Semiconductor manufacturing apparatus and semiconductor device manufacturing method

Abstract

The embodiment of the invention provides a semiconductor manufacturing device and a manufacturing method of the semiconductor device, which can improve in-plane uniformity of wafer processing. According to one embodiment, a semiconductor manufacturing apparatus includes: a processing tank configured to store a processing liquid for processing a wafer and circulate the stored processing liquid; a first belt conveyor disposed in the processing tank so as to extend in the vertical direction; a second belt conveyor disposed in the processing tank so as to extend in the vertical direction; and a drive control unit that causes the first belt conveyor and the second belt conveyor to open and close so as to sandwich and support an end portion of the wafer, and that controls the first belt conveyor and the second belt conveyor to rotate and drive the first belt conveyor and the second belt conveyor.

Description

[0001] Reference to related applications

[0002] This application claims the priority of Japanese Patent Application No. 2023-205491 (filing date: December 5, 2023) as a basic application. The present application incorporates all the contents of the basic application by reference. Technical Field

[0003] Embodiments of the present invention relate to a semiconductor manufacturing apparatus and a method for manufacturing a semiconductor device. Background Art

[0004] In the past, there was a semiconductor manufacturing device that immersed the wafer in a treatment liquid for cleaning and etching. In such a semiconductor manufacturing device, the treatment liquid is discharged from a jet pipe to circulate the treatment liquid in the treatment tank. For example, near the discharge port of the jet pipe, the temperature of the treatment liquid, the concentration of the etchant, and the flow rate are high, so the etching rate increases. Therefore, the processing amount (e.g., the etching amount) differs between the upper and lower parts of the wafer, thereby reducing the in-plane uniformity of the wafer processing. Summary of the invention

[0005] An object of the present invention is to provide a semiconductor manufacturing apparatus and a method for manufacturing a semiconductor apparatus that can improve the in-plane uniformity of processing on a wafer.

[0006] A semiconductor manufacturing device in one embodiment includes: a processing tank storing a processing liquid for processing wafers and circulating the stored processing liquid; a first belt conveyor configured to extend in the processing tank in an up-down direction; a second belt conveyor configured to extend in the processing tank in an up-down direction; and a drive control unit that causes the first belt conveyor and the second belt conveyor to open and close so as to clamp and support the end of the wafer, and controls the first belt conveyor and the second belt conveyor to rotationally drive, the drive control unit rotationally drives the first belt conveyor and the second belt conveyor in a state where the first belt conveyor and the second belt conveyor clamp and support the end of the wafer immersed in the processing liquid stored in the processing tank, thereby rotating the wafer around a direction perpendicular to the surface of the wafer and moving the wafer in the up-down direction. BRIEF DESCRIPTION OF THE DRAWINGS

[0007] Figure 1 FIG. 1 is a diagram schematically showing a configuration of a semiconductor manufacturing apparatus according to a first embodiment of the present invention, showing an example of a state in which a wafer is processed.

[0008] Figure 2 It is a sign of concern Figure 1FIG. 1 is a plan view showing an example of the structure of the first region of the semiconductor manufacturing apparatus shown.

[0009] Figure 3 It is a sign of concern Figure 1 FIG. 1 is a cross-sectional view showing an example of the structure of the second region of the semiconductor manufacturing apparatus shown.

[0010] Figure 4A It is a sign of concern Figure 1 FIG. 2 is a cross-sectional view showing an example of the structure of the third region of the semiconductor manufacturing apparatus shown in FIG.

[0011] Figure 4B It is a sign of concern Figure 1 2 is a cross-sectional view of another example of the structure of the third region of the semiconductor manufacturing apparatus shown.

[0012] Figure 5 It is indicated schematically in Figure 1 FIG. 1 is a diagram showing an example of a state in which a wafer is being cleaned and processed using a processing liquid in a processing tank in a semiconductor manufacturing apparatus.

[0013] Fig. 6A It is an explanatory diagram showing an example of a manufacturing process of a semiconductor device by the semiconductor manufacturing apparatus according to the first embodiment.

[0014] Figure 6B It means next Fig. 6A An explanatory diagram of an example of a manufacturing process of a semiconductor device by a semiconductor manufacturing apparatus according to a first embodiment of the present invention.

[0015] Fig. 7A It means next Figure 6B An explanatory diagram of an example of a manufacturing process of a semiconductor device by a semiconductor manufacturing apparatus according to a first embodiment of the present invention.

[0016] Figure 7B It means next Fig. 7A An explanatory diagram of an example of a manufacturing process of a semiconductor device by a semiconductor manufacturing apparatus according to a first embodiment of the present invention.

[0017] Fig. 8A It means next Figure 7B An explanatory diagram of an example of a manufacturing process of a semiconductor device by a semiconductor manufacturing apparatus according to a first embodiment of the present invention.

[0018] Figure 8B It means next Fig. 7A An explanatory diagram of an example of a manufacturing process of a semiconductor device by a semiconductor manufacturing apparatus according to a first embodiment of the present invention.

[0019] Fig. 9 It means next Figure 8BAn explanatory diagram of an example of a manufacturing process of a semiconductor device by a semiconductor manufacturing apparatus according to a first embodiment of the present invention. DETAILED DESCRIPTION

[0020] Hereinafter, a semiconductor manufacturing apparatus and a method for manufacturing a semiconductor device according to embodiments will be described in detail with reference to the attached drawings. Note that the present invention is not limited to these embodiments.

[0021] (First Embodiment)

[0022] here, Figure 1 1 is a diagram schematically showing a configuration of a semiconductor manufacturing apparatus 100 according to the first embodiment, which is an example of a state in which a wafer is processed. Figure 2 It is a sign of concern Figure 1 FIG. 1 is a top view of an example of the structure of the first region Q1 of the semiconductor manufacturing apparatus 100 shown in FIG. Figure 3 It is a sign of concern Figure 1 FIG. 1 is a cross-sectional view showing an example of the structure of the second region Q2 of the semiconductor manufacturing apparatus 100 shown in FIG. Figure 4A It is a sign of concern Figure 1 FIG. 1 is a cross-sectional view showing an example of the structure of the third region Q3 of the semiconductor manufacturing apparatus 100 shown in FIG. Figure 4B It is a sign of concern Figure 1 FIG. 1 is a cross-sectional view of another example of the structure of the third region Q3 of the semiconductor manufacturing apparatus 100 shown in FIG. Figure 5 It is indicated schematically in Figure 1 FIG. 1 is a diagram showing an example of a state in which a wafer is being cleaned and processed by a processing liquid in a processing tank in a semiconductor manufacturing apparatus 100 .

[0023] In addition, for simplicity, Figure 1 4, the processing liquid stored in the processing tank S of the semiconductor manufacturing apparatus 100 is not shown. Figure 1 In, omitted Figure 5 The auxiliary tank Sa, the jet pipe H and the discharge part K of the processing tank S are shown. Figure 5 In, omitted Figure 1 The first belt conveyor B1, the second belt conveyor B2, the drive control unit DX, and the lifter L are shown. Other configurations may be omitted in each drawing for convenience.

[0024] Furthermore, the configuration of the semiconductor manufacturing apparatus 100 of the first embodiment is an example of a batch-type apparatus that processes a plurality of wafers, but the invention is not limited to this configuration, and may be, for example, a single-wafer-type apparatus.

[0025] [Semiconductor manufacturing equipment]

[0026] For example Figures 1 to 5 As shown, the semiconductor manufacturing apparatus 100 includes a processing tank S, a first belt conveyor B1 , a second belt conveyor B2 , a drive control unit DX, and a lifter L.

[0027] The semiconductor manufacturing apparatus 100 uses a chemical liquid, ie, a processing liquid, such as a cleaning liquid or an etching liquid, to perform a process such as an etching process or a cleaning process on the wafer W. In this case, the processing liquid is, for example, a chemical liquid such as hydrofluoric acid, phosphoric acid, or a metal mixed acid.

[0028] [Processing tank S]

[0029] The processing tank S stores a processing liquid for processing the wafer W and circulates the stored processing liquid.

[0030] The processing tank S is, for example, Figure 5 As shown, an auxiliary groove Sa, a jet pipe H, and a discharge portion K are provided.

[0031] The discharge portion K is, for example, Figure 5 As shown, the processing liquid overflowing from the processing tank S into the auxiliary tank Sa is discharged toward the wafer W through the jet pipe H.

[0032] In particular, the discharge unit K discharges the processing liquid toward the wafer W while the end of the wafer W immersed in the processing liquid is held and supported by the first belt conveyor B1 and the second belt conveyor B2 so that the processing liquid circulates through the surface of the wafer W in the processing bath S.

[0033] [First belt conveyor]

[0034] In addition, the first belt conveyor B1 is, for example, Figure 1 As shown in FIG. 1 , the plurality of electrodes are arranged in the processing tank S so as to extend in the up-down direction (Z direction).

[0035] The upper portion of the first belt conveyor B1 is located above the upper portion of the processing tank S. The upper portion of the first belt conveyor B1 is movable in the lateral direction (eg, in the X direction orthogonal to the Z direction) relative to the processing tank S. The lower portion of the first belt conveyor B1 is fixed to the frame of the processing tank S.

[0036] In addition, the first belt conveyor B1 is connected to Figure 2 The second belt conveyor B2 shown in the example is the same, and includes a first belt BX having a groove Bm formed on a surface Ba at an end portion in a lateral direction (in the X direction orthogonal to the Z direction) for supporting the wafer W. The first belt BX1 is made of a material having flexibility, chemical resistance, and heat resistance, such as polyvinyl alcohol (PVA), depending on the application.

[0037] Moreover, the first belt conveyor B1 is, for example, Figure 1As shown, it includes a first upper rotation axis G11 and a first lower rotation axis G21.

[0038] The first upper rotation axis G11 is located above the first belt conveyor B1 and extends in the lateral direction (the Y direction orthogonal to the X direction and the Z direction). The first upper rotation axis G11 is in contact with the first belt BX1 inside the first belt BX1.

[0039] In addition, Figure 3 Similar to the example of the second upper rotation axis G12 shown, projections and depressions are formed on the surface of the first upper rotation axis G11, and the projections and depressions mesh with projections and depressions formed on the inner surface of the first belt BX1.

[0040] The first upper rotation axis G11 of the first belt conveyor B1 rotates, so that the first belt BX1 rotates, and the first belt conveyor B1 is rotationally driven.

[0041] The first lower rotation axis G21 is located at the lower part of the first belt conveyor B1 and extends in the lateral direction (direction Y). The first lower rotation axis G21 is in contact with the first belt BX1 inside the first belt BX1 and is fixed to the frame of the processing tank S.

[0042] [Second belt conveyor]

[0043] In addition, the second belt conveyor B2 is, for example, Figure 1 As shown, in the processing tank S, along the up and down direction ( Figure 1 The Z direction) is extended.

[0044] The upper portion of the second belt conveyor B2 is, for example, Figure 1 As shown, it is located above the upper part of the processing tank S. The upper part of the second belt conveyor B2 can be relatively horizontally (for example, Figure 1 The lower part of the second belt conveyor B2 is fixed to the frame of the processing tank S.

[0045] For example, the second belt conveyor B2 is Figure 2 As shown, the surface BA includes a lateral ( Figure 2 The second belt BX2 has a groove Bm at the end of the belt BX2 (in the X direction). The second belt BX2 is made of a material having flexibility, chemical resistance, and heat resistance, such as polyvinyl alcohol (PVA), depending on the application.

[0046] Then, the first belt conveyor B1 and the second belt conveyor B2 are closed to sandwich and support the end of the wafer W. The wafer W is supported by the grooves Bm of the first belt BX1 of the first belt conveyor B1 and the grooves Bm of the second belt BX2 of the second belt conveyor B2.

[0047] In addition, the second belt conveyor B2 is, for example, Figure 1 As shown, it includes a second upper rotation axis G12 and a second lower rotation axis G22.

[0048] The second upper rotation axis G12 is located at the upper part of the second belt conveyor B2 and extends in the Y direction. The second upper rotation axis G12 is connected to the second belt BX2 on the inner side of the second belt BX2. Figure 3 In the example shown, the surface of the second upper rotation axis G12 is formed with projections and depressions G12a, and the projections and depressions G12a mesh with projections and depressions BX2a formed on the inner surface of the second belt BX2. Figure 3 The projections and depressions on the inner side of the second band BX2 shown may be of other shapes or may not be formed.

[0049] The second upper rotation axis G12 of the second belt conveyor B2 rotates, so that the second belt BX2 rotates, and the second belt conveyor B2 is rotationally driven.

[0050] In addition, for example Figure 1 As shown, the second lower rotation axis G22 is located at the lower part of the second belt conveyor B2 and extends in the lateral direction (Y direction). Moreover, the second lower rotation axis G22 is connected to the second belt BX2 inside the second belt BX2 and is fixed to the frame of the processing tank S.

[0051] Here, in Figure 4A In the example shown, the second lower rotating shaft G22 has a surface with a concave-convex G22a, which meshes with the concave-convex BX2a formed on the inner surface of the second belt BX2. In this case, the second lower rotating shaft G22 rotates through the second belt BX2, and rotates around the Y direction while being fixed in position to the frame of the processing tank S.

[0052] On the other hand, Figure 4B In the example shown, no concavoconvexity is formed on the surface of the second lower rotating shaft G22. In this case, even if the second belt BX2 rotates, the second lower rotating shaft G22 does not rotate while being fixed to the frame of the processing tank S, or may rotate around the Y direction.

[0053] In addition, the first belt conveyor B1 and the second belt conveyor B2 may be provided with a fixing plate (not shown) inside for ensuring the rigidity thereof. For example, the fixing plate may be made of a material such as fluororesin or quartz.

[0054] [Lifter]

[0055] In addition, the lifter L moves the wafer W from above into the processing tank S to immerse the wafer W in the processing liquid in order to process the wafer W, and lifts the processed wafer W upward from the processing tank S.

[0056] The lifter L includes, for example, a support portion LS that supports the wafer W from below when moving the wafer W in the up-down direction (Z direction).

[0057] [Drive control unit]

[0058] The drive control unit DX is, for example, Figure 1 As shown, the first belt conveyor B1 and the second belt conveyor B2 are opened and closed to clamp and support the end of the wafer W. In addition, the drive control unit DX may control the operation of the lifter L while controlling the operation of the first belt conveyor B1 and the second belt conveyor B2 as needed.

[0059] Drive control unit DX Figure 1 As shown, the opening and closing operations of the first belt conveyor B1 and the second belt conveyor B2 are controlled by moving the first upper rotating shaft G11 and the second upper rotating shaft G12 in the lateral direction.

[0060] For example, the drive control unit DX drives the upper portion of the first belt conveyor B1 and the upper portion of the second belt conveyor B2 to separate from each other, thereby controlling the closed state to the open state.

[0061] On the other hand, the drive control unit DX controls the upper portion of the first belt conveyor B1 to the closed state by driving the upper portion of the second belt conveyor B2 so as to approach the upper portion of the first belt conveyor B1.

[0062] In particular, the drive control unit DX operates the first belt conveyor B1 and the second belt conveyor B2 from the open state to the closed state so as to clamp and support the end of the wafer W while the wafer W is moved from above into the processing bath S by the lifter L.

[0063] In this way, the drive control unit DX controls the state in which the end of the wafer W immersed in the processing liquid stored in the processing tank S is clamped and supported by the first belt conveyor B1 and the second belt conveyor B2 through the opening and closing action. In particular, the drive control unit DX moves the upper part of the first belt conveyor B1 and the upper part of the second belt conveyor B2 so as to adjust the pressure for clamping and supporting the end of the wafer W with respect to the first belt conveyor B1 and the second belt conveyor B2.

[0064] Furthermore, the drive control unit DX controls the first belt conveyor B1 and the second belt conveyor B2 to rotationally drive.

[0065] The drive control unit DX uses Figure 1 The first upper rotating shaft G11 and the second upper rotating shaft G12 shown rotate to rotate the first belt BX1 and the second belt BX2, thereby controlling the rotation drive of the first belt conveyor B1 and the second belt conveyor B2.

[0066] In addition, the drive control unit DX may include a motor (not shown) that rotationally drives the first belt conveyor B1 and the second belt conveyor B2 by rotating the first upper rotating shaft G11 and the second upper rotating shaft G12.

[0067] Furthermore, the drive control unit DX may reverse the rotation direction of the wafer W in a state where the end of the wafer W immersed in the processing liquid is sandwiched and supported by the first belt conveyor B1 and the second belt conveyor B2 .

[0068] In this way, the drive control unit DX drives and rotates the first belt conveyor B1 and the second belt conveyor B2 while the first belt conveyor B1 and the second belt conveyor B2 clamp and support the end of the wafer W immersed in the processing liquid stored in the processing tank S. In this way, the drive control unit DX rotates the wafer W around the direction (Y direction) perpendicular to the surface of the wafer W and moves the wafer W in the up-down direction (Z direction).

[0069] Here, as described above, in the semiconductor manufacturing apparatus 100 of the first embodiment, the processing liquid is discharged from the jet pipe to circulate the processing liquid in the processing tank. For example, near the discharge portion K of the jet pipe H, the temperature of the processing liquid, the concentration of the etchant, and the flow rate are high, so the etching rate will increase.

[0070] However, the semiconductor manufacturing device 100 rotates and drives the first belt conveyor B1 and the second belt conveyor B2 while clamping and supporting the end of the wafer W immersed in the processing liquid stored in the processing tank S, so that the wafer W rotates around the direction (Y direction) perpendicular to the surface of the wafer W and moves the wafer W in the up and down direction (Z direction).

[0071] Thus, the rotation direction of the wafer W can be controlled during processing, so the wafer W can be lowered, raised, and rotated during processing of the wafer W. Therefore, the positions where the processing liquid contacts the wafer W are dispersed, so that the in-plane difference of the processing amount (for example, etching amount) in the vertical direction and the lateral direction of the wafer W becomes smaller.

[0072] That is, the semiconductor manufacturing apparatus 100 according to the first embodiment can improve the in-plane uniformity of the process on the wafer W.

[0073] [Method for manufacturing semiconductor device]

[0074] Next, as already described, refer to FIG. 6A to FIG. 9 , an example of a method for manufacturing a semiconductor device using the semiconductor manufacturing apparatus 100 according to the first embodiment will be described. FIG. 6A to FIG. 9 Is based on Figure 1 1 is an explanatory diagram of an example of a manufacturing process of a semiconductor device by the semiconductor manufacturing apparatus 100 according to the first embodiment shown.

[0075] In addition, FIG. 6A to FIG. 9 In the figure, for the sake of simplicity, the drive control unit DX is omitted and the structures of the first and second belt conveyors B1 and B2 are simplified.

[0076] First, if Fig. 6A As shown, for example, the wafer W is transferred to the lifter L so that the wafer W processed in the previous step is supported by the support portion LS of the lifter L.

[0077] Next, if Figure 6B As shown, the drive control unit DX lowers the elevator L, and rotates the first and second belt conveyors in coordination with the movement of the elevator L. As needed, the drive control unit DX moves the first belt conveyor B1 and the second belt conveyor B2 to an open state at the end of the wafer W, so that the wafer W can move from the elevator L to the first and second belt conveyors B1 and B2 in the processing tank S.

[0078] Thereafter, the drive control unit DX moves the wafer W from above into the processing bath S by the lifter L, and causes the first belt conveyor B1 and the second belt conveyor B2 to move from the open state to the closed state so as to clamp and support the end of the wafer W.

[0079] Next, if Fig. 7A As shown, the drive control unit DX drives the first and second belt conveyors B1 and B2 to rotate so that the wafer W is slightly lifted from the lifter L. Alternatively, the drive control unit DX further lowers the lifter L so that the wafer W is slightly lifted from the lifter L while the wafer W is supported by the first and second belt conveyors B1 and B2.

[0080] As a result, the wafer W leaves the lifter L and is supported by the first and second belt conveyors B1 and B2 .

[0081] Next, if Figure 7BAs shown, the drive control unit DX drives and rotates the first belt conveyor B1 and the second belt conveyor B2 in a state where the end of the wafer W immersed in the processing liquid stored in the processing tank S is clamped and supported by the first belt conveyor B1 and the second belt conveyor B2, thereby rotating the wafer W around a direction (Y direction) perpendicular to the surface of the wafer W and moving (swinging up and down) the up and down direction (Z direction).

[0082] As described above, the drive control unit DX may reverse the rotation direction of the wafer W while the end of the wafer W immersed in the processing liquid is sandwiched and supported by the first belt conveyor B1 and the second belt conveyor B2 .

[0083] As a result, the positions where the processing liquid contacts the wafer W are dispersed, so that the in-plane difference of the processing amount (for example, etching amount) in the vertical direction and the lateral direction of the wafer W is reduced.

[0084] Next, if Fig. 8A As shown, the drive control unit DX drives the first and second belt conveyors B1 and B2 to rotate so as to load the wafer W onto the elevator L. Alternatively, the drive control unit DX may further raise the elevator L in a state where the wafer W is supported by the first and second belt conveyors B1 and B2 so as to load the wafer W onto the elevator L. Thus, the wafer W is loaded onto the elevator L.

[0085] Next, if Figure 8B As shown, the drive control unit DX causes the lifter L to rise, and the first and second belt conveyors are driven to rotate in accordance with the rise of the wafer W due to the rise of the lifter L. As needed, the drive control unit DX causes the first belt conveyor B1 and the second belt conveyor B2 to move from a closed state in which the ends of the wafer W are clamped and supported to an open state, so that the processed wafer W can be lifted upward from the processing tank S by the lifter L.

[0086] Next, if Fig. 9 As shown, the drive control unit DX further raises the lifter L in a state where the wafer W is supported by the support unit LS of the lifter L. Then, the wafer W having completed the processing is transferred from the lifter L to the next step.

[0087] Thus, in the method for manufacturing a semiconductor device using the semiconductor manufacturing apparatus 100 of the first embodiment, the first belt conveyor B1 and the second belt conveyor B2 are driven to rotate while the end of the wafer W immersed in the processing liquid stored in the processing tank S is clamped and supported by the first belt conveyor B1 and the second belt conveyor B2. Thus, the wafer W is rotated around the direction (Y direction) perpendicular to the surface of the wafer W, and the wafer W is moved in the up-down direction (Z direction).

[0088] As a result, the positions where the processing liquid contacts the wafer W are dispersed, so that the in-plane difference of the processing amount (for example, etching amount) in the vertical direction and the lateral direction of the wafer W is reduced.

[0089] As described above, according to the method for manufacturing a semiconductor device using the semiconductor manufacturing apparatus of the present embodiment, the in-plane uniformity of the process on the wafer W can be improved.

[0090] Although several embodiments of the present invention have been described, these embodiments are presented as examples and are not intended to limit the scope of the invention. These new embodiments can be implemented in various other ways, and various omissions, substitutions, and changes can be made without departing from the scope of the subject matter of the invention. These embodiments and their variations are included in the scope and subject matter of the invention, and are included in the invention described in the claims and the scope of their equivalents.

[0091] Description of Reference Numerals

[0092] 100: semiconductor manufacturing apparatus, S: processing tank, B1: first belt conveyor, B2: second belt conveyor, DX: drive control unit, L: lifter.

Claims

1. A semiconductor manufacturing device, characterized in that: have: A processing tank storing a processing liquid for processing wafers and circulating the stored processing liquid; A first belt conveyor is arranged in the processing tank to extend in the up-down direction; A second belt conveyor is arranged in the processing tank to extend in the up-down direction; as well as a drive control unit that causes the first belt conveyor and the second belt conveyor to open and close so as to clamp and support the end of the wafer, and controls the first belt conveyor and the second belt conveyor to rotate and drive, The drive control unit rotates the first belt conveyor and the second belt conveyor while the first belt conveyor and the second belt conveyor are used to clamp and support the end of the wafer immersed in the processing liquid stored in the processing tank, thereby rotating the wafer around a direction perpendicular to the surface of the wafer and moving the wafer in the up and down directions.

2. The semiconductor manufacturing device according to claim 1, characterized in that The drive control unit moves an upper portion of the first belt conveyor and an upper portion of the second belt conveyor so as to adjust a pressure for clamping and supporting an end portion of the wafer by the first belt conveyor and the second belt conveyor.

3. The semiconductor manufacturing device according to claim 1, characterized in that: The drive control unit, The upper portion of the first belt conveyor is driven to separate from the upper portion of the second belt conveyor, thereby controlling the belt conveyor from a closed state to an open state. On the other hand, the upper portion of the first belt conveyor is driven so as to approach the upper portion of the second belt conveyor, thereby controlling the belt conveyor from the open state to the closed state.

4. The semiconductor manufacturing device according to claim 2, characterized in that: The drive control unit, The upper portion of the first belt conveyor is driven to separate from the upper portion of the second belt conveyor, thereby controlling the belt conveyor from a closed state to an open state. On the other hand, the upper portion of the first belt conveyor is driven so as to approach the upper portion of the second belt conveyor, thereby controlling the belt conveyor from the open state to the closed state.

5. The semiconductor manufacturing device according to claim 1, wherein: A lifter is also provided, which moves the wafer from above into the processing tank and immerses the wafer in the processing liquid in order to process the wafer, and lifts the processed wafer upward from the processing tank. The drive control unit causes the first belt conveyor and the second belt conveyor to move from an open state to a closed state so as to clamp and support an end portion of the wafer while the wafer is moved from above into the processing tank by the lifter. The first belt conveyor and the second belt conveyor are moved from a closed state in which the end of the wafer is clamped and supported to an open state, and the processed wafer is lifted upward from the processing tank by a lifter.

6. The semiconductor manufacturing device according to claim 2, characterized in that: A lifter is also provided, which moves the wafer from above into the processing tank and immerses the wafer in the processing liquid in order to process the wafer, and lifts the processed wafer upward from the processing tank. The drive control unit causes the first belt conveyor and the second belt conveyor to move from an open state to a closed state so as to clamp and support an end portion of the wafer while the wafer is moved from above into the processing tank by the lifter. The first belt conveyor and the second belt conveyor are moved from a closed state in which the end of the wafer is clamped and supported to an open state, and the processed wafer is lifted upward from the processing tank by a lifter.

7. The semiconductor manufacturing device according to claim 3, characterized in that: A lifter is also provided, which moves the wafer from above into the processing tank and immerses the wafer in the processing liquid in order to process the wafer, and lifts the processed wafer upward from the processing tank. The drive control unit causes the first belt conveyor and the second belt conveyor to move from an open state to a closed state so as to clamp and support an end portion of the wafer while the wafer is moved from above into the processing tank by the lifter. The first belt conveyor and the second belt conveyor are moved from a closed state in which the end of the wafer is clamped and supported to an open state, and the processed wafer is lifted upward from the processing tank by a lifter.

8. The semiconductor manufacturing device according to claim 1, characterized in that The processing tank includes a discharge portion, which discharges the processing liquid overflowing from the processing tank toward the wafer while the end of the wafer immersed in the processing liquid is clamped and supported by the first belt conveyor and the second belt conveyor, so that the processing liquid passes through the surface of the wafer and circulates in the processing tank.

9. The semiconductor manufacturing device according to claim 2, characterized in that: The processing tank includes a discharge portion, which discharges the processing liquid overflowing from the processing tank toward the wafer while the end of the wafer immersed in the processing liquid is clamped and supported by the first belt conveyor and the second belt conveyor, so that the processing liquid passes through the surface of the wafer and circulates in the processing tank.

10. The semiconductor manufacturing device according to claim 3, characterized in that: The processing tank includes a discharge portion, which discharges the processing liquid overflowing from the processing tank toward the wafer while the end of the wafer immersed in the processing liquid is clamped and supported by the first belt conveyor and the second belt conveyor, so that the processing liquid passes through the surface of the wafer and circulates in the processing tank.

11. A method for manufacturing a semiconductor device, characterized in that: A semiconductor manufacturing device is used, which includes: a processing tank storing a processing liquid for processing a wafer and circulating the stored processing liquid; a first belt conveyor arranged in the processing tank to extend in the vertical direction; a second belt conveyor arranged in the processing tank to extend in the vertical direction; and a drive control unit that causes the first belt conveyor and the second belt conveyor to open and close so as to clamp and support the end of the wafer, and controls the first belt conveyor and the second belt conveyor to be rotationally driven, The method for manufacturing a semiconductor device comprises the following steps: The drive control unit rotates and drives the first belt conveyor and the second belt conveyor while the first belt conveyor and the second belt conveyor are used to clamp and support the end of the wafer immersed in the processing liquid stored in the processing tank, thereby rotating the wafer around a direction perpendicular to the surface of the wafer and moving the wafer in the up and down directions.

12. The method for manufacturing a semiconductor device according to claim 11, wherein: The drive control unit moves an upper portion of the first belt conveyor and an upper portion of the second belt conveyor so as to adjust a pressure for clamping and supporting an end portion of the wafer by the first belt conveyor and the second belt conveyor.

13. The method for manufacturing a semiconductor device according to claim 11, wherein: The drive control unit, The upper portion of the first belt conveyor is driven to separate from the upper portion of the second belt conveyor, thereby controlling the belt conveyor from a closed state to an open state. On the other hand, the upper portion of the first belt conveyor is driven so as to approach the upper portion of the second belt conveyor, thereby controlling the belt conveyor from the open state to the closed state.

14. The method for manufacturing a semiconductor device according to claim 12, wherein: The drive control unit, The upper portion of the first belt conveyor is driven to separate from the upper portion of the second belt conveyor, thereby controlling the belt conveyor from a closed state to an open state. On the other hand, the upper portion of the first belt conveyor is driven so as to approach the upper portion of the second belt conveyor, thereby controlling the belt conveyor from the open state to the closed state.

15. The method for manufacturing a semiconductor device according to claim 11, wherein: A lifter is also provided, which moves the wafer from above into the processing tank and immerses the wafer in the processing liquid in order to process the wafer, and lifts the processed wafer upward from the processing tank. The drive control unit causes the first belt conveyor and the second belt conveyor to move from an open state to a closed state so as to clamp and support an end portion of the wafer while the wafer is moved from above into the processing tank by the lifter. The first belt conveyor and the second belt conveyor are moved from a closed state in which the end of the wafer is clamped and supported to an open state, and the processed wafer is lifted upward from the processing tank by a lifter.

16. The method for manufacturing a semiconductor device according to claim 12, wherein: A lifter is also provided, which moves the wafer from above into the processing tank and immerses the wafer in the processing liquid in order to process the wafer, and lifts the processed wafer upward from the processing tank. The drive control unit causes the first belt conveyor and the second belt conveyor to move from an open state to a closed state so as to clamp and support an end portion of the wafer while the wafer is moved from above into the processing tank by the lifter. The first belt conveyor and the second belt conveyor are moved from a closed state in which the end of the wafer is clamped and supported to an open state, and the processed wafer is lifted upward from the processing tank by a lifter.

17. The method for manufacturing a semiconductor device according to claim 13, wherein: A lifter is also provided, which moves the wafer from above into the processing tank and immerses the wafer in the processing liquid in order to process the wafer, and lifts the processed wafer upward from the processing tank. The drive control unit causes the first belt conveyor and the second belt conveyor to move from an open state to a closed state so as to clamp and support an end portion of the wafer while the wafer is moved from above into the processing tank by the lifter. The first belt conveyor and the second belt conveyor are moved from a closed state in which the end of the wafer is clamped and supported to an open state, and the processed wafer is lifted upward from the processing tank by a lifter.

18. The method for manufacturing a semiconductor device according to claim 11, wherein: The processing tank includes a discharge portion, which discharges the processing liquid overflowing from the processing tank toward the wafer while the end of the wafer immersed in the processing liquid is clamped and supported by the first belt conveyor and the second belt conveyor, so that the processing liquid passes through the surface of the wafer and circulates in the processing tank.

19. The method for manufacturing a semiconductor device according to claim 12, wherein: The processing tank includes a discharge portion, which discharges the processing liquid overflowing from the processing tank toward the wafer while the end of the wafer immersed in the processing liquid is clamped and supported by the first belt conveyor and the second belt conveyor, so that the processing liquid passes through the surface of the wafer and circulates in the processing tank.

20. The method for manufacturing a semiconductor device according to claim 13, wherein: The processing tank includes a discharge portion, which discharges the processing liquid overflowing from the processing tank toward the wafer while the end of the wafer immersed in the processing liquid is clamped and supported by the first belt conveyor and the second belt conveyor, so that the processing liquid passes through the surface of the wafer and circulates in the processing tank.

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