Semiconductor wafer and special cutting tool thereof

Abstract

The invention discloses a semiconductor wafer and a special cutting tool thereof, and relates to the technical field of wafer cutting, the semiconductor wafer comprises a wafer cutting machine of a rectangular frame structure, and the outer wall of one side of the wafer cutting machine is fixedly connected with a main shaft clamp used for firmly fixing the wafer through a vacuum adsorption function; a wafer fixing table used for positioning the main shaft clamp to ensure that a wafer cannot move in the cutting process is connected to the lower portion of the main shaft clamp in a clamped mode, a cutting piece used for cutting the wafer is arranged above the main shaft clamp, and a protective sleeve shell used for being responsible for supporting the cutting piece is fixedly connected to the outer portion of the cutting piece. A prefabricated mark cutting mechanism is arranged on the outer wall of one side of the cutting blade, an adsorption separation mechanism is arranged on one side of the tail end of the main shaft clamp, and a friction foam mechanism is arranged on the other side of the tail end of the main shaft clamp. The shape track comprises a plurality of curves and cross points, the cutting action can be refined, and cutting errors caused by deviation of the cutting blade are reduced.

Description

Technical Field

[0001] The invention relates to the technical field of wafer cutting, and in particular to a semiconductor wafer and a special cutting tool thereof. Background Art

[0002] Conductor wafer dicing is a crucial step in the semiconductor manufacturing process, involving the precise dicing of silicon wafers or other types of semiconductor materials into small pieces, also known as "wafer chips", for subsequent packaging, testing and integrated circuit production. This process plays a decisive role in the performance and yield of semiconductor components. With the continuous development of electronic technology, the requirements for semiconductor chips are getting higher and higher, especially in terms of chip size, precision and processing speed, which has led to the continuous optimization and innovation of wafer dicing technology.

[0003] Semiconductor wafers are usually round slices cut from silicon rods, usually with a diameter of 200 mm or 300 mm. Since the material of the wafer is relatively fragile and extremely thin, the cutting process places extremely strict requirements on the accuracy, stability and tools of the equipment. During the cutting process, any physical damage to the wafer must be avoided, so high-precision cutting tools such as diamond wire cutting machines, laser cutting machines and water jet cutting machines are used. Diamond tools are widely used in the cutting of semiconductor wafers due to their extremely high hardness and wear resistance, which can ensure accurate cutting and reduce material loss during processing; There are still the following defects in specific use: 1. In the traditional straight-line cutting process, due to the relative movement between the cutter and the wafer surface, serrated cutting marks are easily generated. These cutting marks may cause microcracks on the wafer surface, especially in the film layer, device area or the edge of the wafer. Microcracks may cause material failure or device malfunction, seriously affecting the product yield. When the edge roughness of the wafer is high, it may affect the subsequent packaging process. Especially in the semiconductor packaging process, the rough edges may make it difficult for the packaging material to adhere evenly, thereby affecting the strength, reliability and heat dissipation performance of the overall package.

[0004] 2. Wafer warping will cause the wafer to be unstable during subsequent processing, affecting the cutting accuracy. The unevenness of the wafer surface may cause the cutter's tool to not maintain uniform contact with the wafer surface during the cutting process, resulting in cutting errors, and even poor cutting quality and unnecessary defects. In addition, the wafer generates thermal stress due to uneven thermal expansion, which may cause cracks or fractures on the wafer surface, especially on thinner wafers. Wafer fractures caused by thermal stress will not only cause direct material losses, but may also cause the entire batch to be scrapped, resulting in significant production cost losses.

[0005] In view of this, the present invention proposes a semiconductor wafer and a dedicated cutting tool thereof to make up for and improve the deficiencies of the prior art. Summary of the invention

[0006] In order to solve the above technical problems, the present invention provides a semiconductor wafer and a special cutting tool thereof to solve the technical problems raised in the above background technology.

[0007] To achieve the above purpose, the technical solution adopted by the present invention is: a semiconductor wafer and a special cutting tool thereof, comprising a wafer cutting machine with a rectangular frame structure, a spindle fixture for firmly fixing the wafer through a vacuum adsorption function is fixedly connected to an outer wall on one side of the wafer cutting machine, a wafer fixing table for positioning the spindle fixture to ensure that the wafer does not move during the cutting process is clamped below the spindle fixture, a cutting blade for cutting the wafer is arranged above the spindle fixture, a protective cover shell for supporting the cutting blade is fixedly connected to the outside of the cutting blade, a prefabricated scoring mechanism is arranged on an outer wall on one side of the cutting blade, an adsorption separation mechanism is arranged on one side of the tail end of the spindle fixture, and a friction foam mechanism is arranged on the other side of the tail end of the spindle fixture; The pre-scratching mechanism is used to pre-form a tiny, regular crack or scratch path on the wafer surface by engraving an arc track; The adsorption and separation mechanism is used to accurately adhere the cut chips to prevent them from falling off or sticking to the wafer; The friction foam mechanism is used to dissipate heat by friction to adjust the heat distribution on the surface of the wafer and reduce cutting defects caused by local overheating.

[0008] Furthermore, the prefabricated scoring mechanism includes an external block fixedly connected to the outer wall of one side of the cutting blade, the lower surface of the external block on a side away from the cutting blade is rotatably connected to a long rod, the center of one end of the long rod away from the external block is rotatably connected to a bottom rod, the lower surface of one end of the bottom rod away from the long rod is fixedly connected to a universal ball, the upper surface of the bottom rod on a side away from the universal ball is rotatably connected to a double-headed rod, the upper surface of the double-headed rod on a side away from the universal ball is rotatably connected to an upper rod, the upper surface of one end of the upper rod away from the double-headed rod is fixedly connected to a support block, the upper surface of one end of the double-headed rod away from the universal ball is rotatably connected to an inclined rod, the upper surface of one end of the inclined rod away from the double-headed rod is fixedly connected to a cross block, and the lower end of the universal ball is rotatably connected to a carving ball.

[0009] Furthermore, the double-headed rod is V-shaped, the upper rod is rotatably connected to the intersection of the double-headed rod, and one end of the support block away from the upper rod is fixedly connected to the outer surface of one side of the cutting blade.

[0010] Furthermore, one end of the cross block away from the inclined rod is fixedly connected to the outer surface of one side of the cutting piece, the bottom end of the engraving ball is initially positioned against the outer wall of the spindle fixture, and a reduction motor is disposed inside the end of the cross block close to the inclined rod.

[0011] Further, the adsorption and separation mechanism includes an external rod fixedly connected to the outer wall of one side of the wafer cutting machine, the outer wall of one end of the external rod away from the wafer cutting machine passes through and is fixedly connected with an insert block, the inner wall of one end of the insert block away from the external rod is rotatably connected with a convex rod, a fixed shaft is fixedly connected at the center of one side of the convex rod, a rotating shaft is rotatably connected at one side of the convex rod, a sleeve shaft is fixedly connected at the center of one end of the rotating shaft away from the convex rod, a connecting shaft is sleeved on the outer wall of one end of the sleeve shaft away from the rotating shaft, a supporting shaft is fixedly connected to the outer wall of one end of the connecting shaft away from the sleeve shaft, a transverse bevel gear is fixedly connected to the outer wall of one end of the support shaft away from the connecting shaft, a longitudinal bevel gear is provided on one outer wall of one side of the transverse bevel gear, an eccentric shaft is eccentrically fixedly connected to one end of the longitudinal bevel gear away from the transverse bevel gear, a clamping block is fixedly connected to one end of the eccentric shaft away from the longitudinal bevel gear, a cavity plate is provided on the outside of the clamping block, springs are fixedly connected on both sides of the inner wall of the cavity plate, and a plurality of suction cups are evenly fixedly connected to the outer wall of one side of the rotating shaft close to the spindle clamp.

[0012] Furthermore, one end of the transverse bevel gear close to the supporting shaft passes through the upper surface of the insert block, the transverse bevel gear and the longitudinal bevel gear mesh with each other to form a meshing transmission, and the clamping block is slidably connected to the inside of the cavity plate.

[0013] Furthermore, the lower end of the cavity plate is fixedly connected to one side of the upper surface of the plug block, and the initial positions of the plurality of suction cups are in contact with the outer wall of the tail end of the spindle clamp. The movement direction of the clamping block is perpendicular to the rotation axis of the long rod, that is, the horizontal movement of the clamping block is orthogonal to the rotational movement of the long rod.

[0014] Furthermore, the friction foam mechanism includes a transmission belt which is transmission-connected to the outer wall of one side of the longitudinal bevel gear, the transmission belt is fixedly connected to a long plate at one end away from the longitudinal bevel gear, the transmission belt is rotatably connected to a crank at one side away from the long plate, the crank is fixedly connected to a connecting rod at the outer wall of one end away from the transmission belt, the connecting rod is rotatably connected to a short rod at the outer wall of one end away from the crank, the short rod is fixedly connected to a buckle at the outer wall of one end away from the connecting rod, the buckle is rotatably connected to a friction blade at the inner wall of one end away from the short rod, a friction disk is arranged below the friction blade, and the outer plate is fixedly connected to the outer center wall of one side of the friction disk.

[0015] Furthermore, the bottom end of the friction blade is arc-shaped and covered with sandpaper. The initial position of the upper outer wall of the friction disk is in contact with the bottom end of the friction blade. The initial position of the right outer wall of the friction disk is in conflict with the tail outer wall of the spindle clamp. The friction disk is rotatably connected to the top outer wall of the outer plate, and the end of the outer plate away from the outer plate is fixedly connected to the inner surface of the wafer cutting machine.

[0016] Furthermore, the semiconductor wafer is made of silicon (Si) wafer.

[0017] Compared with the prior art, the present invention has the following beneficial effects: (1) The "&"-shaped trajectory of the present invention includes multiple curves and intersections, which can refine the cutting action and reduce the cutting error caused by the deviation of the cutting blade; the curve and intersection design of the cutting trajectory can disperse the mechanical stress, avoid cracks or breakage of the wafer due to stress concentration during the cutting process, improve the overall integrity of the wafer, and reduce losses; the trajectory of the scoring ball can pre-disperse the cutting stress on the wafer surface and reduce the stress concentration on a single cutting point; when the scoring ball rolls on the wafer surface, it can destroy the bubbles in the surface coolant and remove the tiny residues at the cutting position, optimize the contact quality between the blade and the wafer, and improve the cutting effect; the pre-treatment action of the scoring ball can improve the roughness of the wafer surface and provide a more stable working base for the cutting blade; the scoring action can fine-tune the wafer surface before cutting begins, reducing the sudden breakage caused by the brittle material characteristics during the cutting process; (2) The adhesion action of the suction cup of the present invention can effectively solve the chip adhesion problem caused by static electricity or surface tension; the chip can be adsorbed in time after cutting is completed to avoid chip falling off or damage caused by gravity or vibration; the flipping function of the suction cup can adjust the chip to the required direction, providing convenience for subsequent processes; the suction cup is made of soft material and the adsorption force is adjustable to avoid scratches or damage to the chip surface; the chip adhesion problem caused by static electricity and bubbles can be overcome through the precise action of the suction cup; the adsorption and separation mechanism of the suction cup can quickly remove the chip to prevent debris, coolant and other residues from contaminating the chip surface; (3) When the friction disk of the present invention rotates, it rubs against the tail end of the wafer to diffuse or eliminate the locally accumulated heat, thereby maintaining the overall temperature of the wafer uniform. The contact action of the friction disk can destroy the bubbles in the coolant caused by stirring or vibration, ensuring that the coolant is in full contact with the wafer and the cutting blade, thereby improving the cooling efficiency. The friction action reduces the heat fluctuation and unstable factors at the tail end of the wafer, making the thickness and flatness of the wafer more uniform, enhancing the cutting accuracy, improving the smoothness of the cutting edge, and reducing microcracks or breakage. The friction disk removes bubbles and heat accumulation, so that the coolant can more effectively protect the cutting blade, reduce the wear of the blade caused by high temperature or dry friction, reduce the frequency of blade replacement, and save costs. The action of the friction disk can disperse the residual bubbles and liquid on the surface of the wafer, thereby preventing the contaminants carried by the bubbles in the cutting liquid from adhering to the surface of the wafer. The friction disk can polish the tail end of the wafer to a certain extent, thereby reducing the surface roughness after cutting. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a schematic diagram of the main stereoscopic structure of the present invention; Figure 2 It is a schematic diagram of a partial three-dimensional structure of the prefabricated scoring and cutting mechanism of the present invention; Figure 3 It is a partial three-dimensional structural schematic diagram of the position relationship between the long rod and the bottom rod of the present invention; Figure 4 It is a partial three-dimensional structural schematic diagram depicting the position relationship between the ball and the spindle fixture of the present invention; Figure 5 It is a partial three-dimensional structural schematic diagram of the position relationship between the long rod and the clamping block of the present invention; Figure 6 It is a partial three-dimensional structural schematic diagram of the positional relationship between the transverse bevel gear and the longitudinal bevel gear of the present invention; Figure 7 It is a partial three-dimensional structural schematic diagram of the position relationship between the transmission belt and the crank of the present invention; Figure 8 It is a partial three-dimensional structural schematic diagram of the position relationship between the friction blade and the friction disk of the present invention.

[0019] The numbers in the figure are: 1. Wafer cutting machine; 11. Spindle fixture; 12. Wafer fixing table; 13. Cutting disc; 14. Protective shell; 2. Pre-marking mechanism; 21. External block; 22. Long rod; 23. Bottom rod; 24. Universal ball; 25. Double-headed rod; 26. Upper rod; 27. Support block; 28. Oblique rod; 29. ​​Cross block; 210. Carved ball; 3. Adsorption and separation mechanism; 31. External rod; 32. Insert block; 33. Protruding rod; 34. Fixed shaft; 35. Rotating shaft; 36. Sleeve shaft; 37. Connecting shaft; 38. Support shaft; 39. Transverse bevel gear; 310. Longitudinal bevel gear; 311. Eccentric shaft; 312. Block; 313. Cavity plate; 314. Spring; 315. Suction cup; 4. Friction foam mechanism; 41. Transmission belt; 42. Long plate; 43. Crank; 44. Connecting rod; 45. Short rod; 46. Buckle; 47. Friction scriber; 48. Friction disc; 49. Outer plate. DETAILED DESCRIPTION

[0020] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention; Embodiments of the present invention A semiconductor wafer and a special cutting tool thereof, reference Figure 1 As shown, it includes a wafer cutting machine 1 with a rectangular frame structure, a spindle fixture 11 for firmly fixing the wafer through a vacuum adsorption function is fixedly connected to an outer wall of one side of the wafer cutting machine 1, a wafer fixing table 12 for positioning the spindle fixture 11 to ensure that the wafer does not move during the cutting process is clamped below the spindle fixture 11, a cutting blade 13 for cutting the wafer is arranged above the spindle fixture 11, and a protective cover 14 for supporting the cutting blade 13 is fixedly connected to the outside of the cutting blade 13; In view of the above-mentioned semiconductor wafer and its dedicated cutting tool, the specific implementation is as follows: A pre-marking mechanism 2 is provided on one side outer wall of the cutting blade 13, an adsorption separation mechanism 3 is provided on one side of the tail end of the spindle fixture 11, and a friction foam mechanism 4 is provided on the other side of the tail end of the spindle fixture 11; refer to Figure 2 As shown, the pre-scratching mechanism 2 is used to pre-form a tiny, regular crack or scratch path on the wafer surface by engraving an arc track; refer to Figure 3 As shown, the prefabricated scoring mechanism 2 includes an external block 21 fixedly connected to the outer wall of one side of the cutting blade 13, a long rod 22 is rotatably connected to the lower surface of the external block 21 on a side away from the cutting blade 13, a bottom rod 23 is rotatably connected to the center of one end of the long rod 22 away from the external block 21, a universal ball 24 is fixedly connected to the lower surface of the end of the bottom rod 23 away from the long rod 22, a double-headed rod 25 is rotatably connected to the upper surface of the side of the bottom rod 23 away from the universal ball 24, an upper rod 26 is rotatably connected to the upper surface of the side of the double-headed rod 25 away from the universal ball 24, a support block 27 is fixedly connected to the upper surface of one end of the upper rod 26 away from the double-headed rod 25, an inclined rod 28 is rotatably connected to the upper surface of one end of the double-headed rod 25 away from the universal ball 24, a cross block 29 is fixedly connected to the upper surface of one end of the inclined rod 28 away from the double-headed rod 25, and a depiction ball 210 is rotatably connected to the lower end of the universal ball 24; refer to Figure 3 As shown, the double-headed rod 25 is V-shaped, the upper rod 26 is rotatably connected to the intersection of the double-headed rod 25, and one end of the support block 27 away from the upper rod 26 is fixedly connected to the outer surface of one side of the cutting blade 13; refer to Figure 4 As shown, one end of the cross block 29 away from the inclined rod 28 is fixedly connected to the outer surface of one side of the cutting blade 13, the bottom end of the engraving ball 210 is initially attached to the outer wall of the spindle fixture 11, and a reduction motor is arranged inside the end of the cross block 29 close to the inclined rod 28; Summary 1: Compared with the jagged edges or edge roughness caused by conventional straight-line cutting in the prior art, the "&"-shaped trajectory of the present invention includes multiple curves and intersections, which can refine the cutting action and reduce the cutting error caused by the deviation of the cutting blade 13; the curve and intersection design of the cutting trajectory can disperse the mechanical stress, avoid cracks or breakage of the wafer due to stress concentration during the cutting process, improve the overall integrity of the wafer, and reduce losses; the trajectory of the scoring ball 210 can disperse the cutting stress on the wafer surface in advance, reduce the stress concentration on a single cutting point; when the scoring ball 210 rolls on the wafer surface, it can destroy the bubbles in the surface coolant, and at the same time remove the tiny residues at the cutting position, optimize the contact quality between the blade and the wafer, and improve the cutting effect; the pretreatment action of the scoring ball 210 can improve the roughness of the wafer surface and provide a more stable working base for the cutting blade; the scoring action can fine-tune the wafer surface before cutting begins, and reduce sudden breakage caused by the brittle material characteristics during cutting.

[0021] refer to Figure 5 As shown, the adsorption and separation mechanism 3 is used to accurately adhere the cut chips to prevent them from falling off or sticking to the wafer; refer to Figure 5As shown, the adsorption and separation mechanism 3 includes an external rod 31 fixedly connected to the outer wall of one side of the wafer cutting machine 1, an outer wall of the end of the external rod 31 away from the wafer cutting machine 1 penetrates and is fixedly connected with an insert block 32, an inner wall of the end of the insert block 32 away from the external rod 31 is rotatably connected with a convex rod 33, a fixed shaft 34 is fixedly connected at the center of one side of the convex rod 33, a rotating shaft 35 is rotatably connected at an eccentric point of one side of the convex rod 33, a sleeve shaft 36 is fixedly connected at the center of one end of the rotating shaft 35 away from the convex rod 33, a connecting shaft 37 is sleeved on the outer wall of one end of the sleeve shaft 36 away from the rotating shaft 35, and the outer wall of the end of the connecting shaft 37 away from the sleeve shaft 36 is fixed A support shaft 38 is fixedly connected, and a transverse bevel gear 39 is fixedly connected to the outer wall of one end of the support shaft 38 away from the connecting shaft 37, and a longitudinal bevel gear 310 is arranged on the outer wall of one side of the transverse bevel gear 39, and an eccentric shaft 311 is eccentrically fixedly connected to the end of the longitudinal bevel gear 310 away from the transverse bevel gear 39, and a clamping block 312 is fixedly connected to the end of the eccentric shaft 311 away from the longitudinal bevel gear 310, and a cavity plate 313 is arranged outside the clamping block 312, and springs 314 are fixedly connected to both sides of the inner wall of the cavity plate 313, and a plurality of suction cups 315 are evenly fixedly connected to the outer wall of one side of the rotating shaft 35 close to the spindle clamp 11; refer to Figure 6 As shown, one end of the transverse bevel gear 39 close to the support shaft 38 penetrates the upper surface of the insert block 32, the transverse bevel gear 39 and the longitudinal bevel gear 310 mesh with each other and form a meshing transmission, and the clamping block 312 is slidably connected to the inside of the cavity plate 313; refer to Figure 6 As shown, the lower end of the cavity plate 313 is fixedly connected to one side of the upper surface of the insert block 32, and the initial positions of the plurality of suction cups 315 are all against the outer wall of the tail end of the spindle fixture 11, and the movement direction of the clamping block 312 is perpendicular to the rotation axis of the long rod 22, that is, the horizontal movement of the clamping block 312 is orthogonal to the rotation movement of the long rod 22; Summary 2: Compared with the manual separation requirements of the prior art, the adhesion action of the suction cup 315 of the present invention can effectively solve the chip adhesion problem caused by static electricity or surface tension; the chip can be adsorbed in time after cutting is completed to avoid chip falling off or damage due to gravity or vibration; the flipping function of the suction cup 315 can adjust the chip to the required direction, providing convenience for subsequent processes; the suction cup 315 is made of soft material and has adjustable adsorption force to avoid scratches or damage to the chip surface; through the precise action of the suction cup 315, the chip adhesion problem caused by static electricity and bubbles can be overcome; the adsorption and separation mechanism 3 of the suction cup 315 can quickly remove the chip to prevent debris, coolant and other residues from contaminating the chip surface.

[0022] refer to Figure 7 As shown, the friction foam mechanism 4 is used to dissipate heat by friction to adjust the heat distribution on the wafer surface and reduce cutting defects caused by local overheating. refer to Figure 7As shown, the friction foam mechanism 4 includes a transmission belt 41 which is transmission-connected to the outer wall of one side of the longitudinal bevel gear 310, the end of the transmission belt 41 away from the longitudinal bevel gear 310 is fixedly connected to a long plate 42, the side of the transmission belt 41 away from the long plate 42 is rotatably connected to a crank 43, the outer wall of the end of the crank 43 away from the transmission belt 41 is fixedly connected to a connecting rod 44, the outer wall of the end of the connecting rod 44 away from the crank 43 is rotatably connected to a short rod 45, the outer wall of the end of the short rod 45 away from the connecting rod 44 is fixedly connected to a buckle 46, the inner wall of the end of the buckle 46 away from the short rod 45 is rotatably connected to a friction blade 47, a friction disc 48 is arranged below the friction blade 47, and an outer plate 49 is fixedly connected to the central outer wall of one side of the friction disc 48; refer to Figure 8 As shown, the bottom end of the friction blade 47 is in an arc shape, and the bottom end of the friction blade 47 is covered with sandpaper, and the initial position of the upper end outer wall of the friction plate 48 is in contact with the bottom end of the friction blade 47; refer to Figure 8 As shown, the right end outer wall of the friction disk 48 initially contacts the tail end outer wall of the spindle fixture 11, and the friction disk 48 is rotatably connected to the top outer wall of the outer plate 49, and one end of the outer plate 49 away from the outer plate 49 is fixedly connected to the inner surface of the wafer cutting machine 1.

[0023] refer to Figure 8 As shown, the semiconductor wafer is made of silicon (Si) wafer.

[0024] Summary 3: Compared with the wafer warping, breakage or dimensional deviation caused by thermal stress in the prior art, the friction disk 48 of the present invention diffuses or eliminates the locally accumulated heat through contact and friction with the tail end of the wafer during rotation, thereby maintaining the overall temperature of the wafer uniform; the contact action of the friction disk 48 can destroy the bubbles in the coolant generated by stirring or vibration, ensure that the coolant is in full contact with the wafer and the cutting blade, and improve the cooling efficiency; the friction action reduces the heat fluctuation and unstable factors at the tail end of the wafer, making the thickness and flatness of the wafer more uniform, enhancing the cutting accuracy, improving the smoothness of the cutting edge, and reducing microcracks or breakage; by removing bubbles and heat accumulation through the friction disk 48, the coolant can more effectively protect the cutting blade, reduce the wear of the blade caused by high temperature or dry friction, reduce the frequency of blade replacement, and save costs; the action of the friction disk 48 can disperse the residual bubbles and liquid on the surface of the wafer, and prevent the contaminants carried by the bubbles in the cutting liquid from adhering to the surface of the wafer; the friction disk 48 can polish the tail end of the wafer to a certain extent, reducing the surface roughness after cutting.

[0025] The complete working principle and steps of the above embodiment are as follows: Initial definition: First, the wafer is placed on the wafer fixture 12 to ensure that the wafer remains stable during the cutting process. At this time, the operator needs to calibrate the position of the wafer to ensure that the cutting path is accurately aligned with the marking line or designated area on the wafer.

[0026] Next, the spindle fixture 11 is started, driving the upper cutting blade 13 to move downward and rotate for cutting. The spindle fixture 11 provides strong torque and high-speed rotation to ensure that the cutting blade 13 remains stable and efficient during the cutting process. The cutting blade 13 is usually made of high-hardness materials such as diamond to ensure cutting accuracy and durability.

[0027] Subsequently, the cutting blade 13 slowly descends in the vertical direction and contacts the surface of the wafer. The cutting process is controlled by a numerical control system to ensure that the cutting blade 13 moves accurately along a preset path. During the cutting process, the cutting blade 13 cuts the wafer into a specified size or shape through its high-speed rotation. At the same time, the protective cover 14 covers the cutting blade 13, effectively preventing debris from splashing, and protecting the cutting blade 13 from external contamination, while improving the safety of the operation.

[0028] To prevent the high temperature generated by cutting from causing thermal damage to the wafer, coolant or air flow is introduced into the cutting area to help remove heat and cutting debris, thereby ensuring the smoothness of the cutting surface and the integrity of the wafer.

[0029] After the cutting is completed, the wafer fixture 12 positions the wafer to the pick-and-place area, and the operator or the automatic robot arm takes down the cut wafer for cleaning and subsequent processing; When using: Pre-cutting mechanism for pre-forming a tiny, regular crack or scratch path on the wafer surface by engraving an arc track 2 steps: like Figure 3 to Figure 4As shown, the operator starts the cross block 29 close to the reduction motor in one end of the inclined rod 28. The start of the reduction will drive the inclined rod 28 to rotate horizontally. The rotation of the inclined rod 28 will drive the double-headed rod 25, which is rotatably connected at one end, to deflect and rotate horizontally. Then, the horizontal deflection and rotation of the double-headed rod 25 will drive the upper rod 26 at its intersection to deflect and rotate horizontally. Secondly, the horizontal deflection and rotation of the double-headed rod 25 will also pull the bottom rod 23, which is rotatably connected at one end, to deflect and rotate horizontally. In this way, the horizontal deflection and rotation of the double-headed rod 25 and the bottom rod 23 will pull the universal ball 24 fixedly connected at their lower ends to drive the universal ball 24 to rotate inside. The connected engraving ball 210 is engraved on the outer wall of the spindle fixture 11 and the only trajectory is "similar to the shape of the '&' symbol, with the characteristics of a cross curve. Specifically, the motion trajectory is composed of a set of vertically symmetrical curves. The trajectory first moves upward and bends to the right, then bends downward near the intersection to form a closed curve, and then repeats a similar movement direction, and finally completes the entire complex path shape". At the same time, the horizontal deflection and rotation of the bottom rod 23 will also pull the long rod 22 connected to one end to deflect back and forth, so that the engraving path contains two vertically symmetrical curve rings and a central intersection, forming a complex cutting path with directionality and symmetry; Adsorption and separation mechanism for precise adhesion of cut chips to prevent them from falling off or sticking to the wafer. 3 steps: like Figures 5 and 6 As shown, when the long rod 22 deflects left and right to the outer wall of the block 312, the deflection of the long rod 22 will push the block 312 to slide inside the cavity plate 313, and then the sliding of the block 312 will drive the eccentric shaft 311 fixedly connected at one end to move synchronously. Since the eccentric shaft 311 is fixedly connected to the eccentric part of the longitudinal bevel gear 310, the movement of the eccentric shaft 311 will drive the longitudinal bevel gear 310 to rotate, and the transverse bevel gear 39 meshing with the longitudinal bevel gear 310 will rotate along with the longitudinal bevel gear 310. The rotation of the transverse bevel gear 39 will rotate synchronously, so the rotation of the transverse bevel gear 39 will drive the support shaft 38 fixedly connected at its lower end to rotate together, and the rotation of the support shaft 38 will pull the connecting shaft 37 fixedly connected at its bottom end to rotate together, so that as the connecting shaft 37 rotates, the sleeve shaft 36 will be pulled to drive the rotating shaft 35 and the protruding rod 33 to deflect up and down, so that the suction cup 315 initially attached to the outer wall of the spindle fixture 11 will separate, transfer and place the wafer covering the tail end of the spindle fixture 11 as the rotating shaft 35 deflects up and down; The friction foam mechanism adjusts the heat distribution on the wafer surface by friction to reduce cutting defects caused by local overheating. 4 steps: like Figures 7 and 8As shown, when the longitudinal bevel gear 310 rotates, the transmission belt 41 connected to the outer wall of one side thereof will rotate synchronously, and then the rotation of the transmission belt 41 will drive the crank 43 on the outer side of one end thereof to rotate, and the rotation of the crank 43 will pull the connecting rod 44 fixedly connected to one end thereof to rotate synchronously, so that the short rod 45 rotatably connected to one end of the connecting rod 44 will realize horizontal reciprocating swing along with the rotation of the connecting rod 44, and the horizontal reciprocating swing of the connecting rod 44 will drive the buckle 46 fixedly connected to one end thereof to reciprocate together, so that the friction blade 47 rotatably connected to the inner wall of the buckle 46 will push the friction disk 48 attached to the arc-shaped outer wall of the friction blade 47 to rotate intermittently along with the swing of the buckle 46, so that the wafer on the outer wall of the tail end of the main shaft clamp 11 that is in conflict is destroyed by the intermittent rotation of the friction disk 48, thereby destroying the bubbles generated by stirring or vibration in the coolant; Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A semiconductor wafer cutting tool, comprising a wafer cutting machine (1) with a rectangular frame structure, wherein a spindle fixture (11) for firmly fixing a wafer by a vacuum adsorption function is fixedly connected to an outer wall of one side of the wafer cutting machine (1), a wafer fixing table (12) for positioning the spindle fixture (11) to ensure that the wafer does not move during the cutting process is clamped below the spindle fixture (11), a cutting blade (13) for cutting the wafer is arranged above the spindle fixture (11), and a protective cover (14) for supporting the cutting blade (13) is fixedly connected to the outside of the cutting blade (13), characterized in that: A prefabricated scoring mechanism (2) is provided on one side outer wall of the cutting blade (13), an adsorption separation mechanism (3) is provided on one side of the tail end of the spindle clamp (11), and a friction foam mechanism (4) is provided on the other side of the tail end of the spindle clamp (11); The pre-scratching mechanism (2) is used to pre-form a tiny, regular crack or scratch path on the wafer surface by engraving an arc track; The adsorption and separation mechanism (3) is used to accurately adhere the cut chips to prevent them from falling off or sticking to the wafer; The friction foam mechanism (4) is used to dissipate heat by friction to adjust the heat distribution on the surface of the wafer, thereby reducing cutting defects caused by local overheating.

2. The semiconductor wafer cutting tool according to claim 1, characterized in that: The prefabricated notch cutting mechanism (2) comprises an external block (21) fixedly connected to an outer wall of one side of the cutting blade (13); a lower surface of the external block (21) on a side away from the cutting blade (13) is rotatably connected to a long rod (22); a center of an end of the long rod (22) away from the external block (21) is rotatably connected to a bottom rod (23); a lower surface of an end of the bottom rod (23) away from the long rod (22) is fixedly connected to a universal ball (24); and an upper surface of the bottom rod (23) on a side away from the universal ball (24) is rotatably connected to a double-headed rod. (25), the upper surface of one side of the double-headed rod (25) away from the universal ball (24) is rotatably connected to an upper rod (26), the upper surface of one end of the upper rod (26) away from the double-headed rod (25) is fixedly connected to a support block (27), the upper surface of one end of the double-headed rod (25) away from the universal ball (24) is rotatably connected to an inclined rod (28), the upper surface of one end of the inclined rod (28) away from the double-headed rod (25) is fixedly connected to a cross block (29), and the lower end of the universal ball (24) is rotatably connected to a depiction ball (210).

3. The semiconductor wafer cutting tool according to claim 2, characterized in that: The double-headed rod (25) is in a V-shape, the upper rod (26) is rotatably connected to the intersection of the double-headed rod (25), and one end of the support block (27) away from the upper rod (26) is fixedly connected to an outer surface of one side of the cutting blade (13).

4. The semiconductor wafer cutting tool according to claim 2, characterized in that: One end of the cross block (29) away from the inclined rod (28) is fixedly connected to the outer surface of one side of the cutting piece (13), the bottom end of the engraving ball (210) is initially located in contact with the outer wall of the spindle fixture (11), and a reduction motor is disposed inside the end of the cross block (29) close to the inclined rod (28).

5. The semiconductor wafer cutting tool according to claim 1, characterized in that: The adsorption and separation mechanism (3) comprises an external connecting rod (31) fixedly connected to an outer wall of one side of the wafer cutting machine (1); an insert block (32) is fixedly connected to the outer wall of one end of the external connecting rod (31) away from the wafer cutting machine (1); a convex rod (33) is rotatably connected to the inner wall of one end of the insert block (32) away from the external connecting rod (31); a fixed shaft (34) is fixedly connected to the center of one side of the convex rod (33); a rotating shaft (35) is rotatably connected to an eccentric part of one side of the convex rod (33); a sleeve shaft (36) is fixedly connected to the center of one end of the rotating shaft (35) away from the convex rod (33); a connecting shaft (37) is sleeved on the outer wall of one end of the sleeve shaft (36) away from the rotating shaft (35); and the outer wall of one end of the connecting shaft (37) away from the sleeve shaft (36) is A support shaft (38) is fixedly connected thereto; an outer wall of one end of the support shaft (38) away from the connecting shaft (37) is fixedly connected to a transverse bevel gear (39); an outer wall of one side of the transverse bevel gear (39) is provided with a longitudinal bevel gear (310); an end of the longitudinal bevel gear (310) away from the transverse bevel gear (39) is eccentrically fixedly connected to an eccentric shaft (311); an end of the eccentric shaft (311) away from the longitudinal bevel gear (310) is fixedly connected to a clamping block (312); a cavity plate (313) is provided outside the clamping block (312); springs (314) are fixedly connected to both sides of the inner wall of the cavity plate (313); and a plurality of suction cups (315) are evenly fixedly connected to an outer wall of one side of the rotating shaft (35) close to the spindle clamp (11).

6. The semiconductor wafer cutting tool according to claim 5, characterized in that: One end of the transverse bevel gear (39) close to the support shaft (38) passes through the upper surface of the insert block (32), the transverse bevel gear (39) and the longitudinal bevel gear (310) mesh with each other to form a meshing transmission, and the clamping block (312) is slidably connected to the inside of the cavity plate (313).

7. The semiconductor wafer cutting tool according to claim 5, characterized in that: The lower end of the cavity plate (313) is fixedly connected to one side of the upper surface of the insert block (32); the initial positions of the plurality of suction cups (315) are in contact with the outer wall of the tail end of the spindle clamp (11); the movement direction of the clamping block (312) is perpendicular to the rotation axis of the long rod (22), that is, the horizontal movement of the clamping block (312) is orthogonal to the rotational movement of the long rod (22).

8. The semiconductor wafer cutting tool according to claim 5, characterized in that: The friction foam mechanism (4) comprises a transmission belt (41) transmission-connected to an outer wall of one side of the longitudinal bevel gear (310); an end of the transmission belt (41) away from the longitudinal bevel gear (310) is fixedly connected to a long plate (42); a side of the transmission belt (41) away from the long plate (42) is rotationally connected to a crank (43); an outer wall of an end of the crank (43) away from the transmission belt (41) is fixedly connected to a connecting rod (44); an outer wall of an end of the connecting rod (44) away from the crank (43) is rotationally connected to a short rod (45); an outer wall of an end of the short rod (45) away from the connecting rod (44) is fixedly connected to a buckle (46); an inner wall of an end of the buckle (46) away from the short rod (45) is rotationally connected to a friction blade (47); a friction disc (48) is provided below the friction blade (47); and an outer plate (49) is fixedly connected to a central outer wall of one side of the friction disc (48).

9. The semiconductor wafer cutting tool according to claim 8, characterized in that: The bottom end of the friction blade (47) is in an arc shape, and the bottom end of the friction blade (47) is covered with sandpaper. The upper outer wall of the friction disk (48) is initially positioned in contact with the bottom end of the friction blade (47). The right outer wall of the friction disk (48) is initially positioned in contact with the tail outer wall of the spindle fixture (11). The friction disk (48) is rotatably connected to the top outer wall of the outer plate (49), and one end of the outer plate (49) away from the outer plate (49) is fixedly connected to the inner surface of the wafer cutting machine (1).

10. A semiconductor wafer, using a semiconductor wafer-specific cutting tool according to claims 1-9, characterized in that: The semiconductor wafer is made of silicon (Si) wafer.

Images