Semiconductor processing apparatus and clamping device therefor

Abstract

The application discloses a semiconductor process equipment and a clamping device thereof, and belongs to the technical field of semiconductor manufacturing. The clamping device comprises a base, a plurality of clamping pieces and a driving mechanism. The plurality of clamping pieces are arranged on the base. The driving mechanism is used for driving the plurality of clamping pieces to move relative to the base, so that the plurality of clamping pieces clamp or release a wafer. The driving mechanism comprises a first magnetic piece, a second magnetic piece and a transmission assembly. The first magnetic piece is located outside the base. The base is provided with a containing cavity. The second magnetic piece and the transmission assembly are both located in the containing cavity. The second magnetic piece is connected with each clamping piece through the transmission assembly. In the case that the first magnetic piece moves relative to the second magnetic piece, the second magnetic piece drives each clamping piece to move through the transmission assembly. The semiconductor process equipment comprises a process chamber and the above-mentioned clamping device. The clamping device is arranged in the process chamber. In this way, the base does not need to be provided with a channel, the base is relatively sealed, the clamping pieces are not easily affected by a process environment, and the wafer can be smoothly clamped.

Description

TECHNICAL FIELD

[0001] The present application belongs to the technical field of semiconductor manufacturing, and particularly relates to a semiconductor process equipment and a clamping device thereof. BACKGROUND

[0002] In the field of semiconductor manufacturing technology, during the process of cleaning a wafer, a clamping device clamps the wafer and drives the wafer to rotate, so that the wafer can achieve a better process effect in the process.

[0003] In the related art, the clamping device includes a base, a plurality of clamping pieces, and a driving mechanism. The clamping pieces and the driving mechanism are both arranged on the base. The driving mechanism is connected with each clamping piece to drive each clamping piece to move relative to the wafer, thereby achieving clamping and releasing of the wafer. Specifically, the driving mechanism includes a lever, a driving gear, and a plurality of planetary gears. The driving gear and the planetary gears are located inside the base. The lever extends into the base from the outside of the base and is connected with the driving gear. The driving gear is meshed with each planetary gear. Each planetary gear is connected with a corresponding clamping piece. In this way, the lever is controlled from the outside of the base. The lever drives the driving gear to rotate. The driving gear drives each planetary gear and each clamping piece to rotate, thereby achieving clamping and releasing of the wafer.

[0004] However, the base needs to be provided with a channel for the lever to pass through. Harmful corrosive gases such as water vapor and acid gas generated during the process can easily enter the inside of the base through the channel, causing problems such as jamming of the driving gear and the planetary gears, thereby affecting clamping and releasing of the wafer by the clamping pieces. SUMMARY

[0005] The purpose of the embodiments of the present application is to provide a semiconductor process equipment and a clamping device thereof, which can solve the problem that the wafer clamping mechanism in the related art is easily affected by the process environment, thereby affecting clamping and releasing of the wafer.

[0006] In a first aspect, the embodiments of the present application provide a clamping device applied to a semiconductor process equipment. The clamping device includes a base, a plurality of clamping pieces, and a driving mechanism. The plurality of clamping pieces are arranged on the base. The driving mechanism is used to drive the plurality of clamping pieces to move relative to the base, so that the plurality of clamping pieces clamp or release a wafer.

[0007] The driving mechanism includes a first magnetic piece, a second magnetic piece, and a transmission assembly. The first magnetic piece is located outside the base. The base is provided with a cavity. The second magnetic piece and the transmission assembly are both located in the cavity. The second magnetic piece is connected with each clamping piece through the transmission assembly. When the first magnetic piece moves relative to the second magnetic piece, the second magnetic piece drives each clamping piece to move through the transmission assembly.

[0008] Secondly, embodiments of this application also provide a semiconductor process apparatus, including a process chamber and the aforementioned clamping device, wherein the clamping device is disposed in the process chamber.

[0009] In this embodiment, the driving mechanism for moving the clamping component adopts a magnetic attraction structure. That is, the clamping driving force of the clamping component is provided by the interaction between the first magnetic component and the second magnetic component. With this configuration, the driving mechanism does not need to be equipped with a lever or gear, and the base does not need to have a channel for the lever or other transmission components to pass through. The base is in a relatively sealed state, and harmful corrosive gases such as water vapor and acid gas generated during the process are not easy to enter the interior of the base. This avoids the clamping component being affected by the process environment and is conducive to the smooth clamping and release of the wafer. Attached Figure Description

[0010] Figure 1 This is a front view of the clamping device and the wafer when the first magnetic element and the second magnetic element are close to each other, as disclosed in the embodiments of this application.

[0011] Figure 2 This is a front view of the clamping device and the wafer when the first magnetic element and the second magnetic element are far apart, as disclosed in the embodiments of this application;

[0012] Figure 3 This is a partial structure of the clamping device disclosed in the embodiments of this application and a front view of the wafer (excluding the first magnetic component);

[0013] Figure 4 yes Figure 3 A cross-sectional view of the structure shown;

[0014] Figure 5 This is a schematic diagram of the clamping device disclosed in the embodiments of this application;

[0015] Figure 6 This is a top view of the heating plate disclosed in the embodiments of this application;

[0016] Figure 7 This is a front view of the heating plate disclosed in the embodiments of this application;

[0017] Figure 8 This is a bottom view of the heating plate disclosed in the embodiments of this application;

[0018] Figure 9 This is a front view of the mating structure of the base and clamping member disclosed in the embodiments of this application;

[0019] Figure 10 yes Figure 9 A cross-sectional view of the base along the AA direction;

[0020] Figure 11 yes Figure 3Sectional view at point BB;

[0021] Figure 12 This is one of the partial structural schematic diagrams of the drive mechanism disclosed in the embodiments of this application;

[0022] Figure 13 This is a second partial structural schematic diagram of the drive mechanism disclosed in the embodiments of this application;

[0023] Figure 14 This is a top view of a partial structure of the drive mechanism disclosed in the embodiments of this application;

[0024] Figure 15 yes Figure 14 A schematic diagram of a local structure in the image;

[0025] Figure 16 yes Figure 15 A cross-sectional view of the structure shown;

[0026] Figure 17 This is a schematic diagram of the cooperation between the second magnetic component and the positioning magnetic component disclosed in the embodiments of this application;

[0027] Figure 18 This is the third partial structural schematic diagram of the drive mechanism disclosed in the embodiments of this application;

[0028] Figure 19 yes Figure 18 Top view of the structure shown;

[0029] Figure 20 yes Figure 18 Side view of the structure shown;

[0030] Figure 21 This is one of the cross-sectional views of a partial structure of the drive mechanism disclosed in the embodiments of this application;

[0031] Figure 22 This is a second cross-sectional view of a partial structure of the drive mechanism disclosed in the embodiments of this application;

[0032] Figure 23 This is a schematic diagram of the cooperation between the first guide rail and the first slider disclosed in the embodiments of this application;

[0033] Figure 24 This is a schematic diagram showing the cooperation of the first guide rail, the first slider, and the movable support disclosed in the embodiments of this application;

[0034] Figure 25 This is a front view of a partial structure of the drive mechanism disclosed in the embodiments of this application;

[0035] Figure 26 yes Figure 25 A cross-sectional view along the CC direction;

[0036] Figure 27 is a partial structure schematic diagram of a driving mechanism according to an embodiment of the present application;

[0037] Figure 28 is a partial structure schematic diagram of a driving mechanism according to an embodiment of the present application;

[0038] Figure 29 is a front view of a cooperation structure of a moving cam, a slide and a clamping piece according to an embodiment of the present application;

[0039] Figure 30 is a cooperation schematic diagram of a moving cam, a slide and a clamping piece according to an embodiment of the present application;

[0040] Figure 31 is a cooperation schematic diagram of a moving cam, a slide and a clamping piece according to an embodiment of the present application;

[0041] Figure 32 is a cooperation schematic diagram of a moving cam, a slide and a clamping piece according to an embodiment of the present application;

[0042] Figure 33 is a structure schematic diagram of a moving cam according to an embodiment of the present application;

[0043] Figure 34 is a structure schematic diagram of a moving cam according to an embodiment of the present application;

[0044] Figure 35 is a cooperation schematic diagram of a second guide rail and a second slide according to an embodiment of the present application;

[0045] Figure 36 is a partial structure of a clamping device and a wafer according to another embodiment of the present application (a first magnetic piece is removed).

[0046] Explanation of reference signs:

[0047] 100 - base, 100a - cavity, 100b - clamping passage, 110 - frame, 111 - rotating support, 1111 - bearing, 112 - moving support, 1121 - second slide rail,

[0048] 200 - clamping piece, b - second axis,

[0049] 300-driving mechanism, 310-first magnetic member, 320-second magnetic member, 321-bandage, 330-transmission assembly, 331-rotary lever, a-first axis, 332-strip-shaped moving member, 3321-top block, 3322-second slider, 333-moving cam, 333a-slotted, 333b-protruding part, 333c-supporting part, 3331-first slider, 334-sliding member, 335-first elastic member, 336-second elastic member, 337-positioning magnetic member, 338-clamping connecting rod, 3381-fastener,

[0050] 400-heating disc, 400a-heating area, 410-heating element, 420-electricity interface, 430-cooling liquid flow interface,

[0051] 500-rotary driving mechanism, 510-first permanent magnet, 520-first electromagnet, 530-second permanent magnet, 540-second electromagnet,

[0052] 600-temperature detecting element,

[0053] 700-spraying member,

[0054] S-wafer. DETAILED DESCRIPTION

[0055] The technical solutions in the embodiments of the present application will be clearly described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, but not all of the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art belong to the scope of protection of the present application.

[0056] The terms "first", "second", and the like in the specification and claims of the present application are used to distinguish similar objects, and are not used to describe a specific order or sequence. It should be understood that the data used in this way can be interchanged under appropriate circumstances, so that the embodiments of the present application can be implemented in an order other than those illustrated or described herein, and the objects distinguished by "first", "second", etc. are generally a category, and are not limited to the number of objects, for example, the first object can be one or more. In addition, "and / or" in the specification and claims indicates at least one of the connected objects, and the character " / ", generally indicates that the front and rear associated objects are in a "or" relationship.

[0057] The semiconductor process equipment and its clamping device provided by the embodiments of the present application will be described in detail below with reference to the drawings and specific examples and their application scenarios.

[0058] Please refer to Figures 1-36The clamping device disclosed in this application is applied to semiconductor process equipment. The clamping device is used to clamp wafer S, but is not limited to wafer S. The shape of wafer S can be, but is not limited to, fin shape. The clamping device includes a base 100, a plurality of clamping members 200, and a drive mechanism 300. The base 100 serves as a basic component and can be used as the mounting base for the plurality of clamping members 200 and the drive mechanism 300.

[0059] Multiple clamping members 200 are disposed on the base 100. The driving mechanism 300 is used to drive the multiple clamping members 200 to move relative to the base 100, so that the multiple clamping members 200 clamp or release the wafer S. Optionally, the clamping member 200 may be, but is not limited to, a clamping rod. The embodiments of this application do not limit the specific structure of the clamping member 200. Each clamping member 200 is rotatably disposed on the base 100. The driving mechanism 300 is used to drive the multiple clamping members 200 to rotate relative to the base 100, so that the multiple clamping members 200 clamp or release the wafer S; or, each clamping member 200 is movably disposed on the base 100. The driving mechanism 300 is used to drive the multiple clamping members 200 to move relative to the base 100, so that the multiple clamping members 200 clamp or release the wafer S.

[0060] Specifically, refer to Figures 1-2 as well as Figure 4 As shown, the driving mechanism 300 includes a first magnetic element 310, a second magnetic element 320, and a transmission assembly 330. The first magnetic element 310 and the second magnetic element 320 interact to generate the power to drive the clamping member 200. The transmission assembly 330 transmits the power to the clamping member 200. The first magnetic element 310 is located outside the base 100, which has a cavity 100a. The second magnetic element 320 and the transmission assembly 330 are both located within the cavity 100a, meaning they are both inside the base 100. The second magnetic element 320 is connected to each clamping member 200 via the transmission assembly 330. Optionally, the second magnetic element 320 and the transmission assembly 330, and the transmission assembly 330 and the clamping member 200, can be connected by welding, bonding, bolting, or other methods.

[0061] When the first magnetic element 310 moves relative to the second magnetic element 320, the second magnetic element 320 drives each clamping element 200 to move via the transmission assembly 330. Specifically, refer to... Figure 1 As shown, when the first magnetic element 310 approaches the second magnetic element 320, the interaction force between the first magnetic element 310 and the second magnetic element 320 increases, the second magnetic element 320 moves relative to the base 100, and the second magnetic element 320 drives each clamping element 200 to move through the transmission assembly 330, thereby realizing the clamping and release of the wafer S.

[0062] Optionally, the first magnetic member 310 and the second magnetic member 320 can be in a strip structure, a block structure, etc., and the embodiments of the present application do not limit the specific structure of the first magnetic member 310 and the second magnetic member 320. In the case that the magnetic poles of the first magnetic member 310 and the second magnetic member 320 are the same, when the first magnetic member 310 is close to the second magnetic member 320, the repulsive force between them increases. In the case that the magnetic poles of the first magnetic member 310 and the second magnetic member 320 are opposite, when the first magnetic member 310 is close to the second magnetic member 320, the attractive force between them increases.

[0063] In the embodiments of the present application, the driving mechanism 300 that drives the movement of the clamping member 200 adopts a magnetic attraction structure, that is, the clamping driving force of the clamping member 200 is provided by the mutual movement and interaction of the first magnetic member 310 and the second magnetic member 320. In this way, the driving mechanism 300 does not need to be provided with a lever and a gear structure, and the base 100 also does not need to be provided with a channel for the lever and the transmission member to penetrate through. The base 100 is in a relatively sealed state, and harmful corrosive gases such as water vapor and acid gas generated in the process are not easy to enter the inside of the base 100, avoiding the influence of the process environment on the clamping member 200, which is conducive to the smooth clamping and releasing of the wafer S by the clamping member 200.

[0064] In the optional embodiments, as shown in Figure 5 , each clamping member 200 is rotatably arranged on the base 100, and each clamping member 200 is provided with an action structure. When the clamping member 200 rotates relative to the base 100, each action structure directly contacts the edge of the wafer S to jointly clamp and fix the wafer S.

[0065] The transmission assembly 330 includes a moving cam 333 and a clamping connecting rod 338. The moving cam 333 is in transmission connection with the second magnetic member 320. The moving cam 333 is movably arranged on the base 100 along a first direction. The first direction intersects the rotation axis of the clamping member 200. The second magnetic member 320 can drive the moving cam 333 to move along the first direction when the second magnetic member 320 moves. Optionally, the moving cam 333 can be movably arranged on the base 100 through the matched first sliding block 3331 and first sliding rail 121.

[0066] Specifically, referring to Figures 27-28 and Figure 35As shown, the base 100 is provided with a rack 110, one of the rack 110 and the moving cam 333 is provided with a first sliding rail 121, and the other is provided with a first sliding block 3331. The first sliding rail 121 extends along a first direction, and the first sliding rail 121 and the first sliding block 3331 are in sliding fit. In this way, the first sliding block 3331 and the first sliding rail 121 cooperatively guide the moving direction of the moving cam 333. Of course, the moving cam 333 can also be movably arranged on the base 100 through other structures. The first direction can be perpendicular to the rotation axis of the clamping piece 200, that is, the first direction is a horizontal direction, or the first direction can intersect with the rotation axis of the clamping piece 200 but not perpendicular. The clamping connecting rod 338 is connected with the clamping piece 200. Optionally, the clamping connecting rod 338 and the clamping piece 200 can be connected through a fastener 3381 such as a screw. Of course, the two can also be connected through other ways.

[0067] Reference Figures 29-32 As shown, one of the clamping connecting rod 338 and the moving cam 333 is provided with a sliding groove 333a, and the other is provided with a sliding piece 334. The sliding piece 334 extends into the sliding groove 333a, and the sliding piece 334 and the sliding groove 333a are in sliding fit.

[0068] Specifically, the clamping connecting rod 338 is provided with the sliding groove 333a, and the moving cam 333 is provided with the sliding piece 334. Alternatively, the clamping connecting rod 338 is provided with the sliding piece 334, and the moving cam 333 is provided with the sliding piece 334. Optionally, the sliding piece 334 can be a cylindrical pin, a square pin, etc. The sliding piece 334 and the clamping connecting rod 338 can be fixedly connected through welding, bonding or the like. In this way, the second magnetic piece 320 can drive the moving cam 333 to move along the first direction, and the moving cam 333 drives the clamping connecting rod 338 and the clamping piece 200 to rotate through the sliding piece 334 and the sliding groove 333a. That is, the moving power of the moving cam 333 is converted into the rotating power of the clamping connecting rod 338 and the clamping piece 200 through the sliding piece 334 and the sliding groove 333a.

[0069] By adopting this embodiment, the transmission assembly 330 can convert the moving power into the rotating power of the clamping piece 200 through the moving cam 333 and the clamping connecting rod 338, and the cooperating sliding piece 334 and sliding groove 333a, so as to realize the smooth clamping and releasing of the wafer S by the clamping piece 200.

[0070] Optionally, reference Figure 10As shown, the base 100 is provided with a plurality of clamping channels 100b at intervals along the circumference of the base 100, and the clamping members 200 correspond to the clamping channels 100b one by one. Each clamping member 200 penetrates through the corresponding clamping channel 100b and extends from the upper end surface of the base 100. Each clamping member 200 is rotatable relative to the corresponding clamping channel 100b to clamp and release the wafer S. The rotation axis of each clamping member 200 is parallel to the axis of the base 100, that is, the rotation axis of the clamping member 200 is parallel to the vertical direction. Figure 29 As shown, the rotation axis of the clamping member 200 is the second axis b.

[0071] Of course, in other embodiments, the transmission assembly 330 can also include other structures in addition to the moving cam 333 and the clamping connecting rod 338. The specific structure of the transmission assembly 330 is not limited to the above-described embodiments, and the transmission assembly 330 can only convert the movement power provided by the interaction of the first magnetic member 310 and the second magnetic member 320 into rotation power.

[0072] In an optional embodiment, the transmission assembly 330 further includes a first driving member connected to the moving cam 333. The first driving member can be a linear module, an electric cylinder, or other electric driving member or a pneumatic cylinder, etc. The first driving member drives the moving cam 333 to move in the opposite direction of the first direction to reset the moving cam 333.

[0073] In another embodiment, as shown in Figures 25-26 and Figure 28 As shown, the transmission assembly 330 further includes a first elastic member 335, which can be but is not limited to a spring. The first end of the first elastic member 335 is connected to the moving cam 333, and the second end of the first elastic member 335 is connected to the base 100. During the movement of the second magnetic member 320 relative to the base 100, the first elastic member 335 is elastically deformed. When the first magnetic member 310 moves away from the second magnetic member 320, the magnetic force acting on the second magnetic member 320 gradually disappears, and the elastic force generated by the first elastic member 335 becomes the main driving force. The first elastic member 335 restores the elastic deformation and drives the moving cam 333 to reset in the opposite direction.

[0074] Optionally, the first end of the first elastic member 335 can be connected to the moving cam 333 by welding, bonding, or the like. The base 100 is provided with a rack 110, and the second end of the first elastic member 335 is connected to the rack 110 by welding, bonding, or the like, so that the first elastic member 335 is indirectly connected to the base 100. Further optionally, as shown in Figures 32-34As shown, the moving cam 333 is provided with a support portion 333c protruding from the surface of the moving cam 333, the first end of the first elastic member 335 directly abuts against the support portion 333c, and the second end of the first elastic member 335 directly abuts against the rack 110.

[0075] With the embodiment, the transmission assembly 330 directly utilizes the elastic force of the first elastic member 335 to drive the moving cam 333 to reverse reset, without the need to additionally set an electric drive member or a pneumatic drive member, thereby avoiding the problem of failure to timely drive the moving cam 333 to reset due to power failure or air failure, and ensuring smooth reset of the moving cam 333.

[0076] In an alternative embodiment, the number of the moving cam 333, the first magnetic member 310 and the second magnetic member 320 is multiple, and the moving cam 333, the clamping member 200, the first magnetic member 310 and the second magnetic member 320 are one-to-one corresponding.

[0077] In another embodiment, as shown in Figure 13 、 Figures 18-22 , the transmission assembly 330 further comprises a strip-shaped moving member 332, which is movably arranged on the base 100, and the strip-shaped moving member 332 is in transmission connection with the second magnetic member 320.

[0078] Optionally, the moving direction of the strip-shaped moving member 332 is the first direction, as shown in Figure 14 、 Figures 18-20 , the rack 110 of the base 100 is provided with a moving support 112, one of the moving support 112 and the strip-shaped moving member 332 is provided with a second sliding rail 1121, and the other is provided with a second sliding block 3322, the second sliding rail 1121 extends along the first direction, and the second sliding rail 1121 and the second sliding block 3322 are in sliding cooperation, so that the second sliding block 3322 and the second sliding rail 1121 matched with each other guide the moving direction of the strip-shaped moving member 332, of course, the strip-shaped moving member 332 can also be movably arranged on the base 100 through other structures, and the strip-shaped moving member 332 can also move in other directions other than the first direction. Further optionally, the two ends of each strip-shaped moving member 332 are respectively provided with a second sliding block 3322 and a second sliding rail 1121, that is, each strip-shaped moving member 332 corresponds to two sets of second sliding blocks 3322 and second sliding rails 1121 matched with each other.

[0079] As shown in Figure 18As shown, along the extending direction of the strip-shaped moving piece 332, both ends of the strip-shaped moving piece 332 are provided with a top block 3321, and the top block 3321 corresponds to a moving cam 333. That is to say, each strip-shaped moving piece 332 corresponds to two moving cams 333 through two top blocks 3321 respectively. The second magnetic member 320 can drive the strip-shaped moving piece 332 to move, and the strip-shaped moving piece 332 acts on the corresponding moving cam 333 through the top block 3321, so as to drive at least two moving cams 333 to move along the first direction.

[0080] Optionally, the top block 3321 can be a top rod, and the top block 3321 can also be other structures. In any case, the top block 3321 protrudes from the surface of the strip-shaped moving piece 332 and can act on the corresponding moving cam 333; the top block 3321 can be connected with the strip-shaped moving piece 332 by welding, bonding or the like.

[0081] Optionally, as shown in the first aspect of the embodiment, Figures 32-34 As shown, the moving cam 333 is provided with a protruding portion 333b, the protruding portion 333b protrudes from the surface of the moving cam 333, the top block 3321 acts on the protruding portion 333b, and the protruding portion 333b and the supporting portion 333c are located on the opposite sides of the moving cam 333 respectively. Further optionally, the moving cam 333, the protruding portion 333b and the supporting portion 333c can be an integral structure, or the three are a split structure.

[0082] By adopting the embodiment, the transmission assembly 330 is additionally provided with the strip-shaped moving piece 332, and each second magnetic member 320 can drive at least two moving cams 333 to move along the first direction through the strip-shaped moving piece 332, which is beneficial to reduce the number of the first magnetic member 310 and the second magnetic member 320, reduce the number of components of the transmission assembly 330, and simplify the structure of the clamping device.

[0083] In a further embodiment, as shown in the first aspect of the embodiment, Figures 13-16 As shown, the transmission assembly 330 further comprises a rotating lever 331, and the rotating lever 331 is rotatably arranged on the base 100. Optionally, the frame 110 of the base 100 is provided with two rotating supports 111, and the two ends of the rotating lever 331 are rotatably arranged on the two rotating supports 111 respectively. Specifically, the rotating support 111 is provided with a shaft hole, the end of the rotating lever 331 penetrates through the shaft hole, and the rotating lever 331 is rotatably connected with the shaft hole. Further optionally, the transmission assembly 330 further comprises a bearing 1111, and the bearing 1111 is located in the shaft hole and is sleeved on the end of the rotating lever 331. In this way, it is beneficial to reduce the friction during the rotation of the rotating lever 331.

[0084] The second magnetic member 320 is connected with the rotating lever 331. Optionally, the transmission assembly 330 further comprises a binding belt 321, and the second magnetic member 320 is connected with the rotating lever 331 through the binding belt 321, so that the second magnetic member 320 is fixed relative to the rotating lever 331. Further optionally, the rotating lever 331 is provided with an embedding groove, and the second magnetic member 320 is arranged in the embedding groove. Of course, the second magnetic member 320 and the rotating lever 331 can also be fixedly connected through welding, bonding or the like.

[0085] The rotating lever 331 is in transmission connection with the strip-shaped moving member 332. The second magnetic member 320 can drive the rotating lever 331 to rotate relative to the base 100, and the rotating lever 331 drives the strip-shaped moving member 332 to move relative to the base 100.

[0086] Optionally, the rotating axis of the rotating lever 331 is a first axis a, the first axis a is parallel to the moving direction of the strip-shaped moving member 332, and the rotating lever 331 and the strip-shaped moving member 332 are in transmission cooperation in the helical direction of the first axis a, and the transmission cooperation can be realized through a threaded structure, or the rotating axis of the rotating lever 331 intersects with the moving direction of the strip-shaped moving member 332, and the rotating lever 331 and the strip-shaped moving member 332 are in transmission connection through the telescopic rod set, that is, the first end of the telescopic rod set is in rotation connection with the rotating lever 331, the second end of the telescopic rod set is in rotation connection with the strip-shaped moving member 332, the telescopic rod set is driven to move when the rotating lever 331 rotates, and the strip-shaped moving member 332 is driven to move by the telescopic rod set. In short, when the rotating lever 331 rotates around the first axis a, the strip-shaped moving member 332 can move in the first direction. The transmission structure between the rotating lever 331 and the strip-shaped moving member 332 is not limited in the embodiment of the application.

[0087] By adopting the embodiment, the transmission assembly 330 is additionally provided with the rotating lever 331, and the magnetic force borne by the second magnetic member 320 can overcome the rotating friction of the rotating lever 331, that is, the strip-shaped moving member 332 can be driven to move through the rotating lever 331. Compared with the scheme that the second magnetic member 320 directly drives the strip-shaped moving member 332 to move and needs to overcome the gravity of the strip-shaped moving member 332, the magnetic force required for rotation in the embodiment of the application is smaller, which is conducive to reducing the volume of the first magnetic member 310 and the second magnetic member 320 and improving the sensitivity.

[0088] Of course, in other embodiments, the transmission assembly 330 can not be provided with the rotating lever 331, and the second magnetic member 320 can be directly connected with the strip-shaped moving member 332. In the process that the first magnetic member 310 approaches the second magnetic member 320, the second magnetic member 320 directly drives the strip-shaped moving member 332 to move relative to the base 100.

[0089] In an alternative embodiment, the transmission assembly 330 further comprises a second driving member connected to the strip-shaped moving member 332. The second driving member can be a linear module, an electric cylinder or other electric driving member, or a pneumatic cylinder or other pneumatic driving member. The second driving member drives the strip-shaped moving member 332 to move reversely in the first direction, so as to reset the strip-shaped moving member 332.

[0090] In another embodiment, as shown in Figure 18 、 Figures 20-22 the transmission assembly 330 further comprises a second elastic member 336, which can be but is not limited to a spring. The first end of the second elastic member 336 is connected to the strip-shaped moving member 332, and the second end of the second elastic member 336 is connected to the base 100. During the movement of the strip-shaped moving member 332 relative to the base 100 driven by the second magnetic member 320, the second elastic member 336 is elastically deformed. When the first magnetic member 310 moves away from the second magnetic member 320, the magnetic force acting on the second magnetic member 320 gradually disappears, and the elastic force generated by the second elastic member 336 becomes the main driving force. The second elastic member 336 restores the elastic deformation and drives the strip-shaped moving member 332 to reversely reset.

[0091] Optionally, the first end of the second elastic member 336 is connected to the strip-shaped moving member 332 by welding, bonding or other methods. The base 100 is provided with a frame 110, and the second end of the first elastic member 335 is connected to the frame 110 by welding, bonding or other methods, so as to indirectly connect the first elastic member 335 to the base 100. Further optionally, the first end of the first elastic member 335 directly abuts against the strip-shaped moving member 332, and the second end of the second elastic member 336 directly abuts against the frame 110.

[0092] By using the elastic force of the second elastic member 336 to drive the strip-shaped moving member 332 to reversely reset, the transmission assembly 330 does not need to be provided with an electric driving member or a pneumatic driving member, so as to avoid the problem that the strip-shaped moving member 332 cannot be timely reset due to power failure or air failure, and to ensure the smooth resetting of the strip-shaped moving member 332.

[0093] In the scheme of the present application, as shown in Figure 17As shown, the transmission assembly 330 further comprises a positioning magnetic element 337 connected with the base 100. The first magnetic element 310 and the second magnetic element 320 interact to drive the second magnetic element 320 to move from a first position to a second position. The first position is an initial position of the second magnetic element 320. When the second magnetic element 320 is at the first position, the distance between the first magnetic element 310 and the second magnetic element 320 is far, and the magnetic force between them is small or even no magnetic force. When the second magnetic element 320 is at the second position, the distance between the first magnetic element 310 and the second magnetic element 320 is close, and the magnetic force between them is large.

[0094] When the second magnetic element 320 is at the first position, that is, when the magnetic force between the first magnetic element 310 and the second magnetic element 320 is small or even no magnetic force, the second magnetic element 320 is attracted to the positioning magnetic element 337.

[0095] Optionally, the positioning magnetic element 337 can be arranged on the rotating support 111, and the positioning magnetic element 337 and the rotating support 111 can be connected by welding, bonding or the like. The positioning magnetic element 337 can be an electromagnet, and the positioning magnetic element 337 generates magnetism when powered. Alternatively, the positioning magnetic element 337 can be a permanent magnet. In any case, when the second magnetic element 320 is not subjected to the magnetic force of the first magnetic element 310, the positioning magnetic element 337 can magnetically attract the second magnetic element 320.

[0096] By this embodiment, the base 100 is additionally provided with the positioning magnetic element 337, which is used to position the second magnetic element 320 when the second magnetic element 320 is not subjected to the magnetic force or is subjected to a small magnetic force, so as to avoid the second magnetic element 320 from moving randomly due to other forces.

[0097] Of course, in other embodiments, the transmission assembly 330 can not be provided with the positioning magnetic element 337. When the second magnetic element 320 is at the first position, the second magnetic element 320 can rely on the friction between the second magnetic element 320 and the connected member to keep its position fixed.

[0098] In an alternative embodiment, the number of the transmission assembly 330, the first magnetic element 310 and the second magnetic element 320 is one.

[0099] In another embodiment, a plurality of transmission assemblies 330, first magnetic members 310 and second magnetic members 320 are arranged along the circumference of the base 100, and the transmission assemblies 330, the first magnetic members 310 and the second magnetic members 320 are one-to-one corresponding. Alternatively, two transmission assemblies 330, two first magnetic members 310 and two second magnetic members 320 are arranged along the circumference of the base 100, and the number of strip-shaped moving members 332 is two, and the number of moving cams 333, clamping links 338 and clamping members 200 is four.

[0100] With the embodiment, the number of transmission assemblies 330, first magnetic members 310 and second magnetic members 320 is increased, each group of first magnetic members 310 and second magnetic members 320 drives different clamping members 200 to move through different transmission assemblies 330, so that more clamping members 200 do not need to be driven by a shift rod and a gear structure, the number of channels provided by the base 100 for the shift rod and other transmission members to pass through is smaller, which is beneficial to further improve the sealing performance of the base 100, further avoid harmful corrosive gases such as water vapor and acid gas generated in the process from entering the inside of the base 100, and is more conducive to the smooth clamping and releasing of the wafer S by the clamping member 200.

[0101] In the scheme of the present application, referring to Figure 4 and Figure 5 , the clamping device further comprises a heating disc 400 and a rotary driving mechanism 500, the heating disc 400 and the rotary driving mechanism 500 are arranged in the cavity 100a, the heating disc 400 is provided with a heating element 410, the heating element 410 can be a heating rod, a heating wire or the like, and the specific type of the heating element 410 is not limited in the embodiment of the present application. The heating element 410 is used for heating the wafer S clamped by the clamping member 200, specifically, the heating element 410 is used for heating the back surface of the wafer S, that is, the bottom surface of the wafer S. Alternatively, the cavity 100a can be a circular cavity, and the heating disc 400 is a disc-shaped structure, or the cavity 100a can be a square cavity, and the heating disc 400 is a square disc structure, and the specific structure of the heating disc 400 and the cavity 100a is not limited in the embodiment of the present application; the heating disc 400 can be directly placed in the cavity 100a.

[0102] The rotary driving mechanism 500 is connected with the heating disc 400, and the rotary driving mechanism 500 is used for adjusting the rotation state of the heating disc 400 relative to the base 100. Alternatively, the rotary driving mechanism 500 can be a driving source for providing rotary power of a pneumatic motor, an electric motor or the like, adjusting the working state of the rotary driving mechanism 500 can adjust whether the heating disc 400 rotates relative to the base 100, and further can adjust the rotation speed and rotation direction of the heating disc 400 relative to the base 100.

[0103] Alternatively, referring to Figure 8As shown, the heating disc 400 is provided with at least two telecommunication interfaces 420 for supplying power and communication to the heating element 410, and two cooling liquid flow interfaces 430 for cooling liquid inflow and outflow. Since the output power of the heating element 410 is high, only the back surface of the wafer S is heated, and other components inside the base 100 cannot be baked for a long time, so the other components are cooled by the cooling liquid to reduce the temperature radiation of the heating disc 400 to other components inside the base 100.

[0104] With the embodiment, the clamping device is additionally provided with the heating disc 400, which can heat the wafer S clamped by the clamping device, and is conducive to heating the wafer S to a process temperature, without the need to use a heating device other than the clamping device to heat the wafer S. Moreover, in the process of rotating the wafer S driven by the base 100, the heating disc 400 is driven to rotate relative to the base 100 by the rotary driving mechanism 500, which can adjust the rotation state of the heating disc 400 relative to the wafer S, and further adjust the heating degree of the heating element 410 to a specific area of the wafer S, which is conducive to improving the heating uniformity of the wafer S.

[0105] In other embodiments, the clamping device can not be provided with the heating disc 400 and the rotary driving mechanism 500, and when the wafer S is clamped by the clamping device, the wafer S is heated by other heating devices.

[0106] In an optional embodiment, the rotary driving mechanism 500 includes opposite first permanent magnets 510 and first electromagnets 520, one of the first permanent magnets 510 and the first electromagnets 520 is located in the cavity 100a and is arranged on the side wall of the cavity 100a, and the other is arranged on the side wall of the heating disc 400. Specifically, referring to Figures 6-8 As shown, the side wall of the heating disc 400 is provided with the first permanent magnet 510, and referring to Figure 10 As shown, the side wall of the cavity 100a is provided with the first electromagnet 520; or, the side wall of the heating disc 400 is provided with the first electromagnet 520, and the side wall of the cavity 100a is provided with the first permanent magnet 510. Optionally, the first permanent magnet 510 can be a block structure, a strip structure, etc., and the first electromagnet 520 can be but not limited to an energized coil. In short, the first electromagnet 520 can generate a magnetic field when energized.

[0107] The first electromagnet 520 and the first permanent magnet 510 can interact when the first electromagnet 520 is energized to drive the heating plate 400 to rotate relative to the base 100. Specifically, when the first electromagnet 520 is in a first energized state, the first electromagnet 520 generates a magnetic field, and the first electromagnet 520 interacts with the first permanent magnet 510 to drive the heating plate 400 to rotate relative to the base 100. Optionally, the heating plate 400 is a disc, and the first permanent magnet 510 is provided on the side wall of the heating plate 400, and the first electromagnet 520 is provided on the side wall of the cavity 100a. When the first electromagnet 520 is in a first energized state, the energizing direction of the first electromagnet 520 is a first direction, the first electromagnet generates a magnetic field, and the first electromagnet 520 and the first permanent magnet 510 repel each other. The repulsive force between the two has a component force in the tangential direction of the first permanent magnet 510, which is a torsional force. The heating plate 400 is driven to rotate relative to the base 100 by the torsional force.

[0108] In this embodiment, the rotary drive mechanism 500 adopts a magnetic attraction structure. The rotational driving force of the heating plate 400 is provided by the interaction of the first permanent magnet 510 and the first electromagnet 520. Compared with the complex drive mechanism 300 that uses pneumatic motors, electric motors, etc., the rotary drive mechanism 500 has a simple structure and a small size, which helps to reduce the space occupied by the clamping device.

[0109] In a further embodiment, the rotary drive mechanism 500 further includes opposing second permanent magnets 530 and second electromagnets 540, one of which is disposed on the bottom wall of the cavity 100a, and the other is disposed on the bottom wall of the heating plate 400. Specifically, refer to Figure 8 As shown, a second permanent magnet 530 is provided on the bottom wall of the heating plate 400, for reference. Figure 10 As shown, a second electromagnet 540 is provided on the bottom wall of the cavity 100a, or a second electromagnet 540 is provided on the bottom wall of the heating plate 400, and a second permanent magnet 530 is provided on the bottom wall of the cavity 100a. Optionally, the second permanent magnet 530 can be a block structure, a strip structure, etc., and the second electromagnet 540 can be, but is not limited to, an energized coil. In short, the second electromagnet 540 can generate a magnetic field when energized.

[0110] The second electromagnet 540 and the second permanent magnet 530 can be attracted to each other when the second electromagnet 540 is powered on, so as to relatively fix the heating disc 400 and the base 100. Specifically, when the second electromagnet 540 is in a powered-on state, the second electromagnet 540 generates a magnetic field, and the second electromagnet 540 and the second permanent magnet 530 are attracted to each other, so as to relatively fix the heating disc 400 and the base 100. Alternatively, the bottom wall of the heating disc 400 is provided with the second permanent magnet 530, and the bottom wall of the heating disc 400 is provided with the second electromagnet 540. When the second electromagnet 540 is in a powered-on state and the first electromagnet is in a second powered-on state, the power-on direction of the first electromagnet 520 is a second direction, the second direction is opposite to the power-on direction of the first direction, the second electromagnet 540 and the second permanent magnet 530 are attracted to each other, and the first electromagnet and the first permanent magnet 510 are attracted to each other, so as to relatively fix the heating disc 400 and the base 100; or, when the second electromagnet 540 is in a powered-on state and the first electromagnet 520 is in a powered-off state, only the second electromagnet 540 and the second permanent magnet 530 are attracted to each other, so as to relatively fix the heating disc 400 and the base 100.

[0111] By adopting the embodiment, the rotating driving mechanism 500 is further provided with the second electromagnet 540 and the second permanent magnet 530, and the magnetic attraction force between the second permanent magnet 530 and the second electromagnet 540 when the second electromagnet 540 is powered on is used to maintain the synchronous rotation of the heating disc 400 and the base 100, so as to avoid the inertial rotation of the heating disc 400 relative to the base 100.

[0112] In an optional embodiment, the number of the first electromagnet 520 and the first permanent magnet 510 is one.

[0113] In another embodiment, the first electromagnet 520 and the first permanent magnet 510 are respectively arranged in multiple numbers along the circumference of the base 100. Specifically, the first electromagnet 520 and the first permanent magnet 510 can be uniformly distributed or non-uniformly distributed along the circumference of the base 100.

[0114] By adopting the embodiment, the number of the first electromagnet 520 and the first permanent magnet 510 is increased, and the interaction force between the first electromagnet 520 and the first permanent magnet 510 is increased, so that the rotating driving force provided to the heating disc 400 is greater, which is beneficial to the rapid rotation of the heating disc 400 relative to the base 100, so as to rapidly adjust the rotating speed of the heating disc 400 and control the temperature of the wafer S rapidly.

[0115] In an optional embodiment, the number of the second electromagnet 540 and the second permanent magnet 530 is one.

[0116] In another embodiment, multiple second electromagnets 540 and second permanent magnets 530 are respectively arranged at intervals along the circumference of the base 100. Specifically, the second electromagnets 540 and second permanent magnets 530 can be uniformly or non-uniformly distributed along the circumference of the base 100.

[0117] In this embodiment, the number of second electromagnets 540 and second permanent magnets 530 increases, and the magnetic attraction force between the second electromagnets 540 and the second permanent magnets 530 increases, which is more conducive to the heating plate 400 and the base 100 being relatively fixed and maintaining the same speed of rotation, further avoiding the heating plate 400 from rotating relative to the base 100 by inertia.

[0118] In one optional embodiment, the heating plate 400 is provided with a heating area 400a, in which a plurality of heating elements 410 are provided; or, along the circumference of the heating plate 400, the heating plate 400 is provided with a plurality of heating areas 400a, and each heating area 400a is provided with a heating element 410.

[0119] In another embodiment, reference Figure 6 As shown, along the circumference of the heating plate 400, the heating plate 400 is provided with multiple heating areas 400a, and each heating area 400a is provided with multiple heating elements 410. Each heating element 410 extends along the circumference of the heating plate 400, and the multiple heating elements 410 in the same heating area 400a are arranged at radial intervals along the heating plate 400. Optionally, the heating elements 410 in different heating areas 400a are powered separately. The heating plate 400 is a disc, each heating element 410 is a fan-shaped area, each heating element 410 has an arc-shaped structure, and the number of heating elements 410 provided in each heating area 400a may be the same or different. Along the radial direction of the heating plate 400 and in the direction closer to the center of the heating plate 400, the length of each heating element 410 decreases.

[0120] In this embodiment, the heating plate 400 is provided with multiple heating areas 400a in the circumferential direction. Different heating areas 400a correspond to different areas of the wafer S, so that the wafer S can be heated in different areas in its circumferential direction at the same time. Moreover, along the radial direction of the heating plate 400, multiple heating elements 410 are arranged at intervals in each heating area 400a. Therefore, multiple heating elements 410 in the same heating area 400a can heat different positions of the wafer S in its radial direction at the same time, which is more conducive to the rapid heating of the wafer S and improves the temperature control uniformity of the back side of the wafer S.

[0121] In this embodiment, there are 8 heating zones 400a.

[0122] Optionally, refer to Figure 36As shown, the clamping device further comprises a spraying member 700, which is located above the base 100, and a nozzle of the spraying member 700 is capable of spraying IPA (Isopropylamine) to an upper surface of the wafer S clamped by the clamping member 200, so as to dry the upper surface of the wafer S. Moreover, the spraying member 700 can move from the center of the wafer S to the edge of the wafer S, so as to spray the IPA to the entire upper surface of the wafer S.

[0123] In summary, the working process of the clamping device in the embodiment of the present application is as follows: the first magnetic member 310 is controlled to approach the second magnetic member 320, the rotating lever 331 is rotated around the first axis a, the rotating lever 331 drives the strip-shaped moving member 332 and the moving cam 333 to move in the first direction, the moving cam 333 drives the clamping connecting rod 338 and the clamping member 200 to rotate around the second axis b through the sliding member 334 and the sliding groove 333a, the clamping member 200 is opened, and the wafer S is placed in the area surrounded by the plurality of clamping members 200 by using a mechanical hand or other wafer conveying device; then the first magnetic member 310 is controlled to move away from the second magnetic member 320, the rotating lever 331 is reversely rotated around the first axis a under the elastic action of the second elastic member 336 and the magnetic attraction of the positioning magnetic member 337, the strip-shaped moving member 332 and the moving cam 333 are reversely moved, and the clamping connecting rod 338 and the clamping member 200 are reversely rotated around the second axis b, so as to clamp the wafer S, then the wafer S is processed, and the heating disc 400 rotates at the same speed as the base 100, and the heating element 410, the first electromagnet 520 and the second electromagnet 540 are controlled according to the temperature information detected by the temperature detecting element 600.

[0124] When the process is completed, the first magnetic member 310 is controlled to approach the second magnetic member 320 again, the clamping members 200 are opened again, and the wafer conveying device takes away the processed wafer S and places the unprocessed wafer S again.

[0125] Based on the clamping device disclosed in the present application, the embodiment of the present application further discloses a semiconductor process equipment, which comprises a process chamber and the clamping device in the above embodiment, the process chamber provides a process environment, and the clamping device is arranged in the process chamber, so as to ensure that the wafer S achieves a better process effect in the process.

[0126] Optionally, the semiconductor process equipment can be a single-wafer wet cleaning equipment, and the semiconductor process equipment can be used for wafer S cleaning process.

[0127] In the embodiment, the clamping device of the semiconductor processing equipment adopts a magnetic attraction structure to provide clamping driving force of the clamping piece 200, without the need to set a shift rod and a gear structure, and the base 100 also does not need to be provided with a channel for the shift rod and other transmission members to penetrate, so that the base 100 is in a relatively sealed state, and harmful corrosive gases such as water vapor and acid gas generated in the process are not easy to enter the inside of the base 100, so that the clamping piece 200 is not affected by the process environment, and the clamping piece 200 is beneficial to smoothly clamp and release the wafer S.

[0128] In the scheme of the application, the clamping device includes a heating disc 400 and a rotary driving mechanism 500, the heating disc 400 and the rotary driving mechanism 500 are arranged in the cavity 100a, the heating disc 400 is provided with a heating element 410, the heating element is used to heat the wafer S clamped by the clamping piece 200, and the rotary driving mechanism 500 is connected with the heating disc 400 to drive the heating disc 400 to rotate.

[0129] Reference Figure 36 As shown in the figure, the semiconductor processing equipment further includes a temperature detection element 600 and a control module, the temperature detection element 600 can be but is not limited to a temperature sensor, the temperature detection element 600 is used to detect the temperature of the wafer S, and the temperature detection element 600, the heating element 410 and the rotary driving mechanism 500 are respectively in communication connection with the control module. The control module adjusts the heating state of the heating element 410 and the working state of the rotary driving mechanism 500 according to the temperature information detected by the temperature detection element 600, so that the temperature of the wafer S is maintained in a preset temperature range.

[0130] Specifically, in the process, the heating disc 400 rotates at the same speed as the base 100. When the temperature detection element 600 detects that the temperature of a certain region of the wafer S is lower, the control module controls the output power of the heating element 410 to increase, and at the same time, adjusts the working state of the rotary driving mechanism 500, so that the rotating speed of the heating disc 400 is reduced, and the heating disc 400 and the base 100 rotate at different speeds, so that the heating element 410 of the heating disc 400 is opposite to the region of the wafer S with lower temperature, so that the heating element 410 fully heats the region, and the temperature of the region is quickly raised to the preset temperature range.

[0131] It should be noted that the preset temperature range is a temperature range set according to needs.

[0132] Optionally, the rotating driving mechanism 500 can comprise the opposite first permanent magnet 510 and the first electromagnet 520 and the opposite second permanent magnet 530 and the second electromagnet 540, and the first electromagnet 520 and the second electromagnet 540 are respectively connected with the control module in communication. The control module adjusts the energization state of the first electromagnet 520 and the energization state of the second electromagnet 540 according to the temperature information detected by the temperature detecting element 600, so as to adjust the working state of the rotating driving mechanism 500.

[0133] Further optionally, the control module and the heating element 410, the control module and the temperature detecting element 600, the control module and the first electromagnet 520, and the control module and the second electromagnet 540 can be connected in wired communication through the electric connection line, or can be connected in wireless communication through Bluetooth or wireless local area network. In summary, the control module can control the heating element 410, the first electromagnet 520 and the second electromagnet 540 according to the temperature information detected by the temperature detecting element 600.

[0134] The control module can be a temperature controller, or a single-chip microcomputer, a programmable logic controller or other control device, and can control the heating element 410, the first electromagnet 520 and the second electromagnet 540 according to the temperature information.

[0135] By using the embodiment, the temperature detecting element 600 is additionally arranged on the clamping device, the heating element 410 and the rotating driving mechanism 500 are automatically controlled according to the temperature information detected by the temperature detecting element 600, the heating temperature and the rotating state of the base 100 are automatically adjusted, the wafer S is directionally heated, the wafer S is effectively controlled in temperature, and the heating uniformity of the wafer S is improved.

[0136] Of course, in other embodiments, the semiconductor process equipment can not be provided with the control module, i.e., the user can adjust the heating state of the heating element 410 and the working state of the rotating driving mechanism 500 according to the detected temperature information.

[0137] The embodiments of the application are described above with reference to the drawings, but the application is not limited to the above specific embodiments, and the above specific embodiments are only illustrative but not restrictive, and those skilled in the art can make many forms under the inspiration of the application without departing from the purpose of the application and the scope protected by the claims, which all belong to the protection of the application.

Claims

1. A clamping device applied to a semiconductor process equipment, characterized in that, The clamping device comprises a base (100), a plurality of clamping pieces (200) and a driving mechanism (300), the plurality of clamping pieces (200) are arranged on the base (100), and the driving mechanism (300) is used for driving the plurality of clamping pieces (200) to move relative to the base (100) so that the plurality of clamping pieces (200) clamp or release a wafer (S), The driving mechanism (300) comprises a first magnetic piece (310), a second magnetic piece (320) and a transmission assembly (330), the first magnetic piece (310) is located outside the base (100), the base (100) is provided with a containing cavity (100a), the second magnetic piece (320) and the transmission assembly (330) are located in the containing cavity (100a), the second magnetic piece (320) is connected with each clamping piece (200) through the transmission assembly (330), and under the condition that the first magnetic piece (310) moves relative to the second magnetic piece (320), the second magnetic piece (320) drives each clamping piece (200) to move through the transmission assembly (330); The clamping piece (200) is rotatably arranged on the base (100), the transmission assembly (330) comprises a moving cam (333) and a clamping connecting rod (338), the moving cam (333) is in transmission connection with the second magnetic piece (320), and the moving cam (333) is movably arranged on the base (100) along a first direction, the first direction intersects with the rotation axis of the clamping piece (200), the clamping connecting rod (338) is connected with the clamping piece (200), the second magnetic piece (320) can drive the moving cam (333) to move along the first direction, and the moving cam (333) drives the clamping connecting rod (338) and the clamping piece (200) to rotate.

2. The clamping device of claim 1, wherein One of the clamping connecting rod (338) and the moving cam (333) is provided with a sliding groove (333a), and the other is provided with a sliding piece (334), the sliding piece (334) extends into the sliding groove (333a), and the sliding piece (334) is in sliding connection with the sliding groove (333a), The moving cam (333) drives the clamping connecting rod (338) and the clamping piece (200) to rotate through the sliding piece (334) and the sliding groove (333a).

3. The clamping device of claim 1, wherein The transmission assembly (330) further comprises a first elastic piece (335), a first end of the first elastic piece (335) is connected with the moving cam (333), and a second end of the first elastic piece (335) is connected with the base (100), in the process that the second magnetic piece (320) drives the moving cam (333) to move relative to the base (100), the first elastic piece (335) is elastically deformed.

4. The clamping device of claim 1, wherein The number of the moving cams (333) is a plurality, and the moving cams (333) correspond to the clamping pieces (200) one by one, The transmission assembly (330) further comprises a strip-shaped moving piece (332) movably arranged on the base (100), the strip-shaped moving piece (332) is in transmission connection with the second magnetic piece (320), both ends of the strip-shaped moving piece (332) are provided with a top block (3321) corresponding to the moving cam (333), The second magnetic piece (320) can drive the strip-shaped moving piece (332) to move, and the strip-shaped moving piece (332) acts on the corresponding moving cam (333) through the top block (3321), so as to drive at least two moving cams (333) to move along the first direction.

5. The clamping device of claim 4, wherein The transmission assembly (330) further comprises a rotating lever (331) rotatably arranged on the base (100), the second magnetic piece (320) is connected with the rotating lever (331), and the rotating lever (331) is in transmission connection with the strip-shaped moving piece (332), The second magnetic piece (320) can drive the rotating lever (331) to rotate relative to the base (100), and the rotating lever (331) drives the strip-shaped moving piece (332) to move relative to the base (100).

6. The clamping device of claim 4, wherein The transmission assembly (330) further comprises a second elastic piece (336), a first end of the second elastic piece (336) is connected with the strip-shaped moving piece (332), and a second end of the second elastic piece (336) is connected with the base (100), in the process that the second magnetic piece (320) drives the strip-shaped moving piece (332) to move relative to the base (100), the second elastic piece (336) is elastically deformed.

7. The clamping device of claim 1, wherein The transmission assembly (330) further comprises a positioning magnetic piece (337) connected with the base (100), the first magnetic piece (310) and the second magnetic piece (320) interact to drive the second magnetic piece (320) to move from a first position to a second position, When the second magnetic piece (320) is located at the first position, the second magnetic piece (320) is attracted to the positioning magnetic piece (337).

8. The holding device according to claim 1, characterized in that Along the circumference of the base (100), the transmission assembly (330), the first magnetic piece (310) and the second magnetic piece (320) are respectively arranged at intervals, and the transmission assembly (330), the first magnetic piece (310) and the second magnetic piece (320) are respectively one-to-one corresponding.

9. The holding device according to claim 1, characterized in that The clamping device further comprises a heating disc (400) and a rotary driving mechanism (500), both of which are arranged in the cavity (100a), the heating disc (400) is provided with a heating element (410) for heating the wafer (S) clamped by the clamping piece (200), and the rotary driving mechanism (500) is connected with the heating disc (400) and used for adjusting the rotation state of the heating disc (400) relative to the base (100).

10. The clamping device of claim 9, wherein The rotary driving mechanism (500) comprises opposite first permanent magnets (510) and first electromagnets (520), one of the first permanent magnets (510) and the first electromagnets (520) is arranged in the cavity (100a) and at the side wall of the cavity (100a), and the other is arranged at the side wall of the heating disc (400), The first electromagnet (520) and the first permanent magnet (510) can interact when the first electromagnet (520) is powered on to drive the heating disc (400) to rotate relative to the base (100).

11. The clamping device of claim 10, wherein The rotary driving mechanism (500) further comprises opposite second permanent magnets (530) and second electromagnets (540), one of the second permanent magnets (530) and the second electromagnets (540) is arranged at the bottom wall of the cavity (100a), and the other is arranged at the bottom wall of the heating disc (400), The second electromagnet (540) and the second permanent magnet (530) can be attracted when the second electromagnet (540) is powered on to fix the heating disc (400) relative to the base (100).

12. The clamping device of claim 11, wherein, Along the circumference of the base (100), the first electromagnet (520) and the first permanent magnet (510) are respectively arranged in multiple groups; And / or, along the circumference of the base (100), the second electromagnet (540) and the second permanent magnet (530) are respectively arranged in multiple groups.

13. The clamping device of claim 9, wherein Along the circumference of the heating disc (400), the heating disc (400) is provided with multiple heating regions (400a), each of the heating regions (400a) is provided with multiple heating elements (410), each of the heating elements (410) extends along the circumference of the heating disc (400), and multiple heating elements (410) in the same heating region (400a) are arranged in the radial direction of the heating disc (400).

14. A semiconductor process apparatus characterized by comprising: The clamping device comprises a process chamber and the clamping device according to any one of claims 1-13, and the clamping device is arranged in the process chamber.

15. The semiconductor process apparatus according to claim 14, wherein The clamping device further comprises a heating disc (400) and a rotary driving mechanism (500), both of which are arranged in the cavity (100a), the heating disc (400) is provided with a heating element (410) for heating the wafer (S) clamped by the clamping piece (200), and the rotary driving mechanism (500) is connected with the heating disc (400) to drive the heating disc (400) to rotate. The semiconductor process equipment further comprises a temperature detecting element (600) and a control module, the temperature detecting element (600) is used for detecting the temperature of the wafer (S), and the temperature detecting element (600), the heating element (410) and the rotary driving mechanism (500) are respectively in communication connection with the control module, and the control module is used for adjusting the heating state of the heating element (410) and the working state of the rotary driving mechanism (500) according to the temperature information detected by the temperature detecting element (600).

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