Loading chamber, heating furnace and heating furnace temperature adjusting method

Abstract

The invention belongs to the technical field of semiconductor manufacturing, and discloses a loading chamber, a heating furnace and a heating furnace temperature adjusting method. The loading chamber comprises a first space and a second space in the preset first direction, the second space can completely contain the wafer boat carrying mechanism, the loading chamber is provided with an air injection assembly and an exhaust assembly, the air injection assembly comprises a first air injection pipe and a second air injection pipe, and the first air injection pipe is used for overall air injection cooling in the second space. The second gas spraying pipe is used for spraying gas to the end, close to the first space, in the second space for cooling, and the exhaust assembly can suck high-temperature gas in the first space. Through the cooperation of the air injection assembly and the air exhaust assembly, the temperature of the loading chamber can be rapidly and obviously reduced, so that devices in the loading chamber are prevented from being damaged due to high temperature, a wafer at high temperature can be prevented from reacting in the loading chamber to influence the product quality, the cooling time required by the loading chamber is reduced, and the production efficiency is improved. The working efficiency of the heating furnace is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor manufacturing, and in particular to a loading chamber, a heating furnace and a method for regulating the temperature of the heating furnace. Background Art

[0002] In the existing vertical furnace, when the process tube performs heat treatment on the wafer, a large amount of heat will diffuse from the process tube to the surrounding structure of the process tube, among which part of the heat will diffuse into the loading chamber, causing the temperature in the loading chamber to gradually increase. After the heat treatment process is completed, the wafer boat transport mechanism carrying the wafer descends into the loading chamber, and the high-temperature wafer boat transport mechanism will dissipate heat to the loading chamber, which will also cause the temperature in the loading chamber to increase. After the temperature rises, it is easy to damage the devices in the loading chamber, causing device failure, unstable operation, etc., which in turn affects the normal operation and service life of the vertical furnace, increases production costs and maintenance costs, and at the same time, the wafers after the heat treatment process are also in urgent need of cooling. The wafers at high temperatures are easy to react with some gases in the loading chamber, affecting product quality.

[0003] Based on the above, there is an urgent need for a loading chamber, a heating furnace and a method for regulating the temperature of the heating furnace to solve the above technical problems. Summary of the invention

[0004] The first object of the present invention is to provide a loading chamber that can cool down the interior, especially to cool down and regulate the temperature of a wafer boat transport mechanism and wafers in the loading chamber.

[0005] To achieve this object, the present invention adopts the following technical solutions:

[0006] The loading chamber includes a first space and a second space along a preset first direction. The wafer boat transport mechanism can be completely accommodated in the second space and can move into the first space along the preset first direction to enter the process tube. In addition, the loading chamber is also provided with an injection assembly and an exhaust assembly. The injection assembly includes a first injection pipe and a second injection pipe. The first injection pipe is used to perform overall injection cooling in the second space, and the second injection pipe is used to perform local injection cooling in the end of the second space close to the first space. The exhaust assembly is connected to the loading chamber and is used to extract the gas in the first space.

[0007] The beneficial effect of the loading chamber of the present invention is that the first jet pipe is used to perform overall jet cooling in the second space, and the second jet pipe is used to perform local jet cooling in the end of the second space close to the first space, so that the temperature of the wafer boat transport mechanism (as well as the wafer boat and wafers taken out) in a descending state can be reduced, the temperature of the heat source in the loading chamber is reduced, and the temperature of the wafer is reduced, so as to avoid the wafer being kept in a high temperature state and affecting the product quality. The exhaust component can suck the gas from the first space, so as to extract the high-temperature gas from the loading chamber and directly reduce the temperature in the loading chamber. Through the cooperation of the jet component and the exhaust component, the temperature of the loading chamber can be quickly and significantly reduced, so as to avoid the devices in the loading chamber from being damaged by high temperature, and to avoid the wafers at high temperature from reacting in the loading chamber that affects the product quality. At the same time, it is also beneficial to reduce the cooling time required for the loading chamber and improve the working efficiency of the heating furnace.

[0008] In some embodiments, along the preset second direction, the first jet pipe and the second jet pipe are both arranged at one end in the second space, and both can spray in a direction toward the other end of the second space. The preset second direction is perpendicular to the preset first direction, so that the jet assembly can form a stable cooling airflow in the second space, reduce dust, and improve the efficiency of cooling.

[0009] In some embodiments, the first jet pipe and the second jet pipe are both extended along a preset first direction, a plurality of first jet holes are arranged along the preset first direction on the first jet pipe, and a plurality of second jet holes are arranged along the preset first direction on the second jet pipe, and the gas can flow out of the first jet hole and the second jet hole respectively and flow in the second space along the preset second direction. In addition, the distance between the two first jet holes that are farthest apart is not less than the length of the wafer boat transport mechanism, so that the first jet pipe can perform jet cooling on the wafer boat transport mechanism as a whole.

[0010] In some embodiments, the loading chamber has a first air duct, a circulation component is arranged in the first air duct, and a first air inlet is formed on the inner wall of the loading chamber. The gas in the loading chamber can enter the first air duct from the first air inlet and flow through the circulation component. The circulation component can cool and filter the gas flowing through the first air duct, and input the cooled and filtered gas into the loading chamber. The gas in the loading chamber can enter the first air duct from the first air inlet and flow through the circulation component, and then enter the loading chamber again. The circulation component is used to cool and filter the gas flowing through the first air duct, thereby realizing the recycling of the gas and reducing the consumption of nitrogen.

[0011] In some embodiments, the circulation component includes a first heat exchanger, a fan and a filter. The first heat exchanger, the fan and the filter are arranged in the first air duct in sequence. The filter is provided with a circulation outlet. The gas in the loading chamber can enter the loading chamber again through the circulation outlet after flowing through the circulation component, thereby cooling and filtering the recycled gas, ensuring a better cooling effect on the wafer boat transport mechanism.

[0012] In some embodiments, along a preset second direction, the jet assembly is disposed at one end of the second space, and the first air inlet is disposed at the other end of the second space, thereby forming a stable cooling airflow in the loading chamber, avoiding the formation of turbulence that affects heat dissipation, and preventing dust.

[0013] In some embodiments, the filter and the jet assembly are arranged at the same end of the loading chamber along a preset second direction, and the air outlet direction of the circulating air outlet and the jet direction of the jet assembly are both arranged along the preset second direction, thereby forming a stable airflow in the loading chamber, reducing dust and improving the cooling efficiency.

[0014] In some embodiments, the loading chamber also has a second air duct, which has a second air inlet formed on the inner wall of the loading chamber. The circulation component also includes a second heat exchanger, which is arranged in the second air duct, and the second air duct and the first air duct are connected at the installation position of the fan. Driven by the fan, the gas in the loading chamber can flow from the second air inlet in sequence through the second air duct, the fan and the filter, and enter the loading chamber again, thereby increasing the circulating air volume, which is beneficial to improving the jet cooling efficiency.

[0015] In some embodiments, the first air duct is also connected to an air intake valve, and when the air intake valve is opened, outside air can flow through the air intake valve through the circulation component and enter the loading chamber, thereby bringing filtered outside air into the loading chamber to meet the breathing needs of maintenance personnel.

[0016] In some embodiments, the first air duct is also provided with an air intake control valve, which is arranged between the air intake valve and the first air inlet. The air intake control valve is used to prevent outside air from flowing into the loading chamber from the first air inlet, thereby preventing particulate matter from directly entering the loading chamber and causing pollution.

[0017] In some embodiments, the circulation component is also connected to a second air supply pipe, which is used to input inert gas into the loading chamber through the first air duct, so as to discharge the oxygen-containing air in the first air duct after the maintenance is completed and restore the inert gas atmosphere in the loading chamber.

[0018] In some embodiments, the exhaust assembly is arranged outside the loading chamber, and includes a first gas collecting box, a first exhaust pipe and an exhaust mechanism. The first gas collecting box and the first exhaust pipe are both connected to the exhaust mechanism, and along the preset second direction, the first gas collecting box is connected to one end of the loading chamber, and the first exhaust pipe is connected to the other end of the loading chamber. The exhaust mechanism can extract the gas in the first space through the first exhaust pipe and the first gas collecting box, so that the high-temperature gas in the first space can be fully discharged, ensuring the cooling effect in the loading chamber.

[0019] In some embodiments, a second exhaust pipe and a third exhaust pipe are connected between the first air collecting box and the air extraction mechanism. The second exhaust pipe and the third exhaust pipe have different exhaust efficiencies. The air extraction mechanism can selectively communicate with the first air collecting box through at least one of the second exhaust pipe and the third exhaust pipe to extract and cool the loading chamber, thereby taking into account both cooling efficiency and preventing vibration to ensure the production quality of the wafer.

[0020] In some embodiments, the air extraction mechanism is connected to a third pressure detector, and the second exhaust pipe is connected to the first pressure detector, or the loading chamber is connected to the second pressure detector. By comparing the detection results of the pressure detectors, it is convenient to determine whether the air extraction mechanism is working properly.

[0021] In some embodiments, a sweeper is also provided outside the loading chamber, and the exhaust assembly also includes a second air collecting box, the second air collecting box is connected to the sweeper, and is connected to a fourth exhaust pipe, the fourth exhaust pipe is connected to an exhaust mechanism, and the exhaust mechanism can be connected to the sweeper through the second air collecting box and the fourth exhaust pipe, so as to exhaust and cool the sweeper, thereby achieving an indirect effect of lowering the temperature of the loading chamber.

[0022] In some embodiments, a fifth exhaust pipe is also connected between the second air collecting box and the air extraction mechanism. The fifth exhaust pipe and the fourth exhaust pipe have different exhaust efficiencies. The air extraction mechanism can selectively connect with the second air collecting box through at least one of the fourth exhaust pipe and the fifth exhaust pipe to extract air and cool the cleaner, thereby taking into account both cooling efficiency and preventing vibration to ensure the production quality of the wafer.

[0023] In some embodiments, the exhaust mechanism is also connected to a sixth exhaust pipe. Along a preset second direction, the second air collecting box is connected to one end of the sweeper, and the sixth exhaust pipe is connected to the other end of the sweeper, thereby avoiding local overheating of the sweeper and achieving a comprehensive and uniform cooling effect.

[0024] In some embodiments, the exhaust mechanism is also connected to an oxygen analyzer, a second three-way control valve, a first three-way control valve, and at least two wafer boxes, wherein one wafer box is connected to the first interface of the first three-way control valve, wherein another wafer box is connected to the second interface of the first three-way control valve, the third interface of the first three-way control valve is connected to the first interface of the second three-way control valve, the second interface of the second three-way control valve is connected to the loading chamber, the third interface of the second three-way control valve is connected to the air inlet of the oxygen analyzer, the air outlet of the oxygen analyzer is connected to the exhaust mechanism, the first three-way control valve can selectively connect the third interface of the first three-way control valve to one of the first interface and the second interface, and the second three-way control valve can selectively connect the third interface of the second three-way control valve to one of the first interface and the second interface. In this way, oxygen content analysis can be performed on multiple locations by one oxygen analyzer, saving structural costs.

[0025] In some embodiments, the gas extraction mechanism is also connected to a gas detector, and the gas detector is connected to the second gas collecting box to determine whether there is a process gas leak.

[0026] In some embodiments, the gas detector is also connected to a special gas box to determine whether there is a process gas leak.

[0027] The second object of the present invention is to provide a heating furnace, whose loading chamber has better temperature regulation capability and can cool down the wafer boat transport mechanism and wafers in the loading chamber.

[0028] To achieve this object, the present invention adopts the following technical solutions:

[0029] The heating furnace includes a process tube, a wafer boat transport mechanism, a furnace door and the above-mentioned loading chamber. The furnace opening of the process tube is arranged in the first space of the loading chamber. The furnace door is used to close the furnace opening. The wafer boat transport mechanism can be completely accommodated in the second space of the loading chamber and can move into the first space along a preset first direction to enter the process tube.

[0030] The beneficial effect of the heating furnace of the present invention is that the first jet pipe is used to perform overall jet cooling in the second space, and the second jet pipe is used to perform local jet cooling in the end of the second space close to the first space, so that the temperature of the wafer boat transport mechanism (as well as the taken-out wafer boat and wafer) in a descending state can be reduced, the temperature of the heat source in the loading chamber is reduced, and the temperature of the wafer is reduced, so as to avoid the wafer being kept in a high temperature state and affecting the product quality. The exhaust component can suck the gas from the first space, so as to extract the high-temperature gas from the loading chamber and directly reduce the temperature in the loading chamber. Through the cooperation of the jet component and the exhaust component, the temperature of the loading chamber can be quickly and significantly reduced, so as to avoid the devices in the loading chamber being damaged by high temperature, and to avoid the wafers at high temperature from reacting in the loading chamber that affects the product quality. At the same time, it is also beneficial to reduce the cooling time required for the loading chamber and improve the working efficiency of the heating furnace.

[0031] The third object of the present invention is to provide a method for regulating the temperature of a heating furnace, which is capable of cooling the interior of a loading chamber, and in particular, cooling and regulating the temperature of a wafer boat transport mechanism and wafers in the loading chamber.

[0032] To achieve this object, the present invention adopts the following technical solutions:

[0033] A method for regulating the temperature of a heating furnace, applied to the above-mentioned loading chamber, comprises:

[0034] The second space is cooled by jetting as a whole; the end of the second space close to the first space is cooled by jetting locally; and the high-temperature gas in the first space is sucked out.

[0035] The beneficial effect of the heating furnace temperature control method of the present invention is that by performing overall jet cooling in the second space and local jet cooling in the end of the second space close to the first space, the temperature of the wafer boat transport mechanism (as well as the taken-out wafer boat and wafer) in a descending state can be reduced, the temperature of the heat source in the loading chamber can be reduced, and the temperature of the wafer can be reduced to avoid the wafer being kept in a high temperature state and affecting the product quality. By sucking the gas from the first space, the high-temperature gas can be drawn out of the loading chamber to directly reduce the temperature in the loading chamber. Through the cooperation of the jet assembly and the exhaust assembly, the temperature of the loading chamber can be quickly and significantly reduced, thereby avoiding damage to the devices in the loading chamber due to high temperature, and avoiding the reaction of the wafer at high temperature in the loading chamber that affects the product quality. At the same time, it is also beneficial to reduce the cooling time required for the loading chamber and improve the working efficiency of the heating furnace. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] Figure 1 It is a structural schematic diagram of the heating furnace provided by the present invention;

[0037] Figure 2 yes Figure 1 A partial enlarged view below the middle dotted line A;

[0038] Figure 3 It is a three-dimensional structural diagram of the first jet pipe, the second jet pipe and the main connecting pipe;

[0039] Figure 4 yes Figure 1 A partial enlarged view above the middle dotted line B.

[0040] In the figure:

[0041] 10. Loading chamber; 101. First air duct; 102. Second air duct; 11. Process pipe; 12. Furnace door; 13. Wafer boat transport mechanism; 14. Cleaner; 141. Valve assembly; 15. External cabinet; 16. Wafer box; 161. Third air supply pipe; 17. Special gas box; 18. Exhaust gas treatment mechanism;

[0042] 20. jet assembly; 201. first jet pipe; 202. second jet pipe; 203. main connecting pipe; 204. first air supply pipe;

[0043] 30. Exhaust assembly; 301. First gas collecting box; 3011. First cylinder; 3012. Second cylinder; 302. First exhaust pipe; 303. Air extraction mechanism; 304. First pressure detector; 305. Second exhaust pipe; 306. Third exhaust pipe; 307. Air volume regulating valve; 308. Second pressure detector; 309. Ball valve; 310. Third pressure detector; 311. Second gas collecting box; 312. Fifth exhaust pipe; 313. Fourth exhaust pipe; 314. Fourth pressure detector; 315. Seventh exhaust pipe; 316. Oxygen analyzer; 317. First three-way control valve; 318. Second three-way control valve; 319. Gas detector; 320. Fifth pressure detector; 321. Sixth exhaust pipe;

[0044] 40. circulation component; 401. first heat exchanger; 402. fan; 403. filter; 404. second heat exchanger; 405. air intake valve; 406. air intake control valve; 407. second air supply pipe;

[0045] M, first space; N, second space; K, schematic boundary. DETAILED DESCRIPTION

[0046] The present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It is to be understood that the specific embodiments described herein are only used to explain the present invention, rather than to limit the present invention. It should also be noted that, for ease of description, only parts related to the present invention, rather than all structures, are shown in the accompanying drawings.

[0047] In the description of the present invention, unless otherwise clearly specified and limited, the terms "connected", "connected", and "fixed" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0048] In the present invention, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0049] In the description of this embodiment, the terms "upper", "lower", "right", "left" and other directions or positional relationships are based on the directions or positional relationships shown in the drawings, and are only for the convenience of description and simplification of operation, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operate in a specific direction, and therefore cannot be understood as limiting the present invention. In addition, the terms "first" and "second" are only used to distinguish in the description and have no special meaning.

[0050] The following is based on the attached Figure 1 To Attachment Figure 4 The loading chamber 10, the heating furnace and the heating furnace temperature adjustment method provided by the present invention are introduced. For the convenience of description, in this embodiment, the loading chamber 10 is introduced by taking a vertical furnace as an example, but the loading chamber 10 can also be used in a horizontal furnace after the installation direction is appropriately adjusted, and the present invention does not make specific limitations on this.

[0051] like Figure 1 , Figure 2 As shown, in this embodiment, the vertical furnace mainly includes a loading chamber 10, a process pipe 11, a furnace door 12 and other structures. In the vertical direction, the process pipe 11 is arranged above the loading chamber 10, and the furnace door 12 is arranged at the lower end of the process pipe 11 in the vertical direction and is located on the top wall of the loading chamber 10. A wafer boat transport mechanism 13 is arranged in the loading chamber 10, and the wafer boat transport mechanism 13 is used to transport the wafer boat in a preset first direction (in this embodiment, that is, Figure 1 , Figure 2The wafer boat carrying wafers such as silicon wafers or silicon carbide wafers is delivered into the process tube 11 in the vertical direction of the process tube 11, and has two states: an ascending state and a descending state. When the wafer boat transport mechanism 13 is in an ascending state, the wafer boat transport mechanism 13 can extend out of the loading chamber 10 in a direction coaxial with the process tube 11, so as to deliver the wafer boat into the process tube 11 through the opened furnace door 12, or fix the wafer boat to the wafer boat transport mechanism 13 for easy removal; and when the wafer boat transport mechanism 13 is in a descending state, the entirety of the wafer boat (including the wafer boat and wafers to be removed) is accommodated in the loading chamber 10, so as not to affect the closing of the furnace door 12.

[0052] The loading chamber 10 includes a first space M and a second space N along a preset first direction. When the boat transport mechanism 13 is in a descending state, the boat transport mechanism 13 can be completely accommodated in the second space N, and when the boat transport mechanism 13 changes from a descending state to an ascending state, the boat transport mechanism 13 can pass through the first space M along the preset first direction and enter the process tube 11. In addition, the loading chamber 10 is also provided with an injection assembly 20 and an exhaust assembly 30. The injection assembly 20 includes a first injection pipe 201 and a second injection pipe 202, and the first injection pipe 201 and the second injection pipe 202 are both provided in the loading chamber 10. The first jet pipe 201 is used to perform jet cooling on the entire second space N, and can jet purge the entire wafer boat transport mechanism 13 in a descending state, thereby cooling the entire wafer boat transport mechanism 13; the second jet pipe 202 is used to perform local jet cooling on the end of the second space N close to the first space M, and can jet purge the end of the wafer boat transport mechanism 13 in a descending state close to the furnace door 12, thereby locally cooling the local high-temperature area of ​​the wafer boat transport mechanism 13. The exhaust assembly 30 is arranged outside the loading chamber 10 and connected to the top wall of the loading chamber 10, and can suck the gas in the first space M, thereby discharging the high-temperature gas in the first space M, and then locally cooling the local high-temperature area in the loading chamber 10 (mainly near the furnace door 12).

[0053] When in use, for example, when the boat transport mechanism 13 is in an ascending state, it absorbs a large amount of heat in the process tube 11, and at this time the furnace door 12 is in an open state, the high-temperature gas in the process tube 11 will diffuse into the loading chamber 10, causing the temperature in the loading chamber 10 to rise rapidly, which may have a negative impact on the devices in the loading chamber 10. After the wafer heat treatment process is completed, the boat transport mechanism 13 (as well as the boat and wafers taken out) that have absorbed a large amount of heat will retract into the second space N and become a heat source, causing the temperature in the loading chamber 10 to rise rapidly. In particular, the end of the boat transport mechanism 13 close to the furnace door 12 absorbs more heat than other positions of the boat transport mechanism 13, and has a higher temperature, which easily forms a local high-temperature area at the end of the second space N close to the first space M.

[0054] Therefore, when the wafer boat transport mechanism 13 is in the descending state and the furnace door 12 is closed, the first jet pipe 201 is used to jet the entire wafer boat transport mechanism 13 in the second space N to cool it down, and the second jet pipe 202 is used to jet the local end of the wafer boat transport mechanism 13 close to the furnace door 12 to cool it down, so that the temperature of the wafer boat transport mechanism 13 (as well as the wafer boat and wafers taken out) can be reduced, the temperature of the heat source in the loading chamber 10 is reduced, and the temperature of the wafers is reduced, so as to avoid the wafers being kept in a high temperature state and affecting the product quality. The exhaust component 30 can suck and discharge the high-temperature gas in the first space M, so as to extract the high-temperature gas from the loading chamber 10 and directly reduce the temperature in the loading chamber 10. Through the cooperation of the jet component 20 and the exhaust component 30, the temperature of the loading chamber 10 can be quickly and significantly reduced, so as to avoid the devices in the loading chamber 10 being damaged due to high temperature, and to avoid the high-temperature wafers in the loading chamber 10 from reacting in the loading chamber 10 that affects the product quality, and at the same time, it is also beneficial to reduce the cooling time required for the loading chamber 10 and improve the working efficiency of the heating furnace.

[0055] Specifically, refer to Figure 2 , Figure 3As shown, in this embodiment, the jet assembly 20 includes a main connecting pipe 203, the above-mentioned first jet pipe 201 and the second jet pipe 202. One end of the main connecting pipe 203 is arranged to pass through the side wall of the loading chamber 10 and is connected to the first air supply pipe 204. The first air supply pipe 204 can supply inert gas such as nitrogen to the main connecting pipe 203. Nitrogen as a cooling gas can absorb and transfer the heat possessed by the wafer boat transport mechanism 13. The first jet pipe 201 and the second jet pipe 202 are connected to the other end of the main connecting pipe 203, and both are extended along a preset first direction. Preferably, along the preset second direction, the first jet pipe 201 and the second jet pipe 202 are both arranged at one end in the second space N, and both can spray in a direction toward the other end of the second space N, thereby forming a cooling airflow in the second space N. The preset second direction is perpendicular to the preset first direction, that is, Figure 1 , Figure 2 In the direction of the horizontal arrow in the figure, the cooling airflow can flow smoothly along the preset second direction, avoiding the formation of turbulence in the loading chamber 10 to affect the heat dissipation and also preventing the phenomenon of causing dust.

[0056] Therefore, the first space M and the second space N can also be assisted by other criteria. For example, according to the setting position of the jet assembly 20, the end of the jet assembly 20 close to the furnace door 12 can be used as the boundary (such as Figure 2 The loading chamber 10 is divided into a first space M and a second space N. Alternatively, it can be determined based on the flow range of the cooling airflow, that is, the area where the cooling airflow flows along the preset second direction is the second space N, and the rest is the first space M.

[0057] like Figure 2 , Figure 3 As shown, the first jet pipe 201 and the second jet pipe 202 are both extended along the preset first direction. Among them, a plurality of first jet holes are arranged on the first jet pipe 201 along the preset first direction, and the first jet holes are arranged along the preset second direction toward the wafer boat transport mechanism 13 in the descending state, and the length of the first jet pipe 201 is not less than the length dimension of the wafer boat transport mechanism 13 (i.e., the dimension along the preset first direction). The distance between the two first jet holes farthest apart is not less than the length dimension of the wafer boat transport mechanism 13, and nitrogen can flow out of the first jet pipe 201 from the first jet holes and form a first cooling airflow, which can cool down the second space N as a whole and cover the entirety of the wafer boat transport mechanism 13, thereby cooling down the wafer boat transport mechanism 13 as a whole.

[0058] It should be noted that, in the present invention, inert gas includes both rare gases in the conventional sense and gases such as nitrogen that are not easy to form compounds with other elements under specific conditions (in this article, within the loading chamber 10). Therefore, the present invention does not limit the specific type or ratio of the inert gas, as long as it is not easy to form compounds with other elements within the loading chamber 10.

[0059] Continue to refer to Figure 2 , Figure 3 As shown, in this embodiment, at least one second jet hole is arranged on the second jet pipe 202 along the preset first direction, and the length of the second jet pipe 202 is smaller than that of the first jet pipe 201. The second jet hole is arranged along the preset second direction toward the end of the second space N close to the first space M, and nitrogen can flow out of the second jet pipe 202 from the second jet hole and form a second cooling airflow, which only purges one end of the wafer boat transport mechanism 13 in the descending state close to the furnace door 12, thereby partially cooling the wafer boat transport mechanism 13.

[0060] In this embodiment, if Figure 2 As shown, the second jet pipe 202 is arranged closer to the wafer boat transport mechanism 13 than the first jet pipe 201, and the second jet pipe 202 and the first jet pipe 201 are arranged in a staggered manner to avoid the second jet pipe 202 blocking the first jet pipe 201, which can significantly enhance the local cooling effect on the wafer boat transport mechanism 13. Optionally, in some embodiments, referring to Figure 3 As shown, the first jet pipe 201 and the second jet pipe 202 can also be arranged side by side, that is, the first jet pipe 201 and the second jet pipe 202 have the same distance from the wafer boat transport mechanism 13, so as to avoid damage to the second jet pipe 202 caused by high temperature and reduce the space occupied by the first jet pipe 201 and the second jet pipe 202 in the loading chamber 10.

[0061] Further, continue to refer to Figure 2 As shown, in this embodiment, the loading chamber 10 further includes a circulation component 40, the loading chamber 10 has a first air duct 101, and the circulation component 40 is disposed in the first air duct 101. The gas in the loading chamber 10 can enter the first air duct 101 and flow through the circulation component 40, and then enter the loading chamber 10 again. The circulation component 40 is used to cool and filter the gas flowing through the first air duct 101, thereby realizing the recycling of nitrogen and reducing the consumption of nitrogen.

[0062] Specifically, in this embodiment, the circulation component 40 includes a first heat exchanger 401, a fan 402 and a filter 403, and the first heat exchanger 401, the fan 402 and the filter 403 are sequentially arranged along the flow direction of the gas in the first air duct 101. Among them, the first heat exchanger 401 is used to cool the gas flowing through the first air duct 101, the fan 402 is used to drive the gas to flow through the first air duct 101 and input into the loading chamber 10, and the filter 403 can filter the gas flowing through the first air duct 101, so that the gas remains at a low temperature and pure. The filter 403 is provided with a circulation outlet (not shown in the figure), and the gas can flow into the loading chamber 10 after flowing out of the filter 403 through the circulation outlet, and the temperature in the loading chamber 10 is reduced.

[0063] In this embodiment, the first air duct 101 is formed with a first air inlet on the inner wall of the loading chamber 10. Preferably, along the preset second direction, the first air inlet is located at one end of the second space N, and the jet assembly 20 is located at the other end of the second space N, so that the first cooling airflow and the second cooling airflow can be Figure 2 The air flows smoothly in the direction of the horizontal arrow in the figure and enters the first air inlet relatively smoothly, avoiding the formation of turbulence at the first air inlet to affect heat dissipation and prevent the phenomenon of dust. Further preferably, in this embodiment, the circulating air outlet, the first jet hole and the second jet hole are all arranged at one end of the second space N, and the air outlet directions of the three are arranged in parallel, thereby further reducing dust, ensuring the formation of a stable cooling airflow in the loading chamber 10, and improving the cooling effect.

[0064] Optionally, in some embodiments, a second air duct 102 may be provided in the loading chamber 10, and a second air inlet may be formed on the inner wall of the loading chamber 10. The circulation component 40 further includes a second heat exchanger 404, which is provided in the second air duct 102, and the second air duct 102 and the first air duct 101 are connected at the installation position of the fan 402. The gas in the loading chamber 10 can flow through the second air duct 102, the fan 402 and the filter 403 in sequence through the second air inlet under the drive of the fan 402, thereby increasing the gas circulation volume in the loading chamber 10, improving the cooling efficiency of the loading chamber 10, and accelerating the efficiency of transferring the internal heat of the loading chamber 10 through the heat exchanger.

[0065] Preferably, in this embodiment, the first air duct 101 is also connected to an air intake valve 405. When personnel need to enter the loading chamber 10 for maintenance, the air intake valve 405 is opened to supply outside air, and the nitrogen in the loading chamber 10 can be discharged in conjunction with the exhaust assembly 30, gradually making the loading chamber 10 have a normal breathing environment to meet the normal breathing needs of personnel. At this time, the outside air enters the loading chamber 10 after passing through the filter 403, and it is also prevented that the outside air carries impurities such as dust and particulate matter into the loading chamber 10, causing the environment in the loading chamber 10 to be polluted.

[0066] Furthermore, the first air duct 101 is also provided with an air intake control valve 406, which is arranged between the air intake valve 405 and the first air inlet, and can prevent external air from flowing into the loading chamber 10 from the first air inlet, ensuring that the external air can be filtered through the filter 403, thereby preventing impurities such as dust and particulate matter from entering the loading chamber 10 and causing the environment in the loading chamber 10 to be polluted.

[0067] Optionally, the filter 403 is also connected to a second air supply pipe 407, which is used to input an inert gas into the loading chamber 10 through the first air duct 101 and discharge the oxygen-containing air in the first air duct 101. After the overhaul is completed, the loading chamber 10 needs to be restored to a nitrogen atmosphere to avoid oxidation and contamination of wafers during normal production. At this time, by inputting an inert gas such as nitrogen through the second air supply pipe 407, the oxygen-containing air in the first air duct 101 can be completely discharged, and the suction of the exhaust component 30 can be used to restore the loading chamber 10 to a nitrogen atmosphere. Of course, in some embodiments in which a second air duct 102 is provided, the second air supply pipe 407 can be connected to the filter 403, so that the inert gas such as nitrogen can flow into the first air duct 101 and the second air duct 102 respectively after passing through the filter 403 and the fan 402, thereby achieving the discharge of oxygen-containing air for both the first air duct 101 and the second air duct 102.

[0068] It should be noted that, due to the high temperature in the first space M, the first exhaust pipe 302, the second exhaust pipe 305 and the main connecting pipe 203 are spaced apart from the furnace door 12 and the top wall of the loading chamber 10 to prevent the pipes from being damaged by high temperature.

[0069] Based on this, Figure 1 , Figure 4As shown, in this embodiment, the exhaust assembly 30 includes a first air collecting box 301, a first exhaust pipe 302 and an exhaust mechanism 303, which can exhaust and cool the first space M. The first air collecting box 301 is installed on the top of the loading chamber 10, is connected to the loading chamber 10, and is formed with a first exhaust port on the top of the loading chamber 10. One end of the first exhaust pipe 302 is formed with a second exhaust port on the top of the loading chamber 10, and along the preset second direction, the first exhaust port is located at one end of the loading chamber 10, and the second exhaust port is located at the other end of the loading chamber 10. In this way, the exhaust mechanism 303 is connected with the first air collecting box 301 and the first exhaust pipe 302, and the high-temperature air in the first space M can be fully sucked through the first air collecting box 301 and the first exhaust pipe 302 to reduce the residue, so that the high-temperature gas in the first space M can be fully discharged, and the cooling effect in the loading chamber 10 is guaranteed. At the same time, in conjunction with the jet assembly 20, the inside of the loading chamber 10 can be fully cooled to avoid the phenomenon of local high temperature. Furthermore, when the jet assembly 20 jets the inside of the loading chamber 10, exhaust pressure relief can be achieved through the exhaust assembly 30 to prevent the air pressure in the loading chamber 10 from being too high; when outside air is injected before maintenance, the exhaust assembly 30 can improve the efficiency of exhausting nitrogen; when nitrogen is injected after maintenance, the exhaust assembly 30 can improve the efficiency of exhausting oxygen-containing air.

[0070] like Figure 4 As shown, in this embodiment, the loading chamber 10 is connected to a first pressure detector 304, which can detect the pressure in the loading chamber 10, so that the exhaust component 30 can adjust the exhaust efficiency of the loading chamber 10 with reference to the specific pressure situation. Specifically, a second exhaust pipe 305 and a third exhaust pipe 306 are connected between the first gas collecting box 301 and the exhaust mechanism 303. The inner diameter of the second exhaust pipe 305 is larger than that of the third exhaust pipe 306, and has a higher exhaust efficiency. When the first pressure detector 304 detects that the pressure in the loading chamber 10 is within a preset range, the gas can be discharged only through the third exhaust pipe 306; when the first pressure detector 304 detects that the pressure in the loading chamber 10 is higher than the preset range, the gas can be discharged through the second exhaust pipe 305 or the second exhaust pipe 305 and the third exhaust pipe 306, so that the pressure in the loading chamber 10 is restored to within the preset range. At the same time, the loading chamber 10 can be selectively evacuated and cooled with smaller and larger exhaust efficiencies. The smaller exhaust efficiency will not form a large airflow and vibration in the loading chamber 10, thereby avoiding damage to the wafers. It can also prevent some wafers from vibrating to produce particles and further scratch other wafers or pollute the entire heat treatment process environment. The larger exhaust efficiency can better control the temperature in the loading chamber 10.

[0071] More specifically, in the present embodiment, the first gas collecting box 301 is connected to the first cylinder 3011 and the second cylinder 3012, the first cylinder 3011 is used to switch the second exhaust pipe 305 and the first gas collecting box 301 between a connected state and a disconnected state, and the second cylinder 3012 is used to switch the third exhaust pipe 306 and the first gas collecting box 301 between a connected state and a disconnected state. Of course, in some other embodiments, a switch valve may be provided in the second exhaust pipe 305, the third exhaust pipe 306 or the exhaust mechanism 303 to selectively exhaust gas through at least one of the second exhaust pipe 305 and the third exhaust pipe 306, which is not specifically limited in the present invention.

[0072] Preferably, the second exhaust pipe 305 is provided with an air volume regulating valve 307 and is connected to a second pressure detector 308, so that the flow of the second exhaust pipe 305 can be adjusted in real time according to the detection result of the second pressure detector 308, reducing the control difficulty and reducing the vibration phenomenon. The first exhaust pipe 302 and the third exhaust pipe 306 are both provided with a ball valve 309, and the ball valve 309 can control the on and off of the third exhaust pipe 306, achieving the effect of switch control. Of course, in some embodiments, the air volume regulating valve 307 and the pressure detector can also be provided only in the third exhaust pipe 306 or in both the second exhaust pipe 305 and the third exhaust pipe 306, which also belongs to the scope of protection of the present invention.

[0073] Furthermore, the vacuum mechanism 303 is also connected to a third pressure detector 310, which can detect the air pressure inside the vacuum mechanism 303. By comparing and analyzing the detection results of the third pressure detector 310 with the detection results of the first pressure detector 304 and / or the second pressure detector 308, the working status of the vacuum mechanism 303 can be conveniently checked, which is beneficial for the operator to quickly confirm whether the vacuum mechanism 303 is working normally.

[0074] Continue to refer to Figure 4As shown, in this embodiment, the exhaust assembly 30 also includes a second gas collecting box 311, one end of the second gas collecting box 311 is connected to the sweeper 14 of the vertical furnace, and the other end is connected to the exhaust mechanism 303 through the fourth exhaust pipe 313. Through the second gas collecting box 311 and the fourth exhaust pipe 313, the sweeper 14 can be gas-extracted, thereby achieving cooling of the sweeper 14. Since the heat in the sweeper 14 is continuously transferred with the exhaust, compared with the prior art, when the total amount of heat dissipated by the process pipe 11 remains unchanged, the temperature of the sweeper 14 can be maintained at a lower level, so that the ability of the sweeper 14 to receive heat is enhanced and the ability to release heat is weakened, thereby reducing the part of the heat dissipated by the process pipe 11 that can be transferred to the loading chamber 10, thereby reducing the heat received by the loading chamber 10, and cooperating with the exhaust cooling of the loading chamber 10, the temperature in the loading chamber 10 can be better controlled.

[0075] Optionally, a fifth exhaust pipe 312 is further provided between the second air collecting box 311 and the air extraction mechanism 303, and the fifth exhaust pipe 312 is provided with an air volume regulating valve 307, and can be exhausted at a flow rate different from that of the fourth exhaust pipe 313. Similar to the second exhaust pipe 305 and the third exhaust pipe 306, by exhausting air from the fourth exhaust pipe 313 and the fifth exhaust pipe 312 at the same time, it is possible to cool down with a higher efficiency, and by only exhausting air through one of the fourth exhaust pipe 313 or the fifth exhaust pipe 312, it is possible to reduce vibration and meet lower heat dissipation requirements. Further, in this embodiment, along the preset second direction, the second air collecting box 311 is connected to one end of the sweeper 14, and the other end of the sweeper 14 is connected to the sixth exhaust pipe 321. The sixth exhaust pipe 321 is connected between the air extraction mechanism 303 and the valve assembly 141 of the sweeper 14, and can cooperate with the second air collecting box 311 to comprehensively and evenly cool the interior of the sweeper 14 to avoid local overheating.

[0076] Preferably, in this embodiment, the fourth exhaust pipe 313 is provided with an air volume regulating valve 307 and is connected to a fourth pressure detector 314, so that the flow of the fourth exhaust pipe 313 can be adjusted in real time according to the detection result of the fourth pressure detector 314, thereby reducing the control difficulty and reducing vibration.

[0077] Furthermore, in this embodiment, a peripheral cabinet 15 is provided above the loading chamber 10, and the process tube 11 is contained in the peripheral cabinet 15. The exhaust mechanism 303 is provided outside the peripheral cabinet 15 to prevent the vibration of the exhaust mechanism 303 during operation from affecting the normal production of wafers. A seventh exhaust pipe 315 is connected between the exhaust mechanism 303 and the peripheral cabinet 15, and the seventh exhaust pipe 315 can extract the gas heated by the process tube 11 in the peripheral cabinet 15, thereby realizing cooling of the inside of the peripheral cabinet 15.

[0078] Reference Figure 2 , Figure 4 As shown, in this embodiment, the vertical furnace also includes a wafer box 16. A nitrogen atmosphere needs to be maintained inside the wafer box 16 to prevent the wafers inside from being oxidized or contaminated, so it is necessary to continuously supply nitrogen and exhaust gas. Specifically, the loading chamber 10 is connected to two wafer boxes 16, and each wafer box 16 is connected to a third gas supply pipe 161, and nitrogen can enter the two wafer boxes 16 from the third gas supply pipe 161. In addition, the exhaust mechanism 303 is connected to an oxygen analyzer 316, and the oxygen analyzer 316 is connected to the two wafer boxes 16 and the loading chamber 10 through a pipeline, and can measure the oxygen content in the wafer box 16 and the loading chamber 10.

[0079] For example, in this embodiment, one wafer box 16 is connected to the first interface of the first three-way control valve 317 through a pipeline, another wafer box 16 is connected to the second interface of the first three-way control valve 317 through a pipeline, and the third interface of the first three-way control valve 317 is connected to the first interface of the second three-way control valve 318 through a pipeline. The second interface of the second three-way control valve 318 is connected to the loading chamber 10 through a pipeline, and the third interface of the second three-way control valve 318 is connected to the air inlet of the oxygen analyzer 316 through a pipeline, and the air outlet of the oxygen analyzer 316 is connected to the exhaust mechanism 303. The first three-way control valve 317 can selectively connect the third interface with one of the first interface and the second interface, and the second three-way control valve 318 can selectively connect the third interface with one of the first interface and the second interface, so that when the exhaust mechanism 303 is exhausting, the gas in the two wafer boxes 16 and one position in the loading chamber 10 can be selectively sucked into the oxygen analyzer 316 for analysis, so that only one oxygen analyzer 316 can meet the detection needs of multiple different positions. Of course, in some embodiments, for a heating furnace with more wafer boxes 16, a similar effect can be achieved by adding a third three-way control valve and a fourth three-way control valve, thereby greatly reducing the cost of oxygen analysis.

[0080] Exemplarily, first according to the preset charging flow parameters and charging time parameters, high-purity nitrogen is filled into two wafer boxes 16, and the air volume regulating valve (not shown in the figure of the air volume regulating valve) connected to the two wafer boxes 16 is opened at the same time, and the original oxygen-containing gas is discharged, and the replacement and content reduction of oxygen are gradually realized. In the process of oxygen reduction, the first three-way control valve 317 is first controlled to communicate the third interface with the first interface, and the third interface is separated from the second interface, and the second three-way control valve 318 is controlled to communicate the third interface with the first interface, and the third interface and the second interface are separated. At this time, it is possible to communicate a separate wafer box 16 with an oxygen analyzer 316, so that the oxygen analyzer 316 only detects one of the wafer boxes 16. Similarly, in the process of oxygen reduction, the first three-way control valve 317 can also be controlled to separate the third interface from the first interface, and the third interface and the second interface are connected, and the second three-way control valve 318 is controlled to communicate the third interface with the first interface, and the third interface and the second interface are separated. At this time, another wafer box 16 can be connected to the oxygen analyzer 316, so that the oxygen analyzer 316 can only detect the wafer box 16. When there is no need to detect the wafer box 16, for example, before maintenance is required, by controlling the second three-way control valve 318 to connect the third interface with the second interface and to isolate the third interface from the first interface, the oxygen analyzer 316 can analyze the oxygen content in the loading chamber 10 at this time, ensuring that personnel can safely enter the loading chamber 10 and perform maintenance operations.

[0081] Continue to refer to Figure 2 , Figure 4 As shown, in this embodiment, multiple gas detectors 319 are also provided for real-time detection of process gases such as SiH4, PH3, and ClF3 to prevent process gas leakage from threatening personnel health. Specifically, the second gas collection box 311 is connected in series with multiple gas detectors 319 through a pipeline to detect the leakage of process gases in the sweeper 14. Each gas detector 319 is connected to the exhaust mechanism 303 to discharge the detected gas.

[0082] Optionally, the vertical furnace also has a special gas box 17, which is used to supply process gas, so it is also necessary to detect leakage. In the present embodiment, the special gas box 17 is also connected with a plurality of gas detectors 319, which can detect leakage. At the same time, since the gas in the special gas box 17 has a certain acidity and cannot be directly discharged into the external environment, the special gas box 17 is also connected with an exhaust gas treatment mechanism 18, so as to treat the harmful gas. Optionally, an air volume regulating valve 307 is also connected between the special gas box 17 and the exhaust gas treatment mechanism 18, and the special gas box 17 is connected with a fifth pressure detector 320, and the fifth pressure detector 320 detects the pressure value of the special gas box 17, and compares the pressure difference with the pressure value of the exhaust gas treatment mechanism 18 to ensure the normal operation of the exhaust.

[0083] The present invention also provides a heating furnace, which includes a process tube 14, a wafer boat conveying mechanism 13, a furnace door 12 and the above-mentioned loading chamber 10, the furnace opening of the process tube 14 is arranged in the first space M of the loading chamber 10, the furnace door 12 is used to close the furnace opening, the wafer boat conveying mechanism 13 can be completely accommodated in the second space N of the loading chamber 10, and can move into the first space M along a preset first direction to enter the process tube 14. The jet assembly 20 of the loading chamber 10 is used to perform overall jet cooling and local jet cooling on the wafer boat conveying mechanism 13, and the exhaust assembly 30 of the loading chamber 10 can suck the high-temperature gas between the wafer boat conveying mechanism 13 and the furnace door 12.

[0084] It should be noted that the loading chamber 10 can also be applied to other types of heating furnaces such as horizontal furnaces, and is not limited to vertical furnaces. It is only necessary to adaptively adjust the position of the injection assembly 20 and the exhaust assembly 30 connected to the loading chamber 10 according to the setting position of the wafer boat transport mechanism 13 and the furnace door 12 in the loading chamber 10.

[0085] The present invention also provides a heating furnace temperature adjustment method, which is applied to the above-mentioned heating furnace, comprising:

[0086] The second space N is cooled by jetting as a whole; the end of the second space N close to the first space M is cooled by jetting locally; and the high-temperature gas in the first space M is discharged by suction.

[0087] Among them, the overall jet cooling is implemented through the above-mentioned first jet pipe 201, the local jet cooling is implemented through the above-mentioned second jet pipe 202, and the suction exhaust is implemented through the above-mentioned exhaust component 30, which will not be described in detail in the present invention.

[0088] By performing jet cooling on the entire second space N and performing local jet cooling on the end of the second space N close to the first space M, the temperature of the boat transport mechanism 13 (as well as the boat and wafers taken out) in the descending state can be reduced, the temperature of the heat source in the loading chamber 10 can be reduced, and the temperature of the wafers can be reduced to avoid the wafers being kept in a high temperature state and affecting the product quality. By sucking gas from the first space M, the high-temperature gas can be drawn out of the loading chamber 10 to directly reduce the temperature in the loading chamber 10. Through the cooperation of the jet assembly 20 and the exhaust assembly 30, the temperature of the loading chamber 10 can be quickly and significantly reduced, thereby avoiding the damage of the devices in the loading chamber 10 due to high temperature, and avoiding the reaction of the wafers at high temperature in the loading chamber 10 that affects the product quality. At the same time, it is also beneficial to reduce the cooling time required for the loading chamber 10 and improve the working efficiency of the heating furnace.

[0089] Obviously, the above embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not intended to limit the embodiments of the present invention. For those skilled in the art, various obvious changes, readjustments and substitutions can be made without departing from the protection scope of the present invention. It is not necessary and impossible to list all the embodiments here. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the claims of the present invention.

Claims

1. A loading chamber, wherein the loading chamber includes a first space and a second space along a preset first direction, the wafer boat transport mechanism can be completely accommodated in the second space, and can move along the preset first direction into the first space to enter the process tube, characterized in that: The loading chamber is also provided with: an air jet assembly, the air jet assembly comprising a first air jet pipe and a second air jet pipe, the first air jet pipe being used for performing air jet cooling on the entire second space, and the second air jet pipe being used for performing local air jet cooling on an end portion of the second space close to the first space; An exhaust component is used to extract the gas in the first space.

2. The loading chamber according to claim 1, characterized in that Along a preset second direction, the first air jet pipe and the second air jet pipe are both arranged at one end in the second space and can both jet in a direction toward the other end of the second space, and the preset second direction is perpendicular to the preset first direction.

3. The loading chamber according to claim 2, characterized in that: The first air injection pipe and the second air injection pipe are both extended along the preset first direction, and, The first jet pipe is provided with a plurality of first jet holes arranged along the preset first direction, and the second jet pipe is provided with a plurality of second jet holes arranged along the preset first direction. Gas can flow out of the first jet holes and the second jet holes respectively and flow in the second space along the preset second direction, and the distance between the two first jet holes that are farthest apart is not less than the length dimension of the wafer boat transport mechanism.

4. The loading chamber according to claim 2, characterized in that: The loading chamber has a first air duct, a circulation component is arranged in the first air duct, and a first air inlet is formed on the inner wall of the loading chamber. The gas in the loading chamber can enter the first air duct from the first air inlet and flow through the circulation component. The circulation component can cool and filter the gas flowing through the first air duct, and input the cooled and filtered gas into the loading chamber.

5. The loading chamber according to claim 4, characterized in that The circulation component includes a first heat exchanger, a fan and a filter. The first heat exchanger, the fan and the filter are arranged in the first air duct in sequence. The filter is provided with a circulation outlet. The gas in the loading chamber can enter the loading chamber again through the circulation outlet after flowing through the circulation component.

6. The loading chamber according to claim 5, characterized in that Along the preset second direction, the jet assembly is arranged at one end of the second space, and the first air inlet is arranged at the other end of the second space.

7. The loading chamber according to claim 6, characterized in that Along the preset second direction, the filter and the jet assembly are arranged at the same end of the loading chamber, and the air outlet direction of the circulating air outlet and the jet direction of the jet assembly are both arranged along the preset second direction.

8. The loading chamber according to claim 5, characterized in that The loading chamber also has a second air duct, which has a second air inlet formed on the inner wall of the loading chamber. The circulation component also includes a second heat exchanger, which is arranged in the second air duct, and the second air duct and the first air duct are connected at the installation position of the fan. Driven by the fan, the gas in the loading chamber can flow from the second air inlet in sequence through the second air duct, the fan and the filter, and enter the loading chamber again.

9. The loading chamber according to claim 4, characterized in that: The first air duct is also connected to an air intake valve, and when the air intake valve is opened, external air can flow through the circulation component through the air intake valve and enter the loading chamber.

10. The loading chamber according to claim 9, characterized in that The first air duct is also provided with an air intake control valve, which is arranged between the air intake valve and the first air inlet, and is used to prevent external air from flowing into the loading chamber from the first air inlet.

11. The loading chamber according to claim 9, characterized in that The circulation component is also connected to a second air supply pipe, and the second air supply pipe is used to input inert gas into the loading chamber through the first air duct and discharge oxygen-containing air in the first air duct.

12. The loading chamber according to claim 2, characterized in that The exhaust assembly is arranged outside the loading chamber, and includes a first air collecting box, a first exhaust pipe and an exhaust mechanism, wherein the first air collecting box and the first exhaust pipe are both connected to the exhaust mechanism, and, Along the preset second direction, the first gas collecting box is connected to one end of the loading chamber, the first exhaust pipe is connected to the other end of the loading chamber, and the exhaust mechanism can suck the gas in the first space through the first exhaust pipe and the first gas collecting box.

13. The loading chamber according to claim 12, characterized in that A second exhaust pipe and a third exhaust pipe are connected between the first air collecting box and the air exhaust mechanism. The second exhaust pipe and the third exhaust pipe have different exhaust efficiencies. The air exhaust mechanism can selectively communicate with the first air collecting box through at least one of the second exhaust pipe and the third exhaust pipe.

14. The loading chamber according to claim 13, characterized in that The air extraction mechanism is connected to a third pressure detector, and, The second exhaust pipe is connected to a first pressure detector; and / or, The loading chamber is connected to a second pressure detector.

15. The loading chamber according to claim 12, characterized in that A sweeper is also provided outside the loading chamber, and the exhaust assembly also includes a second air collecting box, the second air collecting box is connected to the sweeper, and is connected to a fourth exhaust pipe, the fourth exhaust pipe is connected to the exhaust mechanism, and the exhaust mechanism can be connected to the sweeper through the second air collecting box and the fourth exhaust pipe.

16. The loading chamber according to claim 15, characterized in that A fifth exhaust pipe is also connected between the second air collecting box and the air exhaust mechanism. The fifth exhaust pipe and the fourth exhaust pipe have different exhaust efficiencies. The air exhaust mechanism can selectively communicate with the second air collecting box through at least one of the fourth exhaust pipe and the fifth exhaust pipe.

17. The load chamber according to claim 15, characterized in that The air extraction mechanism is also connected to a sixth exhaust pipe. Along the preset second direction, the second air collecting box is connected to one end of the sweeper, and the sixth exhaust pipe is connected to the other end of the sweeper.

18. The loading chamber according to claim 12, characterized in that The exhaust mechanism is also connected to an oxygen analyzer, a second three-way control valve, a first three-way control valve and at least two wafer boxes, one of the wafer boxes is connected to the first interface of the first three-way control valve, the other of the wafer boxes is connected to the second interface of the first three-way control valve, the third interface of the first three-way control valve is connected to the first interface of the second three-way control valve, the second interface of the second three-way control valve is connected to the loading chamber, the third interface of the second three-way control valve is connected to the air inlet of the oxygen analyzer, the air outlet of the oxygen analyzer is connected to the exhaust mechanism, the first three-way control valve can selectively connect the third interface of the first three-way control valve with one of the first interface and the second interface, and the second three-way control valve can selectively connect the third interface of the second three-way control valve with one of the first interface and the second interface.

19. The load chamber according to claim 15, characterized in that The gas extraction mechanism is also connected to a gas detector, and the gas detector is connected to the second gas collecting box; and / or, The air extraction mechanism is also connected to a gas detector, and the gas detector is connected to a special gas box.

20. A heating furnace, characterized in that: It includes a process tube, a wafer boat transport mechanism, a furnace door and a loading chamber as described in any one of claims 1 to 19, wherein the furnace opening of the process tube is arranged in a first space of the loading chamber, the furnace door is used to close the furnace opening, the wafer boat transport mechanism can be completely accommodated in a second space of the loading chamber, and can move along a preset first direction into the first space to enter the process tube.

21. A method for regulating the temperature of a heating furnace, applied to a loading chamber as claimed in any one of claims 1 to 19, characterized in that: include: Performing overall jet cooling in the second space; Performing local jet cooling on the end of the second space close to the first space; The high-temperature gas in the first space is sucked out.

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