Manufacturing process of high-performance touch screen circuit board

Abstract

The invention relates to the technical field of circuit board manufacturing, in particular to a manufacturing process of a high-performance touch screen circuit board, which comprises an electroplating rack, a cart, a placing frame, a partition plate and the like, a cart is arranged below the two electroplating racks; a placing frame is fixedly connected to the trolley; a plurality of partition plates are fixedly connected in the placing frame at equal intervals, and a placing space used for placing circuit boards is formed between every two adjacent partition plates. Through cooperation of the electric sliding rail, the electric sliding block, the motor and the electric clamp, clamping of circuit boards is automatically completed, the situation that manual feeding and discharging operation of the circuit boards is conducted for a long time is avoided, the situation that the circuit boards need to be clamped on an electroplating frame one by one is avoided, manual feeding and discharging operation is time-consuming and tedious, and the electroplating efficiency of the circuit boards is reduced; and the circuit boards in the placing frame are clamped in two batches, namely an odd number of batches and an even number of batches, so that the circuit boards in each batch are prevented from being interfered by the circuit boards in the other batch when being clamped.

Description

Technical Field

[0001] The present application relates to the technical field of circuit board manufacturing, and in particular to a manufacturing process for a high-performance touch screen circuit board. Background Art

[0002] When manufacturing high-performance touch screen circuit boards, in order to ensure the high quality and performance of the touch screen circuit boards, it is necessary to complete the electroplating process. At present, the circuit boards on the circuit board cart are usually clamped on the electroplating rack one by one by humans. After the electroplating is completed, the circuit boards are taken down and put back into the circuit board cart manually, resulting in a large workload. In addition, the manual loading and unloading operations of the circuit boards are carried out for a long time, and the manual fatigue leads to the circuit boards not being fixed in place after loading. In addition, since the circuit boards need to be clamped on the electroplating rack one by one, the manual loading and unloading operations are not only time-consuming but also cumbersome, which reduces the electroplating efficiency of the circuit boards. Summary of the invention

[0003] In order to overcome the disadvantage of complicated loading and unloading processes of a circuit board, the present invention provides a manufacturing process for a high-performance touch screen circuit board.

[0004] The technical solution is as follows: A manufacturing process for a high-performance touch screen circuit board includes the following steps: S1: Substrate preparation, cutting the substrate according to the design size, and mechanical drilling or laser drilling according to the drilling file to form through holes and blind holes; S2: Pattern transfer, coating photoresist. Evenly coat the surface of the substrate with photoresist, and transfer the designed pattern to the photoresist through an exposure machine; S3: Etching, using etching solution to remove the exposed copper layer and retain the circuit pattern protected by the photoresist; S4: electroplating, immersing the substrate into the electroplating bath for electroplating through the circuit board electroplating loading and unloading equipment; S5: solder mask and silk screen, silk screen component position marking, company logo and other information to facilitate subsequent assembly and maintenance; S6: Anti-oxidation treatment: Anti-oxidation treatment (such as HASL, ENIG, OSP, etc.) is performed to protect the copper wire from oxidation and ensure good bonding performance; S7: Cutting and forming, VCut or milling processing is performed according to design requirements to separate a single PCB from the panel.

[0005] The circuit board electroplating loading and unloading equipment described in the manufacturing process S4 includes an electroplating rack, a trolley, a placement frame and a partition; a trolley is arranged under the two electroplating racks; a placement frame is fixedly connected to the trolley; a number of partitions are fixedly connected at equal distances in the placement frame, and a placement space for placing circuit boards is formed between two adjacent partitions; it also includes electric slide rails, electric sliders, motors, electric clamps, electric push rods, mounting plates and receiving plates; an electric slide rail is fixedly connected in each electroplating rack; a number of electric sliders are equidistantly slidably connected in each electric slide rail; a motor is fixedly connected to each electric slider; an electric clamp is fixedly connected to each motor output shaft, and the electric clamp is used to clamp the circuit board; two electric push rods are fixedly connected to the left and right sides of the placement frame; the two electric push rods located in front of the placement frame are fixedly connected to a mounting plate; the two electric push rods located behind the placement frame are fixedly connected to another mounting plate; a number of receiving plates are fixedly connected to the two mounting plates at equal distances; each receiving plate is slidably connected to the placement frame; and each receiving plate is located between two adjacent partitions.

[0006] Furthermore, the clamp of the electric clamp is covered with a silicone sleeve.

[0007] Furthermore, the partition is configured to be arc-shaped.

[0008] Furthermore, a tapered groove is provided on the upper portion of the receiving plate.

[0009] Furthermore, it also includes an installation frame and a guide plate; the installation frame is fixedly connected to the placement frame; the guide plate is slidably connected in the installation frame; a plurality of through slots are opened on the guide plate, each through slot is provided with a guide surface on the left and right sides, and a receiving plate is spaced between two adjacent through slots.

[0010] Furthermore, the guide plate is made of silicone rubber.

[0011] Furthermore, handles are provided on the left and right parts of the guide plate.

[0012] Furthermore, it also includes an air pipe and a closing plate; a plurality of air pipes are passed through the rear of the placement frame; a closing plate is slidably connected to the front of the placement frame; and the closing plate is in contact with the guide plate.

[0013] Furthermore, handles are provided on the left and right parts of the closing plate.

[0014] Beneficial effects: 1. The present invention automatically completes the clamping of the circuit board through the cooperation of the electric slide rail, the electric slider, the motor and the electric clamp, avoiding long-term manual loading and unloading operations of the circuit board. Manual fatigue may cause the circuit board to be not fixed in place after loading, and avoiding the need to clamp the circuit boards one by one on the electroplating rack, which makes manual loading and unloading operations not only time-consuming but also cumbersome, reducing the problem of circuit board electroplating efficiency. The circuit boards in the placement frame are clamped in two batches, odd batches and even batches, so that when clamping each batch of circuit boards, interference from another batch of circuit boards is avoided.

[0015] 2. The present invention restricts the circuit board through the through groove on the guide plate, ensuring that the portion of the circuit board protruding from the placement frame is in a vertical state, preventing the upper parts of the two circuit boards from approaching each other, thereby facilitating clamping by the electric clamp. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a schematic diagram of the three-dimensional structure of the circuit board electroplating loading and unloading equipment of the present invention; Figure 2 It is a schematic diagram of the three-dimensional structure of the electroplating rack, electric slide rail, electric slider, motor and electric clamp of the circuit board electroplating loading and unloading equipment of the present invention; Figure 3 It is a schematic diagram of the three-dimensional structure of the installation frame and the guide plate of the circuit board electroplating loading and unloading equipment of the present invention; Figure 4 It is a schematic diagram of the three-dimensional structure of the electric push rod, the mounting plate and the receiving plate of the circuit board electroplating loading and unloading equipment of the present invention; Figure 5 It is a schematic diagram of the three-dimensional structure of the partition of the circuit board electroplating loading and unloading equipment of the present invention; Figure 6 It is a schematic diagram of the three-dimensional structure of the air pipe of the circuit board electroplating loading and unloading equipment of the present invention; Figure 7 It is a schematic diagram of the three-dimensional structure of the closed plate of the circuit board electroplating loading and unloading equipment of the present invention.

[0017] Marked in the figure: 1-plating rack, 2-electric slide rail, 3-electric slider, 4-motor, 5-electric clamp, 6-trolley, 7-placing frame, 8-partition, 9-electric push rod, 10-mounting plate, 11-supporting plate, 12-mounting frame, 13-guide plate, 1301-through groove, 21-trachea, 22-closing plate. DETAILED DESCRIPTION

[0018] The present invention is further described in detail below in conjunction with the accompanying drawings and specific embodiments, but the protection scope and application scope of the present invention are not limited.

[0019] Example 1 A manufacturing process for a high-performance touch screen circuit board comprises the following steps: S1: Substrate preparation, cutting the substrate according to the design size, and mechanical drilling or laser drilling according to the drilling file to form through holes and blind holes; S2: Pattern transfer, coating photoresist. Evenly coat the surface of the substrate with photoresist, and transfer the designed pattern to the photoresist through an exposure machine; S3: Etching, using etching solution to remove the exposed copper layer and retain the circuit pattern protected by the photoresist; S4: electroplating, immersing the substrate into the electroplating bath for electroplating through the circuit board electroplating loading and unloading equipment; S5: solder mask and silk screen, silk screen component position marking, company logo and other information to facilitate subsequent assembly and maintenance; S6: Anti-oxidation treatment: Anti-oxidation treatment (such as HASL, ENIG, OSP, etc.) is performed to protect the copper wire from oxidation and ensure good bonding performance; S7: Cutting and forming, VCut or milling processing is performed according to design requirements to separate a single PCB from the panel.

[0020] like Figure 1-Figure 7 As shown, the circuit board electroplating loading and unloading equipment described in the manufacturing process S4 includes an electroplating rack 1, a trolley 6, a placement frame 7 and a partition 8; a trolley 6 is arranged under the two electroplating racks 1; a placement frame 7 is welded on the trolley 6; a plurality of partitions 8 are welded at equal intervals in the placement frame 7, and a placement space is formed between two adjacent partitions 8; It also includes an electric slide rail 2, an electric slider 3, a motor 4, an electric clamp 5, an electric push rod 9, a mounting plate 10 and a receiving plate 11; each electroplating rack 1 is respectively fixed with an electric slide rail 2; each electric slide rail 2 is respectively slidably connected with a plurality of electric sliders 3; each electric slider 3 is respectively bolted with a motor 4; each motor 4 output shaft is respectively fixed with an electric clamp 5; two electric push rods 9 are respectively fixed with the left and right sides of the placement frame 7; the two electric push rods 9 located in front of the placement frame 7 are jointly fixed with a mounting plate 10; the two electric push rods 9 located behind the placement frame 7 are jointly fixed with another mounting plate 10; a plurality of receiving plates 11 are respectively welded with equal distances on the two mounting plates 10; each receiving plate 11 is slidably connected with the placement frame 7; each receiving plate 11 is located between two adjacent partitions 8.

[0021] In order to prevent the circuit board from being clamped, a silicone sleeve is covered on the clamp of the electric clamp 5.

[0022] In order to reduce the number of partitions 8 used and ensure the separation of the circuit boards, the partitions 8 are configured to be arc-shaped, and a single partition 8 can separate one side of the circuit board.

[0023] In order to prevent the circuit board from sliding left and right, a conical groove is formed on the upper part of the receiving plate 11 .

[0024] It also includes an installation frame 12 and a guide plate 13; the installation frame 12 is welded on the placement frame 7; the guide plate 13 is slidably connected in the installation frame 12; a plurality of through slots 1301 are opened on the guide plate 13, and each through slot 1301 is provided with a guide surface on the left and right sides, and a receiving plate 11 is spaced between two adjacent through slots 1301.

[0025] In order to prevent the circuit board from being scratched, the guide plate 13 is made of silicone rubber.

[0026] In order to facilitate pulling the guide plate 13 , handles are provided on the left and right parts of the guide plate 13 .

[0027] Before use, two electroplating racks 1 are installed on an external electric mobile rack in the electroplating work area, and the external electric mobile rack drives the two electroplating racks 1 to move up and down and move forward and backward, so that the circuit boards on the electroplating racks 1 are immersed in the electroplating tank for electroplating; when the circuit boards are to be electroplated, the placement frame 7 receives the circuit boards that have completed the previous electroplating process, and each circuit board is located between two adjacent partitions 8. Each circuit board is received by a receiving plate 11, and the partitions 8 separate the circuit boards to prevent the circuit boards from rubbing against each other and being damaged during transportation and transfer; then the cart 6 is manually pushed to the side of the electroplating rack 1, and then the electric slide rail 2 and the electric slider 3 are provided. , the motor 4 and the electric clamp 5 are powered on, and the electric moving rack is controlled to drive one of the electroplating racks 1 and its corresponding electric slide rail 2, electric slider 3, motor 4 and electric clamp 5 to move to the top of the placement frame 7, and then the electric slide rail 2 is controlled to drive the electric slider 3 to move, and the first electric clamp 5 is located above the first circuit board placement space, and the second electric clamp 5 is located above the third circuit board placement space, and so on, there is an electric clamp 5 above each odd-numbered placement space, and then the electric push rod 9 in the front is controlled to drive the corresponding mounting plate 10 and the odd-numbered receiving plate 11 to move upward , the odd-numbered receiving plate 11 drives the odd-numbered circuit board it receives to move upward, so that the upper part of the odd-numbered circuit board protrudes out of the placement frame 7. After the upper part of the odd-numbered circuit board protrudes out of the placement frame 7, there is no interference from the even-numbered circuit board on the left and right sides, so that it is easy to be clamped by the electric clamp 5. It should be noted that in order to place as many circuit boards as possible on the cart 6 to improve the utilization rate of the cart 6, the interval between two adjacent partitions 8 will be set as small as possible, which makes the circuit boards close to each other, which is not conducive to the electric clamp 5 to clamp the circuit boards; then the electric moving rack is controlled to drive the electroplating rack 1 located just above the placement frame 7 and its corresponding electric slide rail 2 and electric slider 3. The motor 4 and the electric clamp 5 move downward so that the upper parts of the odd-numbered circuit boards are all located in the clamping area of ​​an electric clamp 5, and then each electric clamp 5 is controlled to clamp the circuit board, and then the electric moving frame is controlled to drive the electroplating rack 1 located directly above the placement frame 7 and its corresponding electric slide rail 2, electric slider 3, motor 4 and electric clamp 5 to move upward and reset, and the electric clamp 5 drives the odd-numbered circuit boards to move upward, and then the electric slide rail 2 is controlled to drive the electric slider 3 to move, so that the distance between the two adjacent electric sliders 3 is pulled apart and reset, and then the motor 4 is controlled to drive the electric clamp 5 and the circuit board to rotate ninety degrees, so that the circuit boards are arranged side by side, such as Figure 2 As shown, it is convenient to enter the electroplating tank for electroplating, thus completing the clamping and loading of the odd-numbered circuit boards.

[0028] Similarly, the electric moving rack is then controlled to drive another electroplating rack 1 and its corresponding electric slide rail 2, electric slider 3, motor 4 and electric clamp 5 to move to the top of the placement frame 7, and then the electric slide rail 2 is controlled to drive the electric slider 3 to move, so that the first electric clamp 5 is located above the second circuit board placement space, the second electric clamp 5 is located above the fourth circuit board placement space, and so on, there is an electric clamp 5 above each even-numbered placement space; then the electric push rod 9 at the rear is controlled to drive the corresponding mounting plate 10 and The receiving plate 11 of the even-numbered position moves upward, and the receiving plate 11 of the even-numbered position drives the circuit board of the even-numbered position it receives to move upward, so that the upper part of the circuit board of the even-numbered position protrudes out of the placement frame 7, so as to be clamped by the electric clamp 5; then the electric moving frame is controlled to drive the electroplating rack 1 and its corresponding electric slide rail 2, electric slider 3, motor 4 and electric clamp 5 located just above the placement frame 7 to move downward, so that the upper part of the circuit board of the even-numbered position is located in the clamping area of ​​an electric clamp 5, and then each electric clamp 5 is controlled to clamp the circuit board, and then the electric moving frame is controlled to drive the electroplating rack 1 and its corresponding electric slide rail 2, electric slider 3, motor 4 and electric clamp 5 located just above the placement frame 7 to move downward, so that the upper part of the circuit board of the even-numbered position is located in the clamping area of ​​​​an electric clamp 5, and then each electric clamp 5 is controlled to clamp the circuit board, and then the electric moving frame is controlled to drive the electroplating rack 1 and its corresponding electric slide rail 2, electric slider 3, motor 4 and electric clamp 5 located just above the placement frame 7 to move downward, so that the upper part of the circuit board of the even-numbered position is located in the clamping area of ​​​​an electric clamp 5, and then the electric clamps 5 are ... The electroplating rack 1 and its corresponding electric slide rail 2, electric slider 3, motor 4 and electric clamp 5 move upward, and the electric clamp 5 drives the even-numbered circuit boards to move upward and reset, and the electric clamp 5 drives the even-numbered circuit boards to move upward, then the electric slide rail 2 is controlled to drive the electric slider 3 to move, so that the distance between the two adjacent electric sliders 3 is pulled apart and reset, and then the motor 4 is controlled to drive the electric clamp 5 and the circuit boards to rotate ninety degrees, so that the circuit boards are arranged side by side, so as to enter the electroplating tank for electroplating, thus completing the clamping and loading of the even-numbered circuit boards; then, the electric moving rack is controlled to move the circuit boards Bring it to the top of the electroplating tank, and then immerse the circuit board into the electroplating tank for electroplating; through the above operation, the circuit board is clamped automatically, avoiding long-term manual loading and unloading operations of the circuit board, manual fatigue resulting in the circuit board not being fixed in place after loading, avoiding the circuit boards to be clamped one by one on the electroplating rack 1, making manual loading and unloading operations not only time-consuming but also cumbersome, reducing the problem of circuit board electroplating efficiency, and the circuit boards in the placement frame 7 are clamped in two batches, odd batches and even batches, so that when each batch of circuit boards is clamped, interference from another batch of circuit boards is avoided.

[0029] Since the touch screen circuit board is usually wide and thin, it is easy to deflect. When the receiving plate 11 pushes the circuit board it receives upward to the protruding placement frame 7, the two adjacent circuit boards may be in an inverted V shape, that is, the upper parts of the two circuit boards are close to each other, which is not conducive to the clamping of the electric clamp 5; therefore, the guide plate 13 is inserted into the installation frame 12 in advance, and then the left side of the guide plate 13 is made to contact the left side of the installation frame 12. At this time, based on the number from left to right, the first through groove 1301 on the guide plate 13 is located directly above the first circuit board placement space, and the second through groove 1301 is located directly above the third circuit board placement space, and so on. There is a through groove 1301 directly above each odd-numbered placement space, and then the odd-numbered receiving plate 11 is controlled to receive the odd-numbered receiving space. The digital circuit board is pushed upward to the protruding placement frame 7, and after moving upward and passing through the guide surface on the lower side of the through slot 1301, it passes through the through slot 1301. The restriction of the through slot 1301 can ensure that the part of the odd-numbered circuit board protruding from the placement frame 7 is in a vertical state, avoiding the upper parts of the two circuit boards from approaching each other, thereby facilitating clamping by the electric clamp 5; after the odd-numbered circuit board is clamped away, the guide plate 13 is manually pulled to the right so that the right side of the guide plate 13 contacts the right side of the installation frame 12. At this time, based on the number from left to right, the first through slot 1301 on the guide plate 13 is located directly above the second circuit board placement space, and the second through slot 1301 is located directly above the fourth circuit board placement space, and so on. There is a through slot 1301 directly above each even-numbered placement space. Figure 4 As shown, the even-numbered circuit boards are then clamped, and the through slots 1301 are also used to limit the even-numbered circuit boards, ensuring that the protruding portion of the placement frame 7 is in a vertical state, thereby preventing the upper portions of the two circuit boards from approaching each other, thereby facilitating clamping by the electric clamp 5.

[0030] After the electroplating is completed, the electric push rod 9 is controlled to drive the mounting plate 10 and the receiving plate 11 to move downward and reset, and then the guide plate 13 is manually pulled out from the mounting frame 12, and the guide plate 13 is folded 180 degrees and then inserted into the mounting frame 12, so that the guide surfaces on both sides of the through slot 1301 face upward, as shown in FIG. Figure 7As shown, similarly, the left side of the guide plate 13 is first contacted with the left side of the installation frame 12, so that, based on the number from left to right, there is a through slot 1301 directly above each odd-numbered placement space; then the electric moving frame is controlled to drive one of the electroplating racks 1 and its corresponding electric slide rail 2, electric slider 3, motor 4 and electric clamp 5 to move directly above the placement frame 7, and then the electric slide rail 2 is controlled to drive the electric slider 3 to move, based on the number from left to right, so that the first electric clamp 5 and the electroplated circuit board clamped therein are located directly above the first circuit board placement space, and the second electric clamp 5 and the electroplated circuit board clamped therein are located directly above the third circuit board placement space. The electric moving rack is controlled to drive the electroplating rack 1, the electric slide rail 2, the electric slider 3, the motor 4, the electric clamp 5 and the circuit board to move downward, so that the circuit board passes through the guide surfaces on both sides of the through slot 1301 and is placed in the placement space. The guide surfaces on both sides of the through slot 1301 can ensure that the skewed circuit board (the touch screen circuit board is usually wide and thin, so it is easy to be skewed, resulting in the lower part of the circuit board not facing the placement space) can also be smoothly placed in the placement space. Then the electric moving rack is controlled to drive the electroplating rack 1, the electric slide rail 2, the electric slider 3, the motor 4, the electric clamp 5 and the circuit board to move downward, so that the circuit board passes through the guide surfaces on both sides of the through slot 1301 and is placed in the placement space. The electric clamp 5 is controlled to release the clamping of the circuit board, and then the electric moving frame is controlled to drive the electroplating rack 1, the electric slide rail 2, the electric slider 3, the motor 4, the electric clamp 5 and the circuit board to move upward and reset; then the electric moving frame is controlled to drive another electroplating rack 1 and its corresponding electric slide rail 2, the electric slider 3, the motor 4 and the electric clamp 5 to move to the top of the placement frame 7, and then the electric slide rail 2 is controlled to drive the electric slider 3 to move, so that the first electric clamp 5 and the electroplated circuit board clamped by it are located above the second circuit board placement space, and the second electric clamp 5 and the electroplated circuit board clamped by it are located above the fourth circuit board placement space. Directly above the placement space, and so on, there is a plated circuit board directly above each even-numbered placement space, and then the electric moving frame is controlled to drive the plating frame 1, the electric slide rail 2, the electric slider 3, the motor 4, the electric clamp 5 and the circuit board to move downward, so that the circuit board passes through the guide surfaces on both sides of the through slot 1301, passes through the through slot 1301 and is placed in the placement space, and then the electric clamp 5 is controlled to release the clamping of the circuit board, and then the electric moving frame is controlled to drive the plating frame 1, the electric slide rail 2, the electric slider 3, the motor 4, the electric clamp 5 and the circuit board to move upward, so that the plated circuit board is put back into the placement frame 7 for subsequent transfer.

[0031] Example 2 On the basis of Example 1, Figure 6 and Figure 7 As shown, it also includes an air tube 21 and a closing plate 22 ; five air tubes 21 run through the rear of the placement frame 7 ; the front of the placement frame 7 is slidably connected to the closing plate 22 ; the closing plate 22 is in contact with the guide plate 13 .

[0032] In order to facilitate lifting the closing plate 22 , handles are provided on the left and right parts of the closing plate 22 .

[0033] An opening is provided at the front of the placement frame 7, so that the circuit board can be taken out manually from the front. Compared with taking out the circuit board from the top, taking out the circuit board from the front is more convenient, avoiding uncomfortable movements such as raising arms or bending over.

[0034] There will be some moisture left on the electroplated circuit board, so it needs to be dried. Usually, the circuit board needs to be transferred from the placement frame 7 to a drying box for drying. In order to save the transfer process and improve the working efficiency, an air pump and an air pipe 21 are provided on the placement frame 7. The air pipe 21 is connected to the air pump. After the electroplated circuit board is put back into the placement frame 7, the closing plate 22 is manually inserted into the front of the placement frame 7, and then the air pump is controlled to pass hot air (the temperature is between 60°C and 120°C. At this temperature, the silicone rubber on each component is not affected) through the air pipe 21 into the space formed by the placement frame 7, the closing plate 22 and the guide plate 13, so as to dry the circuit board in the placement frame 7, and the gas generated by the drying is discharged through the through groove 1301.

[0035] The above embodiments are only for illustrating the technical concept and features of the present invention, and their purpose is to enable people familiar with the technology to understand the content of the present invention and implement it accordingly, and they cannot be used to limit the protection scope of the present invention. Any equivalent changes or modifications made according to the spirit of the present invention should be included in the protection scope of the present invention.

Claims

1. A process for manufacturing a high-performance touch screen circuit board, comprising the following steps: S1: Substrate preparation, cutting the substrate according to the design size, and mechanical drilling or laser drilling according to the drilling file to form through holes and blind holes; S2: Pattern transfer, coating photoresist. Evenly coat the surface of the substrate with photoresist, and transfer the designed pattern to the photoresist through an exposure machine; S3: Etching, using etching solution to remove the exposed copper layer and retain the circuit pattern protected by the photoresist; S4: electroplating, immersing the substrate into the electroplating bath for electroplating through the circuit board electroplating loading and unloading equipment; S5: solder mask and silk screen, silk screen component position marking, company logo and other information to facilitate subsequent assembly and maintenance; S6: Anti-oxidation treatment: Anti-oxidation treatment (such as HASL, ENIG, OSP, etc.) is performed to protect the copper wire from oxidation and ensure good bonding performance; S7: Cutting and forming, VCut or milling processing is performed according to design requirements to separate a single PCB from the panel.

2. The manufacturing process of a high-performance touch screen circuit board according to claim 1 is characterized in that: The circuit board electroplating loading and unloading equipment described in the manufacturing process S4 comprises an electroplating rack (1), a trolley (6), a placement frame (7) and a partition (8); a trolley (6) is arranged below two electroplating racks (1); a placement frame (7) is fixedly connected to the trolley (6); a plurality of partitions (8) are fixedly connected at equal intervals in the placement frame (7), and a placement space for placing the circuit board is formed between two adjacent partitions (8); it also comprises an electric slide rail (2), an electric slider (3), a motor (4), an electric clamp (5), an electric push rod (9), a mounting plate (10) and a receiving plate (11); each electroplating rack (1) is respectively fixedly connected with an electric slide rail (2); each electric slide rail (2) is respectively slidably connected with a plurality of electric sliders (8) at equal intervals. A slider (3); each electric slider (3) is fixedly connected to a motor (4); each motor (4) output shaft is fixedly connected to an electric clamp (5), and the electric clamp (5) is used to clamp a circuit board; two electric push rods (9) are fixedly connected to the left and right sides of the placement frame (7); the two electric push rods (9) located in front of the placement frame (7) are fixedly connected to a mounting plate (10); the two electric push rods (9) located behind the placement frame (7) are fixedly connected to another mounting plate (10); a plurality of receiving plates (11) are fixedly connected to the two mounting plates (10) at equal intervals; each receiving plate (11) is slidably connected to the placement frame (7); and each receiving plate (11) is located between two adjacent partitions (8).

3. The manufacturing process of a high-performance touch screen circuit board according to claim 2, characterized in that: The clamp of the electric clamp (5) is covered with a silicone sleeve.

4. The manufacturing process of a high-performance touch screen circuit board according to claim 2, characterized in that: The partition (8) is arranged in an arc shape.

5. The manufacturing process of a high-performance touch screen circuit board according to claim 2, characterized in that: The upper part of the receiving plate (11) is provided with a tapered groove.

6. The manufacturing process of a high-performance touch screen circuit board according to claim 2, characterized in that: It also includes a mounting frame (12) and a guide plate (13); the mounting frame (12) is fixedly connected to the placement frame (7); the guide plate (13) is slidably connected inside the mounting frame (12); a plurality of through slots (1301) are formed on the guide plate (13), each through slot (1301) is provided with a guide surface on the left and right sides, and a receiving plate (11) is spaced between two adjacent through slots (1301).

7. The manufacturing process of a high-performance touch screen circuit board according to claim 6, characterized in that: The guide plate (13) is made of silicone rubber.

8. The manufacturing process of a high-performance touch screen circuit board according to claim 7, characterized in that: The left and right parts of the guide plate (13) are both provided with handles.

9. The manufacturing process of a high-performance touch screen circuit board according to claim 6, characterized in that: It also includes an air tube (21) and a closing plate (22); a plurality of air tubes (21) penetrate the rear of the placement frame (7); a closing plate (22) is slidably connected to the front of the placement frame (7); and the closing plate (22) is in contact with the guide plate (13).

10. A process for manufacturing a high-performance touch screen circuit board according to claim 9, characterized in that: The left and right parts of the closing plate (22) are both provided with handles.

Images