Bonding equipment for multiple cylindrical semiconductor wafers

Abstract

The invention discloses a bonding device for multiple cylindrical semiconductor wafers, and relates to the technical field of wafer bonding processing, the bonding device comprises a placing plate, a lifting motor and a wafer body, and also comprises a fixing device and a cleaning device; wherein the fixing device comprises a pressing plate and a fixing assembly, the pressing plate is fixedly installed at the output end of the lifting motor, the fixing assembly comprises a fixing frame, a sliding plate, a pressing rod, a pushing and pressing plate, a connecting rod, a clamping plate, a clamping piece, a fixing rod and a tray, the fixing frame is fixedly installed above the placing plate, the sliding plate is slidably installed in the fixing frame, and the fixing plate is fixedly installed in the fixing frame. The pressing rod is fixedly installed above the sliding plate, and the pushing and pressing plate is installed at the bottom of the inner wall of the fixing frame in a sliding mode. The wafer clamping device has the advantages that the situation that the wafers deviate, mismatching or dislocation is caused between the wafers in the machining process, the bonding quality and device performance are improved, and the machining cost of the wafers is reduced is avoided.

Description

Technical Field

[0001] The invention relates to the technical field of wafer bonding processing, in particular to a bonding device for multiple cylindrical semiconductor wafers. Background Art

[0002] Multiple cylindrical wafers are device structures made of multiple thin wafers stacked in a cylindrical or cylindrical shape. Each wafer can be made of different materials or have different functional layers, and they are assembled together to form an overall structure through a bonding process.

[0003] The patent with the patent announcement number CN216528822U relates to a wafer carrier, including a plate body, a placement area for placing wafers is arranged in the middle of the plate body, a plurality of concentric annular grooves are arranged on the placement area, the groove edges between the annular grooves are used to support the bottom of the wafer, at least one suction port is arranged in each annular groove on the plate body, a suction port is arranged on the side wall of the body, the suction port is connected with each suction port through a suction channel, and a positioning device for positioning the wafer is arranged around the placement area on the plate body. This patent can better support the wafer, make the force on the wafer more uniform, and reduce the processing difficulty of the carrier.

[0004] In the above patent, the suction port is connected to each suction port through a suction channel, and positioning devices for positioning the wafer are arranged around the placement area on the plate. This patent can better support the wafer, make the force on the wafer more uniform, reduce the processing difficulty of the carrier stage and facilitate the processing of the wafer body. However, when operating and processing the wafer, the wafer is prone to offset, which will cause mismatch or misalignment between the wafers during the processing process, affecting the final bonding quality and device performance, and reducing the processing cost of the wafer.

[0005] Therefore, it is necessary to design a bonding device for multiple cylindrical semiconductor wafers that can prevent the wafers from shifting and fix the wafers. Summary of the invention

[0006] The object of the present invention is to provide a bonding device for multiple cylindrical semiconductor wafers to solve the problems raised in the above-mentioned background technology.

[0007] In order to solve the above technical problems, the present invention provides the following technical solutions: a bonding device for multiple cylindrical semiconductor wafers, comprising a placing plate, a lifting motor and a wafer body, and also comprising a fixing device, a cleaning device, a collecting device and a knocking device; wherein the fixing device comprises a pressing plate and a fixing assembly, the pressing plate is fixedly mounted on the output end of the lifting motor, the fixing assembly comprises a fixing frame, a sliding plate, a pressure rod, a pushing plate, a connecting rod, a clamping plate, a clamping piece, a fixing rod and a tray, the fixing frame is fixedly mounted above the placing plate, the sliding plate is slidably mounted inside the fixing frame, the pressure rod is fixedly mounted above the sliding plate, the pushing plate is slidably mounted on the bottom of the inner wall of the fixing frame, the connecting rod is fixedly mounted on the side of the pushing plate away from the sliding plate, and the clamping plate is fixedly mounted on the side of the connecting rod away from the pushing plate One end of the pressure plate, the clamp is fixedly mounted on a side of the clamp away from the connecting rod, the fixed rod is fixedly mounted on the surface of the sliding plate, and the tray is fixedly mounted on an end of the fixed rod away from the sliding plate; wherein the cleaning device includes a connecting plate and a cleaning assembly, the connecting plate is fixedly mounted on the surface of the lifting motor, the cleaning assembly is arranged above the connecting plate, the collecting device includes an air frame and a collecting assembly, the collecting assembly is arranged above the placement plate, the knocking device includes a processing frame and a knocking assembly, the knocking assembly is arranged above the placement plate, the clamp moves to contact the wafer body and fix it, which can effectively avoid the wafer body from being offset, resulting in mismatch or misalignment between the wafer bodies during processing, affecting the final bonding quality and device performance, and reducing the processing cost of the wafer body.

[0008] According to the above technical solution, a beveled surface is formed on one side of the push plate close to the sliding plate, the tray is fixedly connected to the bottom of the inner wall of the fixed frame by an elastic telescopic rod, the clip is elastic, the elastic telescopic rod can drive the tray to reset, and the clip is elastic to better clamp the wafer body and prevent the wafer body from being damaged.

[0009] According to the above technical scheme, the connecting plate is fixedly mounted on the surface of the lifting motor, and the cleaning assembly includes a lower supporting rod, a plastic rod, a brush, a sliding rod and an upper supporting rod, the lower supporting rod is fixedly mounted above the connecting plate, the plastic rod is fixedly mounted above the connecting plate, the brush is slidably mounted above the lower supporting rod, the sliding rod is slidably mounted above the lower supporting rod, the brush is hinged to the sliding rod, the upper supporting rod is fixedly mounted on the surface of the pressure plate, the end of the upper supporting rod away from the pressure plate is hinged to the end of the sliding rod away from the brush, the brush moves and contacts the plastic rod to generate static electricity, and the static electricity can effectively absorb dust splashed during the cleaning process to avoid dust causing poor contact during the bonding process of the wafer body, thereby reducing the processing cost and maintenance cost of the wafer body.

[0010] According to the above technical solution, one end of the brush close to the lower supporting rod is in contact with the plastic rod, and a clockwork spring is provided at the junction of the sliding rod and the lower supporting rod. The brush moves and contacts the plastic rod to generate static electricity, which can effectively absorb the dust splashed during the cleaning process. The clockwork spring can drive the sliding rod to reset.

[0011] According to the above technical scheme, the air frame is fixedly installed above the placing plate, and the collecting device includes a collecting frame, a baffle, a collecting box, an electrostatic absorption plate, a connecting rod and an extrusion plate. The collecting frame is fixedly installed on the surface of the air frame, and a slide groove one is opened on the surface of the collecting frame. The baffle is hinged above the inner wall of the slide groove one, and the collecting box is fixedly installed on the bottom of the inner wall of the collecting frame. The electrostatic absorption plate is slidably installed above the inner wall of the collecting frame. The connecting rod slides through the inner and outer walls of the collecting frame and the air frame, and the electrostatic absorption plate is fixedly installed on the end of the connecting rod away from the air frame. The extrusion plate is fixedly installed on the end of the connecting rod away from the collecting frame. The collecting box can absorb scattered dust to prevent the dust from escaping to the outside and falling on the surface of the wafer body again, thereby improving the cleaning effect and effectively reducing the maintenance cost.

[0012] According to the above technical solution, a clockwork spring 2 is provided at the junction of the baffle and the slide groove 1, the air frame is connected to the collection box through a conduit, and the negative pressure generated inside the air frame will guide the gas inside the collection box into the air frame through the conduit.

[0013] According to the above technical solution, a one-way valve 1 is arranged inside the conduit, a collection tube is arranged above the collection box, a one-way valve 2 is arranged inside the collection tube, the clockwork spring 2 can drive the baffle to reset, the one-way valve 1 can prevent the air inside the air frame from entering the collection box, and the one-way valve 2 can prevent the air inside the collection box from entering the collection frame.

[0014] According to the above technical scheme, the processing frame is fixedly installed above the placement plate, and the knocking assembly includes a tilting rod, a rocker, a protrusion and a knocking rod. A slide groove 2 is opened on the surface of the processing frame, and the tilting rod is fixedly installed on the surface of the pressure rod, and the end of the tilting rod away from the pressure rod is slidably installed on the inner wall of the slide groove 2, the rocker is fixedly installed on the end of the tilting rod away from the pressure rod, and the protrusion is fixedly installed on the side of the rocker close to the pressure rod, and the knocking rod is hinged on the inner wall of the slide groove 2, and the knocking rod moves and resets under the action of the clockwork spring 3 to knock the sliding plate and generate vibration. The sliding plate vibrates and drives the fixed rod to vibrate, the fixed rod vibrates and drives the tray to vibrate, and the tray vibrates and drives the wafer body to vibrate. The vibration can effectively remove bubbles in the adhesive during the bonding process to avoid loose bonding between the wafer bodies due to bubbles, thereby affecting the final bonding quality and device performance, and reducing the processing cost of the wafer body.

[0015] According to the above technical solution, one end of the knocking rod away from the processing frame contacts the sliding plate, and the other end of the knocking rod away from the sliding plate is opened as a second beveled surface. The knocking rod moves up and down to knock the sliding plate to generate vibration. The vibration can effectively remove bubbles in the adhesive during the bonding process to avoid loose bonding between the wafer bodies due to bubbles.

[0016] According to the above technical solution, the second bevel surface contacts the protrusion, and a clockwork spring three is provided at the intersection of the knock rod and the second slide groove. The clockwork spring three can drive the knock rod to reset, and the protrusion moves downward to contact the second bevel surface and drive the knock rod to knock the sliding plate to generate vibration.

[0017] Compared with the prior art, the beneficial effects achieved by the present invention are: (1) The bonding device drives the pressure plate to contact and squeeze the pressure rod downward by moving the lifting motor downward, and then squeezes the sliding plate downward. The sliding plate moves downward to squeeze the push plate and drive the clamping plate to tighten, so that the clamping plate clamps and fixes the wafer body, which can effectively avoid the wafer from shifting, causing mismatch or misalignment between wafers during processing, affecting the final bonding quality and device performance, and reducing the processing cost of the wafer.

[0018] (2) In the bonding equipment, when the pressure plate moves downward, it also drives the upper supporting rod to move downward, thereby squeezing the sliding rod to move toward both sides of the lifting motor. The movement of the sliding rod drives the brush to clean the surface of the wafer. At the same time, the friction between the brush and the plastic rod generates static electricity, which can effectively absorb dust during the cleaning process, avoid dust causing poor contact during the wafer bonding process, and reduce the processing cost and maintenance cost of the wafer.

[0019] (3) In the bonding equipment, the brush moves to both sides and enters the collection frame. The brush contacts the electrostatic absorption plate to release static electricity, so that dust falls off the brush surface, avoiding the dust on the brush from rubbing against subsequent wafer output and causing damage to the wafer. At the same time, the movement of the electrostatic absorption plate drives the connecting rod to squeeze the extrusion plate inside the air frame. The movement of the extrusion plate generates negative pressure, which passes through the duct to generate negative pressure inside the collection box. The negative pressure generated by the collection box collects the dust scattered on the brush surface through the collection hole, avoiding the dust from escaping to the outside and falling on the wafer surface again, thereby improving the cleaning effect and effectively reducing maintenance costs.

[0020] (4) In the bonding device, the pressure rod moves downward to drive the tilting rod to move downward, the movement of the tilting rod drives the seesaw to move, the movement of the seesaw drives the bump to move and contact the knocking rod, and the knocking rod moves downward and is reset under the action of the clockwork spring three, and then moves repeatedly, so that the knocking rod knocks the sliding plate, the sliding plate vibrates when knocked, drives the fixed rod and the tray to vibrate, the tray vibrates and drives the wafer to vibrate, the vibration of the wafer can effectively remove bubbles in the adhesive during the bonding process, avoid the wafer from being loosely bonded due to bubbles, thereby affecting the final bonding quality and device performance, and reducing the processing cost of the wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention and do not constitute a limitation of the present invention. In the accompanying drawings: Figure 1 It is a schematic diagram of the overall structure of the present invention; Figure 2 It is a schematic diagram of the structure of the fixing device of the present invention; Figure 3 It is a schematic diagram of the push plate and the clamping plate structure of the present invention; Figure 4 It is a schematic diagram of the structure of the cleaning device of the present invention; Figure 5 It is a schematic diagram of the structure of the brush and the plastic rod of the present invention; Figure 6 It is a schematic diagram of the structure of the collecting device of the present invention; Figure 7 It is a schematic structural diagram of the knocking device of the present invention.

[0022] In the figure: 1. placement plate; 2. lifting motor; 3. wafer body; 4. fixing assembly; 41. pressure plate; 42. fixing frame; 43. sliding plate; 431. pressure rod; 44. pushing plate; 45. connecting rod; 46. clamping plate; 461. clamping piece; 47. fixing rod; 48. tray; 5. cleaning assembly; 51. connecting plate; 52. lower receiving rod; 53. plastic rod; 54. brush; 55. sliding rod; 56. upper receiving rod; 6. collecting assembly; 61. air frame; 62. collecting frame; 621. baffle; 63. collecting box; 64. electrostatic absorption plate; 65. connecting rod; 66. squeezing plate; 7. knocking assembly; 71. processing frame; 72. lift rod; 73. rocker; 74. bump; 75. knocking rod. DETAILED DESCRIPTION

[0023] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention. Example

[0024] See also Figure 1-5 The present embodiment provides: a bonding device for multiple cylindrical semiconductor wafers, including a placement plate 1, a lifting motor 2 and a wafer body 3, and also includes a fixing device and a cleaning device; wherein the fixing device includes a pressing plate 41 and a fixing assembly 4, the pressing plate 41 is fixedly installed at the output end of the lifting motor 2, the fixing assembly 4 includes a fixing frame 42, a sliding plate 43, a pressing rod 431, a pushing plate 44, a connecting rod 45, a clamping plate 46, a clamping piece 461, a fixing rod 47 and a tray 48, the fixing frame 42 is fixedly installed above the placement plate 1, the sliding plate 43 is slidably installed inside the fixing frame 42, the pressing rod 431 is fixedly installed above the sliding plate 43, the pushing plate 44 is slidably installed at the bottom of the inner wall of the fixing frame 42, and the connecting rod 45 is fixedly installed at the far end of the pushing plate 44 On one side of the sliding plate 43, the clamp 46 is fixedly mounted on the end of the connecting rod 45 away from the pushing plate 44, the clamp 461 is fixedly mounted on the side of the clamp 46 away from the connecting rod 45, the fixing rod 47 is fixedly mounted on the surface of the sliding plate 43, and the tray 48 is fixedly mounted on the end of the fixing rod 47 away from the sliding plate 43; wherein, the cleaning device includes a connecting plate 51 and a cleaning assembly 5, the connecting plate 51 is fixedly mounted on the surface of the lifting motor 2, the cleaning assembly 5 is arranged above the connecting plate 51, and the clamp 461 moves to contact the wafer body 3 and fix it, which can effectively avoid the deviation of the wafer body 3, resulting in mismatch or misalignment between the wafer bodies 3 during processing, affecting the final bonding quality and device performance, and reducing the processing cost of the wafer body 3.

[0025] The side of the push plate 44 close to the sliding plate 43 is opened as a bevel surface 1, the tray 48 is fixedly connected to the bottom of the inner wall of the fixed frame 42 by an elastic telescopic rod, the clip 461 is elastic, the elastic telescopic rod can drive the tray 48 to reset, and the clip 461 is elastic and can better clamp the wafer body 3 and prevent the wafer body 3 from being damaged.

[0026] The connecting plate 51 is fixedly mounted on the surface of the lifting motor 2, and the cleaning assembly 5 includes a lower supporting rod 52, a plastic rod 53, a brush 54, a sliding rod 55 and an upper supporting rod 56. The lower supporting rod 52 is fixedly mounted above the connecting plate 51, the plastic rod 53 is fixedly mounted above the connecting plate 51, the brush 54 is slidably mounted above the lower supporting rod 52, the sliding rod 55 is slidably mounted above the lower supporting rod 52, the brush 54 is hinged to the sliding rod 55, and the upper supporting rod 56 is fixedly mounted on the surface of the pressing plate 41, and the end of the upper supporting rod 56 away from the pressing plate 41 is hinged to the end of the sliding rod 55 away from the brush 54. The brush 54 moves and contacts the plastic rod 53 to generate static electricity. The static electricity can effectively absorb dust splashed during the cleaning process to prevent dust from causing poor contact during the bonding process of the wafer body 3, thereby reducing the processing cost and maintenance cost of the wafer body 3.

[0027] One end of the brush 54 close to the lower supporting rod 52 is in contact with the plastic rod 53, and a spring 1 is provided at the intersection of the sliding rod 55 and the lower supporting rod 52. The brush 54 moves and contacts the plastic rod 53 to generate static electricity, which can effectively absorb dust splashed during the cleaning process, and the spring 1 can drive the sliding rod 55 to reset.

[0028] When the first embodiment is working, the lifting motor 2 is started, and the output end of the lifting motor 2 moves downward to drive the pressure plate 41 to move downward, and the pressure plate 41 moves downward to contact and squeeze the pressure rod 431 to move downward, and the pressure rod 431 moves downward to drive the sliding plate 43 to move downward, and the sliding plate 43 moves downward to drive the fixing rod 47 to move downward, and the fixing rod 47 moves downward to drive the tray 48 to move downward, and the tray 48 moves to drive the wafer body 3 to move downward, and the sliding plate 43 moves downward to contact and squeeze the pushing plate 44 to move away from the sliding plate 43, and the pushing plate 44 moves to drive the connecting rod 45 to move, and the connecting rod 45 moves to drive the clamping plate 46 to move, and the clamping plate 46 moves to drive the clamping piece 461 to move, and the clamping piece 461 moves to contact the wafer body 3 and fix it, which can effectively avoid the deviation of the wafer body 3, so that the wafer bodies 3 are mismatched or misaligned during the processing, which affects the final bonding quality and device performance, and reduces the processing cost of the wafer body 3.

[0029] The pressing plate 41 moves downward while driving the upper receiving rod 56 to move downward. The upper receiving rod 56 moves downward to squeeze the sliding rod 55 to move toward both sides of the connecting plate 51. The sliding rod 55 moves to drive the brush 54 to move. The brush 54 moves to clean the dust on the surface of the wafer body 3. At the same time, the brush 54 moves and contacts and rubs with the plastic rod 53 to generate static electricity. The static electricity can effectively absorb the dust splashed during the cleaning process, avoiding the dust causing poor contact during the bonding process of the wafer body 3, thereby reducing the processing cost and maintenance cost of the wafer body 3. Example

[0030] See also Figure 1-7 On the basis of the first embodiment, the present embodiment further includes a collecting device and a knocking device, the collecting device includes an air frame 61 and a collecting component 6, the collecting component is arranged above the placing plate 1, the knocking device includes a processing frame 71 and a knocking component 7, the knocking component 7 is arranged above the placing plate 1, the air frame 61 is fixedly installed above the placing plate 1, the collecting device 6 includes a collecting frame 62, a baffle 621, a collecting box 63, an electrostatic absorption plate 64, a connecting rod 65 and an extrusion plate 66, the collecting frame 62 is fixedly installed on the surface of the air frame 61, and a slide groove 1 is opened on the surface of the collecting frame 62, and a baffle 621 is arranged on the surface of the collecting frame 62. Plate 621 is hinged on the upper inner wall of slide slot 1, the collection box 63 is fixedly mounted on the bottom of the inner wall of the collection frame 62, the electrostatic absorption plate 64 is slidably mounted on the upper inner wall of the collection frame 62, the connecting rod 65 slides through the inner and outer walls of the collection frame 62 and the air frame 61, the electrostatic absorption plate 64 is fixedly mounted on the end of the connecting rod 65 away from the air frame 61, and the extrusion plate 66 is fixedly mounted on the end of the connecting rod 65 away from the collection frame 62. The collection box 63 can absorb scattered dust to prevent the dust from escaping to the outside and falling on the surface of the wafer body 3 again, thereby improving the cleaning effect and effectively reducing the maintenance cost.

[0031] A clockwork spring 2 is provided at the junction of the baffle 621 and the slide groove 1. The air frame 61 is connected to the collection box 63 through a conduit. The negative pressure generated inside the air frame 61 will guide the gas inside the collection box 63 into the air frame 61 through the conduit.

[0032] A one-way valve 1 is arranged inside the conduit, a collection tube is arranged above the collection box 63, a one-way valve 2 is arranged inside the collection tube, and a clockwork spring 2 can drive the baffle 621 to reset. The one-way valve 1 can prevent the air inside the air frame 61 from entering the collection box 63, and the one-way valve 2 can prevent the air inside the collection box 63 from entering the collection frame 62.

[0033] The processing frame 71 is fixedly installed above the placement plate 1, and the knocking assembly 7 includes a tilting rod 72, a rocker 73, a protrusion 74 and a knocking rod 75. A slide groove 2 is opened on the surface of the processing frame 71, and the tilting rod 72 is fixedly installed on the surface of the pressure rod 431. The end of the tilting rod 72 away from the pressure rod 431 is slidably installed on the inner wall of the slide groove 2, the rocker 73 is fixedly installed on the end of the tilting rod 72 away from the pressure rod 431, and the protrusion 74 is fixedly installed on the side of the rocker 73 close to the pressure rod 431. The knocking rod 75 is hinged on the inner wall of the slide groove 2, and the knocking rod 75 moves and resets under the action of the clockwork spring 3, thereby knocking the sliding plate 43 and generating vibration. The sliding plate 43 generates vibration and drives the fixed rod 47 to vibrate. The fixed rod 47 generates vibration and drives the tray 48 to vibrate. The tray 48 generates vibration and drives the wafer body 3 to vibrate. The vibration can effectively remove bubbles in the adhesive during the bonding process to avoid loose bonding between the wafer bodies 3 due to bubbles, thereby affecting the final bonding quality and device performance, thereby reducing the processing cost of the wafer body 3.

[0034] The end of the knocking rod 75 away from the processing frame 71 is in contact with the sliding plate 43, and the end of the knocking rod 75 away from the sliding plate 43 is provided with a second bevel surface. The knocking rod 75 moves up and down to knock the sliding plate 43 to generate vibration. The vibration can effectively remove bubbles in the adhesive during the bonding process to avoid loose bonding between the wafer bodies 3 due to bubbles.

[0035] The first bevel surface contacts the protrusion 74, and a spring three is provided at the intersection of the knock rod 75 and the second slide groove. The spring three can drive the knock rod 75 to reset, and the protrusion 74 moves downward to contact the second bevel surface and drive the knock rod 75 to knock the sliding plate 43 to generate vibration.

[0036] When the second embodiment is working, the brush 54 moves to contact and squeeze the baffle 621 to open the entrance of the collection frame 62, the brush 54 moves into the collection frame 62, contacts and squeezes the electrostatic absorption plate 64 to move away from the baffle 621, the movement of the electrostatic absorption plate 64 drives the connecting rod 65 to move, the movement of the connecting rod 65 drives the squeezing plate 66 to move, the squeezing plate 66 moves to squeeze the air inside the air frame 61 and causes the squeezing plate 66 to approach the side of the collection frame 62 to generate negative pressure, the negative pressure causes the air to enter the air frame 61 from the inside of the collection box 63 through the duct, the air loss inside the collection box 63 generates negative pressure, the negative pressure causes the air inside the collection frame 62 to enter the inside of the collection box 63 through the collection hole, which can effectively collect the dust scattered on the surface of the brush 54 due to the elimination of static electricity, avoid the dust escaping to the outside and falling on the surface of the wafer body 3 again, improve the cleaning effect, and effectively reduce the maintenance cost.

[0037] When the pressure rod 431 moves downward, it drives the tilting rod 72 downward inside the processing frame 71. The tilting rod 72 moves downward, driving the rocker 73 downward. The rocker 73 moves downward, driving the bump 74 downward. The bump 74 moves downward, contacts and drives the side of the knocking rod 75 close to the bump 74 to move downward, so that the side of the knocking rod 75 away from the bump 74 moves upward. The knocking rod 75 moves and resets under the action of the clockwork spring three, thereby knocking the sliding plate 43 and generating vibration. The sliding plate 43 vibrates and drives the fixed rod 47 to vibrate. The fixed rod 47 vibrates and drives the tray 48 to vibrate. The tray 48 vibrates and drives the wafer body 3 to vibrate. The vibration can effectively remove bubbles in the adhesive during the bonding process to avoid loose bonding between the wafer bodies 3 due to bubbles, thereby affecting the final bonding quality and device performance, and reducing the processing cost of the wafer body 3.

[0038] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0039] Finally, it should be noted that the above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or replace some of the technical features therein by equivalents. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A bonding device for multiple cylindrical semiconductor wafers, comprising a placement plate (1), a lifting motor (2) and a wafer body (3), characterized in that: It also includes fixing devices, cleaning devices, collecting devices and knocking devices; The fixing device comprises a pressing plate (41) and a fixing assembly (4), wherein the pressing plate (41) is fixedly mounted on the output end of the lifting motor (2), and the fixing assembly (4) comprises a fixing frame (42), a sliding plate (43), a pressing rod (431), a pushing plate (44), a connecting rod (45), a clamping plate (46), a clamping piece (461), a fixing rod (47) and a tray (48), wherein the fixing frame (42) is fixedly mounted above the placing plate (1), the sliding plate (43) is slidably mounted inside the fixing frame (42), and the pressing rod (431) is fixedly mounted on the sliding plate (43). The push plate (44) is slidably mounted on the bottom of the inner wall of the fixed frame (42) above the movable plate (43), the connecting rod (45) is fixedly mounted on a side of the push plate (44) away from the sliding plate (43), the clamping plate (46) is fixedly mounted on an end of the connecting rod (45) away from the push plate (44), the clamping piece (461) is fixedly mounted on a side of the clamping plate (46) away from the connecting rod (45), the fixed rod (47) is fixedly mounted on the surface of the sliding plate (43), and the tray (48) is fixedly mounted on an end of the fixed rod (47) away from the sliding plate (43); The cleaning device comprises a connecting plate (51) and a cleaning component (5), wherein the connecting plate (51) is fixedly mounted on the surface of the lifting motor (2), and the cleaning component (5) is arranged above the connecting plate (51). The collecting device comprises an air frame (61) and a collecting component (6), and the collecting component is arranged above the placement plate (1). The knocking device comprises a processing frame (71) and a knocking component (7), and the knocking component (7) is arranged above the placement plate (1).

2. The bonding device for multiple cylindrical semiconductor wafers according to claim 1, characterized in that: A side of the push plate (44) close to the sliding plate (43) is provided with a beveled surface 1. The tray (48) is fixedly connected to the bottom of the inner wall of the fixed frame (42) via an elastic telescopic rod. The clip (461) is elastic.

3. The bonding device for multiple cylindrical semiconductor wafers according to claim 2, characterized in that: The connecting plate (51) is fixedly mounted on the surface of the lifting motor (2); the cleaning assembly (5) comprises a lower supporting rod (52), a plastic rod (53), a brush (54), a sliding rod (55) and an upper supporting rod (56); the lower supporting rod (52) is fixedly mounted above the connecting plate (51); the plastic rod (53) is fixedly mounted above the connecting plate (51); the brush (54) is slidably mounted above the lower supporting rod (52); the sliding rod (55) is slidably mounted above the lower supporting rod (52); the brush (54) is hinged to the sliding rod (55); the upper supporting rod (56) is fixedly mounted on the surface of the pressing plate (41); an end of the upper supporting rod (56) away from the pressing plate (41) is hinged to an end of the sliding rod (55) away from the brush (54).

4. The bonding device for multiple cylindrical semiconductor wafers according to claim 3, characterized in that: One end of the brush (54) close to the lower receiving rod (52) contacts the plastic rod (53), and a spring 1 is provided at the junction of the sliding rod (55) and the lower receiving rod (52).

5. The bonding device for multiple cylindrical semiconductor wafers according to claim 4, characterized in that: The air frame (61) is fixedly mounted above the placement plate (1); the collecting device (6) comprises a collecting frame (62), a baffle (621), a collecting box (63), an electrostatic absorption plate (64), a connecting rod (65) and an extrusion plate (66); the collecting frame (62) is fixedly mounted on the surface of the air frame (61); a slide groove 1 is provided on the surface of the collecting frame (62); the baffle (621) is hinged above the inner wall of the slide groove 1; the collecting box (63) is fixedly mounted on the bottom of the inner wall of the collecting frame (62); the electrostatic absorption plate (64) is slidably mounted above the inner wall of the collecting frame (62); the connecting rod (65) slides through the inner and outer walls of the collecting frame (62) and the air frame (61); the electrostatic absorption plate (64) is fixedly mounted on the end of the connecting rod (65) away from the air frame (61); and the extrusion plate (66) is fixedly mounted on the end of the connecting rod (65) away from the collecting frame (62).

6. The bonding device for multiple cylindrical semiconductor wafers according to claim 5, characterized in that: A second spring is provided at the junction of the baffle (621) and the first slide groove, and the air frame (61) and the collection box (63) are connected via a conduit.

7. The bonding device for multiple cylindrical semiconductor wafers according to claim 6, characterized in that: A first one-way valve is arranged inside the conduit, a collecting tube is arranged above the collecting box (63), and a second one-way valve is arranged inside the collecting tube.

8. The bonding device for multiple cylindrical semiconductor wafers according to claim 7, characterized in that: The processing frame (71) is fixedly mounted above the placement plate (1); the knocking assembly (7) comprises a tilting rod (72), a tilting plate (73), a protrusion (74) and a knocking rod (75); a second slide groove is provided on the surface of the processing frame (71); the tilting rod (72) is fixedly mounted on the surface of the pressure rod (431); an end of the tilting rod (72) away from the pressure rod (431) is slidably mounted on the inner wall of the second slide groove; the tilting plate (73) is fixedly mounted on an end of the tilting rod (72) away from the pressure rod (431); the protrusion (74) is fixedly mounted on a side of the tilting plate (73) close to the pressure rod (431); and the knocking rod (75) is hinged on the inner wall of the second slide groove.

9. The bonding device for multiple cylindrical semiconductor wafers according to claim 8, characterized in that: One end of the knocking rod (75) away from the processing frame (71) contacts the sliding plate (43), and one end of the knocking rod (75) away from the sliding plate (43) is formed into a second beveled surface.

10. The bonding device for multiple cylindrical semiconductor wafers according to claim 9, characterized in that: The second beveled surface contacts the protrusion (74), and a third spring is provided at the junction of the knock rod (75) and the second slide groove.

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