Eight-axis linkage laser equipment

By proposing an eight-axis linkage laser equipment in laser processing technology, combining a five-axis linkage system and three-dimensional laser marking technology, the shortcomings of the existing technology in complex appearance processing and production efficiency improvement are solved, and efficient and high-precision three-dimensional processing effect is achieved.

CN120095313APending Publication Date: 2025-06-06SHENZHEN TETELASER TECH CO LTD
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Patent Information

Application Number
CN202510441186.2
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-04-09
Publication Date
2025-06-06

AI Technical Summary

Technical Problem

The existing five-axis linkage laser system and three-dimensional laser marking technology have shortcomings in processing complex appearances and improving production efficiency, especially when multiple surfaces and small graphics are clamped at one time, there are problems of graphic splicing errors and inefficiency.

Method used

An eight-axis linkage laser device is proposed. By integrating the five-axis linkage system technology and three-dimensional laser marking technology into the eight-axis linkage system technology, the coordinated work of the base, three-axis assembly, rotating table assembly and three-dimensional optical path assembly is used to realize the rotation and movement of the product in five dimensions, and output the laser beam from the three dimensions to carry out efficient three-dimensional processing.

Benefits of technology

It realizes efficient and high-precision three-dimensional complex surface processing, and can complete multiple surfaces and small figure removal in one clamping, reducing the number of clamping times and adjustment time, improving processing accuracy and consistency, and meeting the needs of complex appearance and efficient production.

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Abstract

The invention discloses eight-axis linkage laser equipment, and relates to the technical field of laser processing, and the eight-axis linkage laser equipment comprises a base, a three-axis assembly, a rotating table assembly and a three-dimensional light path assembly; the three-axis assembly is arranged on the base; the rotating table assembly is in transmission with the three-axis assembly and used for driving a product to rotate and move in five dimensions. The three-dimensional light path assembly is in transmission connection with the three-axis assembly, located above the rotating table assembly and used for outputting machining laser in the three-dimensional direction so as to conduct three-dimensional laser machining on products. According to the technical scheme provided by the invention, the process requirements of large-size and complex-outline laser processing and small-pattern multi-path laser high-speed removal can be met at the same time, no pattern splicing trace exists when the continuous processing path exceeds the three-dimensional laser marking range, the production efficiency is improved, and the processing requirements of diversified electronic products are met.
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Description

Technical Field

[0001] The present invention relates to the technical field of laser processing, and in particular to an eight-axis linkage laser device. Background Art

[0002] With the continuous development of electronic products, their appearance is becoming more and more beautiful and varied, usually composed of complex three-dimensional surfaces. This complex appearance puts extremely high demands on subsequent processing technology, which not only needs to ensure the complexity of the appearance, but also improve production efficiency.

[0003] Among the existing processing technologies, five-axis linkage system technology is a commonly used method. This technology can achieve complex shape requirements of up to five surfaces in one clamping process, and has high processing accuracy and flexibility. However, the processing efficiency of the five-axis linkage laser system is lower than that of the three-dimensional laser marking system. On the other hand, three-dimensional laser marking technology has been widely used for its high speed and high efficiency. However, when this technology is clamped to process the shape of more than three surfaces of the product in one clamping process or exceeds the working range of the three-dimensional laser marking system, it is necessary to configure multi-axis rotating tooling for graphic splicing. There will be errors in graphic splicing. In high-requirement precision processing, continuous processing paths are not allowed to be spliced, which has limitations.

[0004] Therefore, the current processing technology still has certain shortcomings in meeting the complex appearance and efficient production of electronic products. Summary of the invention

[0005] The main purpose of the present invention is to propose an eight-axis linkage laser equipment, which creatively integrates the five-axis linkage system technology and the three-dimensional laser marking technology into the eight-axis linkage system technology. The technology is designed to simultaneously meet the five-axis linkage technology process requirements for one-time clamping and processing of the complex shape of five surfaces of the product, and can also high-speed process the process requirements of multi-path of small graphics with a large and dense product shape. When the continuous processing path exceeds the three-dimensional laser marking range, there is no trace of graphic splicing, which improves production efficiency and meets the processing needs of diversified electronic products.

[0006] In order to achieve the above-mentioned object, the present invention proposes an eight-axis linkage laser device, which comprises:

[0007] Pedestal;

[0008] A three-axis assembly, wherein the three-axis assembly is arranged on the base;

[0009] A rotating table assembly, which is coupled to the three-axis assembly to drive the product to rotate and move in five dimensions; and

[0010] A three-dimensional optical path component is transmission-connected to the three-axis component and is located above the rotating table component, and is used to output laser beams in three dimensional directions to perform three-dimensional processing on the product.

[0011] In one embodiment, the three-dimensional optical path component includes:

[0012] an upper optical path mechanism, the upper optical path mechanism being fixed to the base and used for outputting laser light; and

[0013] A follow-up optical path mechanism is movably connected to the base and connected to the upper optical path mechanism, and is used to adjust the output laser in three dimensional directions.

[0014] In one embodiment, the upper optical path mechanism comprises:

[0015] A laser, which is fixed to the base and is used to output laser light;

[0016] A beam expander, which is fixed to the base and communicated with the laser;

[0017] A first reflector assembly, which is fixed to the base and communicated with the beam expander, and is used to reflect the laser light emitted by the laser;

[0018] A Z-axis dynamic adjustment unit, which is disposed on the base and communicated with the first reflector assembly, and is used to quickly change the focal length of the output laser in the Z-axis dimension direction of a small-figure multi-path three-dimensional scanning head with a small range; and

[0019] A second reflector assembly is arranged on the base and is connected to the Z-axis dynamic adjustment unit and the follow-up optical path mechanism, and is used for reflecting the laser emitted by the laser into the follow-up optical path mechanism.

[0020] In one embodiment, the Z-axis dynamic adjustment unit is a dynamic focusing lens assembly.

[0021] In one embodiment, the follow-up optical path mechanism includes:

[0022] A fixed plate, the fixed plate is movably connected to the base and moves along the X-axis and Z-axis dimensions;

[0023] An X-axis movable reflector group, wherein the X-axis movable reflector group is movably connected to the fixed plate and communicated with the second reflector group;

[0024] A Z-axis movable reflector group, wherein the Z-axis movable reflector group is disposed on the fixed plate and is located below the X-axis movable reflector group, and the Z-axis movable reflector group is connected to the X-axis movable reflector group; and

[0025] A three-dimensional scanning head is arranged on the fixed plate and is connected to the Z-axis movable reflector group, and is used for scanning the surface of the product and outputting adjusted laser to process the product.

[0026] In one embodiment, the follow-up optical path mechanism further includes an accordion cover, which is disposed on the base and connected between the X-axis movable reflector group and the second reflector for sealing the optical path.

[0027] In one embodiment, the follow-up optical path mechanism also includes a visual camera disposed on the fixed plate, and is spaced apart from the X-axis movable reflector group, the Z-axis movable reflector group and the three-dimensional scanning head for real-time acquisition of product processing conditions.

[0028] In one embodiment, a telescopic tube is arranged between the Z-axis movable reflector group and the X-axis movable reflector group, and both ends of the telescopic tube are respectively connected to the Z-axis movable reflector group and the X-axis movable reflector group, so that the Z-axis movable reflector group is connected to the X-axis movable reflector group.

[0029] In one embodiment, the base includes a pedestal and a mounting platform, wherein the mounting platform is disposed on the top surface of the pedestal and encloses the pedestal to form a mounting space;

[0030] The three-axis assembly includes an X-axis linear motion module, a Y-axis linear motion module and a Z-axis linear motion module. The X-axis linear motion module is arranged on the mounting platform, the Z-axis linear motion module is transmission-connected to the X-axis linear motion module, and the follow-up optical path mechanism is transmission-connected to the Z-axis linear motion module; the Y-axis linear motion module is arranged on the base and is located below the X-axis linear motion module, and the rotating table assembly is transmission-connected to the Y-axis linear motion module.

[0031] In one embodiment, the rotating stage assembly comprises:

[0032] A B-axis rotating member, the B-axis rotating member is transmission-connected to the Y-axis linear moving module;

[0033] A C-axis rotating member, the C-axis rotating member is rotatably connected to the B-axis rotating member; and

[0034] A product jig, the product jig being arranged at one end of the C-axis rotating member away from the B-axis rotating member, and the product jig being used to fix the product to be processed;

[0035] The B-axis rotating member is used to drive the C-axis rotating member to rotate around the Y-axis dimension, and the C-axis rotating member is used to drive the product fixture to rotate in the XZ plane direction.

[0036] The eight-axis linkage laser device of the technical solution of the present invention comprises a base, a three-axis assembly, a rotating table assembly and a three-dimensional optical path assembly; the three-axis assembly is arranged on the base; the rotating table assembly is driven by the three-axis assembly to drive the linkage of the displacement and rotation of the product in five dimensions; the three-dimensional optical path assembly is connected to the three-axis assembly and is located above the rotating table assembly to output laser beams from three dimensional directions to perform three-dimensional processing on the product; through the close cooperation of the three-axis assembly, the rotating table assembly and the three-dimensional optical path assembly, the eight-axis linkage laser device can realize efficient and high-precision three-dimensional complex surface processing. It can not only meet the processing requirements of complex shapes, but also significantly improve production efficiency. It can complete the processing of multiple surfaces and the removal of small graphics in one clamping, and there is no trace of graphic splicing when the continuous processing path exceeds the three-dimensional laser marking range, which reduces the number of clamping times and adjustment time, improves processing accuracy and consistency, and can simultaneously meet the process requirements of laser processing of complex product contours and multi-path laser processing of small graphics, improve production efficiency, and meet the processing needs of diversified electronic products. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying creative work.

[0038] Figure 1 A schematic structural diagram of an eight-axis linkage laser device from one perspective provided by the present invention;

[0039] Figure 2 A schematic diagram of the structure of the base and three-axis assembly of the eight-axis linkage laser device provided by the present invention;

[0040] Figure 3 A schematic diagram of the structure of the upper optical path mechanism of the eight-axis linkage laser device provided by the present invention;

[0041] Figure 4 A schematic diagram of the structure of the follow-up optical path mechanism of the eight-axis linkage laser device provided by the present invention;

[0042] Figure 5 A schematic structural diagram of the eight-axis linkage laser device provided by the present invention from another perspective;

[0043] Figure 6A schematic structural diagram of the rotating table assembly of the eight-axis linkage laser equipment provided by the present invention.

[0044] Description of Figure Numbers:

[0045] 10. Base; 11. Base; 12. Mounting platform; 20. Three-axis assembly; 21. Y-axis linear motion module; 22. X-axis linear motion module; 23. Z-axis linear motion module; 30. Rotating table assembly; 31. B-axis rotating part; 32. C-axis rotating part; 33. Product fixture; 40. Three-dimensional optical path assembly; 41. Upper optical path mechanism; 411. Laser; 412. Beam expander; 413. First reflector assembly; 414. Z-axis dynamic adjustment unit; 415. Second reflector assembly; 42. Follow-up optical path mechanism; 421. Fixed plate; 422. X-axis moving reflector group; 423. Z-axis moving reflector group; 424. Three-dimensional scanning head; 425. Organ cover; 426. Visual camera; 427. Telescopic tube.

[0046] The realization of the purpose, functional features and advantages of the present invention will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0047] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0048] It should be noted that if the embodiments of the present invention involve directional indications (such as up, down, left, right, front, back, etc.), the directional indications are only used to explain the relative position relationship, movement status, etc. between the components in a certain specific posture. If the specific posture changes, the directional indication will also change accordingly.

[0049] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the present invention, the descriptions of "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of technical features indicated. Therefore, the features limited to "first" and "second" may explicitly or implicitly include at least one of the features. In addition, if "and / or" or "and / or" appears in the full text, its meaning includes three parallel solutions. Taking "A and / or B" as an example, it includes solution A, solution B, or solutions that satisfy both A and B. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the ability of ordinary technicians in this field to implement. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0050] The invention provides an eight-axis linkage laser device.

[0051] See also Figure 1 and Figure 2 In one embodiment of the present invention, the eight-axis linkage laser equipment includes a base 10, a three-axis assembly 20, a rotating table assembly 30 and a three-dimensional optical path assembly 40; the three-axis assembly 20 is arranged on the base 10; the rotating table assembly 30 is driven by the three-axis assembly 20, so that the product can be flexibly rotated and offset in five dimensions; the three-dimensional optical path assembly 40 enables the laser beam to have three-dimensional rapid movement and is connected to the three-axis assembly 20 in transmission, and is located above the rotating table assembly 30. At this point, the laser beam has eight degrees of freedom of synchronous linkage relative to the product, can flexibly process products of complex shapes and process complex processing paths at high speed, and realize eight-axis linkage processing of the product.

[0052] Laser processing includes laser marking, laser cutting, laser welding, laser removal (cleaning), laser cladding, laser drilling and other processes.

[0053] The base 10 is the basic support structure of the entire eight-axis linkage laser equipment. It provides a stable mounting platform 12 for all other components, ensuring the accuracy and stability of the equipment during operation. The base 10 is usually rigid and strong enough to withstand the various forces and vibrations generated when the equipment is running. The rotating table assembly 30 is combined with the three-axis assembly 20 to provide five degrees of freedom of linkage motion, which can flexibly handle workpieces of complex shapes.

[0054] The three-dimensional optical path component 40 is one of the core parts of the device, responsible for transmitting the laser from the laser 411 to the three-dimensional scanning head 424 via the Z-axis dynamic adjustment unit 414, and realizing high-speed laser output in three-dimensional space. The three-dimensional optical path component 40 can accurately control the focal position of the laser in three-dimensional space and perform laser processing paths at high speed.

[0055] First, the product to be processed is mounted on the rotating table assembly 30. The stability and accuracy of the product on the rotating table are ensured by the positioning device or fixture on the base 10. Then, the three-axis assembly 20 moves the rotating table assembly 30 to the initial processing position. The control system generates corresponding motion instructions according to the preset processing path and process requirements. These instructions include the interpolation movement of the three-dimensional space of the three-axis assembly 20, the rotation interpolation movement of the rotating table assembly 30, and the laser output control during the interpolation movement of the three-dimensional curve of the Z-axis dynamic adjustment unit 414 and the three-dimensional scanning head 424 in the three-dimensional optical path assembly 40. During the processing, the three-axis assembly 20 is responsible for moving the rotating table to different positions to ensure that the three-dimensional scanning head 424 can cover the entire product surface. The rotating table assembly 30 adjusts the angle and direction of the product. Under the action of the control system, the Z-axis dynamic adjustment unit 414 and the three-dimensional scanning head 424 in the three-dimensional optical path assembly 40 accurately control the focal position and processing path of the laser through the coordinated linkage movement with the three-axis assembly 20 and the rotating table assembly 30, so as to realize complex processing in three-dimensional space. The equipment is usually equipped with sensors and monitoring systems to monitor various parameters in the process in real time, such as laser power, speed, position deviation, etc. Based on the monitoring data, the control system will automatically adjust the movement and parameters of each component to ensure quality and efficiency.

[0056] Through the close cooperation of the three-axis assembly 20, the rotating table assembly 30 and the three-dimensional optical path assembly 40, the eight-axis linkage laser equipment of the present invention can realize efficient and high-precision eight-axis linkage laser processing of three-dimensional complex surfaces. Compared with the traditional single five-axis linkage system or three-dimensional laser marking technology, this equipment combines the advantages of both, which can not only meet the processing requirements of complex shapes, but also significantly improve production efficiency. It can complete the laser processing of multiple surfaces and the laser removal of small graphics in one clamping, and there is no trace of graphic splicing when the continuous processing path exceeds the three-dimensional laser marking range, which reduces the number of clamping times and adjustment time, improves processing accuracy and consistency, and can simultaneously meet the process requirements of laser and multi-path laser removal of small graphics with complex product contours, improve production efficiency, and meet the processing needs of diversified electronic products.

[0057] In one embodiment, see Figure 1 and Figure 2 The three-dimensional optical path assembly 40 includes an upper optical path mechanism 41 and a follow-up optical path mechanism 42. The upper optical path mechanism 41 is fixed to the base 10 and is used to output laser; the follow-up optical path mechanism 42 is movably connected to the base 10 and connected to the upper optical path mechanism 41, and is used to adjust the output laser in three dimensions.

[0058] The upper optical path mechanism 41 is an important part of the three-dimensional optical path assembly 40, and is fixedly mounted on the base 10 of the device. Its main function is to transmit the laser generated by the laser 411 to the follow-up optical path mechanism 42, and ensure that the laser enters the follow-up optical path mechanism 42 with a suitable direction and beam quality.

[0059] The follow-up optical path mechanism 42 is movably connected to the base 10 and is tightly connected to the upper optical path mechanism 41. Its main function is to adjust the output laser in three dimensions (X axis, Y axis, Z axis) according to actual needs. This flexible adjustment capability enables the follow-up optical path mechanism 42 to achieve complex laser processing trajectories in three-dimensional space.

[0060] The generated laser is first transmitted to the upper optical path mechanism 41. In the upper optical path mechanism 41, the laser is processed by the follower optical path mechanism 42 for preliminary shaping and collimation. This process ensures that the laser has suitable beam quality and direction, laying the foundation for subsequent precise adjustment and transmission. The laser processed by the upper optical path mechanism 41 is guided to the follower optical path mechanism 42.

[0061] In the follow-up optical path mechanism 42, the laser can be adjusted to focus on planes at different depths to meet the needs of three-dimensional curved surfaces. Through this dynamic adjustment, the follow-up optical path mechanism 42 can flexibly control the focal position and path of the laser in three-dimensional space. The adjustment of the follow-up optical path mechanism 42 works closely with the three-axis assembly 20 and the turntable assembly 30 of the equipment. The three-axis assembly 20 is responsible for moving the turntable assembly 30 to different positions, while the turntable assembly 30 rotates as needed to adjust the angle and direction of the product. In this process, the follow-up optical path mechanism 42 adjusts the output direction and focal position of the laser in real time according to the actual position and angle of the product to ensure that the laser can accurately act on the area of ​​the product.

[0062] Through the close cooperation of the upper optical path mechanism 41 and the follow-up optical path mechanism 42, the three-dimensional optical path assembly 40 can achieve efficient and high-precision three-dimensional laser. The stable transmission and preliminary shaping of the upper optical path mechanism 41 provide a good foundation for the laser, while the flexible adjustment of the follow-up optical path mechanism 42 enables the laser to accurately control the focus position and path in three-dimensional space. This design not only improves the accuracy and quality, but also can adapt to the needs of complex three-dimensional surfaces, significantly improving the processing capacity and flexibility of the equipment. In addition, the dynamic adjustment capability of the follow-up optical path mechanism 42 and the coordinated work of the three-axis assembly 20 and the rotating table assembly 30 further enhance the overall performance of the equipment, enabling it to complete laser processing of multiple surfaces and small graphics in one clamping, reducing the number of clamping times and adjustment time, and improving production efficiency.

[0063] In one embodiment, see Figure 1 , Figure 2 and Figure 3 The upper optical path mechanism 41 includes a laser 411, a beam expander 412, a first reflector assembly 413, a Z-axis dynamic adjustment unit 414 and a second reflector assembly 415. The laser 411 is fixed to the base 10 for outputting laser light; the beam expander 412 is fixed to the base 10 and is connected to the laser 411; the first reflector assembly 413 is fixed to the base 10 and is connected to the beam expander 412 for reflecting the laser light emitted by the laser 411; the Z-axis dynamic adjustment unit 414 is provided on the base 10 and is connected to the first reflector assembly 413 for adjusting the focal length of the output laser light in the Z-axis dimension direction; the second reflector assembly 415 is provided on the base 10 and is connected to the Z-axis dynamic adjustment unit 414 and the follow-up optical path mechanism 42 for reflecting the laser light emitted by the laser 411 into the follow-up optical path mechanism 42.

[0064] The laser 411 is the core component of the entire three-dimensional optical path assembly 40 and is fixedly mounted on the base 10. Its main function is to generate a high-energy, high-precision laser beam to provide a light source for subsequent laser processing operations. The output beam of the laser 411 has a high degree of directionality and coherence, ensuring the stability and accuracy of the laser during transmission and focusing. The beam expander 412 is fixed on the base 10 and connected to the laser 411. Its main function is to expand the laser output by the laser 411, that is, to expand the diameter of the laser beam. The expanded laser beam can not only reduce the energy loss in the subsequent transmission process, but also improve the quality and collimation of the beam, ensuring that the laser can still maintain good focusing performance after long-distance transmission. The first reflector assembly 413 is fixed on the base 10 and connected to the beam expander 412. The first reflector assembly 413 is a high-precision reflector, and its main function is to reflect the expanded laser beam in a predetermined direction. By accurately adjusting the angle of the reflector, it can be ensured that the laser beam is transmitted to the subsequent optical element in the correct path. The Z-axis dynamic adjustment unit 414 is mounted on the base 10 and is connected to the first reflector assembly 413. The Z-axis dynamic adjustment unit 414 includes components such as a dynamic focusing mirror and a movable mirror, which can realize the laser focal length adjustment in the Z-axis direction. By controlling the position of the movable mirror, the Z-axis dynamic adjustment unit 414 can change the focal length of the laser beam, thereby realizing the focusing of planes of different depths and meeting the requirements of three-dimensional curved surface processing. The second reflector assembly 415 is fixed on the base 10 and is connected to the Z-axis dynamic adjustment unit 414 and the follow-up optical path mechanism 42. The second reflector assembly 415 is a high-precision reflector, and its main function is to reflect the laser beam adjusted by the Z-axis dynamic adjustment unit 414 into the follow-up optical path mechanism 42. The precise adjustment of the second reflector assembly 415 ensures that the laser beam can accurately enter the follow-up optical path mechanism 42 for subsequent adjustment in the X-axis and Z-axis directions.

[0065] The laser 411 generates a high-energy laser beam, which is transmitted to the beam expander 412. The beam expander 412 expands the laser beam, expands the diameter of the laser beam, reduces energy loss and improves the collimation of the beam. The expanded laser beam is then transmitted to the first reflector assembly 413. The first reflector assembly 413 reflects the expanded laser beam to the Z-axis dynamic adjustment unit 414. In the Z-axis dynamic adjustment unit 414, the focal length of the laser beam is changed by position adjustment, thereby achieving focus adjustment in the Z-axis direction. This process enables the laser beam to adapt to processing requirements of different depths and prepare for subsequent three-dimensional processing. The laser beam adjusted by the Z-axis dynamic adjustment unit 414 is transmitted to the second reflector assembly 415. The second reflector assembly 415 reflects the laser beam into the follow-up optical path mechanism 42. In the follow-up optical path mechanism 42, the laser beam will undergo further adjustment to achieve precise control in the X-axis and Z-axis directions. The XY galvanometer in the follow-up optical path mechanism 42 quickly and accurately controls the movement of the laser beam in the X-axis and Y-axis directions according to the preset processing path. The dynamic zoom lens group adjusts the focal length of the laser beam in real time as needed to ensure that the laser focus is always located in the processing area of ​​the product. Through this dynamic adjustment, the follow-up optical path mechanism 42 can flexibly control the focal position and processing path of the laser beam in three-dimensional space. The adjustment of the follow-up optical path mechanism 42 works closely with the three-axis assembly 20 and the rotating table assembly 30 of the equipment. In this process, the follow-up optical path mechanism 42 adjusts the output direction and focal position of the laser beam in real time according to the actual position and angle of the product to ensure that the laser can accurately act on the processing area of ​​the product.

[0066] Through the close cooperation of the laser 411, the beam expander 412, the first reflector assembly 413, the Z-axis dynamic adjustment unit 414 and the second reflector assembly 415 in the upper optical path mechanism 41, the three-dimensional optical path assembly 40 can achieve efficient and high-precision three-dimensional laser processing. The high-energy laser beam generated by the laser 411 is expanded by the beam expander 412, which not only reduces energy loss, but also improves the collimation of the beam, laying the foundation for subsequent precise transmission and focusing. The precise reflection of the first reflector assembly 413 and the second reflector assembly 415 ensures that the laser beam can be transmitted to the follow-up optical path mechanism 42 according to the predetermined path, and the focal length adjustment capability of the Z-axis dynamic adjustment unit 414 enables the laser beam to adapt to the processing requirements of different depths. In addition, the close cooperation between the various components and the coordinated work of the three-axis assembly 20 and the rotating table assembly 30 of the equipment further enhance the overall performance of the equipment, enabling it to complete the processing of multiple surfaces and the removal of small graphics in one clamping, reducing the number of clamping times and adjustment time, and improving production efficiency.

[0067] In one embodiment, see Figure 1 , Figure 2 and Figure 3, the Z-axis dynamic adjustment unit 414 is a dynamic focusing lens group.

[0068] The dynamic focusing lens group is a specific form of the Z-axis dynamic adjustment unit, which is mainly composed of a movable lens group and a drive device. The lens group usually includes optical elements such as concave mirrors or convex mirrors, and the focal length of the laser beam is changed by precisely adjusting the position of the lens. The drive device drives the lens group to make a small displacement according to the instructions of the control system, thereby realizing dynamic adjustment of the focal length of the laser beam. This adjustment method can flexibly control the position of the laser focus in the Z-axis direction to meet the needs of three-dimensional curved surfaces of different heights and curvatures.

[0069] The first reflector assembly 413 reflects the laser beam to the dynamic focusing lens group. In the dynamic focusing lens group, the driving device accurately adjusts the position of the lens group according to the preset path and focal length requirements. By changing the position of the lens group, the focal length of the laser beam is adjusted in real time, thereby achieving precise control of the laser focus in the Z-axis direction.

[0070] By using a dynamic focusing lens group as a Z-axis dynamic adjustment unit, the three-dimensional optical path assembly 40 can achieve efficient and high-precision three-dimensional laser. The flexible adjustment capability of the dynamic focusing lens group enables the laser beam to quickly and accurately adjust the focal length in the Z-axis direction to meet the needs of three-dimensional surfaces of different heights and curvatures. This design significantly improves the accuracy and quality, ensures that the laser focus is always located in the product area, and reduces energy loss and errors.

[0071] In one embodiment, see Figures 1 to 6 The follow-up optical path mechanism 42 includes a fixed plate 421, an X-axis movable reflector group 422, a Z-axis movable reflector group 423 and a three-dimensional scanning head 424. The fixed plate 421 is movably connected to the base 10 and moves along the X-axis dimension direction and the Z-axis dimension direction; the X-axis movable reflector group 422 is movably connected to the fixed plate 421 and is connected to the second reflector group; the Z-axis movable reflector group 423 is arranged on the fixed plate 421 and is located below the X-axis movable reflector group 422, and the Z-axis movable reflector group 423 is connected to the X-axis movable reflector group 422; the three-dimensional scanning head 424 is arranged on the fixed plate 421 and is connected to the Z-axis movable reflector group 423, and is used to scan the surface of the product and output the adjusted laser to process the product.

[0072] The fixed plate 421 is the basic support structure of the follow-up optical path mechanism 42. The fixed plate 421 is installed on the sliding plate of the Z-axis linear module 23, and the Z-axis linear module 23 is installed on the sliding plate of the X-axis linear module 22. In this way, the fixed plate 421 can move along the X-axis dimension direction and the Z-axis dimension direction. It provides stable support and precise position adjustment for other optical components installed on it. The movement of the fixed plate 421 in the Z-axis direction is driven by a high-precision servo motor plus a lead screw and has a power-off self-locking function to ensure its motion accuracy, stability and safety in the X-axis and Z-axis directions.

[0073] The X-axis movable reflector assembly 422 is installed above the outer wall of the Z-axis linear module 23, so that it can move relative to the fixed plate 421 and communicate with the second reflector assembly 415. It is composed of high-precision reflectors, and its main function is to reflect and transmit the laser beam from the second reflector assembly 415 in the X-axis direction. By precisely controlling the position of the reflectors, the X-axis movable reflector assembly 422 can achieve flexible adjustment of the laser beam in the X-axis direction, ensuring that the laser beam can be accurately transmitted to subsequent optical elements.

[0074] The Z-axis movable reflector group 423 is mounted on the fixed plate 421, located below the X-axis movable reflector group 422, and connected to the X-axis movable reflector group 422. The Z-axis movable reflector group 423 is a high-precision reflector, which moves along the Z-axis direction following the slider of the Z-axis linear module 23 through the fixed plate 421. Its main function is to reflect and transmit the laser beam from the X-axis movable reflector group 422 in the Z-axis direction. The precise adjustment of the Z-axis movable reflector group 423 enables the laser beam to flexibly adjust the path in the Z-axis direction, further ensuring the accuracy and stability of the laser beam.

[0075] The three-dimensional scanning head 424 is mounted on the fixed plate 421 and is connected to the Z-axis movable reflector group 423. It is one of the core components of the follower optical path mechanism 42, responsible for receiving the laser beam adjusted by the X-axis and Z-axis movable reflector groups 423, and outputting it to the surface of the product. The three-dimensional scanning head 424 contains two groups of optical elements such as galvanometers and a Z-axis dynamic adjustment unit 414, which can realize accurate scanning and focusing of the laser beam in three-dimensional space. By controlling the internal components of the three-dimensional scanning head 424 and the Z-axis dynamic adjustment unit 414, the laser beam can be flexibly adjusted in the X-axis, Y-axis and Z-axis directions to ensure that the laser can accurately act on the processing area of ​​the product.

[0076] The laser beam generated by the laser 411 is first expanded by the beam expander 412 to improve the collimation of the beam and reduce energy loss. Subsequently, the laser beam is transmitted to the first reflector assembly 413, and then reflected by the first reflector assembly 413 to the dynamic focusing mirror group of the Z-axis dynamic adjustment unit 414). In the dynamic focusing mirror group, the focal length of the laser beam is adjusted to meet the processing requirements of the three-dimensional scanning head 424 of different depths in three-dimensional space. The laser beam adjusted by the Z-axis dynamic adjustment unit 414 is transmitted to the second reflector assembly 415, and then reflected to the X-axis movable reflector group 422 in the follower optical path mechanism 42. The X-axis movable reflector group 422 accurately adjusts its position according to the preset path and the adjustment requirements of the X-axis direction, and reflects the laser beam to the Z-axis movable reflector group 423. The Z-axis movable reflector group 423 receives the laser beam from the X-axis movable reflector group 422, and further adjusts its position according to the preset path and the adjustment requirements of the Z-axis direction. Through this adjustment, the laser beam is precisely controlled in the Z-axis direction to ensure that it can be accurately transmitted to the three-dimensional scanning head 424. The three-dimensional scanning head 424 receives the laser beam from the Z-axis moving reflector group 423, and realizes precise scanning and focusing of the laser beam in three-dimensional space through the dynamic zoom lens group and galvanometer and other components of its Z-axis dynamic adjustment unit 414. According to the instructions of the control system, the three-dimensional scanning head 424 adjusts the focal position and scanning path of the laser beam to ensure that the laser can accurately act on the product area and complete complex tasks.

[0077] The present invention enables the eight-axis linkage laser equipment to achieve efficient and high-precision three-dimensional laser processing through the close cooperation of the fixed plate 421, the X-axis movable reflector group 422, the Z-axis movable reflector group 423 and the three-dimensional scanning head 424 in the follower optical path mechanism 42. The X-axis and Z-axis movable capabilities of the fixed plate 421 provide flexible position adjustment for the transmission of the laser beam, while the precise reflection of the X-axis and Z-axis movable reflector group 423 ensures the accuracy and stability of the laser beam in the X-axis and Z-axis directions. The dynamic adjustment capability of the three-dimensional scanning head 424 enables the laser beam to flexibly control the focus position and processing path in three-dimensional space, adapting to the processing requirements of complex three-dimensional surfaces. This design not only significantly improves the processing accuracy and quality, but also significantly improves the processing capability and flexibility of the equipment. In addition, the close cooperation between the various components and the coordinated work of the equipment's three-axis assembly 20 and rotary table assembly 30 further enhance the overall performance of the equipment, enabling it to complete the removal of multiple surfaces and small graphics in one clamping, and there are no traces of graphic splicing when the continuous processing path exceeds the range of the three-dimensional laser marking, reducing the number of clamping times and adjustment time, and improving production efficiency.

[0078] In one embodiment, see Figure 1 , Figure 2 , Figure 3 and Figure 4 The follow-up optical path mechanism 42 also includes an accordion cover 425, which is disposed on the base 10 and connected between the X-axis movable reflector group 422 and the second reflector for sealing the optical path.

[0079] The accordion cover 425 is a flexible protective device, which is usually made of a foldable material, such as flexible plastic or coated fabric. The accordion cover 425 is installed on the base 10 and is connected between the X-axis movable reflector group 422 and the second reflector. The main function is to play a protective role to prevent external dust, debris or laser beam scattering from damaging the optical elements. In addition, the design of the accordion cover 425 allows the X-axis movable reflector group 422 to freely expand and contract in the X-axis direction without affecting its normal operation.

[0080] By adding an accordion cover 425 to the follow-up optical path mechanism 42, the eight-axis linkage laser equipment further improves the stability and reliability of the system on the basis of efficient and high-precision three-dimensional laser processing. The accordion cover 425 effectively protects the X-axis moving reflector group 422, prevents interference from external dust and debris, and extends the service life of the equipment. This design not only improves the accuracy and quality, but also enhances the adaptability and stability of the equipment in complex environments. In addition, the flexible design of the accordion cover 425 does not affect the normal operation of the X-axis moving reflector group 422, ensuring the efficient operation of the equipment.

[0081] In one embodiment, see Figure 1 , Figure 2 , Figure 3 and Figure 4 The follow-up optical path mechanism 42 also includes a visual camera 426 disposed on the fixed plate 421, and is spaced apart from the X-axis movable reflector group 422, the Z-axis movable reflector group 423 and the three-dimensional scanning head 424 for real-time collection of product processing conditions.

[0082] The visual camera 426 is mounted on the fixed plate 421 and is spaced apart from the X-axis movable reflector group 422, the Z-axis movable reflector group 423 and the three-dimensional scanning head 424. The visual camera 426 is mainly used to identify the size deviation of the product during clamping and positioning. The control system automatically gives the position deviation compensation value and collects the processing status of the product in real time. The processing status includes the shape, size, position and various parameters of the product during the process. The visual camera 426 usually has high resolution and fast imaging capabilities, and can provide clear image data so that the control system can monitor and adjust in real time to ensure the accuracy and quality of the processing process.

[0083] In one embodiment, see Figure 1 , Figure 2 , Figure 3 and Figure 4A telescopic tube 427 is arranged between the Z-axis movable reflector group 423 and the X-axis movable reflector group 422, and both ends of the telescopic tube 427 are respectively connected to the Z-axis movable reflector group 423 and the X-axis movable reflector group 422, so that the Z-axis movable reflector group 423 is connected to the X-axis movable reflector group 422.

[0084] The telescopic tube 427 is a connection device with a variable length, which is installed between the Z-axis movable reflector group 423 and the X-axis movable reflector group 422. The main function of the telescopic tube 427 is to connect the two reflector groups to ensure that the laser beam can be smoothly transmitted between the two. The telescopic tube 427 is usually composed of a movable part composed of a metal rigid material sleeve with different diameters, and can automatically adjust its own length when the Z-axis movable reflector group 423 and the X-axis movable reflector group 422 move relative to each other to adapt to the position change, while maintaining the stability and sealing of the optical path.

[0085] The laser beam adjusted by the Z-axis dynamic adjustment unit 414 is transmitted to the second reflector assembly 415. Then, the laser beam enters the X-axis movable reflector assembly 422 in the follower optical path mechanism 42. The telescopic tube 427 plays a protective role in this process to prevent external factors from interfering with the laser beam.

[0086] The X-axis movable reflector group 422 accurately adjusts the position of the reflector according to the preset path and the adjustment requirements in the X-axis direction, and reflects the laser beam to the Z-axis movable reflector group 423. The sleeve design of the telescopic tube 427 allows the X-axis movable reflector group 422 to move freely in the X-axis direction without affecting the transmission and reflection of the laser beam.

[0087] By setting a telescopic tube 427 between the Z-axis moving reflector group 423 and the X-axis moving reflector group 422, the eight-axis linkage laser equipment further improves the stability and adaptability of the system on the basis of efficient and high-precision three-dimensional laser processing. The flexible telescopic ability of the telescopic tube 427 ensures the stability of the laser transmission path and the safety of the optical components when the X-axis and Z-axis moving reflector groups 423 move relative to each other, avoiding optical path deviation or component collision caused by movement.

[0088] In one embodiment, see Figure 1 , Figure 2 , Figure 3 and Figure 4The base 10 includes a base 11 and a mounting platform 12. The mounting platform 12 is arranged on the top surface of the base 11 and is enclosed with the base 11 to form an installation space; the three-axis assembly 20 includes a Y-axis linear motion module 21, an X-axis linear motion module 22 and a Z-axis linear motion module 23. The X-axis linear motion module 22 is arranged on the mounting platform 12, the Z-axis linear motion module 23 is transmission-connected to the X-axis linear motion module 22, and the follow-up optical path mechanism 42 is transmission-connected to the Z-axis linear motion module 23; the Y-axis linear motion module 21 is arranged on the base 11 and is located below the X-axis linear motion module 22, and the rotating table assembly 30 is transmission-connected to the Y-axis linear motion module 21.

[0089] The base 10 is composed of a base 11 and a mounting platform 12. The base 11 provides stable support for the entire device to ensure the stability of the device during operation. The mounting platform 12 is arranged on the top surface of the base 11 and encloses the base 11 to form an installation space for accommodating and fixing various components of the device, such as the three-axis component 20, the rotating stage component 30 and the follow-up optical path mechanism 42.

[0090] The three-axis assembly 20 is one of the core moving parts of the equipment, and is composed of an X-axis linear motion module 22, a Y-axis linear motion module 21, and a Z-axis linear motion module 23. The X-axis linear motion module 22 is installed on the mounting platform 12, and is mainly responsible for driving the Z-axis linear motion module 23 and the follow-up optical path mechanism 42 to move along the X-axis direction. The Y-axis linear motion module 21 is installed on the base 11, located below the X-axis linear motion module 22, and is mainly responsible for driving the rotating table assembly 30 to move along the Y-axis direction. The Z-axis linear motion module 23 is connected to the X-axis linear motion module 22 in a transmission manner, and is mainly responsible for driving the follow-up optical path mechanism 42 to move along the Z-axis direction to adjust the distance between the three-dimensional scanning head 424 and the product.

[0091] The X-axis linear motion module 22 is a part of the three-axis assembly 20 and is installed on the mounting platform 12. It is usually composed of components such as a linear motor and a guide rail, and can achieve high-precision linear motion. The main function of the X-axis linear motion module 22 is to drive the Z-axis linear motion module 23 and the follow-up optical path mechanism 42 to move along the X-axis direction to adjust the position of the three-dimensional scanning head 424 in the horizontal plane. The Y-axis linear motion module 21 is another part of the three-axis assembly 20, which is installed on the base 11 and is located below the X-axis linear motion module 22. The Y-axis linear motion module 21 is also composed of components such as a linear motor and a guide rail, and is responsible for driving the rotating table assembly 30 to move along the Y-axis direction. The movement of the Y-axis linear motion module 21 works in conjunction with the X-axis linear motion module 22 to achieve precise position adjustment of the three-dimensional scanning head 424 in the horizontal plane. The Z-axis linear motion module 23 is the third part of the three-axis assembly 20, and is connected to the X-axis linear motion module 22 in a transmission manner. It is mainly responsible for driving the follow-up optical path mechanism 42 to move along the Z-axis direction and adjusting the distance between the three-dimensional scanning head 424 and the product. The Z-axis linear motion module 23 is usually driven by a servo motor and a lead screw, which can achieve high-precision vertical motion and has a power-off self-locking function to ensure the accuracy of the processing depth and focus position, and prevent accidental power failure during processing, which may cause the fixed plate 421 and the components thereon to fall freely due to gravity.

[0092] The X-axis movable reflector group 422 accurately adjusts the position of the reflector according to the preset processing path and the adjustment requirements in the X-axis direction, and reflects the laser beam to the Z-axis movable reflector group 423. The flexible design of the accordion cover 425 allows the X-axis movable reflector group 422 to move freely in the X-axis direction without affecting the transmission and reflection of the laser beam. The Z-axis movable reflector group 423 receives the laser beam from the X-axis movable reflector group 422, ensuring that it can be accurately transmitted to the three-dimensional scanning head 424.

[0093] The adjustment of the follow-up optical path mechanism 42 is closely coordinated with the three-axis assembly 20 and the rotating table assembly 30 of the equipment. The three-axis assembly 20 is responsible for moving the rotating table to different positions, while the rotating table assembly 30 rotates the B-axis and C-axis as needed to adjust the angle and direction of the product. In this process, the follow-up optical path mechanism 42 adjusts the output direction and focal position of the laser beam in real time according to the actual position and angle of the product to ensure that the laser can accurately act on the area of ​​the product.

[0094] The X-axis, Y-axis and Z-axis linear motion modules 23 of the three-axis assembly 20 can accurately control the movement of the follow-up optical path mechanism 42 and the rotating stage assembly 30, so as to realize the flexible positioning and adjustment of the scanning head in three-dimensional space. This precise motion control not only improves the accuracy and quality, but also can meet the processing requirements of complex three-dimensional curved surfaces, significantly improving the processing capacity and flexibility of the equipment.

[0095] In one embodiment, see Figure 1 and Figure 5 The rotating table assembly 30 includes a B-axis rotating member 31, a C-axis rotating member 32 and a product fixture 33. The B-axis rotating member 31 is transmission-connected to the Y-axis linear moving module 21; the C-axis rotating member 32 is rotationally connected to the B-axis rotating member 31; the product fixture 33 is arranged at one end of the C-axis rotating member 32 away from the B-axis rotating member 31, and the product fixture 33 is used to fix the product to be processed; the B-axis rotating member 31 is used to drive the C-axis rotating member 32 to rotate along the Y-axis direction, and the C-axis rotating member 32 is used to drive the product fixture 33 to rotate around the C-axis dimension direction.

[0096] The B-axis rotating member 31 is one of the core components of the turntable assembly 30, and is connected to the Y-axis linear moving module 21 in a transmission manner. Its main function is to drive the C-axis rotating member 32 to rotate around the Y-axis dimension. The B-axis rotating member 31 is usually composed of a high-precision rotating motor, a reducer and a transmission mechanism, which can achieve precise angle control and stable rotational motion. The C-axis rotating member 32 is rotatably connected to the B-axis rotating member 31 and is another key component of the turntable assembly 30. The C-axis rotating member 32 is mainly responsible for driving the product fixture 33 to rotate around the C-axis dimension. The C-axis rotating member 32 is also composed of a high-precision rotating motor, a reducer and a transmission mechanism, which can achieve precise angle control and stable rotational motion. The product fixture 33 is installed at one end of the C-axis rotating member 32 away from the B-axis rotating member 31, and is used to fix the product to be processed. The design of the product fixture 33 needs to be customized according to the shape, size and processing requirements of the product to ensure that the product is stable and immobile during the processing process, while facilitating quick clamping and disassembly.

[0097] First, the product to be processed is mounted on the product fixture 33. The product fixture 33 is adjusted according to the shape and size of the product to ensure that the product is stable and immobile on the fixture and the position is accurate. During the processing, the control system sends motion instructions to the B-axis rotating member 31 and the C-axis rotating member 32 according to the preset path and process requirements. The B-axis rotating member 31 drives the C-axis rotating member 32 to rotate around the Y-axis to adjust the inclination angle of the product; the C-axis rotating member 32 drives the product fixture 33 to rotate along the C-axis direction to adjust the orientation of the product. The movement of the rotating table assembly 30 is closely coordinated with the three-axis assembly 20. The Y-axis linear moving module 21 drives the rotating table assembly 30 to move along the Y-axis direction to adjust the position of the product in the Y-axis direction in the horizontal plane. At the same time, the X-axis linear moving module 22 and the Z-axis linear moving module 23 respectively drive the follow-up optical path mechanism 42 to move along the X-axis and Z-axis directions to adjust the X-axis position and Z-axis height of the three-dimensional scanning head 424. The follow-up optical path mechanism 42 processes the product by outputting the adjusted laser through the three-dimensional scanning head 424 according to the command of the control system. During the processing, the B-axis rotating part 31 and the C-axis rotating part 32 continuously adjust the angle and direction of the product as needed to ensure that the laser can accurately act on the processing area of ​​the product and complete the complex three-dimensional processing task.

[0098] The turntable assembly 30 significantly improves the processing capability and flexibility of the eight-axis linkage laser equipment through the close cooperation of the B-axis rotating part 31, the C-axis rotating part 32 and the product fixture 33. The precise rotation control of the B-axis rotating part 31 and the C-axis rotating part 32 enables the product to flexibly adjust the angle and direction in three-dimensional space to meet the needs of complex three-dimensional curved surfaces. The stable fixation and fast clamping capabilities of the product fixture 33 ensure the accuracy and efficiency of the processing process.

[0099] The working process of the eight-axis linkage laser equipment is as follows:

[0100] 1. Manual loading: The operator places the product to be processed on the product fixture 33 of the rotating table assembly 30 and ensures that the product is firmly installed and accurately positioned.

[0101] 2. Product front photo station: The three-axis assembly 20 moves the rotating table assembly 30 to the photo position below the visual camera 426. The visual camera 426 takes a photo of the front of the product to obtain the front shape, size and position information in the XY axis plane of the product, so that the subsequent control system can calculate the XY error compensation value of the three-dimensional spatial position of the product clamping and whether there is any expansion or contraction value in the XY plane projection direction.

[0102] 3. Product side photographing station: The three-axis assembly 20 moves the rotating table assembly 30 to the side photographing position. The visual camera 426 photographs the side of the product to obtain the shape, size and ZY axis plane position information of the side, so that the subsequent control system can calculate the ZY error compensation value of the three-dimensional spatial position of the product clamping and whether there is any expansion or contraction value in the ZY plane projection direction.

[0103] 4. After obtaining the error value of each product in the three-dimensional space after clamping, the control system calculates the actual coordinate value of the product in the three-dimensional space. After calculation, the actual space vector value of each piece and the actual product size are obtained to make synchronous compensation adjustments to see if there is any expansion or contraction. The three-dimensional space processing path with expansion and contraction compensation at the origin is rotated and translated to the actual space vector value, and the three-dimensional space processing path is planned in real time, and the processing preparation is completed.

[0104] 5. The three-axis assembly 20 moves the rotating stage assembly 30 to the position below the three-dimensional scanning head 424. The reflector group and the three-dimensional scanning head 424 in the follow-up optical path mechanism 42 are controlled to adjust the focal position and path of the laser beam, and the five-axis system and the three-dimensional laser marking system are linked to the product, and the eight-axis linkage system is used for laser processing in one go until the product processing is completed.

[0105] 6. Manual unloading: After the processing is completed, the three-axis assembly 20 moves the rotary table assembly 30 to the unloading position. The operator removes the processed product from the rotary table assembly 30, completing the entire processing process and waiting for the next product to be processed.

[0106] The above description is only an exemplary embodiment of the present invention, and does not limit the patent scope of the present invention. All equivalent structural changes made by using the contents of the present invention specification and drawings under the technical concept of the present invention, or directly / indirectly applied in other related technical fields are included in the patent protection scope of the present invention.

Claims

1. An eight-axis linkage laser device, characterized in that: The eight-axis linkage laser equipment includes: Pedestal; A three-axis assembly, wherein the three-axis assembly is arranged on the base; A rotating table assembly, which is coupled to the three-axis assembly to drive the product to rotate and move in five dimensions; and A three-dimensional optical path component is transmission-connected to the three-axis component and is located above the rotating table component, and is used to output processing lasers from three dimensional directions to perform three-dimensional processing on the product.

2. The eight-axis linkage laser device according to claim 1, characterized in that: The three-dimensional optical path component comprises: an upper optical path mechanism, the upper optical path mechanism being fixed to the base and used for outputting laser light; and A follow-up optical path mechanism is movably connected to the base and connected to the upper optical path mechanism, and is used to adjust the output laser in three dimensional directions.

3. The eight-axis linkage laser device according to claim 2, characterized in that: The upper optical path mechanism comprises: A laser, which is fixed to the base and is used to output laser light; A beam expander, which is fixed to the base and communicated with the laser; A first reflector assembly, which is fixed to the base and communicated with the beam expander, and is used to reflect the laser light emitted by the laser; A Z-axis dynamic adjustment unit, which is disposed on the base and communicated with the first reflector assembly, and is used to quickly change the output laser focus of a small-scale multi-path three-dimensional scanning head in the Z-axis dimension direction; and A second reflector assembly is arranged on the base and is connected to the Z-axis dynamic adjustment unit and the follow-up optical path mechanism, and is used for reflecting the laser emitted by the laser into the follow-up optical path mechanism.

4. The eight-axis linkage laser device according to claim 3, characterized in that: The Z-axis dynamic adjustment unit is a dynamic focusing lens group.

5. The eight-axis linkage laser device according to claim 3, characterized in that: The follow-up optical path mechanism comprises: A fixed plate, the fixed plate is movably connected to the base and moves along the X-axis and Z-axis dimensions; An X-axis movable reflector group, wherein the X-axis movable reflector group is movably connected to the fixed plate and communicated with the second reflector group; A Z-axis movable reflector group, wherein the Z-axis movable reflector group is disposed on the fixed plate and is located below the X-axis movable reflector group, and the Z-axis movable reflector group is connected to the X-axis movable reflector group; and A three-dimensional scanning head is arranged on the fixed plate and is connected to the Z-axis movable reflector group, and is used for scanning the surface of the product and outputting adjusted laser to process the product.

6. The eight-axis linkage laser device according to claim 5, characterized in that: The follow-up optical path mechanism also includes an accordion cover, which is arranged on the base and connected between the X-axis movable reflector group and the second reflector for sealing the optical path.

7. The eight-axis linkage laser device according to claim 5, characterized in that: The follow-up optical path mechanism also includes a visual camera arranged on the fixed plate, and is spaced apart from the X-axis movable reflector group, the Z-axis movable reflector group and the three-dimensional scanning head, for real-time collection of product processing conditions.

8. The eight-axis linkage laser device according to claim 5, characterized in that: A telescopic tube is arranged between the Z-axis movable reflector group and the X-axis movable reflector group, and two ends of the telescopic tube are respectively connected with the Z-axis movable reflector group and the X-axis movable reflector group, so that the Z-axis movable reflector group is connected with the X-axis movable reflector group.

9. The eight-axis linkage laser device according to claim 2, characterized in that: The base includes a pedestal and a mounting platform, wherein the mounting platform is arranged on the top surface of the pedestal and encloses the pedestal to form an installation space; The three-axis assembly includes an X-axis linear motion module, a Y-axis linear motion module and a Z-axis linear motion module. The X-axis linear motion module is arranged on the mounting platform, the Z-axis linear motion module is transmission-connected to the X-axis linear motion module, and the follow-up optical path mechanism is transmission-connected to the Z-axis linear motion module; the Y-axis linear motion module is arranged on the base and is located below the X-axis linear motion module, and the rotating table assembly is transmission-connected to the Y-axis linear motion module.

10. The eight-axis linkage laser device according to claim 9, characterized in that: The rotating stage assembly comprises: A B-axis rotating member, the B-axis rotating member is transmission-connected to the Y-axis linear moving module; A C-axis rotating member, the C-axis rotating member is rotatably connected to the B-axis rotating member; and A product jig, the product jig being arranged at one end of the C-axis rotating member away from the B-axis rotating member, and the product jig being used to fix the product to be processed; The B-axis rotating member is used to drive the C-axis rotating member to rotate around the Y-axis dimension, and the C-axis rotating member is used to drive the product fixture to rotate in the XZ plane direction.