Optical fiber temperature measurement circuit compatible with thermistor interface
By designing an optical fiber temperature measurement circuit that is compatible with thermistor interface, and using an optical fiber temperature measurement sensor and resistance simulation unit, the problem of replacing a complete set of equipment for fiber temperature measurement is solved, and efficient temperature measurement in a high-temperature and high-voltage environment is achieved, reducing resource waste.
Patent Information
- Application Number
- CN202510220713.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-02-27
- Publication Date
- 2025-06-06
AI Technical Summary
When using optical fiber temperature measurement in the prior art, a complete set of equipment needs to be replaced, resulting in a lot of waste of resources.
An optical fiber temperature measurement circuit compatible with the thermistor interface is designed, including an optical fiber temperature measurement sensor, a photoelectric conversion module and a control unit. By controlling the resistance analog unit to output the resistance value corresponding to the temperature data, it achieves compatibility with the thermistor interface.
While using optical fiber sensors to measure the temperature of the equipment in high-temperature and high-voltage environments, avoid replacing the entire set of equipment, reducing resource waste.
Smart Images
Figure CN120101964A_ABST
Abstract
Description
Technical Field
[0001] The invention belongs to the technical field of temperature measurement, and in particular relates to an optical fiber temperature measurement circuit compatible with a thermistor interface. Background Art
[0002] A thermistor, also known as a thermistor temperature sensor, has a resistance value that decreases as the temperature rises. Due to its characteristics, it is widely used in various temperature measuring equipment. However, in the underground mine environment where the working environment is relatively harsh, thermistors are usually placed in places with high temperature and high voltage, which makes the thermistor susceptible to factors such as electromagnetic interference and temperature drift when transmitting information. In order to avoid the problem that thermistors are easily affected, optical fiber temperature measurement has begun to be used in the prior art. Optical fiber temperature measurement is not easily interfered with, but optical fiber temperature measurement cannot be directly read by a device with a thermistor interface. Thermistors have been widely used in the current market. If they are directly replaced with optical fiber temperature measurement, the entire set of equipment needs to be replaced, resulting in unnecessary waste of resources.
[0003] Therefore, how to avoid replacing a whole set of equipment and reduce waste of resources when using optical fiber temperature measurement is a technical problem to be solved by technical personnel in this field. Summary of the invention
[0004] The purpose of the present invention is to solve the technical problem in the prior art that when using optical fiber temperature measurement, a corresponding complete set of equipment needs to be replaced, resulting in a lot of waste of resources.
[0005] To achieve the above technical objectives, the present invention provides an optical fiber temperature measurement circuit compatible with a thermistor interface, the circuit comprising: Optical fiber temperature sensor, used to obtain temperature data of the object being measured; A photoelectric conversion module, used for decoding the temperature data to obtain an electrical signal, and processing the electrical signal to obtain a digital signal; A control unit is connected to the photoelectric conversion module and the resistance simulation unit, and is used to control the resistance simulation unit to output a resistance value corresponding to the temperature data according to the digital signal.
[0006] Furthermore, the resistance simulation unit specifically includes a chip U4 and a resistance module, and the resistance module at least includes channels S1 to S8, specifically: The S1 channel includes resistors R2, R3, R4 and R5, the S2 channel includes resistors R6, R7, R8 and R9, the S3 channel includes resistors R11, R12, R13 and R14, the S4 channel includes resistors R15, R16, R17 and R18, the S5 channel includes resistors R19, R20, R21 and R23, the S6 channel includes resistors R24, R25, R27 and R28, the S7 channel includes resistors R29, R30, R31 and R32, the S8 channel includes resistors R35, R36, R37 and R38. 37 and resistor R38, one end of the resistor R2, one end of the resistor R4, one end of the resistor R6, one end of the resistor R8, one end of the resistor R11, one end of the resistor R13, one end of the resistor R15, one end of the resistor R17, one end of the resistor R19, one end of the resistor R22, one end of the resistor R24, one end of the resistor R27, one end of the resistor R29, one end of the resistor R31, one end of the resistor R35 and one end of the resistor R37 are all connected to the D- pin in the control unit, and the other end of the resistor R3, the other end of the resistor R5, the other end of the resistor R7, the other end of the resistor R9, the other end of the resistor R12, the other end of the resistor R14, and the resistor R16 The other end of the resistor R2, the other end of the resistor R20, the other end of the resistor R23, the other end of the resistor R25, the other end of the resistor R28, the other end of the resistor R30, the other end of the resistor R32, the other end of the resistor R36 and the other end of the resistor R38 are all connected to the chip U4, the other end of the resistor R2 is also connected to the other end of the resistor R4, one end of the resistor R3 and one end of the resistor R5, the other end of the resistor R6 is also connected to one end of the resistor R7, the other end of the resistor R8 and one end of the resistor R9, the other end of the resistor R11 is also connected to one end of the resistor R12, the other end of the resistor R13 and one end of the resistor R14 The other end of the resistor R15 is connected to one end of the resistor R16, the other end of the resistor R17 and one end of the resistor R18. The other end of the resistor R19 is connected to one end of the resistor R20, the other end of the resistor R22 and one end of the resistor R23. The other end of the resistor R24 is connected to one end of the resistor R25, the other end of the resistor R27 and one end of the resistor R28. The other end of the resistor R29 is connected to one end of the resistor R30, the other end of the resistor R31 and one end of the resistor R32. The other end of the resistor R35 is connected to one end of the resistor R36, the other end of the resistor R37 and one end of the resistor R38.
[0007] Further, the pin 4 of the chip U4 is respectively connected to the other end of the resistor R3 and the other end of the resistor R5, the pin 5 of the chip U4 is respectively connected to the other end of the resistor R7 and the other end of the resistor R9, the pin 6 of the chip U4 is respectively connected to the other end of the resistor R12 and the other end of the resistor R14, the pin 7 of the chip U4 is respectively connected to the other end of the resistor R16 and the other end of the resistor R18, the pin 12 of the chip U4 is respectively connected to the other end of the resistor R20 and the other end of the resistor R23, and the pin 11 of the chip U4 is respectively connected to the resistor R2 5 is connected to the other end of the resistor R28, the pin 10 of the chip U4 is respectively connected to the other end of the resistor R30 and the other end of the resistor R32, the pin 9 of the chip U4 is respectively connected to the other end of the resistor R36 and the other end of the resistor R38, the pin 3 of the chip U4 is grounded, the pin 13 of the chip U4 is respectively connected to the other end of the capacitor C26 and the 3.3V power supply, the pin 14 of the chip U4 is grounded and also connected to one end of the capacitor C26, and the pin 1, pin 2, pin 15 and pin 16 of the chip U4 are all connected to the control unit.
[0008] Furthermore, the control unit is specifically used for: Determine the resistance value to be output in a first comparison table according to the digital signal, wherein the first comparison table is specifically a comparison table of temperature and resistance; The channels to be turned on among the S1 to S8 channels that need to be turned on are determined according to the resistance value to be output, and are turned on to output the resistance value corresponding to the temperature data, wherein the resistance values of the channels among the S1 to S8 channels are not the same.
[0009] Furthermore, the resistance of a certain channel from the S1 channel to the S8 channel is the maximum resistance value in the preset comparison table, and the resistance value output by the resistance module when the S1 channel to the S8 channel are connected in parallel is the minimum resistance value in the preset comparison table.
[0010] Further, determining the channels to be turned on among channels S1 to S8 according to the resistance value to be output is specifically determining the channels to be turned on in a second comparison table according to the resistance value to be output, and the second comparison table is specifically a comparison table between resistance and conduction channels.
[0011] Furthermore, a plurality of optical fiber temperature sensors are provided at the measured object, and the photoelectric conversion module is specifically used to fit the temperature data acquired from the plurality of optical fiber temperature sensors to obtain maximum temperature data, and decode the maximum temperature data to obtain an electrical signal.
[0012] Furthermore, before the control unit controls the resistance simulation unit to output the resistance value corresponding to the temperature data according to the digital signal, the control unit is also used to determine whether the temperature corresponding to the digital signal is within a preset range. If not, an alarm signal is directly sent to the host computer.
[0013] The present invention provides an optical fiber temperature measurement circuit compatible with thermistor interface. Compared with the prior art, the temperature measurement circuit includes: an optical fiber temperature measurement sensor for obtaining temperature data of the object to be measured; a photoelectric conversion module for decoding the temperature data to obtain an electrical signal, and processing the electrical signal to obtain a digital signal; a control unit connected to the photoelectric conversion module and a resistance simulation unit, and used to control the resistance simulation unit to output a resistance value corresponding to the temperature data according to the digital signal. By controlling the resistance simulation unit to output the resistance value corresponding to the temperature data, the optical fiber sensor can be used to measure the temperature of the equipment in a high temperature and high voltage environment, while avoiding the replacement of the entire set of equipment, thereby reducing resource waste. BRIEF DESCRIPTION OF THE DRAWINGS
[0014] In order to more clearly illustrate the embodiments of this specification or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in this specification. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.
[0015] Figure 1 The figure shows the overall structure of the optical fiber temperature measurement circuit compatible with thermistor interface provided in the embodiment of this specification; Figure 2 The figure shows a schematic diagram of the structure of the resistor module in the embodiment of this specification; Figure 3 The figure shows a schematic diagram of the structure of the chip U4 in the embodiment of this specification; Figure 4 The figure is a schematic flow chart of the working process of the photoelectric conversion module in the embodiment of this specification. DETAILED DESCRIPTION
[0016] In order to enable those skilled in the art to better understand the technical solutions in this specification, the technical solutions in the embodiments of this application will be clearly and completely described below in conjunction with the drawings in the embodiments of this application. Obviously, the described embodiments are only part of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of this application.
[0017] like Figure 1The overall structural diagram of the optical fiber temperature measurement circuit compatible with thermistor interface provided in the embodiment of this specification is shown. Although this specification provides the method operation steps or device structure shown in the following embodiments or drawings, the method or device may include more or fewer operation steps or module units after partial merger based on routine or no creative labor. In the steps or structures where there is no necessary causal relationship logically, the execution order of these steps or the module structure of the device is not limited to the execution order or module structure shown in the embodiments of this specification or drawings. When the method or module structure is applied in an actual device, server or terminal product, it can be executed sequentially or in parallel according to the method or module structure shown in the embodiment or drawings.
[0018] The optical fiber temperature measurement circuit compatible with thermistor interface provided in the embodiments of this specification can be applied in various high temperature and high pressure temperature measurement environments, such as Figure 1 As shown, the temperature measurement circuit of this application includes: Optical fiber temperature sensor, used to obtain temperature data of the object being measured; A photoelectric conversion module, used for decoding the temperature data to obtain an electrical signal, and processing the electrical signal to obtain a digital signal; A control unit is connected to the photoelectric conversion module and the resistance simulation unit, and is used to control the resistance simulation unit to output a resistance value corresponding to the temperature data according to the digital signal.
[0019] The optical fiber temperature sensor in the optical fiber temperature measurement circuit provided by the present application can obtain the temperature data of the object being measured, and the optical fiber temperature sensor is connected to the optical fiber cable through an optical fiber connector, and the temperature can be transmitted to the photoelectric conversion module through the optical fiber cable. The optical fiber temperature sensor contains temperature-sensitive rare earth materials and can generate an optical signal containing temperature information. The optical fiber temperature sensor is resistant to 200°C high temperature as a whole, and can withstand 100KV high voltage of power frequency voltage, and has a diameter of 3mm. It uses a small space with high temperature and high voltage for temperature measurement. The photoelectric conversion module converts the optical signal generated by the optical fiber temperature sensor into an electrical signal. When receiving the detection signal of the control unit, the photoelectric conversion module decodes the temperature data according to the temperature spectrum correspondence to obtain an electrical signal. It should be noted here that the photoelectric conversion module can process the decoded electrical signal to obtain a digital signal, or the photoelectric conversion module can send the electrical signal to the control unit, and the control unit processes the electrical signal to obtain a digital signal. The optical fiber temperature sensor is connected to the photoelectric conversion module through an optical fiber, and there is no electrical connection. It is not affected by strong electromagnetic interference, which solves the problem that high-voltage equipment cannot measure temperature.
[0020] In addition, a plurality of optical fiber temperature sensors are arranged at the measured object, and the photoelectric conversion module is specifically used to fit the temperature data acquired from the plurality of optical fiber temperature sensors to obtain the maximum temperature data, and decode the maximum temperature data to obtain an electrical signal.
[0021] Specifically, in an actual working scenario, the power-on initialization program is executed. After receiving the temperature query command from the host computer, the control unit issues a detection command to read the temperature data of multiple optical fiber temperature sensors or multi-channel optical fiber temperature sensors in the photoelectric conversion module, and then fits the multi-channel temperature data of the same device or the same divided area to obtain the fitted maximum temperature, and then decodes the maximum temperature data to obtain an electrical signal. After obtaining the electrical signal, the control unit first determines whether the temperature corresponding to the digital signal is within a preset range. If not, an alarm signal is directly sent to the host computer. If it is within the preset range, the resistance simulation unit is adjusted according to the temperature corresponding to the digital signal so that the resistance simulation unit outputs the corresponding resistance value.
[0022] More importantly, the present application innovatively proposes a resistance simulation unit, which can output different resistance values by adjusting the conduction of each channel in the resistance module, so that an external device can determine the temperature of the object being measured based on the resistance value.
[0023] In the embodiment of the present application, the resistance simulation unit specifically includes a chip U4 and a resistance module, and the resistance module at least includes channels S1 to S8, specifically: The S1 channel includes resistors R2, R3, R4 and R5, the S2 channel includes resistors R6, R7, R8 and R9, the S3 channel includes resistors R11, R12, R13 and R14, the S4 channel includes resistors R15, R16, R17 and R18, the S5 channel includes resistors R19, R20, R21 and R23, the S6 channel includes resistors R24, R25, R27 and R28, the S7 channel includes resistors R29, R30, R31 and R32, the S8 channel includes resistors R35, R36, R37 and R38. 37 and resistor R38, one end of the resistor R2, one end of the resistor R4, one end of the resistor R6, one end of the resistor R8, one end of the resistor R11, one end of the resistor R13, one end of the resistor R15, one end of the resistor R17, one end of the resistor R19, one end of the resistor R22, one end of the resistor R24, one end of the resistor R27, one end of the resistor R29, one end of the resistor R31, one end of the resistor R35 and one end of the resistor R37 are all connected to the D- pin in the control unit, and the other end of the resistor R3, the other end of the resistor R5, the other end of the resistor R7, the other end of the resistor R9, the other end of the resistor R12, the other end of the resistor R14, and the resistor R16 The other end of the resistor R2, the other end of the resistor R20, the other end of the resistor R23, the other end of the resistor R25, the other end of the resistor R28, the other end of the resistor R30, the other end of the resistor R32, the other end of the resistor R36 and the other end of the resistor R38 are all connected to the chip U4, the other end of the resistor R2 is also connected to the other end of the resistor R4, one end of the resistor R3 and one end of the resistor R5, the other end of the resistor R6 is also connected to one end of the resistor R7, the other end of the resistor R8 and one end of the resistor R9, the other end of the resistor R11 is also connected to one end of the resistor R12, the other end of the resistor R13 and one end of the resistor R14 The other end of the resistor R15 is connected to one end of the resistor R16, the other end of the resistor R17 and one end of the resistor R18. The other end of the resistor R19 is connected to one end of the resistor R20, the other end of the resistor R22 and one end of the resistor R23. The other end of the resistor R24 is connected to one end of the resistor R25, the other end of the resistor R27 and one end of the resistor R28. The other end of the resistor R29 is connected to one end of the resistor R30, the other end of the resistor R31 and one end of the resistor R32. The other end of the resistor R35 is connected to one end of the resistor R36, the other end of the resistor R37 and one end of the resistor R38.
[0024] The pin 4 of the chip U4 is respectively connected to the other end of the resistor R3 and the other end of the resistor R5, the pin 5 of the chip U4 is respectively connected to the other end of the resistor R7 and the other end of the resistor R9, the pin 6 of the chip U4 is respectively connected to the other end of the resistor R12 and the other end of the resistor R14, the pin 7 of the chip U4 is respectively connected to the other end of the resistor R16 and the other end of the resistor R18, the pin 12 of the chip U4 is respectively connected to the other end of the resistor R20 and the other end of the resistor R23, the pin 11 of the chip U4 is respectively connected to the other end of the resistor R25, and the pin 20 of the chip U4 is respectively connected to the other end of the resistor R26. The other end is connected to the other end of the resistor R28, the pin 10 of the chip U4 is respectively connected to the other end of the resistor R30 and the other end of the resistor R32, the pin 9 of the chip U4 is respectively connected to the other end of the resistor R36 and the other end of the resistor R38, the pin 3 of the chip U4 is grounded, the pin 13 of the chip U4 is respectively connected to the other end of the capacitor C26 and the 3.3V power supply, the pin 14 of the chip U4 is grounded and also connected to one end of the capacitor C26, and the pin 1, pin 2, pin 15 and pin 16 of the chip U4 are all connected to the control unit.
[0025] In the embodiment proposed in the present application, the resistance module is divided into eight channels from S1 channel to S8 channel, and the resistances of S1-S8 channels are resistors of different resistance values, and the switching of different resistance values can be achieved by different parallel connection methods. The D-pin in the control unit is also the ground pin of the control unit. The present application scheme does not limit the specific model of the control unit, and the control unit can determine the resistance value to be output in the first comparison table according to the digital signal. The first comparison table is specifically a comparison table of temperature and resistance; then, according to the resistance value to be output, the channel to be turned on in the S1 channel to the S8 channel is determined, and it is turned on to output the resistance value corresponding to the temperature data, wherein the resistance value of each channel in the S1 channel to the S8 channel is not the same. The first comparison table is shown in Table 1 below: Table 1 Temperature ℃ Corresponding resistance kΩ Temperature ℃ Corresponding resistance kΩ Temperature ℃ Corresponding resistance kΩ 0 13.7 9 9.4 72 0.99 1 13.1 10 9.0 73 0.95 2 12.6 11 8.6 74 0.92 3 12.1 12 8.3 75 0.89 4 11.6 … … 76 0.87 5 11.1 68 1.13 77 0.84 6 10.6 69 1.08 78 0.81 7 10.2 70 1.05 79 0.79 8 9.7 71 1.02 80 0.76 In a specific working scenario, the resistance changes nonlinearly, but approximately linearly, showing that as the temperature increases, the resistance value decreases.
[0026] According to the actual working conditions and the device thermal resistance, the normal measurement temperature range is formulated as arrive The corresponding resistance value is and According to the S1-S8 permutation and combination relationship, there are 36 parallel combinations with an accuracy of Therefore, as long as the resistance matching in S1-S8 is reasonably calculated, a higher precision display can be achieved. The comparison table between the channels after conduction and the resistance, that is, the second comparison table, is shown in Table 2 below: Table 2 Switch combination S1 S1 / / S2 S1 / / S2 / / S3 S1 / / S2 / / S3 / / S4 S1 / / S2 / / S3 / / S4 / / S5 S1 / / S2 / / S3 / / S4 / / S5 / / S6 S1 / / S2 / / S3 / / S4 / / S5 / / S6 / / S7 S1 / / S2 / / S3 / / S4 / / S5 / / S6 / / S7 / / S8 Corresponding resistance value r11 r12 r13 r14 r15 r16 r17 r18 Switch combination S2 S2 / / S3 S2 / / S3 / / S4 S2 / / S3 / / S4 / / S5 S2 / / S3 / / S4 / / S5 / / S6 S2 / / S3 / / S4 / / S5 / / S6 / / S7 S2 / / S3 / / S4 / / S5 / / S6 / / S7 / / S8 Corresponding resistance value r21 r22 r23 r24 r25 r26 r27 Switch combination S3 S3 / / S4 S3 / / S4 / / S5 S3 / / S4 / / S5 / / S6 S3 / / S4 / / S5 / / S6 / / S7 S3 / / S4 / / S5 / / S6 / / S7 / / S8 Corresponding resistance value r31 r32 r33 r34 r35 r36 Switch combination S4 S4 / / S5 S4 / / S5 / / S6 S4 / / S5 / / S6 / / S7 S4 / / S5 / / S6 / / S7 / / S8 Corresponding resistance value r41 r42 r43 r44 r45 Switch combination S5 S5 / / S6 S5 / / S6 / / S7 S5 / / S6 / / S7 / / S8 Corresponding resistance value r51 r52 r53 r54 Switch combination S6 S6 / / S7 S6 / / S7 / / S8 Corresponding resistance value r61 r62 r63 Switch combination S7 S7 / / S8 Corresponding resistance value r71 r72 Switch combination S8 Corresponding resistance value r81 According to the above, the resistances of S1-S8 channels are r11, r21, r31, r41, r51, r61, r71, and r81, and each resistance value is different; the actual circuit of each channel is composed of 4 branch resistors, 2 in series and 2 in parallel.
[0027] Assumptions aisle; , / / indicates parallel connection.
[0028] According to the resistor parallel formula, the resistance combination including S1 is as follows:
[0029] It can be seen that r18 contains .
[0030] The resistance combination including S2 but excluding S1 is:
[0031] Assume that the normal measurement temperature range is arrive The corresponding resistance value is and , then the required resistance value range is ( ), the resistor preset granularity is ( ) / 36. First, select the appropriate resistance value and calculate the resistance value of each channel. After connecting in parallel, the required resistance value range is met ( ). It should be noted that the resistance of a certain channel from S1 channel to S8 channel is the maximum resistance value in the preset comparison table, and the resistance value output by the resistance module when the S1 channel to S8 channel are connected in parallel is the minimum resistance value in the preset comparison table, and the resistance values of each channel from S1 channel to S8 channel are not the same.
[0032] The above is a description of a specific embodiment of the specification. Other embodiments are within the scope of the appended claims. In some cases, the actions or steps recorded in the claims can be performed in an order different from that in the embodiments and still achieve the desired results. In addition, the processes depicted in the drawings do not necessarily require the specific order or continuous order shown to achieve the desired results. In some embodiments, multitasking and parallel processing are also possible or may be advantageous.
[0033] The controller can be implemented in any appropriate manner, for example, the controller can take the form of a computer-readable medium such as a microprocessor or processor and a computer-readable program code (such as software or firmware) that can be executed by the (micro)processor, a logic gate, a switch, an application specific integrated circuit (ASIC), a programmable logic controller, and an embedded microcontroller. Examples of controllers include, but are not limited to, the following microcontrollers: ARC 625D, ATMEL AT91SAM, MICROCHIP PIC18F26K20, and SILICONE LABS C8051F320. The memory controller can also be implemented as part of the control logic of the memory. It is also known to those skilled in the art that in addition to implementing the controller in a purely computer-readable program code manner, the controller can be implemented in the form of a logic gate, a switch, an application specific integrated circuit, a programmable logic controller, and an embedded microcontroller by logically programming the method steps. Therefore, such a controller can be considered as a hardware component, and the devices included therein for implementing various functions can also be considered as structures within the hardware component. Or even, the devices for implementing various functions can be considered as both software modules for implementing the method and structures within the hardware component.
[0034] The device embodiments described above are merely illustrative. For example, the division of the units is merely a logical function division. There may be other divisions in actual implementation, such as multiple units or plug-ins may be combined or integrated into another system, or some features may be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed may be through some interface, indirect coupling or communication connection of the device or unit, which may be electrical, mechanical or other forms.
[0035] These computer program instructions may also be loaded onto a computer or other programmable resource data updating device so that a series of operating steps are executed on the computer or other programmable device to produce a computer-implemented process, thereby providing instructions executed on the computer or other programmable device for implementing the process. Figure 1 A process or multiple processes and / or boxes Figure 1 The steps for the functions specified in one or more boxes.
[0036] Each embodiment in this specification is described in a progressive manner, and the same and similar parts between the embodiments can be referenced to each other, and each embodiment focuses on the differences from other embodiments. In particular, for the system embodiment, since it is basically similar to the method embodiment, the description is relatively simple, and the relevant parts can refer to the partial description of the method embodiment. In the description of this specification, the description of the reference terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of this specification. In this specification, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art can combine and combine the different embodiments or examples described in this specification and the features of different embodiments or examples without contradiction.
[0037] Those skilled in the art will appreciate that the embodiments described herein are intended to help readers understand the principles of the present invention, and should be understood that the protection scope of the present invention is not limited to such specific statements and embodiments. Those skilled in the art can make various other specific variations and combinations that do not deviate from the essence of the present invention based on the technical revelations disclosed by the present invention, and these variations and combinations are still within the protection scope of the present invention.
Claims
1. An optical fiber temperature measurement circuit compatible with thermistor interface, characterized in that: The temperature measurement circuit specifically comprises: Optical fiber temperature sensor, used to obtain temperature data of the object being measured; A photoelectric conversion module, used for decoding the temperature data to obtain an electrical signal, and processing the electrical signal to obtain a digital signal; A control unit is connected to the photoelectric conversion module and the resistance simulation unit, and is used to control the resistance simulation unit to output a resistance value corresponding to the temperature data according to the digital signal.
2. The optical fiber temperature measurement circuit compatible with thermistor interface according to claim 1, characterized in that: The resistance simulation unit specifically includes a chip U4 and a resistance module, and the resistance module at least includes channels S1 to S8, specifically: The S1 channel includes resistors R2, R3, R4 and R5, the S2 channel includes resistors R6, R7, R8 and R9, the S3 channel includes resistors R11, R12, R13 and R14, the S4 channel includes resistors R15, R16, R17 and R18, the S5 channel includes resistors R19, R20, R21 and R23, the S6 channel includes resistors R24, R25, R27 and R28, the S7 channel includes resistors R29, R30, R31 and R32, the S8 channel includes resistors R35, R36, R37 and R38. 37 and resistor R38, one end of the resistor R2, one end of the resistor R4, one end of the resistor R6, one end of the resistor R8, one end of the resistor R11, one end of the resistor R13, one end of the resistor R15, one end of the resistor R17, one end of the resistor R19, one end of the resistor R22, one end of the resistor R24, one end of the resistor R27, one end of the resistor R29, one end of the resistor R31, one end of the resistor R35 and one end of the resistor R37 are all connected to the D- pin in the control unit, and the other end of the resistor R3, the other end of the resistor R5, the other end of the resistor R7, the other end of the resistor R9, the other end of the resistor R12, the other end of the resistor R14, and the resistor R16 The other end of the resistor R2, the other end of the resistor R20, the other end of the resistor R23, the other end of the resistor R25, the other end of the resistor R28, the other end of the resistor R30, the other end of the resistor R32, the other end of the resistor R36 and the other end of the resistor R38 are all connected to the chip U4, the other end of the resistor R2 is also connected to the other end of the resistor R4, one end of the resistor R3 and one end of the resistor R5, the other end of the resistor R6 is also connected to one end of the resistor R7, the other end of the resistor R8 and one end of the resistor R9, the other end of the resistor R11 is also connected to one end of the resistor R12, the other end of the resistor R13 and one end of the resistor R14 The other end of the resistor R15 is connected to one end of the resistor R16, the other end of the resistor R17 and one end of the resistor R18. The other end of the resistor R19 is connected to one end of the resistor R20, the other end of the resistor R22 and one end of the resistor R23. The other end of the resistor R24 is connected to one end of the resistor R25, the other end of the resistor R27 and one end of the resistor R28. The other end of the resistor R29 is connected to one end of the resistor R30, the other end of the resistor R31 and one end of the resistor R32. The other end of the resistor R35 is connected to one end of the resistor R36, the other end of the resistor R37 and one end of the resistor R38.
3. The optical fiber temperature measurement circuit compatible with thermistor interface as claimed in claim 2, characterized in that: The pin 4 of the chip U4 is respectively connected to the other end of the resistor R3 and the other end of the resistor R5, the pin 5 of the chip U4 is respectively connected to the other end of the resistor R7 and the other end of the resistor R9, the pin 6 of the chip U4 is respectively connected to the other end of the resistor R12 and the other end of the resistor R14, the pin 7 of the chip U4 is respectively connected to the other end of the resistor R16 and the other end of the resistor R18, the pin 12 of the chip U4 is respectively connected to the other end of the resistor R20 and the other end of the resistor R23, the pin 11 of the chip U4 is respectively connected to the other end of the resistor R25, and the pin 20 of the chip U4 is respectively connected to the other end of the resistor R26. The other end is connected to the other end of the resistor R28, the pin 10 of the chip U4 is respectively connected to the other end of the resistor R30 and the other end of the resistor R32, the pin 9 of the chip U4 is respectively connected to the other end of the resistor R36 and the other end of the resistor R38, the pin 3 of the chip U4 is grounded, the pin 13 of the chip U4 is respectively connected to the other end of the capacitor C26 and the 3.3V power supply, the pin 14 of the chip U4 is grounded and also connected to one end of the capacitor C26, and the pin 1, pin 2, pin 15 and pin 16 of the chip U4 are all connected to the control unit.
4. The optical fiber temperature measurement circuit compatible with thermistor interface as claimed in claim 2, characterized in that: The control unit is specifically used for: Determine the resistance value to be output in a first comparison table according to the digital signal, wherein the first comparison table is specifically a comparison table of temperature and resistance; The channels to be turned on among the S1 to S8 channels that need to be turned on are determined according to the resistance value to be output, and are turned on to output the resistance value corresponding to the temperature data, wherein the resistance values of the channels among the S1 to S8 channels are not the same.
5. The optical fiber temperature measurement circuit compatible with thermistor interface as claimed in claim 4, characterized in that: The resistance of a certain channel from the S1 channel to the S8 channel is the maximum resistance value in the preset comparison table, and the resistance value output by the resistance module when the S1 channel to the S8 channel are connected in parallel is the minimum resistance value in the preset comparison table.
6. The optical fiber temperature measurement circuit compatible with thermistor interface as claimed in claim 4, characterized in that: Determining the channels to be turned on among channels S1 to S8 according to the resistance value to be output is specifically determining the channels to be turned on in a second comparison table according to the resistance value to be output, and the second comparison table is specifically a comparison table between resistances and conduction channels.
7. The optical fiber temperature measurement circuit compatible with thermistor interface according to claim 1, characterized in that: A plurality of optical fiber temperature sensors are arranged at the measured object, and the photoelectric conversion module is specifically used to fit the temperature data acquired from the plurality of optical fiber temperature sensors to obtain the maximum temperature data, and decode the maximum temperature data to obtain the electrical signal.
8. The optical fiber temperature measurement circuit compatible with thermistor interface as claimed in claim 7, characterized in that: Before the control unit controls the resistance simulation unit to output the resistance value corresponding to the temperature data according to the digital signal, the control unit is also used to determine whether the temperature corresponding to the digital signal is within a preset range, and if not, directly send an alarm signal to the upper computer.