PCB welding machine

Abstract

The invention provides a PCB welding machine which comprises a first line folding device, a board picking device, a welding device and a conveying mechanism, the first line folding device comprises a first lifting mechanism and a first bending head, and the first lifting mechanism is used for driving the first bending head to ascend and descend; the board picking device is used for sleeving the PCB with a second pin of the sub-assembly; the welding device comprises a welding workbench, a second line folding device, a welding mechanism and a detection mechanism, the welding workbench is used for placing the stator assembly, the second line folding device is used for bending a second pin to be attached to a bonding pad of the PCB, the welding mechanism is used for welding the second pin and the bonding pad, and the detection mechanism is used for detecting the assembly quality of the PCB and the stator assembly; the conveying mechanism is used for conveying the stator assembly among the first line folding device, the plate picking device and the welding device. The PCB welding machine automatically completes multiple procedures, the assembling efficiency is effectively improved, and assembling of the PCB and the stator assembly can be completed within 25 s.

Description

Technical Field

[0001] This application belongs to the field of motor assembly equipment, and more specifically, relates to a PCB soldering machine. Background Art

[0002] The drive motor is a commonly used power structure and also the most critical component of related products. Its main function is to generate driving torque, and it is an electromagnetic device that realizes the conversion or transmission of electrical energy based on the law of electromagnetic induction. In order to reduce the volume of the drive motor, the windings of the stator assembly need to be soldered to the PCB (Printed Circuit Board) in the form of plug-ins.

[0003] The existing plug-in type PCB soldering steps are as follows: First, use a folding device to fold the first pins of the stator assembly; Second, manually pick up the material and insert the second pins of the stator assembly that have not been folded into the PCB; Third, manually place the inserted stator assembly and PCB onto the folding device; Fourth, the folding device folds the second pins to fit the pads of the PCB; Fifth, referring to Chinese Patent CN220943590U, manually place the stator assembly and PCB onto the carrying component, and the transmission line passes the carrying component through the soldering station and the detection station in sequence, and performs soldering and detection operations in sequence. Therefore, the existing plug-in type PCB soldering solution has many steps and low soldering efficiency. Summary of the Invention

[0004] The purpose of the embodiments of this application is to provide a PCB soldering machine to solve the problem of low soldering efficiency of the PCB soldering solution in the related art.

[0005] To achieve the above purpose, the technical solution adopted in the embodiments of this application is: Provide a PCB soldering machine, including: A first folding device, including a first lifting mechanism and a first folding head. The first folding head has a plurality of pressing blocks circumferentially spaced apart. The first lifting mechanism is used to drive the first folding head to lift and lower, so that the plurality of pressing blocks respectively bend a plurality of first pins of the stator assembly; A board picking device, used to sleave the second pins of the PCB on the stator assembly; A soldering device, including a soldering workbench, a second folding device, a soldering mechanism, and a detection mechanism. The soldering workbench is used to place the stator assembly. The second folding device is used to bend the second pins to fit the pads of the PCB. The soldering mechanism solders the second pins and the pads. The detection mechanism is used to detect the assembly quality of the PCB and the stator assembly; A transmission mechanism, used to transfer the stator assembly between the first folding device, the board picking device, and the soldering device.

[0006] In one embodiment, the first folding line device further includes a lifting bracket, which is installed at the output end of the first lifting mechanism, and the first folding head and the PCB picking device are installed on the lifting bracket at intervals in the horizontal direction.

[0007] In one embodiment, the PCB picking device includes a picking bracket and a plurality of elastic negative pressure members, the picking bracket is installed on the lifting bracket, and the plurality of elastic negative pressure members are distributed at intervals along the circumference of the picking bracket.

[0008] In one embodiment, the PCB picking device further includes a rigid limiting column, the rigid limiting column is installed on the lifting bracket, the rigid limiting column is arranged in parallel with the elastic negative pressure member, and the bottom end of the rigid limiting column is higher than the bottom end of the elastic negative pressure member in the initial state.

[0009] In one embodiment, the bottom end of the rigid limiting column is higher than the bottom end of the elastic negative pressure member when it is at 2 / 3 of the compression limit length.

[0010] In one embodiment, the elastic negative pressure member includes a rubber suction cup, the rubber suction cup has a vertically penetrating negative pressure hole, and the bottom end of the rubber suction cup is used to directly adsorb the PCB.

[0011] In one embodiment, the rubber suction cup includes a first shaft section, a second shaft section and a third shaft section from top to bottom, the outer diameter of the first shaft section is larger than the outer diameters of the second shaft section and the third shaft section, the outer diameter of the second shaft section gradually decreases and then gradually increases from top to bottom, and the outer diameter of the third shaft section gradually increases from top to bottom.

[0012] In one embodiment, the picking bracket is installed on the lifting bracket through a buffer rubber sleeve; the elastic modulus of the buffer rubber sleeve is greater than the elastic modulus of the elastic negative pressure member.

[0013] In one embodiment, the picking bracket is provided with a stroke trigger, and the lifting bracket is provided with a lifting switch, and the lifting switch is electrically connected to the first lifting mechanism.

[0014] In one embodiment, when the buffer rubber sleeve is at 2 / 3 of the compression limit length, the stroke trigger triggers the lifting switch to stop the first lifting mechanism.

[0015] In one embodiment, the second folding line device includes a radial driving mechanism, a second lifting mechanism, a second folding head, and a bending jig; the second lifting mechanism and the bending jig are installed on the radial driving mechanism and move toward or away from the welding workbench under the drive of the radial driving mechanism; the bending jig has a bending positioning opening for wrapping the second lead, the second folding head is installed on the second lifting mechanism, and the second lifting mechanism drives the second folding head to move downward to the bending positioning opening.

[0016] In one embodiment, the number of the second folding line devices is two, and the two second folding line devices are located on opposite sides of the welding workbench.

[0017] In one embodiment, the shape of the bending positioning opening is triangular, the width of the bending positioning opening gradually decreases in the direction approaching the radial driving mechanism, and the shape of the second folding head is adapted to the shape of the bending positioning opening.

[0018] In one embodiment, the welding mechanism includes a third lifting mechanism and a welding head, and the third lifting mechanism drives the welding head to move downward to approach the welding workbench.

[0019] In one embodiment, the welding head is installed on the third lifting mechanism through a first rotating mechanism, and the first rotating mechanism drives the welding head to rotate around the vertical direction.

[0020] In one embodiment, the detection mechanism includes two lidars arranged at intervals, and the two lidars jointly detect the same pad.

[0021] In one embodiment, the welding device further includes a photoelectric detection component, which is electrically connected to the second folding line device and is used to detect whether the second lead exists at the working position of the second folding line device.

[0022] The PCB welding machine provided by the embodiment of the present application has at least the following beneficial effects: The first lifting mechanism drives the first bending head to descend, and multiple pressing blocks of the first bending head automatically bend multiple first pins of the stator assembly; the transmission mechanism automatically transports the stator assembly to the lower part of the board picking device, and the board picking device picks up the PCB and automatically sleevs it on the second pins of the stator assembly; the transmission mechanism automatically transports the sleeved stator assembly and PCB to the welding workbench of the welding device; the second folding device automatically bends the second pins and pastes them on the pads of the PCB; the welding mechanism automatically welds the second pins and the pads, realizing the welding and assembly of the PCB and the stator assembly; the detection mechanism detects the assembly quality of the PCB and the stator assembly in place; based on this, the PCB welding machine automatically completes a series of operations such as first pin bending, insertion of the PCB and the stator assembly, second pin bending, welding and quality detection, realizing multi-process integrated automation operation, making the assembly process smoother and more efficient, effectively improving the assembly efficiency, and the automation operation reduces the manual participation links and improves the assembly consistency. Description of the Drawings

[0023] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following will briefly introduce the drawings required for use in the embodiments or exemplary technical descriptions. Obviously, the drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0024] Figure 1 It is an assembly schematic diagram of the stator assembly and the PCB; Figure 2 It is Figure 1 the structural schematic diagram of the stator assembly in Figure 3 It is Figure 1 the structural schematic diagram of the PCB in Figure 4 It is the structural schematic diagram of the PCB welding machine in the embodiment of the present application; Figure 5 It is the structural schematic diagram of the first folding device and the board picking device of the PCB welding machine in the embodiment of the present application; Figure 6 It is the working schematic diagram of the first bending head of the first folding device in the embodiment of the present application; Figure 7 It is Figure 6 the partial enlarged view of place A of Figure 8 It is the working schematic diagram of the board picking device of the PCB welding machine in the embodiment of the present application; Figure 9 It is the structural schematic diagram of the rubber suction cup of the board picking device; Figure 10 Schematic diagram of the working of the soldering device of the PCB soldering machine in the embodiment of the present application; Figure 11 Schematic diagram of the structure of the second folding line device of the soldering device in the embodiment of the present application; Figure 12 Another perspective view of the soldering device of the PCB soldering machine in the embodiment of the present application; Figure 13 Schematic diagram of the detection principle of the detection mechanism of the soldering device in the embodiment of the present application.

[0025] Among them, the main reference signs in each figure are as follows: 10, stator assembly; 11, first pin; 12, second pin; 20, PCB; 21, pad; 22, limiting notch; 100, first folding line device; 110, first lifting mechanism; 120, first folding head; 121, pressing block; 130, lifting bracket; 140, lifting switch; 150, folding line workbench; 200, board picking device; 210, board picking bracket; 220, elastic negative pressure member; 221, rubber suction cup; 222, negative pressure hole; 223, first shaft section; 224, second shaft section; 225, third shaft section; 230, rigid limiting column; 240, buffer rubber sleeve; 250, stroke trigger member; 260, board detecting circuit member; 300, soldering device; 310, soldering workbench; 311, second rotating mechanism; 320, second folding line device; 321, radial driving mechanism; 322, second lifting mechanism; 323, second folding head; 324, bending jig; 325, bending positioning port; 330, soldering mechanism; 331, third lifting mechanism; 332, soldering head; 333, first rotating mechanism; 340, detection mechanism; 341, lidar; 342, vision sensor; 350, photoelectric detection component; 400, transmission mechanism. Detailed implementation manners

[0026] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present application clearer, the present application will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0027] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

[0028] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the present application, "a plurality of" means two or more unless otherwise specifically defined. "Several" means one or more unless otherwise specifically defined.

[0029] In the description of the present application, it should be understood that the orientation or positional relationship indicated by the terms "center", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the indicated device or element must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation to the present application.

[0030] In the description of the present application, it should be noted that unless otherwise clearly specified and limited, the terms "mounted", "connected" and "coupled" should be understood in a broad sense. For example, it may be a fixed connection, a detachable connection or an integral connection; it may be a mechanical connection or an electrical connection; it may be directly connected or indirectly connected through an intermediate medium, and it may be the communication inside two elements or the interaction relationship between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific circumstances.

[0031] Reference throughout the specification to "one embodiment" or "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment of the present application. Thus, the phrases "in one embodiment" or "in some embodiments" appearing throughout the specification are not necessarily all referring to the same embodiment. In addition, in one or more embodiments, the specific features, structures, or characteristics may be combined in any suitable manner.

[0032] Figure 1 A schematic structural view showing the assembled stator assembly 10 and the PCB 20 is shown. The first pin 11 of the stator assembly 10 is bent and located at the bottom of the PCB 20 to avoid the PCB 20. The second pin 12 of the stator assembly 10 passes through the PCB 20 and is bent and welded to the pad 21 of the PCB 20 to achieve electrical connection between the stator assembly 10 and the PCB 20, and the stator assembly 10 and the PCB 20 form an assembly. Figure 2 A stator assembly 10 in the assembly is shown, and the first pin 11 and the second pin 12 have completed the bending operation. Before assembly,Figure 2 The first pin 11 and the second pin 12 of the stator assembly 10 in Figure 2 stand upright instead of being bent, and need to be bent before welding. Figure 3 Show the PCB 20 in the assembly. Specifically, the PCB 20 is provided with a limit notch 22, the pad 21 is located at the edge of the limit notch 22, the second pin 12 passes through the limit notch 22 and is bent inward to fit on the pad 21, and then welding is performed. Combining Figure 2 and Figure 3 , in a specific embodiment, the stator assembly 10 has six groups of first pins 11, which need to be bent before inserting the PCB 20 to avoid interference with the PCB 20. The stator assembly 10 has six groups of second pins 12 that need to pass through the PCB 20 and be welded to the corresponding pads 21, and the number of each group of second pins 12 is two.

[0033] Please refer to Figure 4 , and now the PCB welding machine provided by the embodiment of the present application will be described. The PCB welding machine includes a first folding device 100, a board picking device 200, a welding device 300, and a transmission mechanism 400. Refer to Figure 5 and Figure 6 , the first folding device 100 includes a first lifting mechanism 110 and a first folding head 120. The first folding head 120 has a plurality of pressing blocks 121 distributed at circumferential intervals. The first lifting mechanism 110 is used to drive the first folding head 120 to lift, so that the plurality of pressing blocks 121 respectively bend the plurality of first pins 11 of the stator assembly 10. The board picking device 200 is used to sleave the second pins 12 of the stator assembly 10 with the PCB 20.

[0034] Please refer to Figure 10 , the welding device 300 includes a welding workbench 310, a second folding device 320, a welding mechanism 330, and a detection mechanism 340. The welding workbench 310 is used to place the stator assembly 10. The second folding device 320 is used to bend and attach the second pin 12 to the pad 21 of the PCB 20. The welding mechanism 330 welds the second pin 12 and the pad 21. The detection mechanism 340 is used to detect the assembly quality of the PCB 20 and the stator assembly 10. The transmission mechanism 400 is used to transfer the stator assembly 10 between the first folding device 100, the board picking device 200, and the welding device 300.

[0035] The specific working process is as follows: The first lifting mechanism 110 drives the first folding elbow 120 to descend, and multiple pressing blocks 121 of the first folding elbow 120 automatically bend multiple first pins 11 of the stator assembly 10. The transmission mechanism 400 automatically transports the stator assembly 10 to the lower part of the PCB picking device 200. The PCB picking device 200 picks up the PCB 20 and automatically sleevs it on the second pins 12 of the stator assembly 10. The transmission mechanism 400 automatically transports the sleeved stator assembly 10 and PCB 20 to the welding workbench 310 of the welding device 300. The second folding device 320 automatically bends the second pins 12 and pastes them on the pads 21 of the PCB 20. The welding mechanism 330 automatically welds the second pins 12 and the pads 21 to realize the welding and assembly of the PCB 20 and the stator assembly 10. The detection mechanism 340 detects the assembly quality of the PCB 20 and the stator assembly 10 in place.

[0036] Based on this, the PCB welding machine automatically completes a series of operations such as bending the first pins 11, inserting the PCB 20 and the stator assembly 10, bending the second pins 12, welding, and quality inspection, realizing multi-process integrated automation operation, making the assembly process smoother and more efficient, effectively improving the assembly efficiency. The automated operation reduces the manual participation links and improves the assembly consistency.

[0037] In one embodiment, please refer to FIG. 4. The transmission mechanism 400 can be a multi-axis manipulator, a transfer manipulator, a conveyor belt, or a rotating disc, which is not limited uniquely here. For example, when the transmission mechanism 400 is a rotating disc, the first folding device 100, the PCB picking device 200, and the welding device 300 are sequentially and spaced apart along the circumference of the rotating disc. The stator assembly 10 is placed on the rotating disc and, as the rotating disc rotates, sequentially passes through the first folding device 100, the PCB picking device 200, and the welding device 300, and sequentially completes the bending of the first pins 11, sleeving the PCB 20, bending the second pins 12, and welding. For example, when the first folding device 100, the PCB picking device 200, and the welding device 300 are arranged in a straight line, the transmission mechanism 400 is a transfer manipulator. The transfer manipulator realizes the linear transportation of the stator assembly 10 by clamping the stator assembly 10 and sequentially completes the bending of the first pins 11, sleeving the PCB 20, bending the second pins 12, and welding.

[0038] In one embodiment, the PCB welding machine includes a control mechanism. The control mechanism is electrically connected to the first folding device 100, the PCB picking device 200, the welding device 300, and the transmission mechanism 400 respectively, so that the first folding device 100, the PCB picking device 200, the welding device 300, and the transmission mechanism 400 smoothly perform operations such as bending the first pins 11, threading the PCB 20, bending the second pins 12, welding, and detection according to the production rhythm.

[0039] In one embodiment, please refer to Figure 6 and Figure 7, as a specific implementation of the PCB soldering machine provided by the embodiments of the present application, the pressing block 121 is an arc piece. A plurality of pressing blocks 121 are located on the same circumference and are spaced apart. The plurality of pressing blocks 121 are spaced along the circumference to form a stable annular structure, which can synchronously position and bend a plurality of first pins 11 of the stator assembly 10, and ensure that the bending angles and position heights of each first pin 11 are the same, avoiding the deviation or inconsistent angle of the first pin 11 caused by single-point pressing, and improving the assembly accuracy. The space formed by the interval between two adjacent pressing blocks 121 accommodates the second pin 12, so that the second pin 12 will not be bent when the first pin 11 is bent.

[0040] In one embodiment, please refer to Figures 5 to 7 , as a specific implementation of the PCB soldering machine provided by the embodiments of the present application, the first folding device 100 further includes a lifting bracket 130. The lifting bracket 130 is installed at the output end of the first lifting mechanism 110. The first folding head 120 and the board picking device 200 are installed on the lifting bracket 130 at intervals in the horizontal direction. The first lifting mechanism 110 drives the first folding head 120 and the board picking device 200 to lift synchronously through the lifting bracket 130, reducing the power components, making full use of the space, making the structure of the entire first folding device 100 more compact, reducing the floor area of the PCB soldering machine, and reducing the control difficulty of the PCB soldering machine. When the previous stator assembly 10 is bending the first pin 11, the next stator assembly 10 and the PCB 20 are sleeved, improving the continuity of the operation, and the lifting bracket 130 bears the bending reaction force and the sleeving reaction force at the same time, which is beneficial to the force balance.

[0041] In one embodiment, please refer to Figure 4 , the first folding device 100 further includes a folding workbench 150. The folding workbench 150 has two working stations, which are respectively located directly below the first folding head 120 and the board picking device 200. The working station has positioning holes for limiting the stator assembly 10 to ensure the stable position of the stator assembly 10 during the operation.

[0042] In one embodiment, the PCB 20 can be loaded onto the board picking device 200 through the transfer mechanism 400, or can be loaded through other mechanisms, which is not specifically limited herein.

[0043] In one embodiment, please refer to Figure 5 and Figure 8, as a specific implementation of the PCB soldering machine provided in the embodiments of the present application, the PCB picking device 200 includes a picking bracket 210 and a plurality of elastic negative pressure members 220. The picking bracket 210 is installed on the lifting bracket 130, and the plurality of elastic negative pressure members 220 are distributed at intervals along the circumference of the picking bracket 210. The plurality of elastic negative pressure members 220 work simultaneously to form a multi-point adsorption force, ensuring uniform force on the PCB 20 during the picking process. On the one hand, the elastic negative pressure member 220 has an elastic buffering function, which can adapt to the minute deformation or unevenness on the surface of the PCB 20, ensuring that the adsorption surface is closely attached to the PCB 20 and improving the picking success rate; on the other hand, air can be squeezed out through elastic compression to form a larger fitting surface with the PCB 20, increasing the adsorption force.

[0044] In one embodiment, please refer to Figure 8 , as a specific implementation of the PCB soldering machine provided in the embodiments of the present application, the PCB picking device 200 further includes a rigid limiting column 230. The rigid limiting column 230 is installed on the lifting bracket 130. The rigid limiting column 230 is arranged in parallel with the elastic negative pressure member 220, and the bottom end of the rigid limiting column 230 is higher than the bottom end of the elastic negative pressure member 220 in the initial state. When the PCB picking device 200 descends, the bottom end of the elastic negative pressure member 220 contacts the PCB 20 prior to the rigid limiting column 230, realizing flexible pressing of the PCB 20 to avoid damaging the PCB 20. As the elastic negative pressure member 220 descends and compresses, while increasing the adsorption area, the rigid limiting column 230 abuts against the PCB 20, restricting the excessive compression of the elastic negative pressure member 220 and at the same time indicating that the elastic negative pressure member 220 has been adsorbed in place.

[0045] Specifically, the bottom end of the rigid limiting column 230 is higher than the bottom end of the elastic negative pressure member 220 when it is at 2 / 3 of the compression limit length. For example, the compression limit length of the elastic negative pressure member 220 is 3 cm. When the compression length of the elastic negative pressure member 220 is 2 cm, the bottom end of the rigid limiting column 230 contacts the PCB 20, restricting the continued compression of the elastic negative pressure member 220, so that the maximum compression amount of the elastic negative pressure member 220 is 2 cm.

[0046] Based on this, the elastic negative pressure member 220 will generate fatigue damage during repeated compression and release processes. The greater the compression amount, the more serious the fatigue damage. By setting the height of the rigid limiting column 230, the maximum compression amount of the elastic negative pressure member 220 can be accurately controlled to be 2 / 3 of the compression limit length, avoiding the decline or failure of the elastic performance caused by excessive compression, thereby maintaining the stable operation of the PCB picking device 200. At the same time, excessive compression will also increase the risk of leakage due to the too large contact area of the elastic negative pressure member 220.

[0047] In a specific embodiment, in combination with Figure 5 and Figure 8, the PCB picking device 200 further includes a circuit component 260 for testing the board. The rigid limiting posts 230 are conductive, and the rigid limiting posts 230 are electrically connected to the circuit component 260 for testing the board. The number of the rigid limiting posts 230 is three. When the first rigid limiting post 230 contacts the PCB 20, a test voltage is supplied to the PCB 20. When the second rigid limiting post 230 contacts the PCB 20, the real-time voltage of the PCB 20 is obtained. When the third rigid limiting post 230 contacts the PCB 20, the real-time current at the contact point of the PCB 20 is obtained. Among them, the circuit component 260 for testing the board adjusts the test voltage in real time according to the real-time current until the measured value of the real-time voltage is the preset voltage value, so as to avoid the voltage drop caused by intermediate transmission components such as the rigid limiting posts 230, so that the actual test voltage of the PCB 20 is lower than the preset test voltage, resulting in errors in the test of the circuit component 260 for testing the board, thereby improving the test accuracy.

[0048] In one embodiment, please refer to Figure 8 and Figure 9 , as a specific implementation manner of the PCB soldering machine provided by the embodiment of the present application, the elastic negative pressure member 220 includes a rubber suction cup 221. The rubber suction cup 221 has a vertically penetrating negative pressure hole 222. The bottom end of the rubber suction cup 221 is used to directly adsorb the PCB 20. The rubber suction cup 221 includes a first shaft section 223, a second shaft section 224, and a third shaft section 225 from top to bottom. The outer diameter of the first shaft section 223 is larger than the outer diameters of the second shaft section 224 and the third shaft section 225. The outer diameter of the second shaft section 224 first gradually decreases and then gradually increases from top to bottom. The outer diameter of the third shaft section 225 gradually increases from top to bottom.

[0049] Based on this, the outer diameter of the first shaft section 223 is large, which increases the installation area and can realize the stable installation of the rubber suction cup 221. Through the change of the outer diameter of the second shaft section 224 that first decreases and then increases, the outer diameter of the middle position of the second shaft section 224 is small, and it is easy to be compressed and deformed at both ends, improving the elastic deformation ability of the rubber suction cup 221. The outer diameter of the third shaft section 225 gradually increases, forming a "flare" shape. The bottom increases the adsorption area, increases the contact area with the surface of the PCB 20, reduces air leakage, and improves the adsorption force; the outer diameter of the top is small, making the bottom of the third shaft section 225 easy to turn outwards, further expanding the adsorption area, and enhancing the elastic deformation ability of the third shaft section 225, making the contact between the bottom of the rubber suction cup 221 and the surface of the PCB 20 softer and reducing mechanical damage to the PCB 20.

[0050] Specifically, among the first shaft section 223, the second shaft section 224, and the third shaft section 225, the first shaft section 223 has the largest outer diameter and the largest thickness, enhancing the structural strength, resisting compression and bending deformation, providing a stable support foundation, avoiding the position offset of the PCB 20 caused by the shaking of the rubber suction cup 221, ensuring the picking accuracy, guaranteeing the alignment of the PCB 20 with the second pin 12, and at the same time preventing the excessive deformation of the rubber suction cup 221.

[0051] Specifically, the thicknesses of the second shaft section 224 and the third shaft section 225 remain unchanged. Therefore, the negative pressure holes 222 of the second shaft section 224 and the third shaft section 225 change with the change of their outer diameters, precisely controlling the diameter of the negative pressure holes 222. That is, the negative pressure holes 222 in the second shaft section 224 first gradually shrink and then gradually expand, and the negative pressure holes 222 in the third shaft section 225 gradually expand, which is beneficial to the elastic deformation of the second shaft section 224 and the third shaft section 225 and improves the deformation ability of the rubber suction cup 221.

[0052] In one embodiment, please refer to Figure 8 and Figure 9 , as a specific implementation manner of the PCB soldering machine provided by the embodiment of the present application, the board picking bracket 210 is installed on the lifting bracket 130 through the buffer rubber sleeve 240. The buffer rubber sleeve 240, as a flexible medium, can absorb the impact energy and avoid the mutual impact between the board picking bracket 210 and the lifting bracket 130 during the downward pressing process of the board picking bracket 210.

[0053] Specifically, the elastic modulus of the buffer rubber sleeve 240 is greater than the elastic modulus of the elastic negative pressure member 220. The elastic negative pressure member 220 first undergoes elastic compression deformation. After the deformation of the elastic negative pressure member 220 is stable, the buffer rubber sleeve 240 undergoes elastic deformation. During the downward movement of the board picking device 200, the elastic negative pressure member 220 first undergoes elastic deformation to achieve the flexible alignment of the PCB 20 with the stator assembly 10. For example, the limiting notch 22 of the PCB 20 is aligned with the second pin 12 of the stator assembly 10, avoiding the hard contact between the PCB 20 and the stator assembly 10, absorbing most of the impact force, reducing the impact of the board picking bracket 210 on the PCB 20, and at the same time reducing the alignment difficulty between the PCB 20 and the stator assembly 10. After alignment, the PCB 20 fits against the top of the stator assembly 10 and the elastic negative pressure member 220 continues to undergo elastic deformation until the preset pressing force is reached, and then the buffer rubber sleeve 240 starts to undergo elastic deformation, avoiding excessive contact stress between the PCB 20 and the stator assembly 10 and mutual wear, and playing a protective role.

[0054] In one embodiment, please refer to Figure 8 and Figure 9, as a specific implementation of the PCB soldering machine provided in the embodiments of the present application, the board picking bracket 210 is provided with a stroke trigger 250, and the lifting bracket 130 is provided with a lift switch 140. The lift switch 140 is electrically connected to the first lifting mechanism 110. Based on this, when the buffer rubber sleeve 240 is compressed, the board picking bracket 210 moves upward relative to the lifting bracket 130 until the stroke trigger 250 moves upward to trigger the lift switch 140, causing the first lifting mechanism 110 to stop driving the lifting bracket 130 to move downward, reducing wear, fatigue and overload damage of the PCB 20.

[0055] Specifically, when the buffer rubber sleeve 240 is at 2 / 3 of its compression limit length, the stroke trigger 250 triggers the lift switch 140 to stop the first lifting mechanism 110. In other words, when the buffer rubber sleeve 240 is compressed to 2 / 3 of its limit length, the contact pressure between the board picking bracket 210 and the PCB 20 reaches the safety threshold, the stroke trigger 250 triggers the lift switch 140, and the first lifting mechanism 110 immediately stops. The maximum compression of the buffer rubber sleeve 240 is accurately controlled to 2 / 3 of its compression limit length, preventing the board picking bracket 210 from continuing to press down and avoiding deformation, cracking or internal component damage of the PCB 20 caused by excessive pressing.

[0056] In one embodiment, please refer to Figure 10 and Figure 11 , as a specific implementation of the PCB soldering machine provided in the embodiments of the present application, the second folding device 320 includes a radial driving mechanism 321, a second lifting mechanism 322, a second folding head 323 and a folding jig 324. The second lifting mechanism 322 and the folding jig 324 are installed on the radial driving mechanism 321 and move closer to or away from the soldering workbench 310 under the drive of the radial driving mechanism 321. The folding jig 324 has a folding positioning opening 325 for wrapping the second lead 12. The second folding head 323 is installed on the second lifting mechanism 322, and the second lifting mechanism 322 drives the second folding head 323 to move downward from top to bottom into the folding positioning opening 325.

[0057] Among them, the radial driving mechanism 321 drives the second lifting mechanism 322 and the folding jig 324 to move simultaneously towards the soldering workbench 310 so that the folding positioning opening 325 of the folding jig 324 surrounds the second lead 12. At this time, the second folding head 323 is located above the folding jig 324, and the second lifting mechanism 322 drives the second folding head 323 to descend and embed into the folding positioning opening 325, pressing and bending the second lead 12 located in the folding positioning opening 325 and attaching it to the pad 21 of the PCB 20. Based on this, the folding positioning opening 325 of the folding jig 324 wraps the second lead 12, fixes the position of the second lead 12, ensures that the second lead 12 does not shift during the folding process, and improves the folding accuracy.

[0058] In one embodiment, see Figure 11 As a specific implementation of the PCB welding machine provided in an embodiment of the present application, the shape of the bending positioning opening 325 is a triangle, the width of the bending positioning opening 325 gradually decreases toward the direction approaching the radial driving mechanism 321, and the shape of the second bending head 323 is adapted to the shape of the bending positioning opening 325.

[0059] Among them, as the radial drive mechanism 321 is driven, the bending jig 324 gradually approaches the second pin 12, and the bottom width of the bending positioning opening 325 is large, guiding the second pin 12 into the bending positioning opening 325, and gradually and accurately clamping and positioning it at the vertex of the triangular bending positioning opening 325, effectively limiting the radial freedom of the second pin 12, avoiding the second pin 12 from being offset due to vibration or external force during the bending process, and ensuring the accuracy of the bending angle and position. The triangular shape of the second bending head 323 is completely fitted with the bending positioning opening 325, forming a rigid constraint, further reducing the shaking of the second pin 12.

[0060] In one embodiment, see Figure 10 As a specific implementation of the PCB welding machine provided in the embodiment of the present application, the number of the second folding line devices 320 is two, and the two second folding line devices 320 are located on opposite sides of the welding workbench 310. The two second folding line devices 320 can bend the second pins 12 on both sides of the stator assembly 10 at the same time, doubling the efficiency. At the same time, the simultaneous bending of both sides of the stator assembly 10 can ensure that the stator assembly 10 and the PCB 20 are evenly stressed, avoiding the tilting or warping of the components caused by the bending on one side.

[0061] In one embodiment, see Figure 10 As a specific implementation of the PCB welding machine provided in the embodiment of the present application, the welding mechanism 330 includes a third lifting mechanism 331 and a welding head 332. The third lifting mechanism 331 drives the welding head 332 to move from top to bottom to approach the welding workbench 310, so as to perform welding operations on the stator assembly 10 and the PCB 20 located on the welding workbench 310. At this time, the second pin 12 has been bent and attached to the pad 21. By heating the pad 21, the second pin 12 and the pad 21 can be welded and fixed. The welding head 332 can be fully raised when not working, away from the welding workbench 310, leaving space for the placement and visual inspection of the stator assembly 10.

[0062] In one embodiment, see Figure 10, as a specific implementation of the PCB soldering machine provided in the embodiments of the present application, the soldering head 332 is installed on the third lifting mechanism 331 through the first rotating mechanism 333. The first rotating mechanism 333 drives the soldering head 332 to rotate around the vertical direction, so as to perform soldering operations on the second pins 12 and pads 21 located in different circumferences. Based on this, only one soldering head 332 is required, and there is no need to manually replace the soldering head 332 or adjust the position of the stator assembly 10. With the help of the first rotating mechanism 333, the soldering angle can be quickly switched, and at the same time, the angular placement accuracy of the stator assembly 10 on the soldering table 310 is reduced. Among them, the first rotating mechanism 333 can be a rotating motor.

[0063] In one embodiment, please refer to Figure 10 , as a specific implementation of the PCB soldering machine provided in the embodiments of the present application, the soldering table 310 is provided with a positioning turntable for positioning and placing the stator assembly 10. A second rotating mechanism 311 is installed below the soldering table 310. The second rotating mechanism 311 is used to drive the positioning turntable to rotate, so as to realize the rotation of the stator assembly 10 and the PCB 20, so that the second pins 12 of the stator assembly 10 and the pads 21 of the PCB 20 rotate to adapt to the second folding device 320 and the soldering mechanism 330 at different angular positions. Among them, the second rotating mechanism 311 can be a rotating motor.

[0064] In one embodiment, please refer to Figure 10 , as a specific implementation of the PCB soldering machine provided in the embodiments of the present application, the soldering device 300 further includes a photoelectric detection component 350. The photoelectric detection component 350 is electrically connected to the second folding device 320, and the photoelectric detection component 350 is used to detect whether there is a second pin 12 at the working position of the second folding device 320. The photoelectric detection component 350 can judge in real time whether there is a second pin 12 at the working position of the second folding device 320. If the second pin 12 is not detected, the second folding device 320 can pause the action to avoid ineffective bending.

[0065] Specifically, since the sizes of the second pin 12 and the pad 21 are small, after the photoelectric detection component 350 continuously detects the second pin 12 within the first preset time, it is determined that the second pin 12 is in place, and then the second folding device 320 starts to operate. Optionally, the first preset time is 3s - 5s.

[0066] In one embodiment, please refer to Figure 10, as a specific implementation of the PCB soldering machine provided by the embodiments of the present application, the number of the photoelectric detection components 350 is two, and the two photoelectric detection components 350 are located on the opposite sides of the soldering table 310. The two photoelectric detection components 350 respectively detect the opposite sides of the stator assembly 10 and the PCB 20 to achieve double-station detection. After the two photoelectric detection components 350 detect, the two second folding devices 320 respectively bend the second pins 12 at the two stations. The number of the soldering heads 332 is two, and the two soldering heads 332 are located on the radially opposite sides of the soldering table 310 to achieve soldering operations on the two stations.

[0067] In one embodiment, please refer to Figure 12 , as a specific implementation of the PCB soldering machine provided by the embodiments of the present application, the detection mechanism 340 includes two lidars 341 distributed at intervals, and the two lidars 341 jointly detect the same solder pad 21. The two lidars 341 scan from different angles, can complement the blind areas, and obtain more complete three-dimensional data.

[0068] Specifically, please refer to Figure 12 and Figure 13 , the two lidars 341 are symmetrically distributed about the midline of the connection line between them, the light-emitting angles of the two lidars 341 respectively face the midline of the connection line between them, and the light-emitting angles are the same. Each lidar 341 emits three detection light rays.

[0069] The lowest detection light rays L of the two lidars 341 form the two waists of an isosceles triangle and intersect at the bottom of the current solder pad 21 for detecting whether the solder pad 21 falls off.

[0070] The middle detection light rays M of the two lidars 341 form the two waists of an isosceles triangle and are preset to intersect at the middle part of the current solder pad 21. When the solder pad 21 and the second pin 12 are soldered normally, the detection light ray M touches the solder, that is, the left and right side edges of the second pin 12 are covered, and the soldering is qualified; if the detection light ray M touches the solder pad 21 or the second pin 12, it means that the solder pad 21 and the second pin 12 are not soldered or the bottom of the second pin 12 is soldered but the left and right side edges are not covered by the solder, and the soldering area is small, and the soldering is unqualified.

[0071] The upper detection light rays N of the two lidars 341 form the two waists of an isosceles triangle and intersect at the top of the current second pin 12 for detecting whether the solder covers the second pin 12. If the solder does not cover the second pin 12, the second pin 12 is likely to break away from the solder pad 21, and the soldering stability is poor.

[0072] In one embodiment, please refer to Figure 12 and Figure 13, as a specific implementation manner of the PCB soldering machine provided in the embodiments of the present application, the detection mechanism 340 includes a camera. The camera is located at the midpoint of the connection line of the two lidar sensors 341. The camera is used to capture a top-down welding contour map of the second pin 12 and the pad 21. The top-down image shows the relative positions of the second pin 12 and the pad 21, the solder coverage range, and the shape of the solder joint, further improving the welding quality detection level.

[0073] The above are only optional embodiments of the present application and are not intended to limit the present application. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present application shall be included in the protection scope of the present application.

Claims

1. A PCB welding machine, characterized in that: include: A first bending line device comprises a first lifting mechanism and a first bending head, wherein the first bending head has a plurality of pressing blocks distributed at circumferential intervals, and the first lifting mechanism is used to drive the first bending head to lift and lower, so that the plurality of pressing blocks respectively bend a plurality of first pins of the stator assembly; A board picking device, used for sleeve the PCB onto the second pin of the stator assembly; A welding device, comprising a welding workbench, a second folding line device, a welding mechanism and a detection mechanism, wherein the welding workbench is used to place a stator assembly, the second folding line device is used to bend the second pin and attach it to the pad of the PCB, the welding mechanism welds the second pin and the pad, and the detection mechanism is used to detect the assembly quality of the PCB and the stator assembly; A transmission mechanism is used to transfer the stator assembly between the first folding device, the plate picking device and the welding device.

2. The PCB welding machine according to claim 1, characterized in that: The first folding device further comprises a lifting bracket, which is installed at the output end of the first lifting mechanism, and the first bending head and the plate picking device are installed on the lifting bracket at intervals in the horizontal direction.

3. The PCB welding machine as claimed in claim 2, characterized in that: The plate picking device comprises a plate picking bracket and a plurality of elastic negative pressure members, the plate picking bracket is mounted on the lifting bracket, and the plurality of elastic negative pressure members are distributed at intervals along the circumference of the plate picking bracket.

4. The PCB welding machine as claimed in claim 3, characterized in that: The plate picking device also includes a rigid limiting column, which is installed on the lifting bracket. The rigid limiting column is arranged parallel to the elastic negative pressure part. The bottom end of the rigid limiting column is higher than the bottom end of the elastic negative pressure part in the initial state, and the bottom end of the rigid limiting column is higher than the bottom end of the elastic negative pressure part when it is at 2 / 3 of the compression limit length.

5. The PCB welding machine as claimed in claim 3, characterized in that: The elastic negative pressure member includes a rubber suction cup, the rubber suction cup has a vertically penetrating negative pressure hole, the bottom end of the rubber suction cup is used to directly adsorb the PCB, the rubber suction cup includes a first shaft segment, a second shaft segment and a third shaft segment from top to bottom, the outer diameter of the first shaft segment is greater than the outer diameters of the second shaft segment and the third shaft segment, the outer diameter of the second shaft segment gradually decreases and then gradually increases from top to bottom, and the outer diameter of the third shaft segment gradually increases from top to bottom.

6. The PCB welding machine as claimed in claim 3, characterized in that: The plate picking bracket is installed on the lifting bracket through a buffer rubber sleeve; the elastic modulus of the buffer rubber sleeve is greater than the elastic modulus of the elastic negative pressure member; The plate picking bracket is provided with a travel trigger, and the lifting bracket is provided with a lifting switch, and the lifting switch is electrically connected to the first lifting mechanism. When the buffer rubber sleeve is at 2 / 3 of the compression limit length, the travel trigger triggers the lifting switch to stop the first lifting mechanism.

7. The PCB welding machine according to claim 1, characterized in that: The second folding line device includes a radial driving mechanism, a second lifting mechanism, a second bending head and a bending jig; the second lifting mechanism and the bending jig are installed on the radial driving mechanism, and move toward or away from the welding workbench under the drive of the radial driving mechanism; the bending jig has a bending positioning opening, and the bending positioning opening is used to wrap the second pin. The second bending head is installed on the second lifting mechanism, and the second lifting mechanism drives the second bending head to move from top to bottom into the bending positioning opening.

8. The PCB welding machine according to claim 7, characterized in that: The number of the second folding line devices is two, and the two second folding line devices are located on opposite sides of the welding workbench; And / or, the shape of the bending positioning opening is a triangle, the width of the bending positioning opening gradually decreases toward the direction approaching the radial driving mechanism, and the shape of the second bending head is adapted to the shape of the bending positioning opening.

9. The PCB welding machine according to any one of claims 1 to 8, characterized in that: The welding mechanism comprises a third lifting mechanism and a welding head, and the third lifting mechanism drives the welding head to move from top to bottom to approach the welding workbench; The welding head is installed on the third lifting mechanism through a first rotating mechanism, and the first rotating mechanism drives the welding head to rotate around a vertical direction.

10. The PCB welding machine according to any one of claims 1 to 8, characterized in that: The detection mechanism includes two laser radars distributed at intervals, and the two laser radars jointly detect the same welding pad; And / or, the welding device further comprises a photoelectric detection component, the photoelectric detection component is electrically connected to the second folding line device, and the photoelectric detection component is used to detect whether the second pin exists at the working position of the second folding line device.

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