Camera module and electronic equipment

Abstract

The invention relates to a camera module and electronic equipment, the camera module comprises a bottom plate, a lens assembly, a circuit board, a photosensitive chip and an actuating element, the circuit board comprises a base material, a first conductor and a second conductor, the first conductor and the second conductor are uniformly distributed on the base material, the base material comprises a patch part and an elastic part which are connected, and the elastic part is connected with the patch part. The patch part is arranged in the mounting space and is arranged in a reference plane parallel to the bottom plate, the photosensitive chip is electrically connected along the lens body, the actuating element is electrically connected with the plurality of second conductors, the actuating element is used for driving the patch part to move in the reference plane when powered on and enabling the elastic part to generate elastic deformation, and when the actuating element is powered off, the patch part is driven to move in the reference plane and enable the elastic part to generate elastic deformation. And the elastic part recovers elastic deformation to drive the patch part to reset in the reference plane. According to the camera module and the electronic equipment, the overall structural complexity of the camera module is reduced, the assembly is simple and convenient, the size is reduced, and miniaturization is realized.

Description

Technical Field

[0001] The present application relates to the technical field of electronic equipment, and in particular to camera modules and electronic equipment. Background Art

[0002] The camera module is a functional module that enables mobile phones, tablet computers, smart watches and other electronic devices to take pictures. Its imaging performance directly affects the shooting experience of the electronic devices.

[0003] In the related art, the photosensitive chip is usually set on the TSA (Trace Suspension Assembly), and the SMA (Shape Memory Alloys) component is used to provide power to the photosensitive chip so that the photosensitive chip can move to achieve anti-shake.

[0004] However, this structural setting will make the overall structure of the camera module complex and difficult to assemble. In addition, the camera module with this structure is large in size, which is not conducive to miniaturization. Summary of the invention

[0005] The present application provides a camera module and an electronic device to solve the technical problems of the camera module having a complex overall structure, being difficult to assemble, and having a large volume.

[0006] On the one hand, the present application provides a camera module, comprising:

[0007] Base plate;

[0008] A lens assembly is connected to the bottom plate, and an installation space is formed between the lens assembly and the bottom plate;

[0009] A circuit board, comprising a substrate, a first conductor and a second conductor, wherein the first conductor and the second conductor are both arranged on the substrate, the substrate comprises a connected patch portion and an elastic portion, the patch portion is arranged in the installation space, and the patch portion is arranged in a reference plane parallel to the bottom plate and can move in the reference plane;

[0010] A photosensitive chip is disposed on the patch portion along the optical axis of the lens assembly and is electrically connected to the first conductors;

[0011] An actuator element is electrically connected to the plurality of second conductors. The actuator element is used to drive the patch portion to move within the reference plane when energized, and to cause the elastic portion to undergo elastic deformation. When the actuator element is de-energized, the elastic portion restores the elastic deformation to drive the patch portion to reset within the reference plane.

[0012] In one of the embodiments, the camera module further includes a plurality of rolling members, wherein the rolling members are disposed between the patch portion and the base plate, the rolling members are mounted on one of the patch portion and the base plate, and are in rolling contact with the other one.

[0013] In one embodiment, the rolling element includes a cylindrical ball or a spherical ball.

[0014] In one embodiment, the circuit board also includes a connector, which is connected to the end of the elastic part away from the patch part, the first conductor and the second conductor are both electrically connected to the connector, and the connector is used to cooperate with the electrical connection port and position the end of the elastic part away from the patch part at the electrical connection port.

[0015] In one embodiment, the actuating element comprises a piezoelectric sheet, and the piezoelectric sheet is connected to the surface of the elastic part; or the piezoelectric sheet is embedded in the elastic part.

[0016] In one embodiment, the actuator element includes a coil, and a wiring area is provided at the outer position of the patch portion corresponding to the photosensitive chip, and the coil is arranged in the wiring area; the camera module also includes a permanent magnet, and the permanent magnet is arranged in the lens assembly. When the coil is energized, it can interact with the permanent magnet and drive the patch portion to move relative to the lens assembly.

[0017] In one of the embodiments, the permanent magnet is opposite to the coil in a direction parallel to the optical axis of the lens assembly, or the permanent magnet is opposite to the coil in a direction parallel to the base plate.

[0018] In one embodiment, the coil includes a first coil and a second coil, and the permanent magnet includes a first permanent magnet and a second permanent magnet, the first coil and the second coil correspond to two side edges adjacent to the photosensitive chip, the first permanent magnet is opposite to the first coil, and the second permanent magnet is opposite to the second coil; wherein, the first coil is used to interact with the first permanent magnet when energized to drive the patch portion to translate along a first direction, and the second coil is used to interact with the second permanent magnet when energized to drive the patch portion to translate along a second direction, and the first direction intersects with the second direction.

[0019] In one embodiment, the patch portion includes a substrate layer, a wiring layer and a protective layer, the wiring layer is arranged between the substrate layer and the protective layer, the coil is arranged in the wiring layer, the patch portion is provided with a plurality of solder pads, a plurality of the solder pads are exposed from the protective layer, one end of a plurality of the first conductors extends to the wiring layer and is connected to the plurality of the solder pads, and the photosensitive chip is electrically connected to the plurality of the solder pads.

[0020] In one embodiment, the patch portion and the elastic portion are both in sheet shape, the elastic portion is arranged in the reference plane, and the elastic portion is connected to one side of the patch portion in a first direction, and the actuator element can drive the patch portion to translate along the first direction and / or perpendicular to the first direction when energized.

[0021] In one embodiment, the elastic portion includes a first elastomer and a second elastomer, the first elastomer has a first end and a second end opposite to each other in the first direction, the first end is connected to the patch portion, the second end is connected to the second elastomer, the second elastomer extends along a second direction, and the second direction is perpendicular to the first direction.

[0022] In one of the embodiments, a through hole is provided at the connection position between the lens assembly and the base plate, the elastic portion is located outside the installation space, and the substrate also includes a supporting portion, which can be movably inserted into the through hole, and two ends of the supporting portion are respectively connected to the patch portion and the elastic portion.

[0023] In one of the embodiments, the elastic portion is bent within the reference plane and is capable of elastically deforming in a first direction and a second direction, wherein the first direction and the second direction are perpendicular to each other.

[0024] On the other hand, the present application provides an electronic device, including a device body and the above-mentioned camera module, wherein the camera module is connected to the device body.

[0025] The camera module and electronic device mentioned above, the camera module includes a base plate, a lens assembly, a circuit board, a photosensitive chip and an actuator, the circuit board includes a substrate, a first conductor and a second conductor, the first conductor and the second conductor are both arranged on the substrate, the substrate includes a connected patch portion and an elastic portion, the patch portion is arranged in the installation space, and the patch portion is arranged in a reference plane parallel to the base plate. The photosensitive chip is arranged in the patch portion along the optical axis of the lens assembly and is electrically connected to a plurality of first conductors, the actuator is electrically connected to a plurality of second conductors, the actuator is used to drive the patch portion to move in the reference plane when powered on, and to cause the elastic portion to undergo elastic deformation, when the actuator is powered off, the elastic portion restores the elastic deformation to drive the patch portion to reset in the reference plane. In this way, the actuator can be used in conjunction with the elastic portion to adjust the position of the photosensitive chip relative to the lens assembly to perform optical image stabilization. Since the circuit board can not only utilize the first conductor and the second conductor to energize the photosensitive chip and the actuator element to meet the electrical control needs of the photosensitive chip and the actuator element when the camera module is shooting, but also the elastic part in the substrate of the circuit board can adapt to the movement needs of the patch part carrying the photosensitive chip on the reference plane. Compared with the suspension system adopted in the related art, the present application scheme reduces the overall structural complexity of the camera module, simplifies assembly, and is conducive to reducing the volume and achieving miniaturization. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0027] Figure 1 A schematic diagram of the cross-sectional structure of a camera module according to one embodiment.

[0028] Figure 2 This is a schematic structural diagram of a circuit board connected to a photosensitive chip in a camera module according to one embodiment.

[0029] Figure 3 The present invention is a schematic diagram of the cross-sectional structure of a circuit board connected to a photosensitive chip in a camera module according to one embodiment.

[0030] Figure 4 This is a schematic diagram of the structure of a circuit board connected to a photosensitive chip in a camera module according to another embodiment.

[0031] Figure 5 A schematic diagram of the structure of a circuit board of a camera module connected to a photosensitive chip in one embodiment.

[0032] Figure 6A schematic diagram of the structure of a circuit board of a camera module connected to a photosensitive chip in another embodiment.

[0033] Figure 7 A schematic diagram of the partial structure of a camera module according to one embodiment.

[0034] Figure 8 A schematic diagram of the partial structure of a camera module according to another embodiment.

[0035] Fig. 9 It is a schematic diagram of the three-dimensional structure of an electronic device according to one embodiment.

[0036] Fig.10 This is a structural block diagram of the electronic device provided in this application.

[0037] Description of Figure Numbers:

[0038] 10. Camera module; 11. Bottom plate; 12. Lens assembly; 13. Circuit board; 131. Base material; 1311. Patch part; 1311a. Substrate layer; 1311b. Wiring layer; 1311c. Protective layer; 1311d. Pad; 1312. Elastic part; 1312a. First elastic body; 1312b. Second elastic body; 1313. Support part; 132. First conductor; 133. Second conductor; 134. Connector; 14. Photosensitive chip; 14a. Metal wire; 15. Actuating element; 151. Coil; 1511. First coil; 1512. Second coil; 152. Piezoelectric sheet; 16. Permanent magnet; 17. Filter; 18. Bracket; 19. Voice coil motor; 101. Rolling element; 20. Equipment body; 21. Display screen; X, first direction; Y, second direction. DETAILED DESCRIPTION

[0039] In order to facilitate the understanding of the present application, the present application will be described more fully below with reference to the relevant drawings. The preferred embodiments of the present application are provided in the drawings. However, the present application can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the understanding of the disclosure of the present application more thorough and comprehensive.

[0040] As used herein, "electronic device" refers to a device that can receive and / or send communication signals, including but not limited to a device that is connected via any one or more of the following connection methods:

[0041] (1) Connection via wired lines, such as Public Switched Telephone Networks (PSTN), Digital Subscriber Line (DSL), digital cable, and direct cable connection;

[0042] (2) Via wireless interfaces, such as cellular networks, wireless local area networks (WLAN), digital television networks such as DVB-H networks, satellite networks, and AM-FM broadcast transmitters.

[0043] An electronic device configured to communicate via a wireless interface may be referred to as a "mobile terminal". Examples of mobile terminals include, but are not limited to, the following electronic devices:

[0044] (1) Satellite phone or cellular phone;

[0045] (2) Personal Communications System (PCS) terminals that can combine cellular radio telephones with data processing, fax, and data communications capabilities;

[0046] (3) Radiotelephone, pager, Internet / Intranet access, Web browser, notepad, calendar, Personal Digital Assistant (PDA) equipped with a Global Positioning System (GPS) receiver;

[0047] (4) conventional laptop and / or handheld receivers;

[0048] (5) Conventional laptop and / or palmtop radio telephone transceivers, etc.

[0049] Combination Figure 1 and Figure 2 As shown, the camera module 10 includes a base plate 11, a lens assembly 12, a circuit board 13, a photosensitive chip 14 and an actuator 15.

[0050] The lens assembly 12 is connected to the bottom plate 11 , and an installation space is enclosed between the lens assembly 12 and the bottom plate 11 .

[0051] The circuit board 13 includes a substrate 131, a first conductor 132, and a second conductor 133. The first conductor 132 and the second conductor 133 are both arranged on the substrate 131. The substrate 131 includes a connected patch portion 1311 and an elastic portion 1312, and the patch portion 1311 is arranged in the installation space. The patch portion 1311 is arranged in a reference plane parallel to the base plate 11, and the patch portion 1311 can move in the reference plane.

[0052] In some embodiments, the camera module 10 includes a plurality of rolling members 101. The rolling members 101 are disposed between the patch portion 131 and the base plate 11 so as to support the patch portion 131 with the plurality of rolling members 101, thereby improving the stability of the patch portion 131 when it moves relative to the base plate 11 in the reference plane. The rolling member 101 is mounted on one of the patch portion 131 and the base plate 11, and is in rolling contact with the other. Thus, when the patch portion 131 moves relative to the base plate 11, the rolling member 101 can roll, thereby generating little movement resistance to the patch portion 131, so that the patch portion 131 can flexibly move relative to the base plate 11 in the reference plane. The rolling member 101 includes but is not limited to cylindrical balls or spherical balls. This structure is flexible in rolling, thereby generating little friction resistance, which is conducive to maintaining the movement flexibility of the patch portion 131, and reduces the wear of each structural member, so as to extend the service life of the camera module 10.

[0053] The photosensitive chip 14 is disposed on the patch portion 1311 along the optical axis of the lens assembly 12 and is electrically connected to the plurality of first conductive bodies 132 .

[0054] The actuator 15 is electrically connected to the plurality of second conductors 133. When the actuator 15 is powered on, it drives the patch portion 1311 to move within the reference plane and causes the elastic portion 1312 to undergo elastic deformation. When the actuator 15 is powered off, the elastic portion 1312 recovers its elastic deformation to drive the patch portion 1311 to reset within the reference plane. In this way, the actuator 15 can be used in conjunction with the elastic portion 1312 to adjust the position of the photosensitive chip 14 relative to the lens assembly 12 to perform optical image stabilization.

[0055] In the camera module 10 of the embodiment of the present application, since the circuit board 13 can not only utilize the first conductor 132 and the second conductor 133 to energize the photosensitive chip 14 and the actuator element 15 to meet the electrical control needs of the photosensitive chip 14 and the actuator element 15 when the camera module 10 is shooting; at the same time, in the base material 131 of the circuit board 13, the elastic part 1312 can adapt to the movement needs of the patch part 1311 carrying the photosensitive chip 14 in the reference plane. Compared with the suspension system adopted in the related art, the solution of the present application reduces the overall structural complexity of the camera module 10, makes assembly simple, and is conducive to reducing the volume and achieving miniaturization.

[0056] The photosensitive chip 14 can form an image when receiving light. The type of the photosensitive chip 14 is not limited here. The types of the photosensitive chip 14 may include CCD (Charge Coupled Device) elements, CMOS (Complementary Metal Oxide Semiconductor) devices, photosensitive diodes, etc. In terms of color, the photosensitive chip 14 may be a color light sensor, a monochromatic light sensor, an infrared light sensor, a grayscale sensor, etc.

[0057] In some embodiments, the lens assembly 12 can meet the need to focus and / or adjust the light in the imaging light path of the photosensitive chip 14 so that the photosensitive chip 14 can obtain a good imaging effect.

[0058] The lens assembly 12 may be a common lens group. In some embodiments, the lens assembly 12 includes a plurality of lenses, and the plurality of lenses are arranged in a straight line along the optical axis. Some of the plurality of lenses have both convex surfaces or both concave surfaces, and some lenses have one convex surface and the other concave surface. The surface shape of the lens is not limited here.

[0059] Continue reading Figure 1 As shown, in some embodiments, the camera module 10 also includes a filter 17 , which is located in the imaging light path of the photosensitive chip 14 to exert a filtering effect, thereby improving the imaging quality of the photosensitive chip 14 .

[0060] The filter 17 may be disposed between the photosensitive chip 14 and the lens assembly 12. For example, the camera module 10 includes a bracket 18, and the bracket 18 is connected to the base plate 11. The connection method between the bracket 18 and the base plate 11 includes but is not limited to snap-on, hot-melt connection or connection by glue. The filter 17 is connected to the bracket 18, and is mounted on the side of the photosensitive chip 14 facing the lens assembly 12 under the support of the bracket 18. The lens assembly 12 is disposed on the side of the bracket 18 facing away from the patch portion 1311. It should be noted that in an embodiment in which the camera module 10 includes a bracket 18, the lens assembly 12 is connected to the base plate 11 through the bracket 18. At this time, the space enclosed by the bracket 18 and the lens assembly 12 together with the base plate 11 can be understood as the installation space enclosed between the lens assembly 12 and the base plate 11.

[0061] In this embodiment, after the lens assembly 12 processes the external light, the light passes through the filter 17 and is incident on the photosensitive chip 14. The photosensitive chip 14 receives the light and generates an electrical signal, which is then converted into a digital signal through analog-to-digital conversion, thereby realizing digital imaging.

[0062] In some embodiments, the camera module 10 includes a voice coil motor 19 that supports the lens assembly 12, and the voice coil motor 19 is disposed between the lens assembly 12 and the bracket 18. The voice coil motor 19 is used to move the lens assembly 12 relative to the bracket 18 along the imaging optical path, so that the lens assembly 12 is away from or close to the photosensitive chip 14 to achieve optical focus.

[0063] It should be noted that the filter 17 is not limited to being disposed in the imaging optical path of the photosensitive chip 14 through the bracket 18. For example, in some embodiments, the filter 17 can be attached to the side of the photosensitive chip 14 facing the lens assembly 12, that is, the filter 17 is attached to the photosensitive surface of the photosensitive chip 14.

[0064] The circuit board 13 further includes a connector 134, which is connected to one end of the elastic portion 1312 away from the patch portion 1311, and the first conductor 132 and the second conductor 133 are both electrically connected to the connector 134. The connector 134 is used to match with the electrical connection port and position the end of the elastic portion 1312 away from the patch portion 1311 at the electrical connection port.

[0065] Since the connector 134 can position the end of the elastic part 1312 away from the patch part 1311, when the patch part 1311 moves relative to the connector 134, the patch part 1311 will pull the elastic part 1312, and the elastic part 1312 will be elastically deformed. Alternatively, when the elastic part 1312 is deformed, since the end away from the patch part 1311 is positioned at the electrical connection port by the connector 134, the deformation of the elastic part 1312 will drive the patch part 1311 to move.

[0066] When the connector 134 is matched with the electrical connection port, the photosensitive chip 14 is electrically connected to the electrical connection port through the first conductor 132, and the actuator 15 is electrically connected to the electrical connection port through the second conductor 133. In this way, the electrical connection port can be used to power the photosensitive chip 14 and the actuator 15 and perform electrical signal control.

[0067] It should be noted that the circuit board 13 can be connected to an electrical connection port on a main board or a sub-board in the electronic device by using the connector 134 .

[0068] Continue to combine Figure 1 and Figure 2As shown, the actuator 15 includes a coil 151, and a wiring area is provided at the outer position of the patch part 1311 corresponding to the photosensitive chip 14, and the coil 151 is arranged in the wiring area; the camera module 10 also includes a permanent magnet 16, and the permanent magnet 16 is arranged on the lens assembly 12. When the coil 151 is energized, it can interact with the permanent magnet 16 and drive the patch part 1311 to move relative to the lens assembly 12. In this embodiment, the interaction between the coil 151 and the permanent magnet 16 is used to realize the movement of the patch part 1311 relative to the lens assembly 12, and then the photosensitive chip 14 on the patch part 1311 moves relative to the lens assembly 12 to achieve anti-shake.

[0069] Since the coil 151 is arranged in the wiring area of ​​the patch portion 1311, there is no need to install the coil 151 independently, so that the assembly of the camera module 10 is simple and reliable.

[0070] It should be noted that the permanent magnet 16 is opposite to the coil 151 in a direction parallel to the optical axis of the lens assembly 12, that is, in a direction parallel to the optical axis of the lens assembly 12, there is an overlapping portion between the orthographic projection of the permanent magnet 16 on the base plate 11 and the orthographic projection of the coil 151 on the base plate 11.

[0071] The permanent magnet 16 is opposite to the coil 151 in a direction parallel to the bottom plate 11 , that is, in a direction parallel to the bottom plate 11 , the orthographic projections of the permanent magnet 16 and the coil 151 on a plane perpendicular to the bottom plate 11 have overlapping parts.

[0072] The relative positions of the permanent magnet 16 and the coil 151 are not limited here, as long as they can meet the need of the coil 151 to interact with the permanent magnet 16 and drive the patch portion 1311 to move relative to the lens assembly 12 when energized.

[0073] Combination Figure 3 As shown, in some embodiments, the patch portion 1311 includes a substrate layer 1311a, a wiring layer 1311b, and a protective layer 1311c. The wiring layer 1311b is disposed between the substrate layer 1311a and the protective layer 1311c, and the coil 151 is disposed in the wiring layer 1311b. Thus, the coil 151 is embedded in the patch portion 1311, so that in addition to occupying a certain space in the patch portion 1311, the coil 151 does not occupy the space on the side of the photosensitive chip 14 facing the lens assembly 12, which is conducive to reducing the volume of the camera module 10.

[0074] The patch portion 1311 is provided with a plurality of pads 1311d, the plurality of pads 1311d are exposed from the protective layer 1311c, one end of the plurality of first conductors 132 extends to the wiring layer 1311b and is connected to the plurality of pads 1311d, and the photosensitive chip 14 is electrically connected to the plurality of pads 1311d.

[0075] In this embodiment, the photosensitive chip 14 can be bonded to the patch portion 1311 by glue. The pad 1311d can be used as long as it can meet the needs of electrical connection with the photosensitive chip 14, and the type and shape of the pad 1311d are not limited here.

[0076] The gold fingers (not shown) on the photosensitive chip 14 are correspondingly welded to the multiple pads 1311d through the metal wires 14a, so that the gold fingers of the photosensitive chip 14 are correspondingly electrically connected to the multiple pads 1311d on the patch part 1311, so that the photosensitive chip 14 can be electrically connected to the main board or sub-board of the electronic device by using the circuit board 13, thereby meeting the signal transmission needs of the electronic device to the photosensitive chip 14. The material of the metal wire 14a can be gold (Au), so that the metal wire 14a has good ductility, which is convenient for bonding to the pads 1311d and the gold fingers on the photosensitive chip 14 by a binding process.

[0077] It should be noted that the patch portion 1311 and the elastic portion 1312 are both in the shape of sheets, the elastic portion 1312 is arranged in the reference plane, and the elastic portion 1312 is connected to one side of the patch portion 1311 in the first direction X. When the actuator element 15 is energized, it can drive the patch portion 1311 to translate along the first direction X and / or perpendicular to the first direction X.

[0078] Combination Figure 4 As shown, the coil 151 includes two, namely, a first coil 1511 and a second coil 1512. Correspondingly, the permanent magnet 16 includes two, namely, a first permanent magnet and a second permanent magnet. The first coil 1511 and the second coil 1512 correspond to the two sides adjacent to the photosensitive chip 14, the first permanent magnet and the first coil 1511 are opposite, and the second permanent magnet and the second coil 1512 are opposite.

[0079] Among them, the first coil 1511 is used to interact with the first permanent magnet when powered on to drive the patch part 1311 to translate along the first direction X, thereby meeting the need for anti-shake when the photosensitive chip 14 translates in the first direction X; the second coil 1512 is used to interact with the second permanent magnet when powered on to drive the patch part 1311 to translate along the second direction Y, thereby meeting the need for anti-shake when the photosensitive chip 14 translates in the second direction Y. The first direction X intersects with the second direction Y, so the camera module 10 in this embodiment can move in any direction within the plane where the first direction X and the second direction Y are located to improve the anti-shake performance.

[0080] Combination Figure 5 As shown, in some embodiments, the actuator 15 includes a piezoelectric sheet 152 , and the piezoelectric sheet 152 is connected to the surface of the elastic portion 1312 , so that the piezoelectric sheet 152 and the elastic portion 1312 are compactly connected to each other, so as to reduce the occupied space.

[0081] The piezoelectric sheet 152 is embedded in the elastic part 1312, so that the piezoelectric sheet 152 and the elastic part 1312 are stably connected as a whole, so that when the piezoelectric sheet 152 is deformed, it can stably drive the elastic part 1312 to deform, so as to control the movement accuracy of the photosensitive chip 14 and improve the anti-shake effect.

[0082] Combination Figure 6 As shown, in some embodiments, the actuator element 15 includes a coil 151 and a piezoelectric sheet 152. In this way, the coil 151 can be used to interact with the permanent magnet 16 after being energized to drive the patch portion 1311 to move, so that the photosensitive chip 14 on the patch portion 1311 moves relative to the lens assembly 12, thereby achieving anti-shake. In this embodiment, since the actuator element 15 also includes the piezoelectric sheet 152, the piezoelectric sheet 152 can also be used to generate bending deformation after being energized to drive the patch portion 1311 to move relative to the lens assembly 12 with the photosensitive chip 14, thereby achieving anti-shake. Therefore, in the embodiment in which the actuator element 15 includes the coil 151 and the piezoelectric sheet 152, diversified anti-shake can be achieved, thereby improving the anti-shake performance and the shooting quality.

[0083] It should be noted that in the implementation of the actuator 15 including the coil 151 and the piezoelectric piece 152, both can apply forces in the same direction to the patch portion 1311, or can apply forces in different directions. For example, the forces applied by the coil 151 and the piezoelectric piece 152 to the patch portion 1311 are both to achieve the movement of the patch portion 1311 along the first direction X or the second direction Y; or, in some implementations, one of the coil 151 and the piezoelectric piece 152 applies a force along the first direction X to the patch portion 1311, and the other applies a force along the second direction Y to the patch portion 1311. At this time, the patch portion 1311 can be adjusted in the first direction X and the second direction Y at the same time under the combined force of the first direction X and the second direction Y, and then can meet the anti-shake needs in any direction within the reference plane.

[0084] The photosensitive chip 14 may be connected to the circuit board 13 by a patch process. The coil 151 may be arranged in the patch portion 1311 by an etching process.

[0085] Combination Figure 7As shown, in some embodiments, the elastic portion 1312 includes a first elastic body 1312a and a second elastic body 1312b. The first elastic body 1312a has a first end and a second end opposite to each other in the first direction X, the first end is connected to the patch portion 1311, and the second end is connected to the second elastic body 1312b, and the second elastic body 1312b extends along the second direction Y, and the second direction Y is perpendicular to the first direction X. In this embodiment, the first elastic body 1312a and the second elastic body 1312b are used to respectively realize elastic deformation in the first direction X and the second direction Y, so that the photosensitive chip 14 can be flexibly moved in the first direction X and the second direction Y in two dimensions, so as to obtain good anti-shake performance.

[0086] The elastic portion 1312 is located outside the installation space, so as not to occupy the installation space enclosed between the lens assembly 12 and the base plate 11 , thereby facilitating miniaturization of the lens assembly 12 .

[0087] A through hole is provided at the connection position between the lens assembly 12 and the bottom plate 11, and the substrate 131 further includes a support portion 1313, which can be movably inserted into the through hole. It should be noted that after the support portion 1313 is inserted into the through hole, the through hole can still meet the activity requirements of the support portion 1313, so that the patch portion 1311 can move under the drive of the elastic portion 1312 without being restricted by the hole wall of the through hole.

[0088] The two ends of the support portion 1313 are respectively connected to the patch portion 1311 and the elastic portion 1312. In this way, the support portion 1313 is used to connect the patch portion 1311 and the elastic portion 1312, which are located inside and outside the installation space.

[0089] Combination Figure 8 As shown, the elastic part 1312 is bent in the reference plane and can be elastically deformed in the first direction X and the second direction Y, and the first direction X and the second direction Y are perpendicular to each other. In this embodiment, the bending of the elastic part 1312 is used to meet the elastic deformation requirements in the first direction X and the second direction Y. This structure is simple and easy to manufacture. For example, a pre-bent memory metal is set in the elastic part 1312, so that the elastic part 1312 is bent.

[0090] It should be noted that the elastic part 1312 can realize elastic deformation by setting the first conductor 132 and the second conductor 133 therein. In other words, the first conductor 132 and the second conductor 133 can not only conduct electricity, but also have elastic deformation ability. For example, the first conductor 132 and the second conductor 133 can be elastic bodies made of conductive materials, which not only meets the needs of electrical transmission, but also can meet the needs of elastic deformation of the elastic part 1312 on the reference plane.

[0091] Combination Fig. 9 As shown, another embodiment of the present application provides an electronic device, including a device body 20 and a camera module 10 in any of the above-mentioned embodiments, wherein the camera module 10 is connected to the device body 20 .

[0092] The device body 20 includes a display screen 21. In some embodiments, the patch portion 1311 and the elastic portion 1312 are arranged in a direction parallel to the display surface of the display screen 21. The photosensitive surface of the photosensitive chip 14 faces the display screen 21 and can receive external light for imaging. In this way, the camera module 10 can meet the needs of front-end camera.

[0093] In other embodiments, the photosensitive surface of the photosensitive chip 14 may be facing away from the display screen 21 and may receive external light to form an image. In this way, the camera module 10 may meet the needs of rear-mounted camera.

[0094] It should be noted that the electronic device can be wearable devices such as smart bracelets and smart watches, or it can be a tablet computer, laptop computer, smart helmet, smart glasses, etc., without limitation here.

[0095] Combination Fig.10 , Fig.10 The circuit module block diagram of the device body 100 of the electronic device provided in the embodiment of the present application. The device body 100 may include a radio frequency (RF) circuit 501, a memory 502 including one or more computer-readable storage media, an input unit 503, a display unit 504, a sensor 505, an audio circuit 506, a wireless fidelity (WiFi) module 507, a processor 508 including one or more processing cores, and a power supply 509. Those skilled in the art will understand that Fig.10 The structure of the device body 100 shown in the figure does not constitute a limitation on the device body 100, and may include more or less components than shown in the figure, or combine certain components, or arrange the components differently.

[0096] The radio frequency circuit 501 can be used to send and receive information, or receive and send signals during a call. In particular, after receiving the downlink information of the base station, it is handed over to one or more processors 508 for processing; in addition, the data related to the uplink is sent to the base station. Generally, the radio frequency circuit 501 includes but is not limited to an antenna, at least one amplifier, a tuner, one or more oscillators, a subscriber identity module (SIM) card, a transceiver, a coupler, a low noise amplifier (LNA), a duplexer, etc. In addition, the radio frequency circuit 501 can also communicate with the network and other devices through wireless communication. The wireless communication can use any communication standard or protocol, including but not limited to the Global System of Mobile Communication (GSM), General Packet Radio Service (GPRS), Code Division Multiple Access (CDMA), Wideband Code Division Multiple Access (WCDMA), Long Term Evolution (LTE), email, Short Messaging Service (SMS), etc.

[0097] The memory 502 can be used to store applications and data. The applications stored in the memory 502 include executable codes. The applications can be composed of various functional modules. The processor 508 executes various functional applications and data processing by running the applications stored in the memory 502. The memory 502 can mainly include a program storage area and a data storage area, wherein the program storage area can store an operating system, an application required for at least one function (such as a sound playback function, an image playback function, etc.), etc.; the data storage area can store data created according to the use of the device body 100 (such as audio data, a phone book, etc.), etc. In addition, the memory 502 can include a high-speed random access memory, and can also include a non-volatile memory, such as at least one disk storage device, a flash memory device, or other volatile solid-state storage devices. Accordingly, the memory 502 can also include a memory controller to provide the processor 508 and the input unit 503 with access to the memory 502.

[0098] The input unit 503 can be used to receive input digital, character information or user feature information (such as fingerprints), and generate keyboard, mouse, joystick, optical or trackball signal input related to user settings and function control. Specifically, in a specific embodiment, the input unit 503 may include a touch-sensitive surface and other input devices. The touch-sensitive surface, also known as a touch panel or touch pad, can collect user touch operations on or near it (such as operations performed by users using fingers, styluses, or any other suitable objects or accessories on or near the touch-sensitive surface), and drive corresponding connection devices according to a pre-set program. Optionally, the touch-sensitive surface may include a touch detection device and a touch controller. Among them, the touch detection device detects the user's touch orientation, detects the signal brought by the touch operation, and transmits the signal to the touch controller; the touch controller receives the touch information from the touch detection device, converts it into touch point coordinates, and then sends it to the processor 508, and can receive and execute commands sent by the processor 508.

[0099] Furthermore, the touch-sensitive surface may cover a liquid crystal panel. When the touch-sensitive surface detects a touch operation on or near it, it is transmitted to the processor 508 to determine the type of touch event. The processor 508 then provides corresponding visual output on the liquid crystal panel according to the type of touch event.

[0100] The display unit 504 may be used to display information input by a user or information provided to a user and various graphical user interfaces of the device body 100 . These graphical user interfaces may be composed of graphics, texts, icons, videos, and any combination thereof.

[0101] Although in Fig.10 In the embodiment, the touch sensitive surface and the liquid crystal panel are used as two independent components to realize input and output functions, but in some embodiments, the touch sensitive surface and the liquid crystal panel can be integrated to realize input and output functions. It can be understood that the device body 100 can include an input unit 503 and a display unit 504.

[0102] The device body 100 may also include at least one sensor 505, such as a proximity sensor, a motion sensor, and other sensors. Among them, the proximity sensor can turn off the LCD panel and / or the backlight when the device body 100 is moved to the ear. As a type of motion sensor, the gravity acceleration sensor can detect the magnitude of acceleration in each direction (generally three axes), and can detect the magnitude and direction of gravity when stationary. It can be used for applications that identify the posture of the mobile phone (such as horizontal and vertical screen switching, related games, magnetometer posture calibration), vibration recognition related functions (such as pedometer, tapping), etc.; as for other sensors that can be configured with the device body 100, such as gyroscopes, barometers, hygrometers, thermometers, infrared sensors, etc., they will not be repeated here.

[0103] The audio circuit 506 can provide an audio interface between the user and the device body 100 through a speaker and a microphone. The audio circuit 506 can convert the received audio data into an electrical signal, transmit it to the speaker, and convert it into a sound signal for output; on the other hand, the microphone converts the collected sound signal into an electrical signal, which is received by the audio circuit 506 and converted into audio data, and then the audio data is output to the processor 508 for processing, and then sent to another device body 100 through the radio frequency circuit 501, or the audio data is output to the memory 502 for further processing. The audio circuit 506 may also include an earphone socket to provide communication between an external earphone and the device body 100.

[0104] Wireless Fidelity (WiFi) is a short-range wireless transmission technology. The device body 100 can help users send and receive emails, browse web pages, and access streaming media through the wireless fidelity module 507. It provides users with wireless broadband Internet access. Fig.10 A wireless fidelity module 507 is shown, but it is understandable that it is not a necessary component of the device body 100 and can be omitted as needed without changing the essence of the invention.

[0105] The processor 508 is the control center of the device body 100. It uses various interfaces and lines to connect various parts of the entire device body 100. By running or executing the application program stored in the memory 502 and calling the data stored in the memory 502, it executes various functions of the device body 100 and processes data, thereby monitoring the device body 100 as a whole. Optionally, the processor 508 may include one or more processing cores; preferably, the processor 508 may integrate an application processor and a modem processor, wherein the application processor mainly processes the operating system, user interface and application program, etc., and the modem processor mainly processes wireless communication. It is understandable that the above-mentioned modem processor may not be integrated into the processor 508.

[0106] The device body 100 also includes a power supply 509 for supplying power to various components. Preferably, the power supply 509 can be logically connected to the processor 508 through a power management system, so that the power management system can manage charging, discharging, and power consumption. The power supply 509 can also include one or more DC or AC power supplies, recharging systems, power failure detection circuits, power converters or inverters, power status indicators, and other arbitrary components.

[0107] although Fig.10Not shown, the device body 100 may also include a Bluetooth module, etc., which will not be described in detail here. In specific implementation, the above modules can be implemented as independent entities, or can be arbitrarily combined and implemented as the same or several entities. The specific implementation of the above modules can refer to the previous method embodiment, which will not be described in detail here.

[0108] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0109] The above-described embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be construed as limiting the scope of the patent application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent application shall be subject to the attached claims.

Claims

1. A camera module, characterized in that: include: Base plate; A lens assembly is connected to the bottom plate, and an installation space is formed between the lens assembly and the bottom plate; A circuit board, comprising a substrate, a first conductor and a second conductor, wherein the first conductor and the second conductor are both arranged on the substrate, the substrate comprises a connected patch portion and an elastic portion, the patch portion is arranged in the installation space, and the patch portion is arranged in a reference plane parallel to the bottom plate and can move in the reference plane; A photosensitive chip is disposed on the patch portion along the optical axis of the lens assembly and is electrically connected to the first conductors; An actuator element is electrically connected to the plurality of second conductors. The actuator element is used to drive the patch portion to move within the reference plane when energized, and to cause the elastic portion to undergo elastic deformation. When the actuator element is de-energized, the elastic portion restores the elastic deformation to drive the patch portion to reset within the reference plane.

2. The camera module according to claim 1, characterized in that: The camera module also includes a plurality of rolling members, wherein the rolling members are disposed between the patch portion and the base plate, the rolling members are mounted on one of the patch portion and the base plate, and are in rolling contact with the other one.

3. The camera module according to claim 2, characterized in that: The rolling element includes a cylindrical ball or a spherical ball.

4. The camera module according to claim 1, characterized in that: The circuit board also includes a connector, which is connected to the end of the elastic part away from the patch part, the first conductor and the second conductor are both electrically connected to the connector, and the connector is used to cooperate with the electrical connection port and position the end of the elastic part away from the patch part at the electrical connection port.

5. The camera module according to claim 1, characterized in that: The actuating element includes a piezoelectric sheet, and the piezoelectric sheet is connected to the surface of the elastic part; or the piezoelectric sheet is embedded in the elastic part.

6. The camera module according to any one of claims 1 to 5, characterized in that: The actuating element includes a coil, and a wiring area is provided at the outer position of the patch part corresponding to the photosensitive chip, and the coil is arranged in the wiring area; the camera module also includes a permanent magnet, and the permanent magnet is arranged in the lens assembly. When the coil is energized, it can interact with the permanent magnet and drive the patch part to move relative to the lens assembly.

7. The camera module according to claim 6, characterized in that: The permanent magnet is opposite to the coil in a direction parallel to the optical axis of the lens assembly, or the permanent magnet is opposite to the coil in a direction parallel to the base plate.

8. The camera module according to claim 6, characterized in that: The coil includes a first coil and a second coil, and the permanent magnet includes a first permanent magnet and a second permanent magnet, the first coil and the second coil correspond to the two side edges adjacent to the photosensitive chip, the first permanent magnet is opposite to the first coil, and the second permanent magnet is opposite to the second coil; wherein, the first coil is used to interact with the first permanent magnet when energized to drive the patch part to translate along a first direction, and the second coil is used to interact with the second permanent magnet when energized to drive the patch part to translate along a second direction, and the first direction intersects with the second direction.

9. The camera module according to claim 6, characterized in that: The patch portion includes a substrate layer, a wiring layer and a protective layer, the wiring layer is arranged between the substrate layer and the protective layer, the coil is arranged in the wiring layer, the patch portion is provided with a plurality of solder pads, a plurality of the solder pads are exposed from the protective layer, one end of a plurality of the first conductors extends to the wiring layer and is connected to the plurality of the solder pads, and the photosensitive chip is electrically connected to the plurality of the solder pads.

10. The camera module according to claim 1, characterized in that: The patch portion and the elastic portion are both in sheet shape, the elastic portion is arranged in the reference plane, and the elastic portion is connected to one side of the patch portion in a first direction, and the actuator element can drive the patch portion to translate along the first direction and / or perpendicular to the first direction when energized.

11. The camera module according to claim 10, characterized in that: The elastic part includes a first elastic body and a second elastic body, the first elastic body has a first end and a second end opposite to each other in the first direction, the first end is connected to the patch part, the second end is connected to the second elastic body, the second elastic body extends along a second direction, and the second direction is perpendicular to the first direction.

12. The camera module according to claim 1, characterized in that: A through hole is provided at the connection position between the lens assembly and the base plate, the elastic part is located outside the installation space, and the substrate also includes a supporting part, which can be movably inserted into the through hole, and two ends of the supporting part are respectively connected to the patch part and the elastic part.

13. The camera module according to claim 12, characterized in that: The elastic portion is bent within the reference plane and can be elastically deformed in a first direction and a second direction, wherein the first direction and the second direction are perpendicular to each other.

14. An electronic device, characterized in that: It comprises a device body and a camera module as described in any one of claims 1 to 13, wherein the camera module is connected to the device body.

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