Discharging mechanical arm, grinding equipment and grinding method

Abstract

The embodiment of the invention provides a discharging mechanical arm, grinding equipment and a grinding method, and the discharging mechanical arm comprises a mechanical arm body which comprises a movable arm part and a wafer bearing part connected with the arm part; the N adsorption parts are used for adsorbing a wafer, the N adsorption parts are arranged on the wafer bearing part, the N adsorption parts are uniformly distributed in a mode of surrounding the center of the wafer, and N is greater than or equal to 3. According to the blanking mechanical arm, the grinding equipment and the grinding method provided by the embodiment of the invention, the wafer can be prevented from being broken during blanking.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor processing technology, and in particular to a blanking robot arm, a grinding device, and a grinding method. Background Art

[0002] During the semiconductor processing, after the wafer is ground, it is adsorbed on the reference plate in the grinding chamber. When blanking, there is a large amount of water between the wafer and the reference plate. Due to the surface tension of water, the wafer will be subjected to a large adsorption force during blanking, and at this time, the wafer is in the state of the end of rough grinding, and there is a large stress inside the wafer. In the prior art, when the wafer is blanked by the blanking robot arm, the adsorption forces on different regions of the wafer from the blanking robot arm are uneven, and under the action of the surface tension of water and the internal stress of the wafer, the wafer is extremely easy to break. Summary of the Invention

[0003] In order to solve at least one of the above technical problems in the prior art, embodiments of the present disclosure provide a blanking robot arm, a grinding device, and a grinding method.

[0004] The technical solutions provided by the embodiments of the present disclosure are as follows:

[0005] In a first aspect, embodiments of the present disclosure provide a blanking robot arm, including:

[0006] A robot arm main body, including a movable arm portion and a wafer carrying portion connected to the arm portion;

[0007] N suction members for adsorbing a wafer, the N suction members are disposed on the wafer carrying portion, and the N suction members are evenly distributed in a manner of surrounding the center of the wafer, and N is greater than or equal to 3.

[0008] Exemplarily, the N suction members are distributed on at least one virtual circle with the center of the wafer as the center of the circle, and the radius of the virtual circle is 1 / 3 to 2 / 3 of the radius of the wafer.

[0009] Exemplarily, the radius of the virtual circle is 1 / 2 of the radius of the wafer.

[0010] Exemplarily, N is equal to 3.

[0011] Exemplarily, the wafer carrying portion includes a connecting portion connected to the arm portion, the wafer carrying portion further includes a first support branch arm and a second support branch arm extending from the connecting portion in different directions respectively, and at least one of the suction members is disposed on the connecting portion, at least one of the suction members is disposed on the first support branch arm, and at least one of the suction members is disposed on the second support branch arm.

[0012] Exemplarily, the connection transition positions between the first support branch arm and the connection part, and between the second support branch arm and the connection part are both in a smooth transition state.

[0013] Exemplarily, the adsorbing member includes a vacuum chuck.

[0014] Exemplarily, a vacuum tube is provided on the arm portion, and at least part of the vacuum chucks communicate with the same vacuum tube, so that at least part of the vacuum chucks adsorb the wafer synchronously or release the vacuum to release the wafer.

[0015] In a second aspect, an embodiment of the present disclosure provides a grinding device, which includes a grinding device and a blanking device, and the blanking device includes the blanking robotic arm as described above.

[0016] In a third aspect, an embodiment of the present disclosure provides a grinding method. After grinding the wafer, the blanking robotic arm as described above is used to blank the ground wafer.

[0017] The beneficial effects brought by the embodiments of the present disclosure are as follows:

[0018] In the above solution, by providing N adsorbing members on the blanking robotic arm, the wafer can be adsorbed by the adsorbing members to achieve the blanking purpose, and the N adsorbing members are evenly distributed in a manner of surrounding the center of the wafer, and N is greater than or equal to 3. In this way, it can be ensured that the adsorption force received by the wafer during blanking is uniform, so as to avoid wafer fragmentation during blanking. Description of the Drawings

[0019] Figure 1 The front view of the blanking robotic arm provided by the embodiment of the present disclosure is shown;

[0020] Figure 2 The side view of the blanking robotic arm provided by the embodiment of the present disclosure is shown. Detailed Embodiments

[0021] To make the objectives, technical solutions, and advantages of the embodiments of the present disclosure clearer, the technical solutions of the embodiments of the present disclosure will be clearly and completely described below with reference to the drawings of the embodiments of the present disclosure. Obviously, the described embodiments are part of the embodiments of the present disclosure, rather than all of the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the described embodiments of the present disclosure without creative efforts shall fall within the scope of protection of the present disclosure.

[0022] Unless otherwise defined, technical terms or scientific terms used in this disclosure shall have the ordinary meanings as understood by those of ordinary skill in the art to which this disclosure pertains. The terms "first", "second" and similar words used in this disclosure do not denote any order, quantity or importance, but are only used to distinguish different components. Similarly, words such as "a", "an" or "the" do not denote a quantity limitation, but mean that there is at least one. Words such as "comprising" or "including" mean that the elements or items appearing before this word cover the elements or items listed after this word and their equivalents, without excluding other elements or items. Words such as "connected" or "coupled" are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. Words such as "upper", "lower", "left" and "right" are only used to indicate relative positional relationships, and when the absolute position of the object being described changes, the relative positional relationship may also change accordingly.

[0023] In the embodiments of this disclosure, features such as "parallel", "perpendicular" and "identical" include the strict meanings of "parallel", "perpendicular", "identical", etc., as well as cases with certain tolerances such as "substantially parallel", "substantially perpendicular", "substantially identical", etc. Considering measurement and tolerances associated with the measurement of a particular quantity (e.g., limitations of the measurement system), it means within an acceptable deviation range for a particular value determined by those of ordinary skill in the art. For example, "substantially" can mean within one or more standard deviations, or within 3% or 5% of the value.

[0024] In addition, in this article, unless otherwise defined, the terms "substantially", "essentially", "about" and "approximately" are used to describe and explain small variations. When used with an event or situation, these terms can cover the exact occurrence of the event or situation, or can cover the approximate occurrence of the event or situation. For example, when used with a numerical value, these terms can include a variation range of less than or equal to 10% of the numerical value, such as less than or equal to ±5%, less than or equal to ±4%, less than or equal to ±3%, less than or equal to ±2%, less than or equal to ±1%, less than or equal to ±0.5%, less than or equal to ±0.1%, less than or equal to ±0.05%. The term "substantially coplanar" can mean that two surfaces are arranged in the same plane within a micron range, for example, arranged in the same plane within 40μm, 30μm, 20μm, 10μm or 1μm.

[0025] In an existing double-sided grinding device, after grinding is completed, the wafers loaded on the grinding carrier are vacuum adsorbed by the static pressure plate on one side, and then adsorbed on the reference plate in the grinding chamber, and the wafers are transferred from the reference plate to the next process by the unloading robot arm.

[0026] However, as described above, due to the presence of a large amount of water between the wafer and the reference plate, due to the surface tension of the water, the wafer will be subjected to a large adsorption force during blanking, and there will be a large internal stress inside the wafer at this time after grinding. In the prior art, when the blanking robotic arm adsorbs the wafer, the adsorption position is in the upper half of the wafer, and the force on the wafer is relatively concentrated, which results in uneven force on the wafer during blanking, thereby causing fragmentation, resulting in wafer scrapping and increased costs.

[0027] To solve the above problems, the embodiments of the present disclosure provide a blanking robotic arm, a grinding device, and a grinding method, which can prevent the wafer from fragmenting during blanking.

[0028] Figure 1 The following shows the front view of the blanking robotic arm provided by the embodiments of the present disclosure; Figure 2 The following shows the side view of the blanking robotic arm provided by the embodiments of the present disclosure.

[0029] As Figure 1 and Figure 2 shown, the embodiments of the present disclosure provide a blanking robotic arm, including:

[0030] A robotic arm main body 100, including a movable arm portion 110 and a wafer carrying portion 120 connected to the arm portion 110;

[0031] N suction members 200 for adsorbing the wafer 10, the N suction members 200 are provided on the wafer carrying portion 120, and the N suction members 200 are evenly distributed in a manner surrounding the center of the wafer 10, and N is greater than or equal to 3.

[0032] In the above solution, by providing N suction members 200 on the blanking robotic arm, the wafer 10 can be adsorbed by the suction members 200, and the arm portion 110 of the robotic arm main body 100 can move to drive the wafer carrying portion 120 to move to achieve the blanking action. Among them, the N suction members 200 are evenly distributed in a manner surrounding the center of the wafer 10, and N is greater than or equal to 3. In this way, when blanking after the wafer 10 is ground, the N suction members 200 can adsorb the wafer 10 in a manner surrounding the center of the wafer 10, that is, the adsorption positions of the wafer 10 are evenly distributed around the center of the wafer 10, thereby ensuring that the adsorption force on the wafer 10 during blanking is uniform and balanced, and avoiding fragmentation of the wafer 10 during blanking.

[0033] In some exemplary embodiments, the N suction members 200 are distributed on at least one virtual circle A with the center of the wafer 10 as the center, and the radius R1 of the virtual circle A is 1 / 3 to 2 / 3 of the radius R2 of the wafer 10.

[0034] With the above solution, N of the suction members 200 are distributed on at least one virtual circle A centered at the center of the wafer 10, and the suction positions on the wafer 10 are evenly distributed, and the suction positions are distributed at 1 / 3 to 2 / 3 of the radius R2 of the wafer 10, which can further ensure the balanced force when the wafer 10 is unloaded.

[0035] In some exemplary embodiments, the radius R1 of the virtual circle A is 1 / 2 of the radius R2 of the wafer 10. In other words, the suction positions of N of the suction members 200 on the wafer 10 are located at 1 / 2 of the radius of the wafer 10, and at this time, the force when the wafer 10 is unloaded is more balanced.

[0036] It should be noted that the suction positions of the suction members 200 can be selected according to the size and type of the wafer 10 in actual applications, and are not limited thereto.

[0037] In addition, in some exemplary embodiments, as Figure 1 and Figure 2 shown, N of the suction members 200 are distributed on a virtual circle A centered at the center of the wafer 10. However, it is not limited thereto.

[0038] For example, in some other embodiments, N of the suction members 200 may also be distributed on two or more virtual circles A centered at the center of the wafer 10.

[0039] Specifically, according to the size of the wafer 10, etc., it can be selected whether the suction members 200 are distributed on one virtual circle A or on two or more virtual circles A.

[0040] In some exemplary embodiments, N is equal to 3. As Figure 1 and Figure 2 shown, 3 of the suction members 200 can be distributed on a virtual circle A, and at this time, 3 of the suction members 200 are simultaneously the three vertices of a virtual isosceles triangle B centered at the center of the wafer 10. This structure has a more uniform and balanced adsorption force, and the adsorption and fixation structure is relatively stable.

[0041] In some exemplary embodiments, as Figure 1 and Figure 2 shown, the suction member 200 includes a vacuum chuck. The vacuum chuck can protrude from the bearing surface of the wafer carrier portion 120, so that it is more conducive for the unloading robot arm to smoothly adsorb the wafer 10 from the reference plate. However, it can be understood that the suction member 200 is not limited to a vacuum chuck.

[0042] In some exemplary embodiments, a vacuum port 111 and a vacuum tube communicating with the vacuum port 111 are provided on the arm 110, and at least part of the vacuum suction cups are communicated with the same vacuum tube, so that at least part of the vacuum suction cups synchronously adsorb the wafer 10 or break the vacuum to release the wafer 10.

[0043] In this way, by communicating at least part of the vacuum suction cups with the same vacuum tube, the purpose of synchronously adsorbing the wafer 10 or breaking the vacuum to release the wafer 10 by at least part of the vacuum suction cups can be achieved, and the control and operation are simple.

[0044] Exemplarily, N vacuum suction cups are all communicated with the same vacuum tube. However, it is not limited thereto.

[0045] For example, in other embodiments, N vacuum suction cups can be divided into several groups, each group includes one or more vacuum suction cups, and the vacuum suction cups in the same group are communicated with the same vacuum tube.

[0046] In practical applications, the vacuum states of different groups of vacuum suction cups can be controlled according to actual needs. For example: one group of vacuum suction cups can vacuum-adsorb the wafer 10, and another group of vacuum suction cups may not adsorb the wafer 10.

[0047] It should also be noted that when dividing N vacuum suction cups into several groups, the division method can be, for example:

[0048] When N vacuum suction cups are distributed on the same virtual circle A, N vacuum suction cups are divided into two groups, and the two groups of vacuum suction cups are arranged alternately along the virtual circle A, that is, there is a vacuum suction cup of the other group between two adjacent vacuum suction cups in the same group of vacuum suction cups. In this way, based on conditions such as the size of the wafer 10, for example, when the size of the wafer 10 is large, all the vacuum suction cups can be controlled to adsorb the wafer 10, and when the size of the wafer 10 is small, only one group of vacuum suction cups can be controlled to adsorb the wafer 10.

[0049] When N vacuum suction cups are distributed on at least two virtual circles A, the vacuum suction cups distributed on the same virtual circle A are one group. In this way, for wafers 10 of different sizes, a suitable group or multiple groups of vacuum suction cups can be selected to adsorb the wafer 10.

[0050] It should be understood that the above is only an exemplary description of the division method when dividing N vacuum suction cups into several groups, but it is not limited thereto.

[0051] In addition, in some exemplary embodiments, such as Figure 1 and Figure 2As shown, the wafer carrier 120 includes a connecting portion 121 connected to the arm portion 110. The wafer carrier 120 further includes a first support branch arm 122 and a second support branch arm 123 extending from the connecting portion 121 in different directions respectively. At least one of the suction members 200 is provided on the connecting portion 121, at least one of the suction members 200 is provided on the first support branch arm 122, and at least one of the suction members 200 is provided on the second support branch arm 123.

[0052] Taking N equal to 3 as an example, one of the suction members 200 is provided on the connecting portion 121, one of the suction members 200 is provided on the first support branch arm 122, and one of the suction members 200 is provided on the second support branch arm 123.

[0053] In the above solution, the wafer carrier 120 includes a connecting portion 121 and two support branch arms. This structure can reduce the weight of the wafer carrier 120 while ensuring the support strength, and the suction members 200 are respectively provided on the connecting portion 121 and the two support branch arms, and the spatial layout is relatively reasonable.

[0054] In addition, by designing the wafer carrier 120 into the above structure, the occupied space of the wafer carrier 120 is small, and interference with surrounding structures during blanking can be avoided. It should be understood that the specific structure of the wafer carrier 120 is not limited thereto.

[0055] In addition, in some exemplary embodiments, the connection transition positions between the first support branch arm 122 and the connecting portion 121, and between the second support branch arm 123 and the connecting portion 121 are both in a smooth transition state.

[0056] By adopting the above solution, stress concentration of the wafer carrier 120 can be avoided through smooth transition connection of the corner positions, and the structural stability of the blanking robotic arm can be improved.

[0057] In addition, the embodiments of the present disclosure provide a grinding device, which includes a grinding device and a blanking device, and the blanking device includes the blanking robotic arm in the embodiments of the present disclosure.

[0058] The grinding device may include, but is not limited to, a double-sided grinding device.

[0059] In some embodiments, the double-sided grinding device may include: two grinding wheels, an annular carrier, and two static pressure plates arranged oppositely, etc.

[0060] The annular carrier is used to carry the wafer and drive the wafer to rotate. The grinding wheels are located on opposite sides of the wafer, and the grinding wheels are configured to move in a direction closer to or farther from the wafer. The two static pressure plates are respectively located on opposite sides of the wafer, and the static pressure plates are used to keep the wafer in a vertical state by hydrostatic pressure.

[0061] When grinding the wafer, the wafer can be vertically placed on the annular carrier and located between two relatively arranged static pressure halves. The wafer is balanced by hydrostatic pressure and rotates at a low speed together with the annular carrier. At the same time, two grinding wheels opposite to each other rotate at a high speed to grind the two surfaces of the wafer simultaneously. During the grinding process, the two grinding wheels feed axially until the final target thickness of the wafer is reached.

[0062] After the grinding process is completed, the wafer can be carried to the reference plate, and the unloading robotic arm can adsorb the wafer from the reference plate to complete the unloading.

[0063] Other essential components in the grinding equipment should be understood by those of ordinary skill in the art and will not be elaborated here, nor should they be regarded as a limitation to the present disclosure.

[0064] Since the principle of solving problems of this grinding equipment is similar to that of the above-mentioned unloading robotic arm, the embodiments of this grinding equipment provided by the present disclosure can refer to the embodiments of the above-mentioned unloading robotic arm provided by the present disclosure and will not be elaborated here.

[0065] In addition, the present disclosure provides a grinding method, which includes: after grinding the wafer, using the unloading robotic arm in the embodiments of the present disclosure to unload the ground wafer 10.

[0066] Since the principle of solving problems of this grinding method is similar to that of the above-mentioned unloading robotic arm, the embodiments of this grinding method provided by the present disclosure can refer to the embodiments of the above-mentioned unloading robotic arm provided by the present disclosure and will not be elaborated here.

[0067] The following points need to be explained:

[0068] (1) The drawings of the embodiments of the present disclosure only relate to the structures involved in the embodiments of the present disclosure, and other structures can refer to the general design.

[0069] (2) For clarity, in the drawings used to describe the embodiments of the present disclosure, the thickness of layers or regions is enlarged or reduced, that is, these drawings are not drawn to actual scale. It can be understood that when an element such as a layer, film, region, or substrate is referred to as being "on" or "under" another element, the element can be "directly" on or under the other element or there can be intervening elements.

[0070] (3) Without conflict, the embodiments of the present disclosure and the features in the embodiments can be combined with each other to obtain new embodiments.

[0071] The above are only the specific embodiments of the present disclosure, but the protection scope of the present disclosure is not limited thereto. The protection scope of the present disclosure shall be subject to the protection scope of the claims.

Claims

1. A material unloading robot arm, characterized in that: include: A robot arm body, comprising a movable arm portion and a wafer carrying portion connected to the arm portion; N adsorbing members for adsorbing wafers, wherein the N adsorbing members are arranged on the wafer supporting portion, and the N adsorbing members are evenly distributed in a manner of surrounding the center of the wafer, and N is greater than or equal to 3.

2. The unloading robot arm according to claim 1, characterized in that: The N adsorbing parts are distributed on at least one virtual circle with the center of the wafer as the center, and the radius of the virtual circle is 1 / 3 to 2 / 3 of the radius of the wafer.

3. The unloading robot arm according to claim 2, characterized in that: The radius of the virtual circle is 1 / 2 of the radius of the wafer.

4. The unloading robot arm according to claim 1, characterized in that: N is equal to 3.

5. The unloading robot arm according to claim 1, characterized in that: The wafer supporting part includes a connecting part connected to the arm part, and the wafer supporting part also includes a first supporting branch arm and a second supporting branch arm extending from the connecting part in different directions respectively, wherein at least one of the adsorption parts is arranged on the connecting part, at least one of the adsorption parts is arranged on the first supporting branch arm, and at least one of the adsorption parts is arranged on the second supporting branch arm.

6. The unloading robot arm according to claim 5, characterized in that: A connection transition position between the first supporting branch arm and the connecting portion, and a connection transition position between the second supporting branch arm and the connecting portion are both in a smooth transition shape.

7. The unloading robot arm according to claim 1, characterized in that: The adsorbent includes a vacuum suction cup.

8. The unloading robot arm according to claim 7, characterized in that: The arm is provided with a vacuum air pipe, and at least part of the vacuum suction cups are connected to the same vacuum air pipe, so that at least part of the vacuum suction cups can synchronously absorb the wafer or break the vacuum to release the wafer.

9. A grinding device, characterized in that: It comprises a grinding device and a material unloading device, and the material unloading device comprises a material unloading robot arm as described in any one of claims 1 to 8.

10. A grinding method, characterized in that: After grinding the wafer, the grinding wafer is unloaded by using the unloading robot arm as described in any one of claims 1 to 8.

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