Product welding spot soldering tin flow stopping process

Abstract

The invention discloses a product welding spot soldering tin flow stopping process. The process comprises the following steps: preparing a molded circuit component; forming an optical frame base; laying a circuit component on the optical frame base, and then welding and fixing the interior of the optical frame base with the circuit component, so that the circuit component is embedded in the optical frame base; and packaging: carrying out packaging surface mounting treatment on the optical frame base embedded with the circuit components, carrying out related surface mounting and gold wire welding to form an electrical loop, and forming an external terminal on the optical frame. According to the invention, a highly integrated processing mode is adopted, circuit components are directly packaged in the optical frame, and the problem of outflow of soldering tin at a welding point is avoided.

Description

Technical Field

[0001] The invention belongs to the technical field of welding, in particular to a soldering tin flow stopping process for a product soldering point. Background Art

[0002] Voice coil motors are precision devices widely used in various electronic devices. At present, the optical component Hall element in the voice coil is usually assembled on the FPCB by attaching it, and then cutting it. The current method has the following defects: 1. The attachment assembly method is affected by the PCB accuracy, SMT accuracy, fixture accuracy, etc., and the cumulative error is large; 2. The long process leads to a large number of people. Due to the large number of manual operations, unstable factors are easily generated, the yield is low, the cost is high, and the efficiency is low. Summary of the invention

[0003] In order to solve the above technical problems, the present invention provides a product solder joint solder flow stopping process.

[0004] In order to solve the above technical problems, the present invention adopts the following technical solutions:

[0005] A solder stop flow process for a product solder joint, comprising the following steps:

[0006] Prepare and form circuit components;

[0007] forming an optical frame base;

[0008] Laying the circuit components on the optical frame base, and then welding and fixing the optical frame base with the circuit components, so that the circuit components are embedded in the optical frame base;

[0009] Packaging, the optical frame base with embedded circuit components is packaged and processed, and relevant patches and gold wires are welded to form an electrical circuit, and external terminals are formed on the optical frame. A layer of covering plastic is formed on the optical frame base to cover and bury the circuit components, completing the direct molding of circuit components and optical frame.

[0010] The optical frame base is formed in an injection molding device and pre-formed with a mounting area, such as some grooves, to facilitate the placement of circuit components. Alternatively, the optical frame base is provided with a number of blocks, which are used to limit the extension and positioning of circuit components.

[0011] The outer end interfaces are provided with two, which are respectively formed in different side regions of the optical frame base, and in this embodiment, they are respectively formed in two side regions perpendicular to each other. In this embodiment, the optical frame base is square, with a central through hole in the middle.

[0012] A groove cavity is formed in the area where the external terminal of the optical frame base is located, and the external terminal is buried in the groove cavity. Then, during injection molding, a gap exists between the external terminal and the side wall of the groove cavity, so that the external terminal is electrically connected to the circuit components.

[0013] When the optical frame base is packaged, a layer of covering rubber is formed on the optical frame base, and the covering rubber packages the circuit components in the base.

[0014] If the circuit components have extending pins, the pins extend from the side walls of the optical frame base, and the pins are exposed from the optical frame after molding.

[0015] The present invention adopts a highly integrated processing method to directly form circuit components in the optical frame base, thereby avoiding the problem of solder at the soldering point flowing out when the circuit components are welded. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a schematic diagram of the product combination process of the present invention.

[0017] Reference numerals: DETAILED DESCRIPTION

[0018] The embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0019] In the description of the present invention, it should be understood that if the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like are involved, the orientation or position relationship indicated is based on the orientation or position relationship shown in the drawings, which is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation of the present invention. In addition, the terms "first" and "second" are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, the meaning of "multiple" is two or more, unless otherwise clearly and specifically defined.

[0020] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected" and "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection. It can be a mechanical connection or an electrical connection. It can be directly connected or indirectly connected through an intermediate medium. It can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0021] like Figure 1 As shown, a solder stop flow process for a product solder joint includes the following steps:

[0022] The circuit components 1 are prepared and formed, and the circuit components include various types of electronic components such as Hall sensors and conductive sheets, and the size of the components matches the base to be formed.

[0023] The optical frame base 2 is formed by injection molding on an injection molding device. The optical frame base can be circular, quadrilateral or other shapes. According to the use requirements, the middle of the optical frame base can be set as a central through hole, especially for use in voice coil motors, which require a central through hole to facilitate the movement of other components. In this embodiment, it is a quadrilateral.

[0024] The circuit components are laid on the optical frame base, and then the optical frame base with the circuit components is welded and fixed so that the circuit components are embedded in the optical frame base. In the injection molding equipment, a layer of covering rubber is formed on the optical frame base to cover and embed the circuit components therein, thereby completing the direct molding of the circuit components and the optical frame.

[0025] Packaging: The optical frame base with embedded circuit components is packaged and patched, and the relevant patches and gold wires are welded to form an electrical circuit, and external terminals are formed on the optical frame.

[0026] The optical frame base is formed in an injection molding device and pre-formed with a mounting area, such as some grooves, to facilitate the placement of circuit components. Alternatively, the optical frame base is provided with a number of blocks, which are used to limit the extension and positioning of circuit components.

[0027] The outer end interfaces are provided with two, which are respectively formed in different side regions of the optical frame base. In the present embodiment, they are respectively formed in two side regions perpendicular to each other.

[0028] A groove cavity is formed in the area where the external terminal of the optical frame base is located, and the external terminal is buried in the groove cavity. Then, during injection molding, a gap exists between the external terminal and the side wall of the groove cavity, so that the external terminal is electrically connected to the circuit components.

[0029] If the circuit components have pins extending therefrom, the pins extend from the side wall of the optical frame base, and the pins are exposed from the optical frame after molding. The pins are usually bent from one side of the side of the optical frame base.

[0030] During molding, it can be molded in a whole piece, and the whole piece has several optical frame bases, which are molded in one piece from the injection molding equipment, thereby improving production efficiency.

[0031] In the present invention, the circuit components are directly highly integrated inside the optical frame base, packaged and patched, and then injection molded, so that the welding is also buried inside, and the solder at the welding point will not have the problem of outflow, thereby improving the quality and achieving efficient production.

[0032] It should be noted that the above are only preferred embodiments of the present invention and are not intended to limit the present invention. Although the present invention has been described in detail with reference to the embodiments, it is still possible for those skilled in the art to modify the technical solutions described in the aforementioned embodiments or to make equivalent substitutions for some of the technical features therein. However, any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A solder stop flow process for product solder joints, It is characterized in that The following steps are involved: Prepare and form circuit components; forming an optical frame base; Laying the circuit components on the optical frame base, and then welding and fixing the optical frame base with the circuit components, so that the circuit components are embedded in the optical frame base; Packaging, the optical frame base with embedded circuit components is packaged and processed, and relevant patches and gold wires are welded to form an electrical circuit, and external terminals are formed on the optical frame. A layer of covering plastic is formed on the optical frame base to cover and bury the circuit components, completing the direct molding of circuit components and optical frame.

2. The solder stop flow process for solder joints of products according to claim 1, It is characterized in that The optical frame base and circuit components are injection-molded and packaged in an injection molding device.

3. The solder stop flow process for solder joints of products according to claim 1, It is characterized in that The optical frame base is molded in an injection molding device and is pre-molded with a mounting area.

4. The solder stop flow process for solder joints of products according to claim 1, It is characterized in that There are two external end interfaces, which are respectively formed on different side areas of the optical frame base.

5. The solder stop flow process for solder joints of products according to claim 4, It is characterized in that A groove cavity is formed in the area where the external terminal of the optical frame base is located, and the external terminal is buried in the groove cavity. Then, during injection molding, a gap exists between the external terminal and the side wall of the groove cavity, so that the external terminal is electrically connected to the circuit components.

6. The solder stop flow process for solder joints of products according to claim 1, It is characterized in that When the optical frame base is packaged, a layer of covering rubber is formed on the optical frame base, and the covering rubber packages the circuit components in the base.

7. The solder stop flow process for solder joints of products according to claim 1, It is characterized in that The optical frame base is provided with a plurality of blocks, which are used to limit the extension and positioning of circuit components.

8. The solder stop flow process for solder joints of products according to claim 1, It is characterized in that If the circuit components have extending pins, the pins extend from the side walls of the optical frame base, and the pins are exposed from the optical frame after molding.

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