Micro-hemisphere grinding and polishing equipment

Abstract

The micro-hemisphere grinding and polishing equipment comprises a main machine frame, a horizontal sliding mechanism, a vertical sliding mechanism, a clamping mechanism and a grinding and polishing disc, the horizontal sliding mechanism is installed on the main machine frame and is in transmission connection with the vertical sliding mechanism, and the vertical sliding mechanism comprises a motor, an installation frame, a sliding rail and a threaded rod; the mounting frame is arranged on the horizontal sliding mechanism in a sliding mode, the sliding rail and the motor are arranged on the two end faces in the front-back direction of the mounting frame respectively, the clamping mechanism is arranged on the sliding rail in a sliding mode, the grinding and polishing disc is horizontally arranged on the main machine frame in a circumferential rotating mode and arranged below the clamping mechanism, and the screw is in threaded connection with a transverse plate and a supporting block. The transverse plate is supported on the supporting block and fixedly connected with the clamping mechanism, the motor drives the screw in transmission connection with the motor to rotate when started, and then the supporting block and the clamping mechanism are driven to move downwards, so that the micro hemisphere fixed to the lower end of the clamping mechanism abuts against the grinding and polishing disc. The phenomenon that a sub-damage layer is generated on the micro-hemisphere lip edge due to large grinding and polishing thrust can be avoided.

Description

Technical Field

[0001] The invention relates to the technical field of hemispherical resonant gyroscope preparation, and in particular to a micro-hemispherical grinding and polishing device. Background Art

[0002] Micro-hemisphere is a hemispherical resonant gyroscope. It is a solid wave gyroscope based on the Coriolis effect. It has the advantage of low cost and is an important direction for the development of gyroscopes in the future. Conventional micro-hemispheres are blown from flat quartz sheets. Before they become finished products for assembly, the excess skirts after molding need to be ground to remove excess mass and form a smooth, non-chipped, uniform lip edge to ensure a high quality factor Q value.

[0003] Chinese patent CN221364367U discloses a grinding and polishing device for a micro-hemispherical resonator, which can complete the grinding and polishing operations of the micro-hemispherical resonator at one time by designing a single-sided double grinding and polishing disk and using an X-axis and Z-axis double linkage mechanism; Chinese patent CN118559515B discloses a micro-hemispherical lip edge grinding and polishing method, which, based on CN221364367U, designs a rotatable clamping mechanism so that the outer circle of the bottom surface of the micro-hemispherical skirt is in point contact with the grinding disk of the grinding and polishing device to perform point grinding on the micro-hemispherical skirt, thereby avoiding the occurrence of local small edge collapse on the edge of the outermost circle as much as possible. However, practice shows that the micro-hemispherical will be subjected to the downward thrust from the Z-axis motor movement during the grinding process, which will cause a sub-damage layer to appear on the lip edge of the micro-hemispherical, which is difficult to remove in the subsequent polishing process. In addition, the vibration of the equipment will also affect the flatness of the lip edge of the micro-hemispherical and deepen the sub-damage layer. Summary of the invention

[0004] In view of the problems in the background technology, the present invention proposes a micro-hemispherical grinding and polishing device, which can avoid the phenomenon of a sub-damaged layer being generated on the lip edge of the micro-hemispherical ball due to a large grinding and polishing thrust.

[0005] The present invention adopts the following technical solutions:

[0006] A micro-hemispherical grinding and polishing device comprises a main frame, a horizontal sliding mechanism, a vertical sliding mechanism, a clamping mechanism and a grinding and polishing disc. The horizontal sliding mechanism is mounted on the main frame and is connected to the vertical sliding mechanism for driving the vertical sliding mechanism to move forward and backward. The vertical sliding mechanism comprises a first motor, a vertically arranged mounting frame, a first slide rail and a first screw. The mounting frame is slidably mounted on the horizontal sliding mechanism. The first slide rail and the first motor are respectively arranged on two end surfaces of the mounting frame in the front and rear directions. The clamping mechanism is slidably mounted on the first slide rail. The grinding and polishing disc is horizontally rotatable on the main frame and arranged below the clamping mechanism.

[0007] The first screw is threadedly connected to a cross plate and a support block. The cross plate is supported on the support block and is fixedly connected to the clamping mechanism. The first screw is transmission-connected to the first motor. When the first motor is started, it drives the first screw to rotate, and then drives the support block and the clamping mechanism to move downward, so that the micro-hemispherical ball fixed at the lower end of the clamping mechanism abuts against the grinding and polishing disk.

[0008] As a further improvement of the above technical solution:

[0009] The mounting frame includes a mounting plate and two vertical rods fixed on the mounting plate. The mounting plate is slidably mounted on a horizontal sliding mechanism. Two first slide rails are provided and correspond one to one with the two vertical rods. The first slide rails are fixed on the corresponding vertical rods. The clamping mechanism is mounted on a back plate. The back plate is slidably mounted on the first slide rails. The cross plate is fixed to the upper end of the back plate.

[0010] A vertically arranged micrometer is also fixed on the mounting plate, and the end face position of the extended end of the micrometer corresponds to the final position of the bottom surface of the horizontal plate after micro-hemispherical grinding / polishing.

[0011] The grinding and polishing disc is connected to a rotary drive mechanism, and the rotary drive mechanism is used to drive the grinding and polishing disc to rotate horizontally.

[0012] The rotary drive mechanism includes a drive motor, a belt transmission mechanism and a spindle. The spindle is rotatably mounted on the main frame through a bearing, and the grinding and polishing disc is fixed to the upper end of the spindle.

[0013] A sub-frame is provided on one side of the main frame, the driving motor is fixed on the sub-frame, the belt transmission mechanism includes a main pulley, a slave pulley and a belt, the main pulley is connected to the driving motor, the slave pulley is fixed on the main shaft, and the belt is tensioned between the main pulley and the slave pulley.

[0014] The bearing comprises an upper bearing and a lower bearing, and the upper bearing and the lower bearing are respectively arranged on both sides in the axial direction of the pulley.

[0015] The upper bearing is installed on the main frame through the upper cover plate, and the lower bearing is installed on the main frame through the lower cover plate.

[0016] A locking nut is arranged at the lower end of the main shaft.

[0017] The horizontal sliding mechanism includes a second motor, a second screw and two second slide rails. The second motor and the second slide rails are installed on the main frame. The second slide rails and the second screw are arranged in the front-to-back direction. The mounting frame is slidably mounted on the two second slide rails respectively. The second screw is transmission-connected to the second motor and is threadedly connected to the mounting frame.

[0018] Compared with the prior art, the advantages of the present invention are:

[0019] The device of the present invention installs a vertical motion driving motor on the side of the clamping mechanism, and the clamping mechanism leads out a horizontal plate which is threadedly connected to the screw of the driving motor. Compared with the structure in which the vertical motor is installed above the clamping mechanism, the thrust of the vertical motor on the micro-hemispherical ball is converted into a pulling force. A supporting block supported under the horizontal plate is further provided. During the grinding process of the micro-hemispherical ball, the upward supporting force provided by the horizontal plate offsets the pulling force of the vertical motor on the micro-hemispherical ball. Therefore, the clamping mechanism for clamping the micro-hemispherical ball for grinding and polishing is changed from vertically moving toward the base to using the deadweight of the clamping mechanism to drive the micro-hemispherical ball to move downward for grinding and polishing. Therefore, the micro-hemispherical ball will not be subjected to the downward thrust of about 50-200 kg brought by the movement of the vertical motor, and the movement caused by its own weight is only 2-3 kg. The force is more uniform, thus avoiding the phenomenon of sub-damage layer on the lip edge of the micro-hemispherical ball due to large thrust. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to make the present invention more easily understood, the present invention will be described in more detail by referring to the specific embodiments shown in the accompanying drawings. These drawings only depict typical embodiments of the present invention and should not be considered as limiting the scope of protection of the present invention.

[0021] Figure 1 It is a schematic diagram of the three-dimensional structure of the micro-hemispherical grinding and polishing equipment according to an embodiment of the present invention.

[0022] Figure 2 It is a schematic diagram of the three-dimensional structure of the micro-hemispherical grinding and polishing device from another perspective according to an embodiment of the present invention.

[0023] Figure 3 It is a schematic diagram of the cross-sectional structure of a micro-hemispherical grinding and polishing device according to an embodiment of the present invention.

[0024] Figure 4 It is a schematic cross-sectional structure diagram of the rotary drive mechanism in an embodiment of the present invention.

[0025] Figure 5 It is a schematic diagram of the exploded structure of the rotary drive mechanism in an embodiment of the present invention.

[0026] Reference numerals:

[0027] 1. Clamping mechanism; 11. Back plate; 12. Support block; 13. Cross plate; 2. Water retaining ring; 3. Rotary drive mechanism; 31. Drive motor; 32. Main shaft; 33. Upper bearing; 34. Upper cover plate; 35. Slave pulley; 36. Lower cover plate; 37. Locking nut; 38. Belt; 39. Lower bearing; 40. Main pulley; 4. Grinding and polishing disc; 5. Main frame; 6. Base; 7. Horizontal sliding mechanism; 71. Second motor; 72. Second screw; 73. Second slide rail; 8. Vertical sliding mechanism; 81. First motor; 82. First screw; 83. First slide rail; 84. Mounting plate; 85. Vertical rod; 86. Support plate; 9. Micrometer; 10. Sub-frame. DETAILED DESCRIPTION

[0028] The following describes the implementation modes of the present invention with reference to the accompanying drawings so that those skilled in the art can better understand the present invention and implement it. However, the enumerated embodiments are not intended to limit the present invention. In the absence of conflict, the following embodiments and the technical features in the embodiments may be combined with each other, wherein the same components are represented by the same figure marks.

[0029] like Figure 1-Figure 3 As shown, this embodiment provides a micro-hemispherical grinding and polishing device, including a main frame 5, a horizontal sliding mechanism 7, a vertical sliding mechanism 8, a clamping mechanism 1 and a grinding and polishing disc 4. The horizontal sliding mechanism 7 is installed on the main frame 5 and is connected to the vertical sliding mechanism 8 for driving the vertical sliding mechanism 8 to move forward and backward. The vertical sliding mechanism 8 includes a first motor 81, a vertically arranged mounting frame, a first slide rail 83 and a first screw 82. The mounting frame is slidably mounted on the horizontal sliding mechanism 7, the first slide rail 83 and the first motor 81 are respectively arranged on the two end surfaces of the mounting frame in the front and rear directions, the clamping mechanism 1 is slidably mounted on the first slide rail 83, and the grinding and polishing disc 4 is horizontally rotatable on the main frame 5 and arranged below the clamping mechanism 1.

[0030] The first screw 82 is threadedly connected to the cross plate 13 and the support block 12. The cross plate 13 is supported on the support block 12 and is fixedly connected to the clamping mechanism 1. The first screw 82 is transmission-connected to the first motor 81. When the first motor 81 is started, it drives the first screw 82 to rotate, and then drives the support block 12 and the clamping mechanism 1 to move downward, so that the micro-hemispherical ball fixed at the lower end of the clamping mechanism 1 abuts against the grinding and polishing disk 4.

[0031] Therefore, this equipment installs the vertical motion driving motor on the side of the clamping mechanism, and the clamping mechanism leads out a horizontal plate which is threadedly connected to the screw of the driving motor. Compared with the structure in which the vertical motor is installed above the clamping mechanism, the thrust of the vertical motor on the micro-hemispherical ball is changed into a pulling force, and a supporting block supported under the horizontal plate is added. During the micro-hemispherical ball grinding process, the upward supporting force provided by the horizontal plate offsets the pulling force of the vertical motor on the micro-hemispherical ball. Therefore, the clamping mechanism for clamping the micro-hemispherical ball for grinding and polishing is changed from vertical movement toward the base to using the deadweight of the clamping mechanism to drive the micro-hemispherical ball to move downward for grinding and polishing. Therefore, the micro-hemispherical ball will not be subjected to the downward thrust of about 50-200 kg brought by the vertical motor movement, and the movement caused by its own weight is only 2-3 kg, with more uniform force, thus avoiding the phenomenon of sub-damage layer on the lip edge of the micro-hemispherical ball due to large thrust.

[0032] In this embodiment, the mounting frame includes a mounting plate 84 and two vertical rods 85 fixed on the mounting plate 84. The mounting plate 84 is slidably mounted on the horizontal sliding mechanism 7. Two first slide rails 83 are provided and correspond one to one with the two vertical rods 85. The first slide rails 83 are fixed on the corresponding vertical rods 85. The clamping mechanism 1 is installed on a back plate 11. The back plate 11 is slidably mounted on the first slide rails 83. The cross plate 13 is fixed to the upper end of the back plate 11.

[0033] In this embodiment, a vertically arranged micrometer 9 is also fixed on the mounting plate 84, and the end surface position of the extended end of the micrometer 9 corresponds to the final position of the bottom surface of the horizontal plate 13 after micro-hemispherical grinding / polishing.

[0034] The setting of the micrometer can stop the continued downward movement of the clamping mechanism without stopping the machine after the micro-hemispherical ball is ground into place due to the failure of the sensing device, so as to avoid the scrapping of the micro-hemispherical ball due to over-grinding.

[0035] In this embodiment, the grinding and polishing disc 4 is connected to a rotary drive mechanism 3, and the rotary drive mechanism 3 is used to drive the grinding and polishing disc 4 to rotate horizontally.

[0036] In this embodiment, Figure 4 and Figure 5 As shown, the rotary drive mechanism 3 includes a drive motor 31, a belt transmission mechanism and a main shaft 32. The main shaft 32 is rotatably mounted on the main frame 5 through a bearing, and the grinding and polishing disc 4 is fixed to the upper end of the main shaft 32.

[0037] A sub-frame 10 is provided on one side of the main frame 5, and the driving motor 31 is fixed on the sub-frame 10. The belt transmission mechanism includes a main pulley 40, a slave pulley 35 and a belt 38. The main pulley 40 is connected to the driving motor 31 by transmission, and the slave pulley 35 is fixed on the main shaft 32, and the belt 38 is tensioned between the main pulley 40 and the slave pulley 35.

[0038] Therefore, the motor that drives the grinding wheel to rotate is separated from the integrated design and fixed separately on the base of the equipment, so that the vibration generated by the motor is isolated from the grinding and polishing body of the micro-hemispherical ball, so that the micro-hemispherical ball is protected from the influence of the motor vibration, further reducing the formation of the sub-damage layer on the lip edge surface of the micro-hemispherical ball and improving its surface smoothness.

[0039] In this embodiment, the bearing includes an upper bearing 33 and a lower bearing 39 , and the upper bearing 33 and the lower bearing 39 are respectively arranged on both sides of the pulley 35 in the axial direction.

[0040] In this embodiment, the upper bearing 33 is mounted on the main frame 5 through the upper cover plate 34 , and the lower bearing 39 is mounted on the main frame 5 through the lower cover plate 36 .

[0041] In this embodiment, a locking nut 37 is provided at the lower end of the main shaft 32 .

[0042] In this embodiment, the horizontal sliding mechanism 7 includes a second motor 71, a second screw 72 and two second slide rails 73. The second motor 71 and the second slide rails 73 are installed on the main frame 5. The second slide rails 73 and the second screw 72 are arranged in the front-to-back direction. Support plates 86 are provided at both ends of the mounting frame in the left and right directions. The two support plates 86 are respectively slidably mounted on the two second slide rails 73. The second screw 72 is transmission-connected to the second motor 71 and is threadedly connected to the mounting frame.

[0043] The process of using this equipment to achieve micro-hemispherical grinding and polishing is as follows:

[0044] Step 1: Fix the main frame 5 and the auxiliary frame 10 on the base 6, install the horizontal sliding mechanism 7 on the main frame 5, and then install the assembled vertical sliding mechanism 8 on the slide rail of the horizontal sliding mechanism 7. Finally, install the clamping mechanism 1 on the slide rail of the vertical sliding mechanism 8 through its back plate 11. The cross plate 13 and the support block 12 are connected to the motor of the vertical sliding mechanism 8 by thread, and the cross plate 13 is fixedly connected to the back plate 11 to form the basic grinding and polishing equipment body. In order to enhance the structural stability of the equipment, an inclined support frame 15 is added between the longitudinal and transverse beams of the main frame 5, and between the two support plates 86 and the mounting plate 84 of the mounting frame, wherein a rubber gasket is added between the inclined support frame 15 and the support plate 86 to increase elastic friction, increase structural stability and reduce vibration at the same time;

[0045] Step 2: Fix the bonded micro-hemisphere on the clamping mechanism 1;

[0046] Step 3: Install or check the grinding and polishing mechanism. Fix the water retaining ring 2, the upper cover plate 34, and the lower cover plate 36 to the main frame 5 by screws, wherein a circle of water-absorbing sponge can be added to the circumferential edge of the water retaining ring 2 to absorb the grinding and polishing waste such as quartz generated during the grinding and polishing process, and at the same time avoid splashing water. After that, the upper bearing 33 limited on the upper cover plate 34 is installed on the main shaft 32, and is fixed by interference connection and shoulder limit. Then the grinding and polishing disc 4 is fixed to the upper end of the main shaft 32 and fixed by screws. The grinding and polishing disc 4 is located in the space enclosed by the water retaining ring 2. The pulley 35 is fixed to the main shaft 32 by screws, and is connected to the main pulley 40 on the drive motor 31 by a belt 38. Then the lower bearing 33 on the lower cover plate 36 is connected to the connecting shaft 32, and is locked with a locking nut 37 to minimize the unevenness when the grinding wheel rotates. Finally, the locking nut 37 and the spindle 32 are further locked with screws to ensure that the grinding wheel dressing mechanism can operate normally in both forward and reverse rotations without loosening.

[0047] Among them, a certain gap is maintained between the pulley 35 and the upper cover plate 34 and the lower cover plate 36, and a screw-fastened structure is used to adjust the belt transmission mechanism. That is, after the transmission mechanism has been running for a certain period of time, when shaking occurs and the vibration of the grinding wheel is aggravated, the influence of transmission wear can be eliminated by adjusting the fixed position of the pulley 35 and the main shaft 32.

[0048] The upper cover plate 34 and the lower cover plate 36 are installed in a back-to-back manner so that the bearing can be installed more firmly and the grinding and polishing mechanism can run more smoothly.

[0049] Step 4: Use a diamond grinding wheel to roughly grind the lip edge of the micro-hemispherical ball to remove excess lip edge; since the present device adds a support block 12 to the vertical motor (i.e., the first motor 81), the support block 12 is threadedly connected to the lead screw of the first motor 81, and is used to support the overall structure of the clamping mechanism 1 and the back plate 9 to move downward by its own weight, the micro-hemispherical ball will not be subjected to the downward thrust brought by the movement of the vertical motor, thereby avoiding the phenomenon of a sub-damage layer on the lip edge of the micro-hemispherical ball due to a large thrust. The support block 12 is only positioned at the edge with the cross plate by a sunken step (that is, the two are not fixedly connected), which can ensure that during the micro-hemispherical grinding process, when the cross plate does not contact the micro-micrometer 9, the overall structure of the clamping mechanism 1 and the back plate 9 is supported and moved by the support block 12. Once it contacts the probe of the micro-micrometer 9 (the extension size of the probe is determined by the calculated grinding amount), the micro-micrometer 9 replaces the support block 12 for support. At this time, the support block 12 continues to move downward with the screw, while the overall structure of the clamping mechanism 1 and the back plate 9 is stopped by the micrometer stop, ensuring that the grinding amount of the micro-hemispherical lip edge can still be controlled when the sensing device fails.

[0050] The simultaneous vertical and horizontal motor-linked grinding method expands the grinding method of the micro-hemispherical grinding wheel from grinding only on a specific ring to grinding on the entire grinding wheel surface, thereby improving the grinding efficiency and extending the service life of the grinding wheel; and ensuring the flatness and consistency of the grinding wheel during use, making the contact stress of the micro-hemispherical lip edge more uniform, and effectively reducing edge collapse and sub-damage layers.

[0051] The embodiments described above are only preferred specific implementations of the present invention. This specification uses the phrases "in one embodiment", "in another embodiment", "in yet another embodiment" or "in other embodiments" to refer to one or more of the same or different embodiments according to the present disclosure. Common changes and substitutions made by those skilled in the art within the scope of the technical solution of the present invention should be included in the protection scope of the present invention.

Claims

1. A micro-hemispherical grinding and polishing device, characterized in that: The invention comprises a main frame (5), a horizontal sliding mechanism (7), a vertical sliding mechanism (8), a clamping mechanism (1) and a grinding and polishing disc (4); the horizontal sliding mechanism (7) is mounted on the main frame (5) and is transmission-connected with the vertical sliding mechanism (8) for driving the vertical sliding mechanism (8) to move forward and backward; the vertical sliding mechanism (8) comprises a first motor (81), a vertically arranged mounting frame, a first slide rail (83) and a first screw rod (82); the mounting frame is slidably mounted on the horizontal sliding mechanism (7); the first slide rail (83) and the first motor (81) are respectively arranged on two end surfaces of the mounting frame in the front and rear directions; the clamping mechanism (1) is slidably mounted on the first slide rail (83); the grinding and polishing disc (4) is horizontally rotatably arranged on the main frame (5) and is arranged below the clamping mechanism (1); The first screw rod (82) is threadedly connected to a transverse plate (13) and a support block (12); the transverse plate (13) is supported on the support block (12) and is fixedly connected to the clamping mechanism (1); the first screw rod (82) is transmission-connected to a first motor (81); when the first motor (81) is started, the first screw rod (82) is driven to rotate, thereby driving the support block (12) and the clamping mechanism (1) to move downward, so that the micro-hemispherical ball fixed at the lower end of the clamping mechanism (1) abuts against the grinding and polishing disc (4).

2. The micro-hemispherical grinding and polishing equipment according to claim 1, characterized in that: The mounting frame comprises a mounting plate (84) and two vertical rods (85) fixed on the mounting plate (84); the mounting plate (84) is slidably mounted on the horizontal sliding mechanism (7); two first slide rails (83) are provided and correspond one to one with the two vertical rods (85); the first slide rails (83) are fixed on the corresponding vertical rods (85); the clamping mechanism (1) is mounted on a back plate (11); the back plate (11) is slidably mounted on the first slide rails (83); and the cross plate (13) is fixed on the upper end of the back plate (11).

3. The micro-hemispherical grinding and polishing equipment according to claim 2, characterized in that: A vertically arranged micrometer (9) is also fixed on the mounting plate (84), and the end surface position of the extended end of the micrometer (9) corresponds to the final position of the bottom surface of the horizontal plate (13) after micro-hemispherical grinding / polishing.

4. The micro-hemispherical grinding and polishing device according to any one of claims 1 to 3, characterized in that: The grinding and polishing disc (4) is connected to a rotary drive mechanism (3) in a transmission manner. The rotary drive mechanism (3) is used to drive the grinding and polishing disc (4) to rotate horizontally.

5. The micro-hemispherical grinding and polishing device according to claim 4, characterized in that: The rotary drive mechanism (3) comprises a drive motor (31), a belt transmission mechanism and a main shaft (32). The main shaft (32) is rotatably mounted on a main frame (5) via a bearing. The grinding and polishing disc (4) is fixed to the upper end of the main shaft (32). A sub-frame (10) is provided on one side of the main frame (5), a driving motor (31) is fixed on the sub-frame (10), a belt transmission mechanism comprises a main pulley (40), a slave pulley (35) and a belt (38), the main pulley (40) is connected to the driving motor (31) by transmission, the slave pulley (35) is fixed on the main shaft (32), and the belt (38) is tensioned between the main pulley (40) and the slave pulley (35).

6. The micro-hemispherical grinding and polishing device according to claim 5, characterized in that: The bearing comprises an upper bearing (33) and a lower bearing (39), and the upper bearing (33) and the lower bearing (39) are respectively arranged on both sides in the axial direction of the pulley (35).

7. The micro-hemispherical grinding and polishing device according to claim 6, characterized in that: The upper bearing (33) is mounted on the main frame (5) through an upper cover plate (34), and the lower bearing (39) is mounted on the main frame (5) through a lower cover plate (36).

8. The micro-hemispherical grinding and polishing device according to any one of claims 5 to 7, characterized in that: A locking nut (37) is provided at the lower end of the main shaft (32).

9. The micro-hemispherical grinding and polishing device according to any one of claims 1 to 3, characterized in that: The horizontal sliding mechanism (7) comprises a second motor (71), a second screw rod (72) and two second slide rails (73); the second motor (71) and the second slide rails (73) are mounted on the main frame (5); the second slide rails (73) and the second screw rod (72) are arranged along the front-back direction; the mounting frame is slidably mounted on the two second slide rails (73); the second screw rod (72) is transmission-connected to the second motor (71) and is threadedly connected to the mounting frame.

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