Multilayer device and substrate module

Abstract

A multilayer device is provided with: a dielectric; a signal line provided inside the dielectric; a plurality of planar electrodes provided inside the dielectric and arranged along one direction; a plurality of extraction electrodes provided inside or on the outer surface of the dielectric; a plurality of connection electrodes provided inside the dielectric and connecting the plurality of planar electrodes and the plurality of extraction electrodes; a plurality of signal terminals connected to the signal line; and a plurality of ground terminals which are set to a ground potential and are connected to the plurality of extraction electrodes. A plurality of groups of structures, each of which includes a planar electrode, a connection electrode, an extraction electrode, and a ground terminal, are separated from each other without being connected to each other inside and on the outer surface of the dielectric.

Description

Technical Field

[0001] The present disclosure relates to a multilayer device and a substrate module including the multilayer device. Background Art

[0002] In the past, a functional substrate for controlling the passing characteristics of high-speed digital signals and high-frequency signals (hereinafter referred to as high-speed / high-frequency signals) is known. As an example of such a functional substrate, Patent Document 1 discloses a functional substrate having a mushroom-shaped structure composed of a conductor element (planar electrode) and a through-path (connection electrode), and a conductor (ground electrode) that functions as a ground. The functional substrate has a structure in which the mushroom-shaped structure is periodically arranged, and can suppress the passage of a signal of a specific frequency among high-speed / high-frequency signals.

[0003] Prior Art Literature

[0004] Patent Literature

[0005] Patent Document 1: International Publication No. 2011 / 111311 Summary of the invention

[0006] However, in conventional functional substrates, although it is possible to block the passage of signals of specific frequencies among high-speed / high-frequency signals, it is sometimes impossible to form a stop band that blocks the passage of high-speed / high-frequency signals due to the required specifications for multilayer devices.

[0007] A multilayer device according to one embodiment of the present disclosure includes: a dielectric; a signal line disposed inside the dielectric so that a portion is exposed on the outer surface of the dielectric; a plurality of planar electrodes disposed inside the dielectric and arranged along a first direction; a plurality of extraction electrodes disposed inside or outside the dielectric so that at least a portion is exposed on the outer surface of the dielectric; a plurality of connection electrodes disposed inside the dielectric to connect the plurality of planar electrodes and the plurality of extraction electrodes; a plurality of signal terminals disposed on the outer surface of the dielectric and connected to the signal line; and a plurality of ground terminals disposed on the outer surface of the dielectric, set to a ground potential, and connected to the plurality of extraction electrodes. The plurality of planar electrodes, the plurality of connection electrodes, the plurality of extraction electrodes, and the plurality of ground terminals constitute a plurality of structures. Each of the plurality of structures includes a corresponding one of the planar electrodes, a corresponding one of the connection electrodes, a corresponding one of the extraction electrodes, and a corresponding one of the ground terminals. The plurality of structures are separated from each other without being connected to each other inside and outside the dielectric.

[0008] A multilayer device according to one embodiment of the present disclosure comprises: a dielectric; a signal line arranged inside the dielectric so that a portion is exposed on the outer surface of the dielectric; a plurality of planar electrodes arranged inside the dielectric and arranged along one direction; a plurality of extraction electrodes arranged inside or on the outer surface of the dielectric so that at least a portion is exposed on the outer surface of the dielectric; a plurality of connection electrodes arranged inside the dielectric; a plurality of signal terminals arranged on the outer surface of the dielectric and connected to the signal line; and a plurality of ground terminals arranged on the outer surface of the dielectric and set to a ground potential, the plurality of planar electrodes and the plurality of connection electrodes being connected one-to-one, the plurality of connection electrodes and the plurality of extraction electrodes being connected one-to-one, and the plurality of extraction electrodes and the plurality of ground terminals being connected one-to-one.

[0009] A substrate module according to one aspect of the present disclosure includes the above-mentioned multilayer device.

[0010] According to the multilayer device and the like of the present disclosure, a stop band can be formed according to required specifications. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Figure 1 is a perspective view showing an example of a multilayer device.

[0012] Figure 2 It is shown Figure 1 A diagram of an example of an equivalent circuit of a multilayer device is shown.

[0013] Figure 3 This is an external view of the multilayer device according to the first embodiment.

[0014] Figure 4A This is a diagram showing a signal line, a planar electrode, a connection electrode, an extraction electrode, and the like of the multilayer device according to the first embodiment.

[0015] Figure 4B This is a diagram showing a signal line, a planar electrode, a connection electrode, and a lead electrode extracted from the multilayer device according to the first embodiment.

[0016] Figure 5A This is a plan view of the signal line and the like of the multilayer device according to the first embodiment as viewed from above.

[0017] Figure 5B is from Figure 5A The cross-sectional view of the multilayer device according to the first embodiment is shown as viewed along the VB-VB line.

[0018] Figure 5C This is a bottom view of the multilayer device according to the first embodiment.

[0019] Figure 6 This is a diagram showing a substrate module including the multilayer device according to the first embodiment.

[0020] Figure 7 This is an external view of a multilayer device according to Modification 1 of Embodiment 1.

[0021] Figure 8 This is a diagram showing a signal line, a planar electrode, a connection electrode, an extraction electrode, and the like of a multilayer device according to a second modification of the first embodiment.

[0022] Fig. 9 This is a diagram showing a substrate module including a multilayer device according to a second modification of the first embodiment.

[0023] Fig.10 This is a diagram showing a signal line, a planar electrode, a connection electrode, an extraction electrode, and the like of a multilayer device according to a third modification of the first embodiment.

[0024] Fig.11 This is an appearance diagram of a multilayer device according to Modification 4 of Embodiment 1.

[0025] Fig.12 This is a diagram showing a signal line, a planar electrode, a connection electrode, an extraction electrode, and the like of a multilayer device according to a fourth modification of the first embodiment.

[0026] Fig.13 This is a diagram showing a signal line, a planar electrode, a connection electrode, an extraction electrode, and the like of a multilayer device according to a fifth modification of the first embodiment.

[0027] Fig.14 This is an external view of a multilayer device according to the second embodiment.

[0028] Fig.15 This is a diagram showing a signal line, a planar electrode, a connection electrode, an extraction electrode, and the like of a multilayer device according to a second embodiment. DETAILED DESCRIPTION

[0029] (The process of realizing this disclosure)

[0030] Regarding the process of realizing the present disclosure, refer to Figure 1 as well as Figure 2 to explain.

[0031] Figure 1 1 is a perspective view showing an example of the multilayer device 1 .

[0032] like Figure 1As shown, the multilayer device 1 includes: a signal line 20 for transmitting a high-speed / high-frequency signal; a ground electrode 30z set to a ground potential; a plurality of planar electrodes 40 arranged along the signal line 20; and a plurality of connecting electrodes 50 for connecting the ground electrode 30z and the plurality of planar electrodes 40. The signal line 20, the ground electrode 30z, the planar electrode 40, and the connecting electrode 50 are inside or on the surface of a dielectric. The connecting electrode 50 is an example of a via electrode.

[0033] The multilayer device 1 has a structure in which a plurality of mushroom-shaped structures 501 are arranged at intervals sufficiently small relative to the wavelength of the electromagnetic wave, and the mushroom-shaped structures 501 include a planar electrode 40 and a connecting electrode 50. In this way, a structure in which a plurality of mushroom-shaped structures 501 are arranged at intervals sufficiently small relative to the wavelength of the electromagnetic wave is also called an EBG (Electromagnetic Band Gap) structure. In the multilayer device 1 having the EBG structure, the effective dielectric constant and the magnetic permeability in the medium can be made negative.

[0034] Figure 2 It is shown Figure 1 FIG. 1 is a diagram showing an example of an equivalent circuit of a multilayer device 1 .

[0035] Figure 2 The equivalent circuit shown is composed of the inductive component L20 of the signal line 20 and a parallel circuit 502 (parallel resonant circuit) provided between the path connecting the signal line 20 and the ground electrode 30z. The parallel circuit 502 is composed of the capacitive component C40 based on the signal line 20 and the planar electrode 40, the inductive component L50 based on the connecting electrode 50, and the capacitive component C20 based on the signal line 20 and the ground electrode 30z.

[0036] In the multilayer device 1, by configuring a plurality of Figure 1 The mushroom-shaped structure 501 shown can Figure 2 The admittance of the parallel circuit 502 shown is controlled so that the dielectric constant becomes a negative value. In the frequency band where the dielectric constant becomes negative, high-speed / high-frequency signals cannot propagate on the signal line, and the multilayer device 1 functions as a band-stop filter.

[0037] The multilayer device of the present embodiment has the following structure in order to form a stop band that blocks the passage of high-speed / high-frequency signals in accordance with required specifications.

[0038] Hereinafter, the embodiments will be described in more detail with reference to the drawings.

[0039] In addition, the embodiments described below all represent a specific example of the present disclosure. The numerical values, shapes, materials, structural elements, configuration positions of structural elements, connection methods, steps, and the order of steps shown in the following embodiments are examples and are not intended to limit the present disclosure. In addition, for the structural elements in the following embodiments that are not recorded in the independent technical solutions, they are described as arbitrary structural elements.

[0040] In addition, in this specification, terms such as parallel that indicate the relationship between elements, terms such as rectangular that indicate the shape of elements, and numerical ranges do not express only strict meanings, but are intended to include substantially equivalent ranges, such as differences of several percent.

[0041] In addition, each figure is a schematic diagram that appropriately emphasizes, omits, or adjusts the ratio in order to express the present disclosure, and may not be strictly illustrated, and may sometimes be different from the actual shape, positional relationship, and ratio. In each figure, the same symbol is given to substantially the same structure, and repeated descriptions are sometimes omitted or simplified.

[0042] In addition, in this specification, terms such as "top surface" and "bottom surface" in the structure of a multilayer device do not refer to the top surface (the surface on the vertically upper side) and the bottom surface (the surface on the vertically lower side) in absolute spatial identification, but are used as terms defined by the relative positional relationship of the structural elements of the multilayer device.

[0043] (Implementation method 1)

[0044] [Structure of multilayer device]

[0045] The structure of the multilayer device 1A according to the first embodiment will be described.

[0046] Figure 3 This is an external view of the multilayer device 1A according to the first embodiment. Figure 4A 1A is a diagram showing a signal line 20 , planar electrodes 41 , 42 , 43 , connection electrodes 51 , 52 , 53 , and lead electrodes 31 , 32 , 33 of a multilayer device 1A. Figure 4B The diagram shows a signal line 20 , planar electrodes 41 , 42 , 43 , connection electrodes 51 , 52 , 53 , and lead electrodes 31 , 32 , 33 extracted from the multilayer device 1A. Figure 5A This is a plan view of the signal line 20 and the like of the multilayer device 1A as viewed from above. Figure 5B is from Figure 5A The cross-sectional view of the multilayer device 1A taken along line VB-VB is shown. Figure 5C is a bottom view of the multilayer device 1A.

[0047] Figure 3 , Figure 4A, Figure 4B as well as Figure 5A to Figure 5C The multilayer device 1A shown in the figure includes a dielectric 10, a signal line 20, a plurality of planar electrodes 41, 42 and 43, a plurality of connection electrodes 51, 52 and 53, and a plurality of extraction electrodes 31, 32 and 33. In addition, the multilayer device 1A includes a plurality of signal terminals 61 and 62 and a plurality of ground terminals 71, 72 and 73. Figure 4A In FIG. 1 , the signal line 20 is indicated by a thick dashed line, and the lead electrodes 31, 32, and 33 are indicated by a single-dot chain line. Figure 5C The signal lines and planar electrodes are omitted in the illustration.

[0048] Hereinafter, a part or all of the plurality of planar electrodes 41 to 43 may be referred to as a planar electrode 40, a part or all of the plurality of connection electrodes 51 to 53 may be referred to as a connection electrode 50, and a part or all of the plurality of extraction electrodes 31 to 33 may be referred to as an extraction electrode 30. In addition, a part or all of the plurality of signal terminals 61 and 62 may be referred to as a signal terminal 60, and a part or all of the plurality of ground terminals 71 to 73 may be referred to as a ground terminal 70.

[0049] For example, the signal line 20, the extraction electrode 30, the planar electrode 40 and the connecting electrode 50 are formed of metal materials such as silver or copper. In addition, the signal line 20, the extraction electrode 30, the planar electrode 40 and the connecting electrode 50 can be formed of the same material or the same composition ratio, or can be formed of different materials or different composition ratios.

[0050] The dielectric 10 is formed, for example, by stacking a plurality of dielectric layers. The dielectric 10 is formed, for example, by a dielectric material such as low temperature co-fired ceramics (LTCC). In order to miniaturize the multilayer device 1A, it is desirable to use a material with a relatively high dielectric constant as the dielectric 10. The dielectric 10 is respectively disposed between the signal line 20, the lead electrode 30, and the planar electrode 40. In addition, the dielectric 10 is formed to cover the outer peripheral surface of the signal line 20 except the two end surfaces, the outer peripheral surface of the lead electrode 30 except the end surface of one side (the end surface of the other end described later), the planar electrode 40, and the connecting electrode 50.

[0051] The dielectric 10 has a rectangular parallelepiped shape, and has a bottom surface 16, a top surface 17 opposite to the bottom surface 16, and a plurality of side surfaces 11, 12, 13, and 14 connecting the bottom surface 16 and the top surface 17. The plurality of side surfaces 11 to 14 include the side surfaces 11 and 12 opposite to each other, and the side surfaces 13 and 14 perpendicular to the side surfaces 11 and 12. The bottom surface 16 and the top surface 17 are parallel to each other, the side surfaces 11 and 12 are parallel to each other, and the side surfaces 13 and 14 are parallel to each other. The corner portions (ridgeline portions) where the surfaces of the dielectric 10 intersect may also have rounded corners.

[0052] Here, the direction in which the side surface 11 and the side surface 12 face each other is referred to as the first direction d1, the direction in which the side surface 13 and the side surface 14 face each other is referred to as the second direction d2, and the direction in which the bottom surface 16 and the top surface 17 face each other is referred to as the third direction d3. In addition, hereinafter, the negative side of the first direction d1 is sometimes referred to as one side, and the positive side opposite to the negative side is sometimes referred to as the other side.

[0053] The signal line 20 is linear and strip-shaped and is arranged along the first direction d1. The signal line 20 is arranged inside the dielectric 10 so that both ends of the signal line 20, which are part of the signal line 20, are exposed on the outer surface (side surface 11, 12) of the dielectric 10. The signal line 20 is parallel to the planar electrode 40 and is arranged closer to the top surface 17 than the planar electrode 40. When the multilayer device 1A is mounted on the substrate module, high-speed / high-frequency signals are input and output in the signal line 20 via the signal terminal 60.

[0054] The signal terminal 60 is provided on the side surfaces 11 and 12 as an example of the outer surface of the dielectric 10. One of the two signal terminals 61 and 62 is provided on the side surface 11, and the other signal terminal 62 is provided on the side surface 12. One signal terminal 61 is connected to one end of the signal line 20, and the other signal terminal 62 is connected to the other end of the signal line 20.

[0055] The plurality of planar electrodes 40 are planar electrodes having a rectangular shape. In addition, the shape of the planar electrode 40 is not limited to a rectangle, and may be a square, a polygon, a circle, or an ellipse. The plurality of planar electrodes 41, 42, and 43 are arranged in this order at equal intervals along the first direction d1 from the input side toward the output side of the signal line 20. The planar electrodes 41, 42, and 43 have the same shape, the same size, and the same area.

[0056] Each planar electrode 40 is arranged parallel to the signal line 20. Each planar electrode 40 is arranged inside the dielectric 10 so as to be located between the signal line 20 and each extraction electrode 30 corresponding to each planar electrode 40 in the third direction d3. For example, the planar electrode 41 is arranged inside the dielectric 10 so as to be located between the signal line 20 and the extraction electrode 31, the planar electrode 42 is arranged inside the dielectric 10 so as to be located between the signal line 20 and the extraction electrode 32, and the planar electrode 43 is arranged inside the dielectric 10 so as to be located between the signal line 20 and the extraction electrode 33.

[0057] The plurality of connection electrodes 50 are via conductors each having a cylindrical shape and are provided inside the dielectric 10. Figure 5B As shown, the connection electrode 50 is a via conductor that penetrates a portion 10P of the dielectric 10 between the plurality of planar electrodes 40 and the plurality of extraction electrodes 30. The via diameter of the connection electrode 50 is, for example, 100 μm. The plurality of connection electrodes 51, 52, 53 are arranged at equal intervals in this order along the first direction d1. The connection electrodes 51, 52, 53 have the same shape, the same size, and the same length. The connection electrodes 51 to 53 are arranged along the first direction d1 so as to correspond one-to-one with the planar electrodes 41 to 43 and the extraction electrodes 30.

[0058] Each connecting electrode 50 penetrates the dielectric 10 between each planar electrode 40 and each extraction electrode 30 to connect each planar electrode 40 with each extraction electrode 30. For example, the connecting electrode 51 connects the planar electrode 41 with the extraction electrode 31, the connecting electrode 52 connects the planar electrode 42 with the extraction electrode 32, and the connecting electrode 53 connects the planar electrode 43 with the extraction electrode 33.

[0059] like Figure 5A As shown, when viewed from the third direction d3 perpendicular to the planar electrode 40, each connecting electrode 50 is arranged at a corner of the outer peripheral end of each planar electrode 40. When viewed from the direction perpendicular to the planar electrode 40, the connecting electrode 50 does not overlap with the signal line 20, but overlaps with the outer peripheral end of the planar electrode 40 in the second direction d2 and the end of the lead-out electrode 30. In addition, the plurality of connecting electrodes 50 are arranged along the first direction d1 to cross the signal line 20 in a zigzag shape. Specifically, the connecting electrode 51 is arranged close to the side 13 when viewed from the signal line 20, the connecting electrode 52 is arranged close to the side 14 when viewed from the signal line 20, and the connecting electrode 53 is arranged close to the side 13 when viewed from the signal line 20. That is, the plurality of connecting electrodes 51, 52, 53 are arranged in sequence along the first direction d1 so as to be alternately close to the side surfaces 13 and 14 facing away from each other.

[0060] The plurality of extraction electrodes 30 are strip-shaped wirings arranged along the second direction d2. Each extraction electrode 30 is parallel to the planar electrode 40 and arranged closer to the bottom surface 16 than the planar electrode 40. The plurality of extraction electrodes 31, 32, 33 are arranged in this order at equal intervals along the first direction d1.

[0061] The width (length in the first direction d1) of the lead electrode 30 is greater than the thickness (length in the first direction d1) of the connection electrode 50 and less than the length in the first direction d1 of the plane electrode 40. The length (length in the second direction d2) of the lead electrode 30 is greater than the length in the second direction d2 of the plane electrode 40 and less than the length in the second direction d2 of the multilayer device 1A. The lead electrode 30 is led out to the side surface 13 and 14 that is farther from the connection electrode 50 rather than the side surface that is closer. The lead electrodes 30 have the same width (length in the first direction d1), the same length in the second direction d2, and the same thickness in the third direction d3.

[0062] Each extraction electrode 30 is provided inside the dielectric 10 so that a part of the extraction electrode 30 is exposed on the outer surface of the dielectric 10. With respect to the extraction electrode 31, one end of the extraction electrode 31 is connected to the connection electrode 51, and the other end constitutes a portion 31P that is in contact with the side surface 13 of the dielectric 10 and exposed from the dielectric 10. With respect to the extraction electrode 32, one end of the extraction electrode 32 is connected to the connection electrode 52, and the other end constitutes a portion 32P that is in contact with the side surface 14 of the dielectric 10 and exposed from the dielectric 10. With respect to the extraction electrode 33, one end of the extraction electrode 33 is connected to the connection electrode 53, and the other end constitutes a portion 33P that is in contact with the side surface 13 of the dielectric 10 and exposed from the dielectric 10. In this way, each extraction electrode 30 extends from a position close to one side surface (side surface 14 or 13) of the two side surfaces 13 and 14 toward the other side surface (side surface 13 or 14), and is connected to each ground terminal 70 at the other side surface (side surface 14 or 13).

[0063] A plurality of ground terminals 70 are provided on the outer surface of the dielectric 10. A plurality of ground terminals 71, 72, 73 are provided on two side surfaces 13, 14 among the four side surfaces 11 to 14. A plurality of ground terminals 71 to 73 are provided on two side surfaces 13, 14 different from the side surfaces 11, 12 on which the plurality of signal terminals 60 are provided. Each ground terminal 70 is formed to be in contact with the bottom surface 16, and to extend from the bottom surface 16 side along the side surface 13 or 14 toward the top surface 17 side, and to be in contact with the top surface 17. In addition, for example, one ground terminal 71 is formed only on the side surface 13, but it may be formed to be U-shaped so as to be extended to the top surface 17 and the bottom surface 16 of the dielectric 10 in a winding manner.

[0064] The plurality of ground terminals 71 to 73 are arranged along the first direction d1 so as to cross the signal line 20 in a zigzag shape. For example, when viewed from the signal line 20, the ground terminals 71 and 73 are provided on the side surface 13 located on the opposite side to the connection electrodes 51 and 53, and the ground terminal 72 is provided on the side surface 14 located on the opposite side to the connection electrode 52. The ground terminal 71 is connected to the portion 31P which is the other end of the extraction electrode 31, the ground terminal 72 is connected to the portion 32P which is the other end of the extraction electrode 32, and the ground terminal 73 is connected to the portion 33P which is the other end of the extraction electrode 33.

[0065] When the multilayer device 1A is mounted on the substrate module, the grounding terminals 71, 72, 73 are set to ground potential. The extraction electrodes 31, 32, 33, the connection electrodes 51, 52, 53, and the planar electrodes 41, 42, 43 electrically connected to the grounding terminals 71, 72, 73 are also set to ground potential.

[0066] In the present embodiment, a plurality of planar electrodes 41, 42, 43 and a plurality of connecting electrodes 51, 52, 53 are connected in one-to-one correspondence. In addition, a plurality of connecting electrodes 51, 52, 53 and a plurality of extraction electrodes 31, 32, 33 are connected in one-to-one correspondence. In addition, a plurality of extraction electrodes 31, 32, 33 and a plurality of grounding terminals 71, 72, 73 are connected in one-to-one correspondence. In other words, the first structure S1 including the planar electrode 41, the connecting electrode 51, the extraction electrode 31 and the grounding terminal 71, the second structure S2 including the planar electrode 42, the connecting electrode 52, the extraction electrode 32 and the grounding terminal 72, and the third structure S3 including the planar electrode 43, the connecting electrode 53, the extraction electrode 33 and the grounding terminal 73 are not connected to each other but are separated. In this way, the plurality of planar electrodes 41, 42, 43, the plurality of connecting electrodes 51, 52, 53, the plurality of extraction electrodes 31, 32, 33 and the plurality of grounding terminals 71, 72, 73 constitute a plurality of structures S1, S2, S3. The plurality of structures S1, S2, S3 each include a corresponding one of the plurality of planar electrodes 41, 42, 43, a corresponding one of the plurality of connecting electrodes 51, 52, 53, a corresponding one of the plurality of extraction electrodes 31, 32, 33, and a corresponding one of the plurality of grounding terminals 71, 72, 73.

[0067] Thus, in the present embodiment, a plurality of groups of structures S1 to S3, which are a group of structures including a planar electrode, a connecting electrode, a lead electrode, and a ground terminal, are separated and not connected to each other inside and on the outer surface of the dielectric 10. Therefore, when the multilayer device 1A is mounted on a printed circuit substrate, an inductance value can be generated based on the wiring on the printed circuit substrate connected to the ground terminal 70. For example, by increasing the length of the wiring on the printed circuit substrate, the inductance value formed by the wiring and the above-mentioned structure can be increased, and by shortening the length of the wiring on the printed circuit substrate, the inductance value formed by the wiring and the above-mentioned structure can be reduced. By changing the inductance value in this way, it is possible to change each inductance component L50 (refer to Figure 2 ) value, the frequency of the stop band of the multilayer device 1A can be changed. Thus, the stop band can be formed according to the required specifications. In addition, by changing the value of each inductive component L50 formed by each wiring on the printed circuit board and the above-mentioned multiple sets of structures S1 to S3, the stop band of the multilayer device 1A can be widened.

[0068] [Manufacturing method of multilayer device]

[0069] First, one or more green sheets without electrode patterns are stacked to form a lower layer sheet. The green sheet is a dielectric sheet that becomes a dielectric layer after sintering. Next, a green sheet with a plurality of lead electrode patterns is stacked on the lower layer sheet. The lead electrode pattern is a printed pattern that becomes the lead electrode 30 after sintering. The plurality of lead electrode patterns are formed separately from each other on the green sheet.

[0070] Next, a plurality of green sheets having a plurality of connection electrode patterns are stacked on the green sheet having a plurality of extraction electrode patterns. The connection electrode pattern is a printed pattern that becomes the connection electrode 50 after firing. The plurality of connection electrode patterns are formed separately from each other on the green sheet.

[0071] Next, a green sheet having a plurality of sets of connection electrode patterns and plane electrode patterns is stacked on the stacked green sheets. The plane electrode pattern is a printed pattern that becomes the plane electrode 40 after sintering. The plurality of sets of connection electrode patterns and plane electrode patterns, each set of which is a connection electrode pattern and a plane electrode pattern, are formed separately from each other on the green sheet.

[0072] Next, a green sheet having a signal line pattern is stacked on the green sheet having a plurality of connection electrode patterns and a planar electrode pattern. The signal line pattern is a printed pattern that becomes the signal line 20 after sintering. Next, one or more green sheets without an electrode pattern are stacked on the green sheet having the signal line pattern to form an upper layer sheet.

[0073] The stacked sheet group is punched to form a mother laminate. Next, the mother laminate is cut into individual pieces, and the individual laminate is sintered. In addition, two signal terminals 60 and three ground terminals 70 are formed on the side of the sintered laminate. Thus, the above-mentioned multilayer device 1A is manufactured.

[0074] According to this method, a plurality of sets of structures S1 to S3, each of which includes a planar electrode, a connection electrode, an extraction electrode, and a ground terminal, can be formed in a state separated from each other inside and on the outer surface of the dielectric 10. In addition, by arranging a plurality of extraction electrode patterns separated from each other, the upper and lower green sheets can be brought into close contact with each other in the region between two adjacent extraction electrode patterns. Thus, the interlayer adhesion in the region where the extraction electrode 30 is formed can be improved.

[0075] [Base module]

[0076] A substrate module 80 including the multilayer device 1A according to the embodiment will be described. The substrate module 80 is a substrate built into an electric device or the like.

[0077] Figure 6 1 is a diagram showing a substrate module 80 including a multilayer device 1A according to the embodiment.

[0078] like Figure 6 As shown in FIG. 1 , the substrate module 80 includes the multilayer device 1A and the printed circuit board 90. In addition, the substrate module 80 may include other electronic components different from the multilayer device 1A. Figure 6 In the figure, pad electrodes on the printed circuit board 90 and bonding agents such as solder are omitted.

[0079] The multilayer device 1A is mounted on a printed circuit board 90 by a bonding agent such as solder.

[0080] Wires 96 and 97 for transmitting high-speed / high-frequency signals are provided on the mounting surface 90a of the printed circuit board 90. Wire 96 extends toward the side surface 11 of the multilayer device 1A and is connected to the signal terminal 61. Wire 97 extends toward the side surface 12 of the multilayer device 1A and is connected to the signal terminal 62.

[0081] In addition, a ground electrode 99 set to a ground potential and wirings 91, 92, and 93 connected to the ground electrode 99 are provided on the mounting surface 90a of the printed circuit substrate 90. The ground electrode 99 is arranged at a predetermined interval relative to the multilayer device 1A. In addition, when a ground electrode is provided on the back side of the printed circuit substrate 90, the ground electrode 99 on the surface may be connected to the ground electrode on the back side via a via electrode formed along the thickness direction of the printed circuit substrate 90.

[0082] Each of the wirings 91 to 93 extends linearly from the ground electrode 99 toward the side surface 13 or 14 of the multilayer device 1A, and is connected to the ground terminal 70 .

[0083] For example, the wiring 91 extends from the ground electrode 99 toward the side surface 13 of the multilayer device 1A and is connected to the ground terminal 71. The wiring 92 extends from the ground electrode 99 toward the side surface 14 of the multilayer device 1A and is connected to the ground terminal 72. The wiring 93 extends from the ground electrode 99 toward the side surface 13 of the multilayer device 1A and is connected to the ground terminal 73.

[0084] The width and thickness of each wiring 91 to 93 are the same, and the lengths of each wiring 91 to 93 are different from each other. In this example, the length of wiring 91 is shorter than the length of wiring 92, and the length of wiring 92 is shorter than the length of wiring 93. That is, the inductance value formed by wiring 91, ground terminal 71, extraction electrode 31, connection electrode 51 and plane electrode 41 is smaller than the inductance value formed by wiring 92, ground terminal 72, extraction electrode 32, connection electrode 52 and plane electrode 42. In addition, the inductance value formed by wiring 92, ground terminal 72, extraction electrode 32, connection electrode 52 and plane electrode 42 is smaller than the inductance value formed by wiring 93, ground terminal 73, extraction electrode 33, connection electrode 53 and plane electrode 43.

[0085] In the above example, the example in which the inductance values ​​formed by the wiring, the ground terminal, the extraction electrode, the connection electrode, and the plane electrode are made different by changing the length of each wiring 91 to 93 is shown, but it is not limited to this. For example, the above inductance values ​​may be made different by changing at least one of the length, width, and thickness of the wiring. In addition, the wirings 91 to 93 are not limited to straight lines, but may have a meandering shape.

[0086] Thus, the substrate module 80 includes a printed circuit board 90 and a multilayer device 1A mounted on the printed circuit board 90. The printed circuit board 90 includes a ground electrode 99 and a plurality of wirings 91, 92, and 93 connected to the ground electrode 99. The wiring 91 is connected to the ground terminal 71 of the multilayer device 1A, the wiring 92 is connected to the ground terminal 72 of the multilayer device 1A, and the wiring 93 is connected to the ground terminal 73 of the multilayer device 1A. The wirings 91, 92, and 93 have different inductance values.

[0087] According to the substrate module 80, an inductance value can be generated based on the wirings 91 to 93 on the printed circuit board 90 connected to the ground terminal 70. By changing the inductance value, the value of each inductance component L50 formed by each wiring 91 to 93 on the printed circuit board 90 and the plurality of sets of structures S1 to S3 can be changed, and the frequency of the stop band of the substrate module 80 including the multilayer device 1A can be changed. In this way, the stop band can be formed according to the required specifications.

[0088] Furthermore, when the inductance values ​​formed by the wiring, the ground terminal, the extraction electrode, the connection electrode, and the plane electrode are made equal, the inductance values ​​may be made equal by making the wiring lengths equal.

[0089] [Variation 1 of Implementation Example 1]

[0090] A description will be given of a multilayer device 1B according to Modification 1 of Embodiment 1. In Modification 1, an example in which the height of the ground terminal 70 is lower than the height of the multilayer device 1B will be described.

[0091] Figure 7 This is an external view of a multilayer device 1B according to Modification 1 of Embodiment 1.

[0092] Figure 7 The multilayer device 1B shown includes a dielectric 10, a signal line 20, a plurality of planar electrodes 41, 42 and 43, a plurality of connection electrodes 51, 52 and 53, and a plurality of extraction electrodes 31, 32 and 33. The multilayer device 1B also includes a plurality of signal terminals 61 and 62, and a plurality of ground terminals 71, 72 and 73.

[0093] In the multilayer device 1B of Modification 1, the height of the ground terminal 70 is lower than that of the multilayer device 1B. Each ground terminal 70 is in contact with the bottom surface 16, extends from the bottom surface 16 side along the side surface 13 or 14 toward the top surface 17 side, and is interrupted before reaching the top surface 17. Each ground terminal 70 is connected to the extraction electrode 30 that is extracted to the side surface 13 or 14 of the dielectric 10. In addition, the heights of the ground terminals 70 may be the same or different.

[0094] In the first modification, since the values ​​of the inductive components L50 formed by the wirings 91 to 93 on the printed circuit board 90 and the plurality of structures S1 to S3 can be changed, the frequency of the stop band of the multilayer device 1B can be changed. Thus, the stop band can be formed according to the required specifications. In addition, since an area where the conductor based on the ground terminal 70 is not provided and the dielectric 10 is exposed is formed on the top surface 17 side of the side surfaces 13 and 14, the upper and lower directions of the multilayer device 1B can be visually judged. Thus, the mounting efficiency when the multilayer device 1B is mounted on the printed circuit board 90 can be improved.

[0095] [Variation 2 of Implementation Example 1]

[0096] The structure of a multilayer device 1C according to Modification 2 of Embodiment 1 will be described. In Modification 2, an example in which the upper and lower relationship of the multilayer device 1A shown in Embodiment 1 is reversed and the extraction electrode 30 is exposed on the outer surface of the dielectric 10 will be described.

[0097] Figure 8 The diagram shows a signal line 20 , planar electrodes 41 , 42 , 43 , connection electrodes 51 , 52 , 53 , extraction electrodes 31 , 32 , 33 , and the like of a multilayer device 1C according to a second modification of the first embodiment.

[0098] Figure 8 The multilayer device 1C shown includes a dielectric 10, a signal line 20, a plurality of planar electrodes 41, 42, and 43, a plurality of connection electrodes 51, 52, and 53, and a plurality of extraction electrodes 31, 32, and 33. In addition, the multilayer device 1C includes a plurality of signal terminals 61 and 62, and a plurality of ground terminals 71, 72, and 73. Figure 8 In FIG. 1 , the thickness of the signal terminals 61 , 62 and the ground terminals 71 , 72 , 73 are omitted from illustration.

[0099] The dielectric 10 is provided between the signal line 20, the extraction electrode 30, and the planar electrode 40. The dielectric 10 is formed so as to cover the outer peripheral surface of the signal line 20 except for both end surfaces, the planar electrode 40, and the connection electrode 50.

[0100] The signal line 20 is linear and strip-shaped, and is provided along the first direction d1. The signal line 20 of the second modification example is arranged on the bottom surface 16 side relative to the planar electrode 40.

[0101] The signal terminal 60 is provided on the side surfaces 11 and 12 as an example of the outer surface of the dielectric 10. One of the two signal terminals 61 and 62 is connected to one end of the signal line 20, and the other signal terminal 62 is connected to the other end of the signal line 20.

[0102] Each planar electrode 40 is arranged parallel to the signal line 20. For example, the planar electrode 41 is arranged inside the dielectric 10 so as to be located between the signal line 20 and the extraction electrode 31 in the third direction d3. The planar electrode 42 is arranged inside the dielectric 10 so as to be located between the signal line 20 and the extraction electrode 32 in the third direction d3. The planar electrode 43 is arranged inside the dielectric 10 so as to be located between the signal line 20 and the extraction electrode 33 in the third direction d3.

[0103] Each connecting electrode 50 penetrates the dielectric 10 between each planar electrode 40 and each extraction electrode 30 to connect each planar electrode 40 with each extraction electrode 30. For example, the connecting electrode 51 connects the planar electrode 41 with the extraction electrode 31, the connecting electrode 52 connects the planar electrode 42 with the extraction electrode 32, and the connecting electrode 53 connects the planar electrode 43 with the extraction electrode 33.

[0104] The plurality of extraction electrodes 30 are strip-shaped wirings and are arranged along the second direction d2. Each extraction electrode 30 is parallel to the planar electrode 40 and arranged closer to the top surface 17 than the planar electrode 40. The plurality of extraction electrodes 31, 32, and 33 are arranged in this order at equal intervals along the first direction d1.

[0105] Each extraction electrode 30 is provided on the top surface 17 of the dielectric 10, that is, the outer surface of the dielectric 10. For example, regarding the extraction electrode 31, one end of the extraction electrode 31 is connected to the connection electrode 51, and the other end extends to reach the side surface 13 of the dielectric 10. Regarding the extraction electrode 32, one end of the extraction electrode 32 is connected to the connection electrode 52, and the other end extends to reach the side surface 14 of the dielectric 10. Regarding the extraction electrode 33, one end of the extraction electrode 33 is connected to the connection electrode 53, and the other end extends to reach the side surface 13 of the dielectric 10. In this way, each extraction electrode 30 extends from a position close to one of the two side surfaces 13 and 14 toward the other side surface, and is connected to each ground terminal 70 on the other side surface. The above shows an example in which each extraction electrode 30 is provided on the outer surface of the dielectric 10, but it is not limited to this. Each extraction electrode 30 may also be a structure built into the dielectric 10.

[0106] A plurality of ground terminals 70 are provided on the outer surface of dielectric 10 . Ground terminal 71 is connected to the other end of extraction electrode 31 , ground terminal 72 is connected to the other end of extraction electrode 32 , and ground terminal 73 is connected to the other end of extraction electrode 33 .

[0107] In variation 2, a plurality of planar electrodes 41, 42, 43 and a plurality of connecting electrodes 51, 52, 53 are connected in one-to-one correspondence. In addition, a plurality of connecting electrodes 51, 52, 53 and a plurality of extraction electrodes 31, 32, 33 are connected in one-to-one correspondence. In addition, a plurality of extraction electrodes 31, 32, 33 and a plurality of grounding terminals 71, 72, 73 are connected in one-to-one correspondence. In other words, the first structure S1 including the planar electrode 41, the connecting electrode 51, the extraction electrode 31 and the grounding terminal 71, the second structure S2 including the planar electrode 42, the connecting electrode 52, the extraction electrode 32 and the grounding terminal 72, and the third structure S3 including the planar electrode 43, the connecting electrode 53, the extraction electrode 33 and the grounding terminal 73 are not connected to each other but are separated.

[0108] Fig. 9 is a diagram showing a substrate module 80 including a multilayer device 1C.

[0109] Fig. 9The width and thickness of each wiring 91 to 93 shown are the same, and the lengths of each wiring 91 to 93 are different from each other. In this example, the length of wiring 91 is longer than the length of wiring 92, and the length of wiring 92 is longer than the length of wiring 93. That is, the inductance value formed by wiring 91, ground terminal 71, extraction electrode 31, connection electrode 51 and plane electrode 41 is greater than the inductance value formed by wiring 92, ground terminal 72, extraction electrode 32, connection electrode 52 and plane electrode 42. In addition, the inductance value formed by wiring 92, ground terminal 72, extraction electrode 32, connection electrode 52 and plane electrode 42 is greater than the inductance value formed by wiring 93, ground terminal 73, extraction electrode 33, connection electrode 53 and plane electrode 43.

[0110] In the multilayer device 1C, the plurality of structures S1 to S3, each of which includes a planar electrode, a connecting electrode, an extraction electrode, and a ground terminal, are separated from each other without being connected to each other inside or outside the dielectric 10. Fig. 9 As shown, when the multilayer device 1C is mounted on the printed circuit board 90, the inductance value can be generated according to the wirings 91 to 93 on the printed circuit board 90 connected to the ground terminal 70. For example, by changing the inductance value, the value of each inductance component L50 formed by the wirings 91 to 93 on the printed circuit board 90 and the plurality of sets of structures S1 to S3 can be changed, and the frequency of the stop band of the substrate module 80 including the multilayer device 1C can be changed. In this way, the stop band can be formed according to the required specifications.

[0111] [Variation 3 of Implementation Example 1]

[0112] A multilayer device 1D according to a third modification of the first embodiment will be described. In the third modification, an example in which the lead-out electrode 30 has a meandering shape will be described.

[0113] Fig.10 This is a diagram showing a signal line 20 , a planar electrode 40 , a connection electrode 50 , a lead electrode 30 , and the like of a multilayer device 1D according to a third modification of the first embodiment.

[0114] The multilayer device 1D of the modification example 3 includes a dielectric 10, a signal line 20, a plurality of planar electrodes 41, 42 and 43, a plurality of connection electrodes 51, 52 and 53, and a plurality of extraction electrodes 31, 32 and 33. In addition, the multilayer device 1D includes a plurality of signal terminals 61 and 62, and a plurality of ground terminals 71, 72 and 73. Fig.10 In FIG. 1 , the signal line 20 is indicated by a thick dotted line, and the extraction electrodes 31 , 32 , and 33 are indicated by a single-dot chain line.

[0115] The structures of the dielectric 10 , the signal line 20 , the planar electrode 40 , and the connection electrode 50 in the third modification are the same as those in the first embodiment.

[0116] At least a portion of the extraction electrode 30 of Modification 3 has a meandering shape. The meandering shape is a serpentine shape. Alternatively, the meandering shape may be a square wave shape, a triangular wave shape, a sine wave shape, or an arc-shaped waveform shape.

[0117] Each extraction electrode 30 is parallel to the planar electrode 40 and is arranged on the bottom surface 16 side of the planar electrode 40. For example, regarding the extraction electrode 31, one end of the extraction electrode 31 is connected to the connection electrode 51, and the other end is connected to the side surface 13 of the dielectric 10. Regarding the extraction electrode 32, one end of the extraction electrode 32 is connected to the connection electrode 52, and the other end is connected to the side surface 14 of the dielectric 10. Regarding the extraction electrode 33, one end of the extraction electrode 33 is connected to the connection electrode 53, and the other end is connected to the side surface 13 of the dielectric 10. Each extraction electrode 30 extends from a position close to one of the two side surfaces 13 and 14 toward the other side surface, and is connected to each ground terminal 70 on the other side surface.

[0118] In the third modification, the plurality of structures S1 to S3, which are a group of structures including a planar electrode, a connection electrode, an extraction electrode, and a ground terminal, are separated and not connected to each other inside and on the outer surface of the dielectric 10. Therefore, when the multilayer device 1D is mounted on the printed circuit board 90, the inductance value can be generated according to the wirings 91 to 93 on the printed circuit board 90 connected to the ground terminal 70. For example, by changing the inductance value, the value of each inductance component L50 formed by the wirings 91 to 93 on the printed circuit board 90 and the plurality of structures S1 to S3 can be changed, and the frequency of the stop band of the substrate module 80 including the multilayer device 1D can be changed. Thus, the stop band can be formed according to the required specifications.

[0119] [Variation 4 of Implementation Example 1]

[0120] The structure of a multilayer device 1E according to Modification 4 of Embodiment 1 will be described. In Modification 4, an example in which the connection electrode 50 has a coil shape will be described.

[0121] Fig.11 This is an external view of a multilayer device 1E according to Modification 4 of Embodiment 1. Fig.12 The figure shows the signal line 20, the planar electrode 40, the connection electrode 50, the extraction electrode 30 and the like of the multilayer device 1E.

[0122] Fig.11 as well as Fig.12The multilayer device 1E shown includes a dielectric 10, a signal line 20, a plurality of planar electrodes 41, 42, and 43, a plurality of connection electrodes 51, 52, and 53, and a plurality of extraction electrodes 31, 32, and 33. In addition, the multilayer device 1E includes a plurality of signal terminals 61 and 62, and a plurality of ground terminals 71, 72, and 73. Fig.12 , a state where the signal terminals 61 , 62 , the ground terminals 71 , 72 , 73 , and the dielectric 10 are removed from the multilayer device 1E is shown.

[0123] The structures of the dielectric 10 , the signal line 20 , the planar electrode 40 , and the signal terminal 60 of the multilayer device 1E are the same as those of the first embodiment.

[0124] At least a portion of the connection electrode 50 of Modification 4 has a coil shape. Fig.12 The connection electrode 50 shown has a rectangular coil shape. The coil shape is not limited to a rectangular shape, and may be a circular shape. The connection electrode 50 is composed of a plurality of via electrodes 50v and one or more patterned electrodes 50p. Fig.12 The connection electrode 50 shown has a spiral coil shape of 3.5 turns formed by eight via electrodes 50v and seven patterned electrodes 50p. The connection electrode 50 is not limited to a spiral coil, but may have a spiral coil shape.

[0125] The plurality of extraction electrodes 30 are strip-shaped wirings arranged along the second direction d2. Each extraction electrode 30 is parallel to the planar electrode 40 and arranged closer to the bottom surface 16 than the planar electrode 40. The plurality of extraction electrodes 31, 32, 33 are arranged in this order at equal intervals along the first direction d1.

[0126] The extraction electrode 30 of the modification example 4 is provided inside the dielectric 10 so that a part of the extraction electrode 30 is exposed on the side surface 13 which is an example of the outer surface of the dielectric 10. Each extraction electrode 31, 32, 33 extends from a position close to one side surface 14 of the two side surfaces 13 and 14 toward the other side surface 13, and is connected to each ground terminal 70 on the other side surface 13.

[0127] The plurality of ground terminals 71, 72, 73 of Modification 4 are provided on the side surface 13 among the four side surfaces 11 to 14. The plurality of ground terminals 71 to 73 are provided on a side surface 13 different from the side surfaces 11 and 12 on which the plurality of signal terminals 60 are provided. The ground terminal 71 is connected to the other end of the extraction electrode 31, the ground terminal 72 is connected to the other end of the extraction electrode 32, and the ground terminal 73 is connected to the other end of the extraction electrode 33.

[0128] In the fourth modification, the plurality of structures S1 to S3, which are a group of structures including a planar electrode, a connection electrode, an extraction electrode, and a ground terminal, are separated and not connected to each other inside and on the outer surface of the dielectric 10. Therefore, when the multilayer device 1E is mounted on the printed circuit board 90, the inductance value can be generated according to the wirings 91 to 93 on the printed circuit board 90 connected to the ground terminal 70. For example, by changing the inductance value, the value of each inductance component L50 formed by the wirings 91 to 93 on the printed circuit board 90 and the plurality of structures S1 to S3 can be changed, and the frequency of the stop band of the substrate module 80 including the multilayer device 1E can be changed. Thus, the stop band can be formed according to the required specifications.

[0129] [Variation 5 of Implementation Example 1]

[0130] The structure of a multilayer device 1F according to a fifth modification of the first embodiment will be described. In the fifth modification, an example in which the signal line 20 has a meandering shape will be described.

[0131] Fig.13 This is a diagram showing a signal line 20 , a planar electrode 40 , a connection electrode 50 , a lead electrode 30 , and the like of a multilayer device 1F according to a fifth modification of the first embodiment.

[0132] Fig.13 The multilayer device 1F shown in the figure includes a dielectric 10, a signal line 20, a plurality of planar electrodes 41, 42 and 43, a plurality of connection electrodes 51, 52 and 53, and a plurality of extraction electrodes 31, 32 and 33. In addition, the multilayer device 1F includes a plurality of signal terminals 61 and 62, and Fig.11 Multiple ground terminals 71, 72 and 73 are shown.

[0133] The structures of the dielectric 10 , the planar electrode 40 , and the signal terminal 60 of the multilayer device 1F are the same as those of the first embodiment. The structures of the extraction electrode 30 and the ground terminal 70 of the multilayer device 1F are the same as those of the fourth modification.

[0134] At least a portion of the signal line 20 of Modification 5 has a meandering shape. The meandering shape is a serpentine shape. Fig.13 The signal line 20 shown has a square wave zigzag shape. In addition, the zigzag shape is not limited to a square wave shape, and may be a triangular wave shape, a sine wave shape, or an arc shape. In addition, the zigzag shape may be a pulse wave shape that is convex or concave in the second direction d2.

[0135] The signal line 20 has meander line portions 21, 22, and 23, each of which is a region having a meandering shape. The meander line portions 21, 22, and 23 are arranged in this order along a first direction d1 from the input side toward the output side of the signal line 20. The signal line 20 is composed of the meander line portions 21, 22, and 23 connected in series.

[0136] The meandering line portions 21, 22, 23 are arranged in a one-to-one correspondence with the planar electrodes 41, 42, 43. Specifically, the meandering line portion 21 corresponds to the planar electrode 41, the meandering line portion 22 corresponds to the planar electrode 42, and the meandering line portion 23 corresponds to the planar electrode 43. In other words, the meandering line portions 21, 22, 23 are arranged at positions opposite to the planar electrodes 41, 42, 43, respectively. That is, when viewed from the direction perpendicular to the planar electrode 40, that is, the third direction d3, the meandering line portion 21 overlaps with the planar electrode 41, the meandering line portion 22 overlaps with the planar electrode 42, and the meandering line portion 23 overlaps with the planar electrode 43. The capacitive component C40 (refer to Figure 2 ) is generated in the region where the meandering line portions 21, 22, 23 and the planar electrodes 41, 42, 43 are opposed.

[0137] The plurality of extraction electrodes 30 are strip-shaped wirings arranged along the second direction d2. Each extraction electrode 30 is parallel to the planar electrode 40 and arranged closer to the bottom surface 16 than the planar electrode 40. The plurality of extraction electrodes 31, 32, 33 are arranged in this order at equal intervals along the first direction d1.

[0138] The extraction electrode 30 of the modification example 5 is provided inside the dielectric 10 so that a part of the extraction electrode 30 is exposed on the side surface 13 which is an example of the outer surface of the dielectric 10. Each of the extraction electrodes 31, 32, 33 extends from a position close to one side surface 14 of the two side surfaces 13 and 14 toward the other side surface 13, and is connected to each ground terminal 70 on the other side surface 13.

[0139] Ground terminals 71 to 73 are provided on side surface 13 different from side surfaces 11 and 12 where signal terminals 60 are provided. Ground terminal 71 is connected to the other end of extraction electrode 31, ground terminal 72 is connected to the other end of extraction electrode 32, and ground terminal 73 is connected to the other end of extraction electrode 33.

[0140] In the fifth modification, the plurality of structures S1 to S3, which are a group of structures including a planar electrode, a connection electrode, an extraction electrode, and a ground terminal, are separated and not connected to each other inside and on the outer surface of the dielectric 10. Therefore, when the multilayer device 1F is mounted on the printed circuit board 90, the inductance value can be generated according to the wirings 91 to 93 on the printed circuit board 90 connected to the ground terminal 70. For example, by changing the inductance value, the value of each inductance component L50 formed by the wirings 91 to 93 on the printed circuit board 90 and the plurality of structures S1 to S3 can be changed, and the frequency of the stop band of the substrate module 80 including the multilayer device 1F can be changed. Thus, the stop band can be formed according to the required specifications.

[0141] (Implementation method 2)

[0142] [Structure of multilayer device]

[0143] The structure of a multilayer device 1G according to Embodiment 2 will be described. In Embodiment 2, an example in which the multilayer device 1G is a common mode filter will be described.

[0144] Fig.14 This is an external view of a multilayer device 1G according to the second embodiment. Fig.15 1 is a diagram showing a signal line 20 , a planar electrode 40 , a lead electrode 30 , and a connection electrode 50 of a multilayer device 1G.

[0145] Fig.14 as well as Fig.15 The multilayer device 1G shown includes a dielectric 10, a signal line 20, a plurality of planar electrodes 41, 42, and 43, a plurality of connection electrodes 51, 52, and 53, and extraction electrodes 31, 32, and 33. In addition, the multilayer device 1G includes a plurality of signal terminals 61, 62, 63, and 64, and a plurality of ground terminals 71, 72, and 73. Fig.15 In FIG. 1 , the signal line 20 is indicated by a thick dotted line, and the extraction electrodes 31 , 32 , and 33 are indicated by a single-dot chain line.

[0146] The structures of the dielectric 10 , the planar electrode 40 , the connection electrode 50 , the extraction electrode 30 , and the ground terminals 71 to 73 of the multilayer device 1G are the same as those of the first embodiment.

[0147] The signal line 20 of the second embodiment is a differential line composed of two parallel signal lines 20a and 20b provided inside the dielectric 10. Each of the signal lines 20a and 20b is linear and provided along the first direction d1. Each of the signal lines 20a and 20b is strip-shaped and arranged parallel to the planar electrode 40 and the lead-out electrode 30. When the multilayer device 1G is mounted on the substrate module 80, a differential signal is transmitted in the two signal lines 20a and 20b.

[0148] Four signal terminals 61 to 64 are provided on the side surfaces 11 and 12 of the dielectric 10. Among the four signal terminals 61 to 64, one signal terminal 61 and 63 are provided on the side surface 11, and the other signal terminals 62 and 64 are provided on the side surface 12. One signal terminal 61 is connected to one end of the signal line 20a, and one signal terminal 63 is connected to one end of the signal line 20b. The other signal terminal 62 is connected to the other end of the signal line 20a, and the other signal terminal 64 is connected to the other end of the signal line 20b.

[0149] In the second embodiment, the plurality of structures S1 to S3, which are a group of structures including a planar electrode, a connection electrode, an extraction electrode, and a ground terminal, are separated without being connected to each other inside and on the outer surface of the dielectric 10. Therefore, when the multilayer device 1G is mounted on the printed circuit board 90, the inductance value can be generated according to the wirings 91 to 93 on the printed circuit board 90 connected to the ground terminal 70. For example, by changing the inductance value, the value of each inductance component L50 formed by the wirings 91 to 93 on the printed circuit board 90 and the plurality of structures S1 to S3 can be changed, and the frequency of the stop band of the substrate module 80 including the multilayer device 1G can be changed. Thus, the stop band can be formed according to the required specifications.

[0150] (Summarize)

[0151] The multilayer device 1A (or multilayer devices 1B to 1G) according to the present embodiment includes: a dielectric 10; a signal line 20 provided inside the dielectric 10 so that a part thereof is exposed on the outer surface of the dielectric 10; a plurality of planar electrodes 40 provided inside the dielectric 10 and arranged along a first direction d1; a plurality of extraction electrodes 30 provided inside or on the outer surface of the dielectric 10 so that at least a part thereof is exposed on the outer surface of the dielectric 10; a plurality of connection electrodes 50 provided inside the dielectric 10 and connecting the plurality of planar electrodes 40 and the plurality of extraction electrodes 30; a plurality of signal terminals 60 provided on the outer surface of the dielectric 10 and connected to the signal line 20; and a plurality of ground terminals 70 provided on the outer surface of the dielectric 10 and set to a ground potential and connected to the plurality of extraction electrodes 30. A plurality of sets of structures S1 to S3, each of which includes a structure including planar electrodes, connection electrodes, extraction electrodes, and ground terminals, are separated from each other without being connected to each other inside and on the outer surface of the dielectric 10.

[0152] In this way, since the plurality of sets of structures S1 to S3 are not connected to each other but are separated inside and outside the dielectric 10, when the multilayer device 1A is mounted on the printed circuit board 90, the inductance value can be generated according to the wirings 91 to 93 on the printed circuit board 90 connected to the ground terminal 70. For example, by changing the inductance value, the inductance components L50 (see Figure 2 ) value, the frequency of the stop band of the substrate module 80 including the multilayer device 1A can be changed. Thus, the stop band can be formed according to the required specifications. In addition, by changing the value of each inductive component L50 formed by each wiring 91 to 93 on the printed circuit board 90 and the above-mentioned multiple sets of structures S1 to S3, the stop band of the multilayer device 1A can be widened.

[0153] Alternatively, the plurality of planar electrodes 40 and the plurality of connection electrodes 50 may be connected in one-to-one correspondence, the plurality of connection electrodes 50 and the plurality of extraction electrodes 30 may be connected in one-to-one correspondence, and the plurality of extraction electrodes 30 and the plurality of ground terminals 70 may be connected in one-to-one correspondence.

[0154] According to this structure, a plurality of sets of structures S1 to S3, each of which includes a planar electrode, a connection electrode, an extraction electrode, and a ground terminal, can be set to a state of being separated and not connected to each other inside and on the outer surface of the dielectric 10. Therefore, when the multilayer device 1A is mounted on the printed circuit board 90, an inductance value can be generated based on the wirings 91 to 93 on the printed circuit board 90 connected to the ground terminal 70. For example, by changing the inductance value, the value of each inductance component L50 formed by the wirings 91 to 93 on the printed circuit board 90 and the plurality of sets of structures S1 to S3 can be changed, and the frequency of the stop band of the substrate module 80 including the multilayer device 1A can be changed. Thus, the stop band can be formed according to the required specifications.

[0155] Alternatively, the extraction electrode 30 may be provided inside the dielectric 10 so as to be partially exposed on the outer surface of the dielectric 10 , and the ground terminal 70 may be connected to the portion of the extraction electrode 30 exposed on the outer surface of the dielectric 10 .

[0156] In this way, by providing the lead-out electrode 30 inside the dielectric 10 , the lead-out electrode 30 can be protected from the external environment.

[0157] Alternatively, the dielectric 10 may include a bottom surface 16 parallel to the planar electrode 40, a top surface 17 opposite to the bottom surface 16, and four side surfaces 11, 12, 13, 14 connecting the bottom surface 16 and the top surface 17. The ground terminals 70 are provided on two side surfaces 13, 14 of the four side surfaces 11-14.

[0158] According to this structure, it is possible to ensure the distance between the terminals of the plurality of ground terminals 70. Thus, the multilayer device 1A can be easily mounted on the printed circuit board 90.

[0159] Alternatively, the two side surfaces 13 and 14 may be side surfaces facing away from each other.

[0160] According to this structure, for example, compared with a case where the plurality of ground terminals 70 are provided on side surfaces that are not opposed to each other, the mounting reliability of the multilayer device 1A on the printed circuit board 90 can be improved.

[0161] Alternatively, extraction electrode 30 may extend from a position close to one of the two side surfaces 13 and 14 (eg, side surface 14 ) toward the other side surface (eg, side surface 13 ) and be connected to a ground terminal at the other side surface (eg, side surface 13 ).

[0162] According to this structure, for example, the length of the lead electrode 30 can be increased compared to the case where the lead electrode 30 extends from a position close to the other side surface 13 to the other side surface 13. Therefore, the inductance value of the plurality of sets of structures S1 to S3 including the lead electrode 30 can be increased. By increasing the inductance value, the value of the inductance component L50 can be changed, and the stop band of the substrate module 80 including the multilayer device 1A can be moved to the low frequency side. Thus, the stop band can be formed according to the required specifications.

[0163] Furthermore, the two side surfaces 13 and 14 may be side surfaces different from the side surfaces 11 and 12 on which the plurality of signal terminals 60 are provided, among the four side surfaces 11 to 14 .

[0164] According to this structure, the distance between the signal terminal 60 and the ground terminal 70 can be ensured. As a result, the multilayer device 1A can be easily mounted on the printed circuit board 90.

[0165] Alternatively, the connection electrode 50 may be a via conductor that penetrates a portion of the dielectric 10 located between the plurality of planar electrodes 40 and the lead-out electrode 30 .

[0166] According to this structure, the inductance values ​​of the plurality of groups of structures S1 to S3, each of which includes a structure including a connection electrode, can be easily set to the same value. Therefore, in the substrate module 80 including the multilayer device 1A, the inductance value can be easily generated based on the wirings 91 to 93 on the printed circuit board 90 connected to the ground terminal 70, and the frequency of the stop band of the substrate module 80 can be easily changed. Thus, the stop band can be formed according to the required specifications.

[0167] Furthermore, when viewed from a direction perpendicular to the planar electrode 40 , the connection electrode 50 may overlap with the outer peripheral end of the planar electrode 40 instead of overlapping with the signal line 20 .

[0168] Thus, the connection electrode 50 is arranged at the outer peripheral end of the planar electrode 40. Therefore, the total length of the electrode structure including the connection electrode 50 and the planar electrode 40 can be increased, and the inductance value of the electrode structure can be increased. By increasing the inductance value, the value of the inductance component L50 can be changed, and the stop band of the substrate module 80 including the multilayer device 1A can be moved to the low frequency side. Thus, the stop band can be formed according to the required specifications.

[0169] Alternatively, the signal line 20 may be formed of two parallel lines provided in the dielectric 10 .

[0170] Thus, the multilayer device 1G can be used as a common mode filter.

[0171] Alternatively, the two parallel lines may be differential lines that transmit differential signals.

[0172] Thus, it is possible to provide a multilayer device 1G having a common mode filter function.

[0173] The multilayer device 1A (or multilayer devices 1B to 1G) according to the present embodiment includes: a dielectric 10; a signal line 20 provided inside the dielectric 10 so that a part thereof is exposed on the outer surface of the dielectric 10; a plurality of planar electrodes 40 provided inside the dielectric 10 and arranged along the first direction d1; a plurality of extraction electrodes 30 provided inside or on the outer surface of the dielectric 10 so that at least a part thereof is exposed on the outer surface of the dielectric 10; a plurality of connection electrodes 50 provided inside the dielectric 10; a plurality of signal terminals 60 provided on the outer surface of the dielectric 10 and connected to the signal line 20; and a plurality of ground terminals 70 provided on the outer surface of the dielectric 10 and set to a ground potential. The plurality of planar electrodes 40 and the plurality of connection electrodes 50 are connected in a one-to-one correspondence, the plurality of connection electrodes 50 and the plurality of extraction electrodes 30 are connected in a one-to-one correspondence, and the plurality of extraction electrodes 30 and the plurality of ground terminals 70 are connected in a one-to-one correspondence.

[0174] According to this structure, a plurality of groups of structures including a planar electrode, a connecting electrode, an extraction electrode, and a ground terminal can be set to a state of being separated and not connected to each other inside and outside the dielectric 10. Therefore, when the multilayer device 1A is mounted on the printed circuit board 90, the inductance value can be generated according to the wirings 91 to 93 on the printed circuit board 90 connected to the ground terminal 70. For example, by changing the inductance value, the value of each inductance component L50 formed by the wirings 91 to 93 on the printed circuit board 90 and the plurality of groups of structures S1 to S3 can be changed, and the frequency of the stop band of the substrate module 80 including the multilayer device 1A can be changed. In this way, the stop band can be formed according to the required specifications.

[0175] The substrate module 80 according to the present embodiment includes the above-described multilayer device 1A (or the multilayer devices 1B to 1G).

[0176] According to the substrate module 80 , a stop band can be formed according to the required specifications.

[0177] (Other implementations, etc.)

[0178] The above describes the multilayer device and the like involved in the embodiments and variations of the present disclosure, but the present disclosure is not limited to the above embodiments and variations. As long as it does not depart from the main purpose of the present disclosure, the various modifications thought of by those skilled in the art are implemented in the embodiments and variations, and other methods constructed by combining some of the structural elements in the embodiments and variations are also included in the scope of the present disclosure.

[0179] In Embodiment 1, an example is shown in which three planar electrodes 41 to 43, three connecting electrodes 51 to 53, and three extraction electrodes 31 to 33 are arranged along the first direction d1, but the present invention is not limited thereto. A structure in which one planar electrode, one connecting electrode, and one extraction electrode are a group may be two or more. That is, a multilayer device may have a structure in which four or more planar electrodes, four or more connecting electrodes, and four or more extraction electrodes are arranged along the first direction d1, respectively. In this case, four or more ground terminals may also be provided in the multilayer device.

[0180] Industrial Applicability

[0181] The multilayer device according to the present disclosure is useful as a multilayer device used in various electronic devices and communication systems.

[0182] Explanation of symbols

[0183] 1, 1A, 1B, 1C, 1D, 1E, 1F, 1G Multilayer devices

[0184] 10 Dielectric

[0185] 11, 12, 13, 14 Side

[0186] 16 Bottom

[0187] 17 Top

[0188] 20, 20a, 20b Signal lines

[0189] 21, 22, 23 zigzag line section

[0190] 30, 31, 32, 33 Lead electrodes

[0191] 40, 41, 42, 43 Planar electrodes

[0192] 50, 51, 52, 53 Connecting electrodes

[0193] 50p Patterned Electrode

[0194] 50v via electrode

[0195] 60, 61, 62, 63, 64 signal terminals

[0196] 70, 71, 72, 73 ground terminals

[0197] 80 Baseboard Module

[0198] 90 Printed circuit board

[0199] 90a Mounting surface

[0200] 91, 92, 93, 96, 97 Wiring

[0201] 99 Grounding Electrode

[0202] d1 1st direction

[0203] d2 2nd direction

[0204] d3 3rd direction

[0205] S1, S2, S3 constructs.

Claims

1. A multilayer device comprising: Dielectrics; a signal line disposed inside the dielectric such that a portion of the signal line is exposed on an outer surface of the dielectric; A plurality of planar electrodes are disposed inside the dielectric and arranged along a first direction; A plurality of lead electrodes are disposed inside or on the outer surface of the dielectric so that at least a portion of them is exposed on the outer surface of the dielectric; A plurality of connecting electrodes, disposed inside the dielectric, connecting the plurality of planar electrodes and the plurality of extraction electrodes; A plurality of signal terminals, disposed on the outer surface of the dielectric and connected to the signal line; and A plurality of ground terminals are provided on the outer surface of the dielectric, are set to a ground potential, and are connected to the plurality of extraction electrodes. The plurality of planar electrodes, the plurality of connecting electrodes, the plurality of extraction electrodes and the plurality of ground terminals constitute a plurality of structures. Each of the plurality of structures includes a corresponding one of the plurality of planar electrodes, a corresponding one of the plurality of connecting electrodes, a corresponding one of the plurality of extraction electrodes, and a corresponding one of the plurality of grounding terminals. The plurality of structures are separated from each other without being connected to each other inside and on the outer surface of the dielectric.

2. The multilayer device according to claim 1, in, The plurality of planar electrodes and the plurality of connecting electrodes are connected one by one, so that a corresponding planar electrode and a corresponding connecting electrode are connected to each other. The plurality of connection electrodes and the plurality of extraction electrodes are connected one by one, so that a corresponding connection electrode and a corresponding extraction electrode are connected to each other. The plurality of extraction electrodes and the plurality of ground terminals are connected in a one-to-one correspondence, so that a corresponding one of the extraction electrodes and a corresponding one of the ground terminals are connected to each other.

3. The multilayer device according to claim 1, in, The plurality of extraction electrodes are disposed inside the dielectric so that a portion of the electrodes is exposed on the outer surface of the dielectric. The plurality of ground terminals are connected to portions of the plurality of extraction electrodes exposed on the outer surface of the dielectric.

4. The multilayer device according to claim 1, in, The dielectric has a bottom surface parallel to the plurality of planar electrodes, a top surface opposite to the bottom surface, and four side surfaces connecting the bottom surface and the top surface. The plurality of ground terminals are disposed on two side surfaces among the four side surfaces.

5. The multilayer device according to claim 4, in, The two side surfaces are side surfaces facing away from each other.

6. The multilayer device according to claim 5, in, The plurality of extraction electrodes extend from a position close to one of the two side surfaces toward the other side surface, and are connected to the plurality of ground terminals on the other side surface.

7. The multilayer device according to claim 5, in, The two side surfaces are side surfaces different from side surfaces on which the plurality of signal terminals are disposed among the four side surfaces.

8. The multilayer device according to claim 1, in, Each of the plurality of connection electrodes is a via conductor that passes through a portion of the dielectric that is located between each of the plurality of planar electrodes and each of the plurality of extraction electrodes.

9. The multilayer device according to claim 8, in, When viewed from a direction perpendicular to the plurality of planar electrodes, the plurality of connection electrodes do not overlap with the signal line but overlap with outer peripheral ends of the plurality of planar electrodes.

10. The multilayer device according to any one of claims 1 to 9, in, The signal line is composed of two parallel lines arranged in the dielectric.

11. The multilayer device according to claim 10, in, The two parallel lines are differential lines for transmitting differential signals.

12. A multilayer device comprising: Dielectrics; a signal line disposed inside the dielectric such that a portion of the signal line is exposed on an outer surface of the dielectric; A plurality of planar electrodes are disposed inside the dielectric and arranged along a direction; A plurality of lead electrodes are disposed inside or on the outer surface of the dielectric so that at least a portion of them is exposed on the outer surface of the dielectric; A plurality of connection electrodes are arranged inside the dielectric; A plurality of signal terminals, disposed on the outer surface of the dielectric and connected to the signal line; and A plurality of ground terminals are provided on the outer surface of the dielectric and are set to a ground potential. The plurality of planar electrodes and the plurality of connecting electrodes are connected one by one, The plurality of connection electrodes and the plurality of extraction electrodes are connected in a one-to-one correspondence, The plurality of extraction electrodes and the plurality of ground terminals are connected in a one-to-one correspondence.

13. A substrate module comprising the multilayer device according to any one of claims 1 to 9.

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