Welding method for titanium target material and copper back plate
By setting a specific composition of mixed metal powder layer between the welding surfaces of the titanium target and the copper back plate and performing thermal isostatic welding, the problems of large-sized titanium targets are solved and the welding strength is low during welding, achieving high-strength and low-deformation welding effects.
Patent Information
- Application Number
- CN202510470988.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-04-15
- Publication Date
- 2025-06-06
AI Technical Summary
In the prior art, when welding large-size titanium targets, the target component is largely deformed and the welding strength is low, which cannot meet the needs of large-size targets.
A mixed metal powder layer is arranged between the welding surfaces of the titanium target and the copper back plate, and thermal isostatic welding is performed. The composition of the mixed metal powder layer includes boron powder, copper powder, zinc powder and zirconium powder. Through specific proportions and particle size design, the welding strength is improved and deformation is reduced.
By using a specific mixed metal powder layer and thermal isostatic pressure, the welding strength of large-size titanium target and copper back plate is significantly improved, the deformation during the welding process is reduced, and the use effect of target assembly is improved.
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Abstract
Description
Technical Field
[0001] The invention relates to the technical field of target material welding, in particular to a welding method for a titanium target material and a copper back plate, and in particular to a welding method for a titanium target material and a copper back plate with an equivalent circle diameter of ≥1800 mm. Background Art
[0002] At present, with the development of the size of flat panel displays, the deposition substrate is required to develop in the direction of large-scale, and the corresponding target material is also required to have a larger size to meet the needs of LCD display device manufacturing.
[0003] During use, the target material usually needs to be fixedly connected to the back plate before it can be used. Usually, the connection between the target material and the back plate is carried out by welding.
[0004] For example, CN112059349A discloses a method for welding a titanium target and a copper back plate, the welding method comprising the following steps: (1) sequentially sandblasting and acid treating the welding surfaces of the titanium target and the copper back plate; (2) then adding solder to the welding surfaces of the acid-treated titanium target and the copper back plate and brazing them to obtain a titanium target assembly.
[0005] CN111015111A discloses a diffusion welding method for a large-sized titanium target and a copper back plate. The target is a large-sized titanium target, and the back plate is a copper alloy back plate, and the welding is performed by a hot pressing diffusion method. The method comprises the following steps: machining the large-sized titanium target and the copper alloy back plate, pickling, assembling and placing them in a hot pressing furnace, and performing diffusion welding, and the final overall bending deformation is less than 3mm, and the welding strength of the welding surface is ≥55MPa.
[0006] However, when the above welding method is used for welding large-sized targets such as titanium targets with an equivalent circular diameter ≥1800 mm, there are still defects such as large deformation of the target assembly after welding and low welding strength that cannot meet the requirements of large-sized targets. Summary of the invention
[0007] In view of the problems existing in the prior art, the purpose of the present invention is to provide a welding method for a titanium target and a copper backing plate to solve the defects that when welding large-size titanium targets, the target assembly after welding is still greatly deformed and the welding strength is low and cannot meet the needs of large-size targets.
[0008] To achieve this object, the present invention adopts the following technical solutions:
[0009] The present invention provides a method for welding a titanium target and a copper back plate, the welding method comprising:
[0010] A mixed metal powder layer is provided between the welding surfaces of the titanium target and the copper back plate, followed by hot isostatic pressing welding;
[0011] The mixed metal powder layer comprises, by mass percentage, 1-8% boron powder, 20-25% copper powder, 10-15% zinc powder, and the remainder is zirconium powder.
[0012] The welding method provided by the present invention realizes the effective connection between the titanium target and the copper back plate by means of a specific mixed metal powder layer and hot isostatic pressing, which significantly improves the welding strength of the large-sized titanium target and the copper back plate, and also significantly reduces the deformation caused by the welding process, effectively improving the use effect of the target assembly.
[0013] As a preferred technical solution of the present invention, the welding surface of the titanium target is sandblasted;
[0014] Preferably, the roughness Ra of the welding surface after sandblasting is 200-500 μm.
[0015] As a preferred technical solution of the present invention, the welding surface of the copper back plate is provided with threads.
[0016] Preferably, the pitch of the threads is 5-15 mm.
[0017] Preferably, the depth of the thread is 3-10 mm.
[0018] As a preferred technical solution of the present invention, the D80 particle size of the boron powder is 8-15 μm.
[0019] Preferably, the D80 particle size of the copper powder is 20-40 μm.
[0020] Preferably, the D80 particle size of the zinc powder is 15-30 μm.
[0021] Preferably, the D80 particle size of the zirconium powder is 60-80 μm.
[0022] As a preferred technical solution of the present invention, the thickness of the mixed metal powder layer is 1-5 mm.
[0023] As a preferred technical solution of the present invention, when threads are provided on the welding surface of the copper back plate, the thickness of the mixed metal powder layer is equal to the depth of the threads.
[0024] As a preferred technical solution of the present invention, the hot isostatic pressing welding includes a first hot isostatic pressing and a second hot isostatic pressing performed sequentially.
[0025] Preferably, the heating rate of the first hot isostatic pressing is less than the heating rate of the second hot isostatic pressing.
[0026] Preferably, the heating rate of the first hot isostatic pressing is 2-8°C / min.
[0027] Preferably, the heating rate of the second hot isostatic pressing is 10-15°C / min.
[0028] As a preferred technical solution of the present invention, the insulation temperature of the first hot isostatic pressing is 200-300°C.
[0029] Preferably, the holding time of the first hot isostatic pressing is 1-2 hours.
[0030] As a preferred technical solution of the present invention, the insulation temperature of the second hot isostatic pressing is 500-600°C.
[0031] Preferably, the holding time of the second hot isostatic pressing is 1.5-3 hours.
[0032] As a preferred technical solution of the present invention, the pressure of the hot isostatic pressing welding is 100-150 MPa.
[0033] Compared with the prior art solutions, the present invention has the following beneficial effects:
[0034] The welding method provided by the present invention realizes the effective connection between a large-sized titanium target and a copper back plate by adopting a specially designed mixed metal powder layer as an intermediate layer for welding connection. The welding strength of the target assembly after welding is ≥95.3MPa, and the overall bending deformation is ≤1.71mm, which is conducive to the high-quality use of the target assembly. DETAILED DESCRIPTION
[0035] To better illustrate the present invention and facilitate understanding of the technical solution of the present invention, typical but non-limiting embodiments of the present invention are as follows:
[0036] This embodiment provides a method for welding a titanium target and a copper back plate, the welding method comprising:
[0037] A mixed metal powder layer is set between the welding surface of the titanium target and the copper backing plate, and then hot isostatic pressing welding is performed.
[0038] The copper backplane includes: a pure copper backplane or a copper alloy backplane, such as a copper-chromium alloy backplane such as C18000, C18150 or C18200. The specific backplane can be a high-purity backplane, an ultra-high-purity backplane, etc.
[0039] In the present invention, the high purity refers to a purity of ≥99.99%.
[0040] In the present invention, the ultra-high purity refers to a purity of ≥ 99.9999%.
[0041] Wherein, the welding surface of the titanium target is sandblasted.
[0042] In the present invention, sandblasting refers to using compressed air as a power to form a high-speed jet beam to spray material (copper ore sand, quartz sand, corundum, iron sand, sea sand) at high speed onto the surface of the workpiece to be processed to achieve a surface roughening effect. The control parameters in the specific sandblasting process can be reasonably selected according to the conventional technical requirements in the field to ensure that the roughness requirements specified in the present invention are met.
[0043] Among them, the roughness Ra of the welding surface after sandblasting is 200-500μm, for example, it can be 200μm, 220μm, 240μm, 260μm, 280μm, 300μm, 320μm, 340μm, 360μm, 380μm, 400μm, 420μm, 440μm, 460μm, 480μm or 500μm, but is not limited to the listed values, and other unlisted values within the range also meet the requirements.
[0044] Wherein, the welding surface of the copper back plate is provided with threads.
[0045] In the present invention, thread processing refers to forming threads on the target material welding surface or the back plate welding surface by machining processes such as turning and milling.
[0046] In the present invention, the shape of the thread obtained by thread processing can be selected as rectangular thread, triangular thread, trapezoidal thread, serrated thread, etc.
[0047] Among them, the pitch of the threads is 5-15mm, for example, it can be 5mm, 6mm, 7mm, 8mm, 9mm, 10mm, 11mm, 12mm, 13mm, 14mm or 15mm, but is not limited to the listed values. Other values not listed in this range also meet the requirements.
[0048] Among them, the depth of the thread is 3-10mm, for example, it can be 3mm, 3.5mm, 4mm, 4.5mm, 5mm, 5.5mm, 6mm, 6.5mm, 7mm, 7.5mm, 8mm, 8.5mm, 9mm, 9.5mm or 10mm, but is not limited to the listed values. Other values not listed in this range also meet the requirements.
[0049] The mixed metal powder layer comprises, by mass percentage, 1-8% boron powder, 20-25% copper powder, 10-15% zinc powder, and the remainder is zirconium powder.
[0050] Among them, the mass percentage of boron powder in the mixed metal powder layer is 1-8%, for example, it can be 1%, 1.5%, 2%, 2.5%, 3%, 3.5%, 4%, 4.5%, 5%, 5.5%, 6%, 6.5%, 7%, 7.5% or 8%, etc., but is not limited to the listed values, and other unlisted values within this range also meet the requirements.
[0051] Among them, the copper powder in the mixed metal powder layer is 20-25% by mass, for example, it can be 20%, 20.5%, 21%, 21.5%, 22%, 22.5%, 23%, 23.5%, 24%, 24.5% or 25%, etc., but is not limited to the listed values, and other values not listed within this range also meet the requirements.
[0052] Among them, the zinc powder in the mixed metal powder layer is calculated as a mass percentage of 10-15%, for example, it can be 10%, 10.5%, 11%, 11.5%, 12%, 12.5%, 13%, 13.5%, 14%, 14.5% or 15%, etc., but is not limited to the listed values, and other values not listed within this range also meet the requirements.
[0053] The D80 particle size of the boron powder is 8-15 μm, for example, it can be 8 μm, 8.5 μm, 9 μm, 9.5 μm, 10 μm, 10.5 μm, 11 μm, 11.5 μm, 12 μm, 12.5 μm, 13 μm, 13.5 μm, 14 μm, 14.5 μm or 15 μm, etc., but is not limited to the listed values, and other unlisted values within the range also meet the requirements.
[0054] The D80 particle size of the copper powder is 20-40 μm, for example, it can be 20 μm, 22 μm, 24 μm, 26 μm, 28 μm, 30 μm, 32 μm, 34 μm, 36 μm, 38 μm or 40 μm, but is not limited to the listed values. Other values not listed within the range also meet the requirements.
[0055] Wherein, the D80 particle size of the zinc powder is 15-30μm, for example, it can be 15μm, 16μm, 17μm, 18μm, 19μm, 20μm, 21μm, 22μm, 23μm, 24μm, 25μm, 26μm, 27μm, 28μm, 29μm or 30μm, but is not limited to the listed values, and other unlisted values within the range also meet the requirements.
[0056] The D80 particle size of the zirconium powder is 60-80 μm, for example, it can be 60 μm, 62 μm, 64 μm, 66 μm, 68 μm, 70 μm, 72 μm, 74 μm, 76 μm, 78 μm or 80 μm, but is not limited to the listed values. Other values not listed within the range also meet the requirements.
[0057] Among them, the thickness of the mixed metal powder layer is 1-5mm, for example, it can be 1mm, 1.5mm, 2mm, 2.5mm, 3mm, 3.5mm, 4mm, 4.5mm or 5mm, but is not limited to the listed values. Other values not listed in this range also meet the requirements.
[0058] In the present invention, the mixed metal powder layer is prepared by uniformly mixing aluminum powder, tin powder, nickel powder and zinc powder, for example, by using a V-type powder mixer.
[0059] Wherein, when the welding surface of the copper back plate is provided with threads, the thickness of the mixed metal powder layer is equal to the depth of the threads.
[0060] Wherein, the hot isostatic pressing welding includes a first hot isostatic pressing and a second hot isostatic pressing performed sequentially.
[0061] Wherein, the heating rate of the first hot isostatic pressing is less than the heating rate of the second hot isostatic pressing.
[0062] Wherein, the heating rate of the first hot isostatic pressing is 2-8°C / min, for example, it can be 2°C / min, 2.5°C / min, 3°C / min, 3.5°C / min, 4°C / min, 4.5°C / min, 5°C / min, 5.5°C / min, 6°C / min, 6.5°C / min, 7°C / min, 7.5°C / min or 8°C / min, but is not limited to the listed values, and other values not listed in this range also meet the requirements.
[0063] Among them, the holding temperature of the first hot isostatic pressing is 200-300°C, for example, it can be 200°C, 210°C, 220°C, 230°C, 240°C, 250°C, 260°C, 270°C, 280°C, 290°C or 300°C, but is not limited to the listed values, and other unlisted values within the range also meet the requirements.
[0064] Among them, the holding time of the first hot isostatic pressing is 1-2h, for example, it can be 1h, 1.1h, 1.2h, 1.3h, 1.4h, 1.5h, 1.6h, 1.7h, 1.8h, 1.9h or 2h, but is not limited to the listed values, and other unlisted values within the range also meet the requirements.
[0065] Wherein, the heating rate of the second hot isostatic pressing is 10-15°C / min, for example, it can be 10°C / min, 10.5°C / min, 11°C / min, 11.5°C / min, 12°C / min, 12.5°C / min, 13°C / min, 13.5°C / min, 14°C / min, 14.5°C / min or 15°C / min, but is not limited to the listed values, and other values not listed in this range also meet the requirements.
[0066] Among them, the holding temperature of the second hot isostatic pressing is 500-600℃, for example, it can be 500℃, 510℃, 520℃, 530℃, 540℃, 550℃, 560℃, 570℃, 580℃, 590℃ or 600℃, but is not limited to the listed values, and other unlisted values within the range also meet the requirements.
[0067] Among them, the holding time of the second hot isostatic pressing is 1.5-3h, for example, it can be 1.5h, 1.6h, 1.7h, 1.8h, 1.9h, 2h, 2.1h, 2.2h, 2.3h, 2.4h, 2.5h, 2.6h, 2.8h, 2.9h or 3h, but is not limited to the listed values, and other unlisted values within the range also meet the requirements.
[0068] Among them, the pressure of the hot isostatic pressing welding is 100-150MPa, for example, it can be 100MPa, 105MPa, 110MPa, 115MPa, 120MPa, 125MPa, 130MPa, 135MPa, 140MPa, 145MPa or 150MPa, but is not limited to the listed values, and other unlisted values within the range also meet the requirements.
[0069] Further, in order to illustrate the good welding effect that can be achieved by the welding method provided by the present invention, the following example is used for exemplary description, as follows:
[0070] The target material used in the following embodiments is a titanium target material with a purity of 99.999%, and the back plate is a pure copper back plate with a purity of 99.99%. The length of the target material is 2300 mm and the width is 1800 mm.
[0071] Example 1
[0072] This embodiment provides a method for welding a titanium target and a copper back plate, the welding method comprising:
[0073] A mixed metal powder layer is provided between the welding surfaces of the titanium target and the copper back plate, followed by hot isostatic pressing welding;
[0074] The mixed metal powder layer comprises, by mass percentage, 5% boron powder, 22% copper powder, 12% zinc powder, and the remainder zirconium powder; the D80 particle size of the boron powder is 10 μm; the D80 particle size of the copper powder is 30 μm; the D80 particle size of the zinc powder is 20 μm; the D80 particle size of the zircon powder is 70 μm; the thickness of the mixed metal powder layer is 2 mm;
[0075] The hot isostatic pressing welding includes: a first hot isostatic pressing and a second hot isostatic pressing performed in sequence; the heating rate of the first hot isostatic pressing is 4°C / min; the holding temperature of the first hot isostatic pressing is 250°C; the holding time of the first hot isostatic pressing is 1.5h; the heating rate of the second hot isostatic pressing is 12°C / min; the holding temperature of the second hot isostatic pressing is 550°C; the holding time of the second hot isostatic pressing is 1.8h; the pressure of the hot isostatic pressing welding is 120MPa.
[0076] Example 2
[0077] This embodiment provides a method for welding a titanium target and a copper back plate, the welding method comprising:
[0078] A mixed metal powder layer is provided between the welding surfaces of the titanium target and the copper back plate, followed by hot isostatic pressing welding;
[0079] The mixed metal powder layer comprises, by mass percentage, 3% boron powder, 23% copper powder, 14% zinc powder, and the remainder zirconium powder; the D80 particle size of the boron powder is 12 μm; the D80 particle size of the copper powder is 35 μm; the D80 particle size of the zinc powder is 25 μm; the D80 particle size of the zircon powder is 75 μm; the thickness of the mixed metal powder layer is 3 mm;
[0080] The hot isostatic pressing welding includes: a first hot isostatic pressing and a second hot isostatic pressing performed in sequence; the heating rate of the first hot isostatic pressing is 6°C / min; the holding temperature of the first hot isostatic pressing is 280°C; the holding time of the first hot isostatic pressing is 1.2h; the heating rate of the second hot isostatic pressing is 13°C / min; the holding temperature of the second hot isostatic pressing is 520°C; the holding time of the second hot isostatic pressing is 2h; the pressure of the hot isostatic pressing welding is 130MPa.
[0081] Example 3
[0082] This embodiment provides a method for welding a titanium target and a copper back plate, the welding method comprising:
[0083] A mixed metal powder layer is provided between the welding surfaces of the titanium target and the copper back plate, followed by hot isostatic pressing welding;
[0084] The mixed metal powder layer comprises, by mass percentage, 8% boron powder, 20% copper powder, 10% zinc powder, and the remainder zirconium powder; the D80 particle size of the boron powder is 15 μm; the D80 particle size of the copper powder is 40 μm; the D80 particle size of the zinc powder is 30 μm; the D80 particle size of the zircon powder is 60 μm; the thickness of the mixed metal powder layer is 1 mm;
[0085] The hot isostatic pressing welding includes: a first hot isostatic pressing and a second hot isostatic pressing performed in sequence; the heating rate of the first hot isostatic pressing is 8°C / min; the holding temperature of the first hot isostatic pressing is 300°C; the holding time of the first hot isostatic pressing is 1h; the heating rate of the second hot isostatic pressing is 10°C / min; the holding temperature of the second hot isostatic pressing is 500°C; the holding time of the second hot isostatic pressing is 3h; the pressure of the hot isostatic pressing welding is 150MPa.
[0086] Example 4
[0087] This embodiment provides a method for welding a titanium target and a copper back plate, the welding method comprising:
[0088] A mixed metal powder layer is provided between the welding surfaces of the titanium target and the copper back plate, followed by hot isostatic pressing welding;
[0089] The mixed metal powder layer comprises, by mass percentage, 1% boron powder, 25% copper powder, 10% zinc powder, and the remainder zirconium powder; the D80 particle size of the boron powder is 8 μm; the D80 particle size of the copper powder is 20 μm; the D80 particle size of the zinc powder is 15 μm; the D80 particle size of the zircon powder is 80 μm; the thickness of the mixed metal powder layer is 5 mm;
[0090] The hot isostatic pressing welding includes: a first hot isostatic pressing and a second hot isostatic pressing performed in sequence; the heating rate of the first hot isostatic pressing is 2°C / min; the holding temperature of the first hot isostatic pressing is 200°C; the holding time of the first hot isostatic pressing is 2h; the heating rate of the second hot isostatic pressing is 15°C / min; the holding temperature of the second hot isostatic pressing is 600°C; the holding time of the second hot isostatic pressing is 1.5h; the pressure of the hot isostatic pressing welding is 100MPa.
[0091] Example 5
[0092] The only difference from Example 1 is that the welding surface of the titanium target is sandblasted; the roughness Ra of the welding surface after the sandblasting is 300 μm.
[0093] Example 6
[0094] The only difference from Example 2 is that the welding surface of the titanium target is sandblasted; the roughness Ra of the welding surface after the sandblasting is 400 μm.
[0095] Example 7
[0096] The only difference from Example 1 is that the welding surface of the copper back plate is provided with threads; the pitch of the threads is 8 mm and the depth is 6 mm. Since the welding surface of the copper back plate is provided with threads, the thickness of the mixed metal powder layer is equal to the depth of the threads.
[0097] Example 8
[0098] The only difference from Example 2 is that the welding surface of the copper back plate is provided with threads; the pitch of the threads is 12 mm and the depth is 8 mm. Since the welding surface of the copper back plate is provided with threads, the thickness of the mixed metal powder layer is equal to the depth of the threads.
[0099] Example 9
[0100] The only difference from Example 1 is that the welding surface of the titanium target is sandblasted; the roughness Ra of the welding surface after sandblasting is 200μm; the welding surface of the copper back plate is provided with threads; the pitch of the threads is 5mm and the depth is 3mm. Since the welding surface of the copper back plate is provided with threads, the thickness of the mixed metal powder layer is equal to the depth of the threads.
[0101] Example 10
[0102] The only difference from Example 2 is that the welding surface of the titanium target is sandblasted; the roughness Ra of the welding surface after sandblasting is 500μm; the welding surface of the copper back plate is provided with threads; the pitch of the threads is 15mm and the depth is 10mm. Since the welding surface of the copper back plate is provided with threads, the thickness of the mixed metal powder layer is equal to the depth of the threads.
[0103] Embodiment 11
[0104] The only difference from Example 1 is that the holding temperature of the first hot isostatic pressing is 550° C., and the second hot isostatic pressing does not perform a temperature increase process.
[0105] Example 12
[0106] The only difference from Example 1 is that the heating rate of the first hot isostatic pressing is 12° C. / min.
[0107] Embodiment 13
[0108] The only difference from Example 1 is that the heating rate of the second hot isostatic pressing is 6° C. / min.
[0109] Comparative Example 1
[0110] The only difference from Example 1 is that the mass percentage of boron powder in the mixed metal powder layer is 0.5%, and the changed amount is adjusted by using zirconium powder.
[0111] Comparative Example 2
[0112] The only difference from Example 1 is that the mass percentage of boron powder in the mixed metal powder layer is 10%, and the changed amount is adjusted by using zirconium powder.
[0113] Comparative Example 3
[0114] The only difference from Example 1 is that the mass percentage of copper powder in the mixed metal powder layer is 10%, and the changed amount is adjusted by using zirconium powder.
[0115] Comparative Example 4
[0116] The only difference from Example 1 is that the mass percentage of copper powder in the mixed metal powder layer is 30%, and the changed amount is adjusted by using zirconium powder.
[0117] Comparative Example 5
[0118] The only difference from Example 1 is that the mass percentage of copper powder in the mixed metal powder layer is 5%, and the changed amount is adjusted by using zirconium powder.
[0119] Comparative Example 6
[0120] The only difference from Example 1 is that the mass percentage of copper powder in the mixed metal powder layer is 20%, and the changed amount is adjusted by using zirconium powder.
[0121] Comparative Example 7
[0122] The only difference from Example 1 is that no boron powder is added to the mixed metal powder layer, and the amount of change is adjusted using zirconium powder.
[0123] Comparative Example 8
[0124] The only difference from Example 1 is that no copper powder is added to the mixed metal powder layer, and the amount of change is adjusted using zirconium powder.
[0125] Comparative Example 9
[0126] The only difference from Example 1 is that no zinc powder is added to the mixed metal powder layer, and the amount of change is adjusted by using zirconium powder.
[0127] Comparative Example 10
[0128] The only difference from Example 1 is that the zinc powder in the mixed metal powder layer is replaced by an equal amount of nickel powder.
[0129] The target material assemblies obtained in the embodiment and the comparative example were tested for welding bonding strength according to GB / T 39163-2020 “Test method for bonding strength between target material and backing plate”, and the overall bending deformation before and after welding was measured. The results are shown in Table 1 below.
[0130] Table 1
[0131]
[0132]
[0133] As can be seen from Table 1, the welding method provided by the present invention realizes the effective connection between the titanium target and the copper back plate by means of a specific mixed metal powder layer and hot isostatic pressing, which significantly improves the welding strength of the large-size titanium target and the copper back plate, and also significantly reduces the deformation caused by the welding process, effectively improving the use effect of the target assembly.
[0134] The preferred embodiments of the present invention are described in detail above. However, the present invention is not limited to the specific details in the above embodiments. Within the technical concept of the present invention, a variety of simple modifications can be made to the technical solution of the present invention, and these simple modifications all belong to the protection scope of the present invention.
[0135] It should also be noted that the various specific technical features described in the above specific embodiments can be combined in any suitable manner without contradiction. In order to avoid unnecessary repetition, the present invention will not further describe various possible combinations.
[0136] In addition, various embodiments of the present invention may be arbitrarily combined, and as long as they do not violate the concept of the present invention, they should also be regarded as the contents disclosed by the present invention.
Claims
1. A method for welding a titanium target and a copper back plate, characterized in that: The welding method comprises: A mixed metal powder layer is provided between the welding surfaces of the titanium target and the copper back plate, followed by hot isostatic pressing welding; The mixed metal powder layer comprises, by mass percentage, 1-8% boron powder, 20-25% copper powder, 10-15% zinc powder, and the remainder is zirconium powder.
2. The welding method according to claim 1, characterized in that The welding surface of the titanium target is sandblasted; Preferably, the roughness Ra of the welding surface after sandblasting is 200-500 μm.
3. The welding method according to claim 1 or 2, characterized in that: The welding surface of the copper back plate is provided with threads; Preferably, the pitch of the threads is 5-15 mm; Preferably, the depth of the thread is 3-10 mm.
4. The welding method according to any one of claims 1 to 3, characterized in that: The D80 particle size of the boron powder is 8-15 μm; Preferably, the D80 particle size of the copper powder is 20-40 μm; Preferably, the D80 particle size of the zinc powder is 15-30 μm; Preferably, the D80 particle size of the zirconium powder is 60-80 μm.
5. The welding method according to any one of claims 1 to 4, characterized in that: The thickness of the mixed metal powder layer is 1-5 mm.
6. The welding method according to any one of claims 2 to 5, characterized in that: When the welding surface of the copper back plate is provided with threads, the thickness of the mixed metal powder layer is equal to the depth of the threads.
7. The welding method according to any one of claims 1 to 6, characterized in that: The hot isostatic pressing welding comprises a first hot isostatic pressing and a second hot isostatic pressing performed sequentially; Preferably, the heating rate of the first hot isostatic pressing is less than the heating rate of the second hot isostatic pressing; Preferably, the heating rate of the first hot isostatic pressing is 2-8°C / min; Preferably, the heating rate of the second hot isostatic pressing is 10-15°C / min.
8. The welding method according to claim 7, characterized in that: The first hot isostatic pressing has a holding temperature of 200-300° C.; Preferably, the holding time of the first hot isostatic pressing is 1-2 hours.
9. The welding method according to claim 7 or 8, characterized in that: The holding temperature of the second hot isostatic pressing is 500-600°C; Preferably, the holding time of the second hot isostatic pressing is 1.5-3 hours.
10. The welding method according to any one of claims 1 to 9, characterized in that: The hot isostatic pressing welding pressure is 100-150 MPa.
Citation Information
Patent Citations
Diffusion welding method of large-size titanium target material and copper back plate
CN111015111A
Welding method of titanium target and copper back plate
CN112059349A