VCSEL chip metal etching equipment

Abstract

The invention discloses VCSEL (Vertical Cavity Surface Emitting Laser) chip metal etching equipment, and relates to the technical field of chip metal etching equipment. Comprising a main machine box, a soaking pool, a soaking assembly, a lifting driving assembly, a cover plate and an air suction grid, the lifting driving assembly is used for driving the soaking assembly to move up and down and rotate, and therefore wafers are driven to be soaked or rotate. Through stretching of the fan blade rings, the stirring fan blades can stir the etching liquid in the state of stretching out of the fan blade grooves, it is ensured that the etching liquid around a wafer flows uniformly, the contact between the surface of the wafer and the etching liquid is more uniform, and local over-etching or under-etching is prevented; and when the wafers are fed, the stirring fan blades retract into the fan blade grooves, so that the wafers are prevented from being blocked or scratched by the stirring fan blades during feeding. According to the wafer clamping protection device, the spring telescopic rods are arranged, wafer damage caused by too large clamping force is avoided through self contraction of the spring telescopic rods, the flexible pressing strips are made of flexible materials, scratching between the flexible pressing strips and the wafer is prevented, and double clamping protection on the wafer is achieved.

Description

Technical Field

[0001] The invention relates to the technical field of chip metal etching equipment, in particular to a VCSEL chip metal etching equipment. Background Art

[0002] In the fields of semiconductor manufacturing, microelectronics, metal surface treatment, etc., wet etching is a key surface treatment technology and is widely used in processes such as removing thin films, patterning metals, cleaning, and removing photoresists. The wet etcher mainly immerses the workpiece (such as wafers, metal substrates, etc.) in a chemical solution containing corrosive agents and uses chemical reactions to accurately remove materials to achieve the desired processing effect. At present, wet etching equipment is also used in the production of VCSEL chips.

[0003] As a type of wet etching machine, the immersion wet etcher has become a commonly used equipment in industrial production. However, in the long-term use process, the existing immersion etcher still has many technical bottlenecks. For example, it is difficult to control the uniformity of etching during the immersion process, and it is easy to over-etch or under-etch. Especially in batch production, the accuracy of etching is difficult to control. In addition, during the etching process, the fixation of the wafer and the dynamic control of the etching solution temperature are also important issues that affect the etching quality and efficiency of the etcher at this stage. Summary of the invention

[0004] The object of the present invention is to provide a VCSEL chip metal etching device to solve the problems raised in the prior art.

[0005] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a VCSEL chip metal etching device, comprising a main box, a immersion pool is provided in the main box, a cover plate is installed on the immersion pool, a lifting drive assembly is installed on the main box, a immersion assembly is rotatably installed on the lifting drive assembly, the immersion assembly corresponds to the position of the immersion pool, an air intake grille is provided on the main box, a transparent baffle is provided on the main box, an infusion device is installed in the main box, the infusion device is connected to the immersion pool, and an exhaust device is installed in the main box.

[0006] A control system is installed in the main box, which is used to control the entire etching equipment; the exhaust device is used to make the suction grille generate negative pressure suction, so as to absorb the vaporized etching liquid; the infusion device is used to input the etching liquid into the immersion tank; the transparent baffle is used to shield the etching area to prevent the etching liquid from splashing and the vaporized etching liquid from spreading; the main box is also equipped with a loading and unloading device, which is used to place the pre-treated wafers on the immersion component, or to remove the etched wafers from the immersion component.

[0007] Furthermore, the lifting drive assembly includes a first electric telescopic rod, which is installed on the main box, a first connecting piece is installed on the output shaft of the first electric telescopic rod, an immersion assembly is rotatably installed on the first connecting piece, a driving motor is installed on the first connecting piece, and the output shaft of the driving motor is connected to the immersion assembly.

[0008] After the wafer is clamped and fixed, the output shaft of the first electric telescopic rod of the control system extends, and the output shaft of the first electric telescopic rod drives the entire immersion component to sink into the immersion pool filled with etching liquid through the first connecting piece. The control system turns on the drive motor, and the output shaft of the drive motor drives the immersion component to rotate. The immersion component drives the wafer to rotate in the etching liquid. The extended stirring fan stirs the etching liquid to ensure that the etching liquid around the wafer flows evenly, so that the contact between the wafer surface and the etching liquid is more uniform, and local over-etching or under-etching is prevented. After the etching is completed, the control system repeats the previous operation in reverse to reset the lifting drive component and the immersion component. Finally, the wafer is taken out using the loading and unloading device, thereby completing the batch etching of the wafer.

[0009] Furthermore, the immersion component includes a bracket assembly, a plurality of fixed rings are installed on the bracket assembly, a fan ring is slidably installed on the fixed ring, a clamping drive assembly is installed on the bracket assembly, the clamping drive assembly is slidably connected to the fixed ring, an automatic temperature control assembly is installed on the fixed ring, the bracket assembly is rotatably connected to the first connecting piece, and the bracket assembly is connected to the output shaft of the drive motor.

[0010] Furthermore, the bracket assembly includes a connecting plate, a second end plate is installed at one end of the connecting plate, a second electric telescopic rod is installed on the second end plate, the output shaft of the second electric telescopic rod is connected to the clamping drive assembly, a first end plate is installed at the other end of the connecting plate, the first end plate and the second end plate are both rotatably connected to the first connecting member, the first end plate and the second end plate are both connected to the output shaft of the drive motor, and a fixing ring is installed on the connecting plate.

[0011] Furthermore, a blade groove is provided on the fixed ring, an engaging groove is provided on the fixed ring, a sliding hole is provided on the fixed ring, a second connecting member is installed on the fixed ring, a transmission gear is rotatably installed on the second connecting member, and a bracket is symmetrically installed on the fixed ring.

[0012] Furthermore, the fan ring includes a ring plate, on which a plurality of stirring fan blades are installed, the ring plate is provided with a transmission block, the transmission block is provided with a second transmission tooth, the transmission block is slidably connected with the engaging groove, the transmission block is meshed with the transmission gear through the second transmission tooth, and the stirring fan blade is slidably connected with the fan blade groove.

[0013] Furthermore, the clamping drive assembly includes a transmission plate, which is connected to the output shaft of the second electric telescopic rod. Transmission rods are symmetrically installed on the transmission plate. The transmission rods pass through a plurality of sliding holes. The transmission rods are slidingly connected to the fixed ring through the sliding holes. A plurality of clamping assemblies are installed on the transmission rod. The transmission rod is provided with a first transmission tooth, which is meshed with the transmission gear for transmission. The clamping assembly corresponds to the position of the fixed ring.

[0014] The control system controls the loading and unloading device to vertically place the pre-processed wafer on the bracket of the fixed ring, so that the surface of the wafer to be etched faces the direction of the first end plate. During this period, the stirring blade retracts in the blade groove to prevent the wafer from being blocked or scratched by the stirring blade when loading. After that, the second electric telescopic rod is started, and the output shaft of the second electric telescopic rod drives the transmission plate to retract. The transmission plate drives the clamping assembly to retract through the transmission rod. The clamping plate drives the flexible pressure strip to retract through the spring telescopic rod. The flexible pressure strip approaches the fixed ring and cooperates with the fixed ring to clamp and fix the edges of several wafers. When the clamping force is too large, the spring telescopic rod can shrink itself to avoid the clamping force acting entirely on the wafer and causing damage to the wafer. The flexible pressure strip is made of flexible material to prevent it from scratching the wafer.

[0015] When the transmission rod drives the clamping assembly to retract, it synchronously drives the transmission gear to rotate through the first transmission tooth on it, and the transmission gear drives the transmission block on the other side to slide linearly, and the transmission block drives the entire blade ring to slide, so that the stirring blades on the blade ring gradually pass through and extend out of the blade groove from the initial state of being contracted in the blade groove, and change to the stirring state. At this time, the ring piece is in contact with the fixed ring, and the transmission block is embedded in the engaging groove.

[0016] Furthermore, the clamping assembly includes a clamping plate, which is mounted on the transmission rod, a spring telescopic rod is mounted on the clamping plate, a flexible pressure strip is mounted on the spring telescopic rod, and the flexible pressure strip is made of flexible material.

[0017] Furthermore, the automatic temperature control component includes a heat-conducting shell, which is installed on a fixed ring, an expansion shell is installed inside the heat-conducting shell, a piston bent rod is slidably installed inside the expansion shell, an expansion medium is filled between the piston bent rod and the expansion shell, a sliding contact is installed on the piston bent rod, a heating column is installed in the heat-conducting shell, a fixed contact is installed at one end of the heating column, and the sliding contact is slidably connected to the heating column.

[0018] After the immersion component enters the immersion tank, the automatic temperature control component is immersed in the etching liquid. The temperature of the etching liquid is conducted to the expansion shell through the conduction shell. The expansion medium in the expansion shell expands or contracts after heat exchange with the outside. When the external temperature is low, the expansion medium releases heat and contracts, the piston rod retracts, and the piston rod drives the sliding contact to slide away from the fixed contact on the heating column. At this time, when the power is turned on, the effective conductive length of the heating column becomes longer and the resistance increases. According to Ohm's law, the heat generated by the heating column increases at this time. Since the automatic temperature control component rotates with the immersion component, the heating column will evenly heat the etching liquid around the wafer, thereby ensuring the etching speed; when the external temperature is high, the expansion medium absorbs heat and expands, pushing the piston rod to extend, and the piston rod drives the sliding contact to slide toward the fixed contact on the heating column. At this time, when the power is turned on, the effective conductive length of the heating column decreases. According to Ohm's law, the heat generated by the heating column decreases at this time, preventing the heating column from overheating the surrounding etching liquid, causing the etching liquid to denature or volatilize.

[0019] Furthermore, a first terminal is provided on the sliding contact, a second terminal is provided on the fixed contact, the heating column is made of high resistance material, the piston bending rod is made of insulating material, the fixed contact and the sliding contact are made of conductive material, and the expansion medium is a medium with a high thermal expansion coefficient.

[0020] The first terminal and the second terminal are connected to a power source through a wire. Since the heating column is made of a high-resistance material, the heating column generates heat after power is turned on.

[0021] Compared with the prior art, the present invention has the following beneficial effects:

[0022] 1. The second electric telescopic rod is used to drive the clamping assembly on the transmission rod to retract, so that the clamping assembly can clamp the wafers in batches. While the transmission rod drives the clamping assembly to retract, the transmission gear is synchronously driven to rotate through the first transmission tooth thereon. The transmission gear drives the stirring blades on the blade ring to pass through the blade groove to extend the stirring blades. The function of synchronously completing the batch clamping of the wafers and extending the stirring blades into place is achieved through one component of the transmission rod, which saves components and makes the structure simpler and more efficient.

[0023] 2. The expansion medium in the automatic temperature control component is used to exchange heat with the outside. Through the expansion and contraction of the expansion medium, the piston bending rod automatically drives the sliding contact to slide on the heating column. When the external temperature is low, the heating value of the heating column increases, and the etching liquid around the wafer is evenly heated, thereby ensuring the etching speed; when the external temperature is low, the heating value of the heating column decreases, preventing the heating column from overheating the surrounding etching liquid, causing the etching liquid to denature or volatilize; ultimately, dynamic adjustment of the etching liquid temperature around the wafer is achieved.

[0024] 3. By setting a spring telescopic rod and utilizing its own contraction, damage to the wafer caused by excessive clamping force can be avoided. The flexible pressure strip is made of flexible material to prevent scratches between it and the wafer, thereby achieving double clamping protection for the wafer.

[0025] 4. Use the lifting drive assembly to drive the immersion assembly to move up and down and rotate, thereby driving the wafer to immerse or rotate. Through the expansion and contraction of the fan ring, the stirring fan blade can stir the etching liquid while extending out of the fan blade groove, ensuring that the etching liquid around the wafer flows evenly, making the contact between the wafer surface and the etching liquid more even, and preventing partial over-engraving or under-engraving; when the wafer is loaded, the stirring fan blade retracts into the fan blade groove to prevent the wafer from being blocked or scratched by the stirring fan blade during loading, thereby protecting the wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 It is an overall stereogram of the etching device of the present invention;

[0027] Figure 2 A three-dimensional diagram of the lifting drive assembly of the present invention;

[0028] Figure 3 is a three-dimensional diagram of the soaking assembly of the present invention;

[0029] Figure 4 A three-dimensional diagram of the automatic temperature control assembly of the present invention;

[0030] Figure 5 A three-dimensional diagram of a clamping drive assembly of the present invention;

[0031] Figure 6 For the present invention Figure 5 A partial enlarged view of the middle A area;

[0032] Figure 7 For the present invention Figure 5 A partial enlarged view of the middle B area;

[0033] Figure 8 It is a stereoscopic diagram of the fixing ring and the sector ring of the present invention;

[0034] Fig. 9 For the present invention Figure 6 A partial enlarged view of the middle C area;

[0035] Fig.10 is a three-dimensional diagram of the sector ring of the present invention;

[0036] Fig.11 The three-dimensional structure of the fixing ring of the present invention Figure 1 ;

[0037] Fig.12 The three-dimensional structure of the fixing ring of the present invention Figure 2 .

[0038] In the figure: 1, main box; 2, immersion tank; 3, immersion assembly; 4, lifting drive assembly; 5, cover plate; 6, air intake grille; 41, first electric telescopic rod; 42, first connecting piece; 43, drive motor; 31, bracket assembly; 32, fixing ring; 33, clamping drive assembly; 34, fan ring; 35, automatic temperature control assembly; 351, heat-conducting shell; 352, expansion shell; 353, piston bent rod; 354, sliding contact; 355, heating column; 356, fixed contact; 3541, first terminal; 3561, second terminal; 331, transmission plate; 332, transmission rod; 333, clamping assembly; 3321, first transmission tooth; 321, blade groove; 322, sliding hole; 323, bracket; 324, fitting groove; 325, transmission gear; 326, second connecting member; 341, ring plate; 342, stirring blade; 343, transmission block; 3431, second transmission tooth; 3331, clamping plate; 3332, spring telescopic rod; 3333, flexible pressure strip; 311, second electric telescopic rod; 312, connecting plate; 313, first end plate; 314, second end plate. DETAILED DESCRIPTION

[0039] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0040] like Figure 1-Figure 12 As shown, the present invention provides a technical solution for VCSEL chip metal etching equipment: comprising a main box 1, a soaking pool 2 is provided in the main box 1, a cover plate 5 is installed on the soaking pool 2, a lifting drive assembly 4 is installed on the main box 1, a soaking assembly 3 is rotatably installed on the lifting drive assembly 4, the soaking assembly 3 corresponds to the soaking pool 2 in position, an air intake grille 6 is provided on the main box 1, a transparent baffle is provided on the main box 1, an infusion device is installed in the main box 1, the infusion device is connected to the soaking pool 2, and an exhaust device is installed in the main box 1.

[0041] A control system is provided in the main box 1, which is used to control the entire etching equipment; the exhaust device is used to make the suction grille 6 generate negative pressure suction, thereby sucking out the vaporized etching liquid; the infusion device is used to input the etching liquid into the immersion tank 2; the transparent baffle is used to shield the etching area to prevent the etching liquid from splashing and the vaporized etching liquid from spreading; the main box 1 is also equipped with a loading and unloading device, which is used to place the pre-treated wafer on the immersion component 3, or to remove the etched wafer from the immersion component 3.

[0042] The lifting drive assembly 4 includes a first electric telescopic rod 41, which is installed on the main box 1. A first connecting member 42 is installed on the output shaft of the first electric telescopic rod 41, and an immersion assembly 3 is rotatably installed on the first connecting member 42. A driving motor 43 is installed on the first connecting member 42, and the output shaft of the driving motor 43 is connected to the immersion assembly 3.

[0043] The immersion component 3 includes a bracket component 31, a plurality of fixed rings 32 are installed on the bracket component 31, a fan ring 34 is slidably installed on the fixed ring 32, a clamping drive component 33 is installed on the bracket component 31, the clamping drive component 33 is slidably connected to the fixed ring 32, an automatic temperature control component 35 is installed on the fixed ring 32, the bracket component 31 is rotatably connected to the first connecting member 42, and the bracket component 31 is connected to the output shaft of the drive motor 43.

[0044] The bracket assembly 31 includes a connecting plate 312, a second end plate 314 is installed at one end of the connecting plate 312, a second electric telescopic rod 311 is installed on the second end plate 314, the output shaft of the second electric telescopic rod 311 is connected to the clamping drive assembly 33, and a first end plate 313 is installed at the other end of the connecting plate 312. The first end plate 313 and the second end plate 314 are both rotatably connected to the first connecting member 42, and the first end plate 313 and the second end plate 314 are both connected to the output shaft of the driving motor 43, and the fixing ring 32 is installed on the connecting plate 312.

[0045] The fixing ring 32 is provided with a blade groove 321, an engaging groove 324, a sliding hole 322, a second connecting member 326 is installed on the fixing ring 32, a transmission gear 325 is rotatably installed on the second connecting member 326, and a bracket 323 is symmetrically installed on the fixing ring 32.

[0046] The blade ring 34 includes a ring piece 341, on which a plurality of stirring blades 342 are mounted. A transmission block 343 is provided on the ring piece 341, on which a second transmission tooth 3431 is provided. The transmission block 343 is slidably connected with the engaging groove 324. The transmission block 343 is meshed with the transmission gear 325 through the second transmission tooth 3431, and the stirring blade 342 is slidably connected with the blade groove 321.

[0047] The clamping drive assembly 33 includes a transmission plate 331, which is connected to the output shaft of the second electric telescopic rod 311. A transmission rod 332 is symmetrically installed on the transmission plate 331. The transmission rod 332 passes through a plurality of sliding holes 322. The transmission rod 332 is slidably connected to the fixing ring 32 through the sliding holes 322. A plurality of clamping assemblies 333 are installed on the transmission rod 332. The transmission rod 332 is provided with a first transmission tooth 3321. The first transmission tooth 3321 is meshed with the transmission gear 325 for transmission. The clamping assembly 333 corresponds to the position of the fixing ring 32.

[0048] The clamping assembly 333 includes a clamping piece 3331 , which is mounted on the transmission rod 332 , a spring telescopic rod 3332 is mounted on the clamping piece 3331 , a flexible pressure strip 3333 is mounted on the spring telescopic rod 3332 , and the flexible pressure strip 3333 is made of flexible material.

[0049] The automatic temperature control component 35 includes a heat-conducting shell 351, which is installed on the fixed ring 32. An expansion shell 352 is installed in the heat-conducting shell 351, and a piston bent rod 353 is slidably installed in the expansion shell 352. The space between the piston bent rod 353 and the expansion shell 352 is filled with an expansion medium. A sliding contact 354 is installed on the piston bent rod 353. A heating column 355 is installed in the heat-conducting shell 351, and a fixed contact 356 is installed at one end of the heating column 355. The sliding contact 354 is slidably connected to the heating column 355.

[0050] The sliding contact 354 is provided with a first terminal 3541, the fixed contact 356 is provided with a second terminal 3561, the heating column 355 is made of a high resistance material, the piston bent rod 353 is made of an insulating material, the fixed contact 356 and the sliding contact 354 are made of a conductive material, and the expansion medium is a medium with a high thermal expansion coefficient. The first terminal 3541 and the second terminal 3561 are connected to the power supply through a wire. Since the heating column 355 is made of a high resistance material, the heating column 355 generates heat after power is turned on.

[0051] The working principle of the present invention is as follows: the control system controls the loading and unloading device to vertically place the pre-processed wafer on the bracket 323 of the fixed ring 32, so that the surface of the wafer to be etched faces the direction of the first end plate 313. During this period, the stirring fan blade 342 retracts into the fan blade groove 321 to prevent the wafer from being blocked or scratched by the stirring fan blade 342 when loading. Afterwards, the second electric telescopic rod 311 is started, and the output shaft of the second electric telescopic rod 311 drives the transmission plate 331 to retract, and the transmission plate 331 drives the clamping assembly 333 to retract through the transmission rod 332, and the clamping piece 3331 drives the flexible pressure strip 3333 to retract through the spring telescopic rod 3332. The flexible pressure strip 3333 approaches the fixing ring 32 and cooperates with the fixing ring 32 to clamp and fix the edges of several wafers. When the clamping force is too large, the spring telescopic rod 3332 can shrink by itself to avoid the clamping force from acting entirely on the wafer and causing damage to the wafer. The flexible pressure strip 3333 is made of flexible material to prevent it from scratching the wafer.

[0052] When the transmission rod 332 drives the clamping assembly 333 to retract, it synchronously drives the transmission gear 325 to rotate through the first transmission tooth 3321 thereon. The transmission gear 325 drives the transmission block 343 on the other side to slide linearly. The transmission block 343 drives the entire blade ring 34 to slide, so that the stirring blade 342 on the blade ring 34 gradually passes through and extends out of the blade groove 321 from the initial state of being contracted in the blade groove 321, and changes into a stirring state. At this time, the ring piece 341 is in contact with the fixed ring 32, and the transmission block 343 is embedded in the fitting groove 324.

[0053] After the wafer is clamped and fixed, the output shaft of the first electric telescopic rod 41 of the control system extends, and the output shaft of the first electric telescopic rod 41 drives the entire immersion component 3 to sink into the immersion pool 2 filled with etching liquid through the first connecting piece 42. The control system turns on the drive motor 43, and the output shaft of the drive motor 43 drives the immersion component 3 to rotate. The immersion component 3 drives the wafer to rotate in the etching liquid, and the extended stirring fan blade 342 stirs the etching liquid to ensure that the etching liquid around the wafer flows evenly, so that the contact between the wafer surface and the etching liquid is more uniform, and prevents local over-etching or under-etching. After the etching is completed, the control system repeats the previous operation in reverse to reset the lifting drive component 4 and the immersion component 3. Finally, the wafer is taken out using the loading and unloading device, thereby completing the batch etching of the wafer.

[0054] After the immersion component 3 enters the immersion tank 2, the automatic temperature control component 35 is immersed in the etching solution, and the temperature of the etching solution is conducted to the expansion shell 352 through the heat-conducting shell 351. The expansion medium in the expansion shell 352 expands or contracts after heat exchange with the outside. When the external temperature is low, the expansion medium releases heat and contracts, the piston rod 353 retracts, and the piston rod 353 drives the sliding contact 354 to slide on the heating column 355 away from the fixed contact 356. At this time, when the power is turned on, the effective conductive length of the heating column 355 becomes longer and the resistance increases. According to Ohm's law, the heat generated by the heating column 355 increases at this time. Since the automatic temperature control component 35 rotates with the immersion component 3, the heating column 355 will uniformly heat the etching liquid around the wafer, thereby ensuring the etching speed; when the external temperature is high, the expansion medium absorbs heat and expands, pushing the piston rod 353 to extend, and the piston rod 353 drives the sliding contact 354 to slide on the heating column 355 toward the fixed contact 356. At this time, when the power is turned on, the effective conductive length of the heating column 355 decreases. According to Ohm's law, the heat generated by the heating column 355 decreases at this time, preventing the heating column 355 from overheating the surrounding etching liquid, causing the etching liquid to denature or volatilize.

[0055] It will be apparent to those skilled in the art that the invention is not limited to the details of the exemplary embodiments described above and that the invention can be implemented in other specific forms without departing from the spirit or essential features of the invention. Therefore, the embodiments should be considered exemplary and non-limiting in all respects, and the scope of the invention is defined by the appended claims rather than the foregoing description, and it is intended that all variations falling within the meaning and scope of the equivalent elements of the claims be included in the invention. Any reference numeral in a claim should not be considered as limiting the claim to which it relates.

Claims

1. A VCSEL chip metal etching device, characterized in that: The etching device comprises a main box (1), wherein a soaking pool (2) is arranged in the main box (1), a cover plate (5) is installed on the soaking pool (2), a lifting drive assembly (4) is installed on the main box (1), a soaking assembly (3) is rotatably installed on the lifting drive assembly (4), the soaking assembly (3) corresponds to the soaking pool (2) in position, an air intake grille (6) is arranged on the main box (1), a transparent baffle is arranged on the main box (1), an infusion device is installed in the main box (1), the infusion device is connected to the soaking pool (2), and an exhaust device is installed in the main box (1).

2. A VCSEL chip metal etching device according to claim 1, characterized in that: The lifting drive assembly (4) comprises a first electric telescopic rod (41), the first electric telescopic rod (41) is mounted on the main box (1), a first connecting member (42) is mounted on the output shaft of the first electric telescopic rod (41), a soaking assembly (3) is rotatably mounted on the first connecting member (42), a driving motor (43) is mounted on the first connecting member (42), and the output shaft of the driving motor (43) is connected to the soaking assembly (3).

3. A VCSEL chip metal etching device according to claim 2, characterized in that: The soaking assembly (3) comprises a support assembly (31), a plurality of fixing rings (32) are mounted on the support assembly (31), a fan ring (34) is slidably mounted on the fixing ring (32), a clamping drive assembly (33) is mounted on the support assembly (31), the clamping drive assembly (33) is slidably connected to the fixing ring (32), an automatic temperature control assembly (35) is mounted on the fixing ring (32), the support assembly (31) is rotatably connected to the first connecting member (42), and the support assembly (31) is connected to the output shaft of the driving motor (43).

4. A VCSEL chip metal etching device according to claim 3, characterized in that: The support assembly (31) comprises a connecting plate (312), a second end plate (314) being mounted on one end of the connecting plate (312), a second electric telescopic rod (311) being mounted on the second end plate (314), an output shaft of the second electric telescopic rod (311) being connected to the clamping drive assembly (33), a first end plate (313) being mounted on the other end of the connecting plate (312), the first end plate (313) and the second end plate (314) being both rotatably connected to the first connecting member (42), the first end plate (313) and the second end plate (314) being both connected to the output shaft of the driving motor (43), and the fixing ring (32) being mounted on the connecting plate (312).

5. A VCSEL chip metal etching device according to claim 4, characterized in that: The fixing ring (32) is provided with a blade groove (321), the fixing ring (32) is provided with an engaging groove (324), the fixing ring (32) is provided with a sliding hole (322), the fixing ring (32) is installed with a second connecting piece (326), a transmission gear (325) is rotatably installed on the second connecting piece (326), and a bracket (323) is symmetrically installed on the fixing ring (32).

6. A VCSEL chip metal etching device according to claim 5, characterized in that: The blade ring (34) comprises a ring plate (341), a plurality of stirring blades (342) are mounted on the ring plate (341), a transmission block (343) is provided on the ring plate (341), a second transmission tooth (3431) is provided on the transmission block (343), the transmission block (343) is slidably connected with the engaging groove (324), the transmission block (343) is meshed with the transmission gear (325) through the second transmission tooth (3431), and the stirring blade (342) is slidably connected with the blade groove (321).

7. A VCSEL chip metal etching device according to claim 6, characterized in that: The clamping drive assembly (33) comprises a transmission plate (331), the transmission plate (331) is connected to the output shaft of the second electric telescopic rod (311), a transmission rod (332) is symmetrically mounted on the transmission plate (331), the transmission rod (332) passes through a plurality of sliding holes (322), the transmission rod (332) is slidably connected to the fixing ring (32) through the sliding holes (322), a plurality of clamping assemblies (333) are mounted on the transmission rod (332), a first transmission tooth (3321) is provided on the transmission rod (332), the first transmission tooth (3321) is meshed with a transmission gear (325) for transmission, and the clamping assembly (333) corresponds to the fixing ring (32) in position.

8. A VCSEL chip metal etching device according to claim 7, characterized in that: The clamping assembly (333) comprises a clamping plate (3331), wherein the clamping plate (3331) is mounted on the transmission rod (332), a spring telescopic rod (3332) is mounted on the clamping plate (3331), a flexible pressure strip (3333) is mounted on the spring telescopic rod (3332), and the flexible pressure strip (3333) is made of a flexible material.

9. A VCSEL chip metal etching device according to claim 3, characterized in that: The automatic temperature control component (35) comprises a heat-conducting outer shell (351), wherein the heat-conducting outer shell (351) is mounted on a fixed ring (32), an expansion outer shell (352) is mounted inside the heat-conducting outer shell (351), a piston bent rod (353) is slidably mounted inside the expansion outer shell (352), an expansion medium is filled between the piston bent rod (353) and the expansion outer shell (352), a sliding contact (354) is mounted on the piston bent rod (353), a heating column (355) is mounted inside the heat-conducting outer shell (351), a fixed contact (356) is mounted at one end of the heating column (355), and the sliding contact (354) is slidably connected to the heating column (355).

10. A VCSEL chip metal etching device according to claim 9, characterized in that: The sliding contact (354) is provided with a first terminal (3541), the fixed contact (356) is provided with a second terminal (3561), the heating column (355) is made of a high-resistance material, the piston bent rod (353) is made of an insulating material, the fixed contact (356) and the sliding contact (354) are made of a conductive material, and the expansion medium is a medium with a high thermal expansion coefficient.

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