Substrate processing apparatus, fluid supply system, and substrate processing method

Abstract

The present invention addresses the problem of providing a technique whereby the temperature of a processing fluid can approach a set temperature regardless of the state of the processing fluid. To this end, a substrate processing apparatus according to one embodiment of the present invention is provided with: a processing container for accommodating a substrate; a supply flow path for supplying a processing fluid into the processing container; a heating mechanism that heats the processing fluid flowing through the supply flow path; a first temperature sensor detecting a temperature of the process fluid downstream of the heating mechanism; a pressure sensor detecting a pressure of the process fluid downstream of the heating mechanism; and a control unit configured to control an output of the heating mechanism based on the pressure of the processing fluid detected by the pressure sensor and the temperature of the processing fluid detected by the first temperature sensor.

Description

Technical Field

[0001] The invention relates to a substrate processing device, a fluid supply system and a substrate processing method. Background Art

[0002] A technique for drying a substrate using a supercritical fluid is known. Patent Document 1 discloses a structure in which a heater and two temperature sensors are provided in a supply line for supplying a supercritical fluid to a chamber, and the temperature sensor for controlling the heater is switched when the supercritical fluid flows in the supply line and when the supercritical fluid does not flow.

[0003] <Prior Art Literature>

[0004] <Patent Documents>

[0005] Patent Document 1: Japanese Patent Application Publication No. 2021-086857 Summary of the invention

[0006] <Problems to be Solved by the Invention>

[0007] The present invention provides a technology capable of bringing the temperature of a processing fluid close to a set temperature regardless of the state of the processing fluid.

[0008] <Methods used to solve the problem>

[0009] A substrate processing device involved in one embodiment of the present disclosure includes: a processing container, which accommodates a substrate; a supply flow path, which supplies a processing fluid into the processing container; a heating mechanism, which heats the processing fluid flowing in the supply flow path; a first temperature sensor, which detects the temperature of the processing fluid downstream of the heating mechanism; a pressure sensor, which detects the pressure of the processing fluid downstream of the heating mechanism; and a control unit, which controls the output of the heating mechanism based on the pressure of the processing fluid detected by the pressure sensor and the temperature of the processing fluid detected by the first temperature sensor.

[0010] <Effects of the Invention>

[0011] According to the present invention, the temperature of the process fluid can be brought close to the set temperature regardless of the state of the process fluid. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 It is a diagram showing a substrate processing apparatus according to an embodiment.

[0013] Figure 2 This is a diagram showing an example of the positional relationship between the heating mechanism and the temperature sensor.

[0014] Figure 3A flowchart showing a substrate processing method according to an embodiment.

[0015] Figure 4 It is shown Figure 3 A diagram showing pressure changes in a processing container during a substrate processing method.

[0016] Figure 5 This is a diagram showing an example of the fictive temperature.

[0017] Figure 6 FIG. 1 is a diagram showing a substrate processing method according to an embodiment.

[0018] Figure 7 FIG. 2 is a diagram showing a substrate processing method according to an embodiment.

[0019] Figure 8 FIG. 3 is a diagram showing a substrate processing method according to an embodiment.

[0020] Fig. 9 FIG. 4 is a diagram showing a substrate processing method according to an embodiment.

[0021] Fig.10 FIG. 5 is a diagram showing a substrate processing method according to an embodiment.

[0022] Fig.11 FIG. 6 is a diagram showing a substrate processing method according to an embodiment.

[0023] Fig.12 FIG. 7 is a diagram showing a substrate processing method according to an embodiment.

[0024] Fig.13 FIG. 8 is a diagram showing a substrate processing method according to an embodiment.

[0025] Fig.14 FIG. 9 is a diagram showing a substrate processing method according to an embodiment.

[0026] Fig.15 This is a diagram showing temperature changes when the heating mechanism is controlled based only on the temperature detected by the first temperature sensor.

[0027] Fig.16 This is a diagram showing temperature changes when the heating mechanism is controlled based only on the temperature detected by the second temperature sensor.

[0028] Fig.17 This is a diagram showing temperature changes when the heating mechanism is controlled based on the virtual temperature.

[0029] Fig.18 It is a diagram showing a heating mechanism according to a first modification.

[0030] Fig.19 It is a diagram showing a heating mechanism according to a second modification. DETAILED DESCRIPTION

[0031] Hereinafter, non-limiting exemplary embodiments of the present invention will be described with reference to the accompanying drawings. In all the attached drawings, the same or corresponding components or parts are denoted by the same or corresponding reference numerals, and repeated descriptions are omitted.

[0032] 〔Substrate processing equipment〕

[0033] Reference Figure 1 and Figure 2 , a substrate processing apparatus 10 according to an embodiment will be described. Figure 1 It is a figure which shows the substrate processing apparatus 10 which concerns on embodiment. Figure 2 This is a diagram showing an example of the positional relationship between the heating mechanism HE12 and the temperature sensors (the first temperature sensor T11 and the second temperature sensor T12).

[0034] The substrate processing apparatus 10 includes a processing unit 11 , a fluid supply system 12 , a discharge unit 13 , and a control unit 14 .

[0035] The processing unit 11 includes a processing container 111 and a holding unit 112. The processing container 111 is, for example, a container in which a processing space capable of accommodating a substrate W having a diameter of 300 mm is formed. In the processing space, for example, a substrate having a liquid film formed thereon is processed. The substrate W may be, for example, a semiconductor wafer. The holding unit 112 is disposed inside the processing container 111. The holding unit 112 holds the substrate W horizontally. The holding unit 112 is, for example, integrally formed with the processing container 111. The holding unit 112 may also be a holding plate that is separate from the processing container 111. The processing unit 11 may also include a temperature sensor and a pressure sensor.

[0036] The fluid supply system 12 includes a treatment fluid supply source S11 , an inert gas supply source S12 , a circulation flow path L11 , a first supply flow path L12 , a return flow path L13 , a pressure relief flow path L14 , and a second supply flow path L15 .

[0037] The treatment fluid supply source S11 is a supply source of the treatment fluid. The treatment fluid may be, for example, carbon dioxide (CO 2 ).

[0038] The inert gas supply source S12 is a supply source of an inert gas. The inert gas may be, for example, nitrogen (N 2 )gas.

[0039] The circulation path L11 is connected to the treatment fluid supply source S11. The circulation path L11 circulates the treatment fluid. A pump P11 and an on-off valve V11 are provided in the circulation path L11. The pump P11 delivers the treatment fluid to the downstream side of the circulation path L11. The on-off valve V11 is a valve that switches the flow of the treatment fluid on (ON) and off (OFF). The on-off valve V11 allows the treatment fluid to circulate in the circulation path L11 when it is open, and does not allow the treatment fluid to circulate in the circulation path L11 when it is closed. On-off valves, throttling devices, temperature sensors, and pressure sensors may also be provided at various positions of the circulation path L11.

[0040] The first supply flow path L12 connects the circulation flow path L11 downstream of the pump P11 and upstream of the on-off valve V11 to the processing container 111. The first supply flow path L12 supplies the processing fluid from the circulation flow path L11 to the processing container 111. The first supply flow path L12 includes a pipe L12p ( Figure 2 In the first supply flow path L12, a flow rate adjustment mechanism FC12, a heating mechanism HE12, a second temperature sensor T12, a first temperature sensor T11, a pressure sensor P12, an on-off valve V12, and a filter F12 are provided in order from the upstream.

[0041] The flow rate adjustment mechanism FC12 is provided at a position upstream of the heating mechanism HE12. The flow rate adjustment mechanism FC12 includes opening and closing valves V121, V122, V123, and V124 and throttles OR122, OR123, and OR124.

[0042] The on-off valves V121, V122, V123, and V124 are connected in parallel to each other. The on-off valves V121, V122, V123, and V124 are valves that switch the flow of the treatment fluid on and off. The on-off valves V121, V122, V123, and V124 allow the treatment fluid to flow to the downstream heating mechanism HE12 when they are open, and do not allow the treatment fluid to flow to the downstream heating mechanism HE12 when they are closed.

[0043] The throttle OR122 is connected in series with the on-off valve V122. The throttle OR123 is connected in series with the on-off valve V123. The throttle OR124 is connected in series with the on-off valve V124. The throttles OR122, OR123, and OR124 serve to reduce the flow rate of the treatment fluid flowing in the first supply flow path L12 and adjust the pressure. The throttles OR122, OR123, and OR124 enable the treatment fluid with the adjusted pressure to flow to the downstream heating mechanism HE12. In addition, the throttle may be connected in series with the on-off valve V121 downstream of the on-off valve V121.

[0044] The heating mechanism HE12 heats the treatment fluid to a set temperature and supplies the treatment fluid at the set temperature downstream. The set temperature may be variable. The set temperature includes, for example, a first temperature and a second temperature. The first temperature is greater than 15°C and less than 100°C, for example, 80°C. The second temperature is a temperature higher than the first temperature. The second temperature is less than 150°C, for example, 120°C.

[0045] The heating mechanism HE12 is disposed outside the piping L12p. The heating mechanism HE12 heats the piping L12p and the treatment fluid flowing in the piping L12p from the outside of the piping L12p. The heating mechanism HE12 heats the piping L12p and the treatment fluid flowing in the piping L12p, for example, by irradiating light toward the piping L12p. When light heating is used, the heat capacity is small, so the temperature responsiveness is good. The heating mechanism HE12 is, for example, a lamp heater using a halogen lamp, a xenon lamp, or the like. The heating mechanism HE12 may also be a heater using a laser, a light-emitting diode (LED: Light-Emitting Diode), or the like.

[0046] The first temperature sensor T11 detects the temperature of the process fluid downstream of the heating mechanism HE12. The temperature measuring portion of the first temperature sensor T11 is inserted into the pipe L12p downstream of the heating mechanism HE12 to detect the temperature of the process fluid flowing in the pipe L12p.

[0047] The second temperature sensor T12 detects the temperature of the process fluid at the location where the heating mechanism HE12 is installed. The temperature measuring portion of the second temperature sensor T12 is installed in contact with the outer wall of the pipe L12p at the location where the heating mechanism HE12 is installed, and detects the temperature of the pipe L12p.

[0048] The pressure sensor P12 is provided in the first supply flow path L12 between the heating mechanism HE12 and the on-off valve V12. The pressure sensor P12 detects the pressure of the treatment fluid flowing in the first supply flow path L12 between the heating mechanism HE12 and the on-off valve V12. The pressure sensor P12 may be provided in the first supply flow path L12 between the on-off valve V12 and the filter F12, or in the first supply flow path L12 between the filter F12 and the treatment container 111.

[0049] The on-off valve V12 is a valve that switches the flow of the treated fluid between on and off. The on-off valve V12 allows the treated fluid to flow to the downstream filter F12 when it is open, and does not allow the treated fluid to flow to the downstream filter F12 when it is closed.

[0050] The filter F12 filters the process fluid flowing in the first supply flow path L12 to remove foreign matter contained in the process fluid, thereby preventing particles from being generated on the surface of the substrate W when the process fluid is used to process the substrate.

[0051] A line heater may be provided downstream of the heating mechanism HE12 in the first supply flow path L12. The line heater heats the first supply flow path L12 downstream of the heating mechanism HE12. The line heater suppresses the temperature drop of the treatment fluid heated to a set temperature by the heating mechanism HE12 when it flows in the first supply flow path L12. An on-off valve, a throttle, a temperature sensor, and a pressure sensor may also be provided at various positions of the first supply flow path L12.

[0052] The return flow path L13 connects the first supply flow path L12 downstream of the heating mechanism HE12 and upstream of the on-off valve V12 to the circulation flow path L11 downstream of the on-off valve V11. The return flow path L13 returns the treated fluid from the first supply flow path L12 to the circulation flow path L11. The on-off valve V13 is provided in the return flow path L13.

[0053] The on-off valve V13 is a valve that switches the flow of the treatment fluid on and off. The on-off valve V13 allows the treatment fluid to flow to the downstream circulation flow path L11 when it is open, and does not allow the treatment fluid to flow to the downstream circulation flow path L11 when it is closed.

[0054] The pressure relief passage L14 branches from the return passage L13 downstream of the branch point of the return passage L13 from the first supply passage L12 and upstream of the on-off valve V13. The pressure relief passage L14 discharges the treated fluid in the return passage L13. The on-off valve V14 is provided in the pressure relief passage L14.

[0055] The on-off valve V14 allows the treated fluid to flow to the downstream pressure relief passage L14 when it is open, and does not allow the treated fluid to flow to the downstream pressure relief passage L14 when it is closed.

[0056] The second supply flow path L15 is connected to the inert gas supply source S12 upstream and to the first supply flow path L12 between the on-off valve V12 and the filter F12 downstream. The second supply flow path L15 supplies inert gas to the first supply flow path L12 between the on-off valve V12 and the filter F12. In the second supply flow path L15, a check valve C15 and an on-off valve V15 are sequentially provided from the upstream.

[0057] The check valve C15 prevents the backflow of the processing fluid from the first supply flow path L12 to the inert gas supply source S12.

[0058] The on-off valve V15 is a valve that switches the flow of the inert gas on and off. The on-off valve V15 allows the inert gas to flow to the downstream first supply flow path L12 when open, and does not allow the inert gas to flow to the downstream first supply flow path L12 when closed.

[0059] A heating mechanism, a line heater, an on-off valve, a throttle, a temperature sensor, and a pressure sensor may be further provided at various positions of the second supply flow path L15.

[0060] The discharge unit 13 has a discharge flow path L18. The discharge flow path L18 is connected to the processing container 111. In the discharge flow path L18, a pressure sensor P18, a back pressure valve BV18, and an on-off valve V18 are provided in order from the upstream.

[0061] The pressure sensor P18 detects the pressure of the fluid flowing in the discharge flow path L18 immediately after the processing container 111. Thus, the pressure inside the processing container 111 can be detected.

[0062] When the primary pressure of the discharge flow path L18 exceeds the set pressure, the back pressure valve BV18 ​​adjusts the valve opening to allow the fluid to flow to the secondary side, thereby maintaining the primary pressure at the set pressure. For example, the set pressure of the back pressure valve BV18 ​​is adjusted by the control unit 14 .

[0063] The on-off valve V18 is a valve that switches the flow of the fluid between on and off. The on-off valve V18 allows the fluid to flow to the downstream discharge flow path L18 when it is open, and does not allow the fluid to flow to the downstream discharge flow path L18 when it is closed.

[0064] A line heater may be provided in the discharge flow path L18. The line heater heats the discharge flow path L18. An on-off valve, a throttle, a temperature sensor, and a pressure sensor may also be provided at various positions in the discharge flow path L18.

[0065] The control unit 14 is, for example, a computer, and includes a computing unit 141 and a storage unit 142. In the storage unit 142, a program for controlling various processes performed in the substrate processing device 10 is stored. The computing unit 141 controls the operation of the substrate processing device 10 by reading and executing the program stored in the storage unit 142. The program can also be recorded in a storage medium that can be read by a computer, and installed from the storage medium to the storage unit 142 of the control unit 14. As a storage medium that can be read by a computer, for example, there are a hard disk (HD), a floppy disk (FD), a compact disk (CD), a magneto-optical disk (MO), a memory card, etc. The control unit 14 can also be included in the fluid supply system 12.

[0066] The control unit 14 receives measurement signals from various sensors (first temperature sensor T11, second temperature sensor T12, pressure sensor P18, etc.), and sends control signals to various functional elements. The control signals include, for example, the opening and closing signals of the opening and closing valves V11, V12, V121, V122, V123, V124, V13, V14, V15, and V18, the set pressure signal of the back pressure valve BV18, the set temperature signal of the heating mechanism HE12, and the set temperature signal of the pipeline heater.

[0067] The control unit 14 may control the output of the heating mechanism HE12 based on the pressure of the process fluid detected by the pressure sensor P12, the temperature of the process fluid detected by the first temperature sensor T11, and the temperature of the pipe L12p detected by the second temperature sensor T12.

[0068] The control unit 14 calculates the virtual temperature T using the calculation formula of the formula (1), for example, and controls the output of the heating mechanism HE12 based on the calculated virtual temperature T.

[0069] T=αT 1 +βT 2 ··· (1)

[0070] In formula (1), T is the fictive temperature, T 1 is the temperature of the process fluid detected by the first temperature sensor T11, T 2 is the temperature of the pipe L12p detected by the second temperature sensor T12. α is a first weight coefficient associated with the pressure of the process fluid detected by the pressure sensor P12. β is a second weight coefficient associated with the pressure of the process fluid detected by the pressure sensor P12. The value after adding α and β is always 1 (α+β=1). αT 1 is the temperature T detected by the first temperature sensor T11 1 The first calculation temperature obtained by multiplying the first weight coefficient α. βT 2 is the temperature T detected by the second temperature sensor T12 2 The second calculated temperature is obtained by multiplying the second weight coefficient β.

[0071] For example, when the first weight coefficient α is relatively increased (the second weight coefficient β is relatively decreased), the first calculation temperature αT 1 For example, when the first weight coefficient α is relatively reduced (the second weight coefficient β is relatively increased), the second operation temperature βT 2 becomes relatively large, and the contribution of the temperature of the pipe L12p detected by the second temperature sensor T12 becomes high.

[0072] The control unit 14 may also set the first weight coefficient α when the pressure of the processing fluid detected by the pressure sensor P12 is the first pressure to a value smaller than the first weight coefficient α when the pressure of the processing fluid detected by the pressure sensor P12 is the second pressure higher than the first pressure. When the pressure detected by the pressure sensor P12 is small, the response speed of the first temperature sensor T11 is slow, so the contribution of the second temperature sensor T12 is increased by making the first weight coefficient α relatively small (making the second weight coefficient β relatively large), thereby improving the temperature controllability.

[0073] The control unit 14 may also set the second weight coefficient β to a value greater than the first weight coefficient α (α<β) when the treatment fluid does not flow in the pipe L12p. When the treatment fluid does not flow in the pipe L12p, the response speed of the first temperature sensor T11 is very slow. Therefore, by reducing the contribution of the first temperature sensor T11 and increasing the contribution of the second temperature sensor T12, the temperature controllability is improved.

[0074] The control unit 14 may also set the second weight coefficient β to a value greater than the first weight coefficient α (α<β) when a treatment fluid in a gas state flows in the piping L12p, and set the first weight coefficient α to a value greater than the value when no treatment fluid flows in the piping L12p. When a treatment fluid in a gas state flows in the piping L12p, the response speed of the first temperature sensor T11 is slow. Therefore, by reducing the contribution of the first temperature sensor T11 and increasing the contribution of the second temperature sensor T12, the temperature controllability is improved. However, when a treatment fluid in a gas state flows in the piping L12p, the response speed of the first temperature sensor T11 is faster than when no treatment fluid flows in the piping L12p. Therefore, the first weight coefficient α when a treatment fluid in a gas state flows in the piping L12p may be set to a value greater than the first weight coefficient α when no treatment fluid flows in the piping L12p.

[0075] The control unit 14 may also set the first weight coefficient α to a value greater than the second weight coefficient β (α>β) when a supercritical processing fluid flows in the pipe L12p. When a supercritical processing fluid flows in the pipe L12p, the response speed of the first temperature sensor T11 is fast. Therefore, by increasing the contribution of the first temperature sensor T11 and reducing the contribution of the second temperature sensor T12, the temperature controllability is improved.

[0076] For example, the control unit 14 may control the output of the heating mechanism HE12 while supplying the processing fluid into the processing container 111. In the case of the heating mechanism HE12 using light heating, the heat capacity is small and the temperature responsiveness is good. Therefore, the temperature of the processing fluid can be changed in a short time.

[0077] For example, the control unit 14 may circulate the processing fluid between the circulation flow path L11, the first supply flow path L12, and the return flow path L13 while the processing fluid in the processing container 111 is discharged from the discharge flow path L18 without supplying the processing fluid into the processing container 111. In this case, the discharge of the processing fluid in the processing container 111 and the preparation of the processing fluid for processing the next substrate W can be performed in parallel. Therefore, the processing time in the continuous processing can be shortened.

[0078] For example, the control unit 14 may circulate the processing fluid between the circulation flow path L11, the first supply flow path L12, and the return flow path L13 until the virtual temperature reaches the set temperature. In this case, the processing fluid at the set temperature is supplied to the processing container 111 immediately after the on-off valve V12 is opened. Therefore, it is possible to suppress the temperature from changing immediately after the processing fluid is supplied.

[0079] For example, the control unit 14 may control the on-off valve V14 to discharge the processing fluid in the return flow path L13 from the pressure relief flow path L14 before supplying the processing fluid into the processing container 111. In this case, it is possible to prevent the high-pressure processing fluid from being supplied into the processing container 111 immediately after the on-off valve V12 is opened. This can prevent the processing fluid from being supplied to the substrate W at a high speed, thereby preventing the pattern from collapsing.

[0080] For example, the control unit 14 may set the supply flow rate of the processing fluid supplied into the processing container 111 as the first flow rate to increase the pressure in the processing container 111 until the pressure in the processing container 111 reaches the first pressure. In addition, when the pressure in the processing container 111 reaches the first pressure, the control unit 14 may set the supply flow rate to a second flow rate greater than the first flow rate to further increase the pressure in the processing container 111. In this case, it is possible to prevent the processing fluid from being supplied to the substrate W at a high speed in the initial stage, and to prevent pattern collapse.

[0081] In the substrate processing apparatus 10 according to the embodiment, the control unit 14 controls the output of the heating mechanism HE12 based on the pressure of the processing fluid detected by the pressure sensor P12, the temperature of the processing fluid detected by the first temperature sensor T11, and the temperature of the pipe L12p detected by the second temperature sensor T12. In this case, the virtual temperature can be calculated based on the temperature of the processing fluid detected by the first temperature sensor T11 and the temperature of the pipe L12p detected by the second temperature sensor T12 according to the state of the processing fluid, and the output of the heating mechanism HE12 can be controlled based on the calculated virtual temperature. Therefore, the temperature of the processing fluid can be brought close to the set temperature regardless of the state of the processing fluid.

[0082] 〔Substrate processing method〕

[0083] Reference Figures 3 to 14 , a substrate processing method performed using the substrate processing apparatus 10 is described. The substrate processing method described below is automatically performed under the control of the control unit 14 based on the processing recipe and the control program stored in the storage unit 142.

[0084] Figure 3 1 is a flowchart showing a substrate processing method according to an embodiment. Figure 4 It is shown Figure 3 FIG. 1 is a diagram showing a pressure change in a processing container 111 in a substrate processing method. Figure 5 This is a diagram showing an example of the fictive temperature. Figures 6 to 14 is a diagram showing a substrate processing method according to an embodiment. Figures 6 to 14 In the figure, the valve in the open state is indicated by black, and the valve in the closed state is indicated by hollow. Figures 6 to 14 In the figure, the flow path through which the fluid flows is indicated by a thick solid line.

[0085] like Figure 3 As shown, the substrate processing method according to the embodiment includes a standby step ST11, a pressure increasing step ST12, a circulation step ST13, and a pressure reducing step ST14. In the following description, it is assumed that the substrate W has been carried into the processing container 111 before the standby step ST11. The substrate W is subjected to a cleaning process and is placed on the holding portion 112 in a state where the recessed portions of the pattern on the surface are filled with isopropyl alcohol (IPA).

[0086] <Standby process ST11>

[0087] First, if Figure 6As shown, the set temperature of the heating mechanism HE12 is set to a first temperature, for example, 80°C, and the on-off valves V121, V13, V15, and V18 are set to an open state, and the on-off valves V11, V12, V122, V123, V124, and V14 are set to a closed state. Thus, the treatment fluid of the treatment fluid supply source S11 circulates in the circulation flow path L11, the first supply flow path L12, the return flow path L13, and the circulation flow path L11 in sequence. The treatment fluid is heated to the first temperature by the heating mechanism HE12 in the first supply flow path L12. The treatment fluid circulates in the circulation flow path L11, the first supply flow path L12, the return flow path L13, and the circulation flow path L11 in sequence, whereby each flow path gradually approaches the first temperature. In the standby process ST11, the treatment fluid can also be circulated between the circulation flow path L11, the first supply flow path L12, and the return flow path L13 until the hypothetical temperature reaches the first temperature. In this case, the processing fluid at the first temperature is supplied to the processing container 111 immediately after the on-off valve V12 is opened. Therefore, it is possible to suppress the temperature from changing immediately after the processing fluid is supplied. In addition, the inert gas from the inert gas supply source S12 is supplied to the processing container 111 through the second supply flow path L15 and the first supply flow path L12, and is discharged through the discharge flow path L18.

[0088] Then, if Figure 7 As shown, the on-off valves V13 and V121 are switched from the open state to the closed state, and the on-off valves V11 and V14 are switched from the closed state to the open state. As a result, the circulation of the processing fluid between the circulation flow path L11, the first supply flow path L12 and the return flow path L13 is stopped. In addition, the processing fluid in the first supply flow path L12 between the flow adjustment mechanism FC12 and the on-off valve V12, and the processing fluid in the return flow path L13 between the on-off valve V12 and the on-off valve V13 are discharged from the pressure relief flow path L14. Therefore, the pressure in the first supply flow path L12 between the flow adjustment mechanism FC12 and the on-off valve V12, and the pressure in the return flow path L13 between the on-off valve V12 and the on-off valve V13 are reduced. In this case, it is possible to prevent the situation where a high-pressure processing fluid is supplied to the processing container 111 just after the on-off valve V12 becomes the open state. As a result, it is possible to suppress the situation where the processing fluid is supplied to the substrate W at a high speed, and it is possible to suppress the pattern collapse. In addition, the on-off valve V15 is switched from the open state to the closed state, thereby exhausting the inert gas in the processing container 111 from the exhaust flow path L18.

[0089] Then, if Figure 8 As shown, the on-off valve V18 is switched from the open state to the closed state, and the on-off valve V12 is switched from the closed state to the open state.

[0090] During this series of operations, the control unit 14 receives outputs from the pressure sensor P12, the first temperature sensor T11, and the second temperature sensor T12, calculates a virtual temperature using the calculation formula (1), and controls the output of the heating mechanism HE12 based on the calculated virtual temperature.

[0091] In the standby process ST11, the processing fluid does not flow in the pipe L12p or the processing fluid in a gas state flows in the pipe L12p. Therefore, the control unit 14 sets the second weight coefficient β to a value greater than the first weight coefficient α. Figure 5 As shown, the control unit 14 sets the first weight coefficient α to the range of 0<α≤0.1, and sets the second weight coefficient β to the range of 0.9≤β<1. In the case where the treatment fluid is not flowing in the piping L12p and in the case where the treatment fluid in the gas state is filled in the piping L12p, the response speed of the first temperature sensor T11 is slow. Therefore, by reducing the contribution of the first temperature sensor T11 and increasing the contribution of the second temperature sensor T12, the temperature controllability is improved. The control unit 14 determines which of the multiple states the state in the piping L12p is based on the pressure of the treatment fluid detected by the pressure sensor P12. The multiple states may include a state where the treatment fluid is not flowing in the piping L12p, a state where the treatment fluid in the gas state flows in the piping L12p, and a state where the treatment fluid in the supercritical state flows in the piping L12p.

[0092] <Pressure Boosting Step ST12>

[0093] The pressurization process ST12 is performed after the standby process ST11. In the pressurization process ST12, first, the pressure in the processing container 111 is increased based on the supply of the processing fluid at the first flow rate and the first temperature (the first pressurization process). Next, the pressure in the processing container 111 is increased based on the supply of the processing fluid at the second flow rate and the first temperature (the second pressurization process). Next, the pressure in the processing container 111 is increased based on the supply of the processing fluid at the third flow rate and the first temperature (the third pressurization process). Next, the pressure in the processing container 111 is increased based on the supply of the processing fluid at the third flow rate and the second temperature, for example, 120°C (the fourth pressurization process). The magnitude relationship among the first flow rate, the second flow rate and the third flow rate is first flow rate < second flow rate < third flow rate. The second temperature is a temperature higher than the first temperature.

[0094] In the first step of boosting, Fig. 9As shown, the on-off valve V122 is switched from a closed state to an open state. As a result, the processing fluid of the processing fluid supply source S11 is supplied to the processing container 111 via the circulation flow path L11 and the first supply flow path L12. At this time, the processing fluid is adjusted to a first flow rate by the throttling member OR122, and is adjusted to a first temperature by the heating mechanism HE12. Therefore, the processing fluid of the first flow rate and the first temperature is supplied to the processing container 111. In the first pressure increasing process, the on-off valve V18 is in a closed state, so the processing fluid does not flow out of the processing container 111. Therefore, the pressure in the processing container 111 gradually rises. As a result, pattern collapse can be suppressed.

[0095] During the first pressure increasing step, the pressure in the processing container 111 is detected by the pressure sensor P18, and the pressure is continuously increased at the first flow rate until the pressure in the processing container 111 reaches the first pressure Y1 (see Figure 4 ). When the pressure in the processing container 111 reaches the first pressure Y1, the first pressure increasing step is ended and the process is transferred to the second pressure increasing step.

[0096] In the second step of boosting, Fig.10 As shown, the on-off valve V123 is switched from a closed state to an open state. As a result, the processing fluid of the processing fluid supply source S11 is adjusted to a second flow rate through the throttling members OR122 and OR123, and is adjusted to a first temperature through the heating mechanism HE12. Therefore, the processing fluid of the second flow rate and the first temperature is supplied to the processing container 111. In the second pressurizing process, the on-off valve V18 is in a closed state, so the processing fluid does not flow out of the processing container 111. Therefore, the pressure in the processing container 111 gradually increases. In the second pressurizing process, the processing fluid is pressurized with a larger flow rate than in the first pressurizing process, so the pressurizing speed can be increased.

[0097] During the second pressure increasing step, the pressure in the processing container 111 is detected by the pressure sensor P18, and the pressure is continuously increased at the second flow rate until the pressure in the processing container 111 reaches the second pressure Y2 (see Figure 4 ). When the pressure in the processing container 111 reaches the second pressure Y2, the second pressure increasing step is ended and the process is transferred to the third pressure increasing step.

[0098] In the third step of boosting, Fig.11As shown, the on-off valve V124 is switched from a closed state to an open state. As a result, the processing fluid of the processing fluid supply source S11 is adjusted to a third flow rate through throttling members OR122, OR123, and OR124, and is adjusted to a first temperature through the heating mechanism HE12. Therefore, the processing fluid of the third flow rate and the first temperature is supplied to the processing container 111. In the third pressurizing process, the on-off valve V18 is in a closed state, so the processing fluid does not flow out of the processing container 111. Therefore, the pressure in the processing container 111 gradually increases. In the third pressurizing process, the processing fluid is pressurized with a larger flow rate than in the second pressurizing process, so the pressurizing speed can be further increased.

[0099] During the pressure increase at the third flow rate, the pressure of the treatment fluid supplied to the treatment container 111 is lower than the critical pressure. Therefore, the treatment fluid is supplied to the treatment container 111 in a gas state. Thereafter, as the filling of the treatment fluid into the treatment container 111 progresses, the pressure in the treatment container 111 gradually increases, and when the pressure in the treatment container 111 exceeds the critical pressure, the treatment fluid in the treatment container 111 becomes a supercritical state.

[0100] During the third pressure increasing step, the pressure in the processing container 111 is detected by the pressure sensor P18, and the pressure is continuously increased at the third flow rate until the pressure in the processing container 111 reaches the third pressure Y3 (see Figure 4 ). When the pressure in the processing container 111 reaches the third pressure Y3, the third pressure increasing step is ended and the process is transferred to the fourth pressure increasing step.

[0101] In the fourth step of boosting, Fig.12 As shown, the set temperature of the heating mechanism HE12 is changed from the first temperature to the second temperature. As a result, the processing fluid of the processing fluid supply source S11 is adjusted to the second temperature through the heating mechanism HE12. Therefore, the processing fluid of the third flow rate and the second temperature is supplied to the processing container 111. In this way, while the processing fluid is supplied to the processing container 111, the heating mechanism HE12 is controlled to raise the temperature of the processing fluid from the first temperature to the second temperature. In the case of the heating mechanism HE12 using light heating, the heat capacity is small, so the temperature responsiveness is good. Therefore, the processing fluid can be raised from the first temperature to the second temperature in a short time. In the fourth pressurization step, the on-off valve V18 is in a closed state, so the processing fluid does not flow out of the processing container 111. Therefore, the pressure in the processing container 111 gradually rises.

[0102] During the fourth pressure increasing step, the pressure in the processing container 111 is detected by the pressure sensor P18, and the fourth pressure increasing step is continued until the pressure in the processing container 111 reaches the fourth pressure Y4 (refer to Figure 4). When the pressure in the processing container 111 reaches the fourth pressure Y4, the fourth pressure increasing step is ended and the flow step is transferred to the flow step.

[0103] As described above, in the pressure increasing process, the pressure increasing speed is gradually increased in the order of the first pressure increasing process, the second pressure increasing process, and the third pressure increasing process. In this case, it is possible to suppress the supply of the processing fluid to the substrate W at a high speed in the initial stage, and to suppress pattern collapse.

[0104] During this series of operations, the control unit 14 receives outputs from the pressure sensor P12, the first temperature sensor T11, and the second temperature sensor T12, calculates a virtual temperature using the calculation formula (1), and controls the output of the heating mechanism HE12 based on the calculated virtual temperature.

[0105] In the pressure increasing step ST12, the process fluid in a gaseous state flows in the pipe L12p from the beginning to the middle of the pressure increasing. Therefore, the control unit 14 sets the second weight coefficient β to a value larger than the first weight coefficient α. Figure 5 As shown, the control unit 14 sets the first weight coefficient α to a range of 0<α≤0.5, and sets the second weight coefficient β to a range of 0.5≤β<1. When the process fluid in the gas state flows in the pipe L12p, the response speed of the first temperature sensor T11 is slow. Therefore, by reducing the contribution of the first temperature sensor T11 and increasing the contribution of the second temperature sensor T12, the temperature controllability is improved.

[0106] In the pressure increasing step ST12, the process fluid in a supercritical state flows in the pipe L12p from the middle of the pressure increasing to the end of the pressure increasing. Therefore, the control unit 14 sets the first weight coefficient α to a value larger than the second weight coefficient β. Figure 5 As shown, the control unit 14 sets the first weight coefficient α to a range of 0.9≤α<1, and sets the second weight coefficient β to a range of 0<β≤0.1. When the processing fluid in a supercritical state flows in the pipe L12p, the response speed of the first temperature sensor T11 is fast. Therefore, by increasing the contribution of the first temperature sensor T11 and reducing the contribution of the second temperature sensor T12, the temperature controllability is improved.

[0107] For example, the control unit 14 may determine which of a plurality of states the state in the pipe L12p is based on the pressure of the process fluid detected by the pressure sensor P12.

[0108] <Distribution process ST13>

[0109] The circulation step ST13 is performed after the pressure increasing step ST12. In the circulation step ST13, the processing fluid at the third flow rate and the second temperature is supplied from the processing fluid supply source S11 into the processing container 111, and the IPA is replaced by the processing fluid in the concave portion of the pattern on the substrate W in the processing container 111. Specifically, Fig.13 As shown, the on-off valve V18 is switched from the closed state to the open state. As a result, the processing fluid of the processing fluid supply source S11 is supplied to the processing container 111 via the circulation flow path L11 and the first supply flow path L12, and is discharged from the processing container 111 via the discharge flow path L18. Therefore, the pressure in the processing container 111 is maintained at the fourth pressure Y4 (refer to Figure 4 ). By performing the circulation step ST13, the replacement of the IPA with the processing fluid in the concave portion of the pattern of the substrate W is promoted.

[0110] When the replacement of the processing fluid from IPA in the concave portion of the pattern is completed, the flow step ST13 is ended and the process shifts to the decompression step ST14.

[0111] During this series of operations, the control unit 14 receives outputs from the pressure sensor P12, the first temperature sensor T11, and the second temperature sensor T12, calculates a virtual temperature using the calculation formula (1), and controls the output of the heating mechanism HE12 based on the calculated virtual temperature.

[0112] In the circulation step ST13, the processing fluid in a supercritical state flows in the pipe L12p. Therefore, the control unit 14 sets the first weight coefficient α to a value larger than the second weight coefficient β. Figure 5 As shown, the control unit 14 sets the first weight coefficient α to a range of 0.9≤α<1, and sets the second weight coefficient β to a range of 0<β≤0.1. When the processing fluid in a supercritical state flows in the pipe L12p, the response speed of the first temperature sensor T11 is fast. Therefore, by increasing the contribution of the first temperature sensor T11 and reducing the contribution of the second temperature sensor T12, the temperature controllability is improved.

[0113] For example, the control unit 14 may determine which of a plurality of states the state in the pipe L12p is based on the pressure of the process fluid detected by the pressure sensor P12.

[0114] <Decompression step ST14>

[0115] The decompression step ST14 is performed after the circulation step ST13. In the decompression step ST14, the processing fluid is discharged from the processing container 111. Specifically, Fig.14As shown, the on-off valve V12 is switched from the open state to the closed state. As a result, the processing fluid remaining in the processing container 111 is discharged from the discharge flow path L18. When the pressure in the processing container 111 becomes lower than the critical pressure of the processing fluid through the decompression step ST14, the processing fluid in the supercritical state is vaporized and separated from the concave portion of the pattern. Thus, the drying process of a substrate W is completed.

[0116] In the decompression step ST14, Fig.14 As shown, the set temperature of the heating mechanism HE12 is changed from the second temperature to the first temperature, the on-off valves V11, V122, V123, and V124 are switched from the open state to the closed state, and the on-off valves V121 and V13 are switched from the closed state to the open state. As a result, the processing fluid of the processing fluid supply source S11 circulates between the circulation flow path L11, the first supply flow path L12, and the return flow path L13, and is cooled from the second temperature to the first temperature. In this case, the discharge of the processing fluid in the processing container 111 and the preparation of the processing fluid for processing the next substrate W can be implemented in parallel. Therefore, the processing time in the continuous processing can be shortened.

[0117] In the decompression step ST14, the on-off valves V122, V123, and V124 may be switched from open to closed, the on-off valve V11 may be maintained open, and the on-off valves V121 and V13 may be maintained closed. In this case, the treatment fluid of the treatment fluid supply source S11 circulates in the circulation flow path L11.

[0118] During this series of operations, the control unit 14 receives outputs from the pressure sensor P12, the first temperature sensor T11, and the second temperature sensor T12, calculates a virtual temperature using the calculation formula (1), and controls the output of the heating mechanism HE12 based on the calculated virtual temperature.

[0119] In the decompression process ST14, the processing fluid does not flow in the piping L12p, or the processing fluid in a gas state flows in the piping L12p. Therefore, the control unit 14 sets the second weight coefficient β to a value greater than the first weight coefficient α. In the decompression process ST14, the temperature change caused by the volume expansion of the processing fluid during decompression is large, so the temperature detected by the first temperature sensor T11 is prone to change. Therefore, the control unit 14 sets the second weight coefficient β to a value greater than the second weight coefficient β in the standby process ST11. Figure 5As shown, the control unit 14 sets the first weight coefficient α to the range of 0<α≤0.1, and sets the second weight coefficient β to the range of 0.9≤β<1. In the case where the treatment fluid is not flowing in the piping L12p, and in the case where the treatment fluid is filled in the piping L12p in a gas state, the response speed of the first temperature sensor T11 is slow. Therefore, by reducing the contribution of the first temperature sensor T11 and increasing the contribution of the second temperature sensor T12, the temperature controllability is improved. The control unit 14 determines which of the multiple states the state in the piping L12p is based on the pressure of the treatment fluid detected by the pressure sensor P12.

[0120] After the decompression process ST14, the process is transferred to the standby process ST11. The unloading of the processed substrate W from the processing container 111 is performed, for example, after the process is transferred to the standby process ST11. Specifically, after the decompression process ST14, the supply of the inert gas into the processing container 111 via the second supply flow path L15 is started. Next, the substrate W is unloaded from the processing container 111 while the inert gas is being supplied into the processing container 111. After the substrate W is unloaded from the processing container 111, the inert gas is continuously supplied into the processing container 111. In this way, when the substrate W is unloaded from the processing container 111 while the inert gas is being supplied into the processing container 111, the processing container 111 becomes positively pressurized, and therefore, when the processing container 111 is opened, an airflow is formed from the inside of the processing container 111 toward the outside. Therefore, the residue in the processing container 111 can be discharged to the outside of the processing container 111 and removed. However, when the substrate W is unloaded from the processing container 111 , the supply of the inert gas into the processing container 111 may be stopped.

[0121] In the substrate processing method of the embodiment described above, the case where the heating mechanism HE12 is controlled in the pressure increasing process ST12 to raise the temperature of the processing fluid from the first temperature to the second temperature is described, but the present invention is not limited thereto. For example, the heating mechanism HE12 may be controlled in the circulation process ST13 to raise the temperature of the processing fluid from the first temperature to the second temperature. For example, in the standby process ST11, the pressure increasing process ST12, the circulation process ST13, and the decompression process ST14, the set temperature of the heating mechanism HE12 may also be fixed to a constant value.

[0122] 〔Temperature control〕

[0123] Reference Fig.15 Next, the temperature control in the case where the output of the heating means HE12 is controlled based on only the temperature detected by the first temperature sensor T11 will be described. Fig.15 : is a diagram showing temperature changes when the heating mechanism HE12 is controlled based only on the temperature detected by the first temperature sensor T11. Fig.15 In FIG. 1 , a thin solid line indicates the temperature detected by the first temperature sensor T11 , a thick solid line indicates the temperature detected by the second temperature sensor T12 , and a dashed line indicates the set temperature.

[0124] In the case where the output of the heating mechanism HE12 is controlled based only on the temperature detected by the first temperature sensor T11, in the standby process ST11, the temperature detected by the second temperature sensor T12 becomes a temperature higher than the set temperature. That is, the temperature of the pipe L12p becomes a temperature higher than the set temperature. Just after the standby process ST11 is transferred to the pressurization process ST12, the processing fluid circulates in the pipe L12p heated to a temperature higher than the set temperature, so the temperature of the processing fluid is heated to a temperature higher than the set temperature. Therefore, the temperature detected by the first temperature sensor T11 becomes a temperature higher than the set temperature just after the standby process ST11 is transferred to the pressurization process ST12, and changes in a manner close to the set temperature as time passes. That is, in the pressurization process ST12 and the circulation process ST13, the temperature of the processing fluid supplied to the processing container 111 is unstable. In the decompression process ST14, due to the volume expansion in the pipe L12p, the temperature in the pipe L12p drops sharply, and the temperature detected by the first temperature sensor T11 drops significantly compared to the set temperature. Although the output of the heating means HE12 is controlled so that the temperature detected by the first temperature sensor T11 becomes the set temperature, the temperature in the pipe L12p rises suddenly and an overshoot is likely to occur.

[0125] Reference Fig.16 Next, the temperature control in the case where the output of the heating means HE12 is controlled based on only the temperature detected by the second temperature sensor T12 will be described. Fig.16 2 is a diagram showing temperature changes when the heating mechanism HE12 is controlled based only on the temperature detected by the second temperature sensor T12. Fig.16 In FIG. 1 , a thin solid line indicates the temperature detected by the first temperature sensor T11 , a thick solid line indicates the temperature detected by the second temperature sensor T12 , and a dashed line indicates the set temperature.

[0126] When the heating mechanism HE12 is controlled based only on the temperature detected by the second temperature sensor T12, the temperature detected by the first temperature sensor T11 becomes lower than the set temperature in the pressure increasing step ST12 and the circulation step ST13. The temperature of the processing fluid supplied to the processing container 111 is substantially equal to the temperature detected by the first temperature sensor T11. Therefore, in the pressure increasing step ST12 and the circulation step ST13, the processing fluid having a temperature lower than the set temperature is supplied to the processing container 111.

[0127] Reference Fig.17Next, the temperature control in the case where the output of the heating means HE12 is controlled based on the virtual temperature calculated by the calculation formula of the formula (1) will be described. Fig.17 : is a diagram showing temperature changes when the heating mechanism HE12 is controlled based on the virtual temperature. Fig.17 In FIG. 1 , a thin solid line indicates the temperature detected by the first temperature sensor T11 , a thick solid line indicates the temperature detected by the second temperature sensor T12 , and a dashed line indicates the set temperature.

[0128] When the output of the heating means HE12 is controlled based on the virtual temperature, the ratio of the contribution of the first temperature sensor T11 and the contribution of the second temperature sensor T12 can be changed according to the pressure in the pipe L12p.

[0129] In the standby process ST11, the second weight coefficient β is set to a value greater than the first weight coefficient α. For example, the first weight coefficient α is set to 0.1, and the second weight coefficient β is set to 0.9. In this case, the contribution of the second temperature sensor T12 is higher than the contribution of the first temperature sensor T11. Therefore, in the standby process ST11, the temperature detected by the second temperature sensor T12 becomes a temperature substantially the same as the set temperature.

[0130] Just after the transfer from the standby process ST11 to the pressurization process ST12, the treatment fluid passes through the piping L12p heated to a temperature substantially the same as the set temperature, so the temperature of the treatment fluid becomes substantially the same as the set temperature. Therefore, the temperature detected by the first temperature sensor T11 hardly changes just after the transfer from the standby process ST11 to the pressurization process ST12. In the pressurization process ST12, the first weight coefficient α during the period when the treatment fluid in a gas state flows in the piping L12p is set to a value greater than the first weight coefficient α in the standby process ST11. For example, the first weight coefficient α is set to 0.3, and the second weight coefficient β is set to 0.7. During the period when the treatment fluid in a supercritical state flows in the piping L12p in the pressurization process ST12 and in the circulation process ST13, the first weight coefficient α is set to a value greater than the second weight coefficient β. For example, the first weight coefficient α is set to 0.99, and the second weight coefficient β is set to 0.01. In this case, in the pressure increasing step ST12 and the circulation step ST13, the temperature detected by the first temperature sensor T11 is maintained at a temperature substantially equal to the set temperature. Therefore, in the pressure increasing step ST12 and the circulation step ST13, the processing fluid having a temperature substantially equal to the set temperature is supplied to the processing container 111. That is, the temperature of the processing fluid can be brought close to the set temperature regardless of the state of the processing fluid.

[0131] In the decompression process ST14, the second weight coefficient β is set to a value greater than the first weight coefficient α. For example, the first weight coefficient α is set to 0.01, and the second weight coefficient β is set to 0.99. In this case, the contribution of the second temperature sensor T12 is higher than the contribution of the first temperature sensor T11. In the decompression process ST14, due to the volume expansion in the piping L12p, the temperature in the piping L12p drops sharply, and the temperature detected by the first temperature sensor T11 becomes a temperature significantly lower than the set temperature. At this time, the output of the heating mechanism HE12 is mainly controlled in such a way that the temperature detected by the second temperature sensor T12 becomes the set temperature. The temperature detected by the second temperature sensor T12 becomes a temperature closer to the set temperature than the temperature detected by the first temperature sensor T11. Therefore, compared with the case where the output of the heating mechanism HE12 is controlled in such a way that the temperature detected by the first temperature sensor T11 becomes the set temperature, the sharp rise in the temperature in the piping L12p can be suppressed, and thus overshoot can be suppressed.

[0132] It should be understood that the embodiments disclosed herein are illustrative in all aspects and are not restrictive. The above embodiments may be omitted, replaced, or modified in various ways without departing from the scope of the appended claims and the gist thereof.

[0133] In the above-mentioned embodiment, the case where the output of the heating mechanism HE12 is controlled based on the pressure of the processing fluid detected by the pressure sensor P12, the temperature of the processing fluid detected by the first temperature sensor T11, and the temperature of the pipe L12p detected by the second temperature sensor T12 is described. However, the present invention is not limited to this. For example, the pressure of the processing fluid detected by the pressure sensor P18 may be used instead of the pressure of the processing fluid detected by the pressure sensor P12. For example, the set temperature may be used instead of the temperature of the pipe L12p detected by the second temperature sensor T12.

[0134] In the above embodiment, the heating mechanism HE12 is provided outside the pipe L12p and heats the treatment fluid flowing in the pipe L12p by irradiating light from the outside of the pipe L12p toward the pipe L12p, but the present invention is not limited to this.

[0135] Fig.18 1 is a diagram showing a heating mechanism HE12 according to a first modification example. Fig.18As shown, the heating mechanism HE12 includes a spiral tube HE121 and a heater HE122. The spiral tube HE121 is spirally arranged around the heater HE122. A treatment fluid flows inside the spiral tube HE121. The spiral tube HE121 is formed of, for example, stainless steel. The heater HE122 is arranged on the inner side of the spiral of the spiral tube HE121. The heater HE122 has a rod shape. The heater HE122 heats the spiral tube HE121 and the treatment fluid flowing in the spiral tube HE121 by irradiating light from the inner side of the spiral of the spiral tube HE121 toward the spiral tube HE121. Fig.18 In the example, the temperature measuring part of the first temperature sensor T11 is inserted into the spiral tube HE121 near the outlet of the spiral tube HE121 to detect the temperature of the treatment fluid flowing in the spiral tube HE121. The temperature measuring part of the second temperature sensor T12 is provided in contact with the outer wall of the spiral tube HE121 to detect the temperature of the spiral tube HE121.

[0136] Fig.19 2 is a diagram showing a heating mechanism HE12 according to a second modification. Fig.19 As shown, the heating mechanism HE12 includes a tank HE125, a heater HE126 and a heater HE127. The tank HE125 stores a treatment fluid. The tank HE125 is formed of, for example, stainless steel. The heater HE126 is buried in the wall of the tank HE125. The heater HE127 is disposed inside the tank HE125. The heater HE126 and the heater HE127 heat the tank HE125 and the treatment fluid stored in the tank HE125. The tank HE125 is provided with a first connection port HE128 and a second connection port HE129. In the tank HE125, the treatment fluid is supplied to the tank HE125 via the first connection port HE128, and the treatment fluid is discharged from the tank HE125 via the second connection port HE129. Fig.19 In the example, the temperature measuring part of the first temperature sensor T11 is inserted into the second connection port HE129 to detect the temperature of the treatment fluid flowing in the second connection port HE129. The temperature measuring part of the second temperature sensor T12 is provided in contact with the outer wall of the tank HE125 to detect the temperature of the tank HE125.

Claims

1. A substrate processing device, comprising: a processing container that receives a substrate; a supply flow path for supplying a treatment fluid into the treatment container; a heating mechanism for heating the treatment fluid flowing in the supply flow path; a first temperature sensor that senses the temperature of the process fluid downstream of the heating mechanism; a pressure sensor that senses the pressure of the process fluid downstream of the heating mechanism; as well as Control Department, The control part performs an operation of controlling an output of the heating mechanism based on the pressure of the treatment fluid detected by the pressure sensor and the temperature of the treatment fluid detected by the first temperature sensor.

2. The substrate processing apparatus according to claim 1, wherein: Controlling the output of the heating mechanism has the following processing: calculating a first operating temperature obtained by multiplying the temperature of the processing fluid detected by the first temperature sensor by a first weight coefficient; and controlling the output of the heating mechanism based on the first calculated temperature, The first weight coefficient is a value associated with the pressure of the process fluid detected by the pressure sensor.

3. The substrate processing apparatus according to claim 2, wherein: The first weight coefficient when the pressure of the processing fluid is a first pressure is a value smaller than the first weight coefficient when the pressure of the processing fluid is a second pressure higher than the first pressure.

4. The substrate processing apparatus according to claim 2, wherein: The substrate processing apparatus further includes a second temperature sensor configured to detect a temperature of the supply flow path heated by the heating mechanism. Controlling the output of the heating mechanism has the following processing: calculating a second calculated temperature obtained by multiplying the temperature of the supply flow path detected by the second temperature sensor by a second weight coefficient; and controlling the output of the heating mechanism based on the first calculation temperature and the second calculation temperature, The second weight coefficient is a value associated with the pressure of the process fluid detected by the pressure sensor.

5. The substrate processing apparatus according to claim 4, wherein: The second weight coefficient when the pressure of the processing fluid is a first pressure is a value greater than the second weight coefficient when the pressure of the processing fluid is a second pressure higher than the first pressure.

6. The substrate processing apparatus according to claim 4, wherein: The control unit sets the first weight coefficient to a value larger than the second weight coefficient when the processing fluid flowing through the supply flow path is in a supercritical state.

7. The substrate processing apparatus according to claim 4, wherein: The control unit sets the first weight coefficient to a value smaller than the second weight coefficient when the processing fluid flowing through the supply flow path is in a gas state.

8. The substrate processing apparatus according to claim 4, wherein: The control unit sets the first weight coefficient to a value smaller than the second weight coefficient when the treatment fluid does not flow through the supply flow path.

9. The substrate processing apparatus according to any one of claims 1 to 8, wherein: The control unit controls the output of the heating mechanism while causing the processing fluid to flow from the supply flow path into the processing container.

10. The substrate processing apparatus according to any one of claims 1 to 8, wherein: The heating mechanism includes a lamp heater.

11. A fluid supply system comprising: a supply flow path for supplying a treatment fluid into the treatment container; a heating mechanism for heating the treatment fluid flowing in the supply flow path; a first temperature sensor that senses the temperature of the process fluid downstream of the heating mechanism; a pressure sensor that senses the pressure of the process fluid downstream of the heating mechanism; as well as Control Department, The control part performs an operation of controlling an output of the heating mechanism based on the pressure of the treatment fluid detected by the pressure sensor and the temperature of the treatment fluid detected by the first temperature sensor.

12. A substrate processing method using a substrate processing apparatus, wherein: The substrate processing device comprises: a processing container that receives a substrate; a supply flow path for supplying a treatment fluid into the treatment container; a heating mechanism for heating the treatment fluid flowing in the supply flow path; a first temperature sensor that senses the temperature of the process fluid downstream of the heating mechanism; as well as a pressure sensor that senses the pressure of the process fluid downstream of the heating mechanism, The substrate processing method includes a process of controlling the output of the heating mechanism based on the pressure of the processing fluid detected by the pressure sensor and the temperature of the processing fluid detected by the first temperature sensor.

13. The substrate processing method according to claim 12, wherein: Controlling the output of the heating mechanism has the following processing: calculating a first operating temperature obtained by multiplying the temperature of the processing fluid detected by the first temperature sensor by a first weight coefficient; and controlling the output of the heating mechanism based on the first calculated temperature, The first weight coefficient is a value associated with the pressure of the process fluid detected by the pressure sensor.

14. The substrate processing method according to claim 13, wherein: The first weight coefficient when the pressure of the processing fluid is a first pressure is a value smaller than the first weight coefficient when the pressure of the processing fluid is a second pressure higher than the first pressure.

15. The substrate processing method according to claim 13, wherein: The substrate processing apparatus further includes a second temperature sensor configured to detect a temperature of the supply flow path heated by the heating mechanism. Controlling the output of the heating mechanism has the following processing: calculating a second calculated temperature obtained by multiplying the temperature of the supply flow path detected by the second temperature sensor by a second weight coefficient; and controlling the output of the heating mechanism based on the first calculation temperature and the second calculation temperature, The second weight coefficient is a value associated with the pressure of the process fluid detected by the pressure sensor.

16. The substrate processing method according to claim 15, wherein: The second weight coefficient when the pressure of the processing fluid is a first pressure is a value greater than the second weight coefficient when the pressure of the processing fluid is a second pressure higher than the first pressure.

17. The substrate processing method according to claim 15, wherein: When the processing fluid flowing through the supply flow path is in a supercritical state, the first weight coefficient is set to a value larger than the second weight coefficient.

18. The substrate processing method according to claim 15, wherein: When the processing fluid flowing through the supply flow path is in a gas state, the first weight coefficient is set to a value smaller than the second weight coefficient.

19. The substrate processing method according to claim 15, wherein: When the treatment fluid does not flow through the supply flow path, the first weight coefficient is set to a value smaller than the second weight coefficient.

20. The substrate processing method according to any one of claims 12 to 19, wherein: Controlling the output of the heating mechanism includes a process of controlling the output of the heating mechanism while causing the processing fluid to flow from the supply flow path into the processing container.

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