Method for processing circuit board with plug-in hole step groove

Abstract

The invention provides a method for processing a circuit board containing a plug-in hole step groove, and belongs to the technical field of printed circuit board production, and the method comprises the steps: processing a first core board and a second core board; a glue blocking film is pasted at the position of the preset step groove in the first core plate; sequentially stacking the first core board, the prepreg and the second core board from bottom to top, and then pressing the first core board, the prepreg and the second core board; a plug-in hole is drilled downwards in the preset position of the first core plate; milling a step groove in alignment with the position of the step groove preset on the first core plate, exposing the glue blocking film, and stripping the glue blocking film; carrying out copper deposition, copper plating and tin plating on the circuit board processed in the step; removing the tin layer and the copper surface on the side wall of the step groove; removing the tin layer at the base material position on the first core plate at the bottom of the step groove to expose a copper surface; and removing the exposed copper surface, and then removing the rest tin layer. The processing method can prevent excessive copper reduction when the redundant copper surface in the step groove is removed from causing corrosion to the core plate pattern at the bottom of the step groove and the hole copper of the plug-in hole.

Description

Technical Field

[0001] The invention belongs to the technical field of printed circuit board production, and is particularly related to a method for processing a circuit board with a plug-in hole step groove. Background Art

[0002] At present, a new type of printed circuit board processing technology is the step groove process. The main feature of the step groove process is to weld components in the step groove opened on the printed circuit board, which can reduce the package size of the circuit board. The existing processing method of the circuit board with the plug-in hole step groove is to first drill the plug-in hole at the preset step groove on the bottom core board, and electroplate the hole, then press the multi-layer circuit board, and then copper sink and electroplate the step groove position, and then remove the copper surface on the side wall of the step groove and the bottom substrate of the step groove by chemical copper reduction. In the copper reduction process, it is easy to reduce copper excessively, causing corrosion to the circuit pattern and plug-in hole copper on the core board at the bottom of the step groove, and there is a risk of product scrapping; and before pressing the circuit board, it is necessary to stick a resist film at the preset step groove position on the bottom core board, so that after the step groove is opened later, the circuit pattern at the step groove of the bottom core board can be quickly exposed by tearing off the resist film. At present, sticking the resist film is usually a manual operation, which is time-consuming and labor-intensive, and it is easy to stick crooked, affecting production efficiency. Therefore, it is necessary to make improvements. Summary of the invention

[0003] In order to solve the above-mentioned defects of the prior art, the present application provides a circuit board processing method containing a plug-in hole step groove, which avoids excessive copper reduction when removing the step groove wall and the copper surface of the substrate at the bottom of the step groove, causing corrosion to the graphics on the core board at the bottom of the step groove and the copper of the plug-in hole.

[0004] In order to achieve the above object, the present invention adopts the following technologies: A method for processing a circuit board having a plug-in hole step groove, comprising: S1, cutting, inner layer circuit, browning are performed in sequence to produce the first core board and the second core board; S2, pasting a glue-blocking film at the position of the preset step groove on the first core plate; S3, stacking the first core board, the prepreg, and the second core board in sequence from bottom to top and pressing them together; S4, drilling a plug-in hole downward at a preset position of the first core board; S5, aligning the top of the second core board downwardly with the position of the preset step groove on the first core board to dig out the step groove, exposing the adhesive film, and peeling off the adhesive film; S6, performing copper deposition, copper plating, and tin plating on the circuit board processed in step S5; S7, removing the tin layer and copper surface of the side wall of the step groove; S8, removing the tin layer above the substrate on the first core board at the bottom of the step groove to expose the copper surface, wherein the substrate is the insulating layer below the circuit pattern on the first core board; S9, removing the copper surface exposed in step S8, and then removing the remaining tin layer.

[0005] Furthermore, in step S7, the tin layer and the copper surface on the side wall of the step groove are removed by gong depth control.

[0006] Furthermore, in step S8, the tin layer at the position of the substrate on the first core board at the bottom of the step groove is removed by laser detinning.

[0007] Furthermore, in step S9, the copper surface exposed in step S8 is removed by etching.

[0008] Furthermore, in step S9, the tin layer on the circuit board is removed by chemical tin stripping.

[0009] Furthermore, in step S2, a film pasting device is used to paste the adhesive-blocking film on the first core board. The film pasting device includes a cutting table, a plurality of adsorption disks, a transfer mechanism, and a conveying mechanism. A plurality of strip grooves are arranged in an array along the length direction on the top of the cutting table. The length direction of the strip grooves is parallel to the width direction of the cutting table. A cutting knife is arranged at one end of each strip groove. The cutting knife has a blade facing the other end of the strip groove. The plurality of cutting knives are fixed on a rotating shaft, which is connected to a rotating mechanism. The rotating mechanism is used to drive the cutting knives to rotate into the strip grooves through the rotating shaft. The conveying mechanism is provided on a side of the cutting table away from the rotating mechanism, and is used to convey the first core board. The adsorption disks are arranged in an array above the support table along the length direction of the support table, and the plurality of adsorption disks are respectively arranged between adjacent strip grooves. The plurality of adsorption disks are connected to a variable distance mechanism. The variable distance mechanism is used to change the spacing between adjacent adsorption disks. The variable distance mechanism is connected to the transfer mechanism. The transfer mechanism is used to drive the variable distance mechanism and the adsorption disk to transfer to a preset position above the conveying mechanism. Pasting the adhesive-blocking film includes the following steps: S21, setting a conveying frame on the conveying mechanism, placing a plurality of first core boards side by side in the conveying frame, and applying adhesive at the positions of the preset step grooves on the first core boards; S22, fixing a roll of adhesive film at one end of the top of the cutting table, and then pulling the adhesive film out a preset distance along the length direction of the cutting table; S23, controlling the transfer mechanism to drive the adsorption plate to move above the adhesive film to adsorb the adhesive film, and controlling the rotation mechanism to drive the cutting knife to rotate toward the strip groove to cut the pulled adhesive film into multiple sections; S24. When the conveying mechanism drives the conveying frame to move to the preset position above the conveying mechanism, the transfer mechanism is controlled to drive the adsorption plate and the multi-segment adhesive film to move toward the preset position above the transfer mechanism, and at the same time, the variable distance mechanism is controlled to increase the distance between the multiple adsorption plates, so as to transfer the multi-segment adhesive film to the position of the preset step grooves on the multiple first core plates.

[0010] Furthermore, a support frame and a guide roller are provided at one end of the cutting table, a fixed shaft is rotatably connected to the support frame for fixing the rolled adhesive film, the guide roller is arranged below the fixed shaft, the axial directions of the guide roller and the fixed shaft are parallel to the width direction of the cutting table, a receiving groove is provided on the top of the cutting table along the length direction, the receiving groove runs through a plurality of strip grooves, a linear mechanism is provided in the receiving groove, the movable end of the linear mechanism is connected to a chuck, and the chuck is used to clamp the adhesive film; The specific steps of step S22 are: fix the rolled rubber-blocking film on the fixed shaft, then wrap the rubber-blocking film around the bottom of the guide roller and pull the rubber-blocking film out to the top of the end of the receiving groove close to the guide roller, control the chuck to clamp the rubber-blocking film, and then control the linear mechanism to drive the chuck to move toward the end of the receiving groove away from the guide roller.

[0011] The beneficial effects of the present invention are: 1. This processing method can avoid excessive copper reduction when removing the copper surface of the step groove wall and the substrate at the bottom of the step groove, which may cause corrosion to the graphics and plug-in hole copper on the core board at the bottom of the step groove.

[0012] 2. Use film pasting equipment to paste the resist film on the first core board. Compared with manual pasting of the resist film, the film pasting equipment can automatically cut the resist film and paste multiple resist films at one time, which can effectively improve the efficiency of film pasting and avoid the situation where the resist film is easily pasted crookedly by manual pasting and affects the subsequent processing flow.

[0013] 3. The cooperation of the chuck and the linear mechanism can automatically and continuously pull out the adhesive film. After the adhesive film is cut, there is no need to manually pull out the adhesive film. The length of the pulled-out adhesive film can be controlled, thereby improving the dimensional accuracy of the cut adhesive film. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 The present invention is a flow chart of a method for processing a circuit board having a plug-in hole step groove in an embodiment of the present application.

[0015] Figure 2 This is a schematic diagram of the structure of the first core board in an embodiment of the present application.

[0016] Figure 3 It is a schematic diagram of the structure after the first core board, the prepreg sheet and the second core board are pressed together in the embodiment of the present application.

[0017] Figure 4This is a schematic diagram of the structure after the circuit board is provided with a plug-in hole in the embodiment of the present application.

[0018] Figure 5 This is a schematic diagram of the structure of the circuit board after a step groove is opened in the embodiment of the present application.

[0019] Figure 6 This is a schematic diagram of the structure of the circuit board after copper plating and tin plating in an embodiment of the present application.

[0020] Figure 7 This is a schematic diagram of the structure of removing the copper surface and tin layer of the side wall of the step groove of the circuit board in an embodiment of the present application.

[0021] Figure 8 This is a schematic diagram of the structure of removing the tin layer at the bottom substrate position of the step groove of the circuit board in an embodiment of the present application.

[0022] Fig. 9 This is a schematic diagram of the structure of the circuit board in an embodiment of the present application with the copper surface of the substrate at the bottom of the step groove removed.

[0023] Fig.10 This is a schematic diagram of the structure of the circuit board after all tin layers are removed in an embodiment of the present application.

[0024] Fig.11 This is a three-dimensional diagram of the overall structure of the film-sticking equipment used in step S2 in the embodiment of the present application.

[0025] Fig.12 This is a stereoscopic diagram of the overall structure of the film-sticking device from another perspective in an embodiment of the present application.

[0026] Fig.13 for Fig.12 Enlarged view of part A in the middle.

[0027] Fig.14 It is a structural stereogram of the cutting table in the embodiment of the present application.

[0028] Fig.15 for Fig.14 Enlarged view of middle C.

[0029] Fig.16 It is a structural stereogram of the linear mechanism and the chuck in the embodiment of the present application.

[0030] Fig.17 This is a structural stereogram of the cutting table from another perspective in the embodiment of the present application.

[0031] Fig.18 for Fig.17 Enlarged view of part B in the middle.

[0032] Reference numerals: first core board-1, prepreg-2, second core board-3, cutting table-4, suction plate-5, transfer mechanism-6, conveying mechanism-7, pitch-changing mechanism-8, first cylinder-9, support frame-10, guide roller-11, linear mechanism-12, chuck-13, step groove-101, adhesive film-102, copper surface-103, tin layer-104, plug-in hole-105, circuit pattern-106, strip groove-401, Cutting knife 402, rotating shaft 403, accommodating groove 404, vertical rod 801, slide rail 802, driving mechanism 803, cross folding rod 804, grid bar 8041, connecting shaft 8042, connecting block 901, fixing seat 902, fixing shaft 1001, motor 1201, screw rod 1202, movable block 1203, lower clamping block 1301, upper clamping block 1302, second cylinder 1303. DETAILED DESCRIPTION

[0033] To make the objectives, technical solutions and advantages of the embodiments of the present invention more clear, the implementation modes of the present invention are described in detail below with reference to the accompanying drawings. However, the embodiments described in the present invention are only part of the embodiments of the present invention, rather than all the embodiments.

[0034] like Figure 1 As shown, this embodiment provides a method for processing a circuit board having a plug-in hole step groove, comprising the following steps: S1, core board processing: cutting, inner layer circuit, browning are performed in sequence to produce the first core board 1 and the second core board 3. The processed first core board 1 is as follows: Figure 2 As shown; S2, pasting a blocking film: pasting a blocking film 102 at the position of the preset step groove 101 on the first core board 1; S3, pressing: Figure 3 As shown, the first core board 1, the prepreg 2, and the second core board 3 are stacked in sequence from bottom to top and then pressed together; S4, drilling: Figure 4 As shown, a plug-in hole 105 is drilled downward at a preset position of the first core board 1; S5, slotting: Figure 5 As shown, the step groove 101 is dug from the top of the second core plate 3 downwardly aligned with the position of the preset step groove 101 on the first core plate 1 to expose the adhesive film 102, and the adhesive film 102 is peeled off; S6, coating processing: Figure 6 As shown, the circuit board processed in step S5 is subjected to copper deposition, copper plating, and tin plating; S7, such as Figure 7 As shown, the tin layer 104 and the copper surface 103 on the side wall of the step groove 101 are removed; S8, such as Figure 8As shown, the tin layer 104 above the substrate on the first core board 1 at the bottom of the step groove 101 is removed to expose the copper surface 103, wherein the substrate is the insulating layer below the circuit pattern 106 on the first core board 1; S9, such as Fig. 9 As shown, the copper surface 103 exposed in step S8 is removed, as shown in FIG. Fig.10 As shown, the remaining tin layer 104 on the circuit board is removed.

[0035] Specifically, in step S7, the tin layer 104 and the copper surface 103 on the side wall of the step groove 101 are removed simultaneously by controlled depth gong, and then in step S8, the tin layer 104 at the substrate position on the first core board 1 at the bottom of the step groove 101 is removed by laser tin removal, and the exposed copper surface 103 is removed by etching after the copper surface 103 is exposed, because the unremoved tin layer 104 can protect the copper surface 103 below it, and the etching process can be avoided to cause corrosion to the circuit pattern 106 at the bottom of the step groove 101 and the hole copper in the plug-in hole 105. Finally, the tin layer 104 used for copper surface protection on the circuit board is quickly removed by chemical tin stripping to complete the processing.

[0036] Example 2 like Figure 11-Figure 18 As shown, this embodiment provides a film pasting device, including a cutting table 4, multiple adsorption plates 5, a transfer mechanism 6, a conveying mechanism 7, etc., which is applied in Example 1 to paste the adhesive resistance film 102 at the position of the preset step groove 101 on the first core board 1.

[0037] Specifically, a plurality of strip grooves 401 are arranged in an array along the length direction on the top of the cutting table 4, the length direction of the strip grooves 401 is parallel to the width direction of the cutting table 4, a cutting knife 402 is arranged at one end of the strip grooves 401, and the blade of the cutting knife 402 is arranged toward the other end of the strip grooves 401, and the plurality of cutting knives 402 are fixed on a rotating shaft 403, the axial direction of the rotating shaft 403 is parallel to the length direction of the cutting table 4, and the rotating shaft 403 is connected to a rotating mechanism, and the rotating mechanism is used to drive the cutting knife 402 to rotate into the strip groove 401 through the rotating shaft 403, so as to cut the adhesive film 102 placed on the cutting table 4 into Several sections matching the size of the step groove 101; the conveying mechanism 7 is arranged on the side of the cutting table 4 away from the rotating mechanism, and is used to convey the first core plate 1; the adsorption discs 5 are arranged in an array above the support table along the length direction of the support table, and multiple adsorption discs 5 are respectively arranged between adjacent strip grooves 401, and are used to adsorb multiple adhesive blocking films 102 after being cut, and multiple adsorption discs 5 are connected to a distance-changing mechanism 8, and the distance-changing mechanism 8 is used to change the distance between adjacent adsorption discs 5, and the distance-changing mechanism 8 is connected to the transfer mechanism 6, and the transfer mechanism 6 is used to drive the distance-changing mechanism 8 and the adsorption discs 5 to transfer to the preset position above the conveying mechanism 7. When the distance between adjacent adsorption discs 5 is changed by the distance-changing mechanism 8 to a certain limit, the distance between the adhesive blocking films 102 adsorbed on the bottom of the adjacent adsorption discs 5 matches the distance between the positions of the preset step grooves 101 on the two first core plates 1 arranged side by side. When the transfer mechanism 6 is used to drive the variable distance mechanism 8 and the adsorption plate 5 to transfer to the preset position above the conveying mechanism 7, the adhesive resistance film 102 adsorbed on the bottom of the adsorption plate 5 can just be aligned with the step groove 101 of the multiple first core boards 1 conveyed on the transfer mechanism 6, completing the pasting of the adhesive resistance film 102.

[0038] In Example 1, a resist film 102 is pasted at the position of the preset step groove 101 on the first core board 1, which specifically includes the following steps: S21, a conveying frame 14 is set on the conveying mechanism 7, a plurality of first core boards 1 are placed side by side in the conveying frame 14, and adhesive is applied at the position of the preset step groove 101 on the first core board 1. Specifically, the inner size of the conveying frame 14 can be set to match the overall size of the plurality of first core boards 1 placed therein; S22, a roll of resist film 102 is fixed at one end of the top of the cutting table 4, and then the resist film 102 is pulled out a preset distance along the length direction of the cutting table 4. Specifically, the width of the used roll of resist film 102 matches the width of the step groove 101; S 23. Control the transfer mechanism 6 to drive the adsorption plate 5 to move above the adhesive film 102 to adsorb the adhesive film 102, and control the rotating mechanism to drive the cutting knife 402 to rotate toward the strip groove 401, and cut the pulled adhesive film 102 into multiple sections of adhesive film 102 that match the shape and size of the step groove 101; S24. When the conveying mechanism 7 drives the conveying frame 14 to move to the preset position above the conveying mechanism 7, control the transfer mechanism 6 to drive the adsorption plate 5 and the multiple sections of adhesive film 102 to move toward the preset position above the transfer mechanism 6, and at the same time control the variable distance mechanism 8 to increase the distance between the multiple adsorption plates 5, and transfer the multiple sections of adhesive film 102 to the positions of the preset step grooves 101 on the multiple first core plates 1. Compared with manually pasting the adhesive film 102, the device can paste multiple adhesive films 102 at a time, which can effectively improve the film pasting efficiency, and can solve the problem that the manually pasted adhesive film 102 is easy to be pasted crooked and affect the subsequent processing flow.

[0039] For details, see Fig.12 , Fig.13The pitch-changing mechanism 8 includes a plurality of vertical rods 801, a slide rail 802, a pushing mechanism 803, and a plurality of groups of cross-folding rods 804 hinged at the head and tail, each of the plurality of cross-folding rods 804 includes a pair of cross-arranged bars 8041, a pair of bars 8041 is connected by a connecting shaft 8042, a plurality of connecting shafts 8042 are respectively connected to the plurality of vertical rods 801, the bottoms of the plurality of vertical rods 801 are respectively connected to the plurality of adsorption disks 5, a top of one of the vertical rods 801 is fixedly connected to the slide rail 802, the tops of the remaining vertical rods 801 are all slidably connected to the slide rail 802, the slide rail 802 is connected to the transfer mechanism 6, the vertical rod 801 fixedly connected to the slide rail 802 is connected to the fixed end of the pushing mechanism 803, and the connecting shaft 804 connected to any one of the vertical rods 801 slidably connected to the slide rail 802 2 is connected to the telescopic end of the pushing mechanism 803, and the telescopic direction of the telescopic end of the pushing mechanism 803 is parallel to the length direction of the cutting table 4. When the telescopic end of the pushing mechanism 803 is pushed out, the multiple groups of cross-folding rods 804 will rotate synchronously, so that the distance between adjacent connecting shafts 8042 increases, thereby driving the distance between adjacent vertical rods 801 to increase, so that a certain distance is generated between the adhesive resistance films 102 adsorbed on the bottom of the adsorption plate 5, which matches the distance between the positions of the preset step grooves 101 on the adjacent first core plates 1 placed side by side. When the telescopic end of the pushing mechanism 803 is retracted, the distance between the adjacent connecting shafts 8042 will decrease, and the vertical rods 801 and the adsorption plate 5 will return to the initial position, which is convenient for the next time to press the adhesive resistance film 102 and drive the transfer of the adhesive resistance film 102. The specific steps of controlling the variable distance mechanism 8 to increase the distance between the multiple adsorption plates 5 in step S14 are: controlling the telescopic end of the pushing mechanism 803 to push out the preset distance.

[0040] Preferably, see Figure 14-17A support frame 10 and a guide roller 11 are provided at one end of the cutting table 4. A fixed shaft 1001 is rotatably connected to the support frame 10 for fixing a rolled adhesive film 102. The guide roller 11 is provided below the fixed shaft 1001. The axial directions of the guide roller 11 and the fixed shaft 1001 are parallel to the width direction of the cutting table 4. In actual use, the rolled adhesive film 102 is pulled out, bypassed from the bottom of the guide roller 11, and pulled out to a certain length, so that the adhesive film 102 can be pulled out along the fixed direction of the length direction of the cutting table 4. A receiving groove 404 is provided on the top of the cutting table 4 along the length direction. The receiving groove 404 runs through a plurality of strip grooves 401. A linear mechanism 12 is provided in the receiving groove 404. The movable end of the linear mechanism 12 is connected to the A chuck 13 is connected, and the chuck 13 can be a pneumatic chuck 13, which is used to clamp the adhesive film 102. When the adhesive film 102 needs to be pulled out, the end of the adhesive film 102 to be pulled out is first placed above the end of the accommodating groove 404 close to the guide roller 11, and then the linear mechanism 12 is controlled to drive the chuck 13 to move toward the guide roller 11 to clamp the end of the pulled-out part of the rolled adhesive film 102. Finally, the linear mechanism 12 is controlled to drive the chuck 13 to move to the end of the accommodating groove 404 away from the guide roller 11 to pull out the adhesive film 102. Subsequently, the cutting knife 402 cuts the adhesive film 102, and the transfer mechanism 6 transfers the adhesive film 102. The above steps are repeated to continuously and automatically pull out the adhesive film 102.

[0041] The specific steps of step S22 are: fix the rolled adhesive film 102 on the fixed shaft 1001, then wrap the adhesive film 102 around the bottom of the guide roller 11 and pull the adhesive film 102 out to the top of the end of the accommodating groove 404 close to the guide roller 11, control the chuck 13 to clamp the adhesive film 102, and then control the linear mechanism 12 to drive the chuck 13 to move toward the end of the accommodating groove 404 away from the guide roller 11.

[0042] Specifically, in order to prevent the rolled adhesive film from rotating due to the tension when the cutting knife 402 cuts the pulled out adhesive film 102, thereby affecting the subsequent clamping of the adhesive film by the chuck, a clamping mechanism can be set on the support frame 10 to limit the rotation of the fixed shaft 1001. In step S23, when cutting the adhesive film 102, the clamping mechanism is controlled to clamp the fixed shaft 1001 so that it cannot rotate. In step S22, when pulling out the adhesive film 102, the locking mechanism is controlled to cancel the clamping of the fixed shaft 1001.

[0043] For details, see Fig.15 , Fig.16The linear mechanism 12 includes a motor 1201, a screw rod 1202, and a movable block 1203. The screw rod 1202 is rotatably connected to both ends of the receiving groove 404. The output shaft of the motor 1201 is connected to one end of the screw rod 1202. The movable block 1203 is threadedly connected to the screw rod 1202, and the movable block 1203 is slidably arranged in the receiving groove 404 along the length direction of the receiving groove 404. The chuck 13 includes a lower clamping block 1301, an upper clamping block 1302, The second cylinder 1303, the lower clamping block 1301 is fixed to the side of the movable block 1203 away from the motor 1201, the top height of the lower clamping block 1301 matches the top height of the cutting table 4, the upper clamping block 1302 is arranged above the lower clamping block 1301, and the upper clamping block 1302 is connected to the telescopic end of the second cylinder 1303, the telescopic direction of the telescopic end of the second cylinder 1303 is the vertical direction, and the fixed end of the second cylinder 1303 is connected to the movable block 1203. In step S22, the step of pulling out the adhesive film 102 is as follows: control the telescopic end of the second cylinder 1303 to move downward, so that the upper clamping block 1302 and the lower clamping block 1301 clamp the adhesive film 102, and then control the motor 1201 to drive the screw rod 1202 to rotate, so that the movable block 1203 moves toward the end of the accommodating groove 404 away from the guide roller 11.

[0044] For details, see Fig.17 , Fig.18 The rotating mechanism includes a first cylinder 9 and a connecting block 901. The bottom of the first cylinder 9 is hinged to a fixed seat 902. The telescopic end of the first cylinder 9 is hinged to the connecting block 901. The connecting block 901 is connected to the rotating shaft 403. When the telescopic end of the first cylinder 9 is pushed out, the cutting knife 402 rotates into the strip groove 401. When the telescopic end of the first cylinder 9 is retracted, the cutting knife 402 rotates upward to leave the strip groove 401. The specific steps of controlling the rotating mechanism to drive the cutting knife 402 to rotate toward the strip groove 401 in step S23 are: controlling the telescopic end of the first cylinder 9 to be pushed out.

[0045] For details, see Fig.11 , Fig.12 The transfer mechanism 6 selects the PPU manipulator, and the PPU manipulator is arranged above the cutting table 4 and the conveying mechanism 7. The grabbing end of the PPU manipulator is connected to the pitch changing mechanism 8, which is used to drive the pitch changing mechanism 8 to realize an inverted U-shaped moving trajectory, and transfer the adhesive film 102 above the cutting table 4 to the first core board 1 conveyed by the conveying mechanism 7.

[0046] The above description is only a preferred embodiment of the present invention, and is not intended to be the only one or to limit the present invention. Those skilled in the art should understand that various changes or equivalent substitutions made to the present invention without departing from the scope of the present invention are within the scope of protection of the present invention.

Claims

1. A method for processing a circuit board having a plug-in hole step groove, characterized in that: The following steps are involved: S1, cutting, inner layer circuitry, and browning are performed in sequence to produce a first core board (1) and a second core board (3); S2, pasting a glue-blocking film (102) at the position of the preset step groove (101) on the first core board (1); S3, stacking the first core board (1), the prepreg (2), and the second core board (3) in sequence from bottom to top and pressing them together; S4, drilling an insert hole (105) downward at a preset position of the first core plate (1); S5, aligning downward from the top of the second core board (3) with the position of the preset step groove (101) on the first core board (1), cutting out the step groove (101), exposing the adhesive resistance film (102), and peeling off the adhesive resistance film (102); S6, performing copper deposition, copper plating, and tin plating on the circuit board processed in step S5; S7, removing the tin layer (104) and the copper surface (103) on the side wall of the step groove (101); S8, removing the tin layer (104) above the substrate on the first core board (1) at the bottom of the step groove (101) to expose the copper surface (103), wherein the substrate is the insulating layer below the circuit pattern (106) on the first core board (1); S9, removing the copper surface (103) exposed in step S8, and then removing the remaining tin layer (104).

2. A method for processing a circuit board having a plug-in hole step groove according to claim 1, characterized in that: In step S7, the tin layer (104) and the copper surface (103) on the side wall of the step groove (101) are removed by gong using a controlled depth gong method.

3. A method for processing a circuit board having a plug-in hole step groove according to claim 1, characterized in that: In step S8, the tin layer (104) at the position of the substrate on the first core board (1) at the bottom of the step groove (101) is removed by laser detinning.

4. A method for processing a circuit board having a plug-in hole step groove according to claim 1, characterized in that: In step S9, the copper surface (103) exposed in step S8 is removed by etching.

5. A method for processing a circuit board having a plug-in hole step groove according to claim 1, characterized in that: In step S9, the tin layer on the circuit board is removed by chemical tin stripping.

6. A method for processing a circuit board having a plug-in hole step groove according to claim 1, characterized in that: In step S2, a film laminating device is used to paste the adhesive-blocking film (102) on the first core board (1). The film laminating device comprises a cutting table (4), a plurality of adsorption plates (5), a transfer mechanism (6), and a conveying mechanism (7). A plurality of strip grooves (401) are arranged in an array along the length direction on the top of the cutting table (4). The length direction of the strip grooves (401) is parallel to the width direction of the cutting table (4). A cutting knife (402) is arranged at one end of the strip grooves (401). The cutting edge of the cutting knife (402) is arranged toward the other end of the strip groove (401). The plurality of cutting knives (402) are fixed on a rotating shaft (403). The rotating shaft (403) is connected to a rotating mechanism. The rotating mechanism is used to drive the cutting knives (402) to rotate through the rotating shaft (403). The cutting knife (402) rotates into the strip groove (401); the conveying mechanism (7) is arranged on a side of the cutting table (4) away from the rotating mechanism, and is used to convey the first core plate (1); the adsorption discs (5) are arranged in an array above the support table along the length direction of the support table, and the plurality of adsorption discs (5) are respectively arranged between adjacent strip grooves (401); the plurality of adsorption discs (5) are connected to a variable distance mechanism (8), the variable distance mechanism (8) is used to change the spacing between adjacent adsorption discs (5), the variable distance mechanism (8) is connected to a transfer mechanism (6), and the transfer mechanism (6) is used to drive the variable distance mechanism (8) and the adsorption discs (5) to transfer to a preset position above the conveying mechanism (7); pasting the adhesive blocking film (102) comprises the following steps: S21, arranging a conveying frame on the conveying mechanism (7), placing a plurality of first core plates (1) side by side in the conveying frame, and applying adhesive at the positions of the preset step grooves (101) on the first core plates (1); S22, fixing the rolled adhesive film (102) at one end of the top of the cutting table (4), and then pulling the adhesive film (102) out by a preset distance along the length direction of the cutting table (4); S23, controlling the transfer mechanism (6) to drive the adsorption plate (5) to move above the adhesive resistance film (102) to adsorb the adhesive resistance film (102), and controlling the rotation mechanism to drive the cutting knife (402) to rotate toward the strip groove (401), so as to cut the pulled adhesive resistance film (102) into a plurality of sections; S24. When the conveying mechanism (7) drives the conveying frame to move to a preset position above the conveying mechanism (7), the transfer mechanism (6) is controlled to drive the adsorption plate (5) and the multi-segment adhesive film (102) to move toward the preset position above the transfer mechanism (6), and at the same time, the variable distance mechanism (8) is controlled to increase the distance between the multiple adsorption plates (5), so as to transfer the multi-segment adhesive film (102) to the position of the preset step groove (101) on the multiple first core plates (1).

7. A method for processing a circuit board having a plug-in hole step groove according to claim 6, characterized in that: A support frame (10) and a guide roller (11) are provided at one end of the cutting table (4); a fixed shaft (1001) is rotatably connected to the support frame (10) for fixing a rolled adhesive film (102); the guide roller (11) is provided below the fixed shaft (1001); the axial directions of the guide roller (11) and the fixed shaft (1001) are parallel to the width direction of the cutting table (4); a receiving groove (404) is provided at the top of the cutting table (4) along the length direction; the receiving groove (404) passes through a plurality of strip grooves (401); a linear mechanism (12) is provided in the receiving groove (404); a movable end of the linear mechanism (12) is connected to a chuck (13); the chuck (13) is used to clamp the adhesive film (102); The specific steps of step S22 are: fixing the rolled adhesive film (102) on the fixed shaft (1001), then winding the adhesive film (102) around the bottom of the guide roller (11) and pulling the adhesive film (102) out to the top of one end of the receiving groove (404) close to the guide roller (11), controlling the chuck (13) to clamp the adhesive film (102), and then controlling the linear mechanism (12) to drive the chuck to move toward one end of the receiving groove (404) away from the guide roller (11).

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