Peeling method, peeling device, processing equipment and storage medium

Abstract

The invention is applicable to the technical field of material processing, and provides a stripping method, a stripping device, processing equipment and a storage medium, the stripping method comprises the following steps: fixing a workpiece with a processing trace; and the workpiece is torn off from the edge of the workpiece along the machining trace, so that the part, from the surface of the workpiece to the machining trace, of the workpiece is elastically deformed, and the sheet-shaped sub-component is stripped from the workpiece along the machining trace. According to the stripping method provided by the embodiment of the invention, the implementation difficulty can be reduced.

Description

Technical Field

[0001] The present application belongs to the field of material processing technology, and in particular relates to a stripping method, a stripping device, a processing equipment and a storage medium. Background Art

[0002] The third-generation semiconductor silicon carbide (SiC) has excellent physical properties such as wide bandgap, high critical breakdown field strength, and high thermal conductivity, making it an ideal substrate material for the preparation of power devices and radio frequency devices.

[0003] In the process of preparing silicon carbide (SiC) substrates, the silicon carbide ingot is first processed by laser to form processing marks within a predetermined depth range of the silicon carbide ingot, and then the sheet-shaped wafer is peeled off from the silicon carbide ingot by mechanical peeling. The current method of mechanically peeling silicon carbide ingots is axial tensile peeling, specifically using a suction cup to absorb the top surface of the silicon carbide ingot for axial tensile peeling. The tensile force required for axial tensile peeling is relatively large, and it is difficult to implement. Summary of the invention

[0004] The embodiments of the present application provide a stripping method, a stripping device, a processing equipment and a storage medium, which can reduce the difficulty of implementation.

[0005] In a first aspect, an embodiment of the present application provides a stripping method, comprising:

[0006] Fixing workpieces with machining marks;

[0007] The workpiece is torn from the edge of the workpiece along the processing trace, so that the portion from the surface of the workpiece to the processing trace undergoes elastic deformation, so as to peel off a sheet-like sub-component from the workpiece along the processing trace.

[0008] In a possible implementation manner of the first aspect, tearing the workpiece from the edge of the workpiece along the processing trace so that the portion from the surface of the workpiece to the processing trace undergoes elastic deformation, so as to peel off a sheet-like subcomponent from the workpiece along the processing trace, includes:

[0009] Fixing the plate to the surface of the workpiece;

[0010] The plate is flipped up to cause elastic deformation of the plate, so as to flip up the surface of the workpiece from the edge of the workpiece to the portion of the processing trace along the processing trace and drive the surface of the workpiece to the portion of the processing trace to undergo elastic deformation, thereby peeling off a sheet-like sub-component from the workpiece along the processing trace.

[0011] In a possible implementation manner of the first aspect, turning up the plate includes:

[0012] Lift up the plate or pull up the plate to turn over the plate.

[0013] In a possible implementation manner of the first aspect, the step of fixing the plate to the surface of the workpiece includes:

[0014] The plate is fixedly connected to the surface of the workpiece by means of a bonding material.

[0015] In a possible implementation manner of the first aspect, both sides of the bonding material are adhesive.

[0016] In a possible implementation manner of the first aspect, a debonding method of the bonding material includes thermal debonding or photodebonding.

[0017] In a possible implementation manner of the first aspect, the step of fixing the plate to the surface of the workpiece by means of a bonding material includes:

[0018] bonding the first side of the bonding material to the surface of the workpiece;

[0019] The plate is bonded to the second surface of the bonding material so that the bonding material is located between the plate and the workpiece.

[0020] In a possible implementation manner of the first aspect, the stripping method further includes:

[0021] The sheet is separated from the subcomponent by debonding.

[0022] In a possible implementation manner of the first aspect, fixing the workpiece having processing traces includes:

[0023] The bottom surface of the workpiece with processing marks is fixedly connected to the carrier.

[0024] In a possible implementation manner of the first aspect, the plate includes a glass plate, a sapphire plate, or a spring steel plate.

[0025] In a possible implementation manner of the first aspect, before fixing the workpiece having the processing traces, the stripping method further includes:

[0026] The workpiece is processed by laser so as to form the processing mark on the workpiece.

[0027] In a possible implementation manner of the first aspect, before fixing the workpiece having the processing traces, the stripping method further includes:

[0028] The workpiece is processed by laser and then processed by ultrasonic wave, so that the workpiece forms the processing mark.

[0029] In a possible implementation manner of the first aspect, the step of fixing the plate to the surface of the workpiece includes:

[0030] Covering the entire top surface of the workpiece with a plate;

[0031] The plate is fixedly connected to the top surface.

[0032] In a possible implementation manner of the first aspect, the material of the workpiece is a brittle material.

[0033] In a second aspect, an embodiment of the present application provides a peeling device, comprising:

[0034] A fixing unit to fix the workpiece with machining traces;

[0035] The tearing unit tears the workpiece from the edge of the workpiece along the processing trace, so that the portion from the surface of the workpiece to the processing trace undergoes elastic deformation, so as to peel off a sheet-like sub-component from the workpiece along the processing trace.

[0036] In a possible implementation manner of the second aspect, the tearing unit includes:

[0037] A connecting unit, which fixes and connects the plate to the surface of the workpiece;

[0038] A flipping unit flips up the plate to cause elastic deformation of the plate, so as to flip up the surface of the workpiece from the edge of the workpiece to the portion of the processing trace along the processing trace and drive the surface of the workpiece to the portion of the processing trace to undergo elastic deformation, thereby peeling off a sheet-like sub-component from the workpiece along the processing trace.

[0039] In a third aspect, an embodiment of the present application provides a processing device, comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor implements any one of the methods described in the first aspect when executing the computer program.

[0040] In a fourth aspect, an embodiment of the present application provides a computer-readable storage medium, wherein the computer-readable storage medium stores a computer program, and when the computer program is executed by a processor, the method described in any one of the above-mentioned first aspects is implemented.

[0041] In a fifth aspect, an embodiment of the present application provides a computer program product. When the computer program product runs on a terminal device, the terminal device executes any one of the methods described in the first aspect.

[0042] The beneficial effects of the embodiments of the present application are:

[0043] By fixing the workpiece with processing marks, using the processing marks as a breakthrough, and tearing the surface of the workpiece from the edge of the workpiece to the part with processing marks, the part of the workpiece undergoes elastic deformation, thereby peeling off the sheet-like sub-components from the workpiece along the processing marks. The force required to be applied is small, which is easy to implement and can reduce the difficulty of implementation. BRIEF DESCRIPTION OF THE DRAWINGS

[0044] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0045] Figure 1 It is a structural schematic diagram of a stripping device used in a stripping method provided in an embodiment of the present application;

[0046] Figure 2 It is a schematic diagram of a process of a stripping method provided in an embodiment of the present application;

[0047] Figure 3 It is an exploded view of a part of the structure of a stripping device used in a stripping method provided in one embodiment of the present application;

[0048] Figure 4 is a working state diagram of a stripping device used in a stripping method provided in one embodiment of the present application;

[0049] Figure 5 is a schematic flow chart of step A2 of the stripping method provided in one embodiment of the present application;

[0050] Figure 6 is a schematic flow chart of step A21 of the stripping method provided in one embodiment of the present application;

[0051] Figure 7 is a schematic flow chart of a stripping method provided in another embodiment of the present application;

[0052] Figure 8 is a schematic flow chart of a stripping method provided in another embodiment of the present application;

[0053] Fig. 9 is a schematic flow chart of a stripping method provided in another embodiment of the present application;

[0054] Fig.10 It is a structural schematic diagram of a processing device provided in one embodiment of the present application. DETAILED DESCRIPTION

[0055] In order to make the technical problems, technical solutions and beneficial effects to be solved by this application clearer, the following Figures 1 to 10 It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0056] In the following description, specific details such as specific system structures, technologies, etc. are provided for the purpose of illustration rather than limitation, so as to provide a thorough understanding of the embodiments of the present application. However, it should be clear to those skilled in the art that the present application may also be implemented in other embodiments without these specific details. In other cases, detailed descriptions of well-known systems, devices, circuits, and methods are omitted to prevent unnecessary details from obstructing the description of the present application.

[0057] It should be understood that when used in the present specification and the appended claims, the term "comprising" indicates the presence of described features, wholes, steps, operations, elements and / or components, but does not exclude the presence or addition of one or more other features, wholes, steps, operations, elements, components and / or combinations thereof.

[0058] It should also be understood that the term “and / or” used in the specification and appended claims refers to any and all possible combinations of one or more of the associated listed items, and includes these combinations.

[0059] As used in the specification and appended claims of this application, the term "if" can be interpreted as "when" or "uponce" or "in response to determining" or "in response to detecting", depending on the context. Similarly, the phrase "if it is determined" or "if [described condition or event] is detected" can be interpreted as meaning "uponce it is determined" or "in response to determining" or "uponce [described condition or event] is detected" or "in response to detecting [described condition or event]", depending on the context.

[0060] In addition, in the description of the present application specification and the appended claims, the terms "first", "second", "third", etc. are only used to distinguish the descriptions and cannot be understood as indicating or implying relative importance.

[0061] References to "one embodiment" or "some embodiments" etc. described in the specification of this application mean that one or more embodiments of the present application include specific features, structures or characteristics described in conjunction with the embodiment. Therefore, the statements "in one embodiment", "in some embodiments", "in some other embodiments", "in some other embodiments", etc. that appear in different places in this specification do not necessarily refer to the same embodiment, but mean "one or more but not all embodiments", unless otherwise specifically emphasized in other ways. The terms "including", "comprising", "having" and their variations all mean "including but not limited to", unless otherwise specifically emphasized in other ways.

[0062] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

[0063] It should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0064] The embodiment of the present application provides a stripping method for stripping a subcomponent from a workpiece. The material of the aforementioned workpiece can be a brittle material or a hard material. Specifically, the aforementioned workpiece can be a silicon carbide ingot, a gallium nitride ingot, a sapphire ingot, a glass ingot or a ceramic ingot. Taking the silicon carbide ingot 1 as an example, the embodiment of the present application is described.

[0065] Figure 1 Schematic diagram of the structure of a stripping device used in a stripping method provided in an embodiment of the present application. Figure 1 The stripping method provided in the embodiment of the present application uses a stripping device, which includes a carrier 2, a glass plate 3 (ie, a plate), a bonding material 4, a lifting component 5, and a supporting component 6.

[0066] Figure 2 Schematic diagram of a stripping method according to an embodiment of the present application. Figure 2 The stripping method provided in the embodiment of the present application includes steps A1 to A3.

[0067] Step A1, fixing the workpiece with processing marks.

[0068] After the silicon carbide ingot 1 (ie, the workpiece) is processed (eg, laser processed), a processing mark will be formed, and the processing mark includes a plurality of cracks. The processing mark can be a processing mark located within a specified depth range of the silicon carbide ingot.

[0069] The processing traces are used to separate the silicon carbide ingot 1 into multiple parts. It should be understood that although the silicon carbide ingot 1 has been processed and formed with processing traces, the parts are still connected together and need to be subjected to a subsequent peeling process.

[0070] Figure 3 This is a disassembled view of a portion of the structure of a stripping device used in a stripping method provided in one embodiment of the present application. Figure 4 FIG. 1 is a working state diagram of a stripping device used in a stripping method provided in an embodiment of the present application. Figure 1 , Figure 3 and Figure 4 In order to subsequently divide the silicon carbide ingot 1 into multiple parts, the silicon carbide ingot 1 needs to be fixed.

[0071] Specifically, the bottom surface of the silicon carbide ingot 1 can be fixed to the carrier 2, for example, the silicon carbide ingot 1 can be placed on an adsorption carrier, so that the adsorption carrier adsorbs the bottom surface of the silicon carbide ingot 1 to fix the silicon carbide ingot 1. Of course, the silicon carbide ingot 1 can also be fixed by clamping.

[0072] Step A2: tearing the workpiece from the edge of the workpiece along the processing trace, so that the portion from the surface of the workpiece to the processing trace undergoes elastic deformation, so as to peel off a sheet-like sub-component from the workpiece along the processing trace.

[0073] For the silicon carbide ingot 1 or the sapphire ingot, the portion from the surface to the processing trace is in a thin sheet shape and can undergo elastic deformation.

[0074] Figure 5 is a schematic flow chart of step A2 of the peeling method provided in one embodiment of the present application. Figure 5 , step A2 may specifically include step A21 and step A22.

[0075] Step A21, fixing the plate to the surface of the workpiece.

[0076] The plate is specifically a plate that can undergo elastic deformation, such as a glass plate, a sapphire plate, or a spring steel plate. The embodiment of the present application is described by taking the glass plate 3 as an example.

[0077] refer to Figure 1, the top surface of the silicon carbide ingot 1 is the processing surface, and the glass plate 3 can be fixedly connected to the top surface of the silicon carbide ingot 1 to peel off the portion from the top surface to the processing trace. For other ingots, if the side surface is the processing surface, the glass plate is fixedly connected to the side surface of the workpiece to peel off the portion from the side surface to the processing trace.

[0078] For example, the glass plate 3 may be fixedly connected to the surface of the silicon carbide ingot 1 by bonding or adsorption.

[0079] Step A21 (fixingly connecting the plate to the surface of the workpiece) may specifically include: fixing the plate to the surface of the workpiece via a bonding material.

[0080] The bonding material 4 may specifically be a thermal bonding material, a laser bonding material or various adhesive tapes.

[0081] refer to Figure 1 , Figure 3 and Figure 4 The glass plate 3 is fixedly connected to the surface of the silicon carbide ingot 1 through the bonding material 4, which can form a firm connection, improve the connection strength, and better protect the surface of the silicon carbide ingot 1 to the processing traces during the peeling process.

[0082] In some embodiments, both sides of the bonding material 4 are adhesive.

[0083] The plate is fixedly connected to the surface of the workpiece by means of bonding material 4, specifically including step A211 and step A212.

[0084] Step A211, bonding the first surface of the bonding material 4 to the surface of the workpiece.

[0085] The first surface and the second surface of the bonding material 4 are sticky. The first surface of the bonding material 4 is placed on the surface of the silicon carbide ingot 1 so that the first surface of the bonding material 4 is bonded to the surface of the silicon carbide ingot 1, thereby fixing the bonding material 4 to the silicon carbide ingot 1.

[0086] Step A212: Bond the plate to the second surface of the bonding material 4 so that the bonding material 4 is located between the glass plate 3 and the workpiece.

[0087] After the bonding material 4 is fixed to the silicon carbide ingot 1, the glass plate 3 is placed on the second surface of the bonding material 4, so that the glass plate 3 is bonded to the second surface of the bonding material 4, thereby achieving a fixed connection between the glass plate 3 and the silicon carbide ingot 1. In the thickness direction of the silicon carbide ingot 1, the bonding material 4 is located between the glass plate 3 and the workpiece.

[0088] refer to Figure 1 , Figure 3 and Figure 4After the glass plate 3 is fixedly connected to the surface of the silicon carbide ingot 1, a part of the glass plate 3 is fixed to the silicon carbide ingot, and the other part is suspended. The suspended part of the glass plate 3 is the edge part, which serves as the subsequent direct force-bearing part.

[0089] Step A22, flip up the plate to make the plate elastically deform and drive the surface of the workpiece to the part with the processing trace to elastically deform, so as to flip up a part of the workpiece from the edge of the workpiece along the processing trace, thereby peeling off the sheet-like sub-component from the workpiece along the processing trace.

[0090] As mentioned above, the suspended portion of the glass plate 3 (ie, the plate) is its edge portion. A force is applied to the edge portion of the glass plate 3 along the thickness direction H of the silicon carbide crystal ingot 1, so that the glass plate 3 undergoes elastic deformation.

[0091] refer to Figure 3 and Figure 4 For example, the edge of the glass plate 3 is lifted by a lifting component 5 (such as a cylinder or a hydraulic cylinder), so that the glass plate 3 is turned up and elastically deformed.

[0092] Since the glass plate 3 is fixedly connected to the top surface of the silicon carbide crystal ingot 1, the glass plate 3 will cause the portion from the top surface of the silicon carbide crystal ingot 1 to the processing trace to flip up from the edge and undergo elastic deformation, tearing off the portion from the top surface to the processing trace from the edge of the silicon carbide crystal ingot 1, thereby peeling off a sheet-like sub-component 11 from the silicon carbide crystal ingot 1 along the processing trace, and the remaining portion is the portion to be processed 12, wherein the sub-component 11 is a wafer.

[0093] One type of glass plate that can undergo elastic deformation is a common high-boron glass plate. Of course, the parameters of the glass plate (such as Young's modulus and Poisson's ratio) can also be controlled according to the actual conditions of the workpiece to select a suitable glass plate, and the same is true for other plates.

[0094] In some other embodiments, when peeling off workpieces made of other materials (for example, workpieces made of plastic materials), the glass plate 3 is optional, and the lifting component 5 can be directly connected to the edge portion of the surface of the workpiece. When the lifting component 5 is lifted, it drives the surface of the workpiece to move to the part with the processing traces, and tears the workpiece from the edge of the workpiece along the processing traces, thereby peeling off the sheet-like sub-components from the workpiece along the processing traces.

[0095] According to the above content, it can be known that by fixing the silicon carbide ingot 1 with processing marks, taking the processing marks as a breakthrough point, and tearing the surface of the silicon carbide ingot 1 from the edge of the silicon carbide ingot 1 to the part with processing marks, the part of the silicon carbide ingot 1 undergoes elastic deformation, thereby peeling off the sheet-like sub-component 11 from the silicon carbide ingot 1 along the processing marks. The force required to be applied is small, which is easy to implement and can reduce the difficulty of implementation.

[0096] In addition, the glass plate 3 is fixedly connected to the surface of the silicon carbide crystal ingot 1, and the glass plate 3 is flipped up to make the glass plate 3 elastically deform. The glass plate 3 will drive the surface of the silicon carbide crystal ingot 1 to the part with processing marks to flip up from the edge and elastically deform, thereby peeling off the sheet-like sub-component 11 from the silicon carbide crystal ingot 1 along the processing marks. In this process, the glass plate 3 can support the sub-component 11, prevent the sub-component 11 from being damaged, protect the sub-component 11, and improve product quality. It is particularly suitable for peeling brittle materials or semiconductor materials such as the silicon carbide crystal ingot 1.

[0097] After the silicon carbide ingot 1 (i.e., the workpiece) is laser processed, a processing mark including multiple cracks is formed; Figure 1 and Figure 4 , since the glass plate 3 (i.e., the plate) will continue to undergo significant deformation (for example, it will continue to undergo significant deformation as the lifting assembly 5 is lifted), for the cracks on the peeling interface, the tensile stress ( Figure 1 and Figure 4 The straight line segment of the one-way arrow in the figure indicates that the tensile stress is the largest, and the tensile stress at the position away from the force-bearing point of the glass plate 3 (i.e., the plate) gradually decreases with the distance; from the perspective of inducing stress concentration, this method is more likely to cause cracks to propagate than the situation where the glass plate 3 (i.e., the plate) is basically not deformed, and it is easier to peel off the sheet-like sub-components from the silicon carbide ingot 1 (i.e., the workpiece), which can make the force required to be applied smaller.

[0098] refer to Figure 1 , Figure 3 and Figure 4 In order to facilitate flipping up the glass plate 3, the glass plate 3 can be rotatably connected to the supporting component 6. In this way, during the peeling process, the glass plate 3 will rotate around the connection with the supporting component 6, which can prevent the glass plate 3 from crushing the edge of the sub-component 11 after peeling off the sub-component 11, and can prevent the glass plate 3 from falling and being damaged.

[0099] The supporting component 6 can be specifically arranged on the carrier 2 or on the ground.

[0100] Figure 6 is a schematic flow chart of step A21 of the peeling method provided in one embodiment of the present application. Figure 6 The above-mentioned step A21 (fixing the plate to the surface of the workpiece) may specifically include step A211 and step A212.

[0101] Step A211, cover the entire top surface of the workpiece with a plate.

[0102] The size of the glass plate 3 should be greater than or equal to the size of the top surface of the silicon carbide crystal ingot 1 , so as to completely cover the top surface of the silicon carbide crystal ingot 1 .

[0103] Step A212: fix the plate to the top surface of the workpiece.

[0104] After the glass plate 3 and the silicon carbide ingot 1 are fixed to each other, each part of the top surface of the silicon carbide ingot 1 is fixedly connected to the surface of the glass plate 3 .

[0105] Since the glass plate 3 covers the entire top surface of the silicon carbide ingot 1 and is fixedly connected to the top surface of the silicon carbide ingot 1, the strength of the entire top surface of the silicon carbide ingot 1 can be enhanced, and the top surface of the silicon carbide ingot 1 to the processing traces can be protected during the peeling process to prevent breakage.

[0106] Turning up the plate in the above step A22 specifically includes: lifting up the plate or pulling up the plate to turn up the plate.

[0107] No matter the glass plate 3 is lifted up at the edge of the glass plate 3 or the glass plate 3 is pulled up at the edge of the glass plate 3 , a force along the thickness direction H of the silicon carbide crystal ingot 1 is applied to the edge of the glass plate 3 .

[0108] Since a portion of the glass plate 3 is fixedly connected to the surface of the silicon carbide ingot 1, when the glass plate 3 is lifted up at the edge of the glass plate 3 or when the glass plate 3 is pulled up at the edge of the glass plate 3, the glass plate 3 will be flipped up from the edge of the glass plate 3, thereby driving the surface of the silicon carbide ingot 1 to the part with processing marks to flip up from the edge.

[0109] In the process of turning up the glass plate 3, the force point of the glass plate 3 is at the suspended part, and the fixing point between the glass plate 3 and the surface of the silicon carbide ingot 1 is used as a fulcrum, and the lever principle is used to further reduce the force required to be applied.

[0110] Figure 7 is a schematic diagram of a stripping method provided by another embodiment of the present application. Figure 7 The above-mentioned stripping method may further include step A3.

[0111] Step A3: Separate the plate from the subcomponents.

[0112] After the sheet-like subcomponent 11 (such as a wafer) is peeled off from the silicon carbide ingot 1, the glass plate 3 is still fixedly connected to the surface of the sheet-like subcomponent 11. In order to subsequently process the sheet-like subcomponent 11, the plate and the subcomponent 11 need to be separated.

[0113] If the glass plate 3 is fixedly connected to the surface of the silicon carbide ingot 1 by the bonding material 4, the glass plate 3 needs to be separated from the subcomponent 11 by debonding. The specific method of debonding can be thermal debonding or photodebonding (such as laser debonding or ultraviolet debonding).

[0114] Among them, thermal bonding and pyrolysis bonding are more convenient bonding and debonding methods in actual production. If the plate is fixedly connected to the surface of the workpiece by thermal bonding, and the plate is separated from the subcomponent by pyrolysis bonding, the plate can be a glass plate. In actual production, the thermal expansion coefficient of the glass plate is easy to adjust, which can better meet the temperature required for thermal bonding and pyrolysis bonding.

[0115] As mentioned above, both sides of the bonding material 4 can be sticky. The first side of the bonding material 4 is bonded to the surface of the workpiece, and the glass plate 3 is bonded to the second side of the bonding material 4, so that the bonding material 4 is located between the glass plate 3 and the workpiece, thereby achieving rapid fixed connection of the glass plate 3 to the silicon carbide ingot 1. After the sheet-like sub-component 11 is peeled off from the silicon carbide ingot 1 along the processing traces, the glass plate 3 is separated from the sub-component 11 by pyrolysis bonding or photolysis bonding, which can increase the speed of the entire peeling process and improve efficiency.

[0116] Figure 8 is a schematic diagram of a stripping method provided by another embodiment of the present application. Figure 8 Before step A1 (fixing the workpiece with processing marks), the above-mentioned stripping method may further include step B1.

[0117] Step B1, processing the workpiece by laser to form processing marks on the workpiece.

[0118] Specifically, by irradiating the interior of the silicon carbide ingot 1 with laser light, a crack layer having cracks is generated within a preset depth range of the silicon carbide ingot 1 , and the crack layer is the aforementioned processing trace.

[0119] In the embodiments of the present application, since the processing marks are used as a breakthrough point, the force required to be applied is relatively small to tear open the surface of the silicon carbide ingot 1 from the edge of the silicon carbide ingot 1 to the portion of the processing marks, which can reduce the degree of laser processing on the silicon carbide ingot 1, reduce the number of laser processing times on the silicon carbide ingot 1, and improve production efficiency.

[0120] Fig. 9 is a schematic diagram of a stripping method provided by another embodiment of the present application. Fig. 9 Before step A1 (fixing the workpiece with processing marks), the above-mentioned stripping method may further include step C1.

[0121] Step C1, processing the workpiece by laser, and then processing the workpiece by ultrasonic wave, so that processing marks are formed on the workpiece.

[0122] Specifically, laser irradiation is performed inside the silicon carbide ingot 1 to generate a crack layer within a preset depth range of the silicon carbide ingot 1, and then ultrasonic waves are focused on the cracks in the crack layer of the silicon carbide ingot 1 to expand the cracks. The crack layer after crack expansion is the aforementioned processing trace.

[0123] In an embodiment of the present application, a silicon carbide ingot 1 is processed by laser and ultrasound to form processing marks on the silicon carbide ingot 1, and then the processing marks are used as a breakthrough to tear open the surface of the silicon carbide ingot 1 from the edge of the silicon carbide ingot 1 to the part with the processing marks. The force required to be applied is relatively small, and with the auxiliary processing of ultrasound, the degree of laser processing on the silicon carbide ingot 1 can be further reduced, the number of laser processing times on the silicon carbide ingot 1 can be further reduced, and the production efficiency can be further improved.

[0124] It should be understood that the size of the serial numbers of the steps in the above embodiments does not mean the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of the present application.

[0125] Corresponding to the method described in the above embodiment, an embodiment of the present application provides a peeling device, which includes a fixing unit and a tearing unit.

[0126] The fixing unit fixes the workpiece having machining traces.

[0127] The tearing unit tears the workpiece from the edge of the workpiece along the processing trace, so that the portion from the surface of the workpiece to the processing trace undergoes elastic deformation, so as to peel off a sheet-like sub-component from the workpiece along the processing trace.

[0128] It should be understood that the fixing unit may include the above-mentioned carrier 2; the tearing unit may include the above-mentioned glass plate 3, bonding material 4, lifting assembly 5 and supporting component 6.

[0129] The tearing unit may include a connecting unit and a turning unit.

[0130] The connecting unit securely connects the plate to the surface of the workpiece.

[0131] The flipping unit flips up the plate to cause elastic deformation of the plate, flipping up the surface of the workpiece from the edge of the workpiece along the processing trace to the portion of the processing trace and driving the surface of the workpiece to the portion of the processing trace to undergo elastic deformation, thereby peeling off the sheet-like sub-component from the workpiece along the processing trace.

[0132] It should be understood that the connecting unit may include the glass plate 3 and the bonding material 4 mentioned above; and the lifting unit may include the lifting assembly 5 and the supporting component 6 mentioned above.

[0133] In some embodiments, the turning-up unit lifts up the sheet or pulls up the sheet to turn the sheet up.

[0134] In some embodiments, the fixing unit fixes the plate to the surface of the workpiece via a bonding material.

[0135] The stripping device may further include a separation unit.

[0136] The separation unit separates the plate from the subcomponent by debonding.

[0137] In some embodiments, the fixing unit is fixedly connected to the bottom surface of the workpiece having the processing traces.

[0138] The stripping device may further include a first processing unit.

[0139] The laser processing unit processes the workpiece by using laser to form processing marks on the workpiece.

[0140] The stripping device may further include a second processing unit.

[0141] The processing unit processes the workpiece by laser and then processes the workpiece by ultrasonic wave, so that processing marks are formed on the workpiece.

[0142] It should be noted that the information interaction, execution process, etc. between the above-mentioned devices / units are based on the same concept as the method embodiments of the present application. Their specific functions and technical effects can be found in the method embodiments section and will not be repeated here.

[0143] Fig.10 This is a schematic diagram of the structure of a processing device provided in one embodiment of the present application. Fig.10 As shown, the processing device 10 of this embodiment includes: at least one processor 100 ( Fig.10 Only one is shown in the figure), a memory 101, and a computer program 102 stored in the memory 101 and executable on at least one processor 100; when the processor 100 executes the computer program 102, the steps in the above-mentioned method embodiments are implemented.

[0144] The processing device 10 may be a computing device such as a desktop computer, a notebook, a PDA, or a cloud server. The processing device may include, but is not limited to, a processor 100 and a memory 101. Those skilled in the art will appreciate that Fig.10 It is only an example of processing equipment and does not constitute a limitation of the processing equipment. It may include more or fewer components than shown in the figure, or a combination of certain components, or different components. For example, it may also include input and output devices, network access equipment, buses, etc.

[0145] The processor 100 may be a central processing unit (CPU), or other general-purpose processors, digital signal processors (DSP), application-specific integrated circuits (ASIC), field-programmable gate arrays (FPGA) or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc. A general-purpose processor may be a microprocessor or any conventional processor, etc.

[0146] In some embodiments, the memory 101 may be an internal storage unit of the processing device 10, such as a hard disk or memory of the processing device. In other embodiments, the memory 101 may also be an external storage device of the processing device, such as a plug-in hard disk equipped on the processing device, a smart memory card (Smart Media Card, SMC), a secure digital (Secure Digital, SD) card, a flash card (Flash Card), etc. Further, the memory 101 may also include both an internal storage unit of the processing device and an external storage device. The memory 101 is used to store an operating system, an application program, a boot loader (BootLoader), data, and other programs, such as program codes of a computer program. The memory 101 may also be used to temporarily store data that has been output or is to be output.

[0147] Exemplarily, the computer program 102 may be divided into one or more modules / units, one or more modules / units are stored in the memory 101, and are executed by the processor 100 to complete the present application. One or more modules / units may be a series of computer program instruction segments capable of completing specific functions, and the instruction segments are used to describe the execution process of the computer program 102 in the processing device 10.

[0148] The technicians in the relevant field can clearly understand that for the convenience and simplicity of description, only the division of the above-mentioned functional units and modules is used as an example for illustration. In practical applications, the above-mentioned function allocation can be completed by different functional units and modules as needed, that is, the internal structure of the device can be divided into different functional units or modules to complete all or part of the functions described above. The functional units and modules in the embodiment can be integrated in a processing unit, or each unit can exist physically separately, or two or more units can be integrated in one unit. The above-mentioned integrated unit can be implemented in the form of hardware or in the form of software functional units. In addition, the specific names of the functional units and modules are only for the convenience of distinguishing each other, and are not used to limit the scope of protection of this application. The specific working process of the units and modules in the above-mentioned system can refer to the corresponding process in the aforementioned method embodiment, which will not be repeated here.

[0149] If the aforementioned integrated unit is implemented in the form of a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the present application implements all or part of the processes in the above-mentioned embodiment method, which can be completed by instructing the relevant hardware through a computer program, and the computer program can be stored in a computer-readable storage medium; when the computer program is executed by the processor, the steps of the above-mentioned various method embodiments can be implemented. Among them, the computer program includes computer program code, and the computer program code can be in source code form, object code form, executable file or some intermediate form. Computer-readable media include: any entity or device that can carry computer program code to a device / terminal device, a recording medium, a computer memory, a read-only memory (ROM, Read-Only Memory), a random access memory (RAM, Random Access Memory), an electric carrier signal, a telecommunication signal, and a software distribution medium. For example, a USB flash drive, a mobile hard disk, a magnetic disk or an optical disk. In some jurisdictions, according to legislation and patent practice, computer-readable media cannot be electric carrier signals and telecommunication signals.

[0150] An embodiment of the present application further provides a computer-readable storage medium, which stores a computer program. When the computer program is executed by a processor, the steps in the above-mentioned method embodiments can be implemented.

[0151] An embodiment of the present application provides a computer program product. When the computer program product runs on a terminal device, the terminal device can implement the steps in the above-mentioned various method embodiments.

[0152] In the above embodiments, the description of each embodiment has its own emphasis. For parts that are not described or recorded in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0153] Those of ordinary skill in the art will appreciate that the units and algorithm steps of each example described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are performed in hardware or software depends on the specific application and design constraints of the technical solution. Professional and technical personnel can use different methods to implement the described functions for each specific application, but such implementation should not be considered to be beyond the scope of this application.

[0154] In the embodiments provided in the present application, it should be understood that the disclosed devices / equipment and methods can be implemented in other ways. For example, the device / equipment embodiments described above are merely schematic, for example, the division of the modules or units is only a logical function division, and there may be other division methods in actual implementation, such as multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be through some interfaces, indirect coupling or communication connection of devices or units, which can be electrical, mechanical or other forms.

[0155] The units described above as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed on multiple network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0156] The embodiments described above are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, a person skilled in the art should understand that the technical solutions described in the aforementioned embodiments may still be modified, or some of the technical features may be replaced by equivalents. Such modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present application, and should all be included in the protection scope of the present application.

Claims

1. A stripping method, characterized in that: include: Fixing workpieces with machining marks; The workpiece is torn from the edge of the workpiece along the processing trace, so that the portion from the surface of the workpiece to the processing trace undergoes elastic deformation, so as to peel off a sheet-like sub-component from the workpiece along the processing trace.

2. The stripping method according to claim 1, characterized in that: The step of tearing the workpiece from the edge of the workpiece along the processing trace so that the portion of the workpiece from the surface to the processing trace undergoes elastic deformation, so as to peel off a sheet-like sub-component from the workpiece along the processing trace, comprises: Fixing the plate to the surface of the workpiece; The plate is flipped up to cause elastic deformation of the plate, so as to flip up the surface of the workpiece from the edge of the workpiece to the portion of the processing trace along the processing trace and drive the surface of the workpiece to the portion of the processing trace to undergo elastic deformation, thereby peeling off a sheet-like sub-component from the workpiece along the processing trace.

3. The stripping method according to claim 2, characterized in that: The step of turning up the plate comprises: Lift up the plate or pull up the plate to turn over the plate.

4. The stripping method according to claim 2, characterized in that: The step of fixing the plate to the surface of the workpiece comprises: Covering the entire top surface of the workpiece with a plate; The plate is fixedly connected to the top surface.

5. The stripping method according to claim 2, characterized in that: The step of fixing the plate to the surface of the workpiece comprises: The plate is fixedly connected to the surface of the workpiece by means of a bonding material.

6. The stripping method according to claim 5, characterized in that: Both sides of the bonding material are sticky, and the debonding method of the bonding material includes thermal debonding or photodebonding; The step of fixing the plate to the surface of the workpiece by means of a bonding material comprises: bonding the first side of the bonding material to the surface of the workpiece; The plate is bonded to the second surface of the bonding material so that the plate is bonded to the workpiece through the bonding material.

7. The stripping method according to claim 5, characterized in that: The stripping method further comprises: The sheet is separated from the subcomponent by debonding.

8. The stripping method according to claim 2, characterized in that: The plate includes a glass plate, a sapphire plate, or a spring steel plate.

9. The stripping method according to claim 1, characterized in that: The method of fixing the workpiece having processing traces comprises: The bottom surface of the workpiece with processing marks is fixedly connected to the carrier.

10. The stripping method according to any one of claims 1 to 9, characterized in that: Before fixing the workpiece with processing traces, the stripping method further comprises: The workpiece is processed by laser so as to form the processing mark on the workpiece.

11. The stripping method according to any one of claims 1 to 9, characterized in that: Before fixing the workpiece with processing traces, the stripping method further comprises: The workpiece is processed by laser and then processed by ultrasonic wave, so that the workpiece forms the processing mark.

12. The stripping method according to any one of claims 1 to 11, characterized in that: The material of the workpiece is a brittle material.

13. A peeling device, characterized in that: include: A fixing unit to fix the workpiece with machining traces; The tearing unit tears the workpiece from the edge of the workpiece along the processing trace, so that the portion from the surface of the workpiece to the processing trace undergoes elastic deformation, so as to peel off a sheet-like sub-component from the workpiece along the processing trace.

14. The stripping device according to claim 13, characterized in that: The tearing unit comprises: A connecting unit, which fixes and connects the plate to the surface of the workpiece; A flipping unit flips up the plate to cause elastic deformation of the plate, so as to flip up the surface of the workpiece from the edge of the workpiece to the portion of the processing trace along the processing trace and drive the surface of the workpiece to the portion of the processing trace to undergo elastic deformation, thereby peeling off a sheet-like sub-component from the workpiece along the processing trace.

15. A processing equipment, characterized in that: The invention comprises a memory, a processor and a computer program stored in the memory and executable on the processor, wherein the processor implements the stripping method according to any one of claims 1 to 12 when executing the computer program.

16. A computer-readable storage medium, characterized in that: The computer-readable storage medium stores a computer program, and when the computer program is executed by a processor, the stripping method according to any one of claims 1 to 12 is implemented.

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