A wafer-level chip packaging device and a packaging method

Abstract

The present invention discloses a wafer-level chip packaging device and a packaging method, which are applied to the technical field of chip packaging devices. The device includes a frame, a loading and unloading mechanism, a clamping mechanism, a dispensing mechanism, a display mechanism and a detection component. The display mechanism is arranged above one side of the frame. The loading and unloading mechanism, the clamping mechanism, the dispensing mechanism and the detection component are all arranged inside the frame. The clamping mechanism is arranged in the middle of the loading and unloading mechanism. The dispensing mechanism is arranged on one side of the clamping mechanism away from the display mechanism. The detection component is in signal connection with the display mechanism. The dispensing mechanism includes a second support frame, a three-axis moving seat and a dispensing component. The dispensing component includes a housing, a mixing component, a glue source and a three-way valve. The housing is of a hollow structure, and the mixing component is arranged inside the housing. The detection component includes a temperature sensor, a camera and a temperature and humidity sensor. The present invention can improve the packaging yield and production efficiency of wafer-level chip packaging.

Description

Technical Field

[0001] The present invention relates to the technical field of chip packaging equipment, and particularly to a wafer-level chip packaging equipment and a packaging method. Background Art

[0002] As an advanced packaging form, Wafer-Level Packaging (WLP) technology significantly reduces chip size, power consumption, and production costs, and improves integration by completing packaging and testing at the wafer stage. It is widely used in fields such as consumer electronics, communication, and automotive electronics.

[0003] In the process of wafer-level chip packaging, the dispensing process is a key link to ensure the mechanical support, sealing protection, and solder joint reliability of the packaging structure. However, traditional dispensing equipment relies on a fixed temperature and humidity environment for colloid coating. Environmental fluctuations can easily cause changes in the rheological properties of the colloid, leading to problems such as uneven glue volume, air bubble residue, and abnormal colloid flow. Frequent shutdowns for calibration are required, affecting the yield and production efficiency.

[0004] Therefore, it is necessary to provide a wafer-level chip packaging equipment and a packaging method to solve the above problems. Summary of the Invention

[0005] The purpose of the present invention is to provide a wafer-level chip packaging equipment and a packaging method, which can improve the packaging yield and production efficiency of wafer-level chip packaging, so as to solve the problems raised in the above background art.

[0006] To solve the above technical problems, the present invention provides the following technical solution: A wafer-level chip packaging equipment includes a frame, a loading and unloading mechanism, a clamping mechanism, a dispensing mechanism, a display mechanism, and a detection component. The display mechanism is arranged above one side of the frame. The loading and unloading mechanism, the clamping mechanism, the dispensing mechanism, and the detection component are all arranged inside the frame. The clamping mechanism is arranged in the middle of the loading and unloading mechanism. The dispensing mechanism is arranged on the side of the clamping mechanism away from the display mechanism. The detection component is signal-connected to the display mechanism.

[0007] The dispensing mechanism includes a second support frame, a three-axis moving seat, and a dispensing component.

[0008] The dispensing component includes a housing, a mixing component, a glue source, and a three-way valve. The housing is a hollow structure, and the mixing component is arranged inside the housing.

[0009] The detection component includes a temperature sensor, a camera, and a temperature and humidity sensor. The temperature sensor, the camera, and the temperature and humidity sensor are all signal-connected to a collection and analysis module. The collection and analysis module is arranged inside the display mechanism. The collection and analysis module is used to analyze based on the temperature of the glue, the shape of the glue, and the temperature and humidity inside the frame obtained during dispensing.

[0010] According to the above technical solution, the loading and unloading mechanism includes a storage rack, a loading component and an unloading component arranged on both sides of the storage rack, and a transverse material changing component arranged on the side of the storage rack away from the display mechanism;

[0011] The loading component includes a double-axis moving seat one, two groups of connecting seats one, and a suction cup one arranged on the connecting seat one. The connecting seat one is fixed on the side of the double-axis moving seat one close to the transverse material changing component, and the suction cup one is fixed on the connecting seat one;

[0012] The structure and connection mode of the unloading component are the same as those of the loading component. The unloading component includes a double-axis moving seat two, two groups of connecting seats two, and a suction cup two arranged on the connecting seat two.

[0013] According to the above technical solution, the transverse material changing component includes a support seat and a storage tray arranged above the support seat. The support seat is fixedly connected to the frame. The support seat is arranged between the loading component and the unloading component. Two groups of chutes are arranged at the top of the support seat. Two groups of slide rails are fixedly connected to the bottom inside the support seat. A slider is slidably connected to the slide rail. The storage tray is fixedly connected to the slider. The connection part between the slider and the storage tray is located in the chute. The slider is slidably connected to the support seat. A drive one is arranged on the side of the support seat close to the unloading component. The output end of the drive one is connected to the support seat by a bearing. The output end of the drive one is threadedly connected to the slider.

[0014] A photoelectric switch is fixedly connected to the bottom inside the support seat. An induction sheet is fixedly connected to the side of the slider close to the photoelectric switch.

[0015] According to the above technical solution, the clamping mechanism includes a support frame one and a temperature control plate. The support frame one is fixedly connected to the frame. The temperature control plate is fixed on the top of the support frame one. A number of cylinders one are fixedly connected to the top of the support frame one. The output end of the cylinder one is fixedly connected to a clamping block. A heat source is arranged at the bottom of the support frame one. The heat source includes a heat source and a cold source;

[0016] A heat medium channel and a refrigerant channel are arranged inside the temperature control plate. The heat medium channel is connected to the heat source of the heat source by a pipeline. The refrigerant channel is fixedly connected to the cold source of the heat source. The heat medium channel and the refrigerant channel are arranged alternately in a spiral shape.

[0017] According to the above technical solution, the support frame two is fixedly connected to the frame. The support frame two is arranged on the side of the clamping mechanism away from the display mechanism. The three-axis moving seat is fixed on the top of the support frame two. A cylinder is fixedly connected to the three-axis moving seat. The output end of the cylinder is fixedly connected to a connecting seat three. The dispensing component is fixed on the connecting seat three.

[0018] According to the above technical solution, a glue inlet 1, a glue inlet 2 and a glue outlet are sequentially arranged on one side of the housing from top to bottom, and a glue outlet head is arranged at the bottom of the housing.

[0019] According to the above technical solution, the three-way valve includes two groups of outlets and one group of inlets. The two groups of outlets of the three-way valve are connected to the glue inlet 1 and the glue inlet 2 through pipelines. A pump 1 is arranged inside the glue source. The inlet of the three-way valve is connected to the pump 1 through a pipeline. A temperature control part 1 is arranged on the pipeline connecting the glue inlet 2 and the three-way valve. The glue outlet is connected to the glue source through a pipeline. A pump 2 and a temperature control part 2 are sequentially arranged on the pipeline connecting the glue outlet and the glue source.

[0020] According to the above technical solution, the mixing assembly includes a servo motor, an inner stirring fan blade, two groups of connecting rings and a plurality of outer stirring fan blades. The servo motor is fixed on the top of the housing. The output end of the servo motor is fixedly connected with the inner stirring fan blade. The inner stirring fan blade, the connecting rings and the outer stirring fan blades are all arranged inside the housing. The two groups of connecting rings are respectively located at the top and the bottom inside the housing. The connecting rings are rotatably connected with the housing. A transmission part is connected to the inner stirring fan blade. The transmission part is also connected to the connecting ring located at the top inside the housing. A plurality of outer stirring fan blades are fixed between the two groups of connecting rings. The bottom of the inner stirring fan blade is rotatably connected with the connecting ring located at the bottom inside the housing.

[0021] According to the above technical solution, the temperature sensor and the camera are fixed at the bottom of the connecting seat 3, and the temperature and humidity sensor is fixed inside the frame, close to the dispensing mechanism side.

[0022] Compared with the prior art, the beneficial effects achieved by the present invention are as follows: In the present invention, by providing a loading and unloading mechanism, the complexity of the robotic arm can be simplified, the precise movement of the wafer in the horizontal and vertical directions can be realized, and the efficiency of wafer loading and unloading is improved;

[0023] By providing a clamping mechanism, on the basis of realizing the basic clamping of the wafer, the cold and heat sources can be dynamically switched according to the solidification state of the glue. Through the alternating introduction of the heat source and the cold source, the rapid response and uniform control of the wafer temperature can be realized, the mixing interference of the cold and hot media can be avoided, and the temperature fluctuation can be reduced at the same time;

[0024] By providing a dispensing mechanism and a detection component, the uniformity of the glue temperature during dispensing can be improved. According to the shape of the glue after dispensing, the glue temperature and the temperature of the temperature control plate can be dynamically adjusted, the influence of the ambient temperature and humidity on dispensing can be reduced, and the recycling of the glue and the self-cleaning of the pipeline can be realized at the same time. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] The drawings are used to provide a further understanding of the present invention, and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention, and do not constitute a limitation to the present invention. In the drawings:

[0026] Figure 1 is the overall structural schematic diagram of the present invention;

[0027] Figure 2 is the partial structural schematic diagram of the present invention;

[0028] Figure 3 is the schematic diagram of the internal part of the frame of the present invention;

[0029] Figure 4 is the left-side sectional schematic diagram of the internal structure of the frame of the present invention;

[0030] Figure 5 is the top-view sectional schematic diagram of the temperature control plate of the present invention;

[0031] Figure 6 is the Figure 3 magnified structural schematic diagram of area A in the present invention;

[0032] Figure 7 is the sectional schematic diagram of the dispensing assembly of the present invention;

[0033] Figure 8 is the internal structural schematic diagram of the dispensing assembly of the present invention;

[0034] Figure 9 is the Figure 8 magnified structural schematic diagram of area B in the present invention;

[0035] In the figure: 1. Frame;

[0036] 2. Loading and unloading mechanism; 21. Storage rack; 22. Loading component; 221. First dual-axis moving seat; 222. First connecting seat; 223. First suction cup; 23. Horizontal material changing component; 231. Support seat; 232. Chute; 233. Slide rail; 234. Slide block; 235. Storage tray; 236. First driver; 237. Photoelectric switch; 238. Inductive sheet; 24. Unloading component; 241. Second dual-axis moving seat; 242. Second connecting seat; 243. Second suction cup;

[0037] 3. Clamping mechanism; 31. First support frame; 32. First cylinder; 33. Temperature control plate; 331. Heat medium channel; 332. Refrigerant channel; 34. Heat source;

[0038] 4. Dispensing mechanism; 41. Second support frame; 42. Three-axis moving seat; 43. Cylinder; 44. Third connecting seat; 45. Dispensing component; 451. Housing; 452. First glue inlet; 453. Second glue inlet; 454. Glue outlet; 455. Glue outlet head; 456. First temperature control part; 457. Second pump body; 458. Second temperature control part; 46. Mixing component; 461. Servo motor; 462. Inner stirring fan blade; 463. Transmission part; 464. Connecting ring; 465. Outer stirring fan blade; 47. Glue source; 471. First pump body

[0039] 5. Display mechanism; 6. Detection component; 61. Temperature sensor; 62. Camera Specific implementation manner

[0040] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention

[0041] Please refer to Figures 1-9 , the present invention provides a technical solution: a wafer-level chip packaging device and a packaging method, including a frame 1, a loading and unloading mechanism 2, a clamping mechanism 3, a dispensing mechanism 4, a display mechanism 5 and a detection component 6. The display mechanism 5 is arranged above one side of the frame 1. The loading and unloading mechanism 2, the clamping mechanism 3, the dispensing mechanism 4 and the detection component 6 are all arranged inside the frame 1. The clamping mechanism 3 is arranged in the middle of the loading and unloading mechanism 2. The dispensing mechanism 4 is arranged on the side of the clamping mechanism 3 away from the display mechanism 5. The detection component 6 is signal-connected to the display mechanism 5. The loading and unloading mechanism 2 is used for loading and unloading wafers before and after dispensing. The clamping mechanism 3 is used for clamping wafers during dispensing. The dispensing mechanism 4 is used for dispensing the clamped wafers. The display mechanism 5 is used for setting, controlling and displaying the dispensing steps. The detection component 6 is used for detecting the picture and temperature during dispensing

[0042] Specifically, as Figure 2 and Figure 3 shown, the loading and unloading mechanism 2 includes a storage rack 21, a loading component 22 and a unloading component 24 arranged on both sides of the storage rack 21, and a horizontal material changing component 23 arranged on the side of the storage rack 21 away from the display mechanism 5. The storage rack 21 is used for placing wafers before and after dispensing. The loading component 22 and the horizontal material changing component 23 are used for loading and unloading wafers before and after dispensing. The horizontal material changing component 23 is used for driving the wafer to move between the loading component 22 and the unloading component 24

[0043] Furthermore, as Figure 2As shown in the figure, the loading component 22 includes a dual-axis moving seat one 221, two groups of connecting seats one 222, and a suction cup one 223 arranged on the connecting seat one 222. The connecting seat one 222 is fixed on the side of the dual-axis moving seat one 221 close to the horizontal material changing component 23. The connecting seat one 222 is L-shaped, and the suction cup one 223 is fixed on the connecting seat one 222. The suction cup one 223 is connected to a dual-purpose air pump through a pipeline. The dual-axis moving seat one 221 is a dual-drive and dual-output dual-axis moving seat, and the dual-axis moving seat one 221 is used to drive the two groups of suction cups one 223 to move along the display mechanism 5 in the direction of the dispensing mechanism 4 and move up and down. The suction cup one 223 is used to adsorb wafers.

[0044] As Figure 3 shown in the figure, the structure and connection method of the unloading component 24 are the same as those of the loading component 22. The unloading component 24 includes a dual-axis moving seat two 241, two groups of connecting seats two 242, and a suction cup two 243 arranged on the connecting seat two 242. The difference is that the bottom length of the connecting seat two 242 is greater than the L-shaped bottom length of the connecting seat one 222.

[0045] As Figure 3 and Figure 4 shown in the figure, the horizontal material changing component 23 includes a support seat 231 and a placement tray 235 arranged above the support seat 231. The support seat 231 is fixedly connected to the frame 1. The support seat 231 is arranged between the loading component 22 and the unloading component 24. Two groups of chutes 232 are arranged at the top of the support seat 231. Two groups of slide rails 233 are fixedly connected to the inner bottom of the support seat 231. A slider 234 is slidably connected to the slide rails 233. The placement tray 235 is fixedly connected to the slider 234. The connection part of the slider 234 and the placement tray 235 is located in the chute 232. The slider 234 is slidably connected to the support seat 231. A drive one 236 is arranged on the side of the support seat 231 close to the unloading component 24. The drive one 236 is a motor screw drive structure. The drive one 236 includes a motor drive end and a screw output end. The motor drive end is fixed on the support seat 231. The screw output end is connected to the support seat 231 through a bearing. The screw output end is threadedly connected to the slider 234. The drive one 236 is used to drive the slider 234 to move along the axial direction of the screw output end, thereby driving the placement tray 235 to move between the loading component 22 and the unloading component 24.

[0046] Two groups of photoelectric switches 237 are fixedly connected to the inner bottom of the support seat 231. An induction sheet 238 is fixedly connected to the side of the slider 234 close to the photoelectric switch 237. The photoelectric switch 237 and the induction sheet 238 are used to ensure that when the drive one 236 drives the slider 234 and the slider 234 drives the placement tray 235 to move, the position of the placement tray 235 is accurate, so as to ensure the fixed position of the subsequent wafers when dispensing on the clamping mechanism 3.

[0047] In actual operation, the robot places the wafer on the storage rack 21, the driving unit 236 starts to rotate forward, drives the slider 234 to drive the storage tray 235 to move towards the blanking component 24, and the blanking component 24 first transfers the wafer on the storage rack 21 to the storage tray 235; then, the driving unit 236 starts to rotate in reverse, drives the slider 234 to drive the storage tray 235 to move towards the feeding component 22; the feeding component 22 first transfers the wafer on the storage tray 235 to the clamping mechanism 3; after the wafer on the clamping mechanism 3 is dot - glued, the blanking component 24 transfers the wafer on the clamping mechanism 3 to the storage rack 21, and then the robot collects the wafers that have completed dot - gluing.

[0048] It should be noted that when the wafer is being dot - glued on the clamping mechanism 3, there is no wafer to be transferred on the blanking component 24. The robot places the wafer to be dot - glued on the storage rack 21 again and transfers it to the storage tray 235 through the blanking component 24, ensuring that there is no wafer to be dot - glued on the top of the storage rack 21 after the wafer on the clamping mechanism 3 is dot - glued. Thus, the storage rack 21 can place the wafers that have completed dot - gluing, and at this time, the robot can also directly place the wafers to be dot - glued after collecting the wafers that have completed dot - gluing, improving the dot - gluing efficiency in packaging.

[0049] Specifically, as Figures 3-5 shown, the clamping mechanism 3 includes a first support frame 31 and a temperature - controlled plate 33. The first support frame 31 is fixedly connected to the frame 1, the temperature - controlled plate 33 is fixed on the top of the first support frame 31. A number of first cylinders 32 are fixedly connected to the top of the first support frame 31. The output ends of the first cylinders 32 are fixedly connected with clamping blocks. The first cylinders 32 are arranged at equal intervals around the temperature - controlled plate 33. A heat source 34 is arranged at the bottom of the first support frame 31. The heat source 34 includes a heat source and a cold source. The cold source can be related refrigeration equipment, and the heat source can be related heating equipment;

[0050] The temperature - controlled plate 33 is internally provided with a heat - medium channel 331 and a refrigerant channel 332. The heat - medium channel 331 is connected to the heat source of the heat source 34 through a pipeline, and the refrigerant channel 332 is fixedly connected to the cold source of the heat source 34. The heat - medium channel 331 and the refrigerant channel 332 are arranged alternately in a spiral shape. By alternately arranging the heat - medium channel 331 and the refrigerant channel 332, the temperature of the temperature - controlled plate 33 is controlled, and the temperature of the wafer on the temperature - controlled plate 33 is controlled in a direct - contact manner, thus avoiding the influence of environmental temperature changes on the wafer temperature. At the same time, the alternating arrangement of the heat - medium channel 331 and the refrigerant channel 332 can gently heat up and cool down the wafer.

[0051] In actual operation, when the wafer is transferred to the temperature control plate 33, the first cylinder 32 extends, driving the clamping block to approach the center of the temperature control plate 33, so that the clamping block fixedly clamps the wafer on the temperature control plate 33; when the ambient temperature changes and the temperature control plate 33 needs to be heated, a heat source is introduced into the heat medium channel 331, and the refrigerant channel 332 is closed; when the temperature control plate 33 needs to be cooled, a cold source is introduced into the refrigerant channel 332, and the heat medium channel 331 is closed, realizing temperature control of the temperature control plate 33, which can reduce the influence of ambient temperature changes on the wafer during dispensing. At the same time, when the temperature of the wafer during dispensing is high, the temperature of the temperature control plate 33 and the wafer on the temperature control plate 33 can also be adjusted by controlling the heat source 34 to introduce a heat source into the heat medium channel 331 or a cold source into the refrigerant channel 332.

[0052] Specifically, as Figure 3 、 Figures 6-9 shown, the dispensing mechanism 4 includes a second support frame 41, a three-axis moving seat 42 and a dispensing assembly 45. The second support frame 41 is fixedly connected to the frame 1. The second support frame 41 is arranged on the side of the clamping mechanism 3 away from the display mechanism 5. The three-axis moving seat 42 is fixed on the top of the second support frame 41. A cylinder 43 is fixedly connected to the three-axis moving seat 42. The output end of the cylinder 43 is fixedly connected to a third connecting seat 44. The third connecting seat 44 is L-shaped. The dispensing assembly 45 is fixed on the third connecting seat 44. The three-axis moving seat 42 is used to drive the dispensing assembly 45 to move up and down, move along the direction of the feeding assembly 22, and move along the direction perpendicular to the direction of the feeding assembly 22.

[0053] Furthermore, the dispensing assembly 45 includes a housing 451, a mixing assembly 46, a glue source 47 and a three-way valve. The housing 451 is a hollow structure. The mixing assembly 46 is arranged inside the housing 451. An inlet glue port 452, an inlet glue port 453 and an outlet glue port 454 are sequentially arranged on one side of the housing 451 from top to bottom. A glue outlet head 455 is arranged at the bottom of the housing 451;

[0054] The three-way valve includes two groups of outlets and one group of inlets. The two groups of outlets of the three-way valve are connected to the inlet glue port 452 and the inlet glue port 453 through pipelines. A first pump body 471 is arranged inside the glue source 47. The inlet of the three-way valve is connected to the first pump body 471 through a pipeline. A first temperature control part 456 is arranged on the pipeline connecting the inlet glue port 453 and the three-way valve. The first temperature control part 456 is used to finely adjust the temperature of the glue entering the housing 451 through the inlet glue port 453. The outlet glue port 454 is connected to the glue source 47 through a pipeline. A second pump body 457 and a second temperature control part 458 are sequentially arranged on the pipeline connecting the outlet glue port 454 and the glue source 47. The second temperature control part 458 is used to adjust the temperature of the glue flowing back into the glue source 47, and at the same time prevent the solidified glue from blocking the second pump body 457.

[0055] It should be noted that a one-way valve for preventing air from entering during backflow is provided at the glue outlet 455, and both the temperature control unit 456 and the pump body 457 can control the heating and cooling of the glue.

[0056] In actual operation, the outlet connected to the first glue inlet 452 of the three-way valve is opened, and the outlet connected to the second glue inlet 453 is closed. The first pump body 471 is started, and the glue inside the glue source 47 is pumped into the inside of the housing 451 through the first glue inlet 452; when there is a small deviation between the dispensing temperature and the set temperature, the outlet connected to the first glue inlet 452 of the three-way valve is closed, and the outlet connected to the second glue inlet 453 is opened. The temperature control unit 456 is started to finely adjust the temperature of the glue entering the inside of the housing 451 through the second glue inlet 453; when the glue outlet 455 is blocked or dispensing needs to be stopped, the first pump body 471 stops operating, and the outlets of the three-way valve connected to the first glue inlet 452 and the second glue inlet 453 are both closed. The second pump body 457 is started. Since the bottom of the glue outlet 455 is open, the glue inside the housing 451 can flow back to the glue source 47 after the first pump body 471 is started, so as to achieve the effect of cleaning the inside of the housing 451 and preventing the glue outlet 455 from being blocked.

[0057] Furthermore, the mixing assembly 46 includes a servo motor 461, an inner stirring fan blade 462, two connecting rings 464, and several outer stirring fan blades 465. The servo motor 461 is fixed to the top of the housing 451, and the output end of the servo motor 461 is fixedly connected to the inner stirring fan blade 462. The inner stirring fan blade 462, the connecting rings 464, and the outer stirring fan blades 465 are all arranged inside the housing 451. The two connecting rings 464 are respectively located at the top and bottom inside the housing 451. The connecting rings 464 are rotatably connected to the housing 451. A transmission part 463 is connected to the inner stirring fan blade 462. The transmission part 463 is a planetary gear transmission structure, and the transmission part 463 is also connected to the connecting ring 464 located at the top inside the housing 451. Several outer stirring fan blades 465 are fixed between the two connecting rings 464. The bottom of the inner stirring fan blade 462 is rotatably connected to the connecting ring 464 located at the bottom inside the housing 451. The spiral directions of the fan blades of the inner stirring fan blade 462 and the outer stirring fan blades 465 are opposite;

[0058] In actual operation, when the servo motor 461 starts to rotate forward, it drives the inner stirring fan blade 462 to rotate forward to stir the glue in the middle part inside the housing 451. While the servo motor 461 rotates forward, it drives the connecting ring 464 to rotate reversely through the connected transmission part 463, thereby driving the outer stirring fan blades 465 to stir the glue at the edge part inside the housing 451. Moreover, since the spiral directions of the fan blades of the inner stirring fan blade 462 and the outer stirring fan blades 465 are opposite, a convection can be formed when the inner stirring fan blade 462 and the outer stirring fan blades 465 rotate, enhancing the uniformity of the mixing of the glue inside the housing 451, which is beneficial to ensuring the subsequent dispensing effect of the glue and thus ensuring the packaging quality of the wafer.

[0059] Specifically, as Figure 6 shown, the detection component 6 includes a temperature sensor 61, a camera 62, and a temperature and humidity sensor. The temperature sensor 61 and the camera 62 are fixed to the bottom of the third connecting seat 44. The temperature sensor 61 is used to detect the temperature of the glue on the wafer during dispensing. The temperature and humidity sensor is fixed inside the frame 1, near the dispensing mechanism 4. The camera 62 is used to capture the shape of the glue on the wafer during dispensing. The temperature sensor 61, the camera 62, and the temperature and humidity sensor are all signal-connected to a collection and analysis module. The collection and analysis module is arranged inside the display mechanism 5 and is used to analyze based on the temperature of the glue, the shape of the glue, and the temperature and humidity inside the frame 1 obtained during dispensing.

[0060] Wafer-level chip packaging method:

[0061] Step 1: The robot places the wafer to be dispensed on the storage rack 21. The loading component 22 and the unloading component 24 transfer the wafer to be dispensed to the clamping mechanism 3, and the clamping mechanism 3 fixedly clamps the wafer to be dispensed.

[0062] Step 2: Control the dispensing mechanism 4 to dispense glue on the wafer clamped by the clamping mechanism 3. The collection and analysis module obtains the glue temperature, the shape of the glue, and the temperature and humidity inside the frame 1, and adjusts the temperature of the glue entering the housing 451 and the temperature of the temperature control plate 33 according to the obtained data.

[0063] It should be noted that the initial state of the dispensing component 45 during dispensing is that the outlet of the three-way valve connected to the first glue inlet 452 is open, the outlet connected to the second glue inlet 453 is closed, and the mixing component 46 remains in the driving state to stir and mix the glue inside the housing 451.

[0064] Step 2-1: Obtain the glue temperature, the temperature and humidity inside the frame 1, and the shape of the glue.

[0065] Specifically, the collection and analysis module first obtains the shape of the glue, which mainly includes the width of the glue when it is dispensed along the set route and whether there are bubbles. The actual width of the glue is denoted as d. The standard width range set in the collection and analysis module is d1 - d2, where d1 is the minimum width of the glue and d2 is the maximum width of the glue. When the actual width of the glue is within the standard width range and there are no bubbles, the dispensing width meets the production requirements.

[0066] The collection and analysis module obtains the temperature detected by the temperature sensor 61 during dispensing and the temperature and humidity of the internal environment of the frame 1 obtained by the temperature and humidity sensor. The glue temperature is denoted as t, the temperature inside the frame 1 is denoted as T, and the humidity inside the frame 1 is denoted as RH.

[0067] The glue standard temperature range, the temperature difference threshold between the glue temperature and the internal temperature of the rack 1, and the humidity threshold are set in the acquisition and analysis module. The glue standard temperature range is denoted as t1 - t2, where t1 is the lowest temperature allowed for the glue during dispensing, and t2 is the highest temperature allowed for the glue during dispensing. The glue standard temperature range is used to determine whether the temperature during dispensing will affect the shape of the glue. The temperature difference threshold is denoted as ΔT, and ΔT is the maximum allowable temperature difference during normal dispensing. The actual difference between the glue temperature and the internal environment temperature of the rack 1 is denoted as Δt, and Δt = t - T. The temperature difference threshold is used to determine whether, under the set humidity environment, the large temperature difference will affect the solidification speed of the glue and thus affect the shape of the dispensed glue. The humidity threshold is denoted as RH', and the humidity threshold is the maximum allowable humidity during normal dispensing. The humidity threshold is used to determine whether the high humidity inside the rack 1 will affect the dispensing quality.

[0068] Step two-two: The acquisition and analysis module conducts data analysis and judgment.

[0069] Case one: When d ∈ [d1, d2] and there are no air bubbles in the glue, the dispensing process of the encapsulation device is normal, and the subsequent dispensing operations can be continued according to the relevant temperature parameters of the current dispensing. In other cases, it is an abnormal situation;

[0070] Case two: When d ∈ [d1, d2], it is a temperature abnormality during the dispensing process of the encapsulation device;

[0071] Case two-one: When d < d1, the glue solidifies quickly after dispensing, resulting in a small width of the dispensed glue;

[0072] If t ∈ [t1, t2] at this time, the dispensing temperature is normal. When Δt ≤ ΔT, the internal environment temperature of the rack 1 is normal. At this time, the small width of the glue is caused by the low temperature of the wafer itself. Control a small amount of the heat source of the heat source 34 to pass through the heat medium channel 331, and close the refrigerant channel 332. Since the amount of heat source passed in at this time is small, the temperature control plate 33 can be slowly heated up, thereby increasing the temperature of the wafer and promoting the flow of the glue dispensed on the wafer. When Δt > ΔT, the small width of the glue is caused by the low internal environment temperature of the rack 1. Control a large amount of the heat source of the heat source 34 to pass through the heat medium channel 331, and close the refrigerant channel 332. Heat up the temperature control plate 33. Since the amount of heat source passed in at this time is large, the temperature control plate 33 can be quickly heated up, thereby increasing the temperature of the wafer and the glue on the wafer, which is beneficial to promoting the flow of the dispensed glue and expanding the width after the glue solidifies;

[0073] If t < t1 at this time, it is caused by a low dispensing temperature. At this time, it is not affected by the temperature difference between the glue temperature and the internal environment temperature of the rack 1. The outlet of the three-way valve connected to the first glue inlet 452 is closed, and the outlet connected to the second glue inlet 453 is opened. The first temperature control unit 456 is started to heat up the glue entering the inside of the housing 451 through the second glue inlet 453. At the same time, the mixing assembly 46 continues to keep mixing and stirring the glue inside the housing 451.

[0074] If t > t2 at this time, it is a high dispensing temperature. At this time, the small glue width is caused by the large temperature difference between the glue and the wafer, and it is not affected by the temperature difference between the glue temperature and the internal environment temperature of the rack 1. The outlet of the three-way valve connected to the first glue inlet 452 remains open, and the outlet connected to the second glue inlet 453 is closed. At the same time, a large amount of heat source of the heat source 34 is introduced into the heat medium channel 331, and the refrigerant channel 332 is closed to quickly heat up the temperature control plate 33 to promote the flow of the glue dispensed on the wafer.

[0075] Case two-two: When d > d2, it is that the glue solidifies slowly after dispensing, resulting in a large glue width after dispensing.

[0076] If t ∈ [t1, t2] at this time, it is a normal dispensing temperature. When Δt ≤ ΔT, the internal environment temperature of the rack 1 is normal. At this time, the large glue width is caused by a high ambient temperature. A small amount of cold source of the heat source 34 is introduced into the refrigerant channel 332, and the heat medium channel 331 is closed. Since the amount of cold source introduced at this time is small, the temperature control plate 33 can be slowly cooled down, thereby inhibiting the flow of the glue for dispensing. When Δt > ΔT, it is a low ambient temperature. The large glue width is caused by the high temperature of the wafer itself. A large amount of cold source of the heat source 34 is introduced into the refrigerant channel 332, and the heat medium channel 331 is closed. Since the amount of cold source introduced at this time is large, the temperature control plate 33 can be quickly cooled down, which is beneficial to inhibiting the flow of the glue for dispensing.

[0077] If t < t1 at this time, it is a low dispensing temperature. At this time, only the high temperature of the wafer itself can cause a large glue width. Therefore, the outlet of the three-way valve connected to the first glue inlet 452 remains open, and the outlet connected to the second glue inlet 453 is closed. At the same time, a large amount of cold source of the heat source 34 is introduced into the refrigerant channel 332, and the heat medium channel 331 is closed to cool down the temperature control plate 33 and inhibit the flow of the glue for dispensing.

[0078] If t > t1 at this time, it is a high dispensing temperature. At this time, the width of the glue is not affected by the temperature difference between the glue temperature and the internal environment temperature of the rack 1. The outlet of the three-way valve connected to the first glue inlet 452 is closed, and the outlet connected to the second glue inlet 453 is opened. The first temperature control unit 456 is started to cool down the glue entering the inside of the housing 451 through the second glue inlet 453, thereby reducing the glue temperature inside the housing 451.

[0079] Case 3: When there are air bubbles in the glue, if RH ≤ RH', it is caused by gas mixed into the dispensing assembly 45 and the glue source 47; if RH > RH', it is due to high humidity inside the frame 1. During the curing process of the glue, the moisture in the air condenses on the wafer and is then wrapped by the flowing glue, thus forming air bubbles. The acquisition and analysis module gives an alarm prompt, and dehumidification treatment is required.

[0080] It should be noted that in the above cases, if the glue width still fails to be within the set standard range after adjusting the glue temperature in the housing 451 multiple times or if the glue outlet 455 is blocked, then control the outlet connecting the three-way valve to the first glue inlet 452 to close and the outlet connecting to the second glue inlet 453 to close. Control the second pump 457 to start heating and control the first pump 471 to start, so that the glue inside the housing 451 flows back to the glue source 47 to adjust the glue temperature inside the glue source 47. The specific number of times of adjustment allowed is set manually; in order to improve the quality and efficiency of dispensing during the encapsulation of the encapsulation device, an abnormal situation counting threshold is set in the acquisition and analysis module and the abnormal situations are classified and counted. When the count value reaches the counting threshold, corresponding control operations are performed to increase the control adjustment frequency during dispensing, thereby ensuring the dispensing quality and improving the encapsulation efficiency.

[0081] Step 3: Control the blanking assembly 24 to blank the wafer after dispensing, and collect it by the robot.

[0082] Through the above steps, the temperature and shape during wafer dispensing and the temperature and humidity inside the frame 1 can be monitored in real time. According to the obtained dispensing temperature and shape, the glue temperature inside the housing 451 and the temperature of the temperature control plate 33 are adjusted to ensure that the finally obtained wafer has a good dispensing effect, thereby ensuring the encapsulation quality of the wafer.

[0083] It should be noted that in this article, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the term "comprising", "including" or any other variant thereof is intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements not only includes those elements, but also includes other elements not expressly listed, or elements inherent to such process, method, article or device.

[0084] Finally, it should be noted that the above are only preferred embodiments of the present invention and are not used to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or perform equivalent replacements for some of the technical features. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included within the protection scope of the present invention.

Claims

1. A wafer-level chip packaging device, comprising a frame (1), a loading and unloading mechanism (2), a clamping mechanism (3), a dispensing mechanism (4), a display mechanism (5) and a detection component (6), characterized in that, The display mechanism (5) is arranged above one side of the frame (1), and the loading and unloading mechanism (2), the clamping mechanism (3), the dispensing mechanism (4), and the detection component (6) are all arranged inside the frame (1). The clamping mechanism (3) is arranged in the middle of the loading and unloading mechanism (2), the dispensing mechanism (4) is arranged on one side of the clamping mechanism (3) away from the display mechanism (5), and the detection component (6) is signal-connected to the display mechanism (5). The dispensing mechanism (4) includes a second support frame (41), a three-axis moving seat (42), and a dispensing component (45). The dispensing component (45) includes a housing (451), a mixing component (46), a glue source (47), and a three-way valve. The housing (451) is of a hollow structure, and the mixing component (46) is arranged inside the housing (451). The clamping mechanism (3) includes a first support frame (31) and a temperature control plate (33). The first support frame (31) is fixedly connected to the frame (1), the temperature control plate (33) is fixed on the top of the first support frame (31), a plurality of first cylinders (32) are fixedly connected to the top of the first support frame (31), a clamping block is fixedly connected to the output end of the first cylinder (32), and a heat source (34) is arranged at the bottom of the first support frame (31). The heat source (34) includes a heat source and a cold source. A heat medium channel (331) and a refrigerant channel (332) are arranged inside the temperature control plate (33). The heat medium channel (331) is connected to the heat source of the heat source (34) through a pipeline, the refrigerant channel (332) is fixedly connected to the cold source of the heat source (34), and the heat medium channel (331) and the refrigerant channel (332) are arranged alternately in a spiral shape. The detection component (6) includes a temperature sensor (61), a camera (62), and a temperature and humidity sensor. The temperature sensor (61), the camera (62), and the temperature and humidity sensor are all signal-connected to a collection and analysis module. The collection and analysis module is arranged inside the display mechanism (5). The collection and analysis module obtains the glue temperature, the glue shape, and the temperature and humidity inside the frame (1), and adjusts the glue temperature entering the inside of the housing (451) and the temperature of the temperature control plate (33) according to the obtained data.

2. The wafer-level chip packaging device according to claim 1, characterized in that, The loading and unloading mechanism (2) includes a storage rack (21), a loading component (22) and a unloading component (24) arranged on both sides of the storage rack (21), and a transverse material changing component (23) arranged on one side of the storage rack (21) away from the display mechanism (5). The loading component (22) includes a first double-axis moving seat (221), two groups of first connecting seats (222), and a first suction cup (223) arranged on the first connecting seat (222). The first connecting seat (222) is fixed on the side of the first double-axis moving seat (221) close to the transverse material changing component (23), and the first suction cup (223) is fixed on the first connecting seat (222). The structure and connection method of the unloading component (24) are the same as those of the loading component (22). The unloading component (24) includes a second double-axis moving seat (241), two groups of second connecting seats (242), and a second suction cup (243) arranged on the second connecting seat (242).

3. A wafer-level chip packaging device according to claim 2, wherein, The horizontal material changing component (23) includes a support base (231) and a storage tray (235) arranged above the support base (231). The support base (231) is fixedly connected to the machine frame (1). The support base (231) is arranged between the feeding component (22) and the discharging component (24). Two groups of chutes (232) are arranged at the top of the support base (231). Two groups of slide rails (233) are fixedly connected to the inner bottom of the support base (231). A slider (234) is slidably connected to the slide rail (233). The storage tray (235) is fixedly connected to the slider (234). The connection part of the slider (234) and the storage tray (235) is located in the chute (232). The slider (234) is slidably connected to the support base (231). A first driver (236) is arranged on one side of the support base (231) close to the discharging component (24). The output end of the first driver (236) is connected to the support base (231) by bearing. The output end of the first driver (236) is threadedly connected to the slider (234). A photoelectric switch (237) is fixedly connected to the inner bottom of the support base (231). An induction sheet (238) is fixedly connected to one side of the slider (234) close to the photoelectric switch (237).

4. A wafer-level chip packaging device according to claim 3, characterized in that, The second support frame (41) is fixedly connected to the machine frame (1). The second support frame (41) is arranged on one side of the clamping mechanism (3) away from the display mechanism (5). The three-axis moving seat (42) is fixed to the top of the second support frame (41). A cylinder (43) is fixedly connected to the three-axis moving seat (42). The output end of the cylinder (43) is fixedly connected to a third connecting seat (44). The dispensing component (45) is fixed to the third connecting seat (44).

5. A wafer-level chip packaging device according to claim 4, characterized in that, On one side of the housing (451), a first glue inlet (452), a second glue inlet (453) and a glue outlet (454) are arranged in sequence from top to bottom. A glue outlet head (455) is arranged at the bottom of the housing (451).

6. The wafer-level chip packaging device according to claim 5, characterized in that, The three-way valve includes two groups of outlets and one group of inlets. The two outlets of the three-way valve are connected to the first glue inlet (452) and the second glue inlet (453) through pipelines. A first pump body (471) is arranged inside the glue source (47). The inlet of the three-way valve is connected to the first pump body (471) through a pipeline. A first temperature control part (456) is arranged on the pipeline connecting the second glue inlet (453) and the three-way valve. The glue outlet (454) is connected to the glue source (47) through a pipeline. A second pump body (457) and a second temperature control part (458) are arranged in sequence on the pipeline connecting the glue outlet (454) and the glue source (47).

7. A wafer-level chip packaging device according to claim 6, characterized in that, The mixing component (46) includes a servo motor (461), an inner stirring fan blade (462), two sets of connecting rings (464), and a plurality of outer stirring fan blades (465). The servo motor (461) is fixed to the top of the housing (451). The output end of the servo motor (461) is fixedly connected to the inner stirring fan blade (462). The inner stirring fan blade (462), the connecting rings (464), and the outer stirring fan blades (465) are all arranged inside the housing (451). The two sets of connecting rings (464) are respectively located at the top and bottom inside the housing (451). The connecting rings (464) are rotatably connected to the housing (451). A transmission part (463) is connected to the inner stirring fan blade (462). The transmission part (463) is also connected to the connecting ring (464) located at the top inside the housing (451). A plurality of the outer stirring fan blades (465) are fixed between the two sets of connecting rings (464). The bottom of the inner stirring fan blade (462) is rotatably connected to the connecting ring (464) located at the bottom inside the housing (451).

8. A wafer-level chip packaging device according to claim 7, wherein, The temperature sensor (61) and the camera (62) are fixed to the bottom of the third connecting seat (44). The temperature and humidity sensor is fixed inside the frame (1), on the side close to the dispensing mechanism (4).

9. A packaging method for a wafer-level chip packaging device, which is implemented based on a wafer-level chip packaging device described in claim 8, is characterized in that, The packaging method of the wafer-level chip packaging equipment is as follows: Step 1: The robot places the wafer to be dispensed on the storage rack (21). The loading component (22) and the unloading component (24) transfer the wafer to be dispensed to the clamping mechanism (3), and the clamping mechanism (3) fixedly clamps the wafer to be dispensed. Step 2: Control the dispensing mechanism (4) to dispense glue on the wafer clamped by the clamping mechanism (3). The acquisition and analysis module obtains the glue temperature, the glue shape, and the temperature and humidity inside the frame (1), and adjusts the glue temperature entering the inside of the housing (451) and the temperature of the temperature control plate (33) according to the obtained data. Step 3: Control the unloading component (24) to unload the wafer after dispensing, and collect it by the robot.

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