Laminate and reflective film

Abstract

The invention relates to a laminate and a reflective film. A laminate (1) is provided with a resin film (2), an inorganic layer (3), and a cured resin layer (4) in this order toward one side in the thickness direction. In addition, the thickness T1 of the inorganic material layer (3) is 110 nm or more and 1000 nm or less, and the ratio (T2 / T1) of the thickness T2 (nm) of the cured resin layer (4) to the thickness T1 (nm) of the inorganic material layer (3) is 1.0 or more and less than 10.

Description

Technical Field

[0001] The present invention relates to a laminate and a reflective film. Background Art

[0002] The liquid crystal display device comprises a liquid crystal panel having an image display surface, a backlight source emitting light to the back side of the liquid crystal panel, and a housing for accommodating them. The housing comprises a frame portion as a frame around the image display surface. It is known that a reflective film is arranged on the inner wall surface in the frame portion to suppress the light from the backlight source from leaking from the frame portion. As such a reflective film, a laminate having a resin film, an inorganic layer, and a cured resin layer is proposed (for example, refer to the following patent document 1). The cured resin layer is a layer for protecting the surface of the laminate.

[0003] Prior art literature

[0004] Patent Literature

[0005] Patent Document 1: Japanese Patent Application Publication No. 2004-184443

[0006] The laminate described in Patent Document 1 has a problem in that wrinkles are generated at the end portions when the cured resin layer is formed on the inorganic layer. Summary of the invention

[0007] An object of the present invention is to provide a laminate and a reflective film capable of suppressing wrinkles at the end portions.

[0008] The present invention [1] includes a laminate, which comprises a resin film, an inorganic layer, and a cured resin layer in sequence toward one side in the thickness direction, wherein the thickness T1 of the inorganic layer is greater than 110 nm and less than 1000 nm, and the ratio (T2 / T1) of the thickness T2 (nm) of the cured resin layer to the thickness T1 (nm) of the inorganic layer is greater than 1.0 and less than 10.

[0009] The present invention [2] includes the laminate according to [1], wherein the thickness of the resin film is 100 μm or less.

[0010] The present invention [3] includes the laminate according to [1] or [2], wherein the inorganic layer is at least one selected from the group consisting of a metal layer, a metal oxide layer, and a metal nitride layer.

[0011] The present invention [4] includes the laminate according to any one of [1] to [3], wherein the inorganic layer includes a first inorganic layer and a second inorganic layer in this order toward one side in the thickness direction.

[0012] The present invention [5] includes the laminate according to [4], wherein the first inorganic layer is a metal layer, and the second inorganic layer is a layer containing a metal oxide and a single element metal.

[0013] The present invention [6] includes the laminate according to [4] or [5], wherein the inorganic layer further includes a third inorganic layer disposed on one side in the thickness direction of the second inorganic layer.

[0014] The present invention [7] includes the laminate according to [6], wherein the third inorganic material layer is a metal oxide layer.

[0015] The present invention [8] includes the laminate according to any one of [1] to [7], wherein the inorganic layer includes a blackened layer.

[0016] The present invention [9] includes the laminate according to any one of [1] to [8], wherein the thickness T2 of the cured resin layer is 1000 nm or more.

[0017] The present invention

[10] includes a reflective film comprising the laminate according to any one of [1] to [9].

[0018] Effects of the Invention

[0019] In the laminate of the present invention, the thickness T1 of the inorganic layer is 110 nm to 1000 nm, and the ratio (T2 / T1) of the thickness T2 (nm) of the cured resin layer to the thickness T1 (nm) of the inorganic layer is 1.0 to less than 10. Therefore, wrinkles at the end can be suppressed.

[0020] Since the reflective film of the present invention includes the above-mentioned laminated body, wrinkles at the end portions can be suppressed. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 A cross-sectional view showing one embodiment of the laminated body of the present invention.

[0022] Figure 2 This is a cross-sectional view showing another embodiment of the laminated body of the present invention.

[0023] FIG. 3A to FIG. 3C express Figure 1 The method for manufacturing the laminated body shown. Figure 3A The steps of preparing the resin film are shown. Figure 3B The process of forming an inorganic layer on a resin film is shown. Figure 3C The step of forming a cured resin layer on the inorganic layer is shown.

[0024] Description of Reference Numerals

[0025] 1: laminate; 2: resin film; 3: inorganic layer; 4: cured resin layer; 31: first inorganic layer; 32: second inorganic layer; 33: third inorganic layer. DETAILED DESCRIPTION

[0026] 1. Laminated body

[0027] Reference Figure 1 and Figure 2 , the laminated body 1 of the present invention is described.

[0028] The laminate 1 includes a resin film 2, an inorganic layer 3, and a cured resin layer 4 in sequence toward one side in the thickness direction. Specifically, the laminate 1 includes a resin film 2, an inorganic layer 3 disposed on one side of the thickness direction of the resin film 2, and a cured resin layer 4 disposed on one side of the thickness direction of the inorganic layer 3. The laminate 1 extends in a direction (surface direction) orthogonal to the thickness direction. The laminate 1 is used, for example, as a reflective film that suppresses light from a backlight source of a liquid crystal display device from leaking from a housing.

[0029] <Resin film>

[0030] The resin film 2 is a base film that ensures the strength of the laminated body 1. In addition, the resin film 2 has flexibility.

[0031] Examples of the material of the resin film 2 include polyester resins, polyolefin resins, acrylic resins, polycarbonate resins, polyethersulfone resins, polyarylate resins, melamine resins, polyamide resins, polyimide resins, cellulose resins, and polystyrene resins. Preferably, polyester resins are used.

[0032] Examples of the polyester resin include polyethylene terephthalate (PET), polybutylene terephthalate, and polyethylene naphthalate, and preferably polyethylene terephthalate is used.

[0033] Examples of the polyolefin resin include polyethylene, polypropylene, and cycloolefin polymers.

[0034] As an acrylic resin, polymethacrylate is mentioned, for example.

[0035] As the resin film 2, from the viewpoint of excellent transparency and strength, a polyester resin film is preferred, and a polyethylene terephthalate film is more preferred.

[0036] The resin film 2 may include, for example, a transparent film and a white film. From the viewpoint of excellent light reflectivity, a white film is preferred. In the case of a white film, for example, particles that scatter light are dispersed in the resin film. That is, as the resin film 2, a polyethylene terephthalate film containing particles is preferably included.

[0037] As the fine particles, for example, fine particles formed of inorganic fillers can be cited. As the inorganic filler, for example, titanium oxide, calcium carbonate, barium sulfate, silicon dioxide, and talc can be cited. It is preferred to use at least one selected from the group consisting of titanium oxide and silicon dioxide.

[0038] The fine particles may be used alone or in combination of two or more.

[0039] The average particle diameter of the fine particles is, for example, 0.05 μm to 2 μm, or preferably 0.1 μm to 1 μm.

[0040] The content ratio of the fine particles in the resin film 2 as the white film is, for example, 5 mass % to 50 mass %, or preferably 10 mass % to 40 mass %.

[0041] The thickness of the resin film 2 is, for example, 5 μm to 200 μm, preferably 10 μm to 150 μm, more preferably 15 μm to 100 μm, further preferably 20 μm to 70 μm, and particularly preferably 25 μm to 50 μm.

[0042] The thickness of the resin film 2 is, for example, 5 μm or more, preferably 10 μm or more, more preferably 15 μm or more, further preferably 20 μm or more, particularly preferably 25 μm or more, and, for example, 200 μm or less, preferably 150 μm or less, more preferably 100 μm or less, further preferably 70 μm or less, particularly preferably 50 μm or less.

[0043] When the thickness of the resin film 2 is at least the above lower limit, water vapor can be suppressed from penetrating into the inorganic layer 3 from the resin film 2 side of the laminate 1. In addition, a laminate 1 having excellent strength can be manufactured. When the thickness of the resin film 2 is at most the above upper limit, the handling property of the resin film 2 in a roll-to-roll process is excellent. In addition, the laminate 1 can be made thinner.

[0044] In order to improve the adhesion between the inorganic layer 3 and the resin film 2, the surface in the thickness direction of the resin film 2 (the contact surface with the inorganic layer 3) can be subjected to surface modification treatment. Examples of surface modification treatments include corona treatment, plasma treatment, ozone treatment, primer treatment, glow treatment, and coupling agent treatment.

[0045] <Inorganic layer>

[0046] The inorganic layer 3 is disposed on one side in the thickness direction of the resin film 2, preferably on one surface in the thickness direction of the resin film 2. That is, the inorganic layer 3 is preferably in contact with one surface in the thickness direction of the resin film 2.

[0047] As the inorganic layer 3, for example, a metal layer, a metal oxide layer, and a metal nitride layer can be cited. The inorganic layer 3 preferably includes at least one selected from the group consisting of a metal layer, a metal oxide layer, and a metal nitride layer. More preferably, it includes at least one selected from the group consisting of a metal layer and a metal oxide layer. It is further preferred to include at least one layer selected from the group consisting of aluminum, indium oxide, copper, and indium tin composite oxide. In addition, the inorganic layer 3 preferably includes a blackening layer.

[0048] The inorganic layer 3 may be a single layer or multiple layers. The inorganic layer 3 is preferably a multiple layer.

[0049] The inorganic layer 3 is, for example, a layer formed by a dry coating method (dry coating layer). Examples of the dry coating layer include a sputtered layer formed by a sputtering method and a vapor-deposited layer formed by a vapor deposition method, and preferably, a sputtered layer is used.

[0050] The inorganic layer 3, for example, includes a first inorganic layer 31 and a second inorganic layer 32 in sequence toward one side in the thickness direction. More specifically, the inorganic layer 3 includes a first inorganic layer 31 and a second inorganic layer 32 disposed on a surface of the first inorganic layer 31 on one side in the thickness direction. The inorganic layer 3 also includes a third inorganic layer 33 disposed on one side in the thickness direction of the second inorganic layer 32 as required. More specifically, the inorganic layer 3 also includes a third inorganic layer 33 disposed on a surface of the second inorganic layer 32 on one side in the thickness direction.

[0051] exist Figure 1 In the laminate 1 shown in FIG. 1 , the inorganic layer 3 includes a first inorganic layer 31, a second inorganic layer 32, and a third inorganic layer 33 in this order toward one side in the thickness direction. Figure 2 In the laminated body 1 shown, the inorganic layer 3 includes a first inorganic layer 31 and a second inorganic layer 32 in this order toward one side in the thickness direction, but does not include the third inorganic layer 33 .

[0052] [First Inorganic Layer]

[0053] The first inorganic layer 31 is disposed on one side in the thickness direction of the resin film 2, preferably on one surface in the thickness direction of the resin film 2. That is, the first inorganic layer 31 is preferably in contact with one surface in the thickness direction of the resin film 2. The first inorganic layer 31 is the bottommost layer of the inorganic layer 3.

[0054] Examples of the first inorganic layer 31 include a metal layer, a metal oxide layer, and a metal nitride layer, and a metal layer is preferred. The metal layer as the first inorganic layer 31 is formed of, for example, a light-reflective metal.

[0055] As the metal forming the first inorganic layer 31, for example, aluminum (Al), silver (Ag), titanium (Ti), and alloys thereof can be cited. From the viewpoint of having good light reflectivity to visible light, as the metal of the first inorganic layer 31, preferably aluminum and silver are cited, and more preferably aluminum is cited. That is, as the first inorganic layer 31, for example, an aluminum layer (Al layer) and a silver layer (Ag layer) can be cited, and preferably an aluminum layer is cited.

[0056] The thickness t1 of the first inorganic layer 31 is, for example, 10 nm to 700 nm, preferably 30 nm to 500 nm, more preferably 50 nm to 400 nm, and further preferably 70 nm to 350 nm.

[0057] The thickness t1 of the first inorganic layer 31 is, for example, greater than 10 nm, preferably greater than 30 nm, more preferably greater than 50 nm, further preferably greater than 70 nm, and, for example, less than 700 nm, preferably less than 500 nm, more preferably less than 400 nm, further preferably less than 350 nm.

[0058] When the thickness t1 of the first inorganic layer 31 is greater than or equal to the above lower limit, the light reflectivity is excellent. When the thickness t1 of the first inorganic layer 31 is less than or equal to the above upper limit, the adhesion between the first inorganic layer 31 and the resin film 2 is excellent.

[0059] [Second Inorganic Layer]

[0060] The second inorganic layer 32 is disposed on one side of the first inorganic layer 31 in the thickness direction, preferably on one surface of the first inorganic layer 31 in the thickness direction. That is, the second inorganic layer 32 is preferably in contact with one surface of the first inorganic layer 31 in the thickness direction.

[0061] The second inorganic layer 32 is, for example, an inorganic layer with high light absorption, and is preferably a blackened layer.

[0062] The second inorganic layer 32 is, for example, a layer including a metal compound and a single metal, preferably a layer consisting of a metal compound and a single metal. It should be noted that the second inorganic layer 32 may include a plurality of metal compounds or a plurality of single metals.

[0063] A metal compound is a compound of a metal and a non-metal. Examples of metal compounds include metal oxides, metal nitrides, and metal carbides, preferably metal oxides. Examples of metals (first metals) in metal compounds include indium (In), copper (Cu), molybdenum (Mo), and iron (Fe). The first metal is preferably at least one selected from the group consisting of In, Cu, Mo, and Fe, more preferably at least one selected from the group consisting of Cu and In. That is, examples of metal compounds include metal oxides, preferably copper oxide and indium oxide. In addition, the first metal may be used alone or in combination of two or more.

[0064] Examples of the single metal (second metal) include In, Cu, Mo, and Fe. The second metal is preferably at least one selected from the group consisting of In, Cu, Mo, and Fe, and more preferably Cu. In addition, the second metal may be used alone or in combination of two or more.

[0065] The ratio of the first metal in the second inorganic layer 32 is, for example, 10 atomic % to 90 atomic %, or preferably 20 atomic % to 80 atomic %.

[0066] The ratio of the first metal in the second inorganic layer 32 is, for example, 10 atomic % or more, preferably 20 atomic % or more, and, for example, 90 atomic % or less, preferably 80 atomic % or less.

[0067] When the ratio of the first metal in the second inorganic substance layer 32 is within the above range, the light shielding property is excellent.

[0068] The ratio of the second metal in the second inorganic layer 32 is, for example, 10 atomic % to 90 atomic %, or preferably 20 atomic % to 80 atomic %.

[0069] The ratio of the second metal in the second inorganic layer 32 is, for example, 10 atomic % or more, preferably 20 atomic % or more, and, for example, 90 atomic % or less, preferably 80 atomic % or less.

[0070] When the ratio of the second metal in the second inorganic substance layer 32 is within the above range, the light shielding property is excellent.

[0071] The second inorganic layer 32 is, for example, a layer including a metal compound and a single metal, preferably a layer including a metal oxide and a single metal, and more preferably a layer including indium oxide and copper. More specifically, the second inorganic layer 32 is, for example, a layer including a metal compound and a single metal.

[0072] If the second inorganic layer 32 contains the above-mentioned metal compound and a single metal, the light shielding property is further improved.

[0073] When the second inorganic layer 32 includes indium oxide and copper, the ratio of In in the second inorganic layer 32 is, for example, 40 atomic % to 90 atomic %, or preferably 50 atomic % to 80 atomic %.

[0074] When the second inorganic layer 32 includes indium oxide and copper, the ratio of In in the second inorganic layer 32 is, for example, 40 atomic % or more, preferably 50 atomic % or more, and, for example, 90 atomic % or less, preferably 80 atomic % or less.

[0075] When the ratio of In in the second inorganic substance layer 32 is within the above range, the light shielding property is excellent.

[0076] When the second inorganic layer 32 includes indium oxide and copper, the ratio of Cu in the second inorganic layer 32 is, for example, 5 atomic % to 50 atomic %, or preferably 10 atomic % to 40 atomic %.

[0077] When the second inorganic layer 32 includes indium oxide and copper, the proportion of Cu in the second inorganic layer 32 is, for example, 5 atomic % or more, preferably 10 atomic % or more, and, for example, 50 atomic % or less, preferably 40 atomic % or less.

[0078] When the ratio of Cu in the second inorganic substance layer 32 is within the above range, the light shielding property is excellent.

[0079] The thickness t2 of the second inorganic layer 32 is, for example, 5 nm to 300 nm, preferably 10 nm to 200 nm, more preferably 15 nm to 150 nm, and further preferably 20 nm to 120 nm.

[0080] The thickness t2 of the second inorganic layer 32 is, for example, greater than 5 nm, preferably greater than 10 nm, more preferably greater than 15 nm, further preferably greater than 20 nm, and, for example, less than 300 nm, preferably less than 200 nm, more preferably less than 150 nm, further preferably less than 120 nm.

[0081] When the thickness t2 of the second inorganic layer 32 is greater than or equal to the above lower limit, the light shielding property is excellent. When the thickness t2 of the second inorganic layer 32 is less than or equal to the above upper limit, the second inorganic layer 32 and the first inorganic layer 31 have excellent adhesion.

[0082] The light transmittance (Y value) of the second inorganic layer 32 at a wavelength of 380 nm to 780 nm in the CIE-XYZ colorimetric system is, for example, 0.001% to 0.1%, preferably 0.005% to 0.05%, and more preferably 0.01% to 0.03%. It should be noted that the light transmittance can be measured, for example, by a spectrophotometer (trade name: U-4100, manufactured by Hitachi High-Tech Science Co., Ltd.).

[0083] [Third Inorganic Layer]

[0084] The third inorganic layer 33 is disposed, for example, on one side in the thickness direction of the second inorganic layer 32 , preferably on one surface in the thickness direction of the second inorganic layer 32 . That is, the third inorganic layer 33 is in contact with one surface in the thickness direction of the second inorganic layer 32 .

[0085] As the third inorganic layer 33, for example, a metal layer, a metal oxide layer, and a metal nitride layer can be listed, and a metal oxide layer is preferably listed. As the metal of the metal oxide forming the third inorganic layer 33, for example, indium (In), zinc (Zn), tin (Sn), magnesium (Mg), nickel (Ni), cobalt (Co), and chromium (Cr) can be listed. As the metal of the metal oxide forming the third inorganic layer 33, from the viewpoint of improving the water vapor barrier property of the third inorganic layer 33, it is preferably selected from at least one of the group consisting of In, Zn, Sn, Mg, Ni, Co, and Cr. As the third inorganic layer 33, an indium tin composite oxide (ITO) layer is more preferably used.

[0086] When an ITO layer is used as the third inorganic material layer 33, the relative amount of tin oxide in ITO to indium oxide (In 2 O 3 ) and tin oxide (SnO 2 ) is, for example, 1.0 to 20.0% by mass, preferably 3.0 to 18.0% by mass, more preferably 5.0 to 15.0% by mass, and further preferably 7.0 to 12.0% by mass.

[0087] When an ITO layer is used as the third inorganic material layer 33, the relative amount of tin oxide in ITO to indium oxide (In 2 O 3 ) and tin oxide (SnO 2) is, for example, 1.0 mass % or more, preferably 3.0 mass % or more, more preferably 5.0 mass % or more, further preferably 7.0 mass % or more, and, for example, 20.0 mass % or less, preferably 18.0 mass % or less, more preferably 15.0 mass % or less, further preferably 12 mass % or less.

[0088] If the tin oxide in ITO is relative to indium oxide (In 2 O 3 ) and tin oxide (SnO 2 ) is within the above range, the water vapor barrier property is excellent.

[0089] The thickness t3 of the third inorganic layer 33 is, for example, 1 nm to 200 nm, preferably 5 nm to 100 nm, more preferably 10 nm to 50 nm, and further preferably 15 nm to 30 nm.

[0090] The thickness t3 of the third inorganic layer 33 is, for example, greater than 1 nm, preferably greater than 5 nm, more preferably greater than 10 nm, further preferably greater than 15 nm, and, for example, less than 200 nm, preferably less than 100 nm, more preferably less than 50 nm, further preferably less than 30 nm.

[0091] When the thickness t3 of the third inorganic layer 33 is greater than or equal to the above lower limit, the water vapor barrier property is excellent. When the thickness t3 of the third inorganic layer 33 is less than or equal to the above upper limit, the adhesion between the third inorganic layer 33 and the second inorganic layer 32 is excellent.

[0092] The total thickness T1 of the inorganic layer 3 (the thickness of the inorganic layer 3 ) is 110 nm to 1000 nm, preferably 110 nm to 700 nm, more preferably 115 nm to 500 nm, further preferably 115 nm to 400 nm, particularly preferably 120 nm to 300 nm, and most preferably 120 nm to 200 nm.

[0093] The total thickness of the inorganic layer 3 (the thickness of the inorganic layer 3) T1 is 110 nm or more, preferably 115 nm or more, and more preferably 120 nm or more. In addition, the total thickness of the inorganic layer 3 (the thickness of the inorganic layer 3) T1 is 1000 nm or less, preferably 700 nm or less, more preferably 500 nm or less, further preferably 400 nm or less, particularly preferably 300 nm or less, and most preferably 200 nm or less.

[0094] If the thickness T1 of the inorganic layer 3 is above the above lower limit, wrinkles at the end of the laminate 1 can be suppressed. Specifically, if the total thickness T1 of the inorganic layer 3 (the thickness of the inorganic layer 3) is above the above lower limit, the internal stress of the inorganic layer 3 can be ensured, and further, wrinkles at the end of the laminate 1 can be suppressed. In addition, if the thickness T1 of the inorganic layer 3 is below the above upper limit, the inorganic layer 3 has excellent adhesion with the resin film 2, and further, the manufacturability is excellent.

[0095] In addition, if the thickness T1 of the inorganic layer 3 is within the above range, the ratio (T2 / T1) of the thickness T2 (nm) of the cured resin layer described later to the thickness T1 (nm) of the inorganic layer can be set within a preferred range, thereby suppressing end wrinkles in the stack 1.

[0096] <Cured resin layer>

[0097] The cured resin layer 4 is disposed on one side in the thickness direction of the inorganic layer 3 , preferably on one surface in the thickness direction of the inorganic layer 3 . That is, the cured resin layer 4 is in contact with one surface in the thickness direction of the inorganic layer 3 .

[0098] exist Figure 1 In the laminate 1 shown in FIG. 1 , the cured resin layer 4 is disposed on one surface of the third inorganic layer 33 in the thickness direction. That is, the cured resin layer 4 is in contact with one surface of the third inorganic layer 33 in the thickness direction. Figure 2 In the laminated body 1 shown, the cured resin layer 4 is disposed on one surface in the thickness direction of the second inorganic layer 32. That is, the cured resin layer 4 is in contact with one surface in the thickness direction of the second inorganic layer.

[0099] The cured resin layer 4 is, for example, a hard coating layer for making the laminate 1 less susceptible to scratches.

[0100] The cured resin layer 4 is a cured product of a curable resin composition. The curable resin composition contains a curable resin. As the curable resin, for example, polyester resins, acrylic urethane resins, acrylic resins (excluding acrylic urethane resins), carbamate resins (excluding acrylic urethane resins), amide resins, silicone resins, epoxy resins, and melamine resins can be listed. These curable resins can be used alone or in combination of two or more. As the curable resin, from the viewpoint of having excellent hardness, it is preferred to use at least one selected from the group consisting of acrylic urethane resins and acrylic resins, and more preferably acrylic urethane resins.

[0101] Examples of the curable resin include ultraviolet curable resins and thermosetting resins. From the viewpoint of improving the production efficiency of the laminate 1, the curable resin is preferably an ultraviolet curable resin that can be cured without high-temperature heating.

[0102] The curable resin composition may contain particles. As particles, for example, inorganic particles and organic particles can be listed. As inorganic particles, for example, inorganic oxide particles can be listed. As materials for inorganic oxide particles, for example, silica, alumina, titanium dioxide, zirconium oxide, calcium oxide, tin oxide, indium oxide, cadmium oxide, and antimony oxide can be listed. As materials for organic particles, for example, polymethyl methacrylate, polystyrene, polyurethane, acrylic-styrene copolymer, benzoguanamine, melamine, and polycarbonate can be listed. The particles can be used alone or in combination of two or more. As particles, preferably inorganic particles are listed, more preferably inorganic oxide particles are listed, and further preferably at least one selected from silica particles and zirconium oxide particles is listed.

[0103] The average particle size (D50) of the particles is, for example, 20 nm to 300 nm, preferably 25 nm to 200 nm, and more preferably 30 nm to 100 nm.

[0104] When the average particle size (D50) of the particles is at least the above lower limit, the hardness of the cured resin layer 4 is excellent. On the other hand, when the average particle size (D50) of the particles is at most the above upper limit, the dispersibility of the particles in the cured resin layer 4 is excellent.

[0105] The average particle size (D50) of particles is the median size in a volume-based particle size distribution (particle size at which the volume cumulative frequency from the smaller diameter side reaches 50%), and is determined based on a particle size distribution obtained by, for example, a laser diffraction scattering method.

[0106] The ratio of the particles in the cured resin layer 4 is, for example, 5 mass % to 30 mass %, preferably 8 mass % to 20 mass %, and more preferably 10 mass % to 15 mass %.

[0107] When the ratio of particles in the cured resin layer 4 is at least the above lower limit, the hardness of the cured resin layer 4 is excellent. When the ratio of particles in the cured resin layer 4 is at most the above upper limit, the particles can be uniformly dispersed in the cured resin layer 4.

[0108] The thickness T2 of the cured resin layer 4 is, for example, 100 nm to 5000 nm, preferably 300 nm to 3000 nm, more preferably 500 nm to 2000 nm, further preferably 700 nm to 1500 nm, and particularly preferably 900 nm to 1200 nm.

[0109] The thickness T2 of the cured resin layer 4 is, for example, greater than 100 nm, preferably greater than 300 nm, more preferably greater than 500 nm, further preferably greater than 700 nm, and particularly preferably greater than 900 nm. In addition, it is, for example, less than 5000 nm, preferably less than 3000 nm, more preferably less than 2000 nm, further preferably less than 1500 nm, and particularly preferably less than 1200 nm.

[0110] When the thickness T2 of the cured resin layer 4 is at least the above lower limit, the scratch resistance is excellent. On the other hand, when the thickness T2 of the cured resin layer 4 is at most the above upper limit, the adhesion between the cured resin layer 4 and the inorganic layer 3 is excellent.

[0111] In addition, if the thickness T2 of the cured resin layer 4 is within the above-mentioned range, the ratio (T2 / T1) of the thickness T2 (nm) of the cured resin layer 4 described later to the thickness T1 (nm) of the inorganic layer 3 can be set within a preferred range, thereby suppressing end wrinkles in the stack 1.

[0112] The luminous reflectance (Y value) of the laminate 1 at a wavelength of 380 nm to 780 nm in the CIE-XYZ colorimetric system is, for example, 80% to 100%, preferably 82% to 100%, and more preferably 85% to 100%. It should be noted that the luminous reflectance (Y value) of the laminate 1 refers to the reflectivity of light irradiated to the laminate 1 from the resin film 2 side.

[0113] The light transmittance (Y value) of the laminate 1 at a wavelength of 380 nm to 780 nm in the CIE-XYZ colorimetric system is, for example, 0.001% to 0.10%, preferably 0.005% to 0.05%, and more preferably 0.01% to 0.02%. It should be noted that the light transmittance (Y value) of the laminate 1 refers to the transmittance of light irradiated to the laminate 1 from the resin film 2 side.

[0114] <Relationship between the thickness of each layer>

[0115] The ratio (t1 / T1×100) (%) of the thickness t1 (nm) of the first inorganic layer 31 in the thickness T1 (nm) of the inorganic layer 3 is, for example, 40% to 99%, preferably 45% to 95%, and more preferably 50% to 93%.

[0116] The ratio (t1 / T1×100) (%) of the thickness t1 (nm) of the first inorganic layer 31 in the thickness T1 (nm) of the inorganic layer 3 is, for example, greater than 40%, preferably greater than 45%, more preferably greater than 50%, and, for example, less than 99%, preferably less than 95%, more preferably less than 93%.

[0117] The ratio (t2 / T1×100) (%) of the thickness t2 (nm) of the second inorganic layer 32 in the thickness T1 (nm) of the inorganic layer 3 is, for example, 1% to 60%, preferably 3% to 55%, and more preferably 5% to 50%.

[0118] The ratio (t2 / T1×100) (%) of the thickness t2 (nm) of the second inorganic layer 32 in the thickness T1 (nm) of the inorganic layer 3 is, for example, greater than 1%, preferably greater than 3%, more preferably greater than 5%, and, for example, less than 60%, preferably less than 55%, more preferably less than 50%.

[0119] When the inorganic layer 3 has a third inorganic layer 33, the ratio (t3 / T1×100) (%) of the thickness t3 (nm) of the third inorganic layer 33 in the thickness T1 (nm) of the inorganic layer 3 is, for example, 1% to 30%, preferably 5% to 25%, and more preferably 10% to 20%.

[0120] When the inorganic layer 3 has a third inorganic layer 33, the ratio (t3 / T1×100) (%) of the thickness t3 (nm) of the third inorganic layer 33 in the thickness T1 (nm) of the inorganic layer 3 is, for example, greater than 1%, preferably greater than 5%, more preferably greater than 10%, and, for example, less than 30%, preferably less than 25%, more preferably less than 20%.

[0121] The ratio ( t2 / t1 ) of the thickness t2 (nm) of the second inorganic layer 32 to the thickness t1 (nm) of the first inorganic layer 31 is, for example, 0.01 to 1.00, preferably 0.03 to 0.90, and more preferably 0.05 to 0.85.

[0122] The ratio (t2 / t1) of the thickness t2 (nm) of the second inorganic layer 32 to the thickness t1 (nm) of the first inorganic layer 31 is, for example, greater than 0.01, preferably greater than 0.03, more preferably greater than 0.05, and for example, less than 1.00, preferably less than 0.90, more preferably less than 0.85.

[0123] When the inorganic layer 3 includes the third inorganic layer 33 , the ratio ( t3 / t1 ) of the thickness t3 (nm) of the third inorganic layer 33 to the thickness t1 (nm) of the first inorganic layer 31 is, for example, 0.10 to 0.80, preferably 0.15 to 0.50, and more preferably 0.20 to 0.35.

[0124] When the inorganic layer 3 has a third inorganic layer 33, the ratio (t3 / t1) of the thickness t3 (nm) of the third inorganic layer 33 to the thickness t1 (nm) of the first inorganic layer 31 is, for example, greater than 0.10, preferably greater than 0.15, more preferably greater than 0.20, and, for example, less than 0.80, preferably less than 0.50, more preferably less than 0.35.

[0125] When the inorganic layer 3 includes the third inorganic layer 33 , the ratio ( t3 / t2 ) of the thickness t3 (nm) of the third inorganic layer 33 to the thickness t2 (nm) of the second inorganic layer 32 is, for example, 0.3 to 1.2, preferably 0.5 to 1.0, and more preferably 0.7 to 0.9.

[0126] When the inorganic layer 3 has a third inorganic layer 33, the ratio (t3 / t2) of the thickness t3 (nm) of the third inorganic layer 33 to the thickness t2 (nm) of the second inorganic layer 32 is, for example, greater than 0.3, preferably greater than 0.5, more preferably greater than 0.7, and, for example, less than 1.2, preferably less than 1.0, more preferably less than 0.9.

[0127] The ratio (T2 / T1) of the thickness T2 (nm) of the cured resin layer 4 to the total thickness T1 (nm) of the inorganic layer 3 (the thickness of the inorganic layer 3) is, for example, 1.0 to 10.0, preferably 1.5 to 9.9, more preferably 2.0 to 9.0, and further preferably 2.5 to 8.5.

[0128] The ratio (T2 / T1) of the thickness T2 (nm) of the cured resin layer 4 to the total thickness T1 (nm) of the inorganic layer 3 (the thickness of the inorganic layer 3) is greater than 1.0, preferably greater than 1.5, more preferably greater than 2.0, and further preferably greater than 2.5. In addition, it is less than 10.0, preferably less than 9.9, more preferably less than 9.0, and further preferably less than 8.5.

[0129] If the ratio (T2 / T1) of the thickness T2 (nm) of the cured resin layer 4 to the total thickness T1 (nm) of the inorganic layer 3 (the thickness of the inorganic layer 3) is above the above lower limit, the scratch resistance of the cured resin layer 4 can be ensured, and the total thickness of the laminate 1 can be thinned. If the ratio (T2 / T1) of the thickness T2 (nm) of the cured resin layer 4 to the total thickness T1 (nm) of the inorganic layer 3 (the thickness of the inorganic layer 3) is below the above upper limit, the end wrinkles in the laminate 1 can be suppressed.

[0130] That is, if the ratio (T2 / T1) of the thickness T2 (nm) of the cured resin layer 4 to the total thickness T1 (nm) of the inorganic layer 3 (the thickness of the inorganic layer 3) is within the above range, the inorganic layer 3 has sufficient internal stress, thereby being able to suppress end wrinkles in the stack 1.

[0131] The ratio of the thickness (nm) of the resin film 2 to the thickness T2 (nm) of the cured resin layer 4 (thickness of the resin film 2 / T2) is, for example, 5.0 to 90.0, preferably 10.0 to 80.0, more preferably 15.0 to 70.0, further preferably 20.0 to 60.0, and particularly preferably 30.0 to 50.0.

[0132] The ratio of the thickness (nm) of the resin film 2 to the thickness T2 (nm) of the cured resin layer 4 (resin film thickness / T2) is, for example, greater than 5.0, preferably greater than 10.0, more preferably greater than 15.0, further preferably greater than 20.0, and particularly preferably greater than 30.0. In addition, for example, it is less than 90.0, preferably less than 80.0, more preferably less than 70.0, further preferably less than 60.0, and particularly preferably less than 50.0.

[0133] If the ratio of the thickness (nm) of the resin film 2 to the thickness T2 (nm) of the cured resin layer 4 (resin film thickness / T2) is within the above range, the end wrinkles in the laminate 1 can be suppressed by adjusting the thicknesses of the inorganic layer 3 and the cured resin layer 4.

[0134] 2. Method for manufacturing laminate

[0135] Next, refer to FIG. 3A to FIG. 3C The method for producing the laminate 1 will be described. The laminate 1 is produced, for example, in the roll-to-roll method as follows.

[0136] (Preparation process)

[0137] First, if Figure 3A As shown in the figure, a resin film 2 is prepared.

[0138] (Inorganic Material Layer Formation Step)

[0139] Then, if Figure 3B As shown, an inorganic layer 3 is formed on one side of the thickness direction of the resin film 2. Specifically, a first inorganic layer 31 is formed on one side of the thickness direction of the resin film 2, and then a second inorganic layer 32 is formed on one side of the thickness direction of the first inorganic layer 31, and then a third inorganic layer 33 is formed on one side of the thickness direction of the second inorganic layer 32.

[0140] The inorganic layer 3 (the first inorganic layer 31 , the second inorganic layer 32 , and the third inorganic layer 33 ) is formed by, for example, a dry coating method. Examples of the dry coating method include a sputtering method and a vapor deposition method, and preferably, a sputtering method is used.

[0141] The sputtering method uses, for example, a sputtering film forming device. The sputtering film forming device can implement the film forming process in a roll-to-roll manner. In the inorganic layer forming process, a long resin film 2 is used as a work film (the English name is work film), which is made to travel from a take-off roll to a winding roll, and each material is formed on one side of the thickness direction of the resin film 2 to form an inorganic layer. The travel speed of the work film is, for example, 0.5m / min to 10.0m / min.

[0142] It should be noted that in the sputtering method, either a sputtering film forming device with one film forming chamber or a sputtering film forming device with multiple film forming chambers sequentially arranged along the path of travel of the workpiece film can be used. In the process of forming the inorganic layer 3 (the first inorganic layer 31, the second inorganic layer 32, and the third inorganic layer 33), it is preferred to use a sputtering film forming device with multiple film forming chambers sequentially arranged along the path of travel of the workpiece film. By setting a series of processes for forming the first inorganic layer 31, the second inorganic layer 32, and the third inorganic layer 33 as a passline, the workpiece film will not be exposed to the atmosphere during the process. Therefore, the adhesion between the second inorganic layer 32 and the first inorganic layer 31 and the adhesion between the third inorganic layer 33 and the second inorganic layer 32 can be improved.

[0143] In the sputtering method, specifically, a sputtering gas (inert gas) is introduced into a film forming chamber of a sputtering film forming device under vacuum conditions, and a negative voltage is applied to a target arranged on a cathode in the film forming chamber. Thus, a glow discharge is generated, gas atoms are ionized, and the gas ions are made to collide with the target surface at high speed, and the target material is driven out from the target surface, so that the driven target material is deposited on the resin film 2.

[0144] Examples of the sputtering gas include argon, krypton, xenon, and mixed gases thereof, and preferably argon is used.

[0145] As the material of the target configured on the cathode in the film forming chamber, the above-mentioned metals, metal oxides, metal nitrides, metal carbides, and combinations thereof can be listed. Specifically, the target material used to form the first inorganic layer 31 can be, for example, a metal with light reflectivity, preferably aluminum (Al), silver (Ag), titanium (Ti), and their alloys, and more preferably aluminum (Al). In addition, the target material used to form the second inorganic layer 32 can be, for example, a combination of metal compounds and elemental metals, preferably a combination of metal oxides and elemental metals, and more preferably a combination of indium oxide and copper. Furthermore, the target material used to form the third inorganic layer 33 can be, for example, a metal oxide, and preferably indium tin oxide (ITO) is listed.

[0146] The gas pressure in the film forming chamber in film forming by sputtering (sputtering film forming) (the gas pressure in the film forming chamber when the sputtering gas is introduced) is, for example, 0.02 Pa to 1 Pa, preferably 0.1 Pa to 0.6 Pa. Examples of the power source for applying a voltage to the target include a DC power source, an AC power source, an MF power source, and an RF power source, and preferably a DC power source.

[0147] (Cured Resin Layer Formation Step)

[0148] Then, if Figure 3C As shown, a cured resin layer 4 is formed on the inorganic layer 3 (third inorganic layer 33). The cured resin layer 4 can be formed by applying the above-mentioned curable resin composition on the inorganic layer 3 to form a coating film and then curing the coating film. In the case where the curable resin composition contains an ultraviolet curable resin, the coating film is cured by ultraviolet irradiation. In the case where the curable resin composition contains a thermosetting resin, the coating film is cured by heating.

[0149] As described above, the laminated body 1 can be manufactured.

[0150] As described above, the laminate 1 comprises a resin film 2, a first inorganic layer 31 arranged on a surface on one side of the thickness direction of the resin film 2, a second inorganic layer 32 arranged on a surface on one side of the thickness direction of the first inorganic layer 31, a third inorganic layer 33 arranged on a surface on one side of the thickness direction of the second inorganic layer 32, and a cured resin layer 4 arranged on a surface on one side of the thickness direction of the third inorganic layer 33.

[0151] 3. Reflective film

[0152] Although not shown in the drawings, the reflective film includes, for example, the above-mentioned laminated body 1 , and is preferably composed of the above-mentioned laminated body 1 .

[0153] When the reflective film includes the above-described laminated body 1 , wrinkles at the end portions are suppressed and the reflectivity is excellent.

[0154] In addition, the reflective film may include an arbitrary layer other than the above-mentioned laminated body 1. As an arbitrary layer, an adhesive layer is mentioned, for example.

[0155] The reflective film including the above-described laminated body 1 is preferably used in a liquid crystal display device or the like.

[0156] (Effect)

[0157] In the laminate of the present invention, the thickness T1 of the inorganic layer is 110 nm to 1000 nm, and the ratio (T2 / T1) of the thickness T2 (nm) of the cured resin layer to the thickness T1 (nm) of the inorganic layer is 1.0 to less than 10. Therefore, wrinkles at the end can be suppressed.

[0158] Since the reflective film of the present invention includes the above-mentioned laminated body, wrinkles at the end portions can be suppressed.

[0159] [Example]

[0160] The following examples and comparative examples are shown to further specifically describe the present invention. It should be noted that the present invention is not limited to any examples and comparative examples. In addition, the specific numerical values ​​such as the mixing ratio (containing ratio), physical property values, and parameters used in the following description can be replaced by the upper limit (by the numerical value defined by "below", "less than") or the lower limit (by the numerical value defined by "above", "exceeding") of the corresponding recording of the mixing ratio (containing ratio), physical property values, and parameters recorded in the above-mentioned "specific embodiments".

[0161] Example 1

[0162] First, a white polyethylene terephthalate (PET) film (trade name: Lumirror E20, thickness: 38 μm, manufactured by Toray Industries, Inc.) was prepared as a base film.

[0163] Next, an inorganic layer is formed on one side of the thickness direction of the PET film by sputtering (sputtering film forming process). Specifically, a first inorganic layer, a second inorganic layer, and a third inorganic layer are formed in sequence. In the sputtering film forming process, a roll-to-roll sputtering film forming device (DC magnetron sputtering film forming device) is used. The sputtering film forming device includes a withdrawal chamber, a first film forming chamber, a second film forming chamber, a third film forming chamber, and a winding chamber. The withdrawal chamber includes a withdrawal roller. The roll of the above-mentioned substrate film is assembled on the withdrawal roller as a workpiece film. The winding chamber includes a winding roller that can wind the workpiece film. In the first film forming chamber, the second film forming chamber, and the third film forming chamber, the workpiece film is moved from the withdrawal chamber to the winding chamber in a roll-to-roll manner, and the film forming process can be implemented.

[0164] Specifically, in the sputtering film forming process, the first sputtering film forming in the first film forming chamber, the second sputtering film forming in the second film forming chamber, and the third sputtering film forming in the third film forming chamber are sequentially performed, and then the workpiece film (substrate film / first inorganic layer / second inorganic layer / third inorganic layer) is wound on the winding roller of the winding chamber. In the first sputtering film forming, a first inorganic layer (Al layer) with a thickness of 75nm is formed on one surface in the thickness direction of the PET film. Then, in the second sputtering film forming, a second inorganic layer (In layer) with a thickness of 25nm is formed on the first inorganic layer. 2 O 3 +Cu layer). Next, in the third sputtering film formation, a third inorganic layer (ITO layer) with a thickness of 20 nm is formed. The specific details of each sputtering film formation are as follows.

[0165] In the first sputtering film formation, after the sputtering film forming device (extraction chamber, first film forming chamber, second film forming chamber, third film forming chamber, winding chamber) is evacuated, argon (Ar) is introduced as a sputtering gas into the first film forming chamber, and the gas pressure in the first film forming chamber is set to 0.3-0.4 Pa. As a target, an Al target (manufactured by Mitsui Mining & Co., Ltd.) is used. As a power source for applying voltage to the target, a DC power source is used. The film forming temperature (the temperature of the substrate film for stacking the Al layer) is set to 40°C. The type of power source and the film forming temperature are the same in the second sputtering film formation and the third sputtering film formation.

[0166] In the second sputtering film formation, after the sputtering film formation device was evacuated, Ar was introduced as a sputtering gas into the second film formation chamber, and the gas pressure in the second film formation chamber was set to 0.3 to 0.4 Pa. In addition, as a target, indium oxide (In 2 O 3 ) and copper (Cu) mixed target (In 2 O 3 :Cu=81.2 mass %:18.8 mass %, manufactured by Mitsui Kinzoku Co., Ltd.) 2 O 3 +Cu layer refers to the use of indium oxide (In 2 O 3 ) and copper (Cu) mixed target layer.

[0167] In the third sputtering film formation, after the sputtering film formation device was evacuated, Ar was introduced as a sputtering gas into the third film formation chamber, and the gas pressure in the third film formation chamber was set to 0.3 to 0.4 Pa. In addition, as a target, an ITO target (a composite oxide of indium oxide and tin oxide, with a tin oxide concentration of 10% by mass, manufactured by Mitsui Mining & Co., Ltd.) was used.

[0168] Next, a curable resin composition was applied on the inorganic layer (specifically, the third inorganic layer) to form a coating. The curable resin composition contained an ultraviolet curable acrylic urethane resin (trade name: AICAAITRONZ844, manufactured by AICA Industries) and methyl ethyl ketone as a solvent. Next, after the coating was dried, the coating was cured by ultraviolet irradiation to form a cured resin layer with a thickness of 1 μm.

[0169] As described above, a laminate of Example 1 was prepared. The laminate of Example 1 comprises a substrate film (PET film, thickness 38 μm), a first inorganic layer (Al layer, thickness 75 nm), a second inorganic layer (In 2 O 3 +Cu layer, thickness 25nm), a third inorganic layer (ITO layer, thickness 20nm), and a cured resin layer (thickness 1μm) stacked structure.

[0170] Example 2

[0171] The laminated body of Example 2 was produced in the same manner as the laminated body of Example 1 except for the following matters. In the second sputtering film formation of the sputtering film formation process, the second inorganic layer (In 2 O 3 The thickness of the Cu layer (+Cu layer) was set to 50 nm, and the third sputtering film formation was not performed. That is, the cured resin layer was formed on the inorganic layer (specifically, the second inorganic layer). The laminate of Example 2 was composed of a substrate film (PET film, thickness 38 μm), a first inorganic layer (Al layer, thickness 75 nm), a second inorganic layer (In 2 O 3 +Cu layer, thickness 50nm), and a cured resin layer (thickness 1μm).

[0172] Example 3

[0173] The laminated body of Example 3 was produced in the same manner as the laminated body of Example 2 except for the following matters. In the second sputtering film formation of the sputtering film formation process, the thickness of the first inorganic layer (Al layer) formed was set to 125 nm, and in the second sputtering film formation, the thickness of the second inorganic layer (In layer) formed was set to 125 nm. 2 O 3 The thickness of the Cu layer (+Cu layer) was set to 100 nm, and the third sputtering film formation was not performed. That is, the cured resin layer was formed on the inorganic layer (specifically, the second inorganic layer). The laminate of Example 3 was composed of a substrate film (PET film, thickness 38 μm), a first inorganic layer (Al layer, thickness 125 nm), a second inorganic layer (In 2 O 3 +Cu layer, thickness 100nm), and a cured resin layer (thickness 1μm).

[0174] Example 4

[0175] The laminate of Example 4 was produced in the same manner as the laminate of Example 1 except for the following matters. In the second sputtering film formation of the sputtering film formation process, the thickness of the first inorganic layer (Al layer) formed was set to 300 nm, and in the second sputtering film formation, the thickness of the second inorganic layer (In layer) formed was set to 300 nm. 2 O 3 The thickness of the first inorganic layer (Al layer, thickness 300 nm), the second inorganic layer (In layer, thickness 300 nm), and the second inorganic layer (In layer, thickness 300 nm) were set to 25 nm. In other words, the cured resin layer was formed on the inorganic layer (specifically, the second inorganic layer). 2 O 3 +Cu layer, thickness 25nm), and a cured resin layer (thickness 1μm).

[0176] Comparative Example 1

[0177] The laminate of Comparative Example 1 was prepared in the same manner as the laminate of Example 1 except for the following matters. In the sputtering film forming process, the third sputtering film forming was not performed. That is, the cured resin layer was formed on the inorganic layer (specifically, the second inorganic layer). The laminate of Comparative Example 1 was composed of a substrate film (PET film, thickness 38 μm), a first inorganic layer (Al layer, thickness 75 nm), a second inorganic layer (In 2 O 3 +Cu layer, thickness 25nm), and a cured resin layer (thickness 1μm).

[0178] Comparative Example 2

[0179] The laminate of Comparative Example 2 was prepared in the same manner as the laminate of Example 1 except for the following matters. In the sputtering film forming process, the third sputtering film forming was not performed, and a cured resin layer with a thickness of 3 μm was formed on the inorganic layer (specifically, the second inorganic layer). The laminate of Comparative Example 2 was composed of a substrate film (PET film, thickness 38 μm), a first inorganic layer (Al layer, thickness 75 nm), a second inorganic layer (In 2 O 3 +Cu layer, thickness 25nm), and a cured resin layer (thickness 3μm).

[0180] Comparative Example 3

[0181] The laminate of Comparative Example 3 was produced in the same manner as the laminate of Example 1 except for the following matters. In the sputtering film forming process, the second sputtering film forming and the third sputtering film forming were not performed, and a cured resin layer with a thickness of 0.5 μm was formed on the first inorganic layer (Al layer). The laminate of Comparative Example 3 was a laminated structure of a base film (PET film, thickness 38 μm), a first inorganic layer (Al layer, thickness 75 nm), and a cured resin layer (thickness 0.5 μm).

[0182] Comparative Example 4

[0183] The laminate of Comparative Example 4 was prepared in the same manner as the laminate of Example 1 except for the following matters. A cured resin layer with a thickness of 3 μm was formed on the inorganic layer (specifically, the third inorganic layer). The laminate of Comparative Example 4 had a base film (PET film, thickness 38 μm), a first inorganic layer (Al layer, thickness 75 nm), a second inorganic layer (In 2 O 3 +Cu layer, thickness 25nm), a third inorganic layer (ITO layer, thickness 20nm), and a cured resin layer (thickness 3μm) stacked structure.

[0184] <Evaluation>

[0185] [Thickness of each layer]

[0186] The thickness of each layer (inorganic layer (specifically, the first inorganic layer, the second inorganic layer, and the third inorganic layer), and the cured resin layer) in the laminate of each embodiment and each comparative example was measured by observation using a field emission transmission electron microscope (FE-TEM). Specifically, first, a cross-sectional observation sample of the laminate of each embodiment and each comparative example was prepared by the FIB microsampling method. In the FIB microsampling method, a FIB device (trade name: FB2200, manufactured by Hitachi) was used, and the acceleration voltage was set to 10 kV. Next, the cross section of the laminate of the cross-sectional observation sample was observed by FE-TEM, and the thickness of the inorganic layer (specifically, the first inorganic layer, the second inorganic layer, and the third inorganic layer) and the cured resin layer were measured in the observed image. In this observation, a FE-TEM device (trade name: JEM-2800, manufactured by JEOL) was used, and the acceleration voltage was set to 200 kV. The results are shown in Table 1. It should be noted that in Table 1, the total thickness of the first inorganic layer, the second inorganic layer, and the third inorganic layer is recorded as the thickness T1 (nm) of the inorganic layer, and the thickness of the cured resin layer is recorded as T2 (nm). In addition, the ratio (T2 / T1) of the thickness T2 (nm) of the cured resin layer to the thickness T1 (nm) of the inorganic layer is calculated. The results are shown in Table 1.

[0187] [End wrinkles (appearance)]

[0188] The laminate of each embodiment and each comparative example was cut into 300 mm (width direction) × 1.5 m (flow direction (MD direction) of the work film (laminate)) to produce samples for end wrinkle evaluation. Next, the two ends of each sample for end wrinkle evaluation produced were held by hand in the long side direction (flow direction (MD direction) of the work film (laminate)) and hung in a manner such that the height difference between the center (the most drooping part) and the two ends of the sample for end wrinkle evaluation was about 30 cm. The state of the end of the suspended sample for end wrinkle evaluation was visually confirmed and evaluated according to the criteria shown below. The results are shown in Table 1.

[0189] {Benchmark}

[0190] A: No wrinkles were generated at the end.

[0191] B: Thin wrinkles are formed on the entire end portion, and the interval between them is about 50 mm.

[0192] C: Strong wrinkles are generated at the entire end, and the intervals between them are about 100 mm.

[0193] [Table 1]

[0194]

[0195] It should be noted that the above invention is provided as an exemplary embodiment of the present invention, but it is only an example and is not to be interpreted as limiting. Modifications of the present invention that are not doubtful to those skilled in the art are included in the claims.

[0196] Industrial Applicability

[0197] The laminate 1 of the present invention is preferably used for an antireflection film. Such an antireflection film is preferably used for a liquid crystal display device. Specifically, the antireflection film is used to suppress light leakage in the frame portion of a liquid crystal display device.

Claims

1. A laminate comprising a resin film, an inorganic layer, and a cured resin layer in this order toward one side in a thickness direction, The thickness T1 of the inorganic layer is greater than or equal to 110 nm and less than or equal to 1000 nm. The ratio of the thickness T2 of the cured resin layer to the thickness T1 of the inorganic layer, that is, T2 / T1, is greater than 1.0 and less than 10.0, wherein The units of the thickness T2 and the thickness T1 are nm.

2. The laminate according to claim 1, wherein The resin film has a thickness of 100 μm or less.

3. The laminate according to claim 1, wherein The inorganic layer includes at least one selected from the group consisting of a metal layer, a metal oxide layer, and a metal nitride layer.

4. The laminate according to claim 1, wherein The inorganic layer includes a first inorganic layer and a second inorganic layer in this order toward one side in the thickness direction.

5. The laminate according to claim 4, wherein The first inorganic layer is a metal layer, The second inorganic layer is a layer including a metal oxide and a single element metal.

6. The laminate according to claim 4, wherein The inorganic layer further includes a third inorganic layer disposed on one side in the thickness direction of the second inorganic layer.

7. The laminate according to claim 6, wherein: The third inorganic layer is a metal oxide layer.

8. The laminate according to claim 1, wherein The inorganic layer includes a blackened layer.

9. The laminate according to claim 1, wherein The thickness T2 of the cured resin layer is greater than 1000 nm. 10 . A reflective film comprising the laminate according to claim 1 .

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