A laminating device for printed circuit board processing

Abstract

This invention discloses a lamination device for printed circuit board (PCB) processing, belonging to the field of PCB processing technology. It includes a horizontally arranged conveyor platform, with a support frame mounted above the conveyor platform. A lamination moving structure is mounted on the support frame, and a lamination lifting structure is mounted on the lamination moving structure. The lamination lifting structure and the lamination moving structure are slidably coupled, and the lamination lifting structure has a lamination rotating structure. A preheating lamination assembly is located at the front end of the conveyor platform, and a lamination curing assembly for curing the lamination is located at the rear end of the conveyor platform. This invention can laminate the dry film along both the length and width of the substrate, ensuring better adhesion of the dry film to the substrate and preventing it from falling off. It can protect the substrate, facilitate the fabrication of circuit patterns, and improve electrical performance for subsequent processing.

Description

Technical Field

[0001] This invention belongs to the field of printed circuit board processing technology, and particularly relates to a laminating device for printed circuit board processing. Background Technology

[0002] With the rapid development of electronic technology, electronic products are constantly evolving towards miniaturization, multifunctionality, and high performance. This demands that printed circuit boards (PCBs) possess higher precision, smaller linewidths and spacing, and better electrical performance and reliability. Lamination technology, as a key step in the PCB manufacturing process, plays a crucial role in meeting these evolving needs. After lamination, a protective film is formed on the PCB surface, effectively protecting it from physical damage and chemical corrosion during subsequent processing. For example, in drilling and etching processes, this film prevents the PCB surface from being scratched or excessively corroded by etching solutions, ensuring the integrity and reliability of the PCB.

[0003] In existing circuit board lamination processes, the dry film can only be laminated in one direction, such as along the direction of film application. This results in poor adhesion between the dry film and the substrate, affecting the subsequent processing of the circuit board. Summary of the Invention

[0004] This invention provides a laminating device for printed circuit board processing to solve the problems in the prior art.

[0005] The present invention adopts the following technical solution: a laminating device for printed circuit board processing, comprising a horizontally arranged conveyor platform, a support frame mounted above the conveyor platform, a laminating moving structure mounted on the support frame, a laminating lifting structure mounted on the laminating moving structure, the laminating lifting structure and the laminating moving structure being slidably engaged, a laminating rotating structure mounted on the laminating lifting structure, and the laminating rotating structure being rotatably connected to the laminating lifting structure; a preheating laminating assembly is provided at the front end of the conveyor platform, and a laminating curing assembly for curing the laminating film is provided at the rear end of the conveyor platform.

[0006] This invention can perform lamination of the dry film along both the length and width of the substrate, thereby ensuring that the dry film adheres better to the substrate and does not fall off; it can protect the substrate, realize the fabrication of circuit patterns, and improve electrical performance to facilitate subsequent processing.

[0007] Furthermore, the pressing and moving structure includes a first moving motor, a moving plate, a belt, and two rotating screws. The two rotating screws are symmetrically rotatably connected to the support frame. The first moving motor is located on the support frame and is drivenly connected to one of the rotating screws. The belt is sleeved on one end of the two rotating screws, and the moving plate is threadedly connected to the two rotating screws.

[0008] Furthermore, the pressing and moving structure also includes a second moving motor, a horizontal lead screw, a first bevel gear, a second bevel gear, and a slide rod. The moving plate is provided with a mounting block extending to the slide rod, and the mounting block is slidably engaged with the slide rod. The slide rod rotates on the support frame. The second moving motor is located on the support frame and is drivenly connected to the slide rod. The horizontal lead screw is rotatably connected to the moving plate. The first bevel gear is connected to the end of the horizontal lead screw. The second bevel gear is connected to the slide rod and is slidably engaged with the slide rod. The second bevel gear is located inside the mounting block, and the second bevel gear meshes with the first bevel gear.

[0009] Furthermore, the pressing and lifting structure includes a moving block, a lifting electric cylinder, and a lifting frame. The moving block is threadedly connected to a horizontal lead screw. The lifting electric cylinder is connected to the moving block, and the telescopic end of the lifting electric cylinder is connected to the lifting frame. The lifting frame is provided with two lifting rods, and the lifting frame is slidably connected to the moving block through the two lifting rods.

[0010] Furthermore, the film pressing rotation structure includes a rotating motor, a rotating frame, and a film pressing roller. The rotating motor is located on the lifting frame, and the rotating frame is connected to the main shaft of the rotating motor and rotates with the lifting frame. The rotating frame is provided with two sliding grooves, and a slider is provided in the sliding groove. An adjusting electric cylinder is provided in the sliding groove, and the extension end of the adjusting electric cylinder is connected to the slider. Both ends of the film pressing roller are rotatably connected to the two sliders respectively.

[0011] Furthermore, the preheating film pressing assembly includes a film pressing frame, a drive roller, and a drive motor. The film pressing frame is mounted on the feed end above the conveying platform. The drive roller is rotatably connected to the film pressing frame. The drive motor is mounted on the film pressing frame and is connected to the drive roller for transmission. The drive roller is equipped with a heating resistance wire for heating.

[0012] Furthermore, the pressure film curing assembly includes a curing box frame located at the discharge end of the conveying platform, and the curing box frame is equipped with three equally spaced heating fans.

[0013] Furthermore, a temperature sensor is installed inside the curing box.

[0014] The above-described at least one technical solution adopted in the embodiments of the present invention can achieve the following beneficial effects:

[0015] Firstly, during the lamination process of the circuit board, the present invention can perform lamination work along the length direction of the substrate and also along the width direction of the substrate, thereby ensuring that the dry film is better attached to the substrate and will not fall off; it can protect the substrate, realize the fabrication of circuit patterns, improve electrical performance, and facilitate subsequent processing.

[0016] Secondly, during the pressing process, the two adjusting electric cylinders drive the two sliders to move within the two slide grooves, thereby moving the position of the pressing roller. During the pressing process of the dry film and the substrate by the pressing roller, the pressing pressure can be adjusted to make the dry film and the substrate adhere more tightly.

[0017] Applying appropriate pressure ensures a tight bond between the dry film and the substrate, eliminating gaps and air between them. This prevents chemicals such as etching solutions and electroplating solutions from seeping into the gaps during subsequent processing, which could lead to defects in the circuit pattern. Adjusting the pressure also helps ensure uniform adhesion of the dry film across the entire substrate surface. Uneven pressure may result in some areas of poor adhesion while others are subjected to excessive pressure, affecting the performance and lifespan of the dry film. Uniform adhesion guarantees the consistency and quality stability of the circuit pattern. Attached Figure Description

[0018] The accompanying drawings, which are included to provide a further understanding of the invention and form part of this invention, illustrate exemplary embodiments of the invention and are used to explain the invention, but do not constitute an undue limitation of the invention. In the drawings:

[0019] Figure 1 This is a three-dimensional structural diagram of the present invention;

[0020] Figure 2 This is a partial three-dimensional structural diagram of the present invention;

[0021] Figure 3 This is a three-dimensional structural diagram of the pressure membrane moving structure in this invention;

[0022] Figure 4 This is a three-dimensional structural diagram of the pressure film lifting structure and the pressure film rotating structure in this invention;

[0023] Figure 5 for Figure 4 Enlarged view of point A in the middle;

[0024] Figure 6 This is a three-dimensional structural diagram of the preheating and pressing film assembly in this invention;

[0025] Figure 7 This is a three-dimensional structural diagram of the pressure film curing assembly in this invention;

[0026] Figure Labels

[0027] Conveying platform 1, support frame 11, film pressing moving structure 2, first moving motor 21, moving plate 22, belt 23, rotating screw 24, second moving motor 25, horizontal screw 26, first bevel gear 27, second bevel gear 28, slide bar 29, mounting block 290, film pressing lifting structure 3, moving block 31, lifting electric cylinder 32, lifting frame 33, lifting rod 34, film pressing rotating structure 4, rotating motor 41, rotating frame 42, film pressing roller 43, slide groove 44, slider 45, adjusting electric cylinder 46, preheating film pressing assembly 5, drive roller 52, drive motor 53, film pressing curing assembly 6, curing box frame 61, heating fan 62. Detailed Implementation

[0028] To make the objectives, technical solutions, and advantages of this invention clearer, the technical solutions of this invention will be clearly and completely described below in conjunction with specific embodiments and corresponding drawings. Obviously, the described embodiments are only a part of the embodiments of this invention, and not all of them. Based on the embodiments of this invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this invention.

[0029] The technical solutions provided by the various embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

[0030] Reference Figures 1 to 7 As shown, this embodiment of the invention provides a laminating device for printed circuit board processing. The technical solution adopted in this embodiment is as follows: A laminating device for printed circuit board processing includes a horizontally arranged conveyor platform 1. A support frame 11 is mounted above the conveyor platform 1. A laminating moving structure 2 is mounted on the support frame 11. A laminating lifting structure 3 is mounted on the laminating moving structure 2. The laminating lifting structure 3 and the laminating moving structure 2 are slidably coupled. A laminating rotating structure 4 is mounted on the laminating lifting structure 3. The laminating rotating structure 4 and the laminating lifting structure 3 are rotatably connected. A preheating laminating assembly 5 is provided at the front end of the conveyor platform 1, and a laminating curing assembly 6 for curing the laminating film is provided at the rear end of the conveyor platform 1.

[0031] In use, after the dry film is applied to the substrate, the preheating and pressing assembly 5 preheats the dry film. Then, the pressing moving structure 2, pressing lifting structure 3, and pressing rotating structure 4 press the dry film onto the substrate, making the dry film adhere better to the substrate and better cover the substrate. This results in a better bonding effect and prevents phenomena such as edge lifting. Afterward, the pressing curing assembly 6 cures the bonded dry film and the substrate.

[0032] Specifically, the pressing film moving structure 2 includes a first moving motor 21, a moving plate 22, a belt 23 and two rotating screws 24. The two rotating screws 24 are symmetrically rotatably connected to the support frame 11. The first moving motor 21 is located on the support frame 11 and is connected to one of the rotating screws 24 in a transmission manner. The belt 23 is sleeved on one end of the two rotating screws 24. The moving plate 22 is threadedly connected to the two rotating screws 24.

[0033] The pressing film moving structure 2 further includes a second moving motor 25, a horizontal lead screw 26, a first bevel gear 27, a second bevel gear 28, and a slide rod 29. The moving plate 22 is provided with a mounting block 290 extending to the slide rod 29. The mounting block 290 is slidably engaged with the slide rod 29. The slide rod 29 rotates on the support frame 11. The second moving motor 25 is located on the support frame 11 and is drivenly connected to the slide rod 29. The horizontal lead screw 26 is rotatably connected to the moving plate 22. The first bevel gear 27 is connected to the end of the horizontal lead screw 26. The second bevel gear 28 is connected to the slide rod 29 and is slidably engaged with the slide rod 29. The second bevel gear 28 is located inside the mounting block 290, and the second bevel gear 28 meshes with the first bevel gear 27.

[0034] During the process of pressing the dry film and the substrate, the first moving motor 21 drives one of the rotating lead screws 24 to rotate, which in turn drives the other rotating lead screw 24 to rotate on the support frame 11 via the belt 23. The simultaneous rotation of the two rotating lead screws 24 can drive the position of the moving plate 22 to move horizontally. The horizontal movement of the moving plate 22 can drive the position of the pressing roller 43 to rotate, and the dry film and the substrate are pressed along the length of the substrate.

[0035] Then, the pressing and rotating structure 4 drives the pressing roller 43 to rotate 90 degrees. Then, the second moving motor 25 drives the slide bar 29 to rotate on the support frame 11, thereby driving the second bevel gear 28 to rotate, causing the first bevel gear 27 to rotate, thereby driving the horizontal lead screw 26 to rotate on the moving plate 22. This allows the pressing roller 43 to move along the width direction of the substrate, and to perform pressing work on the dry film and the substrate in the width direction of the substrate.

[0036] It should be noted that when the movable plate 22 moves along the position of the rotating screw 24, the second bevel gear 28 also moves along the slide bar 29 following the position of the mounting block 290.

[0037] During the lamination process of circuit boards, the dry film can be laminated both along the length and width of the substrate, ensuring that the dry film adheres better to the substrate and does not fall off. This protects the substrate, facilitates the creation of circuit patterns, and improves electrical performance for subsequent processing.

[0038] After lamination, a robust protective film is formed on the substrate surface, effectively preventing physical damage to the substrate during subsequent processing. For example, it can prevent the substrate from being scratched or damaged by collisions during operations such as handling, drilling, and cutting.

[0039] It isolates the substrate from external chemical substances. During chemical processing such as etching and electroplating, it prevents chemical solutions from directly contacting the substrate, thereby protecting the substrate from corrosion and extending its service life.

[0040] Specifically, the pressing and lifting structure 3 includes a moving block 31, a lifting cylinder 32, and a lifting frame 33. The moving block 31 is threadedly connected to a horizontal lead screw 26. The lifting cylinder 32 is connected to the moving block 31, and the telescopic end of the lifting cylinder 32 is connected to the lifting frame 33. The lifting frame 33 is provided with two lifting rods 34, and the lifting frame 33 is slidably connected to the moving block 31 through the two lifting rods 34.

[0041] The lifting cylinder 32 drives the lifting frame 33 to move on the moving block 31 via two lifting rods 34. During the pressing process, the pressing roller 43 moves above the dry film. After the circuit board is pressed, the lifting cylinder 32 drives the pressing roller 43 to retract so that the subsequent conveying platform 1 can continue to move the circuit board forward and perform pressing operations on other parts of the circuit board.

[0042] Specifically, the film pressing rotation structure 4 includes a rotation motor 41, a rotation frame 42, and a film pressing roller 43. The rotation motor 41 is located on the lifting frame 33. The rotation frame 42 is connected to the main shaft of the rotation motor 41 and the rotation frame 42 is rotatably engaged with the lifting frame 33. The rotation frame 42 is provided with two sliding grooves 44. A slider 45 is provided in the sliding groove 44. An adjusting electric cylinder 46 is provided in the sliding groove 44. The telescopic end of the adjusting electric cylinder 46 is connected to the slider 45. The two ends of the film pressing roller 43 are rotatably connected to the two sliders 45 respectively.

[0043] The rotating motor 41 drives the rotating frame 42 to rotate. Adjusting the angle of the rotating frame 42 can make the rotating frame 42 and the lifting frame 33 parallel or perpendicular, so that the pressure roller 43 can better bond the dry film to the substrate.

[0044] While the film is being pressed, the two adjusting electric cylinders 46 work to drive the two sliders 45 to move within the two slide grooves 44, thereby moving the position of the pressing roller 43. During the pressing process of the dry film and the substrate by the pressing roller 43, the pressing pressure can be adjusted to make the dry film and the substrate fit more tightly.

[0045] Applying appropriate pressure ensures a tight bond between the dry film and the substrate, eliminating gaps and air between them. This prevents chemicals such as etching solutions and electroplating solutions from seeping into the gaps during subsequent processing, which could lead to defects in the circuit pattern. Adjusting the pressure also helps ensure uniform adhesion of the dry film across the entire substrate surface. Uneven pressure may result in some areas of poor adhesion while others are subjected to excessive pressure, affecting the performance and lifespan of the dry film. Uniform adhesion guarantees the consistency and quality stability of the circuit pattern.

[0046] Specifically, the preheating film pressing assembly 5 includes a film pressing frame 51, a film pressing roller 43, and a drive motor 53. The film pressing frame 51 is mounted on the upper feed end of the conveying platform 1. The film pressing roller 43 is rotatably connected to the film pressing frame 51. The drive motor 53 is mounted on the film pressing frame 51 and is connected to the film pressing roller 43 in a transmission manner. The film pressing roller 43 is provided with a heating resistance wire for heating.

[0047] During use, the drive motor 53 drives the pressing roller 43 to rotate on the pressing frame 51, thereby moving the dry film and the substrate forward. During the forward movement, the heating resistance wire heats the pressing roller 43 and preheats the pressing film, so that the dry film can better adhere to the substrate during the subsequent pressing process.

[0048] Specifically, the pressure film curing assembly 6 includes a curing box frame 61, which is located at the discharge end of the conveying platform 1, and three equally spaced heating fans 62 are provided inside the curing box frame 61.

[0049] During the curing process, the circuit board is conveyed to the underside of the curing box 61 via the conveyor platform 1. Then, three heating fans 62 generate heat, causing the curing box 61 to heat up and cure the dry film on the substrate, allowing the dry film to adhere better to the substrate.

[0050] Strong Bonding: After curing, the adhesion between the dry film and the printed circuit board is significantly enhanced. This allows the dry film to adhere tightly to the circuit board surface, making it less prone to detachment during subsequent processing. For example, in the etching process, even when impacted by the etching solution, the cured dry film remains stable, ensuring the integrity of the circuit pattern.

[0051] Resistance to external forces: The cured dry film is better able to resist the effects of mechanical forces, such as friction and scratches. This helps protect the circuit board from damage during production, transportation, and use, improving the reliability of the circuit board.

[0052] Specifically, the curing box 61 is equipped with a temperature sensor; the temperature sensor can monitor the temperature inside the curing box 61 in real time to ensure that the curing temperature is at a constant value and will not be too high or too low, thus affecting the curing of the circuit board.

[0053] The above description is merely an embodiment of the present invention and is not intended to limit the invention. Various modifications and variations can be made to the present invention by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principle of the present invention should be included within the scope of the claims of the present invention.

Claims

1. A laminating device for printed circuit board processing, characterized in that, It includes a horizontally arranged conveyor platform (1), and a support frame (11) is mounted above the conveyor platform (1). The support frame (11) is provided with a film pressing moving structure (2), and the film pressing moving structure (2) is provided with a film pressing lifting structure (3). The film pressing lifting structure (3) and the film pressing moving structure (2) are in sliding cooperation. The pressure film lifting structure (3) is provided with a pressure film rotating structure (4), and the pressure film rotating structure (4) is rotatably connected to the pressure film lifting structure (3); The front end of the conveying platform (1) is provided with a preheating film pressing assembly (5), and the rear end of the conveying platform (1) is provided with a film pressing curing assembly (6) for curing the film. The pressure film moving structure (2) includes a first moving motor (21), a moving plate (22), a belt (23), and two rotating lead screws (24). The two rotating lead screws (24) are symmetrically rotatably connected to the support frame (11). The first moving motor (21) is located on the support frame (11) and is connected to one of the rotating lead screws (24) in a transmission manner. The belt (23) is sleeved on one end of the two rotating screws (24), and the moving plate (22) is threadedly connected to the two rotating screws (24); The pressure film moving structure (2) also includes a second moving motor (25), a horizontal lead screw (26), a first bevel gear (27), a second bevel gear (28), and a slide bar (29). The movable plate (22) is provided with a mounting block (290) extending to the slide rod (29). The mounting block (290) is slidably engaged with the slide rod (29). The slide rod (29) rotates on the support frame (11). The second moving motor (25) is located on the support frame (11) and is connected to the slide rod (29) for transmission. The horizontal lead screw (26) is rotatably connected to the moving plate (22). The first bevel gear (27) is connected to the end of the horizontal lead screw (26), and the second bevel gear (28) is connected to the slide rod (29) with a sliding fit between the second bevel gear (28) and the slide rod (29). The second bevel gear (28) is located inside the mounting block (290), and the second bevel gear (28) meshes with the first bevel gear (27); The pressure film lifting structure (3) includes a moving block (31), a lifting electric cylinder (32), and a lifting frame (33). The movable block (31) is threaded onto the horizontal lead screw (26), and the lifting electric cylinder (32) is connected to the movable block (31), with the telescopic end of the lifting electric cylinder (32) connected to the lifting frame (33). The lifting frame (33) is provided with two lifting rods (34), and the lifting frame (33) is slidably connected to the moving block (31) through the two lifting rods (34); The film pressing rotation structure (4) includes a rotation motor (41), a rotation frame (42), and a film pressing roller (43). The rotating motor (41) is located on the lifting frame (33), and the rotating frame (42) is connected to the main shaft of the rotating motor (41) and the rotating frame (42) and the lifting frame (33) are in rotational engagement. The rotating frame (42) is provided with two sliding grooves (44), and a slider (45) is provided in the sliding groove (44). The groove (44) is equipped with an adjusting electric cylinder (46), the telescopic end of the adjusting electric cylinder (46) is connected to the slider (45), and the two ends of the pressing roller (43) are respectively rotatably connected to the two sliders (45).

2. The laminating device for printed circuit board processing according to claim 1, characterized in that: The preheating film pressing assembly (5) includes a film pressing frame (51), a drive roller (52), and a drive motor (53). The pressing frame (51) is mounted above the feed end of the conveying platform (1), and the drive roller (52) is rotatably connected to the pressing frame (51). The drive motor (53) is mounted on the press frame (51) and is connected to the drive roller (52) for transmission. The drive roller (52) is provided with a heating resistance wire for heating.

3. The laminating device for printed circuit board processing according to claim 1, characterized in that: The pressure curing assembly (6) includes a curing box frame (61), which is located at the discharge end of the conveying platform (1). The curing box frame (61) is equipped with three equally spaced heating fans (62).

4. The laminating device for printed circuit board processing according to claim 3, characterized in that: A temperature sensor is installed inside the curing box (61).

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