Scrap protection structure of silicon wafer cutting machine

Abstract

The invention relates to the technical field of silicon wafer cutting, in particular to a chipping protection structure of a silicon wafer cutting machine, which comprises a cutting machine body, airflow with chippings enters a cavity formed by an outer flow guide cover and an inner flow guide cover from the lower part, and in the upward moving process, due to the action of a spiral channel, when the airflow with the chippings moves upwards, the chippings are prevented from falling off. Under the action of centrifugal force, chippings extrude a check block, the check block drives a connecting rod to move, a first spring is compressed, then the chippings fly out of a chipping outlet, a laser is fixedly connected into an inner flow guide cover, a cavity formed by the outer flow guide cover and the inner flow guide cover forms a gradient airflow channel, the laser is arranged in an inner cover, chipping pollution is avoided, and the laser is used for emitting light. A traditional structure depends on pure airflow to carry chippings and is prone to blockage or secondary attachment. By means of the spiral channel on the outer side of the inner flow guide cover, airflow rotates to generate centrifugal force, scraps are thrown to the cavity wall and extrude the check block, and dynamic mechanical separation is achieved.

Description

Technical Field

[0001] The present invention relates to the technical field of silicon wafer cutting, and specifically relates to a debris protection structure for a silicon wafer cutting machine. Background Art

[0002] Currently, the silicon wafer laser cutting technology is transforming from traditional mechanical processing to ultrafast laser cold processing. By using picosecond or femtosecond lasers to reduce thermal damage, combined with gas flow guiding and dynamic debris management (such as centrifugal separation + double-layer deflector) to improve cutting accuracy and cleanliness. At the same time, an intelligent control system is introduced to optimize parameters to meet the high-efficiency and low-loss processing requirements of the semiconductor and photovoltaic industries for thin silicon wafers and complex structures; There is a multi-wire silicon wafer cutting machine with a simple structure, convenient cutting wire arrangement, reduced cutting wire friction, and capable of evenly spraying coolant on the cutting wire, with the publication number of CN109129949B. The multi-wire silicon wafer cutting machine includes a frame, a feeding chamber is arranged on the frame, a crystal carrier connector is arranged at the top of the feeding chamber, a vertical telescopic device and a coolant storage tank are arranged above the feeding chamber, and the telescopic shaft of the vertical telescopic device is connected to the crystal carrier connector; two wire guiding rollers with parallel axes are arranged at the lower part of the frame, and the wire guiding rollers are rotationally matched with the frame; a receiving box is arranged between the two wire guiding rollers; a wiring device is arranged below the receiving box; a spraying device is arranged above the wire guiding rollers; a wire winding device is arranged on one side of the frame. Using this multi-wire silicon wafer cutting machine can effectively extend the service life of the cutting wire; The existing devices for cutting silicon wafers mainly have the following disadvantages: When cutting silicon wafers, due to the high temperature of the debris generated by cutting and the splashing, it will cause pollution and even damage to the cutting device. Summary of the Invention

[0003] The purpose of the present invention is to provide a debris protection structure for a silicon wafer cutting machine to solve the problems raised in the above background art.

[0004] To achieve the above invention purpose, the present invention adopts the following technical solutions: Provide a debris protection structure for a silicon wafer cutting machine, including a cutting machine body, a protection mechanism is fixedly connected to the cutting machine body, and a cooling mechanism is fixedly connected below the protection mechanism; The protection mechanism includes: A protective cover assembly, the protective cover assembly is fixedly connected to the cutting machine body, and a promoting air flow assembly is fixedly connected to the upper end of the protective cover assembly; The cooling mechanism includes: The flow guiding component is fixedly connected below the protective cover component, and an adjusting component is connected to the flow guiding component.

[0005] Furthermore, the protective cover component includes: The outer flow guiding cover is fixedly connected to the cutting machine body. An inner flow guiding cover is arranged inside the outer flow guiding cover. A spiral channel is fixedly connected to the outer side of the inner flow guiding cover. The inner flow guiding cover is fixedly connected to the outer flow guiding cover. A debris outlet is formed in the outer flow guiding cover. A connecting rod is slidably connected at the debris outlet. One end of the connecting rod is fixedly connected with a blocking block, and a first spring is sleeved on the connecting rod.

[0006] Furthermore, the air flow promoting component includes: The protective cover is fixedly connected to the upper end of the outer flow guiding cover. A motor is fixedly connected to the protective cover. The output end of the motor is fixedly connected with a toothed ring. The toothed ring meshes with a plurality of gears, and the gears are fixedly connected with fan blades.

[0007] Furthermore, the flow guiding component includes: The lower flow guiding cover is fixedly connected with an annular cooling pipe inside. A plurality of wavy guiding plates are rotatably connected along the outer side of the annular cooling pipe. A coolant cavity is formed in the wavy guiding plate, and a slider is fixedly connected to the wavy guiding plate.

[0008] Furthermore, the adjusting component includes: The connecting plate is fixedly connected to the lower end of the lower flow guiding cover. A plurality of angled rods are slidably connected to the connecting plate. A second spring is sleeved on the angled rods. One end of the angled rod is fixedly connected with a chute, and the slider is slidably connected in the chute. The other end of the angled rod is rotatably connected with a roller. A connecting ring is rotatably connected to the lower end of the lower flow guiding cover, and a plurality of convex blocks are fixedly connected to the connecting ring.

[0009] Compared with the prior art, the above one or more technical solutions have the following beneficial effects: 1. By starting the motor, the motor drives the toothed ring fixedly connected thereto to rotate. Through the meshing action between the toothed ring and the gear, the gear rotates, driving the fan blade to rotate, accelerating the flow of air. The airflow with debris enters the cavity formed by the outer guide cover and the inner guide cover from below. During the upward movement, due to the action of the spiral channel, when the airflow with debris moves upward, under the action of centrifugal force, the debris presses against the stop block, causing the stop block to drive the connecting rod to move, and the first spring is compressed. As a result, the debris flies out from the debris outlet. The laser is fixedly connected inside the inner guide cover. The cavity formed by the outer guide cover and the inner guide cover constitutes a gradient airflow channel. The laser is placed inside the inner cover to avoid debris contamination. The traditional structure relies solely on the airflow to carry debris, which is prone to clogging or secondary adhesion. In this design, through the spiral channel on the outer side of the inner guide cover, the airflow rotates to generate centrifugal force, throwing the debris towards the cavity wall and pressing against the stop block, achieving dynamic mechanical separation.

[0010] 2. By rotating the connecting ring, the convex block lifts the roller, and then lifts the angled rod. The second spring is compressed. Under the limiting action of the chute, the slider slides in the chute. At the same time, the wavy guide plate rotates and can be adjusted according to different requirements of the angle between the airflow and the cavity formed by the outer guide cover and the inner guide cover. When the airflow with debris moves upward from below the lower guide cover, when the airflow hits the wavy guide plate, the direction of the airflow changes, causing the angle between the airflow and the cavity formed by the outer guide cover and the inner guide cover to change. At the same time, the airflow is cooled. After hitting the wavy curved surface, the airflow forms a turbulent flow, and the debris separates due to inertia and is thrown towards the cavity wall. By changing the initial angle of the airflow entering the cavity, the centrifugal effect of the spiral channel is optimized, reducing debris backflow. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] The schematic diagrams in the specification forming a part of the present invention are used to provide a further understanding of the present invention. The illustrative embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation to the present invention.

[0012] In addition, the terms "installed", "set up", "provided with", "connected", "connected to", "socketed" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral structure; it can be a mechanical connection or an electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, or there is an internal connection between two devices, components or parts. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0013] Figure 1 is a schematic three-dimensional structure diagram of the whole of the present invention; Figure 2 is a schematic three-dimensional structure diagram of the whole protection mechanism of the present invention; Figure 3Schematic diagram of the overall three-dimensional structure of the protective cover assembly of the present invention; Figure 4 Exploded schematic diagram of the overall three-dimensional structure of the protective cover assembly of the present invention; Figure 5 Schematic diagram of the overall three-dimensional structure of the outer flow deflector of the present invention; Figure 6 Schematic diagram of the overall three-dimensional structure of the air flow promoting assembly of the present invention; Figure 7 Schematic diagram of the overall three-dimensional structure of the cooling mechanism of the present invention; Figure 8 Schematic diagram of the overall three-dimensional structure of the flow guiding assembly of the present invention; Figure 9 Schematic diagram of the overall three-dimensional structure of the adjustment assembly of the present invention; Figure 10 Exploded schematic diagram of the overall three-dimensional structure of the adjustment assembly of the present invention; Figure 11 Cross-sectional view of the overall three-dimensional structure of the wavy guide plate of the present invention; In the drawings, the list of components represented by each reference numeral is as follows: 1. Cutting machine body; 2. Protection mechanism; 21. Protective cover assembly; 211. Outer flow deflector; 212. Inner flow deflector; 213. Spiral channel; 214. Debris outlet; 215. Connecting rod; 216. Block; 217. First spring; 22. Air flow promoting assembly; 221. Protective cover; 222. Motor; 223. Tooth ring; 224. Gear; 225. Fan blade; 3. Cooling mechanism; 31. Flow guiding assembly; 311. Lower flow deflector; 312. Annular cooling pipe; 313. Wavy guide plate; 314. Coolant cavity; 315. Slide block; 32. Adjustment assembly; 321. Connecting plate; 322. Angular lever; 323. Second spring; 324. Chute; 325. Roller; 326. Connecting ring; 327. Protrusion. Detailed implementation manners

[0014] In order to enable those skilled in the art to better understand the solution of the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present application.

[0015] Refer to Figure 1-2, as shown in FIGS. 7, a debris protection structure of a silicon wafer cutting machine, including a cutting machine body 1, a protection mechanism 2 is fixedly connected to the cutting machine body 1, and a cooling mechanism 3 is fixedly connected below the protection mechanism 2; The protection mechanism 2 includes: A protective cover assembly 21, the protective cover assembly 21 is fixedly connected to the cutting machine body 1, and an air flow promoting assembly 22 is fixedly connected to the upper end of the protective cover assembly 21; The cooling mechanism 3 includes: A diversion assembly 31, the diversion assembly 31 is fixedly connected below the protective cover assembly 21, and an adjustment assembly 32 is connected to the diversion assembly 31.

[0016] When laser cutting a silicon wafer, the cooling mechanism 3 faces the silicon wafer. Due to the action of the technological air flow and the thermodynamic effect air flow during cutting, the debris generated by cutting moves along with the air flow. Through the action of the diversion assembly 31, the moving direction of the air flow with debris is changed, so that the included angle between the air flow and the lower end of the protective cover assembly 21 is changed. After the air flow with debris enters the protective cover, the debris is centrifuged out. By starting the air flow promoting assembly 22, the flow of the air flow is accelerated. Through the adjustment of the diversion assembly 31 by the adjustment assembly 32, the air flow direction is changed.

[0017] Refer to Figure 3-5 As shown in the figure, the protective cover assembly 21 includes: An outer diversion cover 211, the outer diversion cover 211 is fixedly connected to the cutting machine body 1. An inner diversion cover 212 is arranged inside the outer diversion cover 211. A spiral channel 213 is fixedly connected to the outside of the inner diversion cover 212. The inner diversion cover 212 is fixedly connected to the outer diversion cover 211. A debris outlet 214 is opened on the outer diversion cover 211. A connecting rod 215 is slidably connected at the debris outlet 214. One end of the connecting rod 215 is fixedly connected with a blocking block 216. A first spring 217 is sleeved on the connecting rod 215.

[0018] The air flow with debris enters the cavity formed by the outer diversion cover 211 and the inner diversion cover 212 from below. During the upward movement, due to the action of the spiral channel 213, when the air flow with debris moves upward, under the action of centrifugal force, the debris presses against the blocking block 216, causing the blocking block 216 to drive the connecting rod 215 to move, and the first spring 217 is compressed. As a result, the debris flies out from the debris outlet 214. The laser is fixedly connected inside the inner diversion cover 212.

[0019] Refer to Figure 6 As shown in the figure, the air flow promoting assembly 22 includes: A protective cover 221, the protective cover 221 is fixedly connected to the upper end of the outer flow guide cover 211, a motor 222 is fixedly connected to the protective cover 221, the output end of the motor 222 is fixedly connected to a toothed ring 223, the toothed ring 223 meshes with a plurality of gears 224, and the gears 224 are fixedly connected to fan blades 225.

[0020] By starting the motor 222, the motor 222 drives the toothed ring 223 fixedly connected thereto to rotate. Through the meshing action of the toothed ring 223 and the gears 224, the gears 224 rotate, driving the fan blades 225 to rotate, accelerating the flow of air.

[0021] Refer to Figure 8 and 11 As shown, the flow guide assembly 31 includes: A lower flow guide cover 311, an annular cooling pipe 312 is fixedly connected inside the lower flow guide cover 311, a plurality of wavy guide plates 313 are rotatably connected along the outer side of the annular cooling pipe 312, a coolant cavity 314 is formed inside the wavy guide plates 313, and a slider 315 is fixedly connected to the wavy guide plates 313.

[0022] When the airflow with debris moves upward from below the lower flow guide cover 311, when the airflow impacts the wavy guide plates 313, the direction of the airflow changes, causing the angle between the airflow and the cavity formed by the outer flow guide cover 211 and the inner flow guide cover 212 to change, and at the same time cooling the airflow.

[0023] Refer to Figure 9-10 As shown, the adjustment assembly 32 includes: A connecting plate 321, the connecting plate 321 is fixedly connected to the lower end of the lower flow guide cover 311, a plurality of angled rods 322 are slidably connected to the connecting plate 321, a second spring 323 is sleeved on the angled rods 322, one end of the angled rod 322 is fixedly connected to a chute 324, the slider 315 is slidably connected in the chute 324, the other end of the angled rod 322 is rotatably connected to a roller 325, the lower end of the lower flow guide cover 311 is rotatably connected to a connecting ring 326, and a plurality of bumps 327 are fixedly connected to the connecting ring 326.

[0024] By rotating the connecting ring 326, the bump 327 lifts the roller 325, thereby lifting the angled rod 322, and the second spring 323 is compressed. Under the limiting action of the chute 324, the slider 315 slides in the chute 324, and at the same time the wavy guide plate 313 rotates, and can be adjusted according to the different angle requirements between the airflow and the cavity formed by the outer flow guide cover 211 and the inner flow guide cover 212.

[0025] In the description of the present invention, it should be understood that the orientation or positional relationships indicated by the terms "longitudinal", "lateral", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. are based on the orientation or positional relationships shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present invention. In the description of the present invention, unless otherwise specified and defined, it should be noted that the terms "mounted", "connected" and "coupled" should be understood in a broad sense. For example, it may be a mechanical connection or an electrical connection, or may be the communication inside two elements. It may be directly connected or indirectly connected through an intermediate medium. For those of ordinary skill in the art, the specific meanings of the above terms can be understood according to specific circumstances.

[0026] The above are only the preferred embodiments of the present invention, and are not intended to limit the present invention. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A chip protection structure for a silicon wafer cutting machine, characterized in that: It comprises a cutting machine body (1), a protection mechanism (2) being fixedly connected to the cutting machine body (1), and a cooling mechanism (3) being fixedly connected below the protection mechanism (2); The protection mechanism (2) comprises: A protective cover assembly (21), the protective cover assembly (21) being fixedly connected to the cutting machine body (1), and an airflow promoting assembly (22) being fixedly connected to the upper end of the protective cover assembly (21); The cooling mechanism (3) comprises: A flow guide component (31), wherein the flow guide component (31) is fixedly connected below the protective cover component (21), and an adjustment component (32) is connected to the flow guide component (31).

2. The chip protection structure of a silicon wafer cutting machine according to claim 1, characterized in that: The protective cover assembly (21) comprises: An outer flow guide cover (211), the outer flow guide cover (211) is fixedly connected to the cutting machine body (1), an inner flow guide cover (212) is arranged inside the outer flow guide cover (211), a spiral channel (213) is fixedly connected to the outer side of the inner flow guide cover (212), the inner flow guide cover (212) is fixedly connected to the outer flow guide cover (211), a debris outlet (214) is opened on the outer flow guide cover (211), a connecting rod (215) is slidably connected to the debris outlet (214), a stopper (216) is fixedly connected to one end of the connecting rod (215), and a spring (217) is sleeved on the connecting rod (215).

3. The chip protection structure of a silicon wafer cutting machine according to claim 2, characterized in that: The airflow promoting component (22) comprises: A protective cover (221), the protective cover (221) being fixedly connected to the upper end of the outer air guide cover (211), the protective cover (221) being fixedly connected to a motor (222), the output end of the motor (222) being fixedly connected to a gear ring (223), the gear ring (223) being meshed with a plurality of gears (224), and the gears (224) being fixedly connected to the fan blades (225).

4. The chip protection structure of a silicon wafer cutting machine according to claim 3, characterized in that: The flow guide component (31) comprises: A lower air guide cover (311), wherein an annular cooling pipe (312) is fixedly connected inside the lower air guide cover (311), a plurality of wavy guide plates (313) are rotatably connected along the outer side of the annular cooling pipe (312), a cooling liquid cavity (314) is formed inside the wavy guide plate (313), and a sliding block (315) is fixedly connected to the wavy guide plate (313).

5. The chip protection structure of a silicon wafer cutting machine according to claim 4, characterized in that: The regulating component (32) comprises: A connecting plate (321) is fixedly connected to the lower end of the lower air guide cover (311), a plurality of angled rods (322) are slidably connected to the connecting plate (321), a second spring (323) is sleeved on the angled rod (322), one end of the angled rod (322) is fixedly connected to a slide groove (324), the slider (315) is slidably connected in the slide groove (324), the other end of the angled rod (322) is rotatably connected to a roller (325), the lower end of the lower air guide cover (311) is rotatably connected to a connecting ring (326), and a plurality of protrusions (327) are fixedly connected to the connecting ring (326).

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