Gas delivery tray assembly, cleaning unit having gas delivery tray assembly, and chemical mechanical polishing system

Abstract

Disclosed herein is a modular gas tray assembly, and a cleaning unit and a chemical mechanical grinder having the same. In one example, a gas tray assembly includes three outlets and two or less inlets. The gas tray assembly has a first main gas conduit and a second main gas conduit secured to the first mounting plate. The second main gas conduit is divided into two branches, each branch having its own flow control. The modular gas tray assembly is configured to provide gas to a base plate of a substrate cleaner, a substrate grasping pin of the substrate cleaner, and a bottom of a substrate held by the substrate grasping pin of the substrate cleaner.

Description

Technical Field

[0001] Embodiments described herein relate generally to apparatus used in the manufacture of electronic devices, and more particularly, to substrate processing systems that can be used to clean the surface of a substrate, particularly after or as part of a chemical mechanical polishing (CMP) system. Background Art

[0002] Chemical mechanical polishing (CMP) is commonly used in the manufacture of high-density integrated circuits to planarize or polish a layer of material deposited on a substrate. In a typical CMP process, a substrate is held in a carrier head that presses the front side of the substrate against a rotating polishing pad in the presence of a polishing slurry. Material is removed from the surface of the material layer of the substrate that is in contact with the polishing pad through a combination of chemical and mechanical activity provided by the polishing slurry and the relative motion of the substrate and the polishing pad. Typically, after one or more CMP processes are completed, the polished substrate is cleaned, such as in a cleaning unit coupled to the CMP system. The cleaning unit can include a plurality of cleaning stations, i.e., cleaning modules, for performing various cleaning operations. Once the post-CMP operation is completed, the substrate can be removed from the CMP system and then transferred to the next device manufacturing system, such as a lithography, etching, or deposition system.

[0003] In a clean cell with multiple clean modules, there is limited space available for transferring substrates between modules. The space limitation problem is exacerbated by the high cost of ownership for FAB operators, as the cleaning equipment takes up valuable space that could be used more cost-effectively for other processing equipment. Additionally, large clean enclosures undesirably increase the time that substrates are exposed to air, which presents a risk of substrate oxidation and particulate contamination. As a result, the modules within a clean cell are packed as closely together as possible, leaving little room for a robot-like device to grab a substrate, change its orientation, and insert it into another module. This compression of space also leaves little available space for gas control systems and associated wiring within the clean cell, resulting in a gas delivery system that is difficult to maintain and repair, and lacks the ability to expand or replace if the cleaning process changes in the future.

[0004] Therefore, there is a need for an improved gas delivery system and a cleaning unit having the same. Summary of the invention

[0005] The present invention discloses a modular gas tray assembly and a cleaning unit and a chemical mechanical grinder having the same. In one example, the gas tray assembly has a first main gas conduit fixed to a first mounting plate and a second main gas conduit. The first main gas conduit includes a first inlet port, a first normally closed valve, a first regulator coupled between the first normally closed valve and the first inlet port, a first outlet port, a first filter coupled to the first outlet port, and a first flow controller connected between the first filter and the first normally closed valve. The second main gas conduit includes a second inlet port, a second normally closed valve, a second regulator coupled between the second normally closed valve and the second inlet port, a second outlet port, a second filter coupled to the second outlet port, a second flow controller coupled between the second filter and the second normally closed valve, a third normally closed valve coupled to a three-way valve disposed between the second regulator and the second normally closed valve, a third outlet port, a third filter coupled to the third outlet port, and a third flow controller coupled between the second filter and the second normally closed valve.

[0006] In another example, a second tray assembly having the same configuration as the tray assembly described in the above paragraph is stacked vertically.

[0007] In another example, a cleaning unit is provided. The cleaning unit includes a gas tray assembly and a first cleaning module (FCM). The gas tray assembly has three outlets and two or fewer inlets. The outlets of the gas tray assembly are connected to the FCM. The FCM includes: a base plate having gripping pins configured to hold a substrate during processing; a first arm, the first arm movable between a position above the base plate and a position away from the base plate; a first FCM outlet port disposed on the first arm and connected to the first outlet port; a second FCM outlet port disposed on the first arm and connected to the second outlet port; and a third FCM outlet port disposed in the base plate and connected to the third outlet port.

[0008] In another example, a substrate processing system is provided, which includes a chemical mechanical grinder, a substrate conveying device, and a substrate cleaning unit. The substrate cleaning unit is coupled to the chemical mechanical grinder. The substrate conveying device is configured to move the substrate from the chemical mechanical grinder to the substrate cleaning unit. The substrate cleaning unit further includes a first plurality of stacked integrated cleaning dryers, a first plurality of stacked gas trays disposed directly below the first plurality of stacked integrated cleaning dryers, a second plurality of stacked integrated cleaning dryers disposed to be laterally offset from the first plurality of stacked integrated cleaning dryers, and a second plurality of stacked gas trays disposed directly below the second plurality of stacked integrated cleaning dryers. A corresponding one of the first plurality of stacked gas trays is connected to a corresponding one of the first plurality of stacked integrated cleaning dryers. A corresponding one of the second plurality of stacked gas trays is connected to a corresponding one of the second plurality of stacked integrated cleaning dryers. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] The above briefly summarized disclosure may be more particularly described with reference to a number of specific embodiments, some of which are illustrated in the accompanying drawings, in order to understand the above features of the disclosure in more detail. It should be noted, however, that the accompanying drawings illustrate only typical embodiments of the disclosure and are therefore not to be considered as limiting the scope of the disclosure, as the disclosure may admit of other equally effective embodiments.

[0010] Figure 1A is a schematic top view of an exemplary chemical mechanical polishing (CMP) system with an integrated cleaning unit.

[0011] Figure 1B yes Figure 1A Schematic side view of a CMP system showing multiple gas tray assemblies disposed at the bottom of an integrated cleaning unit.

[0012] Figure 2 is a side view of an example of an integrated clean and dry (ICD) station.

[0013] Figure 3 is configured to provide gas to separate Figure 2 Schematic diagram of the two gas tray assemblies of the ICD station.

[0014] Figure 4 is a top view of the gas tray assembly.

[0015] Figure 5 is a partial schematic side view of a stacked gas assembly.

[0016] To facilitate understanding, identical reference numerals have been used, where possible, to designate identical elements that are common to the figures. It is contemplated that elements and features of one embodiment may be beneficially incorporated in other embodiments without further recitation. DETAILED DESCRIPTION

[0017] Specific embodiments described herein relate generally to apparatus used in the manufacture of electronic devices, and more particularly, to a cleaning unit that can be used to clean the surface of a substrate after chemical mechanical polishing of the substrate in a semiconductor device manufacturing process. The cleaning unit includes a modular gas tray assembly that is stacked in a bottom area of ​​the cleaning unit. The gas tray assembly can be easily replaced and / or added to the cleaning unit, thereby enabling efficient and cost-effective service and expansion of the cleaning unit. The location of the stacked gas tray assembly also allows for ease of maintenance, including enabling one cleaning module to be repaired while other cleaning modules of the cleaning unit remain operational, thereby minimizing the impact on factory output during maintenance.

[0018] Figure 1Aand Figure 1B are schematic top and side views of an exemplary chemical mechanical polishing (CMP) system 100 having a cleaning cell 106 utilizing a modular gas tray assembly 124. The modular gas tray assembly 124 may be easily removed, replaced, and / or added to the cleaning cell 106, as further described below.

[0019] The CMP system 100 includes one or more polishing stations 105, a factory interface 102 having a first substrate handler 103, and a cleaning unit 106 including a second substrate handler 104. The factory interface 102 may include one or more loading stations 102A. The loading station 102A may be, for example, a FOUP or a cassette. Each loading station 102A may include one or more substrates 200 for CMP in the CMP system 100.

[0020] The first substrate handler 103 is positioned to transfer the substrate 200 to and from one or more loading stations 102A. The first substrate handler 103 transfers the substrate 200 from the loading station 102A to the cleaning unit 106, such as to the cleaner lane 102B, where the substrate 200 can be picked up by the second substrate handler 104. As another example, the first substrate handler 103 transfers the substrate 200 from the cleaning unit 106 (e.g., from the cleaner lane 102B) to the loading station 102A.

[0021] The substrate 200 is initially positioned in the loading station 102A before being processed in the polishing station 105. The first substrate handler 103 transfers the substrate 200 to the cleaner channel 102B. The first substrate handler 103 also transfers the polished substrate 200 from the cleaning unit 106 back to the loading station 102A.

[0022] The second substrate handler 104 is positioned to transfer the substrate 200 from the cleaner channel 102B to the transfer station 105A of the polishing station 105 for polishing. The second substrate handler 104 is also operable to transfer the substrate 200 from the transfer station 105A of the polishing station 105 to the cleaning unit 106 after polishing in the polishing station 105. In one example, the second substrate handler 104 retrieves the polished substrate 200 from the transfer station 105A within the polishing station 105 and transfers the substrate 200 to one of the cleaning modules in the cleaning unit 106.

[0023] The grinding station 105 is a chemical mechanical grinder, which may include a plurality of grinding stations (not shown). The grinding station 105 includes one or more grinding assemblies for grinding the substrate 200. Typically, each of the one or more grinding assemblies will include the use of a grinding table (not shown) and a grinding head (not shown), which is configured to push the substrate 200 against a grinding pad (not shown) disposed on the grinding table. The substrate 200 is ground in the presence of a grinding liquid. The grinding liquid may include an abrasive. After undergoing chemical mechanical grinding in the grinding station 105, residual abrasive particles and / or liquid (e.g., acidic or alkaline chemicals contained in the grinding liquid) may remain on the substrate 200.

[0024] like Figure 1A As shown, the cleaning unit 106 may include two cleaning units 106A, 106B, which are arranged parallel to each other on opposite sides of the second substrate processor 104. The cleaning units 106A, 106B include a plurality of cleaning modules, such as one or more first cleaning modules, one or more second cleaning modules, and one or more third cleaning modules, as described below. Each gas tray assembly 124 is configured to provide gas to a corresponding single cleaning module of the cleaning units 106A, 106B. This allows any cleaning module and / or gas tray assembly 124 to be repaired without taking other modules out of service, thereby enabling substrates to be cleaned in the cleaning units 106A, 106B even during maintenance. The gas tray assembly 124 can be stacked under each of the cleaning units 106A, 106B to convert space within the system 100 and provide space for substrate transfer.

[0025] Cleaning unit 106A is essentially a mirror image of cleaning unit 106B. Cleaning unit 106A includes a plurality of cleaning stations (i.e., Figure 1A Modules shown, such as a first cleaning module 107, a second cleaning module 109, and a third cleaning module 110) and a third substrate processor 108. In some embodiments, the first cleaning module is generally referred to as a pre-cleaning module 107 herein, but this is not intended to limit the scope of the disclosure provided herein. In some embodiments, the second cleaning module 109 is generally referred to as a vertical cleaning module 109 herein, but this is not intended to limit the scope of the disclosure provided herein. In some embodiments, the third cleaning module 110, although not intended to limit the scope of the disclosure provided herein, is generally referred to as a drying (ICD) module 110 herein. In some embodiments, the vertical cleaning module 109 may be configured as a first vertical cleaning module 109A and a second vertical cleaning module 109B. In some embodiments, the ICD module 110 may be provided as a first ICD module 110A and a second ICD module 110B. In some embodiments, Figure 1AAs shown, the third substrate handler 108 within each cleaning unit 106A, 106B is positioned so that it is located at the outer edge of the cleaning unit 106A, 106B of the CMP system 100. In this configuration, the substrate handler 108 is positioned outside the first, second and third cleaning modules, the outside being opposite to the inside of the first, second and third cleaning modules, and the inside facing the robot channel 104T and the second substrate handler 104 of the CMP system 100.

[0026] The pre-cleaning module 107 is configured to process a substrate 200 disposed in a substantially horizontal orientation (i.e., in the XY plane) with the processing surface 201 facing upward. In some embodiments, each cleaning unit 106A, 106B includes two vertical cleaning modules 109A, 109B, which are configured to process a substrate 200 disposed in a substantially vertical orientation (i.e., in the ZY plane) with the processing surface 201 facing the factory interface 102.

[0027] As described above, the pre-cleaning module 107 receives the grinding substrate 200 from the second substrate processor 104 through the first door 107A formed in the first side panel of the pre-cleaning module 107. The first door 107A can be, for example, a slit valve, which is configured to isolate the inner area of ​​the pre-cleaning module 107 from the outer area of ​​the pre-cleaning module 107. The substrate 200 is received by the pre-cleaning module 107 in a horizontal orientation to be positioned on a substrate support surface disposed horizontally therein. The pre-cleaning module 107 then performs a pre-cleaning process (e.g., a grinding process) on the substrate 200 before the substrate 200 is transferred from the pre-cleaning module 107 using the third substrate processor 108 (which is sometimes also referred to as the third substrate processor 108). In some specific embodiments, the grinding process will include sweeping a grinding pad across the surface of the substrate located on the horizontally disposed substrate support surface to remove residual slurry (e.g., grinding liquid), scratches, and other defects found on the surface of the substrate. The grinding pad may include a material such as polyurethane, acrylate, or other polymeric material.

[0028] The third substrate processor 108 transfers the substrate 200 from the pre-cleaning module 107 through the second door 107B, and the second door 107B covers the opening formed in the second side panel of the pre-cleaning module 107. The second door 107B can be, for example, a slit valve. The second side panel can be, for example, orthogonal to the first side panel. When the substrate 200 is removed from the pre-cleaning module 107, the substrate 200 is still in a horizontal direction, that is, oriented in the XY plane. After the substrate 200 is transferred from the pre-cleaning module 107, the third substrate processor 108 rotates the substrate 200 to a vertical direction, that is, oriented in the YZ plane, and the processing surface 201 faces the factory interface 102 for further processing in the vertical cleaning modules 109A, 109B of the cleaning unit 106. For example, after transferring the substrate 200 from the pre-cleaning module 107, the third substrate processor 108 may rotate the substrate 200 90 degrees about the Y-axis to change the orientation to a vertical position, and may also rotate the substrate 200 180 degrees about the Z-axis so that the processing surface 201 faces the factory interface 102. The Y-axis rotation and the Z-axis rotation may be performed sequentially or at overlapping time intervals.

[0029] After rotating the substrate 200 so that the processing surface 201 faces the factory interface 102, the third substrate processor 108 passes through the door 109C (eg, Figure 1B 106A, 106B) transfers the substrate 200 to the vertical cleaning module 109A. The transfer process may include movement of the third substrate processor 108 in at least one direction (such as the X direction). The door 109C may be, for example, a slit valve. Each cleaning unit 106A, 106B may include two vertical cleaning modules 109A, 109B. The two vertical cleaning modules 109A, 109B may be arranged linearly (i.e., along the X direction) in each corresponding cleaning unit 106A, 106B. The two vertical cleaning modules 109A, 109B may also be substantially arranged below the pre-cleaning module 107 in each corresponding cleaning unit 106A, 106B, i.e., along the Z direction. This arrangement of the vertical cleaning modules 109A, 109B below the pre-cleaning module 107 can provide a reduced footprint of the entire cleaning unit 106, and also helps to reduce the transfer time between these modules to improve throughput and importantly reduce the time that the wet substrate can be dried and reduce the exposure of the substrate to air between the cleaning steps.

[0030] In some embodiments, the vertical cleaning modules 109A, 109B may be any one or a combination of contact and non-contact cleaning units for removing grinding byproducts from the surface of the substrate, such as spray boxes and / or scrubbing brush boxes.

[0031] The vertical cleaning module 109 includes a cylindrical roller that can be actuated against the major surface of the substrate 200. A second treatment fluid, such as deionized water and / or one or more second cleaning fluids, is applied to the surface of the substrate 200 from a second fluid source while the substrate 200 and the cylindrical roller are rotated by various actuators and motors. In some embodiments, the second treatment fluid provided to the substrate surface is different from the first treatment fluid provided to the substrate surface in the pre-cleaning module 107. During the cleaning process in each vertical cleaning module 109A, 109B, the substrate 200 can be positioned so that the processing surface 201 faces the factory interface 102. In another embodiment, the vertical cleaning modules 109A and 109B are oriented within the cleaning units 106A, 106B so that the processing surface 201 faces an orientation substantially perpendicular to the factory interface 102 (e.g., parallel to the XZ plane) during the cleaning process. In another specific embodiment, the vertical cleaning modules 109A and 109B are oriented within the cleaning units 106A, 106B such that the processing surface 201 of the substrate 200 faces an orientation at an angle between parallel to the XZ plane and parallel to the YZ plane during the cleaning process.

[0032] According to a specific embodiment, the cleaning units 106A, 106B can be configured to sequentially process each substrate 200 through the two vertical cleaning modules 109A, 109B as a two-step cleaning process. That is, after the substrate 200 undergoes a cleaning process in the vertical cleaning module 109A closest to the polishing station 105, the third substrate handler 108 transfers the substrate 200 to the vertical cleaning module 109B closest to the factory interface 102 for further cleaning processing. During the cleaning process train, after being processed in the first vertical cleaning module 109A for a first time period, the substrate is transferred to the second vertical cleaning module 109B and then processed for a second time period, which is generally substantially similar to the first time period. The processing performed in the first vertical cleaning module 109A and the second vertical cleaning module 109B can include using similar fluid chemistry and mechanical processing parameters (e.g., cylindrical roller rotation speed and applied force). In some specific embodiments, the first vertical cleaning module 109A is suitable for performing a rough cleaning step to remove most of the remaining contaminants remaining on the substrate after the first cleaning process is performed in the first cleaning module, and the second vertical cleaning module 109B is configured to perform a cleaning treatment suitable for removing any remaining contaminants remaining after the treatment performed in the first vertical cleaning module 109A.

[0033] Then, the third substrate handler 108 transfers the substrate 200 to an available one of the ICD modules 110A, 110B through a first door 110C (shown in FIG. 1 ) formed in a first side panel of the available one of the ICD modules 110A, 110B. Figure 1A ). The door 110C may be, for example, a slit valve. Figures 1A to 1B As shown, each cleaning unit 106A, 106B may include two ICD modules 110A, 110B arranged vertically (i.e., along the Z direction). Each ICD module 110A, 110B performs cleaning and drying processes on the substrate 200. For example, the ICD modules 110A, 110B may rinse and dry the substrate 200. For example, the ICD modules 110A, 110B may apply isopropyl alcohol (IPA) vapor to adjust the liquid surface tension while rinsing the substrate 200 with deionized water, thereby reducing the adhesion of the liquid to the substrate 200 during the rinsing and drying processes.

[0034] The horizontal arrangement of the ICD modules 110A, 110B can increase the throughput of the substrates 200 for cleaning and drying processes while maintaining a low footprint for the entire cleaning unit 106. This arrangement of the ICD modules 110A, 110B in the CMP system 100 will help reduce the transfer time between the vertical cleaning module 109B and the ICD modules 110A, 110B to increase throughput and importantly reduce the time that wet substrates can dry and reduce the time that substrates are exposed to air between cleaning steps.

[0035] The cleaning unit 106 can operate with two, three, four, or more ICD modules 110. However, for most applications, it is expected that the cleaning unit 106 will operate with two or four ICD modules 110. That is, the two cleaning units 106A, 106B can operate with the same number (one or two) of ICD modules 110. In some specific embodiments, each of the cleaning units 106A, 106B includes two ICD modules 110 stacked vertically. Since the ICD modules 110 are generally independent, one type of ICD module 110 can be replaced with another type, or additional ICD modules 110 can be added to the cleaning unit 106 later.

[0036] Figure 21 is a schematic diagram of a cross-sectional view of an ICD module 110, which represents an ICD module 110A, 110B and can be used in a cleaning unit 106A, 106B, as described above. After the substrate 200 has been cleaned in one or more of the pre-cleaning module 107 and the vertical cleaning modules 109A, 109B, and before the substrate 200 is received by the first substrate processor 103 in the factory interface 102, the ICD module 110 can receive the substrate 200 to be cleaned. The ICD module 110 can be used to remove contaminants from the substrate 200, which, if not removed, may cause the corresponding substrate 200 to fail to meet the cleanliness requirements of subsequent processing steps and be discarded. In one example, the ICD module 110 is configured to perform a cleaning and drying process to prevent water droplet marks from forming on the surface of the substrate 200. Generally speaking, the process performed in each ICD module 110 is the last cleaning process performed in the cleaning sequence performed on the substrate in the CMP system 100. The process performed in each ICD module 110 may include one or more cleaning steps, wherein a cleaning or rinsing fluid (eg, deionized water) is supplied to the top side and / or bottom side of the substrate, and then a drying process is performed on the substrate.

[0037] The ICD module 110 includes a substrate gripping device 203, a sweep arm 230, a first outlet port 240, a second outlet port 241, a plenum 282, an exhaust port 260, an exhaust port 284, and a gas source 270. The ICD module 110 may further include a sensing device 294, such as a camera for detecting the status of a cleaning process or a retroreflective position sensing device for sensing the position of a substrate within the interior space 295.

[0038] The substrate gripping device 203 is configured to support, hold and / or retain the substrate 200 in a horizontal direction. For example, the substrate gripping device 203 is configured to support the substrate 200 in a horizontal direction perpendicular to the vertically oriented rotation axis 216. The substrate gripping device 203 includes a capture cup 210 and the substrate gripping device 203. The capture cup 210 may include a shield 211 and a base plate 212. The shield 211 may be coupled to the base plate 212. For example, the shield 211 may be connected to the base plate 212 by one or more bolts. One or more of the shield 211 and the base plate 212 may include one or more threaded portions configured to receive the bolts.

[0039] The bottom plate 212 may include drain holes 262 positioned in an array along the edge of the bottom plate 212 so that fluid flows into the drain port 284 when the substrate 200, the substrate gripping device 203, and the capture cup 210 are rotated by the drive motor 222. In addition, a labyrinth 264 may be formed between the capture cup 210 and the housing of the ICD module 110. The labyrinth 264 may be configured to at least partially restrict fluid from flowing back through the labyrinth 264 and into the interior space 295.

[0040] The capture cup 210 includes a wall 213 having an annular inner surface 214. The annular inner surface 214 defines a processing volume 297 within the substrate gripping device 203. The annular inner surface 214 has angled portions that are symmetrical about a central axis, such as a rotation axis 216 of the substrate gripping device 203. For example, the substrate 200 may be cleaned within the processing volume 297.

[0041] The substrate gripping device 203 holds the substrate 200 while applying deionized water and / or a third cleaning liquid to the substrate 200 for cleaning. The substrate gripping device 203 may also include a gripping pin 217 coupled to the plate 219. In one or more specific embodiments, each gripping pin 217 may be coupled to an element 280 configured to contact the housing of the shield 211 when the plate 219 is positioned relative to the capture cup 210 using the actuator 229. The contact between the element 280 and the surface 214 of the shield 211 transfers the translational motion to the gripping pin 217. For example, in response to the element 280 contacting the annular inner surface 214 of the shield 211, when the plate 219 and the substrate gripping device 203 are moved in the +Z direction by the actuator 229, the element 280 contacts the annular inner surface 214 of the shield 211 and the structure of the pivot. In response, pivoting and / or translational motion is imparted to the gripping pin 217 coupled to the element 280. In one embodiment, the element 280 continues to pivot until the movement of the substrate clamping device 203 in the +Z direction stops. In one embodiment, after the movement of the plate 219 along the +Z direction stops, the element 280 and the gripping pin 217 are positioned in the open position.

[0042] A spring element, such as a flat spring or a coil spring, can further return the element 280 to the starting position, thereby moving the catch pin 217 to the catch position in response to the element 280 no longer contacting the annular inner surface 214 of the shield 211. The biasing force from the spring element can load the element 280 so that when the element 280 no longer contacts the housing of the shield 211, the element 280 returns to the starting position and the catch pin 217 returns to the catch position.

[0043] One or more fluids may be applied to the processing surface 201 of the substrate 200 through the first outlet port 240 and the second outlet port 241. For example, the first fluid source 243 may supply deionized water and / or IPA vapor to the second outlet port 241, the second outlet port 241 is positioned to deliver the fluid to the surface of the substrate 200, and the first outlet port 240 may apply deionized (DI) water to the processing side of the substrate 200. The second outlet port 241 is also configured to provide a gas, such as an inert gas, nitrogen, or another desired gas, from a connected gas tray assembly 124.

[0044] The first outlet port 240 may, for example, include a megasonic nozzle. The first outlet port 240 may include one or more elements (e.g., ultrasonic actuators) configured to alternately apply megasonic energy in the form of waves in a cleaning fluid in an alternating manner according to a sinusoidal curve or other pattern to produce a megasonic driven fluid. The cleaning fluid may be delivered from a first fluid source 243 suitable for delivering deionized water and / or a cleaning solution (i.e., an acid or alkaline solution). For example, the first outlet port 240 may be configured to alternately apply megasonic energy in a sinusoidal pattern at a rate between about 430kHz and 5MHz (e.g., 950kHz) to produce megasonic driven deionized water, which is provided to the surface of the substrate 200. Alternatively, other frequencies may be used.

[0045] Fluid may be applied to the back side of the substrate 200 through openings 225 formed in the bottom plate 219, which are coupled to the fluid source 223 through the shaft 224, while the substrate clamping device 203 and the capture cup 210 rotate. The shaft 224 may include one or more tubes (not shown) configured to deliver deionized water, cleaning fluids, and / or gases to the back side of the substrate 200. The openings 225 formed in the substrate 219 are also coupled to one of the gas tray assemblies 124 for providing gas below the substrate 200 when needed.

[0046] The drive motor 222 may be coupled to the substrate gripping device 203 via a shaft 224. The drive motor 222 rotates the substrate gripping device 203 and the capture cup 210 about the rotation axis 216. In addition, the drive motor may be one of a hydraulic motor, a pneumatic motor, an electromechanical motor, and a magnetic motor. The substrate gripping device 203, the substrate 200, and the capture cup 210 are configured to rotate together (e.g., simultaneously) so that the relative speed between the substrate 200 and the capture cup 210 is substantially the same to reduce the chance of droplets being thrown off the surface of the rotating substrate, bouncing off the inner surface of the capture cup 210 and landing on the surface of the substrate due to the delivery of the fluid to the front side or the back side of the substrate.

[0047] The door 202 can cover an opening formed in a wall (e.g., a perimeter wall) 283 and provide access to an interior space 295 of the ICD module 110 for inserting and removing the substrate 200 from the ICD module 110. When the door 202 is in a closed position, the interior space 295 of the ICD module 110 can be referred to as an isolated environment. For example, when the door 202 is closed, the interior space 295 of the ICD module 110 is isolated from the external environment so that fumes (e.g., IPA vapor) and liquids generated and / or used during cleaning of the substrate 200 do not escape from the ICD module 110 during the cleaning process. Any fumes and cleaning liquids used and / or generated during the cleaning process are removed from the ICD module 110 in a controlled manner through the exhaust port 260 and / or the exhaust port 284. Air can be provided to the plenum 282 by the gas source 270 and exhausted from the ICD module 110 through the exhaust port 260. In addition, the plenum 282 and the exhaust port 260 can be configured to control the air flow within the ICD module 110 to prevent particles from reattaching to the surface of the substrate 200. The air flow provided to the ICD module 110 can be provided at a desired pressure and flow rate to ensure that vapors (e.g., IPA vapors) and / or airborne particles, etc. formed in the processing area of ​​the ICD module 110 are removed during processing. In some specific embodiments where nitrogen is delivered to the ICD module 110, it may be desirable to eliminate the use of HEPA filters from the system to reduce system and maintenance costs and reduce system complexity. In some specific embodiments, the gas source 270 is configured to provide filtered air or other gas so that a desired pressure (e.g., greater than atmospheric pressure) is maintained in the processing area of ​​the ICD module 110A.

[0048] Drain 284 may be used to remove excess moisture from ICD module 110. In one embodiment, drain 284 removes excess cleaning fluid from ICD module 110 during the cleaning process.

[0049] The internal space 295 of the ICD module 110 may be defined between the capture cup 210 and the wall (e.g., surrounding wall) 283. The substrate (e.g., substrate 200) may be inserted into the internal space 295 when loaded into the ICD module 110, and removed from the internal space 295 when removed from the ICD module 110.

[0050] The sensing device 294 may detect the substrate 200 within the ICD module 110. For example, the sensing device 294 may detect the substrate 200 within the internal space 295. In addition, the sensing device 294 may detect the substrate 200 when the substrate 200 is held by the substrate gripping device 203. The sensing device 294 may detect when the substrate 200 has been correctly or incorrectly loaded into the substrate gripping device 203. In addition, the sensing device 294 may detect when the substrate 200 has fallen out of or dropped out of the substrate gripping device 203. The sensing device 294 may further determine when the substrate 200 has been inserted into the ICD module 110 and when it has been removed from the ICD module 110.

[0051] The sweep arm 230 is coupled to a sweep arm shaft 232 and a sweep arm drive motor 234 . The sweep arm shaft 232 and the sweep arm drive motor 234 form a sweep arm drive assembly 236 .

[0052] The sweep arm drive motor 234 can be coupled to the sweep arm shaft 232 and configured to move the outlet ports 240, 241 on the distal end of the sweep arm 230 along an arcuate path parallel to the surface of the substrate 200. The sweep arm 230 can include one or more tubes to deliver fluid to the outlet ports 240, 241. The sweep arm drive assembly 236 is configured to move the outlet ports 240, 241 on the surface of the substrate 200 during the cleaning process so that the cleaning fluid output by the outlet ports 240, 241 is evenly distributed on the surface of the substrate 200. The sweep arm drive assembly 236 can also be configured to move the sweep arm 230 vertically to set the distance between the outlet ports 240, 241 and the surface of the substrate 200.

[0053] In some specific embodiments, the second outlet port 241 is suitable for providing IPA vapor to the surface of the substrate 200, while providing deionized water to the surface of the substrate 200 through the first outlet port 240 to produce a "Marangoni" effect to dry the surface of the substrate 200. The IPA vapor is provided by an IPA vapor delivery assembly, which may include an IPA vapor generation source 244 and a carrier gas delivery source 245. The IPA vapor generation source 244 may include an IPA liquid evaporation device (not shown), which is configured to receive liquid IPA and convert it into vapor, and then mix the vapor with a carrier gas (e.g., N) provided by the carrier gas delivery source 245. 2) are mixed and then provided to the substrate surface in a Marangoni drying process. During the horizontally oriented Marangoni drying process, the sweep arm 230 moves the outlet ports 240, 241 along an arcuate path from the center region of the substrate to the edge region to create a moving boundary of deionized water that moves outward from the center of the substrate to the edge. In this case, as the sweep arm 230 moves the outlet ports 240, 241 along the arcuate path from the center region to the edge region, the first outlet port 240 that provides the deionized water to the substrate surface will guide the second outlet port 241 that provides the IPA vapor carrier gas mixture to the substrate surface. The first outlet port 240 is also configured to provide a gas, such as an inert gas, nitrogen, or another desired gas, from one of the gas tray assemblies 124 connected thereto.

[0054] The position of the sweep arm 230 and / or the outlet ports 240, 241 may be adjusted to ensure that the outlet ports 240, 241 pass through the center of the rotating substrate 200 during processing. In addition, at least one of the position of the sweep arm 230 and the position of the outlet ports 240, 241 may be adjusted so that the outlet ports 240, 241 pass through a portion of the substrate 200 other than the center of the substrate 200. For example, the outlet ports 240, 241 may be moved relative to the sweep arm 230 and / or the sweep arm 230 may be moved relative to the sweep arm shaft 232 to change the position of the outlet ports 240, 241 relative to the surface of the substrate 200. In addition, the axial distance between the outlet ports 240, 241 and the surface of the substrate 200 may be varied to facilitate the cleaning process. During the cleaning process, the sweep arm drive motor 234 moves the sweep arm shaft 232, thereby moving the sweep arm 230 and the outlet ports 240, 241 over the substrate 200.

[0055] The various modules 107, 109, 110 included in the cleaning unit 106 are modular. Therefore, the modules 107, 109, 110 can be changed according to the needs of, for example, service and / or routine maintenance or a specific application.

[0056] Return to reference Figures 1A to 1B, the third substrate processor 108 may transfer the substrate 200 from the vertical cleaning module 109B to an available one of the ICD modules 110A, 110B. That is, while one substrate 200 is undergoing cleaning and drying processes in one of the ICD modules 110A, 110B, the third substrate processor 108 may transfer the substrate 200 to the other of the ICD modules 110A, 110B (generally referred to as the ICD module 110) that is not currently performing cleaning and drying processes on the substrate 200. During the transfer of the substrate 200 from the vertical cleaning module 109B to the available ICD module 110, the third substrate processor 108 may rotate the substrate 200 90 degrees around the Y axis so that the processing surface 201 of the substrate 200 faces upward, i.e., along the Z direction, when located in the ICD module 110.

[0057] The first substrate processor 103 may transfer the substrate 200 from the ICD module 110 through a second door 110D formed in a second side panel of the ICD module 110. The first side panel of the ICD module 110 and the second side panel of the ICD module 110 may be parallel to each other and located at opposite sides of the ICD module. The door 110D may be, for example, a slit valve. The first substrate processor 103 may transfer the substrate 200 from the ICD module 110 to one of the loading stations 102A.

[0058] The cleaning unit 106 also includes a fluid and piping section 111. For example, Figure 1B As shown, the fluid and piping portion 111 is disposed at the bottom of the cleaning units 106A, 106B and is located below the robot channel 104T. The fluid and piping portion 111 includes a catch basin 120 for collecting fluid that may leak from the pipeline or splash from one of the modules of the cleaning unit 106. The catch basin 120 includes a sensor 122, which is configured to detect the presence and / or liquid level of the fluid in the catch basin 120. The sensor 122 is coupled to a system controller (not shown). The system controller is configured to output a warning signal based on a meter indicating the presence and / or liquid level of the fluid in the catch basin 120, terminate one or more processes performed in one or more cleaning units 106, or stop the flow of one or more fluids in or to one or more cleaning units 106. The warning signal can be any one or more of a visual signal, an audible signal, an electronic communication (e.g., to another controller, a computer system, a mobile phone, an email, a text message, etc.).

[0059] The fluid and piping section 111 includes a liquid delivery module (LDM) and a gas tray assembly 124. Each cleaning unit 106A, 106B is associated with at least one LDM and at least one gas tray assembly 124. Figure 1BIn the embodiment, LDMs 111A, 111B, 111C and 111D (as well as conduits, valves, etc., not shown) are provided for supplying the processing liquid required by each individual module 107, 109, 110 in each cleaning unit 106A, 106B. For example, LDM 111A can supply processing liquid to the pre-cleaning module 107. Similarly, two different LDMs 111B can each supply processing liquid to a corresponding one of the vertical cleaning modules 109A, 109B, and two different ICD LDMs 111C can each supply processing liquid to a corresponding one of the ICD modules 110.

[0060] In some embodiments, each LDM 111A-111D may be a dedicated liquid delivery module for supplying process liquid to a single specific one of the modules 107, 109, 110. Thus, when one of the cleaning units 106A, 106B is configured with only a single ICD module 110 (as described above), a single ICD LDM 111C may be provided in the corresponding fluid and tubing portion 111 for supplying process liquid to the single ICD module 110.

[0061] As described above, the fluid and piping section 111 also includes at least one gas tray assembly 124 for providing gas to each cleaning unit 106A, 106B. For example, each cleaning unit 106A, 106B includes at least one separate and dedicated gas tray assembly 124. Figure 1B 1, the fluid and piping section 111 includes four gas tray assemblies 124, each of which is labeled 124A, 124B, 124C, and 124D. For example, gas tray assembly 124A supplies process gas to ICD module 110A, while gas tray assembly 124B supplies process gas to another ICD module 110B. Because each ICD module 110 of the cleaning unit 106A, 106B has a dedicated gas tray assembly 124A, 124B, one gas tray assembly 124 can be repaired or replaced while the other ICD modules in the cleaning unit 106A, 106B remain operational. In addition, because each gas tray assembly 124 is modular, different or additional gas tray assemblies 124 can be added if the recipe or process within a particular gas tray assembly 124 changes or if simply by replacing one gas tray assembly 124 with another gas tray assembly and / or adding one or more additional gas tray assemblies 124.

[0062] Figure 3 is configured to provide gas to separate Figure 2Schematic diagram of two gas tray assemblies 124A, 124B of an ICD station 110A, 110B. Gas tray assembly 124A and gas tray assembly 124B are identical, except that the outlet port of gas tray assembly 124A is coupled to ICD module 110A, while the outlet port of gas tray assembly 124B is connected to ICD module 110B.

[0063] The gas tray assembly 124A generally includes an input port 302 and at least three outlet ports, such as a first outlet port 304, a second outlet port 306, and a third outlet port 308. The input port 302 of the gas tray assembly 124A can be directly connected to a gas source 310, or can be coupled to the gas source 310 in parallel with the input port 302 of the gas tray assembly 124B and / or with other input ports of one or more other gas tray assemblies 124. The gas source 310 is configured to provide an inert gas, nitrogen, IPA vapor, clean dry air, or another desired gas.

[0064] The first outlet port 304 is configured to be connected to an opening 225 formed in the bottom plate 219 of the ICD module 110A so that the gas tray assembly 124A can provide gas below the substrate 200 when needed. The second outlet port 306 is configured to be connected to the second outlet port 241, which is also configured to provide gas to the top surface 201 of the substrate 200 as part of the final substrate cleaning process, such as inert gas, nitrogen, IPA vapor, clean dry air, or other desired gas. The third outlet port 308 is configured to be connected to the first outlet port 240 so that the gas tray assembly 124A can provide gas to dry the gripping pins 217 so that subsequently processed substrates are not cross-contaminated by slurry or other particles remaining on the gripping pins 217 after the last substrate cleaning process. The first outlet port 240 and the second outlet port 241 attached to the arm 230 can be rotated to different positions above the substrate 200 (and the bottom plate 219), and can also be rotated away from the substrate 200 (and the bottom plate 219).

[0065] The gas tray assembly 124A includes two main gas conduits 320, 322. Each main gas conduit 320, 322 is connected to the inlet port 302 through a tee 370. Alternatively, the main gas conduits 320, 322 may include a separate inlet port 302 for direct connection to the gas source 310 (as described later in Figure 4 as depicted in ).

[0066] The first main gas conduit 320 includes a pressure regulator 360, a shutoff valve 330, a flow controller 332, and a filter 334. The pressure regulator 360 is disposed between the shutoff valve 330 and the inlet port 302, and is located downstream of the tee 370 when the tee 370 is present. The pressure regulator 360 can be set manually or electronically to control the pressure of the gas entering the first main gas conduit 320. The shutoff valve 330 is connected to the output end of the pressure regulator 360 and can be any suitable shutoff valve. In one example, the shutoff valve 330 is a normally closed solenoid valve.

[0067] The flow controller 332 is set between the shut-off valve 330 and the filter 334. The flow controller 332 can be a mass gas flow meter, a needle valve, a proportional valve or other suitable gas flow controller. Figure 3 In the example shown, the flow controller 332 is a mass gas flow meter.

[0068] The filter 334 is typically a micron-sized filter or other suitable filter. The inlet of the filter 334 is connected to the flow controller 332 , and the output of the filter 334 is connected to the outlet port 304 .

[0069] The second main gas conduit 322 includes a flow splitter 328, such as a tee, which splits the second gas conduit 322 into a first branch 324 and a second branch 326. The first branch 324 is connected to the second outlet port 306. The second branch 326 is connected to the third outlet port 308. The second gas conduit 322 can be split because the gas is not provided through the first outlet port 240 to dry the gripping pins 217 and at the same time reaches the top surface 201 of the substrate 200 through the second outlet port 241 during the final substrate cleaning.

[0070] The pressure regulator 362 is disposed between the flow divider 328 and the input port 302. The pressure regulator 362 can be manually or electronically set to control the pressure of the gas entering the first branch 324 and the second branch 326 of the second main gas conduit 322.

[0071] The first branch 324 includes a shutoff valve 340, a flow controller 336, and a filter 338. The shutoff valve 340 may be any suitable shutoff valve, and in one example, is a normally closed solenoid valve.

[0072] The flow controller 336 is disposed between the shut-off valve 340 and the filter 338. The flow controller 336 may be a mass gas flow meter, a needle valve, a proportional valve, or other suitable gas flow controller. Figure 3 In the example shown, the flow controller 336 is a mass gas flow meter.

[0073] The filter 338 is typically a micron-sized filter or other suitable filter. The inlet of the filter 338 is connected to the flow controller 336 , and the output of the filter 338 is connected to the second outlet port 306 .

[0074] Similarly, the second branch 326 includes a shutoff valve 350, a flow controller 352, and a filter 354. The shutoff valve 350 may be any suitable shutoff valve, and in one example, is a normally closed solenoid valve.

[0075] The flow controller 352 is disposed between the stop valve 340 and the filter 338. The flow controller 352 may be a mass flow controller, a needle valve, a regulating valve or an orifice plate, or other suitable gas flow control device. Figure 3 In the example shown, the flow controller 352 is a needle valve because the flow of gas used to clean the gripping pins 217 does not need to be precisely controlled.

[0076] The filter 338 is typically a micron-sized filter or other suitable filter. The inlet of the filter 338 is connected to the flow controller 352, and the output of the filter 338 is connected to the second outlet port 306.

[0077] Figure 4 4 is a top view of the gas tray assembly 124. The gas tray assembly 124 includes a mounting plate 402 to which the pressure regulators 360, 362, the shutoff valves 330, 340, 350, and the flow controllers 332, 336, 352 are mounted. The filters 334, 338, 354 may optionally be mounted to the mounting plate 402 or may simply be in-line filters. Each of the pressure regulators 360, 362, the shutoff valves 330, 340, 350, and the flow controllers 332, 336, 352 may be mounted to the mounting plate 402 using a bracket 420 that separates the pressure regulators 360, 362, the shutoff valves 330, 340, 350, and the flow controllers 332, 336, 352. Separating the above components above the top surface 416 of the mounting plate 402 provides additional space for tools required to tighten / loosen the pipe fittings that connect the components together. Spacing the components above the top surface 416 of the mounting plate 402 also allows for easier detection of potential leaks.

[0078] The mounting plate 402 is made of a polymer that is resistant to the fluid present in the cleaning unit. In one example, the mounting plate 402 is made of CPVC or PVC. Alternatively, the mounting plate 402 is made of a coated metal to resist damage caused by the fluid present in the cleaning unit.

[0079] The mounting plate 402 is generally rectangular and includes two short sides 404, 408 and two long sides 406, 410. Generally speaking, the input port 302 is disposed at a first side 404 of the mounting plate 402, and the outlet ports 304, 306, 308 are disposed at a second short side 408 of the mounting plate 402. Figure 4 In the illustrated example of the gas tray assembly 124 , the first primary gas conduit 320 and the second primary gas conduit 322 each have a separate input port 302 disposed at a first side 404 of a mounting plate 402 .

[0080] Long side 410 includes cutout 412. Cutout 412 is positioned generally above sensor 122, which is configured to detect fluid in capture basin 120. The size and location of cutout 412 enables maintenance of sensor 122 without removing gas tray assembly 124 from fluid and tubing portion 111.

[0081] The pressure regulators 360, 362 are positioned generally side by side on the top surface 416 of the mounting plate 402. However, one or more of the shutoff valves 330, 340, 350 and / or one or more of the flow controllers 332, 336, 352 may be staggered on the top surface 416 of the mounting plate 402 in a direction parallel to the long side 406 so that the short sides 404, 408 may be smaller and additional tool space is provided for tightening various fittings of the regulators, valves, controllers, and filters connected to the gas tray assembly 124.

[0082] The top surface 416 of the mounting plate 402 includes a plurality of bracket receiving holes 414. In one example, two bracket receiving holes 414 are located along the long side 406, and two other bracket receiving holes 414 are located along the opposite long side 410. The bracket receiving holes 414 may be located in other locations. Figure 5 As better shown, the bottom surface 502 of the mounting plate 402 also includes a plurality of bracket receiving holes 414 that are aligned with the bracket receiving holes 414 present on the top surface 416 or are single holes. Thus, the brackets 504 may be used to connect the top surface 416 of the mounting plate 402 of the gas tray assembly 124A to the bottom surface 502 of the mounting plate 402 of the gas tray assembly 124B. If space permits, one or more additional gas tray assemblies 124 may be stacked on the gas tray assembly 124B using additional brackets 504.

[0083] Thus, the modular gas tray assemblies disclosed herein can be stacked in the bottom area of ​​a cleaning unit. Gas tray assemblies can be easily replaced and / or added to the cleaning unit, thereby enabling efficient and cost-effective service and expansion of the cleaning unit. The location of the stacked gas tray assemblies also allows for ease of maintenance, including enabling one cleaning module to be serviced while other cleaning modules of the cleaning unit remain operational, thereby minimizing the impact on plant output during maintenance.

[0084] While the foregoing is directed to specific embodiments of the present disclosure, other and further embodiments may be envisaged without departing from the underlying scope of the foregoing, and the scope of the foregoing is to be determined by the following claims.

Claims

1. A gas tray assembly, the gas tray assembly include: a first mounting plate; A first main gas conduit, the first main gas conduit being fixed to the first mounting plate, the first main gas conduit comprising: a first inlet port; The first normally closed valve; a first regulator coupled between the first normally closed valve and the first inlet port; a first outlet port; a first filter coupled to the first outlet port; and a first flow controller coupled between the first filter and the first normally closed valve; and A second main gas conduit, the second main gas conduit being fixed to the first mounting plate, the second main gas conduit comprising: a second inlet port; The second normally closed valve; a second regulator coupled between the second normally closed valve and the second inlet port; a second outlet port; a second filter coupled to the second outlet port; a second flow controller, the second flow controller being coupled between the second filter and the second normally closed valve; a third normally closed valve, the third normally closed valve being coupled to a three-way valve, the three-way valve being disposed between the second regulator and the second normally closed valve; Third outlet port; a third filter coupled to the third outlet port; and A third flow controller is coupled between the second filter and the second normally closed valve.

2. The gas tray assembly of claim 1, wherein the first and second flow controllers are mass flow controllers.

3. The gas tray assembly of claim 2, wherein the third flow controller is selected from the group consisting of a mass flow controller, a needle valve, a regulating valve, or an orifice plate.

4. The gas tray assembly of claim 2, wherein the first mounting plate is made of a plastic material.

5. The gas tray assembly of claim 1, wherein the first mounting plate is rectangular.

6. The gas tray assembly of claim 5, wherein the first mounting plate has cutouts disposed along long edges of the rectangular first mounting plate.

7. The gas tray assembly of claim 2, wherein fittings connecting the second normally closed valve to the second flow controller are exposed through the cutout of the first mounting plate.

8. The gas tray assembly of claim 2, wherein the first mounting plate is made of a polymer.

9. The gas tray assembly of claim 1, further comprising: include: a second mounting plate coupled to the first mounting plate; A third main gas conduit, the third main gas conduit being fixed to the second mounting plate, the third main gas conduit comprising: a fourth inlet port; Fourth normally closed valve; a fourth regulator coupled between the fourth normally closed valve and the fourth inlet port; a fourth outlet port; a fourth filter coupled to the fourth outlet port; and a fourth flow controller coupled between the fourth filter and the fourth normally closed valve; and a fourth main gas conduit, the fourth main gas conduit being fixed to the second mounting plate, the fourth main gas conduit comprising: a fifth inlet port; Fifth normally closed valve; a fifth regulator coupled between the fifth normally closed valve and the fifth inlet port; a fifth outlet port; a fifth filter coupled to the fifth outlet port; a fifth flow controller coupled between the fifth filter and the fifth normally closed valve; a sixth normally closed valve, the sixth normally closed valve being coupled to a three-way valve, the three-way valve being set between the fifth regulator and the fifth normally closed valve; a sixth outlet port; a sixth filter coupled to the sixth outlet port; and A sixth flow controller is coupled between the sixth filter and the sixth normally closed valve.

10. The gas tray assembly of claim 9, wherein the second mounting plate is stacked directly above the first mounting plate via a plurality of brackets.

11. The gas tray assembly of claim 9, wherein the first mounting plate is rectangular and has a first cutout disposed along a long edge of the rectangular first mounting plate; and Wherein the second mounting plate is rectangular and has a second cutout disposed along a long edge of the rectangular second mounting plate, wherein the first mounting plate and the second mounting plate have the same size, and wherein the first cutout and the second cutout are aligned with each other and have the same size.

12. A substrate cleaning unit, the substrate cleaning unit include: The gas tray assembly of claim 1, wherein the first and second inlet ports are connected to a common supply fitting and are configured to receive gas from a common gas source; and A first cleaning module (FCM), the first cleaning module comprising: a base plate having gripping pins configured to secure a substrate during processing; a first arm movable between a position above the base plate and away from the base plate; a first FCM outlet port, the first FCM outlet port being disposed on the first arm, the first FCM gas outlet port being connected to the first outlet port; a second FCM outlet port disposed on the first arm, the second FCM gas outlet port being connected to the second outlet port; and A third FCM outlet port is disposed in the bottom plate, and the third FCM gas outlet port is connected to the third outlet port. 13 . The substrate cleaning unit of claim 12 , wherein the gas tray assembly is disposed directly below the first cleaning module.

14. The substrate cleaning unit according to claim 12, further comprising: include: a second cleaning module, the second cleaning module being stacked on the first cleaning module; and A second gas tray assembly is coupled to the second cleaning module.

15. The substrate cleaning unit of claim 14, wherein the second gas tray assembly further comprises: include: a second mounting plate coupled to the first mounting plate; A third main gas conduit, the third main gas conduit being fixed to the second mounting plate, the third main gas conduit comprising: a fourth inlet port; a fourth normally closed valve coupled to the fourth inlet port; a fourth regulator coupled between the fourth normally closed valve and the fourth inlet port; a fourth outlet port coupled to a first clean module (SMC) gas outlet port of the second clean module; a fourth filter coupled to the fourth outlet port; and a fourth flow controller coupled between the fourth filter and the fourth normally closed valve; and a fourth main gas conduit, the fourth main gas conduit being fixed to the second mounting plate, the fourth main gas conduit comprising: a fifth inlet port, the fourth and fifth inlet ports connected to a common supply fitting and configured to receive gas from the common gas source; Fifth normally closed valve; a fifth regulator coupled between the fifth normally closed valve and the fifth inlet port; a fifth outlet port coupled to a second clean module (SMC) gas outlet port of the second clean module; a fifth filter coupled to the fifth outlet port; a fifth flow controller coupled between the fifth filter and the fifth normally closed valve; a sixth normally closed valve, the sixth normally closed valve being coupled to a three-way valve, the three-way valve being set between the fifth regulator and the fifth normally closed valve; a sixth outlet port coupled to a third clean module (SMC) gas outlet port of the second clean module; a sixth filter coupled to the sixth outlet port; and A sixth flow controller is coupled between the sixth filter and the sixth normally closed valve. 16 . The substrate cleaning unit of claim 15 , wherein the second mounting plate is stacked directly above the first mounting plate and directly below the first and second cleaning modules.

17. The substrate cleaning unit of claim 16, wherein the first mounting plate is rectangular and has a first cutout disposed along a long edge of the rectangular first mounting plate; and Wherein the second mounting plate is rectangular and has a second cutout disposed along a long edge of the rectangular second mounting plate, wherein the first mounting plate and the second mounting plate have the same size, and wherein the first cutout and the second cutout are aligned with each other and have the same size.

18. The substrate cleaning unit according to claim 17, further comprising: include: a capture basin, the capture basin being disposed below the first gas tray; and A fluid sensor is disposed in the capture basin directly below and aligned with the first and second cutouts.

19. A substrate processing system, comprising: Chemical Mechanical Polisher; Substrate conveyor ； and a substrate cleaning unit coupled to the chemical mechanical polisher, the substrate conveying device being configured to move a substrate from the chemical mechanical polisher to the substrate cleaning unit, the substrate cleaning unit further comprising: The first multiple stacked integrated cleaner-dryers; a first plurality of stacked gas trays, the first plurality of stacked gas trays being disposed directly below the first plurality of stacked integrated cleaning dryers, a respective one of the first plurality of stacked gas trays being connected to a respective one of the first plurality of stacked integrated cleaning dryers; a second plurality of stacked integrated cleaning dryers, the second plurality of stacked integrated cleaning dryers being laterally offset from the first plurality of stacked integrated cleaning dryers; and A second plurality of stacked gas trays are disposed directly below the second plurality of stacked integrated cleaning dryers, and a corresponding one of the second plurality of stacked gas trays is connected to a corresponding one of the second plurality of stacked integrated cleaning dryers.

20. The substrate processing system of claim 19, wherein each of the gas trays in the first plurality of stacked gas trays further comprises include: Mounting plate; A first main gas conduit, the first main gas conduit being fixed to the first mounting plate, the first main gas conduit comprising: a first inlet port; The first normally closed valve; a first regulator coupled between the first normally closed valve and the first inlet port; a first outlet port coupled to a first gas outlet port positioned on a swing arm of a first integrated cleaner-dryer of the first plurality of stacked integrated cleaner-dryers; a first filter coupled to the first outlet port; and a first flow controller coupled between the first filter and the first normally closed valve; and A second main gas conduit, the second main gas conduit being fixed to the first mounting plate, the second main gas conduit comprising: a second inlet port coupled to the first inlet port, the first and second inlet ports being configured to receive a gas from a common source; The second normally closed valve; a second regulator coupled between the second normally closed valve and the second inlet port; a second outlet port coupled to a second gas outlet port positioned on the swing arm of the first one of the first plurality of stacked integrated cleaner-dryers; a second filter coupled to the second outlet port; a second flow controller, the second flow controller being coupled between the second filter and the second normally closed valve; a third normally closed valve, the third normally closed valve being coupled to a three-way valve, the three-way valve being disposed between the second regulator and the second normally closed valve; a third inlet port coupled to a third gas outlet disposed in a bottom plate of the first integrated cleaner-dryer of the first plurality of stacked integrated cleaner-dryers; a third filter coupled to the third outlet port; and A third flow controller is coupled between the second filter and the second normally closed valve.

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