Device for detecting wall thickness of pinhole piece of electric connector

Abstract

The invention relates to the technical field of wall thickness detection, in particular to an electric connector pinhole piece wall thickness detection device which comprises a laser thickness gauge mounting base, a horizontal limiting plate is fixedly mounted at the upper end of the laser thickness gauge mounting base, and a sliding seat is slidably connected to the outer surface of the horizontal limiting plate. The linkage contraction mechanism drives the laser outer frame to move inwards and outwards along the laser thickness gauge body, and when the laser outer frame and the semiconductor laser are combined to be recycled to an inner cavity of the avoiding notch, the baffle expansion mechanism is triggered to drive the protective baffle and the cleaning mechanism to horizontally and relatively move, and the outer wall of the semiconductor laser is automatically cleaned. And when the baffle plate expansion mechanism drives the two groups of protection baffle plates to be combined, the gap of the avoiding notch is blocked, so that the recovered laser outer frame and the semiconductor laser are blocked and protected, the laser outer frame and the semiconductor laser are blocked and stored, the service life is prolonged, and the accuracy of the wall thickness detection of the pinhole piece is improved.

Description

Technical Field

[0001] The invention relates to the technical field of wall thickness detection, in particular to a device for detecting the wall thickness of a pinhole part of an electrical connector. Background Art

[0002] Wall thickness detection devices usually use advanced measurement technologies, such as ultrasonic thickness measurement, laser thickness measurement or optical interference thickness measurement. High-precision laser thickness gauges can usually directly output digital signals and connect to industrial computers to quickly process data and output deviation values. When detecting the wall thickness of the pinhole parts of electrical connectors, the laser thickness gauge will emit a beam of laser to the surface of the pinhole part being measured. After the laser beam contacts the surface of the pinhole part, it will be reflected back and received by the receiver. By measuring the time difference or phase difference from the emission to the reception of the laser beam, the propagation distance of the laser beam in the pinhole part can be calculated, and then the wall thickness of the pinhole part can be obtained.

[0003] In the prior art, there is a laser thickness gauge with publication number CN220062871U, which belongs to the field of optical measurement technology, and includes a body, a front end face of the body is provided with a working area, and the working area is provided with a laser device; the laser device includes a first laser device and a second laser device, the first laser device and the second laser device are arranged relatively up and down, and the first laser device and the second laser device slide synchronously in the working area, wherein the rear end face of the shell of the first laser device is provided with a driving member for driving the first laser device to slide left and right, the driving member includes a motor fixedly arranged inside the body, the driving end of the motor is poweredly connected with an incomplete gear, the incomplete gear is meshed with a driven member, and the driven member is fixedly arranged on the rear end face of the first laser device; under the action of the driving member, the laser thickness gauge realizes continuous scanning in the moving process, is simple to operate and convenient to use, and at the same time solves the service life of the motor and improves the accuracy of detection.

[0004] However, during the pinhole parts wall thickness detection process, it is impossible to detect the wall thickness of multiple groups of pinhole parts. After the detection is completed, the laser equipment is exposed to the outside, which is very easy to accumulate dust and needs to be manually cleaned before the next start-up detection. Moreover, long periods of idleness and exposure to the outside can easily shorten the service life of the laser equipment, thus affecting the performance of the wall thickness detection equipment and reducing the detection work efficiency.

[0005] Therefore, the present invention proposes a wall thickness detection device for a pinhole part of an electrical connector to solve the problem that the existing wall thickness detection equipment is easily exposed to the outside when idle for a long time, which may shorten the service life of the laser equipment, thus affecting the performance of the wall thickness detection equipment and reducing the detection work efficiency. Summary of the invention

[0006] In view of the shortcomings of the prior art, the present invention aims to provide a device for detecting the wall thickness of a pinhole component of an electrical connector to solve the problems raised in the background technology.

[0007] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a device for detecting the wall thickness of a pinhole part of an electrical connector, comprising a laser thickness gauge mounting base, a horizontal limit plate being fixedly mounted on the upper end of the laser thickness gauge mounting base, a sliding seat being slidably connected to the outer surface of the horizontal limit plate, a laser thickness gauge body being fixedly mounted on the upper end of the sliding seat, an electrical connector pinhole part mounting base being arranged on one side of the laser thickness gauge body, an inner cavity of the laser thickness gauge body being arranged with a receiving cavity and an avoidance groove, a horizontal telescopic plate being movably connected to the inner side of the receiving cavity, a laser outer frame being arranged at one end of the horizontal telescopic plate close to the avoidance groove, and the laser A semiconductor laser is movably mounted on the inner side of the optical device outer frame, and two groups of semiconductor lasers are arranged and relatively distributed, a quick-release assembly is arranged between the semiconductor laser and the laser outer frame, a double-sided gear rod is fixedly connected to one end of the horizontal telescopic plate away from the laser outer frame, a linkage contraction mechanism is arranged on the outer side of the double-sided gear rod, a protective baffle is arranged on the outer side of the avoidance groove, a cleaning assembly is arranged on the inner side of the protective baffle, and a baffle expansion mechanism is arranged between the protective baffle and the laser thickness gauge body; a hydraulic cylinder is fixedly mounted on one end of the horizontal limit plate, and a piston rod at the output end of the hydraulic cylinder is fixedly connected to one side of the slide seat.

[0008] Preferably, the linkage retraction mechanism includes a driving motor, which is fixedly mounted on an outer surface of one side of the laser thickness gauge body, and an output shaft of the driving motor is fixedly connected to a bevel gear 1, one side of the bevel gear 1 is meshed and rotatably engaged with a bevel gear 2, a central inner surface of the bevel gear 2 is fixedly connected to a central rod, and an outer surface of the central rod is rotatably connected to a support plate fixedly connected to the inner wall of the laser thickness gauge body.

[0009] Preferably, the outer surfaces of both ends of the center rod are respectively fixedly connected with a driving center gear, and the outer surfaces of both sides of the driving center gear are meshed and rotated with driven side gear 1 and driven side gear 2, and the central inner surfaces of the driven side gear 1 and driven side gear 2 are fixedly connected with a center connecting rod, and the outer surfaces of the center connecting rod are respectively fixedly connected with fan gear 1 and fan gear 2.

[0010] Preferably, the sector gear 1 and the sector gear 2 are configured as sector plate structures, and one side of the sector gear 1 and the sector gear 2 is configured as a curved tooth surface, and the outer surface of the curved tooth surface is adapted to mesh with the outer surface of the double-sided gear rod.

[0011] Preferably, the baffle expansion mechanism includes a mounting plate and a limiting slide bar. Anti-disengagement blocks are fixedly installed at both ends of the limiting slide bar. The mounting plate and the limiting slide bar are both fixedly installed on the outer surface of the laser thickness gauge body close to the avoidance notch through bolts. The mounting plate is in a "T"-shaped plate structure. Electric telescopic rods are fixedly installed on the outer surfaces of both sides of the mounting plate. The output ends of the electric telescopic rods are fixedly connected with connecting side plates. There are two groups of electric telescopic rods and connecting side plates respectively, and they are mirror-symmetrically distributed about the central axis of the mounting plate.

[0012] Preferably, the connecting side plate is fixedly installed on one side of the protective baffle. A top-side limiting plate is fixedly installed at the upper end of the protective baffle. The outer surface of the top-side limiting plate is fixedly connected with the connecting side plate. The top-side limiting plate and the upper end of the protective baffle jointly form a convex structure. A concave groove is arranged inside the convex structure. The inner surface of the concave groove is slidably connected with the outer surface of the limiting slide bar.

[0013] Preferably, the cleaning assembly includes a cleaning soft brush and cleaning cotton strips. The cleaning cotton strips are distributed on both sides of the cleaning soft brush. One group of cleaning soft brush and two groups of cleaning cotton strips form a combination. The cleaning soft brush and the cleaning cotton strips are evenly distributed inside the protective baffle, and the outer surfaces of the cleaning soft brush and the cleaning cotton strips are movably connected with the outer surface of the semiconductor laser.

[0014] Preferably, the semiconductor laser is movably embedded in the inner surface of the laser outer frame. A high-transparency glass plate is arranged on the laser outer frame. The laser outer frame and the high-transparency glass plate form a frame structure with an opening away from the horizontal telescopic plate side. An embedding groove is opened on the inner wall of the laser outer frame away from the high-transparency glass plate. A soft clamping block is arranged inside the embedding groove. The outer surface of the soft clamping block is movably abutted against the outer surface of the semiconductor laser.

[0015] Preferably, a locking sealing plate is fixedly installed on the outer surface of the soft clamping block. A metal elastic block is fixedly connected to the inner side surface of the locking sealing plate. The metal elastic blocks are symmetrically distributed on both sides of the soft clamping block, and the other ends of the metal elastic blocks are fixedly connected with the outer surface of the laser outer frame. A locking groove is arranged at one end of the locking sealing plate.

[0016] Preferably, the quick-installation component includes an auxiliary strip-shaped embedding frame. The auxiliary strip-shaped embedding frame is fixedly installed on the outside of the laser outer frame in a "C"-shaped plate structure. A combined embedding block is fixedly installed on the auxiliary strip-shaped embedding frame. An annular groove is opened on the inner wall of the combined embedding block. A sliding lock block is movably connected to the inner surface of the annular groove. A thumb contact groove is arranged on the outer surface of the sliding lock block. There are two groups of sliding lock blocks and thumb contact grooves. Elastic blocks are fixedly connected to the inner sides of the two groups of sliding lock blocks, and the inner ends of the two groups of sliding lock blocks are respectively movably embedded in the inner surface of the locking groove.

[0017] Compared with the prior art, the present invention has the following beneficial effects:

[0018] The present invention proposes a device for detecting the wall thickness of a pinhole part of an electrical connector. The device drives a laser outer frame to move inside and outside along a laser thickness gauge body through a linkage contraction mechanism. When the laser outer frame is combined with a semiconductor laser to be recovered to the inner cavity of an avoidance groove, a baffle expansion mechanism is triggered to drive the protective baffle and a cleaning mechanism to move horizontally relative to each other, so as to automatically clean the outer wall of the semiconductor laser. When the baffle expansion mechanism drives two groups of protective baffles to merge, the gap of the avoidance groove is sealed, so as to block and protect the recovered laser outer frame and semiconductor laser, realize the isolation and storage of the laser outer frame and the semiconductor laser, extend the service life, and improve the accuracy of the pinhole part wall thickness detection. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a schematic diagram of the three-dimensional structure of the present invention;

[0020] Figure 2 It is a schematic diagram of the structure of two groups of protective baffles of the present invention in a separated state;

[0021] Figure 3 This is a schematic diagram of the structure of two groups of protective baffles in a combined state of the present invention;

[0022] Figure 4 It is a schematic diagram of the disassembled structure of the laser thickness gauge body and its internal structure of the present invention;

[0023] Figure 5 It is a schematic diagram of the internal structure of the laser thickness gauge body of the present invention;

[0024] Figure 6 For the present invention Figure 5 A schematic diagram of the enlarged structure at point A;

[0025] Figure 7 It is a schematic diagram of the detached structure of the semiconductor laser and the laser frame of the present invention;

[0026] Figure 8 It is a schematic diagram of the connection structure between the horizontal telescopic plate and the laser outer frame of the present invention;

[0027] Fig. 9 It is a schematic diagram of the assembly structure of the laser outer frame and the semiconductor laser of the present invention;

[0028] Fig.10 For the present invention Fig. 9 A schematic diagram of the enlarged structure at B;

[0029] Fig.11 It is a schematic diagram of the connection structure between the auxiliary bar-shaped embedded frame and the quick-install component of the present invention;

[0030] Fig.12 For the present invention Fig.11 A schematic diagram of the enlarged structure at C;

[0031] Fig.13 It is a schematic diagram of the cross-sectional structure of the connection between the locking sealing plate and the flexible clamping block of the present invention;

[0032] Fig.14 It is a schematic diagram of the connection structure between the protective baffle and the baffle extension mechanism of the present invention;

[0033] Fig.15 It is a schematic diagram of the connection structure between the protective baffle and the cleaning assembly of the present invention;

[0034] Fig.16 For the present invention Fig.14 Enlarged structural diagram at D.

[0035] In the figure: 1. Laser thickness gauge mounting base; 11. Horizontal stop plate; 12. Slide seat; 13. Electrical connector pinhole mounting seat; 2. Laser thickness gauge body; 20. Accommodating cavity; 200. Avoidance slot; 201. Stop block; 21. Horizontal telescopic plate; 211. Double-sided gear rod; 22. Driving motor; 221. Bevel gear 1; 222. Bevel gear 2; 223. Center rod; 224. Active center gear; 225. Driven side gear 1; 2251. Fan gear 1; 226. Driven side gear 2; 2261. Fan gear 2; 3. Laser outer frame; 31. Semi-circular gear; 32. Conductor laser; 30, high-transmittance glass plate; 300, embedded groove; 32, auxiliary strip embedded frame; 321, joint embedded block; 3210, annular groove; 322, sliding lock block; 3221, thumb contact groove; 323, elastic block; 33, locking sealing plate; 330, locking groove; 331, soft clamping block; 3311, metal spring block; 4, protective baffle; 40, top side limit plate; 41, mounting plate; 411, electric telescopic rod; 412, connecting side plate; 42, limit slide rod; 421, anti-slip block; 43, cleaning soft brush; 431, cleaning cotton strip; 432, strip triangular bottom plate. DETAILED DESCRIPTION

[0036] In order to make the purpose and technical solution of the present invention clearly and completely described, and the advantages more clearly understood, the embodiments of the present invention are further described in detail with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are part of the embodiments of the present invention, not all of them, and are only used to explain the embodiments of the present invention, and are not used to limit the embodiments of the present invention. All other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0037] For example, see Figure 1-16 , the present invention provides a technical solution: an electric connector pinhole wall thickness detection device, including a laser thickness gauge mounting base 1. A horizontal limit plate 11 is fixedly installed at the upper end of the laser thickness gauge mounting base 1. A sliding seat 12 is slidably connected to the outer surface of the horizontal limit plate 11. A laser thickness gauge body 2 is fixedly installed at the upper end of the sliding seat 12. An electric connector pinhole part mounting seat 13 is arranged on one side of the laser thickness gauge body 2. A receiving cavity 20 and an avoidance notch 200 are arranged in the inner cavity of the laser thickness gauge body 2. A horizontal expansion plate 21 is movably connected to the inner side of the receiving cavity 20. A laser outer frame 3 is arranged at one end of the horizontal expansion plate 21 close to the avoidance notch 200. A semiconductor laser 31 is movably installed inside the laser outer frame 3. There are two groups of semiconductor lasers 31 and they are distributed relatively. A quick installation component is arranged between the semiconductor laser 31 and the laser outer frame 3. A double-sided toothed rod 211 is fixedly connected to the end of the horizontal expansion plate 21 far from the laser outer frame 3. A linkage contraction mechanism is arranged on the outer side of the double-sided toothed rod 211. A protective baffle 4 is arranged on the outer side of the avoidance notch 200. A cleaning component is arranged on the inner side of the protective baffle 4. A baffle expansion mechanism is arranged between the protective baffle 4 and the laser thickness gauge body 2; A limit block 201 is slidably connected to the outer surface of the horizontal expansion plate 21. The limit block 201 is in the shape of a "C"-shaped plate structure and is fixedly installed on the inner wall of the receiving cavity 20; The laser outer frame 3 is driven to move in and out along the laser thickness gauge body 2 through the linkage contraction mechanism. When the laser outer frame 3 and the semiconductor laser 31 are retracted into the inner cavity of the avoidance notch 200, the baffle expansion mechanism is triggered, driving the protective baffle 4 and the cleaning mechanism to move horizontally relative to each other to automatically clean the outer wall of the semiconductor laser 31. And when the baffle expansion mechanism drives the two groups of protective baffles 4 to merge, the notch of the avoidance notch 200 is blocked, meeting the requirements of blocking and protecting the retracted laser outer frame 3 and semiconductor laser 31, realizing the blocking and storage of the laser outer frame 3 and semiconductor laser 31, prolonging the service life, and improving the accuracy of pinhole wall thickness detection.

[0038] Embodiment 2, referring to the attached Figure 1-16On the basis of the first embodiment, in order to realize the movement of the laser outer frame 3 and the semiconductor laser 31 inside the laser thickness gauge body 2: the linkage contraction mechanism includes a driving motor 22, the driving motor 22 is fixedly mounted on the outer surface of one side of the laser thickness gauge body 2, the output shaft of the driving motor 22 is fixedly connected with a bevel gear 1 221, one side of the bevel gear 1 221 is meshed and rotated with a bevel gear 222, the inner surface of the center of the bevel gear 222 is fixedly connected with a center rod 223, the outer surface of the center rod 223 is rotatably connected with a support plate fixedly connected to the inner wall of the laser thickness gauge body 2; the outer surfaces of both ends of the center rod 223 are respectively fixed A driving central gear 224 is fixedly connected, and the outer surfaces of both sides of the driving central gear 224 are meshed and rotated with a driven side gear 1 225 and a driven side gear 2 226. The inner central surfaces of the driven side gears 1 225 and 226 are fixedly connected with a central connecting rod, and the outer surfaces of the central connecting rod are respectively fixedly connected with a sector gear 1 2251 and a sector gear 2 2261; the sector gear 1 2251 and the sector gear 2 2261 are configured as a sector plate structure, and one side of the sector gear 1 2251 and the sector gear 2 2261 is configured as a curved tooth surface, and the outer surface of the curved tooth surface is adapted to mesh with the outer surface of the double-sided gear rod 211;

[0039] In this embodiment, the semiconductor laser 31 is installed on the inner side of the laser outer frame 3, and one side of the laser outer frame 3 is connected to the end of the horizontal telescopic plate 21 away from the double-sided gear rod 211. The drive motor 22 is started, and its output shaft rotates and drives the umbrella gear 1 221 and the umbrella gear 2 222 to fit and mesh, and the center rod 223 rotates. At this time, the active center gear 224 connected to the two ends of the center rod 223 rotates and fits with the driven side gear 1 225 and the driven side gear 2 226 on both sides, so as to drive The sector gear 1 2251 and the sector gear 2 2261 swing, and the sector gear 1 2251 and the sector gear 2 2261 always keep parallel and rotate in the same direction. Then, when the sector gear 1 2251 on one side is adapted to the umbrella gear 1 221, the curved tooth surface of the other set of sector gears 2 2261 is away from the double-sided gear rod 211, so that the reciprocating motion of the laser outer frame 3 can be realized by the drive of the drive motor 22, and the activity of the laser outer frame 3 in the inner cavity of the receiving cavity 20 is realized. Figure 4 , Figure 5 and Figure 6 As shown, when the laser outer frame 3 is recycled, it is stored in the inner cavity of the avoidance groove 200, ensuring that the two sets of semiconductor lasers 31 can be quickly extended when detecting the wall thickness of the pinhole component, and can be conveniently stored when idle.

[0040] Embodiment 3, refer to the attached Figure 1-16On the basis of the second embodiment, in order to achieve the blocking of the gap position of the avoidance groove 200 after the laser outer frame 3 is connected to the semiconductor laser 31 and stored: the baffle expansion mechanism includes a mounting plate 41 and a limiting slide bar 42, and anti-dropping blocks 421 are fixedly installed at both ends of the limiting slide bar 42. The mounting plate 41 and the limiting slide bar 42 are both fixedly installed on the outer surface of the laser thickness gauge body 2 near the avoidance groove 200 by bolts. The mounting plate 41 is a "T"-shaped plate structure, and the outer surfaces of both sides of the mounting plate 41 are fixedly installed with electric telescopic rods 411. The electric telescopic rods 411 The output end is fixedly connected with a connecting side plate 412, and the electric telescopic rod 411 and the connecting side plate 412 are respectively provided with two groups and are mirror-distributed about the central axis of the mounting plate 41; the connecting side plate 412 is fixedly installed on one side of the protective baffle 4, and a top side limiting plate 40 is fixedly installed on the upper end of the protective baffle 4, and the outer surface of the top side limiting plate 40 is fixedly connected to the connecting side plate 412, and the top side limiting plate 40 and the upper end of the protective baffle 4 jointly form a convex structure, and a concave groove is provided on the inner side of the convex structure, and the inner surface of the concave groove is slidably connected to the outer surface of the limiting sliding rod 42;

[0041] In this embodiment, if Figure 14-16 As shown, after the laser frame 3 and the semiconductor laser 31 are stored in the avoidance groove 200, the two sets of electric telescopic rods 411 are triggered at the same time, and the piston rods at the output ends thereof drive the connecting side plates 412 and the protective baffle 4 connected on one side to move relative to each other. At this time, the top side limit plate 40 slides on the surface of the limit slide 42. Here, the limit slide 42 serves as a limit piece for the top side limit plate 40, maintaining the stability of the horizontal movement of the protective baffle 4 and the top side limit plate 40, and with the addition of the anti-slip block 421, the range of movement of the top side limit plate 40 is limited. When the two sets of protective baffles 4 gradually move toward the center and are completely close together, the avoidance groove 200 is blocked, thereby achieving the protection effect of the laser frame 3 and the semiconductor laser 31.

[0042] Embodiment 4, refer to the attached Figure 1-16 On the basis of the third embodiment, in order to realize the cleaning of the side wall of the semiconductor laser 31: the cleaning component includes a cleaning soft brush 43 and a cleaning cotton strip 431, the cleaning cotton strip 431 is distributed on both sides of the cleaning soft brush 43, and two groups of cleaning cotton strips 431 and one group of cleaning soft brush 43 are a combination, the cleaning soft brush 43 and the cleaning cotton strip 431 are evenly distributed on the inner side of the protective baffle 4, and the outer surfaces of the cleaning soft brush 43 and the cleaning cotton strip 431 are movably connected to the outer surface of the semiconductor laser 31; a strip triangular bottom plate 432 is fixedly connected to the inner wall of the lower end of the cleaning soft brush 43, and the cross-section of the strip triangular bottom plate 432 is a right-angled triangle structure, and the inclined surface of the right-angled triangle is distributed to the inner side of the protective baffle 4;

[0043] In this embodiment, refer to Fig.14 , Fig.15 and Fig.16 As shown, the cleaning component is installed inside the protective baffle 4. When the protective baffle 4 moves horizontally along the limit slide bar 42, the cleaning soft brush 43 and the cleaning cotton strip 431 laid on the inner side of the protective baffle 4 wipe the outer surface of the semiconductor laser 31, thus realizing the self-cleaning of the dust on the single exposed surface of the semiconductor laser 31. The reason for designing the strip-shaped triangular bottom plate 432 into this right-angled triangle structure is to better store the dust falling from above, avoid the falling of dust, cause the situation of secondary dust raising, and avoid affecting the semiconductor laser 31 below.

[0044] Example Five. Refer to the attached Figure 1-16 , on the basis of Example Four, in order to realize the quick assembly and disassembly between the semiconductor laser 31 and the laser outer frame 3: The semiconductor laser 31 is movably embedded on the inner surface of the laser outer frame 3. A high-transparency glass plate 30 is provided on the laser outer frame 3. The laser outer frame 3 and the high-transparency glass plate 30 form a frame structure with an opening away from the horizontal telescopic plate 21 side. An embedding groove 300 is opened on the inner wall of the laser outer frame 3 away from the high-transparency glass plate 30. A soft clamping block 331 is provided inside the embedding groove 300. The outer surface of the soft clamping block 331 is in movable contact with the outer surface of the semiconductor laser 31; A locking sealing plate 33 is fixedly installed on the outer surface of the soft clamping block 331. A metal elastic block 3311 is fixedly connected to the inner side surface of the locking sealing plate 33. The metal elastic blocks 3311 are symmetrically distributed on both sides of the soft clamping block 331, and the other end of the metal elastic block 3311 is fixedly connected to the outer surface of the laser outer frame 3. A locking groove 330 is provided at one end of the locking sealing plate 33; The quick-installation component includes an auxiliary strip-shaped embedding frame 32. The auxiliary strip-shaped embedding frame 32 is fixedly installed on the outer side of the laser outer frame 3 in a "C"-shaped plate structure. A combined embedding block 321 is fixedly installed on the auxiliary strip-shaped embedding frame 32. An annular groove 3210 is opened on the inner wall of the combined embedding block 321. A sliding locking block 322 is movably connected to the inner surface of the annular groove 3210. A thumb contact groove 3221 is provided on the outer surface of the sliding locking block 322. Both the sliding locking block 322 and the thumb contact groove 3221 are provided in two groups. An elastic block 323 is fixedly connected to the inner sides of the two groups of sliding locking blocks 322, and one ends of the inner sides of the two groups of sliding locking blocks 322 are respectively movably embedded in the inner surface of the locking groove 330;

[0045] In this embodiment, refer to Figure 9-13As shown, the semiconductor laser 31 is inserted into the opening on one side of the laser outer frame 3, and the laser test probe is aligned with the high-transmittance glass plate 30 position of the laser outer frame 3. At this time, the soft clamping block 331 is inserted into the groove on the side of the semiconductor laser 31 for resistance. When the semiconductor laser 31 needs to be disassembled, the operator places the thumb and index finger on the two sets of sliding lock blocks 322 respectively, and the thumb contact groove 3221 contacts the thumb to increase the friction of the thumb. At this time, the two fingers are opened to both sides, and the sliding lock block 322 is pushed to move on the inner side of the annular groove 3210. At this time, the locking groove 330 on one side of the locking sealing plate 33 is separated from the restriction of the sliding lock block 322. In this way, the soft clamping block 331 moves outward under the elastic storage force of the metal spring block 3311, and the soft clamping block 331 releases the restriction on the side of the semiconductor laser 31. At this time, the semiconductor laser 31 is no longer subjected to the clamping force, so it is only necessary to pull the semiconductor laser 31 outward. The disassembly is completed; on the contrary, when the semiconductor laser 31 is installed, after repeating the above operation, the pushed sliding lock block 322 is released, and the elastic block 323 pulls the sliding lock blocks 322 on both sides to quickly reset, and can provide a certain degree of resistance to prevent the sliding lock blocks 322 from separating without external force. At this time, the sliding lock block 322 locks the upper end of the locking sealing plate 33 again to ensure that the soft clamping block 331 clamps the side of the semiconductor laser 31; Yes, the surfaces of the metal spring block 3311 and the thumb contact groove 3221 are set to be soft rubber material, and the sliding lock block 322 is slightly higher than the joint embedding block 321. When the laser outer frame 3 and the semiconductor laser 31 are retracted to the inner side of the avoidance groove 200, the sliding lock block 322 contacts the side wall of the avoidance groove 200, on the one hand, it enhances the clamping force of the soft clamping block 331, and on the other hand, it contacts the side wall of the avoidance groove 200, thereby enhancing the tightness of the recovery of the laser outer frame 3.

[0046] The working principle and use process of the present invention are as follows: when in use, first, the pinhole part of the electrical connector to be detected is installed above the pinhole part mounting seat 13 of the electrical connector through a flexible clamp, and then the entire device is started, and the driving motor 22 is driven to make the umbrella gear 1 221 and the umbrella gear 2 222 fit and mesh, and the center rod 223 rotates. At this time, the active center gear 224 connected to the two ends of the center rod 223 rotates and fits with the driven side gear 1 225 and the driven side gear 2 226 on both sides, so that the drive center gear 224 can be driven by the driven side gear 225 and the driven side gear 226 on both sides. The movable sector gear 1 2251 and the sector gear 2 2261 swing, and the sector gear 1 2251 and the sector gear 2 2261 always keep parallel and rotate in the same direction. Then, when the sector gear 1 2251 on one side is adapted to the umbrella gear 1 221, the curved tooth surface of the other group of sector gears 2 2261 is away from the double-sided gear rod 211. At this time, the two groups of laser outer frames 3 synchronously extend horizontally out of the receiving cavity 20, and the two groups of semiconductor lasers 31 are aligned with the electrical connector pinhole member on the electrical connector pinhole member mounting seat 13. The wall thickness detection is carried out to obtain the thickness of the pinhole part of the electrical connector; when the laser frame 3 and the semiconductor laser 31 are stored in the avoidance groove 200, the two sets of electric telescopic rods 411 are triggered at the same time, and the piston rods at the output ends thereof drive the connecting side plates 412 and the protective baffle 4 connected on one side to move relative to each other. When the two sets of protective baffles 4 gradually move toward the center and are completely closed together, the avoidance groove 200 is blocked, thereby achieving the protection effect of the laser frame 3 and the semiconductor laser 31; when the protective baffles 4 are When the slider 4 moves horizontally along the limit slide bar 42, the cleaning soft brush 43 and the cleaning cotton strip 431 laid on the inner side of the protective baffle 4 wipe the outer surface of the semiconductor laser 31, thereby realizing the self-cleaning of dust on the single exposed surface of the semiconductor laser 31, and the strip-shaped triangular bottom plate 432 stores the wiped dust for subsequent centralized cleaning; the hydraulic cylinder controls the slider 12 to move horizontally on the horizontal limit plate 11, and controls the laser thickness gauge body 2 to move horizontally, thereby realizing the one-by-one detection of multiple groups of electrical connector pinhole parts.

[0047] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A device for detecting the wall thickness of a pinhole component of an electrical connector, comprising a laser thickness gauge mounting base (1), a horizontal limit plate (11) being fixedly mounted on the upper end of the laser thickness gauge mounting base (1), a sliding seat (12) being slidably connected to the outer surface of the horizontal limit plate (11), a laser thickness gauge body (2) being fixedly mounted on the upper end of the sliding seat (12), and an electrical connector pinhole component mounting seat (13) being arranged on one side of the laser thickness gauge body (2), characterized in that: The inner cavity of the laser thickness gauge body (2) is provided with a receiving cavity (20) and an avoidance groove (200); a horizontal telescopic plate (21) is movably connected to the inner side of the receiving cavity (20); a laser outer frame (3) is provided at one end of the horizontal telescopic plate (21) close to the avoidance groove (200); a semiconductor laser (31) is movably mounted on the inner side of the laser outer frame (3); two groups of semiconductor lasers (31) are provided and are relatively distributed; the semiconductor lasers (31) are arranged in pairs. 1) and a laser outer frame (3) are provided with a quick-install assembly, one end of the horizontal telescopic plate (21) away from the laser outer frame (3) is fixedly connected to a double-sided gear rod (211), a linkage contraction mechanism is provided on the outer side of the double-sided gear rod (211), a protective baffle (4) is provided on the outer side of the avoidance groove (200), a cleaning assembly is provided on the inner side of the protective baffle (4), and a baffle expansion mechanism is provided between the protective baffle (4) and the laser thickness gauge body (2).

2. The device for detecting the wall thickness of a pinhole of an electrical connector according to claim 1, characterized in that: The linkage retracting mechanism comprises a driving motor (22), the driving motor (22) being fixedly mounted on an outer surface of one side of a laser thickness gauge body (2), a parasol-shaped gear 1 (221) being fixedly connected to an output shaft of the driving motor (22), a parasol-shaped gear 2 (222) being meshed and rotatably engaged on one side of the parasol-shaped gear 1 (221), a center rod (223) being fixedly connected to the central inner surface of the parasol-shaped gear 2 (222), and a support plate fixedly connected to the inner wall of the laser thickness gauge body (2) being rotatably connected to the outer surface of the center rod (223).

3. The device for detecting the wall thickness of a pinhole of an electrical connector according to claim 2, characterized in that: The outer surfaces at both ends of the center rod (223) are respectively fixedly connected to a driving center gear (224), and the outer surfaces at both sides of the driving center gear (224) are meshed and rotated with a driven side gear 1 (225) and a driven side gear 2 (226), and the central inner surfaces of the driven side gear 1 (225) and the driven side gear 2 (226) are fixedly connected to a center connecting rod, and the outer surfaces of the center connecting rod are respectively fixedly connected to a sector gear 1 (2251) and a sector gear 2 (2261).

4. The device for detecting the wall thickness of a pinhole component of an electrical connector according to claim 3, characterized in that: The sector gear 1 (2251) and the sector gear 2 (2261) are configured as sector plate structures, and one side of the sector gear 1 (2251) and the sector gear 2 (2261) is configured as a curved tooth surface, and the outer surface of the curved tooth surface is adapted to mesh with the outer surface of the double-sided gear rod (211).

5. The device for detecting the wall thickness of a pinhole of an electrical connector according to claim 1, characterized in that: The baffle expansion mechanism comprises a mounting plate (41) and a limiting slide bar (42), anti-dropping blocks (421) are fixedly mounted at both ends of the limiting slide bar (42), the mounting plate (41) and the limiting slide bar (42) are both fixedly mounted on the outer surface of the laser thickness gauge body (2) near the avoidance groove (200) by bolts, the mounting plate (41) is a "T"-shaped plate structure, electric telescopic rods (411) are fixedly mounted on the outer surfaces of both sides of the mounting plate (41), the output end of the electric telescopic rod (411) is fixedly connected to a connecting side plate (412), and the electric telescopic rod (411) and the connecting side plate (412) are respectively provided in two groups and are mirror-distributed with respect to the central axis of the mounting plate (41).

6. The device for detecting the wall thickness of a pinhole of an electrical connector according to claim 5, characterized in that: The connecting side plate (412) is fixedly mounted on one side of the protective baffle (4); a top side limit plate (40) is fixedly mounted on the upper end of the protective baffle (4); an outer surface of the top side limit plate (40) is fixedly connected to the connecting side plate (412); the top side limit plate (40) and the upper end of the protective baffle (4) jointly form a convex structure; a concave groove is provided on the inner side of the convex structure; and the inner surface of the concave groove is slidably connected to the outer surface of the limit slide rod (42).

7. The device for detecting the wall thickness of a pinhole of an electrical connector according to claim 1, characterized in that: The cleaning component comprises a cleaning soft brush (43) and a cleaning cotton strip (431), wherein the cleaning cotton strip (431) is distributed on both sides of the cleaning soft brush (43), and two groups of cleaning cotton strips (431) and one group of cleaning soft brush (43) form a combination, wherein the cleaning soft brush (43) and the cleaning cotton strip (431) are evenly distributed on the inner side of the protective baffle (4), and the outer surfaces of the cleaning soft brush (43) and the cleaning cotton strip (431) are movably connected to the outer surface of the semiconductor laser (31).

8. The device for detecting the wall thickness of a pinhole of an electrical connector according to claim 7, characterized in that: The semiconductor laser (31) is movably embedded in the inner surface of the laser outer frame (3); a high-transmittance glass plate (30) is arranged on the laser outer frame (3); the laser outer frame (3) and the high-transmittance glass plate (30) form a frame structure with an opening on the side away from the horizontal telescopic plate (21); an embedding groove (300) is provided on the inner wall of the laser outer frame (3) on the side away from the high-transmittance glass plate (30); a flexible clamping block (331) is arranged on the inner side of the embedding groove (300); and the outer surface of the flexible clamping block (331) is movably abutted against the outer surface of the semiconductor laser (31).

9. The device for detecting the wall thickness of a pinhole of an electrical connector according to claim 8, characterized in that: A locking sealing plate (33) is fixedly mounted on the outer surface of the flexible clamping block (331), and a metal spring block (3311) is fixedly connected to the inner side surface of the locking sealing plate (33). The metal spring blocks (3311) are symmetrically distributed on both sides of the flexible clamping block (331), and the other end of the metal spring block (3311) is fixedly connected to the outer surface of the laser outer frame (3), and a locking groove (330) is provided at one end of the locking sealing plate (33).

10. The device for detecting the wall thickness of a pinhole of an electrical connector according to claim 9, characterized in that: The quick-installation component includes an auxiliary strip-shaped embedding frame (32). The auxiliary strip-shaped embedding frame (32) is fixedly installed on the outer side of the laser outer frame (3) in a "C"-shaped plate-like structure. A combined embedding block (321) is fixedly installed on the auxiliary strip-shaped embedding frame (32). An annular groove (3210) is formed on the inner wall of the combined embedding block (321). A sliding lock block (322) is movably connected to the inner surface of the annular groove (3210). A thumb contact groove (3221) is arranged on the outer surface of the sliding lock block (322). Both the sliding lock block (322) and the thumb contact groove (3221) are provided in two groups. Elastic blocks (323) are fixedly connected to the inner sides of the two groups of sliding lock blocks (322). And one ends of the inner sides of the two groups of sliding lock blocks (322) are respectively movably embedded in the inner surface of the locking groove (330).

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