Epoxy plastic packaging film for automobile-gauge-level chip and preparation method of epoxy plastic packaging film

Abstract

The invention relates to an epoxy plastic packaging film for a vehicle-gauge-level chip and a preparation method of the epoxy plastic packaging film. The epoxy plastic packaging film comprises a material and a solvent, the materials comprise the following components in parts by weight: 4.7-21.5 parts of special epoxy resin, 3-6 parts of fluorine-containing epoxy resin, 3-5 parts of organic silicon modified epoxy resin, 2-3 parts of low-viscosity epoxy resin, 10-15 parts of a curing agent, 0.1-0.5 part of an accelerant and 0.1-0.2 part of a defoaming agent; 0.2 to 0.3 part of a coupling agent and 0.1 to 0.3 part of a dispersing agent; 60 to 65 parts of powder filler; the total parts by weight of the materials are 100; the preparation method comprises the following steps: step S1, stirring and mixing the materials, and step S2, molding a glue solution. S3, curing the adhesive film; the epoxy plastic packaging film has the advantages of high Tg, high temperature resistance, low hygroscopicity, high reliability, low warpage and high stability and reliability.

Description

Technical Field

[0001] The present invention relates to the field of chip plastic packaging films, and in particular to an epoxy plastic packaging film for automotive-grade chips and a preparation method thereof. Background Art

[0002] With the development of science and technology, the development of chips plays a vital role in industrial innovation. At present, with the rise of new energy vehicles, the use and popularity of automotive chips are increasing exponentially. There are many differences between automotive chips, that is, automotive-grade chips and consumer chips. The main reason is that the use environment of automobiles is changeable and needs to adapt to various harsh natural environments and application scenarios, which puts higher requirements on the reliability of chips.

[0003] First, the temperature around the car engine needs to meet -40℃~150℃, and the passenger compartment requires -40℃~85℃, so automotive-grade chips need to have excellent temperature adaptability; secondly, the service life of general cars is designed to be 15 years or 200,000 kilometers, which also requires automotive chips to have outstanding reliability; vehicles need to be used in low-temperature and low-humidity areas, so chips also have strict requirements in terms of moisture and heat resistance. Epoxy resin film as a chip packaging material also requires high Tg, high temperature resistance, low moisture absorption, high reliability and low warping performance requirements, but traditional epoxy resin film is difficult to adapt to the use requirements of automotive-grade chips.

[0004] It should be noted that the information disclosed in the above background technology section is only used to enhance the understanding of the background of the present disclosure, and therefore may include information that does not constitute the prior art known to ordinary technicians in the field. Summary of the invention

[0005] In view of the deficiencies in the prior art, the present invention discloses an epoxy molding film for automotive-grade chips and a preparation method thereof.

[0006] The technical solution adopted by the present invention is as follows:

[0007] An epoxy plastic film for automotive-grade chips, comprising materials and solvents; the materials include components counted by weight: 4.7 to 21.5 parts of special epoxy resin, 3 to 6 parts of fluorine-containing epoxy resin, 3 to 5 parts of silicone-modified epoxy resin, 2 to 3 parts of low-viscosity epoxy resin, 10 to 15 parts of curing agent, 0.1 to 0.5 parts of accelerator, 0.1 to 0.2 parts of defoaming agent; 0.2 to 0.3 parts of coupling agent, 0.1 to 0.3 parts of dispersant; 60 to 65 parts of powder filler; a total of 100 parts of materials; 20 to 30 parts of the solvent.

[0008] Furthermore, the special epoxy resin is a trifunctional phenolic epoxy resin, and its epoxy equivalent is 150 to 180 g / eq.

[0009] Furthermore, the fluorinated epoxy resin is a fluorinated bisphenol A type epoxy resin, the epoxy equivalent of which is 190 to 230 g / eq, and the structural formula is shown in formula (1):

[0010]

[0011] Furthermore, the organosilicon-modified epoxy resin is a POSS-type caged polysilsesquioxane with an epoxy equivalent of 150 to 190 g / eq.

[0012] Furthermore, the POSS type caged polysilsesquioxane includes one of caged γ-glycidyloxypropyl silsesquioxane, octapoly(propyl glycidyl ether)silsesquioxane and octacyclohexylethyl caged polysilsesquioxane.

[0013] Furthermore, the low viscosity epoxy resin is a glycidyl ether, and the glycidyl ether includes castor oil triglycidyl ether (ERISYS GE-35), neopentyl glycol diglycidyl ether (ERISYS GE-20), and cyclohexanedimethanol diglycidyl ether (ARALDITE DY-C).

[0014] Furthermore, the curing agent is dicyclopentadiene phenol resin, and the hydroxyl equivalent is 180-220 g / eq.

[0015] Furthermore, the powder filler is spherical silicon dioxide, and the particle size of the spherical silicon dioxide ranges from 0.5 to 1.0 μm.

[0016] Furthermore, the accelerator is imidazole, and the imidazole is one of 2E4MZ, C11Z-A, 2MZA-PW, and 2-MI; the defoamer is one of BYK-A530, KS-603, BYK-066N, and Defom5300; the coupling agent is one of KBM-13, KBM-8603, and KBM-303; the dispersant is one of BYK-9011, BYK-163, BYK-9076, and TEGO Dispers685; the solvent is one of butanone, butyl acetate, ethylene glycol methyl ether, and propylene glycol methyl ether acetate, or a combination of two thereof.

[0017] A method for preparing an epoxy plastic film for an automotive-grade chip comprises the following steps:

[0018] Step S1, mixing the materials, putting the materials except the powder filler and the solvent into a planetary mixer in sequence for heating and stirring, the stirring temperature range is 65-80°C, the stirring time range is 2-3h, then the powder filler is added, stirring is continued for 1h, and the glue solution is obtained by filtering;

[0019] Step S2, forming the adhesive liquid, using a coating machine to process the adhesive liquid into an adhesive film, with a coating temperature range of 60 to 90° C., a coating speed range of 0.8 to 1.5 m / min, a coating tension of 50 to 60 N, and a film thickness of 50 to 150 μm;

[0020] Step S3, curing the adhesive film, adhering the adhesive film to the chip or substrate, and then curing it at a temperature of 120° C. for 1 to 2 hours, and then curing it at a temperature of 180° C. for 2 to 3 hours to complete the curing and shaping of the product.

[0021] The beneficial effects of the present invention are as follows:

[0022] 1. The film is made of trifunctional phenolic epoxy resin, which has a high benzene ring content and a high cross-linking density. It has excellent performance in temperature resistance, thermal properties, mechanical properties, etc., which greatly improves the comprehensive indicators of the product; silicone-modified epoxy resin has outstanding aging resistance and high temperature resistance, and is also flexible. Adding this raw material to the formula system can improve warping deformation and curing shrinkage; fluorinated epoxy resin and dicyclopentadiene phenol resin can enhance the moisture absorption effect of the product, and the introduction of a variety of special additives can produce a synergistic effect, further improving the comprehensive performance of the product.

[0023] 2. A combination of fluorinated epoxy resin and curing agent is used as dicyclopentadienol resin. The fluorinated polymer has outstanding hydrophobicity. The fluorinated epoxy resin is introduced into the formula system. The molecular chain of the product contains a large number of hydrophobic groups. The packaging material shows good moisture absorption resistance in a humid environment. Dicyclopentadienol resin, due to its strong non-polarity and weak interaction with water molecules, can prevent water molecules from entering the resin and reduce the absorption of water. In the process of resin curing, a tight cross-linking structure can be formed. The movement of the molecular chain segments is restricted, making it difficult for water molecules to diffuse and penetrate into the resin, thereby improving the hygroscopicity of the product and ultimately improving the hygroscopicity of the product.

[0024] 3. POSS caged polysilsesquioxane is a special structured reactive monomer that contains both multifunctional epoxy groups that can participate in chemical reactions and caged siloxanes. Caged siloxanes open the ring to form large molecular weight compounds that can offset the volume shrinkage caused by the polymerization reaction. By adjusting the proportion of POSS caged polysilsesquioxanes, a polymer with zero warping, no shrinkage, or even expansion can be obtained. Therefore, the use of POSS caged polysilsesquioxanes can solve the problem of warping and shrinkage.

[0025] 4. Imidazole latent plastic film has very low reactivity at 150-190℃, but the reaction proceeds smoothly at medium and high temperatures. Its function is to accelerate the chemical reaction of resin and curing agent and shorten the curing time. Selecting 150-190℃ that matches the polymerization system not only improves the curing efficiency, but also reduces the reaction enthalpy, effectively controls the heat released in the reaction, and can minimize the warping deformation of the cured product.

[0026] 5. The epoxy molding film is made into a roll or sheet, and the molding film is adhered to the chip or substrate through a vacuum laminating process, and then cured at medium and high temperatures to complete the chip packaging. First, the film material has high production efficiency, which can be automated on the assembly line to reduce labor input; second, the film material is selected compared with the traditional molding process, which greatly reduces equipment investment and operating costs and maximizes economic benefits; third, the film material fits tightly to the chip or substrate and can be cut according to the shape of the chip, with less waste of raw materials, reducing unnecessary losses and controlling production costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 This is a schematic diagram of the steps of a method for preparing an epoxy molding film for automotive-grade chips. DETAILED DESCRIPTION

[0028] The specific implementation of the present invention will be described below in conjunction with the accompanying drawings.

[0029] Embodiment 1:

[0030] An epoxy molding film for automotive-grade chips comprises a solute and a solvent.

[0031] The solute includes 14.6 parts of trifunctional phenolic epoxy resin SQTN-331, 4.5 parts of fluorinated bisphenol A epoxy resin, 3 parts of cage-type γ-glycidyl ether oxypropyl silsesquioxane, 2 parts of low-viscosity epoxy resin ERISYS GE-35, 10 parts of dicyclopentadiene phenol resin SH-7090, 0.3 parts of accelerator imidazole 2E4MZ, 0.2 parts of defoamer KS-603, 0.2 parts of coupling agent KBM-13, 0.2 parts of dispersant BYK-9011, and powder fillers include 45 parts of spherical silica NQ2110B and 20 parts of SC 2500-SXJ, totaling 100 parts of the above materials.

[0032] The solvent included 15 parts of butyl acetate and 5 parts of ethylene glycol methyl ether.

[0033] The epoxy equivalent of the trifunctional phenolic epoxy resin SQTN-331 is 150 g / eq.

[0034] The epoxy equivalent of the fluorinated bisphenol A epoxy resin is 190 g / eq, and its structural formula is shown in formula (1):

[0035]

[0036] The epoxy equivalent of dicyclopentadienol resin SH-7090 is 180 g / eq.

[0037] The particle size of spherical silica ranges from 0.5 to 1.0 μm.

[0038] Its preparation method, such as Figure 1 As shown, the following steps are included:

[0039] Step S1, stirring and mixing the materials, putting the materials except the powder filler and the solvent into a planetary mixer in turn for heating and stirring, the stirring temperature is 70°C, the stirring time is 2.5h, then the powder filler is added, stirred for 1h, and finally filtered to obtain a glue with good fluidity.

[0040] Step S2, processing the adhesive liquid into an adhesive film of specified thickness by a precision coating machine, controlling the temperature at 70-80°C, the coating speed at 1.2m / min, the tension at 55N, the thickness of the adhesive film at 110μm, and the obtained epoxy plastic film in the form of roll or sheet.

[0041] Step S3: The prepared epoxy plastic film is adhered to the chip or substrate by using a vacuum film lamination process, and then the product is cured at 120° C. for 1.5 hours and then cured at 180° C. for 2 hours.

[0042] Embodiment 2:

[0043] An epoxy molding film for automotive-grade chips comprises a solute and a solvent.

[0044] The solute includes 15.45 parts of trifunctional phenolic epoxy resin EPPN-501H, 3 parts of fluorine-containing epoxy resin, 5 parts of octapoly(propyl glycidyl ether)silsesquioxane, 2.5 parts of cyclohexanedimethanol diglycidyl ether ARALDITE DY-C, 13 parts of curing agent dicyclopentadiene phenol resin SH-7110, 0.5 parts of accelerator imidazole C11Z-A, 0.15 parts of defoaming agent BYK-066N, 0.3 parts of coupling agent KBM-8603, 0.1 parts of dispersant BYK-9076, 45 parts of powder filler spherical silica SE015X and 15 parts of DQ005, totaling 100 parts.

[0045] The solvent included 20 parts of butyl acetate and 10 parts of propylene glycol methyl ether acetate.

[0046] The epoxy equivalent of the trifunctional phenolic epoxy resin SQTN-331 is 160 g / eq.

[0047] The fluorinated epoxy resin is a fluorinated bisphenol A type epoxy resin, with an epoxy equivalent of 210 g / eq and a structural formula as shown in formula (1):

[0048]

[0049] The preparation method thereof comprises the following steps:

[0050] Step S1, stirring and mixing the materials, putting the materials except the powder filler and the solvent into a planetary mixer in sequence for heating and stirring, the stirring temperature is 80°C, the stirring time is 2h, then the powder filler is added, stirred for 1h, and finally filtered to obtain a glue with good fluidity.

[0051] Step S2, the glue liquid is processed into a glue film of specified thickness by a precision coating machine, the temperature is controlled at 70-90°C, the coating speed is 1.0m / min, the tension is 50N, the thickness of the glue film is 150μm, and the prepared epoxy plastic film is presented in the form of roll or sheet.

[0052] Step S3: The prepared epoxy plastic film is adhered to the chip or substrate by a vacuum film lamination process, and then the product is cured at 120° C. for 2 hours and then at 180° C. for 1 hour.

[0053] Embodiment 3:

[0054] An epoxy molding film for automotive-grade chips comprises a solute and a solvent.

[0055] The solute includes 8.3 parts of special epoxy resin SQTN-333, 6 parts of fluorine-containing epoxy resin, 4 parts of octaepoxycyclohexylethyl caged polysilsesquioxane, 3 parts of low viscosity epoxy resin ERISYS GE-20, 15 parts of curing agent dicyclopentadiene phenol resin SH-7117, 0.1 parts of accelerator imidazole 2MZA-PW, 0.1 parts of defoamer Defom5300, 0.2 parts of coupling agent KBM-303, 0.3 parts of dispersant BYK-163, and 43 parts of powder filler spherical silica NQ2110B and 20 parts of NQ1040G.

[0056] The solvent included 15 parts of methyl ethyl ketone and 10 parts of ethylene glycol methyl ether.

[0057] The preparation method comprises the following steps:

[0058] Step S1, stirring and mixing the materials, putting the materials except the powder filler and the solvent into a planetary mixer in sequence, heating and stirring, the stirring temperature is 65°C, the stirring time is 3h, then the powder filler is added, stirred for 1h, and finally filtered to obtain a glue with good fluidity.

[0059] Step S2, the glue liquid is processed into a glue film of specified thickness by a precision coating machine, the temperature is controlled at 60-80°C, the coating speed is 0.8m / min, the tension is 60N, the thickness of the glue film is 150μm, and the prepared epoxy plastic film is presented in the form of roll or sheet.

[0060] Step S3: The prepared epoxy plastic film is adhered to the chip or substrate by a vacuum film lamination process, and then the product is cured at 120° C. for 1 hour, and then cured at 180° C. for 3 hours.

[0061] Embodiment 4:

[0062] An epoxy molding film for automotive-grade chips comprises a solute and a solvent.

[0063] The solute includes 16.7 parts of trifunctional phenolic epoxy resin SQTN-331, 5 parts of fluorinated bisphenol A epoxy resin, 3.5 parts of cage-type γ-glycidyl ether oxypropyl silsesquioxane, 2 parts of low viscosity epoxy resin ERISYS GE-20, 12 parts of dicyclopentadiene phenol resin SH-7110, 0.2 parts of accelerator imidazole 2-MI, 0.1 parts of defoamer TEGO Dispers 685, 0.3 parts of coupling agent KBM-303, 0.2 parts of dispersant B-163, and powder fillers include 30 parts of spherical silica NQ2110B and 30 parts of NQ005, totaling 100 parts of the above materials.

[0064] The solvent included 12 parts of methyl ethyl ketone and 8 parts of ethylene glycol methyl ether.

[0065] The epoxy equivalent of the trifunctional phenolic epoxy resin SQTN-331 is 150 g / eq.

[0066] The epoxy equivalent of the fluorinated bisphenol A epoxy resin is 190 g / eq, and its structural formula is shown in formula (1):

[0067]

[0068] The epoxy equivalent of dicyclopentadienol resin SH-7110 is 180 g / eq.

[0069] The particle size of spherical silica ranges from 0.5 to 1.0 μm.

[0070] Its preparation method, such as Figure 1 As shown, the following steps are included:

[0071] Step S1, stirring and mixing the materials, putting the materials except the powder filler and the solvent into a planetary mixer in sequence, heating and stirring, the stirring temperature is 75°C, the stirring time is 3h, then the powder filler is added, stirred for 1h, and finally filtered to obtain a glue with good fluidity.

[0072] Step S2, the glue liquid is processed into a glue film of specified thickness by a precision coating machine, the temperature is 60-70°C, the coating speed is 1.3m / min, the tension is 55N, the thickness of the glue film is 130μm, and the prepared epoxy plastic film is presented in the form of roll or sheet.

[0073] Step S3: The prepared epoxy plastic film is adhered to the chip or substrate by a vacuum film lamination process, and then the product is cured at 120° C. for 2 hours, and then cured at 180° C. for 2.2 hours.

[0074] Product performance test:

[0075] Samples were randomly selected from the products of Examples 1 to 4 for testing. The test results are shown in Table 1.

[0076] Table 1 Performance test table of epoxy plastic film for automotive grade chips

[0077]

[0078] Test result analysis:

[0079] Among the samples of Examples 1 to 4, the shear strength of the three is higher than 13MPa, and the elastic modulus is lower than 15MPa, which proves that the products have both rigidity and toughness. The glass transition temperature is higher than 190℃, and the linear expansion coefficient ɑ1 is less than 15ppm / K; the weight loss ratio after baking at 200℃ / 72h is less than 3%, the curing shrinkage is not higher than 0.3%, and the warpage deformation is less than 2%. In addition, the samples performed well in the PCT test and the hot and cold shock test, and the performance indicators were good.

[0080] Among them, Example 1 has good comprehensive performance and moderate cost performance. Example 2 has a higher glass transition temperature and high reliability. Example 3 has the best effect in terms of moisture and heat resistance. Example 4 has good performance in terms of deformation and warpage.

[0081] Comparative experiment:

[0082] Comparative Example 1: Keeping other raw materials unchanged, the special epoxy resin SQTN-331 in Example 1 was replaced with bisphenol A epoxy resin E-51, the ratio of epoxy resin to curing agent was adjusted to ensure that the equivalent ratio was 1:1, and epoxy plastic film was prepared. The performance of the product was tested. The results are shown in Table 2.

[0083] From the data in Table 2, it can be seen that replacing the epoxy resin SQTN-331 with E-51 will cause significant changes in the performance of the product, mainly in terms of mechanical properties, thermal properties, and reliability. SQTN-331 is a trifunctional epoxy resin. After curing, the polymer has a large crosslinking density and multiple network structures, which greatly improves the performance of the product. E-51 is a difunctional epoxy resin. In comparison, the crosslinking density of the polymer is small. Therefore, the glass transition temperature of Comparative Example 1 is reduced, the temperature resistance is reduced, and the performance of the hot and cold shock test is poor. It can be seen that the main resin SQTN-331 used in the present invention plays an irreplaceable role in the formulation system.

[0084] Comparative Example 2:

[0085] Keeping other raw materials unchanged, the fluorine-containing epoxy resin in Example 1 was replaced with epoxy resin SQTN-331, and the ratio of epoxy resin to curing agent was adjusted to ensure that the equivalent ratio was 1:1, and epoxy plastic films were prepared to test the performance of the product.

[0086] Fluorinated epoxy resin has low surface energy and hydrophobic properties. The introduction of this structural unit can improve the product's resistance to moisture absorption. The results in Table 2 show that the use of trifunctional SQTN-331 to replace fluorinated epoxy resin enhances the rigidity of the formulation system, increases the glass transition temperature of the product to 201.3°C, and improves the mechanical properties, but the PCT water absorption rate increases to 0.89%. This shows that fluorinated epoxy resin performs well in reducing water absorption, and the purpose of improving the moisture absorption effect is achieved by adding fluorinated epoxy resin.

[0087] Comparative Example 3:

[0088] Keeping other raw materials unchanged, the cage-type γ-glycidyloxypropyl silsesquioxane in Example 1 was replaced with epoxy resin SQTN-331, and the ratio of epoxy resin to curing agent was adjusted to ensure that the equivalent ratio was 1:1, and epoxy plastic films were prepared to test the performance of the product.

[0089] POSS cage-like polysilsesquioxane has a special structure, with multiple reactive epoxy groups and cage-like siloxane groups, and has both rigidity and flexibility. The presence of silicon-oxygen bonds improves the temperature resistance of the product, as evidenced by the results in Table 2. The glass transition temperature of Comparative Example 3 is 223.7°C, and the thermal shock test is 165 cycles, which is the result of the product losing its flexibility; the temperature resistance of the product is greatly deteriorated to 6.23%, and the curing shrinkage rate increases to 0.93%, which shows that the siloxane structural unit can improve the temperature resistance and warpage deformation of the product, and this raw material plays an important role in the formulation system.

[0090] Comparative Example 4:

[0091] Keeping other raw materials unchanged, the special coupling agent KBM-13 in Example 1 was replaced with the conventional coupling agent KH-560 to prepare epoxy plastic films, and the performance of the products was tested.

[0092] The coupling agent has two functions in the epoxy resin system: one is to improve the dispersion effect of the epoxy resin and the powder filler, and the other is to enhance the adhesion of the epoxy resin and the bonding interface. Some coupling agents with special structures have a good hydrophobic effect and are outstanding in terms of moisture absorption resistance. KBM-13 used in the present invention is a typical representative. When KBM-13 is replaced by KH-560, the PCT water absorption rate of the product is increased from 0.18% to 0.55%, and the moisture absorption effect is deteriorated. Therefore, the present invention preferably uses KBM-13 as a coupling agent.

[0093] Comparative Example 5:

[0094] Keeping other raw materials unchanged, the curing agent SH-7090 in Example 1 was replaced with linear phenol formaldehyde resin PF8011, and the ratio of epoxy resin to curing agent was adjusted to ensure that the equivalent ratio was 1:1, and epoxy plastic films were prepared to test the performance of the products.

[0095] Curing agent is an important component of epoxy resin. Selecting appropriate curing agent can not only improve the comprehensive performance of product, but also be closely related to the use effect of product. The present invention selects dicyclopentadiene phenol resin as curing agent. Different from linear phenol formaldehyde resin, SH-7090 has more dicyclopentadiene structural units, and has good performance in water absorption and reliability. PF8011 is used to replace SH-7090, and the PCT water absorption rate of product is increased to 0.73%, and the result of hot and cold shock test is 225 cycles, which fully illustrates the beneficial effect of the present invention selecting SH-7090 as curing agent.

[0096] Table 2 Comparative test of epoxy plastic film for automotive grade chips

[0097]

[0098] In summary, the present invention uses special epoxy resin, fluorine-containing epoxy resin, silicone-modified epoxy resin POSS caged polysilsesquioxane, dicyclopentadienol resin, spherical silica, and necessary auxiliary agents, and cooperates with a reasonable processing technology to prepare a series of epoxy plastic films with excellent comprehensive performance, which are suitable for automotive-grade chip packaging. The films have outstanding substantial characteristics and solve the current technical problems in the industry.

[0099] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0100] The above-mentioned embodiments only express several implementation methods of the present invention, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the invention patent. It should be pointed out that, for ordinary technicians in this field, several variations and improvements can be made without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention shall be subject to the attached claims.

Claims

1. An epoxy plastic film for automotive-grade chips, characterized in that: Including materials and solvents; The material includes the following components counted by weight: 4.7-21.5 parts of special epoxy resin, 3-6 parts of fluorine-containing epoxy resin, 3-5 parts of organosilicon-modified epoxy resin, 2-3 parts of low-viscosity epoxy resin, 10-15 parts of curing agent, 0.1-0.5 parts of accelerator, 0.1-0.2 parts of defoaming agent, 0.2-0.3 parts of coupling agent, 0.1-0.3 parts of dispersant, 60-65 parts of powder filler, and a total of 100 parts of the material; The solvent is 20 to 30 parts.

2. The epoxy molding film for automotive-grade chips according to claim 1, characterized in that: The special epoxy resin is a trifunctional phenolic epoxy resin with an epoxy equivalent of 150 to 180 g / eq.

3. The epoxy molding film for automotive-grade chips according to claim 1, characterized in that: The fluorine-containing epoxy resin is a fluorinated bisphenol A type epoxy resin, and its epoxy equivalent is 190 to 230 g / eq, and its structural formula is shown in formula (1):

4. The epoxy molding film for automotive-grade chips according to claim 1, characterized in that: The organosilicon-modified epoxy resin is a POSS-type cage-like polysilsesquioxane with an epoxy equivalent of 150 to 190 g / eq.

5. The epoxy molding film for automotive-grade chips according to claim 4, characterized in that: The POSS type caged polysilsesquioxane includes one of caged γ-glycidyloxypropylsilsesquioxane, octapoly(propylglycidyl)silsesquioxane and octaepoxycyclohexylethyl caged polysilsesquioxane.

6. The epoxy molding film for automotive-grade chips according to claim 1, characterized in that: The low viscosity epoxy resin is a glycidyl ether, and the glycidyl ether includes castor oil triglycidyl ether (ERISYS GE-35), neopentyl glycol diglycidyl ether (ERISYS GE-20), and cyclohexanedimethanol diglycidyl ether (ARALDITE DY-C).

7. The epoxy molding film for automotive-grade chips according to claim 1, characterized in that: The curing agent is dicyclopentadiene phenol resin, and the hydroxyl equivalent is 180-220 g / eq.

8. The epoxy molding film for automotive-grade chips according to claim 1, characterized in that: The powder filler is spherical silicon dioxide, and the particle size of the spherical silicon dioxide ranges from 0.5 to 1.0 μm.

9. The epoxy molding film for automotive-grade chips according to claim 1, characterized in that: The accelerator is imidazole, and the imidazole is one of 2E4MZ, C11Z-A, 2MZA-PW, and 2-MI; the defoamer is one of BYK-A530, KS-603, BYK-066N, and Defom5300; the coupling agent is one of KBM-13, KBM-8603, and KBM-303; the dispersant is one of BYK-9011, BYK-163, BYK-9076, and TEGO Dispers 685; and the solvent is one of butanone, butyl acetate, ethylene glycol methyl ether, and propylene glycol methyl ether acetate, or a combination of two thereof.

10. A method for preparing an epoxy plastic film for automotive-grade chips according to any one of claims 1 to 9, characterized in that: The following steps are involved: Step S1, mixing the materials, putting the materials except the powder filler and the solvent into a planetary mixer in sequence for heating and stirring, the stirring temperature range is 65-80°C, the stirring time range is 2-3h, then the powder filler is added, stirring is continued for 1h, and the glue solution is obtained by filtering; Step S2, forming the adhesive liquid, using a coating machine to process the adhesive liquid into an adhesive film, with a coating temperature range of 60 to 90° C., a coating speed range of 0.8 to 1.5 m / min, a coating tension of 50 to 60 N, and a film thickness of 50 to 150 μm; Step S3, curing the adhesive film, adhering the adhesive film to the chip or substrate, and then curing it at a temperature of 120° C. for 1 to 2 hours, and then curing it at a temperature of 180° C. for 2 to 3 hours to complete the curing and shaping of the product.

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