Coil component

Abstract

Provided is a coil component capable of improving stability when a core is disposed on a plurality of substrates. This coil component is provided with a plurality of substrates, a core material, and a support member. Each of the plurality of substrates has a coil pattern. The plurality of substrates overlap each other with a gap therebetween in the thickness direction. The core material is disposed on each of the plurality of substrates. The support member engages with the outer peripheral portions of the plurality of substrates and supports the plurality of substrates so as to maintain the gap.

Description

Technical Field

[0001] The present disclosure relates to a coil component including a substrate and a core arranged on the substrate. Background Art

[0002] Patent Document 1 discloses a transformer as an example of a coil component including a substrate and a core arranged on the substrate.

[0003] The transformer disclosed in Patent Document 1 is composed of a winding formed by winding a conductive foil on a printed circuit board and an EIR core formed by combining an ER core and an I core. The ER core is composed of a flat plate, a central leg protruding from the central portion of the flat plate, and outer leg protruding from both ends of the flat plate. The central leg is inserted through the central leg insertion hole of the printed circuit board, and the outer leg is inserted through the outer leg insertion hole of the printed circuit board. The I core is arranged at a position opposite to the ER core across the printed circuit board. As a result, the printed circuit board is clamped by the ER core and the I core.

[0004] Prior art literature

[0005] Patent Literature

[0006] Patent Document 1: Japanese Patent No. 5788012 Summary of the invention

[0007] Problems to be solved by the invention

[0008] There is a coil component in which cores are arranged on a plurality of substrates that overlap with each other at intervals. For example, in the case where the coil component (transformer) disclosed in Patent Document 1 is provided with a plurality of printed substrates, the legs of the ER core are inserted through insertion holes formed in each printed substrate. At this time, the coil component may wobble due to the relative position offset between the plurality of substrates and the relative position offset between at least one of the plurality of substrates and the core. In a coil component in which cores are arranged on a plurality of substrates, there are more locations where relative position offset occurs than in a coil component in which a core is arranged on one substrate, and therefore, it is difficult to stabilize the coil component.

[0009] Therefore, an object of the present disclosure is to solve the above-mentioned problems and to provide a coil component capable of improving stability when cores are arranged on a plurality of substrates.

[0010] Means for solving problems

[0011] A coil component of one embodiment of the present invention comprises: a plurality of substrates, each having a coil pattern, which are overlapped with a gap in the thickness direction; a core material, which is arranged on the plurality of substrates; and a supporting component, which is engaged with the outer periphery of the plurality of substrates to support the plurality of substrates in a manner maintaining the gap.

[0012] Effects of the Invention

[0013] According to the present disclosure, it is possible to provide a coil component capable of improving stability when cores are arranged on a plurality of substrates. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a perspective view schematically showing a coil component according to one embodiment of the present disclosure.

[0015] Figure 2 yes Figure 1 An exploded perspective view of the coil assembly is shown.

[0016] Figure 3 yes Figure 1 A front view of the coil assembly is shown.

[0017] Figure 4 is Figure 3 The coil component shown is a front view in which the supporting component is exploded from other parts.

[0018] Figure 5 It is a side view schematically showing a support member according to a modified example.

[0019] Figure 6 is Figure 3 The supporting component is replaced by a front view of a supporting component of a modified example in the front view.

[0020] Figure 7 It is a perspective view schematically showing a coil component according to a modified example of one embodiment of the present disclosure. DETAILED DESCRIPTION

[0021] Figure 1 It is a perspective view schematically showing a coil component according to one embodiment of the present disclosure. Figure 2 yes Figure 1 An exploded perspective view of the coil assembly is shown. Figure 3 yes Figure 1 A front view of the coil assembly is shown. Figure 4 is Figure 3 The front view of the coil component shown in the figure is obtained by decomposing the support component from other parts. In the following description, when indicating directions, the X, Y, and Z directions shown in each figure are used. The X direction, the Y direction, and the Z direction represent the directions of the arrows in each figure, and the opposite directions of the X direction, the Y direction, and the Z direction represent the directions opposite to the arrows in each figure.

[0022] like Figure 1As shown, the coil component 10 is formed by arranging a core material 30 on a plurality of substrates 20. In the present embodiment, the coil component 10 is a transformer. In addition, the coil component 10 is not limited to a transformer as long as it is a structure in which a core material 30 is arranged on a plurality of substrates 20. For example, the coil component 10 may also be a choke coil.

[0023] like Figures 1 to 4 As shown, the coil component 10 includes a plurality of substrates 20 , a core material 30 arranged on the plurality of substrates 20 , and a support member 40 that supports the plurality of substrates 20 .

[0024] In the present embodiment, the coil component 10 has three substrates 20 (substrate 21, substrate 22, and substrate 23). However, the number of substrates 20 provided by the coil component 10 is not limited to three. The coil component 10 may also have two substrates 20, or may have four or more substrates 20. In the following description, the substrate 21, substrate 22, and substrate 23 are collectively referred to as the substrate 20.

[0025] Each substrate 21, 22, 23 includes a base made of an insulator and a conductive wiring pattern formed on at least one of the surface and the inside of the base. The base is made of, for example, ceramic, glass epoxy resin, paper phenolic, etc. The wiring pattern is conductive and is made of, for example, metal such as copper.

[0026] like Figure 1 and Figure 3 As shown, the substrates 20 are overlapped with gaps 20A in the order of substrates 22, 23, and 21 along the Z direction. The Z direction is an example of the thickness direction of the substrate 20. The gap 20A between the substrates 22 and 23 and the gap 20A between the substrates 23 and 21 may be equal or different.

[0027] like Figure 2 As shown, each substrate 21, 22, 23 has four convex portions 24. Two of the four convex portions 24 protrude in the X direction from a side surface (a part of an outer side surface 20B described later) constituting an end portion in the X direction of each substrate 21, 22, 23, and are provided with a gap 24A spaced apart from each other in the Y direction. The other two of the four convex portions 24 protrude in a direction opposite to the X direction from an end portion in a direction opposite to the X direction of each substrate 21, 22, 23, and are provided with a gap 24A spaced apart from each other in the Y direction.

[0028] Each substrate 21, 22, 23 has a through hole 20C, 20D for the core material 30 to pass through. The through hole 20D is provided in the central portion of each substrate 21, 22, 23. The through hole 20C is provided on both sides of the through hole 20D in the X direction. In other words, one of the through holes 20C is located at a position closer to the X direction side than the through hole 20D, and the other through hole 20C is located at a position closer to the direction side opposite to the X direction than the through hole 20D. In further other words, the two through holes 20C are separated by the through hole 20D in the X direction. In the present embodiment, the through hole 20C is connected to the gap 24A between the two protrusions 24.

[0029] Each substrate 21, 22, 23 has a coil pattern 25 constituting a coil. The coil pattern 25 corresponds to at least a part of the aforementioned wiring pattern. Although not shown, each substrate 21, 22, 23 may have a wiring pattern other than the coil pattern 25.

[0030] The coil pattern 25 is provided on the surface of each substrate 21, 22, 23, and is connected to the wiring pattern (not shown) provided inside each substrate 21, 22, 23 by means of the via 26. The via 62 is conductive. The via 62 is formed by laminating a metal such as copper on the inner side surface of the hole provided along the Z direction on each substrate 21, 22, 23. The hole may penetrate each substrate 21, 22, 23 or may not penetrate. The coil pattern 25 is formed in a spiral shape around the through hole 20D of each substrate 21, 22, 23.

[0031] In this embodiment, the coil pattern 25 provided on the substrate 21 and the coil pattern 25 provided on the substrate 22 function as the input side coil (primary coil) of the transformer. The primary coil and its peripheral circuit are provided on the substrates 21 and 22. That is, the substrates 21 and 22 are primary substrates of the transformer.

[0032] In this embodiment, the coil pattern 25 provided on the substrate 23 functions as an output side coil (secondary coil) of the transformer. The secondary coil and its peripheral circuit are provided on the substrate 23. That is, the substrate 23 is a primary substrate of the transformer. The substrate 23 is larger than the substrate 21 and the substrate 22.

[0033] The size, shape and other structures of each substrate 21, 22, 23 are not limited to Figures 1 to 4 Regarding the size of substrate 21, substrate 22, and substrate 23, for example, Figures 1 to 4 In the embodiment, substrate 23 is larger than substrate 21 and substrate 22, but substrate 23 may be smaller than substrate 21 and substrate 22. Regarding the shapes of substrates 21, 22, and 23, for example, Figure 1 and Figure 2In the embodiment, the substrates 21, 22, and 23 respectively include the convex portions 211, 221, and 231, but the substrates 21, 22, and 23 may not include the convex portions 211, 221, and 231. For example, the coil pattern 25 may also be provided inside the substrates 21, 22, and 23. Also, for example, the through hole 20C and the gap 24A may not be connected to each other. In this case, the coil pattern 25 may also be formed around the through hole 20C.

[0034] like Figure 3 and Figure 4 As shown, the core material 30 is disposed on the three substrates 21, 22, and 23. In the present embodiment, only the core material 30 is mounted on the three substrates 21, 22, and 23, but electronic components other than the core material 30 (eg, resistors, capacitors, inductors, etc.) may be mounted.

[0035] The core material 30 is made of a magnetic material. For example, the core material 30 is made of ferrite. In addition, the material of the core material 30 is not limited to ferrite. For example, the core material 30 may also be made of a silicon steel plate.

[0036] like Figure 2 As shown, the core material 30 includes a first core 31 and a second core 32. In the present embodiment, the first core 31 is an E-type core. The second core 32 is an I-type core. That is, in the present embodiment, the core material 30 is an EI-type core formed by combining the first core 31 and the second core 32. In addition, the first core 31 and the second core 32 are combined by known means such as interlocking, adhesives, and fixings.

[0037] The first core 31 includes a main body 311 , two outer legs 312 protruding from both ends of the main body 311 in the X direction, and a middle leg 313 protruding from the main body 311 between the two outer legs 312 .

[0038] like Figure 3 and Figure 4 As shown, the main body 311 as a part of the first core 31 is located on one side of the three substrates 21, 22, 23 in the Z direction. Each outer leg 312 passes through the through hole 20C of each substrate 21, 22, 23. The middle leg 313 passes through the through hole 20D of each substrate 21, 22, 23. The protruding ends of the two outer legs 312 and the middle leg 313 are in contact with the second core 32. The second core 32 is located on the other side of the three substrates 21, 22, 23 in the Z direction. As a result, the three substrates 21, 22, 23 are clamped between the main body 311 of the first core 31 and the second core 32.

[0039] In the present embodiment, the first core 31 is an E-type core and the second core 32 is an I-type core, but the opposite may be true. That is, the first core 31 may be an I-type core and the second core 32 may be an E-type core. In this case, the entire first core 31 is located on one side of the substrate 20 in the Z direction, while a portion of the second core 32 is located on the other side of the substrate 20 in the Z direction.

[0040] As described above, at least a portion of the first core 31 is located on one side of the substrates 20 in the Z direction, and at least a portion of the second core 32 is located on the other side of the substrates 20 in the Z direction.

[0041] The structure of the core material 30 is not limited to Figures 1 to 4 The structure shown. For example, the first core 31 may be an E-type core, and the second core 32 may also be an E-type core. That is, the core material 30 is not limited to an EI-type core, but may also be an EE-type core. In addition to the above, the type of the core material 30 may also be various types (e.g., EIR-type core, UI-type core, etc.).

[0042] like Figures 1 to 4 As shown, the support member 40 engages with the outer periphery of each of the three substrates 21 , 22 , and 23 to support the three substrates 21 , 22 , and 23 while maintaining the gap 20A between the substrates 22 and 23 and the gap 20A between the substrates 23 and 21 .

[0043] The peripheral portion is the outer side surface 20B of the substrate 21, 22, 23 and the portion near the outer side surface 20B. The outer side surface 20B is a surface constituting the outer periphery of the substrate 21, 22, 23. For example, the surface constituting the through hole 20C is included in the outer side surface 20B. The portion near the outer side surface 20B is, for example, the aforementioned convex portion 24 or the convex portions 211, 221, 231. That is, the convex portion 24 or the convex portions 211, 221, 231 are included in the peripheral portion. And, for example, the portion near the outer side surface 20B may also be a portion of the substrate 20 that is closer to the outer side surface 20B of the substrate 20 than the center of the substrate 20 when viewed from the Z direction. Furthermore, for example, the portion near the outer side surface 20B may be a portion of the substrate 20 whose distance from the outer side surface 20B of the substrate 20 is less than 1 / 8 of the distance from the outer side surface 20B of the substrate 20 to the center of the substrate 20 when viewed from the Z direction.

[0044] The material of the support member 40 is arbitrary. In the present embodiment, the support member 40 is made of resin.

[0045] like Figures 1 to 4 As shown in FIG. 1 , the support member 40 includes a first support portion 41 and a second support portion 42. The first support portion 41 and the second support portion 42 are each in a plate shape.

[0046] The first support portion 41 contacts the substrate 20 from one side in the X direction. The second support portion 42 contacts the substrate 20 from the other side in the X direction. That is, the first support portion 41 and the second support portion 42 clamp the three substrates 21, 22, and 23 from both sides in the X direction. The X direction is a direction intersecting the Z direction. In the present embodiment, the X direction is a direction orthogonal to the Z direction. The X direction is an example of an intersecting direction.

[0047] like Figure 2 as well as Figure 4 As shown in FIG. 1 , each of the first support portion 41 and the second support portion 42 includes three pairs of notches 40B each consisting of two notches 40B. That is, each of the first support portion 41 and the second support portion 42 includes six notches 40B.

[0048] The pair of cutouts 40B are formed at the same position in the Z direction. One of the pair of cutouts 40B is cut in the Y direction from the outer side surface 40A facing the direction opposite to the Y direction. The other of the pair of cutouts 40B is cut in the direction opposite to the Y direction from the outer side surface 40A facing the Y direction. Each group of the pair of cutouts 40B is arranged in the Z direction. The interval between two adjacent groups of the pair of cutouts 40B in the Z direction is the same as the gap 20A between the two substrates 20 described above.

[0049] The convex portion 24 of each of the three substrates 21, 22, and 23 is embedded in each of the three pairs of cutouts 40B. That is, the convex portion 24 is engaged with the cutout 40B. At this time, the convex portion 24 is supported by a supporting surface 40Ba, which is one of the surfaces constituting the cutout 40B and faces the Z direction. The supporting surface 40Ba forms each cutout 40B. That is, one supporting surface 40Ba of the three pairs of cutouts 40B supports the substrate 21. And, the other supporting surface 40Ba of the three pairs of cutouts 40B supports the substrate 22. And, the remaining one supporting surface 40Ba of the three pairs of cutouts 40B supports the substrate 23.

[0050] like Figure 2 As shown in FIG. 1 , the support member 40 includes a wiring pattern 61 and via holes 62 and 63 . In the present embodiment, the wiring pattern 61 and the via holes 62 and 63 are provided in the second support portion 42 of the support member 40 .

[0051] The wiring pattern 61 is conductive like the wiring pattern such as the coil pattern 25 of the substrate 20, and is made of, for example, a metal such as copper. The vias 62 and 63 are conductive. The vias 62 and 63 are formed by laminating a metal such as copper on the inner side surface of the hole provided in the support member 40. The vias 62 and 63 are an example of a wiring pattern.

[0052] In this embodiment, the wiring pattern 61 is formed on the surface 42C of the second support portion 42. The via 62 is provided in a hole formed in the surface 42C and is electrically connected to the wiring pattern 61. The wiring pattern 61 is connected to a wiring pattern (not shown) provided inside the support member 40 via the via 62.

[0053] At least one of the wiring pattern 61 and the via hole 62 is electrically connected to the wiring pattern provided on the substrate 21 and the wiring pattern provided on the substrate 23 . Thus, the substrate 21 and the substrate 23 are electrically connected via at least one of the wiring pattern 61 and the via hole 62 .

[0054] In the present embodiment, the via hole 63 is provided in a through hole that penetrates the second support portion 42 in the Z direction. One end of the via hole 63 opens at the support surface 40Ba of the cutout 40B that supports the substrate 23, and is electrically connected to the wiring pattern provided on the substrate 23. The other end of the via hole 63 opens at the surface of the cutout 40B that is opposite to the support surface 40Ba that supports the substrate 22 in the Z direction, and is electrically connected to the wiring pattern provided on the substrate 22. Thus, the substrate 23 and the substrate 22 are electrically connected via the via hole 63.

[0055] In the present embodiment, the wiring pattern 61 is formed on the surface of the support member 40, but may be provided inside the support member 40. In this case, for example, the wiring pattern inside the support member 40 is exposed to the outside of the support member 40 through a via hole, and is electrically connected to the substrate 20 through the via hole.

[0056] In the present embodiment, the substrate 21 and the substrate 23 are electrically connected via the wiring pattern, and the substrate 23 and the substrate 22 are electrically connected via the via hole, but the present invention is not limited to such a structure. For example, the substrate 21 and the substrate 23 may be electrically connected via the via hole, and the substrate 23 and the substrate 22 may be electrically connected via the wiring pattern, which is opposite to the above.

[0057] In the present embodiment, the wiring pattern 61 and the vias 62 and 63 are provided on the second support portion 42, but the present invention is not limited to such a structure. For example, the wiring pattern 61 and the vias 62 and 63 may also be provided on the first support portion 41. Also, for example, the wiring pattern 61 and the vias 62 may be provided on the first support portion 41, and the vias 63 may be provided on the second support portion 42.

[0058] like Figure 3 As shown, the three substrates 20 are bonded to the support member 40 via an adhesive 50. Specifically, the side surfaces of the three substrates 21, 22, and 23 facing the direction opposite to the X direction are bonded to the first support portion 41 via the adhesive 50. The side surfaces of the three substrates 21, 22, and 23 facing the X direction are bonded to the second support portion 42 via the adhesive 50.

[0059] In addition, only a part of the three substrates 21, 22, and 23 may be bonded to the support member 40 via the adhesive 50. Furthermore, the three substrates 21, 22, and 23 may be bonded to the support member 40 without the adhesive 50.

[0060] The core material 30 is bonded to the support member 40 via an adhesive 50. Specifically, the main body 311 of the first core 31, the outer leg 312 located on the opposite side of the X direction among the two outer legs 312 of the first core 31, and the side faces of the second core 32 facing the opposite direction to the X direction are bonded to the first support portion 41 via an adhesive 50. The main body 311 of the first core 31, the outer leg 312 located on the X direction among the two outer legs 312 of the first core 31, and the side faces of the second core 32 facing the X direction are bonded to the second support portion 42 via an adhesive 50.

[0061] In addition, the core material 30 may be bonded to the supporting member 40 without the adhesive 50 .

[0062] According to the present embodiment, the support member 40 engages with the outer periphery of the plurality of substrates 20 (the convex portion 24 in the present embodiment) to support the plurality of substrates 20 in a manner that maintains the gap 20A between the plurality of substrates 20. Since the support member 40 engages with the outer periphery of the plurality of substrates 20, the usable space in the plurality of substrates 20 (for example, the space for configuring the core material 30, the space for forming the wiring pattern) can be increased. Furthermore, the offset of the relative position between the plurality of substrates 20 can be reduced. By reducing the offset of the relative position between the plurality of substrates 20, the offset of the relative position between the plurality of substrates 20 and the core material 30 can also be reduced. As a result, the shaking of the coil component 10 can be suppressed, and the coil component 10 can be stabilized.

[0063] According to the present embodiment, the plurality of substrates 20 are supported by the support members 40 (the first support portion 41 and the second support portion 42 ) on both sides in the X direction, thereby improving the stability of the plurality of substrates 20 .

[0064] According to the present embodiment, the plurality of substrates 20 can be supported by various structures having a support surface, for example, a groove or a through hole provided in the support member 40 (in the present embodiment, the notch 40B provided in the support member 40 ).

[0065] According to the present embodiment, the support member 40 can support a plurality of substrates 20 with a simple structure including the cutout 40B and the protrusion 24 .

[0066] According to the present embodiment, since the support member 40 is plate-shaped, the thickness of the support member 40 is thin. Therefore, as the thickness of the support member 40 is reduced, the coil component 10 can be reduced in size and weight.

[0067] According to the present embodiment, the core material 30 includes the first core 31 and the second core 32. Thus, by placing the first core 31 on the substrate 20 and then combining the second core 32 with the first core 31, a plurality of substrates 20 can be easily sandwiched between the first core 31 and the second core 32.

[0068] According to the present embodiment, the plurality of substrates 20 can be electrically connected via the wiring pattern (wiring pattern 61 and via 63) of the support member 40. Therefore, there is no need to separately provide a structure for electrically connecting the plurality of substrates 20, for example, there is no need to separately provide a communication line connecting the plurality of substrates 20 from the support member 40.

[0069] According to the present embodiment, the plurality of substrates 20 are fixed to the support member 40 via the adhesive 50. Thus, compared with a structure in which the support member 40 and the plurality of substrates 20 are not bonded via the adhesive 50, positional deviation of the plurality of substrates 20 can be reduced.

[0070] According to the present embodiment, the core 30 is fixed to the support member 40 by the adhesive 50. Thus, compared with a structure in which the support member 40 and the core 30 are not bonded by the adhesive 50, positional deviation of the core 30 relative to the support member 40 can be reduced.

[0071] The structure of the support member 40 is not limited to Figures 1 to 4 The structure shown.

[0072] For example, the shapes of the first support portion 41 and the second support portion 42 are not limited to the plate shape, and may be non-plate shapes such as a rectangular parallelepiped shape.

[0073] Figures 1 to 4 The support member 40 shown in the figure has the notch 40B which engages with the substrate 20. However, the structure which the support member 40 has for engaging with the substrate 20 is not limited to the notch 40B.

[0074] For example, the support member 40 may include Figure 5 The support portion 43 shown replaces at least one of the first support portion 41 and the second support portion 42 . Figure 5 1 is a side view schematically showing a support member of a modified example. The support portion 43 has three sets of a pair of through holes 40C instead of the three sets of a pair of notches 40B. Each through hole 40C penetrates the support portion 43 in the X direction. Each through hole 40C is provided at a position corresponding to each notch 40B.

[0075] The convex portion 24 of each of the three substrates 21, 22, and 23 is embedded in each through hole 40C. That is, the convex portion 24 is engaged with the through hole 40C. At this time, the convex portion 24 is supported by a supporting surface 40Ca, which is one of the surfaces constituting the through hole 40C and faces the Z direction. The supporting surface 40Ca forms each through hole 40C. That is, one of the three pairs of through holes 40C supports the substrate 21. And, the other pair of the three pairs of through holes 40C supports the substrate 22. And, the remaining pair of the three pairs of through holes 40C supports the substrate 23.

[0076] And, for example, Figure 6 As shown, the coil component 10A may include support portions 44 and 45 instead of the first support portion 41 and the second support portion 42 . Figure 6 is Figure 3 The front view of the embodiment is a front view in which the supporting member is replaced with the supporting member of the modified example. The supporting portion 44 and the supporting portion 45 each have a pair of recessed portions 40D provided in three groups instead of the pair of cutouts 40B provided in three groups. Each recessed portion 40D is provided on the surface facing the substrate 20 of the outer surface of the supporting portion 44, 45, and is recessed from the surface along the X direction. Each recessed portion 40D corresponds to each cutout 40B.

[0077] The convex portion 24 of each of the three substrates 21, 22, and 23 is embedded in each concave portion 40D. That is, the convex portion 24 is engaged with the concave portion 40D. At this time, the convex portion 24 is supported by a supporting surface 40Da, which is one of the surfaces constituting the concave portion 40D and faces the Z direction. The supporting surface 40Da forms each concave portion 40D. That is, one supporting surface 40Da of the three groups of a pair of concave portions 40D supports the substrate 21. And, the other supporting surface 40Da of the three groups of a pair of through holes 40C supports the substrate 22. And, the remaining supporting surface 40Da of the three groups of a pair of through holes 40C supports the substrate 23.

[0078] The recess 40D may not correspond to the cutout 40B. For example, the support portion 44 and the support portion 45 may each have a recess that is longer in the Y direction instead of a pair of recesses 40D. That is, the support portion 44 and the support portion 45 may each have three recesses arranged in the Z direction instead of three groups of a pair of recesses 40D. The length of each recess in the Y direction is greater than the length of each substrate 21, 22, 23 in the Y direction. Thus, the entire area of ​​the end of each substrate 21, 22, 23 in the X direction is embedded in the recess. In this case, even if each substrate 21, 22, 23 does not have a convex portion 24, the support portions 44 and 45 can support each substrate 21, 22, 23 through the recess.

[0079] Figure 6The coil component 10A shown has support parts 44 and 45 instead of the first support part 41 and the second support part 42. However, for example, the coil component may also have a support part 44 instead of the first support part 41, and on the other hand, have a second support part 42. That is, the coil component may also have a support part 44 and a second support part 42. And, for example, the coil component may also have a support part 45 instead of the second support part 42, and on the other hand, have a first support part 41. That is, the coil component may also have a support part 45 and a first support part 41.

[0080] Figures 1 to 4 The support member 40 shown in the figure includes a first support portion 41 and a second support portion 42, and the first support portion 41 and the second support portion 42 sandwich the three substrates 20 from both sides in the X direction. However, the structure of the support member 40 is not limited to this structure.

[0081] For example, the support member 40 may include only one of the first support portion 41 and the second support portion 42. In this case, the support member 40 supports the substrate 20 only on one side in the X direction, but the substrate 20 is not supported by a known structure of the support member 40 (for example, a columnar member for supporting the substrate 20) on the other side in the X direction.

[0082] And, for example, Figure 7 As shown, the coil component 10B may include a support member 40 in which the first support portion 41 , the second support portion 42 , and the third support portion 46 are integrally formed. Figure 7 It is a perspective view schematically showing a coil component according to a modified example of one embodiment of the present disclosure.

[0083] The first support portion 41 contacts the substrate 20 from one side in the X direction. The second support portion 42 contacts the substrate 20 from the other side in the X direction.

[0084] The third supporting portion 46 is in contact with the substrate 20 along the Y direction. Both ends of the third supporting portion 46 in the X direction are connected to the first supporting portion 41 and the second supporting portion 42, respectively.

[0085] The third support portion 46 has six through holes 46A. Each through hole 46A penetrates the third support portion 46 in the Y direction. The convex portion 211 of the substrate 21 is embedded in two of the six through holes 46A. The convex portion 231 of the substrate 23 is embedded in the other two of the six through holes 46A. The convex portion 221 of the substrate 22 is embedded in the remaining two of the six through holes 46A.

[0086] The material of the support member 40 is not limited to resin. For example, the support member 40 may be made of metal such as iron.

[0087] When the support member 40 is made of metal, the heat generated by the plurality of substrates 20 and the heat generated by the core material 30 can be dissipated through the support member 40 made of metal.

[0088] The above description can also be expressed as follows.

[0089] (1) A coil component 10 according to one embodiment of the present invention comprises: a plurality of substrates 20 (substrates 21, 22, 23), each having a coil pattern 25, which overlap with a gap 20A in the thickness direction (Z direction); a core material 30, which is arranged on the plurality of substrates 20; and a supporting component 40, which is engaged with the outer periphery of the plurality of substrates 20 to support the plurality of substrates 20 in a manner maintaining the gap 20A.

[0090] (2) In the coil component 10 of (1), the support component may include a first support portion 41 and a second support portion 42, and the first support portion 41 and the second support portion 42 clamp the multiple substrates 20 from both sides in an intersecting direction (X direction) intersecting the thickness direction (Z direction).

[0091] (3) In the coil component 10 of (1) or (2), the support member 40 may include a support surface 40Ba facing the thickness direction (Z direction) and supporting each of the plurality of substrates 20 .

[0092] (4) In the coil component 10 of any one of (1) to (3), the supporting component 40 may also have a cutout 40B cut out from the outer side surface 40A of the supporting component 40, and each of the plurality of substrates 20 may also have a protrusion 24 protruding from the side surface of each of the plurality of substrates 20 and engaging with the cutout 40B.

[0093] (5) In the coil component 10 according to any one of (1) to (4), the support member 40 may be plate-shaped.

[0094] (6) In the coil component 10 of any one of (1) to (5), the core material 30 may also have a first core 31 and a second core 32 that are in contact with each other, and at least a portion of the first core 31 may also be located on one side of the thickness direction (Z direction) than the multiple substrates 20, and at least a portion of the second core 32 may also be located on the other side of the thickness direction (Z direction) than the multiple substrates 20.

[0095] (7) In the coil component 10 according to any one of (1) to (6), the support member 40 may be made of metal.

[0096] (8) In the coil component 10 according to any one of (1) to (7), the support member 40 may have a conductive wiring pattern (the wiring pattern 61 and the vias 62 and 63 ).

[0097] (9) In the coil component 10 according to any one of (1) to (8), at least one of the plurality of substrates 20 and the support member 40 may be bonded to each other via an adhesive 50 .

[0098] (10) In the coil component 10 according to any one of (1) to (9), the core material 30 and the supporting member 40 may be bonded to each other via an adhesive 50 .

[0099] In addition, by appropriately combining any of the various embodiments described above, the effects possessed by each can be achieved.

[0100] Although the present disclosure is fully described in relation to the preferred embodiments with appropriate reference to the drawings, various modifications and variations will be apparent to those skilled in the art, and such modifications and variations should be understood to be included within the scope of the present invention as long as they do not depart from the scope of the appended claims.

[0101] Description of symbols

[0102] 10 Coil components

[0103] 20 substrates

[0104] 20A gap

[0105] 24 convex part

[0106] 25 coil pattern

[0107] 30 core material

[0108] 31 First Core

[0109] 32 Second Core

[0110] 40 Supporting parts

[0111] 40A outer side

[0112] 40B incision

[0113] 40Ba bearing surface

[0114] 41 first supporting portion

[0115] 42 second supporting portion

[0116] 50 Adhesive

[0117] 61 Wiring Pattern

[0118] 63 vias (wiring pattern)

Claims

1. A coil component, comprising: A plurality of substrates, each having a coil pattern, are overlapped with a gap in the thickness direction; a core material, which is disposed on the plurality of substrates; as well as The supporting member is engaged with the outer periphery of the plurality of substrates and supports the plurality of substrates so as to maintain the gap.

2. The coil component according to claim 1, in, The support member includes a first support portion and a second support portion, and the first support portion and the second support portion sandwich the plurality of substrates from both sides in a direction intersecting the thickness direction.

3. The coil component according to claim 1 or 2, in, The supporting member has a supporting surface facing the thickness direction and supporting each of the plurality of substrates.

4. The coil component according to any one of claims 1 to 3, in, The support member has a cutout formed by cutting out from an outer side surface of the support member, Each of the plurality of substrates has a convex portion that protrudes from a side surface of each of the plurality of substrates and engages with the cutout.

5. The coil component according to any one of claims 1 to 4, in, The supporting member is plate-shaped.

6. The coil component according to any one of claims 1 to 5, in, The core material includes a first core and a second core that are in contact with each other, At least a portion of the first core is located closer to one side in the thickness direction than the plurality of substrates. At least a portion of the second core is located on the other side in the thickness direction relative to the plurality of substrates.

7. The coil component according to any one of claims 1 to 6, in, The supporting member is made of metal.

8. The coil component according to any one of claims 1 to 7, in, The supporting member has a conductive wiring pattern.

9. The coil component according to any one of claims 1 to 8, in, At least one of the plurality of substrates is bonded to the support member via an adhesive.

10. The coil component according to any one of claims 1 to 9, in, The core material and the supporting member are bonded via an adhesive.

Images