array can be different from the number of die pads in the second columnar array. The first columnar array and the second columnar array are parallel to each other.

[0010] The die pads in the first columnar array are the same as the die pads in the second columnar array. The offset of the die pads in the first columnar array from the die pads in the second columnar array includes: the die pads in the second columnar array are translated in a direction parallel to the first columnar array. That is, at least one (relative to the columnar direction) horizontal extending edge of the die pads in the first columnar array is not aligned with at least one horizontal extending edge of the die pads in the second columnar array. For example, the top edge of the die pads in the first columnar array is not aligned with the top (or bottom) edge of the die pads in the second columnar array. The second columnar array can be translated or shifted in a vertical direction relative to the first columnar array such that the die pads are offset. The offset of the die pads in the first columnar array from the die pads in the second columnar array is advantageous because it allows the spacing (referred to as the saw lane width) between the two columnar arrays to be reduced. The die pads in adjacent columnar arrays can be offset by rotating the adjacent columnar arrays 180 degrees. Reducing the saw lane width is beneficial because it allows an increase in the number of die pads that can be set on a lead frame of a given size. In other words, the density of die pads on the lead frame is increased. Increasing the density of die pads on the lead frame provides a significant reduction in manufacturing costs.

[0011] Each die pad can be further fabricated to form separate semiconductor components. Increasing the density of die pads on the lead frame reduces the total cost per semiconductor component and can result in further cost reduction by reducing the material cost of the encapsulation of the semiconductor component.

[0012] Each die pad can include a first pad and a second pad, the first pad can be larger than the second pad, and the first pads in the first columnar array can be offset from the first pads in the second columnar array.

[0013] The first pad can be configured to receive the die of the semiconductor component. The second pad can be configured to receive wire connections, such as wire bonding connections. In other embodiments, the second pad can be configured to receive metal clip connections or any other suitable type of connection.

[0014] The first pad being larger than the second pad includes: the surface area of the first pad is larger than that of the second pad.

[0015] The offset of the first pads of the first columnar array from the first pads of the second columnar array includes that the upper and lower edges of the first pads in the first columnar array are not aligned with the upper and lower edges of the first pads in the second columnar array. In other words, the first pads (and thus the second pads) in the second columnar array are translated relative to the first pads (and thus the second pads) in the first columnar array.

[0016] Each die seat in the first columnar array can be connected to a die seat in the second columnar array by a connection bar.

[0017] The term connection bar includes a part of the lead frame formed of the same material as the die seat and provides a mechanical connection between the first columnar array and the second columnar array. The connection bar provides stability and rigidity to the lead frame. Since the distance between the first columnar array and the second columnar array is reduced, the width of the connection bar is also reduced, which is beneficial because the rigidity of the lead frame is increased. Increasing the rigidity of the lead frame reduces the warping of the lead frame during further manufacturing processes such as molding. The ability to reduce the warping of the lead frame allows for the use of larger-sized lead frames.

[0018] The connection bar can extend in a direction substantially perpendicular to the first columnar array and the second columnar array.

[0019] That is, the connection bar extends in a direction orthogonal to the direction in which the die seats extend along the length of the columnar array. The connection bar can be directly attached to the die seat. However, in other embodiments, additional bars such as linking bars can extend in a direction substantially parallel to the first columnar array and the second columnar array. In other words, the connection bar can be perpendicular to the linking bar and perpendicular to the columnar array. The linking bar can be connected to the first pads and / or the second pads of the die seat. Additionally, the connection bar can be connected between the first pad and the second pad of each die seat to provide a connection.

[0020] During further manufacturing, when the lead frame is cut to provide individual semiconductor components, the linking bar and / or the connection bar can be cut by a laser.

[0021] The connection bar can extend in a non-parallel and non-perpendicular direction relative to the first columnar array and the second columnar array.

[0022] The connection bar extending in a non-parallel and non-perpendicular direction relative to the first columnar array and the second columnar array includes that the connection bar extends in a diagonal or inclined direction relative to the first columnar array and the second columnar array. In other words, the connection bar does not extend in a direction purely parallel to the first columnar array and the second columnar array, and the connection bar does not extend in a direction purely perpendicular to the first columnar array and the second columnar array. The connection bar extends in a direction including a parallel component and a perpendicular component.

[0023] It is advantageous to have diagonal connecting bars because this allows for a reduction in the width (saw lane width) between the first columnar array and the second columnar array. Reducing the saw lane width allows for an increase in the density of die pads on the lead frame, making the lead frame more cost-effective. For a lead frame of a given size, in addition to increasing the density of die pads, the diagonal connecting bars also increase the rigidity of the lead frame, which reduces warping of the lead frame during further manufacturing steps. The ability to reduce the warping of the lead frame allows for the use of larger-sized lead frames.

[0024] The diagonal connecting bars can be directly connected to the die pads. That is, the connecting bars do not need to be connected to the die pads via additional connections such as linking bars.

[0025] Each connecting bar can extend between a first pad of the first columnar array and a first pad of the second columnar array.

[0026] The connecting bar can be directly connected to the first pad. The connecting bar can be not connected to the first pad at the junction with any other connection (such as a linking bar).

[0027] The second columnar array can be rotated 180 degrees relative to the first columnar array.

[0028] It should be understood that the die pads in the first columnar array and the second columnar array can be the same. However, since the die pads can include a first pad and a second pad, where the first pad and the second pad have different sizes, rotating the second columnar array 180 degrees relative to the first columnar array causes the die pads of the first columnar array and the second columnar array to be offset from each other. It should be understood that the same effect can be achieved by rotating the first columnar array 180 degrees relative to the second columnar array.

[0029] Linking bars can be provided between the die pads in the first columnar array and the die pads in the second columnar array.

[0030] The linking bars are connections formed of the same material as the die pads and extend between the die pads in the first columnar array and the second columnar array. The linking bars can extend between the edges of adjacent die pads in the first columnar array and the edges of die pads in the second columnar array. The linking bars help provide rigidity to the lead frame. During further manufacturing processes, the linking bars can be cut to separate individual semiconductor components.

[0031] A first width can be defined between adjacent edges of the first columnar array and the second columnar array; and

[0032] A second width can be defined between adjacent first columnar arrays and second columnar arrays, where the second width can be less than the first width, and the second width can be between about 20 micrometers (μm) and about 100 μm.

[0033] That is, the second width is spaced from the edges of the first columnar array and the second columnar array.

[0034] The second width may be referred to as the saw lane width. The saw lane width may be between about 20 μm and about 150 μm. The saw lane width may be between about 30 μm and about 75 μm. The saw lane width may be between about 30 μm and about 50 μm. The saw lane width may be about 50 μm.

[0035] The lead frame may include a plurality of first columnar arrays and a plurality of second columnar arrays.

[0036] That is, the lead frame is composed of a plurality of first columnar arrays and a plurality of second columnar arrays. The first columnar array and the second columnar array may together define a columnar array pair. The lead frame may include a plurality of columnar array pairs. The columnar array pairs may be connected to each other via connection bars and / or linking bars. The die pads in adjacent columnar array pairs may be offset from each other.

[0037] The first columnar array may be adjacent to the second columnar array.

[0038] That is, when there are a plurality of first columnar arrays and a plurality of second columnar arrays, the columnar arrays may be arranged such that the first columnar array is always adjacent to the second columnar array. In other words, the first columnar array may not be adjacent to another first columnar array. In this way, adjacent columnar arrays are always offset from each other. Making adjacent columnar arrays always offset from each other helps to maximize the density of die pads on the lead frame by being able to reduce the width between adjacent columnar arrays.

[0039] The lead frame includes about 0.986 die pads per square millimeter.

[0040] That is, the size of the lead frame may be 53 mm × 185 mm, and since the saw lane width is reduced by having offset columns, 9672 die pads can be provided on the lead frame.

[0041] According to a second aspect of the present invention, there is provided a semiconductor component, which includes a lead frame according to the first aspect of the present invention, wherein a die is coupled to each die pad.

[0042] The term die includes semiconductor material. Then, circuits are generally fabricated on the surface of the die. The die may be formed of silicon.

[0043] The optional and / or preferred features of the first aspect of the present invention described herein are also applicable to the second aspect of the present invention, where appropriate. BRIEF DESCRIPTION OF THE DRAWINGS

[0044] Embodiments of the present invention will now be described by way of example only with reference to the accompanying drawings, in which:

[0045] Figure 1 A plan view showing a part of a lead frame for use in the manufacture of semiconductor components;

[0046] Figure 2 A plan view showing a part of a lead frame for use in the manufacture of semiconductor components according to an embodiment of the present invention; and

[0047] Figure 3 A plan view showing a part of another lead frame for use in the manufacture of semiconductor components according to an embodiment of the present invention. DETAILED DESCRIPTION

[0048] Figure 1 A plan view showing a part of a known lead frame 1 for use in the manufacture of semiconductor components. The lead frame 1 is actually a sheet of material, where the material has been selectively removed, for example, by stamping or etching, to define a plurality of die pads 3 (for convenience, only two die pads are provided with reference numerals 3). The sheet of material can be, for example, copper, a copper alloy, or a nickel-iron alloy.

[0049] The lead frame 1 can be described as a conventional lead frame.

[0050] Each die pad 3 includes a first larger pad 5 and a second smaller pad 7. The first pad 5 is larger because the surface area of the first pad is larger than that of the second pad 7. The first pad 5 is arranged such that a die is received on the pad 5. Where the die is a piece of semiconductor material. As is well known in the art, the second pad 7 is arranged such that the connection to the first pad 5 and the die can be made subsequently. In other embodiments, each die pad 3 can include three or more pads. In particular, in some embodiments, the smaller pad 7 can include a plurality of smaller pads.

[0051] Figure 1 The part of the lead frame 1 includes five columnar arrays 9 of die pads 3. For convenience, Figure 1 only two columnar arrays 5 are marked in. Each columnar array 5 includes five die pads 3. The die pads 3 are arranged in a column in each columnar array 5. Thus, the part of the lead frame 1 shown includes a 5×5 array of die pads. It should be understood that the number of die pads 3 in each columnar array 9 can be much greater than 5, and the lead frame 1 can similarly include more than 5 columnar arrays. For example, the lead frame 1 can include approximately 7000 die pads 3.

[0052] The die seats 3 in the columnar array 9 are connected to each other by the connecting bars 11. The die seats 3 are shown as being connected to adjacent die seats 3 in the same columnar array 9 by two connecting bars 11. However, in other embodiments, adjacent die seats 3 in the same columnar array 9 may be connected to each other by one connecting bar 11, and in other embodiments, they may be connected to each other by three or more connecting bars 11.

[0053] Additional connecting bars 13 project from the die seats 3 to connect the die seats 3 in adjacent columnar arrays 9. With respect to the columnar array 9, it can be seen that the connecting bars 11 connecting adjacent die seats 3 in the same columnar array 9 extend in a direction substantially parallel to the columnar array 9. The connecting bars 11 connecting the die seats 3 in adjacent columnar arrays extend in a direction substantially perpendicular to the columns of the columnar array 9.

[0054] The vertically extending connecting bars 13 connecting the die seats 3 in adjacent columnar arrays 9 are connected to each other by a connecting strip 15. The connecting strip 15 extends in a direction substantially parallel to the columnar array 9 and the connecting bars 11. The connecting strip 15 extends between adjacent vertically extending connecting bars 13. The connecting strip 15 provides additional rigidity to the lead frame 1. As described above, since the die seats 3 are formed by removing material from the plate, the connecting bars 11, 13 and especially the connecting strip 15 are required to support the die seats 3 and prevent the lead frame 1 from undergoing unacceptable warping and breaking during further manufacturing steps in the worst case.

[0055] Each die seat 3 ultimately goes on to form part of a single semiconductor component or package. To form a single semiconductor component or package, the lead frame 1 must be cut at some point during the manufacturing process. The step of cutting the lead frame includes sawing, especially using a rotating saw blade. The lead frame 1 can be fed to the rotating saw blade. In other words, the lead frame 1 and such a columnar array 9 can be moved relative to the rotating saw blade. In other embodiments, the cutting operation can be by various different cutting processes, including but not limited to reciprocating or rotating blades (i.e., sawing), lasers, water jets or other similar processes.

[0056] Each die seat 3 can be considered to have a first side 19, a second side 21, a third side 23 and a fourth side 25. Wherein, when observing Figure 1When referring to the plan view, the first side 19 is the top side, the second side 21 is the bottom side, the third side 23 is the right side, and the fourth side 25 is the left side. A first width 17 is defined between adjacent column arrays 9. In particular, the width 17 is defined between adjacent edges of the die seats 3. That is to say, the width 17 is defined between the third side 23 of the die seat 3 in one column array 9 and the fourth side 25 of the die seat 3 in the adjacent column array 9. In addition, for the width 17, another second width 18 is defined. The second width is set between adjacent column arrays 9 and can be referred to as the "saw lane width". The width 18 is wide enough so that a saw or other suitable cutting tool can cut through the link bars 13 and the connection bars 15 between adjacent column arrays to remove the connection bars 15, but narrow enough so that some encapsulation (material) remains on the die seats 3 to provide protection for the die seats 3, form the cutting tool, and / or account for variations and tolerances during cutting. In other words, the saw lane width 18 is less than the width 17, but wide enough to remove the connection bars 15. In other words, the saw lane width 18 is spaced from the edges of the die seats 3 in adjacent column arrays. The width 18 is further limited by the amount of material that must be provided by the connection bars 15 and the link bars 13 to provide the necessary support to the lead frame 1 during the manufacture of the semiconductor component. The saw lane width 18 is typically about 300 micrometers (μm). In some embodiments, the saw lane width 18 can be about 150 μm. However, if the saw lane width 18 is less than this width, there is not enough material to provide the necessary mechanical support to the lead frame, and the lead frame may undergo unacceptable warping and / or breakage. Additionally, if the saw lane width 18 is narrower than the width of the connection bars 15, or if the saw lane width is narrower than the width of the connection bars 15 plus the variations (tolerances) in the cutting and manufacture of the lead frame 1, it is not possible to remove all the material in the connection bars 15, which will subsequently result in an undesired electrical connection between adjacent die seats 3 and cause the failure of the component.

[0057] Turning to Figure 2 , which shows a plan view of a part of a lead frame 100 for use in the manufacture of a semiconductor component according to an embodiment of the present invention. For ease of understanding, Figure 2 The corresponding features in Figure 1 that are the same as the corresponding features in

[0058] The lead frame 100 includes a plurality of column arrays 9, and each column array 9 includes a plurality of die seats 3. The lead frame 100 is different from the lead frame 1 in Figure 1 in that the die seats 3 in adjacent column arrays are offset from each other. In particular, the lead frame 100 includes five column arrays labeled 9a - e. The die seats 3 in the column array 9a are not aligned with the die seats 3 in the adjacent column array 9b. Similarly, the die seats 3 in the column array 9b are not aligned with the die seats 3 in any of the adjacent column arrays 9a, 9c. While inFigure 1 it is clear that the die seats 3 in adjacent columnar arrays are aligned. In Figure 1 by way of example, the first pad 5 is aligned with the adjacent first pad 5 in the adjacent columnar array 9, and the second pad 7 is likewise aligned with the adjacent second pad 7 in the adjacent columnar array 9.

[0059] Conversely, in Figure 2 it can be seen that the first pad 5 is not aligned with any first pad 5 in the adjacent columnar array 9, and the second pad 7 is likewise not aligned with any second pad in the adjacent columnar array 9.

[0060] As Figure 1 shown, Figure 2 the lead frame 100 shown is a 5×5 array. It should be understood that in other embodiments, the lead frame 100 may include more than 5 columnar arrays 9, and each columnar array 9 may include more than 5 die seats 3.

[0061] In other embodiments, each die seat 3 may include three or more pads. In particular, in some embodiments, the smaller pads 7 may include a plurality of smaller pads.

[0062] In Figure 2 the embodiment shown, the adjacent columnar arrays 9 are offset from each other by a 180-degree rotation. That is, the columnar array 9b is rotated 180 degrees relative to the columnar array 9a. Similarly, the columnar array 9c is rotated 180 degrees relative to the columnar array 9b. It should be understood that the columnar array 9c is aligned with the columnar array 9a, but the columnar array 9c is not adjacent to the columnar array 9a.

[0063] Similar to Figure 1 the die seats 3 in the lead frame 1, the die seats 3 in the lead frame 100 in the same columnar array 9 are connected to each other by the connecting bars 111. The connecting bars 111 serve the same function as Figure 1 the connecting bars 11 in

[0064] In Figure 2In the illustrated embodiment, only one link bar 111 is shown extending between adjacent die pads 3 in the same columnar array 9. In other embodiments, two or more link bars 111 may be provided between adjacent die pads 3 in the same columnar array 9.

[0065] As with Figure 1 the illustrated embodiment, Figure 2 the lead frame 100 in

[0066] also includes link bars 113 extending in a direction substantially perpendicular to the columnar array 9.

[0067] Link bars 115 that extend diagonally between die pads 3 in adjacent columnar arrays 9 are advantageous because they provide a strong, firm, and rigid mechanical connection that reduces warping and / or breakage of the lead frame. In some embodiments, the link bars may extend in a direction perpendicular to the columnar array, particularly when the die pads are large, in which cases the link bars still provide a strong, firm, and rigid mechanical connection while still being able to benefit from the narrower saw lanes resulting from the offset of the die pads in adjacent columnar arrays.

[0068] Link bars 115 extend directly between the first pads 5 of die pads 3 in adjacent columnar arrays 9. That is, link bars 115 are connected to die pads 3 without an intermediate connection such as link bars 11, 13. Link bars 11, 13 do not form a connection with or meet any other connection such as link bars 11, 13 at the connection point. In other embodiments, link bars 115 may extend only between the second pads 7 of die pads in adjacent columnar arrays 9, or they may extend between the first pads 5 and the second pads 7 of die pads in adjacent columnar arrays 9, or any suitable combination, depending on how the die pads 3 in adjacent columnar arrays are offset from each other. In other embodiments, link bars 115 may be connected to die pads via an intermediate connection such as link bars 11, 13.

[0068] Another advantage of the inclined extension of link bars 115 towards the columnar array 9 is that the length of the saw lane width 18 is reduced. The saw lane width 18 may be from about 20 micrometers (μm) to 50 micrometers (μm). The saw lane width 18 may be about 20 micrometers (μm). The saw lane width 18 may be about 30 micrometers (μm). The saw lane width 18 may be about 50 micrometers (μm). The saw lane width 18 may be limited by the cutting tool used to separate the die pads in subsequent manufacturing processes.

[0069] For a lead frame 100 made of a material plate of a given size, when reducing the saw lane width 18 between each columnar array, more die pads 3 can be provided on the lead frame 100, and less material is discarded. By way of example, for a lead frame 1 made of a material plate sized 53 mm × 185 mm and having a saw lane width 18 of 150 μm and having connection bars substantially parallel to the columnar arrays, the lead frame 1 can include approximately 7,776 die pads (i.e., 0.793 die pads per square millimeter). In contrast, for a lead frame 100 also made of a material plate sized 53 mm × 185 mm and having a saw lane width 18 of 50 μm (as Figure 2 shown), the lead frame 100 can include 9,672 die pads (i.e., 0.986 die pads per square millimeter). This represents a 24% increase. Accordingly, the density of the die pads 3 provided on the lead frame increases while at least maintaining the rigidity of the lead frame if the rigidity of the lead frame is not increased.

[0070] As described above, the offset of the die pads 3 in adjacent columnar arrays 9 from each other is achieved by rotating the columnar array 180 degrees relative to an adjacent columnar array 9. In other embodiments, the die pads 3 can be offset in adjacent columnar arrays 9 by translating the adjacent columnar arrays 9 only in a direction substantially parallel to the columnar arrays 9 and / or by rotation of the columnar arrays 9 as already described.

[0071] Turning to Figure 3 . Figure 3 FIG. shows a plan view of a portion of another lead frame 200 for use in the manufacture of semiconductor components according to an embodiment of the present invention.

[0072] The portion of the lead frame 200 shown includes four columnar arrays 9a, 9b, 9c, 9d, and each columnar array 9 includes four die pads 3. Of course, it should be understood that only a portion of the lead frame 200 is shown, and the lead frame 200 can include more than four columnar arrays 9, and each columnar array can include more than four die pads 3.

[0073] The lead frame 200 is similar to the Figure 2 lead frame 100 shown in that the die pads 3 in adjacent columnar arrays 9 are offset from each other. That is, the die pads 3 in columnar array 9b are not aligned with the die pads 3 in adjacent columnar arrays 9a, 9c. In particular, in Figure 3 , the first pads 5 are not aligned with any of the first pads 5 in adjacent columnar arrays 9, and the second pads 7 are likewise not aligned with any of the second pads in adjacent columnar arrays 9.

[0074] The lead frame 200 is similar to the Figure 2The leadframe 100 differs in that the die pads 3 in the adjacent columnar arrays 9 are offset by translating the columnar arrays 9 in a direction parallel to the columnar arrays 9 (rather than rotating them 180 degrees).

[0075] Similar to Figure 1 and Figure 2 the die pads in, the die pads 3 are connected to each other by connecting bars 11, 13. The leadframe 200 further includes a connecting bar 215. The connecting bar 215 extends in a direction substantially perpendicular to the columnar arrays 9 and the connecting bars 11. The connecting bar 215 provides support and rigidity to the leadframe 200. Since the die pads 3 in the adjacent columnar arrays 9 are offset, the width of the connecting bar 215 and thus the saw lane width 18 can be reduced. Accordingly, the density of the die pads 3 provided on the leadframe 200 of a given size is increased.

[0076] In subsequent manufacturing steps, to separate the die pads 3 from the leadframe 200, the connecting bars 11 and the connecting bar can be cut along the cutting lines 220. The connecting bars 11 can be cut with a laser, which may be more effective considering that there is no continuous path through which a saw blade can easily pass across the columnar arrays 9. The connecting bar 215 can be cut with a saw or a laser. However, the connecting bars 11 and the connecting bar 215 can be cut with any suitable cutting tool or member.

[0077] Figures 1 to 3 The leadframes 1, 100, 200 shown are for leadless (or lead-free, or flat leadless) semiconductor packages. It should be understood that the leadframes 100, 200 can be applicable to other types of semiconductor components or packages that do indeed include leads, arms, connectors, etc.

Claims

1. A lead frame for a semiconductor component, the lead frame comprising a first columnar array of a die pad and a second columnar array of a die pad; The die pads in the first columnar array are offset from the die pads in the second columnar array. 2 . The lead frame of claim 1 , wherein each die pad comprises a first pad and a second pad, the first pad being larger than the second pad, and wherein the first pad in the first columnar array is offset from the first pad in the second columnar array.

3. The lead frame according to any one of claims 1 or 2, wherein each die pad in the first columnar array is connected to a die pad in the second columnar array by a connecting bar. 4 . The lead frame of claim 3 , wherein the connecting bar extends in a direction substantially perpendicular to the first columnar array and the second columnar array. 5 . The lead frame of claim 3 , wherein the connecting bar extends in a non-parallel and non-perpendicular direction relative to the first column array and the second column array. 6 . The lead frame of claim 5 , wherein each connecting bar extends between a first pad of the first column array and a first pad of the second column array.

7. The lead frame of any one of the preceding claims, wherein the second columnar array is rotated 180 degrees relative to the first columnar array.

8. The lead frame of any one of the preceding claims, wherein a tie bar is provided between the die paddles in the first columnar array and the die paddles in the second columnar array.

9. The lead frame of any of the preceding claims, wherein a first width is defined between adjacent edges of the first columnar array and the second columnar array; and A second width is defined between adjacent first column arrays and second column arrays, wherein the second width is smaller than the first width, and the second width is between about 20 micrometers μm and about 100 μm.

10. The lead frame according to any one of the preceding claims, wherein the lead frame comprises a plurality of first columnar arrays and a plurality of second columnar arrays. The lead frame of claim 10 , wherein the first column array is always adjacent to the second column array.

12. A semiconductor component comprising a lead frame according to any one of the preceding claims, wherein a die is coupled to each die pad.

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