Pad repairing method and system

Abstract

The invention relates to the technical field of bonding pad repair, in particular to a bonding pad repair method and system. The method comprises the following steps: acquiring an image of a target bonding pad; wherein the target bonding pad is a bonding pad after a defective chip is removed, and the image of the target bonding pad comprises tin on the target bonding pad; calculating the volume of tin on the target bonding pad according to the image of the target bonding pad; and supplementing tin for the target bonding pad based on the tin volume on the target bonding pad so as to repair the target bonding pad. In this way, the technical problem that the chip cannot work normally due to the fact that the tin amount of the bonding pad is inconsistent in the chip repairing process in the prior art is solved.

Description

Technical Field

[0001] The present application relates to the field of pad repair technology, and in particular to a pad repair method and system. Background Art

[0002] In recent years, with the continuous development of the display industry, micro light emitting diode (LED) chips have also been constantly replaced (such as Mini LED chips, Micro LED chips), with continuous breakthroughs in cost, performance, etc., gradually replacing traditional LED chips.

[0003] However, micro LED chips are smaller than traditional chips, making them more difficult to weld and repair. After welding the micro LEDs, it may be necessary to remove and re-weld individual micro LED chips that are not working properly due to poor chips or poor welding. After removing the chips, solder paste needs to be added to the pads to facilitate the next step of re-welding the new chips.

[0004] Since the removal of the micro LED chip will take away an indefinite amount of tin, the amount of residual tin on the pad may be inconsistent. If the volume of residual tin on the pad is not measured, but only a fixed volume of tin is added based on experience, if the amount of tin added is too much, the chip position and angle deviation may occur during the next soldering. If the amount of tin added is too little, the next soldering may result in problems such as low soldering firmness and low electrical yield. Summary of the invention

[0005] The present application provides a pad repair method and system for solving the technical problem that the chip cannot work normally due to inconsistent tin amount on the pad during chip repair in the related art.

[0006] In order to achieve the above objectives, this application adopts the following technical solutions:

[0007] In a first aspect, the present application provides a pad repair method, comprising: acquiring an image of a target pad; wherein the target pad is the pad after a defective chip is removed, and the image of the target pad includes tin on the target pad; based on the image of the target pad, calculating the volume of tin on the target pad; based on the volume of tin on the target pad, replenishing tin for the target pad to repair the target pad.

[0008] In one of the embodiments, before acquiring the image of the target pad, the method further includes: acquiring the chip type of the chip on the pad; the chip type includes a defective chip or a non-defective chip; if the chip type is a defective chip, removing the defective chip from the pad.

[0009] In one of the embodiments, the volume of tin on the target pad is calculated based on the image of the target pad, including: determining whether the defective chip has been removed based on the image of the target pad; if the defective chip has been removed, slicing the tin on the target pad to obtain the volume of tin on the target pad.

[0010] In one of the embodiments, determining whether a defective chip has been removed based on an image of a target pad includes: obtaining a height value on a target pad in the image of the target pad; when the height value is greater than or equal to a preset height value, determining that the defective chip has not been removed; and when the height value is less than a preset height value, determining that the defective chip has been removed.

[0011] In one of the embodiments, obtaining a height value on a target pad in an image of the target pad includes: constructing a three-dimensional point cloud image of the target pad based on the image of the target pad; and inputting the three-dimensional point cloud image into a preset model to obtain a height value on the target pad.

[0012] In one of the embodiments, based on the tin volume on the target pad, tin is replenished to the pad to repair the target pad, including: obtaining the original tin volume of the target pad; based on the difference between the original tin volume of the target pad and the tin volume on the target pad, selecting a dipping needle with a diameter matching the difference to replenish tin to the target pad to repair the target pad.

[0013] In a second aspect, the present application provides a pad repair system, the system comprising: an acquisition module, used to acquire an image of a target pad; wherein the target pad is the pad after a defective chip is removed, and the image of the target pad includes tin on the target pad; a processing module, used to calculate the volume of tin on the target pad based on the image of the target pad; the processing module is also used to replenish tin for the target pad based on the volume of tin on the target pad to repair the target pad.

[0014] In a third aspect, the present application also provides an electronic device, comprising: a processor and a memory configured to store processor executable instructions; wherein the processor is configured to execute the instructions to implement any one of the optional pad repair methods in the first aspect above.

[0015] In a fourth aspect, the present invention provides a computer-readable storage medium having instructions stored thereon. When the instructions in the computer-readable storage medium are executed by an electronic device, the electronic device is enabled to execute any one of the optional pad repair methods described in the first aspect.

[0016] The present invention provides a pad repair method and system, which calculates the tin volume on the target pad by acquiring an image of the target pad, and replenishes tin for the pad according to the tin volume on the target pad, thereby ensuring the consistency of the tin quality on the pad during chip repair, thereby ensuring the welding quality. The technical problem of the chip not being able to work properly due to inconsistent tin volume on the pad during chip repair in the related art is solved. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0018] Figure 1 A schematic diagram of the layered structure of a pad provided in an embodiment of the present application;

[0019] Figure 2 A schematic diagram of a type of dip pin and pad provided in an embodiment of the present application;

[0020] Figure 3 A schematic diagram of a multi-station tin replenishment method provided in an embodiment of the present application;

[0021] Figure 4 A schematic diagram of a tin box provided in an embodiment of the present application;

[0022] Figure 5 A schematic cross-sectional view of a dip needle provided in an embodiment of the present application;

[0023] Figure 6 A schematic diagram of a pad repair system provided in an embodiment of the present application;

[0024] Figure 7 A schematic diagram of a collection method of an image collection device provided in an embodiment of the present application;

[0025] Figure 8 A schematic diagram of the hardware structure of an electronic device provided in an embodiment of the present application;

[0026] Fig. 9 A schematic diagram of a process flow of a pad repair method provided in an embodiment of the present application;

[0027] Fig.10 A schematic flow chart of another pad repair method provided in an embodiment of the present application;

[0028] Fig.11 A schematic flow chart of another pad repair method provided in an embodiment of the present application;

[0029] Fig.12 A schematic flow chart of another pad repair method provided in an embodiment of the present application;

[0030] Fig.13 A schematic flow chart of another pad repair method provided in an embodiment of the present application;

[0031] Fig.14 A schematic diagram of another pad repair system provided in an embodiment of the present application;

[0032] Fig.15 A schematic diagram of the composition of another pad repair system provided in an embodiment of the present application. DETAILED DESCRIPTION

[0033] A pad repair method and system provided in an embodiment of the present application will be described in detail below in conjunction with the accompanying drawings.

[0034] The terms "first" and "second" in the specification and drawings of this application are used to distinguish different objects rather than to describe a specific order of objects. For example, the first distance and the second distance are used to distinguish different distances rather than to describe a specific order of distances.

[0035] In addition, the terms "including" and "having" and any variations thereof mentioned in the description of the present application are intended to cover non-exclusive inclusions. For example, a process, method, device, product or equipment including a series of steps or units is not limited to the listed steps or units, but may optionally include other steps or units that are not listed, or may optionally include other steps or units that are inherent to these processes, methods, products or equipment.

[0036] It should be noted that in the embodiments of the present application, words such as "exemplary" or "for example" are used to indicate examples, illustrations or descriptions. Any embodiment or design described as "exemplary" or "for example" in the embodiments of the present application should not be interpreted as being more preferred or more advantageous than other embodiments or designs. Specifically, the use of words such as "exemplary" or "for example" is intended to present related concepts in a specific way.

[0037] The term "and / or" used in the present application includes using either or both of the two methods.

[0038] In the description of the present application, unless otherwise specified, “plurality” means two or more.

[0039] At present, after the micro LED chips are welded, some micro LED chips that cannot work properly may need to be removed and re-soldered due to reasons such as defective chips or poor welding.

[0040] Furthermore, after removing the chip, solder paste needs to be added to the pad to facilitate soldering of a new chip in the next step.

[0041] However, since removing the chip will take away an indefinite amount of tin, the amount of residual tin on the pad may be inconsistent. If the volume of residual tin on the pad is not measured, and a fixed volume of tin is only added based on experience, it may cause poor welding. For example, if there is too much tin after addition, the chip position and angle offset may occur during re-welding; if there is too little tin after addition, the welding may be weak and the electrical yield may be low. In order to measure the volume of residual tin on the pad, existing repair equipment can only use relatively expensive scanning equipment in conjunction with the motion platform to complete the contour analysis, which has high equipment costs.

[0042] Based on this, an embodiment of the present application provides a pad repair method, including: acquiring an image of a target pad; wherein the target pad is the pad after a defective chip is removed, and the image of the target pad includes tin on the target pad; based on the image of the target pad, calculating the volume of tin on the target pad; based on the volume of tin on the target pad, replenishing tin for the target pad to repair the target pad.

[0043] Figure 1 A schematic diagram of the layered structure of a pad provided in an embodiment of the present application. Figure 1 As shown, the pad 1 includes: a chip 2 (the chip 2 includes chip pins 3), a tin layer 4 and a substrate 5.

[0044] Optionally, the chip 2 may be a micro LED chip. The present application embodiment takes the chip 2 as a micro 0620 LED chip (size 0.152*0.508mm) as an example for description.

[0045] It should be noted that the chip 2 may also be other possible chip types, which is not limited in this application.

[0046] In some embodiments, the chip pins 3 are used to fix the chip 2 .

[0047] In some embodiments, the tin layer 4 is used to solder the chip 2 onto the pad.

[0048] In some embodiments, the substrate 5 is used to support the pad 1 .

[0049] It should be noted that Figure 1 The above is only an example of the layered structure of a pad. In a specific implementation, the layered structure of the pad 1 may include more or fewer layer types, and this application does not limit this.

[0050] Figure 2A schematic diagram of a dip pin and a pad provided in an embodiment of the present application. Figure 2 As shown, pads 16, 17, 18 and 19 on substrate 11 are in a state of pads before tinning, and pads 16, 20, 21 and 22 on substrate 12 are in a state of pads after tinning.

[0051] Among them, the pad 16 is a standard pad.

[0052] In some embodiments, the dipping needle is used to dip solder paste to repair the pad. The dipping needle includes dipping needle 13, dipping needle 14 and dipping needle 15.

[0053] Among them, the diameter of dipping needle 13 is smaller than the diameter of dipping needle 14, and the diameter of dipping needle 14 is smaller than the diameter of dipping needle 15, that is, the tin dipping amount of dipping needle 13 is smaller than the tin dipping amount of dipping needle 14, and the tin dipping amount of dipping needle 14 is smaller than the tin dipping amount of dipping needle 15.

[0054] In a specific implementation, the user can select a suitable dipping needle according to the tin deficiency of the target pad.

[0055] Figure 3 A schematic diagram of a multi-station tin replenishment method provided in an embodiment of the present application is shown in FIG. Figure 3 As shown: the driving mechanism 31 drives the dipping needle 32 to go deep into the dipping needle reservoir 33 to dip the solder paste, and the dipped solder paste is stored in the tin box 34 for future use.

[0056] The driving mechanism 31 can rotate with the central axis. Based on the different amounts of solder to be added, the motor selectively rotates the driving needle to the bottom of the corresponding dipping needle, the driving needle is pressed down to make the dipping needle dip into the solder paste, and then the driving needle is lifted up, and the dipping needle returns to the waiting position through the internal spring mechanism.

[0057] It should be noted that Figure 3 A 6-station tin box is taken as an example. In a specific implementation, the tin box may include more or fewer stations, and this application does not limit this.

[0058] Figure 4 A schematic diagram of a tin box structure provided in an embodiment of the present application is shown in FIG. Figure 4 As shown, taking the tin box including 6 workstations as an example, the tin box 34 includes a guide groove 41 and a workstation 42 .

[0059] In some embodiments, the guide groove 41 is used to guide the solder paste to ensure that the amount of solder in each workstation is highly consistent, thereby preventing a lack of solder or excess solder in individual workstations.

[0060] In some embodiments, dipping needles of different diameters have different dipping areas at the workstation. Figure 5 A cross-sectional diagram of a dip needle provided in an embodiment of the present application. Figure 5As shown, the smaller the diameter of the dipping needle, the smaller the dipping area on the work station, and vice versa, the larger the dipping area.

[0061] Figure 6 A schematic diagram of a pad repair system provided in an embodiment of the present application is shown in FIG. Figure 6 As shown, the pad repair system 10 includes: an image acquisition device 101, a soldering device 102, a chip removal device 103, a chip welding device 104, a motion device 105, a data processing device 106 and a controller 1000.

[0062] In some embodiments, the image acquisition device 101 is used to identify defective chips, locate defective chips, determine whether defective chips have been removed, calculate the tin volume on the pad and the height value on the target pad, etc.

[0063] In some embodiments, the image acquisition device 101 may be a camera, a monocular camera, a camera head or a binocular camera. This application uses a binocular camera as the image acquisition device. Figure 7 Schematic diagram of a collection method of an image collection device provided in an embodiment of the present application. Figure 7 As shown, the image acquisition device 101 includes a left acquisition device 6 and a right acquisition device 7 .

[0064] In some embodiments, after determining the pads for which images need to be collected, Figure 7 The target pad 9 is calibrated by the left acquisition device 6 and the right acquisition device 7 of the binocular camera, and a group of images of the target pad 9 are acquired.

[0065] It should be noted that the binocular camera will capture at least one group of images of the target pad. In a specific implementation, the total number of image groups of the target pad can be more, and this application does not limit this.

[0066] In some embodiments, the tin replenishing device 102 is used for the chip removing device 103 to calibrate the tin amount and replenish the tin quality.

[0067] In some embodiments, the chip removal device 103 is used to remove defective chips.

[0068] In some embodiments, the chip bonding device 104 is used to bond a new chip.

[0069] In some embodiments, the motion device 105 is used for coordinated movement of the modules.

[0070] In some embodiments, the data processing device 106 is used for related algorithm deployment and calculation.

[0071] In the embodiment shown in the present application, the controller 1000 refers to a device that can generate an operation control signal based on an instruction operation code and a timing signal to instruct the warehouse system to execute the control instruction.

[0072] Exemplarily, the controller may be a central processing unit (CPU), a general-purpose processor, a network processor (NP), a digital signal processor (DSP), a microprocessor, a microcontroller, a programmable logic device (PLD), or any combination thereof.

[0073] In some embodiments, the controller may also be other devices with processing functions, such as circuits, devices, or software modules, and the embodiments of the present application do not impose any limitations on this.

[0074] In addition, the controller 1000 can be used to control the operation of various components inside the pad repair system 10, so that the various components of the pad repair system 10 can operate to achieve various predetermined functions of the pad repair.

[0075] It should be noted that Figure 6 Only one example of the structure of the pad repair system is shown. In a specific implementation, the pad repair system 10 may include more or fewer types of equipment, and each type may include more or fewer devices. This application does not limit this.

[0076] In some embodiments, the electronic device that performs the pad repair method provided in the embodiments of the present application can be a mobile phone, a tablet computer, a desktop, a laptop, a handheld computer, a notebook computer, an ultra-mobile personal computer (ultra-mobile personal computer, UMPC), a netbook, and a cellular phone, a personal digital assistant (personal digital assistant, PDA), an augmented reality (augmented reality, AR)\virtual reality (virtual reality, VR) device, etc. The present invention does not impose any special restrictions on the specific form of the electronic device. It can interact with the user through one or more methods such as a keyboard, a touchpad, a touch screen, a remote control, voice interaction or a handwriting device.

[0077] For example, Figure 8 The hardware structure diagram of an electronic device provided in an embodiment of the present application is shown in FIG. Figure 8 As shown, the electronic device 20 includes a processor 201, a memory 202, a network interface 203, and the like.

[0078] Among them, the processor 201 is the core component of the electronic device 20, and the processor 201 is used to run the operating system of the electronic device 20 and the applications on the electronic device 20 (including system applications and third-party applications) to enable the electronic device 20 to execute the pad repair method.

[0079] In some embodiments, the processor 201 can be a central processing unit (CPU), a microprocessor, a digital signal processor (DSP), an application-specific integrated circuit (ASIC), a field programmable gate array (FPGA) or other programmable logic device, a transistor logic device, a hardware component or any combination thereof, which can implement or execute the various exemplary logic boxes, modules and circuits described in combination with the contents disclosed in the embodiments of the present application; the processor can also be a combination that implements computing functions, such as a combination of one or more microprocessors, a combination of DSP and microprocessors, etc.

[0080] Optionally, the processor 201 of the electronic device 20 includes one or more CPUs, which are single-core CPUs (single-CPU) or multi-core CPUs (multi-CPU).

[0081] In some embodiments, the memory 202 includes, but is not limited to, a random access memory (RAM), a read only memory (ROM), an erasable programmable read-only memory (EPROM), a flash memory, or an optical memory, etc. The memory 202 stores operating system code.

[0082] Optionally, the processor 201 implements the pad repair method in the embodiment of the present application by reading instructions stored in the memory 202, or the processor 201 implements the pad repair method provided in the embodiment of the present application by internally stored instructions. In the case where the processor 201 implements the pad repair method provided in the embodiment of the present application by reading the instructions stored in the memory, the memory stores instructions for implementing the pad repair method provided in the embodiment of the present application.

[0083] In some embodiments, the network interface 203 is a wired interface, such as a fiber distributed data interface (FDDI) or a gigabit Ethernet (GE) interface. Alternatively, the network interface 203 is a wireless interface. The network interface 203 is used for the electronic device 20 to communicate with other devices.

[0084] In some embodiments, the memory 202 is used to store device information of at least one device. At least one processor 201 further executes the method described in the embodiment of the present application according to the device information of at least one device stored in the memory 202. For more details on how the processor 201 implements the above functions, please refer to the description of each method embodiment below.

[0085] Optionally, the electronic device 20 further includes a bus 204, and the processor 201 and the memory 202 are connected to each other via the bus 204, or are connected to each other in other ways.

[0086] Optionally, the electronic device 20 further includes an input / output interface 205, which is used to connect to an input device and receive a pad repair request input by a user through the input device. The input device includes but is not limited to a keyboard, a touch screen, a microphone, etc. The input / output interface 205 is also used to connect to an output device and output the pad repair record of the processor 201. The output device includes but is not limited to a display, a printer, etc.

[0087] The pad repair method and system provided in the embodiment of the present application are applied to the application scenario of pad repair. The pad repair method provided in the embodiment of the present application can avoid the technical problem that the chip cannot work normally due to inconsistent soldering amount on the pad during chip repair.

[0088] Fig. 9 A schematic diagram of a pad repair method provided in an embodiment of the present application is shown in FIG. Fig. 9 As shown, the method comprises the following steps:

[0089] S101, acquiring an image of a target pad.

[0090] The target pad is the pad after the defective chip is removed, and the image of the target pad includes tin on the target pad.

[0091] Specifically, the image of the target pad may be acquired by an image acquisition device.

[0092] Optionally, the image acquisition device may be a binocular camera.

[0093] In some embodiments, the binocular camera collects a pair of images of the target pad each time, and multiple pairs of images of the target pad can be obtained by the binocular camera. The binocular camera collects images of the target pad in the following manner: Figure 7 shown.

[0094] In some embodiments, before acquiring an image of the target pad, the binocular camera needs to be configured, a checkerboard calibration plate is selected to calibrate the binocular camera, the checkerboard is placed in the binocular camera field of view (ensuring that the complete checkerboard can be seen under both cameras), and 15 pairs of checkerboard images at different positions are collected.

[0095] Furthermore, the calibration file and related calibration process are created through the HALCON algorithm to complete the calibration of the stereo camera's internal parameters (CamParam0, CamParam1) and external parameters (Pose0, Pose1).

[0096] In some embodiments, after the binocular camera calibration is completed, the target pads with defective chips need to be identified and located.

[0097] Optionally, the bad pixel data of the chip can be detected by an automatic optical inspection (AOI) system, and preliminary positioning can be performed by identifying the marking points on the chip substrate. Then, the binocular camera can be moved according to the bad pixel data to perform secondary recognition and precise positioning of the defective chip.

[0098] Furthermore, after the defective chip is located, the image of the target pad is collected by the binocular camera, and based on the image of the target pad, it is determined whether the chip needs to be removed from the pad. Fig.10 A flow chart of another pad repair method provided in an embodiment of the present application is used to determine whether a chip needs to be removed from a pad, such as Fig.10 As shown, the method comprises the following steps:

[0099] S201, obtaining the chip type of the chip on the pad.

[0100] The chip type includes a defective chip or a non-defective chip.

[0101] S202: If the chip type is a defective chip, remove the defective chip from the pad.

[0102] In some embodiments, when the chip type of the chip on the pad is a non-defective chip, there is no need to remove the chip from the pad.

[0103] In some embodiments, defective chips can be removed by laser heating (laser temperature 220° C., heating time 1.2 seconds, heating curve is step-type).

[0104] It should be noted that the methods for removing defective chips include but are not limited to direct thrust removal, heat conduction removal, ultrasonic removal, electromagnetic heating removal, laser heat removal, laser pulse removal, etc. This application does not limit the method of removing chips.

[0105] In some embodiments, after the defective chip is removed from the pad, it is necessary to determine whether the defective chip is removed successfully based on the image of the target pad. Fig.11 A flow chart of another pad repair method provided in an embodiment of the present application is used to determine whether a defective chip has been successfully removed. Fig.11 As shown, the method comprises the following steps:

[0106] S301 , obtaining a height value of a target pad in an image of the target pad.

[0107] In some embodiments, after acquiring an image of the target pad, a disparity map and a correction map of the target pad are generated according to internal parameters and external parameters in the image of the target pad, and a three-dimensional point cloud map is created based on the disparity map and the correction map.

[0108] Furthermore, the abnormal data of the three-dimensional point cloud image is cleaned, and the cleaned three-dimensional point cloud image is input into the preset model to extract the coplanar points of the tin in the image, and the height value on the target pad is calculated based on the coplanar points.

[0109] Optionally, the preset model may be a deep learning model, which includes but is not limited to support vector machines (SVM), multilayer perceptrons (MLP) or graph neural networks (GNN).

[0110] In some embodiments, 100 pairs of unsoldered standard pad images are collected, 100 micro 0620 LED chips are removed using a laser, and 100 pairs of residual tin pad images are collected.

[0111] Furthermore, the collected image pairs are processed (such as disparity map, correction map, 3D point cloud, abnormal point cleaning, etc.) to obtain characteristic parameters such as pad volume, height, area, weight, vector transformation, etc. The MLP algorithm model is designed, and the above data is added for training, the model parameters are optimized, and the model parameters are saved.

[0112] In some embodiments, the deep learning model completes training and simultaneously obtains the tin volume of a standard pad.

[0113] S302: When the height value on the target pad is greater than or equal to the preset height value, determine that the defective chip has not been removed.

[0114] It should be noted that the preset height value is pre-set by the pad repair system manufacturer and stored in the memory. The preset height values ​​set by different manufacturers may be different, and this application does not limit this.

[0115] Optionally, the preset height value may be 80.

[0116] Specifically, when the height value on the target pad is greater than or equal to 80, it is determined that the defective chip has not been removed, and at this time, the chip removal operation needs to be performed again.

[0117] S303: When the height value on the target pad is less than the preset height value, it is determined that the defective chip has been removed.

[0118] Specifically, when the height value on the target pad is less than 80, it is determined that the defective chip has been removed.

[0119] S102, calculating the tin volume on the target pad according to the image of the target pad.

[0120] In some implementations, after it is determined that the defective chip on the target pad is removed based on the image of the target pad, a slice calculation is performed on the tin on the target pad.

[0121] Specifically, based on the 3D point cloud after data cleaning, the existing coordinates are converted into a coordinate system, the lowest surface in the 3D point cloud is taken as the XY surface, and the central coordinate system is constructed with the center point of the XY surface upward as the Z axis.

[0122] Furthermore, the tin on the target pad is sliced ​​along the X-axis direction, for example, the tin on the target pad is sliced ​​into 100 slices, and the volume of each tin slice is counted to obtain the volume of the tin on the target pad.

[0123] S103 , replenishing tin for the target pad based on the tin volume on the target pad.

[0124] In some embodiments, after the tin volume on the target pad is obtained, the tin volume required to repair the target pad can be determined according to the tin volume on the target pad and the original tin volume of the target pad. Fig.12 A schematic flow chart of another pad repair method provided in an embodiment of the present application is used to repair the tin volume required for the target pad, such as Fig.12 As shown, the method comprises the following steps:

[0125] S401, obtaining the original tin volume of the target pad.

[0126] It should be noted that the original tin volume of the target pad is the tin volume of the standard pad obtained by training the preset model.

[0127] Alternatively, the original tin volume may be 1 microliter.

[0128] S402 , according to the difference between the original tin volume of the target pad and the tin volume on the target pad, select a dipping needle with a diameter matching the difference to replenish tin for the target pad.

[0129] In some embodiments, the original tin volume V of the target pad 1 and the tin volume V on the target pad 2 The difference between V (i.e. Δ V =V 1 -V 2 ), which is the amount of tin replenishment required for the target pad.

[0130] In some embodiments, after the soldering amount of the target pad is determined, the soldering function is used to match the dipping needle for soldering.

[0131] In some embodiments, tip diameters of 25um, 35um, 45um, 55um, 65um, and 75um are selected as tin-filling dipping needles according to the micro 0620 LED chip.

[0132] Furthermore, the six groups of dipping needles are assembled on the tin filling device, and the pad repair system is controlled to design a matrix tin dipping program (6*30, each dipping needle completes 30 tin dippings), and the program is started. The dipping needles are dipped into tin on a horizontal glass substrate of 200*200mm, and the tin beads are spaced 0.5mm apart.

[0133] Furthermore, the binocular camera collects the tin beads on the glass substrate and the HALCON algorithm is designed to complete the volume measurement. The 30 sets of data for each dipping needle are averaged and fitted with the diameter values ​​of different dipping needles to form a tin filling function.

[0134] For example, if the tin addition amount Δ V For 0.59 μl, a dip needle with a tip diameter of 55 μm is used.

[0135] Furthermore, the tin filling device drives the 55um diameter dipping needle to press down into the tin dipping box to dip the solder paste, and then returns to the working position to drive the next tin dipping needle to dip the solder paste. After completion, the motion device moves the tin filling device above the pad, and the dipping needle slowly drips the solder paste onto the pad under the drive mechanism, and then returns to the waiting position.

[0136] Furthermore, a non-defective chip is sucked up by a nozzle and placed on the pad, and laser heating (temperature 230° C., heating time 1.8 s, heating curve is step-type) is used for welding to complete the pad repair work. This application does not limit the welding method.

[0137] It should be noted that in the process of replenishing tin for the pad, the number of times the dipping needle is taken out is not limited to once. For example, if there are two pads to be replenished with tin, according to the different tin replenishment amounts of the two pads, different dipping needles are selected to dip the solder paste (that is, the tin replenishment device takes out the needle twice), and the two pads are replenished with tin respectively, so as to improve work efficiency.

[0138] This technical solution brings at least the following beneficial effects: by acquiring the image of the target pad to calculate the tin volume on the target pad, and according to the tin volume on the target pad, the pad is replenished with tin, thereby ensuring the consistency of the tin quality on the pad during chip repair, thereby ensuring the welding quality. The technical problem of the chip not being able to work properly due to inconsistent tin volume on the pad during chip repair under the related technology is solved.

[0139] In some embodiments, the above method can also be performed as follows Fig.13 The flowchart shown is implemented as Fig.13 As shown, the method comprises the following steps:

[0140] S11. Identify defective chips.

[0141] Optionally, the chip on the pad can be identified by a binocular camera.

[0142] S12. Remove the defective chip.

[0143] S13, collecting an image of the target pad.

[0144] Optionally, an image of the target pad may be captured by a binocular camera.

[0145] S14, calculating the height value on the target pad.

[0146] S15, when the defective chip on the target pad has been removed, calculate the tin volume on the target pad; when the defective chip on the target pad has not been removed, execute the above step S12.

[0147] In some embodiments, when the height value is greater than or equal to a preset height value, it is determined that the defective chip has not been removed; when the height value is less than the preset height value, it is determined that the defective chip has been removed.

[0148] S16, replenishing tin to the target pad.

[0149] In some embodiments, the amount of tin replenishment required for the target pad is the difference between the original tin volume of the target pad and the tin volume on the target pad.

[0150] S17, soldering defect-free chips.

[0151] The embodiment of the present invention can divide the functional modules of the electronic device etc. according to the above method example. For example, each functional module can be divided according to each function, or two or more functions can be integrated into one processing module. The above integrated module can be implemented in the form of hardware or in the form of software functional modules. It should be noted that the division of modules in the embodiment of the present invention is schematic and is only a logical function division. There may be other division methods in actual implementation.

[0152] In the case of dividing each functional module into corresponding functional modules, Fig.14 A schematic diagram of another pad repair system provided in an embodiment of the present application is shown in FIG. Fig.14 As shown, in Figure 6 Based on the structure of the pad repair system shown, the pad repair system 10 may further include: an acquisition module 107 and a processing module 108 .

[0153] In some embodiments, the acquisition module 107 is used to acquire an image of the target pad.

[0154] In some embodiments, the processing module 108 is configured to calculate the tin volume on the target pad according to the image of the target pad.

[0155] In some embodiments, the processing module 108 is further configured to replenish tin to the target pad based on the tin volume on the target pad to repair the target pad.

[0156] In some embodiments, the acquisition module 107 is further used to acquire the chip type of the chip on the pad.

[0157] In some embodiments, the processing module 108 is further configured to remove the defective chip from the pad if the chip type is a defective chip.

[0158] In some embodiments, the processing module 108 is further configured to determine whether the defective chip has been removed according to the image of the target pad.

[0159] In some embodiments, the processing module 108 is further configured to perform a slice calculation on the tin on the target pad to obtain the volume of the tin on the target pad when the defective chip has been removed.

[0160] In some embodiments, the acquisition module 107 is further configured to acquire a height value of the target pad in the image of the target pad.

[0161] In some embodiments, the processing module 108 is further configured to determine that the defective chip has not been removed when the height value on the target pad is greater than or equal to a preset height value.

[0162] In some embodiments, the processing module 108 is further configured to determine that the defective chip has been removed when the height value on the target pad is less than a preset height value.

[0163] In some embodiments, the processing module 108 is further configured to construct a three-dimensional point cloud image of the target pad based on the image of the target pad.

[0164] In some embodiments, the processing module 108 is further configured to input the three-dimensional point cloud image into a preset model to obtain a height value on the target pad.

[0165] In some embodiments, the acquisition module 107 is further used to acquire the original tin volume of the target pad.

[0166] In some embodiments, the processing module 108 is further configured to replenish tin for the target pad according to the difference between the original tin volume of the target pad and the tin volume on the target pad, so as to repair the target pad.

[0167] In the case of an integrated unit, Fig.15 FIG. 2 shows a possible structural diagram of the pad repair system involved in the above embodiment. Fig.15 As shown, in Figure 6 and Fig.14 Based on the structure of the pad repair system shown, the pad repair system 10 may further include: a storage module 109 and a communication module 110. The communication module 110 may be used to support the communication between the pad repair system 10 and other entities. The storage module 109 is used to store program codes and data of the pad repair system 10.

[0168] In some embodiments, the processing module 108 may be a processor or a controller (e.g., the processor may be as described above). Figure 8 The storage module 109 may be a memory (for example, the processor 201 as described above). Figure 8 The communication module 110 may be a transceiver, a transceiver circuit or a communication interface, etc. (for example, it may be the memory 202 as described above). Figure 8 Network interface 203 shown).

[0169] When the processing module 108 is a processor, the storage module 109 is a memory, and the communication module 110 is a transceiver, the processor, the transceiver, and the memory may be connected via a bus. The bus may be a peripheral component interconnect (PCI) bus or an extended industry standard architecture (EISA) bus, etc. The bus may be divided into an address bus, a data bus, a control bus, etc.

[0170] It should be understood that in various embodiments of the present invention, the size of the serial numbers of the above-mentioned processes does not mean the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of the present invention.

[0171] Those skilled in the art will appreciate that the units and algorithm steps of each example described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are performed in hardware or software depends on the specific application and design constraints of the technical solution. Professional and technical personnel can use different methods to implement the described functions for each specific application, but such implementation should not be considered to be beyond the scope of the present invention.

[0172] Those skilled in the art can clearly understand that, for the convenience and brevity of description, the specific working processes of the systems, devices and units described above can refer to the corresponding processes in the aforementioned method embodiments and will not be repeated here.

[0173] The units described as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed on multiple network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0174] In the above embodiments, it can be implemented in whole or in part by software, hardware, firmware or any combination thereof. When implemented using a software program, it can be implemented in whole or in part in the form of a computer program product. The computer program product includes one or more computer instructions. When the computer program instructions are loaded and executed on a computer, the process or function described in the embodiment of the present invention is generated in whole or in part. The computer can be a general-purpose computer, a special-purpose computer, a computer network, or other programmable devices. The computer instructions can be stored in a computer-readable storage medium, or transmitted from one computer-readable storage medium to another computer-readable storage medium. For example, the computer instructions can be transmitted from a website site, computer, server or data center by wired (e.g., coaxial cable, optical fiber, digital subscriber line (Digital Subscriber Line, DSL)) or wireless (e.g., infrared, wireless, microwave, etc.) mode to another website site, computer, server or data center. The computer-readable storage medium can be any available medium that a computer can access or a data storage device such as a server, data center, etc. that contains one or more media integrated. The available medium may be a magnetic medium (eg, a floppy disk, a hard disk, a magnetic tape), an optical medium (eg, a DVD), or a semiconductor medium (eg, a solid state disk (SSD)).

[0175] The above is only a specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto. Any person skilled in the art can easily think of changes or substitutions within the technical scope disclosed by the present invention, which should be included in the protection scope of the present invention. Therefore, the protection scope of the present invention should be based on the protection scope of the claims.

Claims

1. A pad repair method, It is characterized in that include: Acquire an image of a target pad; wherein the target pad is a pad after a defective chip is removed, and the image of the target pad includes tin on the target pad; Calculating the tin volume on the target pad according to the image of the target pad; Based on the volume of tin on the target pad, tin is supplemented to the target pad to repair the target pad.

2. The method according to claim 1, It is characterized in that Before acquiring the image of the target pad, the method further includes: Obtaining the chip type of the chip on the pad; the chip type includes a defective chip or a non-defective chip; In a case where the chip type is the defective chip, the defective chip is removed from the pad.

3. The method according to claim 1, It is characterized in that The step of calculating the tin volume on the target pad according to the image of the target pad includes: Determining whether the defective chip has been removed according to the image of the target pad; When the defective chip has been removed, a slice calculation is performed on the tin on the target pad to obtain the volume of the tin on the target pad.

4. The method according to claim 3, It is characterized in that The step of determining whether the defective chip has been removed according to the image of the target pad comprises: Acquire a height value on the target pad in the image of the target pad; When the height value on the target pad is greater than or equal to a preset height value, determining that the defective chip has not been removed; In a case where the height value on the target pad is less than the preset height value, it is determined that the defective chip has been removed.

5. The method according to claim 4, It is characterized in that The obtaining a height value of the target pad in the image of the target pad includes: Constructing a three-dimensional point cloud image of the target pad based on the image of the target pad; The three-dimensional point cloud image is input into a preset model to obtain a height value on the target pad.

6. The method according to claim 1, It is characterized in that The method of replenishing tin for the pad based on the tin volume on the target pad to repair the target pad includes: Obtaining the original tin volume of the target pad; According to the difference between the original tin volume of the target pad and the tin volume on the target pad, a dipping needle with a diameter matching the difference is selected to replenish tin for the target pad to repair the target pad.

7. A pad repair system, It is characterized in that The system comprises: An acquisition module is used to acquire an image of a target pad; wherein the target pad is a pad after a defective chip is removed, and the image of the target pad includes tin on the target pad; A processing module, used for calculating the tin volume on the target pad according to the image of the target pad; The processing module is further used to replenish tin for the target pad based on the volume of tin on the target pad to repair the target pad.

8. The system according to claim 7, It is characterized in that The acquisition module is further used to acquire the chip type of the chip on the pad; the chip type includes a defective chip or a non-defective chip; The processing module is further used for removing the defective chip from the pad when the chip type is the defective chip.

9. The system according to claim 7, It is characterized in that The processing module is further used to determine whether the defective chip has been removed according to the image of the target pad; The processing module is further used to perform slicing calculation on the tin on the target pad to obtain the volume of the tin on the target pad when the defective chip has been removed.

10. The system according to claim 9, It is characterized in that The acquisition module is further used to acquire a height value on the target pad in the image of the target pad; The processing module is further configured to determine that the defective chip has not been removed when the height value on the target pad is greater than or equal to a preset height value; The processing module is further configured to determine that the defective chip has been removed when the height value on the target pad is less than the preset height value; The processing module is further used to construct a three-dimensional point cloud image of the target pad based on the image of the target pad; The processing module is further used to input the three-dimensional point cloud image into a preset model to obtain a height value on the target pad; The acquisition module is further used to acquire the original tin volume of the target pad; The processing module is also used to select a dipping needle with a diameter matching the difference between the original tin volume of the target pad and the tin volume on the target pad, to replenish tin for the target pad to repair the target pad.

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